TPS850 - Toshiba - Datasheet.Directory

TPS850

2007-10-01

TOSHIBA Photo-IC Silicon Epitaxial Planar

TPS850

Mobile Phones, PHS

Notebook PCs, PDAs

Video Cameras, Digital Still Cameras

Other Equipment Requiring Luminosity Adjustment

The TPS850 is a linear-output photo-IC which incorporates a photodiode

and a current amp circuit in a single chip. This photo-IC is current

output type, so can set up output voltage freely by arbitrary load

resistance.

• High sensitivity: IL = 230 μA

@EV = 100 lx (typ.) Using the fluorescent light

• Little fluctuation in light current

: Width range = x1 to x1.6 (typ. ±25%)

• Output linearity of illuminance is excellent

• Open-emitter output

• Compact and light surface-mount package

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Supply voltage VCC −0.5 to 7 V

Output voltage VOUT

VCC V

Light current IL 10 mA

Permissible power dissipation P 70 mW

Operating temperature range Topr −30 to 85 °C

Storage temperature range Tstg −40 to 100 °C

Soldering temperature range (10 s)

(Note 1) Tsol 260 °C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling

Precautions.

TOSHIBA ―

Weight: 0.017 g (typ.)

TPS850

2007-10-01

Electrical and Optical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Supply voltage VCC ⎯ 2.7 ⎯ 5.5 V

Supply current ICC VCC = 3 V, EV = 1000 lx,

RL = 250 Ω (Note 2) ⎯ 4 ⎯ mA

Light current (1) IL (1) VCC = 3 V, EV = 100 lx

(Note 2, 4) ⎯ 300 ⎯

Light current (2) IL (2) VCC = 3 V, EV = 10 lx

(Note 3, 4) 18 23 30

Light current (3) IL (3) VCC = 3 V, EV = 100 lx

(Note 3, 4) 180 230 300

μA

Light current ratio (3)

(1)

⎯ 1.3 1.7

Dark current ILEAK VCC = 3.3 V, EV = 0 ⎯ ⎯ 0.5 μA

Saturation output voltage Vo VCC = 3 V, RL = 75 kΩ,

EV = 100 lx (Note 3) 2.2 2.35 ⎯ V

Peak sensitivity wavelength λp ⎯ ⎯ 640 ⎯ nm

Rise time tr ⎯ 0.2 1

Switching time

Fall time tf

VCC = 3 V, RL = 5 kΩ,

(Note 5) ⎯ 0.35 2

Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light).

Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.

Note 4: Light current measurement circuit

Note 5: Rise time/fall time measurement method

OUT

VCC

TPS850

Light

source

OUT

VCC

White LED

Pulse drive

TPS850

tf tr

1.5 V

VOUT

GND

90%

10%

TPS850

2007-10-01

Package Dimensions

Weight: 0.017 g (typ.)

Block Diagram

Current

amp

3 VCC

4 OUT

1 GND

2 GND

TPS850

2007-10-01

Handling Precautions

At power-on in darkness, the internal circuit takes about 50 ms to stabilize. During this period the output signal

is unstable and may change. Please take this into account.

Moisture-Proof Packing

(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica

gel.

(2) Since the optical characteristics of the device can be affected during soldering by vaporization

resulting from prior absorption of moisture and they should therefore be stored under the following

conditions:

Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h

(3) Baking is required if the devices have been store unopened for more than six months or if the

aluminum envelope has been opened for more than 168 h.

These devices are packed on tapes; hence, please avoid baking at high temperature.

Recommended baking conditions: 60°C for 12 h or longer

Mounting Precautions

(1) Do not apply stress to the resin at high temperature.

(2) The resin part is easily scratched, so avoid friction with hard materials.

(3) When installing the assembly board in equipment, ensure that this product does not come into

contact with other components.

Mounting Methods

(1) Reflow soldering

• Package surface temperature: 260°C (max)

• Please perform reflow soldering using the following reference temperature profile.

Perform reflow soldering no more than twice.

• Please perform the first reflow soldering within 168 h after opening the package with reference to

the above temperature profile.

• Second reflow soldering

In case of second reflow soldering, it should be performed within 168 h after first reflow under the

above conditions.

Storage conditions before second reflow soldering: 30°C, 60% RH or lower

• Do not perform flow soldering.

• Make any necessary soldering correction manually.

(do not do this more than once for any given pin.)

Temperature: no more than 350°C (25 W for soldering iron)

Time: within 5 s

30 s to 50 s Heating part

Time (s) →

60 s to 120 s

Temperature (°C) →

260°C max

230°C

190°C

180°C Preheating part

TPS850

2007-10-01

(2) Recommended soldering pattern

(3) Cleaning conditions

When cleaning is required after soldering

Chemicals: AK225 alcohol

Temperature and time: 50°C × 30 s or : 30°C × 3 minutes

Ultrasonic cleaning: 300 W or less

Packing Specification

(1) Packing quantity

Reel (minimum packing quantity) 3000 devices

Carton 5 reels (15000 devices)

(2) Packing format

An aluminum envelope containing silica gel and reels is deaerated and sealed.

Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.

• Carton specification

Carton dimensions

(W) 81 mm × (L) 280 mm × (H) 280 mm

1.6 1.6 1.3

0.95 0.95 0.6

Unit: mm

Label

TPS850

2007-10-01

4.0 ± 0.1

φ1.5 + 0.1

0 2.0 ± 0.05

A’

Feed direction

Device Orientation

4.0 ± 0.1

0.2 ± 0.05

1.3 ± 0.1

A-A’

B-B’

max 6°

2.8 ± 0.1

max 6°

3.6 ± 0.1

8.0 ± 0.2

1.75 ± 0.1

max 6° max 6°

3.5 ± 0.1 (2.75)

BB’

Tape Packing Specifications

(1) Reel dimensions

(2) Tape dimensions

(3) Packing quantity: 3000/reel

2 ± 0.5

φ180 + 0

− 4

φ21 ± 0.3

φ13 ± 0.5

Label

φ60

9 ± 0.3

11.4 ± 1

TPS850

2007-10-01

P – Ta

ILEAK – Ta (typ.)

20 40 60 80 100

Relative light current

Ambient temperature Ta (°C)

Power dissipation P (mW)

Ambient temperature Ta (°C)

Dark current ILEAK (μA)

Illuminance EV (lx)

IL – EV (typ.)

Light current IL (μA)

Ambient temperature Ta (°C)

Relative IL – Ta (typ.)

Supply voltage VCC (V)

Relative IL – VCC (typ.)

Illuminance EV (lx)

Vo – EV (typ.)

Output voltage Vo (V)

0.001

VCC = 3 V

Please refer to Figure 2.

0.1

0.01

40 60 80 100

Ta = 25°C

Please refer to Figure 1.

1.6

3 4 5 6

1.2

0.8

0.4

10000

10 100 1000 10000

1000

100

10 Ta = 25°C

VCC = 3 V

Please refer to Figure 1.

A light source

Fluorescent light

1.4

0.6

−40

1.2

1.0

0.8

−20 0 20 40 60 80 100

VCC = 3 V

Please refer to Figure 1.

Fluorescent light

A light source

10 100 1000 10000

0.0001

0.1

0.01

0.001

25°C

VCC = 3 V

Please refer to Figure 4.

Fluorescent light RL = 250 Ω

Fluorescent light RL = 5 kΩ

A light source RL = 250 Ω

A light source RL = 5 kΩ

TPS850

2007-10-01

Illuminance EV (lx)

ICC – EV (typ.)

Consumption current ICC (mA)

Load resistance RL (kΩ)

Switching characteristics

(Non-saturating operation) (typ.)

Switching time (μs)

Load resistance RL (kΩ)

Switching characteristics

(Saturating operation) (typ.)

Relative consumption current

Ambient temperature Ta (°C)

Relative ICC – Ta (typ.)

VCC = 3 V

Using the Fluorescent light

RL = 1 kΩ

Please refer to Figure 3.

1.40

0.60

−40

1.20

1.00

0.80

−20 0 20 40 60 80 100

Ta = 25°C

VCC = 3 V

VOUT = 1.5 V

Using the White LED

Please refer to Figure 5.

0.1

0.1 10

1000

100

300

0.3

0.3 3

Ta = 25°C

VCC = 3 V

VOUT

2 V

Using the White LED

Please refer to Figure 5.

1000

0.1

0.1 10

100

300

0.3

0.3 3

10 100 1000 10000

0.001

0.3

0.03

0.1

0.01

0.003

Ta = 25°C

VCC = 3 V

Using the A light source

Please refer to Figure 3.

L = 250 Ω

L = 1000 Ω

L = 5000 Ω

TPS850

2007-10-01

Measurement Circuits

Spectral response (typ.)

Relative sensitivity

Radiation pattern (typ.)

Wavelength λ (nm)

Ta = 25°C

Luminosity angle

30°

0°

60°

90° 90°

30°

60°

1.00.8 0.6 0.4 0.2 0

80°

70°

50°

40°

20°

10°

70°

80°

50°

40°

20°10°

TPS850

VCC

Figure 4 Output voltage measurement circuit

RLV Vo

Light

TPS850

VCC

OUT

Icc

Figure 3 Consumption current measurement circuit

Light

Pulse drive

TPS850

White LED

VCC

OUT

Figure 5 Switching measurement circuit and waveform

Figure 1 Light current measurement circuit

TPS850

VCC

OUT

Light

Figure 2 Dark current measurement circuit

TPS850

VCC

OUT

ILEAK

tf tr

1.5 V

VOUT

GND

90%

10%

200

1200400 600 800

0.2

0.4

0.6

0.8

1000

Ta = 25°C

TPS850

2007-10-01

RESTRICTIONS ON PRODUCT USE

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in this document, and related hardware, software and systems (collectively “Product”) without notice.

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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must

also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,

the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA

Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are

solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any

information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other

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