TB6612FNG
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2007-06-30
Toshiba Bi-CD Integrated Circuit Silicon Monolithic
T B 6 6 1 2 F N G
Driver IC for Dual DC motor
Features
• Power supply voltage；VM=15V（Max.）
• Output current；Iout=1.2A(ave) / 3.2A (peak)
• Output low ON resistor； 0.5Ω (upper＋lower Typ. @VM≧
5V)
• Standby (Power save) system
• CW/CCW/short brake/stop function modes
• Built-in thermal shutdown circuit and low voltage detecting circuit
• Small faced package（SSOP24：0.65mm Lead pitch）
• Response to Pb free packaging
* This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product,
ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive
mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at
reasonable levels.
質量: 0.14 g (標準)
TB6612FNG is a driver IC for DC motor with output
transistor in L D MOS stru cture with low ON-resistor. Two
input signals, IN1 and IN2, can choose one of four modes
such as CW, CCW, short brake, and stop mode.
The TB6612FNG is a Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperatur e = 230°C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperatur e = 245°C
*dipping time = 5 seconds
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Block Diagram
Pin Functions
Pin
NO. Symbol I/O Remarks
1 AO1
2 AO1 O chAoutput1
3 PGND1
4 PGND1 ⎯ PowerGND1
5 AO2
6 AO2 O chAoutput2
7 BO2
8 BO2 O chBoutput2
9 PGND2
10 PGND2 ⎯ PowerGND2
11 BO1
12 BO1 O chBoutput1
13 VM2
14 VM3 ⎯ Motorsupply（2.5V〜13.5V）
15 PWMB I chBPWMinput/ 200kΩpull-downatinternal
16 BIN2 I chBinput2/ 200kΩpull-downatinternal
17 BIN1 I chBinput1/ 200kΩpull-downatinternal
18 GND ⎯ SmallsignalGND
19 STBY I “L”=standby/200kΩpull-downatinternal
20 Vcc ⎯ Smallsignalsupply(2.7V〜5.5V)
21 AIN1 I chAinput1/200kΩpull-downatinternal
22 AIN2 I chAinput2/200kΩpull-downatinternal
23 PWMA I chAPWMinput/200kΩpull-downatinternal
24 VM1 ⎯ Motorsupply（2.5V〜13.5V）
1820 14
3
13
1 2 64 5
19
789 11 1210
24 22 2123
H-SW
AH-SW
B
ControlLogic
AControlLogic
B
TSD
STB
UVLO
151617
Vcc GNDSTBYAIN1AIN2PWMA BIN1 BIN2 PWMBVM1 VM3 VM2
AO1 AO2PGND1AO1 AO2PGND1 BO1BO2 PGND2 BO1BO2 PGND2
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Absolute Maximum Ratings (Ta = 25°C)
Operating Range（Ta=-20〜85℃）
Characteristics Symbol Rating Unit Remarks
VM 15
Supplyvoltage Vcc 6 V
Inputvoltage VIN -0.2〜6 V IN1,IN2,STBY,PWMpins
Outputvoltage Vout 15 V O1,O2pins
Iout 1.2 Per1ch
2 tw=20msContinuouspulse,Duty≦20%
Outputcurrent Iout
(peak) 3.2 A tw=10msSinglepulse
0.78 IConly
0.89 50×50t=1.6(mm)Cu≧40%inPCBmounting
Powerdissipation PD 1.36 W 76.2×114.3t=1.6(mm)Cu≧30%inPCBmonting
Operatingtemperature Topr -20〜85 ℃
Storagetemperature Tstg -55〜150 ℃
Characteristics Symbol Min Typ. Max Unit Remarks
Vcc 2.7 3 5.5 V
Supplyvoltage VM 4.5 5 13.5 V
--- --- 1.0 VM≧5V
Outputcurrent(H-SW) Iout --- --- 0.4 A 5V＞VM≧4.5V
Switchingfrequency fPWM --- --- 100 kHz
入力端子;IN1,IN2,PWM,STBY
Vcc
GND
Input
Internal
circuit
200kΩ
出力端子;O1,O2
VM
PGND
O1 O2
Input pin; Output pin;
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H-SW Control Function
Input Output
IN1 IN2 PWM STBY OUT1 OUT2 Mode
H H H/L H L L Shortbrake
H H L H CCW
L H L H L L Shortbrake
H H H L CW
H L L H L L Shortbrake
L L H H OFF
(Highimpedance) Stop
H/L H/L H/L L OFF
(Highimpedance) Standby
H-SW Operating Description
・To pr event penetrating current, dead time t2 and t4 is provided in switching to each mode in the IC.
VM VM VM
Ｍ
VM
GND
<ON>
t5
Ｍ
VM
GND
<OFF>
t4
Ｍ
GND
Ｍ
GND
<Short brake>
t3
Ｍ
GND
<OFF>
t2
<ON>
 t1
OUT2
OUT1 OUT1 OUT1
OUT1 OUT1
OUT2 OUT2
OUT2 OUT2
GND
VM
OUT1
Voltagewave
t1
t2
t3
t5
t4
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Electrical Characteristics (unless otherwise specified, Ta = 25°C, Vcc=3V, VM=5V）
Characteristics Symbol TestCondition Min Typ. Max Unit
Icc(3V) STBY=Vcc=3V, VM=5V --- 1.1 (1.8)
Icc(5.5V) STBY=Vcc=5.5V, VM=5V --- 1.5 2.2 mA
Icc(STB) --- --- 1
Supplycurrent
IM(STB)STBY=0V --- --- 1 μA
VIH Vcc×0.7 --- Vcc+0.2
Controlinputvoltage VIL -0.2 --- Vcc×0.3 V
IIH VIN=3V 5 15 25
Controlinputcurrent IIL VIN=0V --- --- 1 μA
VIH(STB) Vcc×0.7 --- Vcc+0.2
Standbyinputvoltage VIL(STB) -0.2 --- Vcc×0.3 V
IIH(STB) VIN=3V 5 15 25
Standbyinputcurrent IIL(STB) VIN=0V --- --- 1 μA
Vsat(U+L)1 Io=1A,Vcc=VM=5V --- 0.5 (0.7) Outputsaturating
voltage Vsat(U+L)2 Io=0.3A,Vcc=VM=5V 0.15 (0.21) V
IL(U) VM=Vout=15V --- --- 1
Outputleakagecurrent IL(L) VM=15V,Vout=0V -1 --- --- μA
VF(U) --- 1 1.1
RegenerativediodeVF VF(L) IF=1A --- 1 1.1 V
Lowvoltagedetecting
voltage UVLD --- 1.9 ---
RecoveringvoltageUVLC
（Designedvalue）
--- 2.2 ---
V
tr --- 24 ---
tf （Designedvalue）--- 41 ---
H to L --- (50) ---
Responsespeed Dead
time L to HPenetrationprotecttime
（Designedvalue） --- (230)---
ns
Thermalshutdown
circuitoperating
temperature TSD --- 175 ---
Thermalshutdown
hysteresis △TSD
（Designedvalue）
--- 20 ---
℃
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Target characteristics
PD-Ta
0.00
0.50
1.00
1.50
0 50 100 150
Ta(℃)
(w)
①
②
①IC単体θj-a=160℃/W
②基板実装時
PCB面積50×50×1.6mm
Cu箔面積≧40%
③基板実装時
PCB面積76.2×114.3×1.6mm
Cu箔面積≧30%
③
Iout-Duty
0.0
0.5
1.0
1.5
2.0
2.5
0% 20% 40% 60% 80% 100%
Duty
(A)
2ch動作時
1ch動作時
Ta=25℃,IC単体
①IConlyθj‒a＝160℃/W
②Inboarding
PCBarea50×50×1.6mm
Cuarea≧40%
③Inboarding
PCBarea76.2×114.3×1.6mm
Cuarea≧30%
Ta=25℃, IC only
1ch driving
2ch driving
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Typical Application Diagram
Note: Condensers for noise absorption (C1, C2, C3, and C4) should be connected as close as possible to the IC.
+4.5V
〜13.5V
+
C1
10uF
C2
0.1uF
M
MCU
STBY
AIN1
AIN2
PWMA
H-SW
Driver
A
18
TSD
Vcc
GND
2
AO1
24
VM1
Control
Logic
A
20
21
22
23
19
3
PGND1
BIN1
BIN2
PWMB
Control
Logic
B
17
16
15
STBY
UVLO
4
PGND1
1
AO1
6
AO2
5
AO2
H-SW
Driver
B
11
BO1
13
VM2
9
PGND2
10
PGND2
12
BO1
7
BO2
8
BO2
14
VM3
M
+2.7V
〜5.5V
+
C3
10uF
C4
0.1uF
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Package Dimennsions
Weght: 0.14 g (typ)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purp oses.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do n ot e xce ed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case
of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location,
are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or igniti on.
Use a stable power supply with ICs with built-in protection functions. If the power supply is
unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
[4] Do not insert de vices in the wrong orientation or incorrectly.
Make sure that the posit iv e and negative termina ls of power supplies are co nnected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any devic e tha t is applied the current with inserting in the wrong orientation
or incorrectly ev en j u st one time.
TB6612FNG
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Points to remember on handling of ICs
(1) Thermal Shutdown Ci rcuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC br eakdown before operation.
(2) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ)
at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral com ponents.
(3) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond maximum rat ings. To avoid
this problem, take the effect of back-EMF into consideration in system design.
TB6612FNG
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RESTRICTIONS ON P RODUCT USE 070122EBA_R6
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the qualit y and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of huma n life, bo dily injury or damage to property.
In developing your designs, pl ease ensure that TOSHIBA products are used within specified operatin g ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, per sonal equipment, office equipment, measuring equipment, industri al robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties. 070122_C
• Pleas e use this product in complia nce with all a pplicable l a ws and regulations that regul ate the inclusio n or use o f
controlled substances.
Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws
and regulations. 060819_AF
• The products described in this document are subject to foreign e xchange and foreign trade control laws. 060925_E