4-11
MT8870D/MT8870D-1
Integrated DTMF Receiver
Features
Complete DTMF Receiver
Low power consumption
Internal gain setting amplifier
Adjustable guard time
Central office quality
Power-down mode
Inhibit mode
Backward compatible with
MT8870C/MT8870C-1
Applications
Receiver system for British Telecom (BT) or
CEPT Spec (MT8870D-1)
Paging systems
Repeater systems/mobile radio
Credit card systems
Remote control
Personal computers
Telephone answering machine
Description
The MT8870D/MT8870D-1 is a complete DTMF
receiver integrating both the bandsplit filter and
digital decoder functions. The filter section uses
switched capacitor techniques for high and low
group filters; the decoder uses
digital counting
techniques to detect and decode all 16 DTMF tone-
pairs into a 4-bit code. External component count is
minimized by on chip provision of a differential input
amplifier, clock oscillator and latched three-state bus
interface.
Ordering Information
MT8870DE/DE-1 18 Pin Plastic DIP
MT8870DS/DS-1 18 Pin SOIC
MT8870DN/DN-1 20 Pin SSOP
-40
°
C to +85
°
C
Figure 1 - Functional Block Diagram
PWDN
IN +
IN -
GS
OSC1 OSC2 St/GT ESt STD TOE
Q1
Q2
Q3
Q4
VDD VSS VRef INH
Bias
Circuit
Dial
Tone
Filter
High Group
Filter
Low Group
Filter
Digital
Detection
Algorithm
Code
Converter
and Latch
St
GT
Steering
Logic
Chip
Power
Chip
Bias
VRef
Buffer
Zero Crossing
Detectors
to all
Chip
Clocks
ISSUE 5 March 1997
ISO
2
-CMOS
MT8870D/MT8870D-1
ISO
2
-CMOS
4-12
Figure 2 - Pin Connections
Pin Description
Pin #
Name Description
18 20
1 1 IN+
Non-Inverting Op-Amp
(Input)
.
2 2 IN-
Inverting Op-Amp
(Input)
.
33 GS
Gain Select.
Gives access to output of front end differential amplifier for connection of
feedback resistor.
44 V
Ref
Reference Voltage (Output).
Nominally V
DD
/2 is used to bias inputs at mid-rail (see Fig. 6
and Fig. 10).
5 5 INH
Inhibit (Input).
Logic high inhibits the detection of tones representing characters A, B, C
and D. This pin input is internally pulled down.
6 6 PWDN
Power Down (Input).
Active high. Powers down the device and inhibits the oscillator. This
pin input is internally pulled down.
7 8 OSC1
Clock
(Input)
.
8 9 OSC2
Clock
(Output)
. A 3.579545 MHz crystal connected between pins OSC1 and OSC2
completes the internal oscillator circuit.
910 V
SS
Ground
(Input)
. 0V typical.
10 11 TOE
Three State Output Enable (Input).
Logic high enables the outputs Q1-Q4. This pin is
pulled up internally.
11-
14
12-
15
Q1-Q4
Three State Data (Output).
When enabled by TOE, provide the code corresponding to the
last valid tone-pair received (see Table 1). When TOE is logic low, the data outputs are high
impedance.
15 17 StD
Delayed Steering (Output).
Presents a logic high when a received tone-pair has been
registered and the output latch updated; returns to logic low when the voltage on St/GT falls
below V
TSt
.
16 18 ESt
Early Steering (Output).
Presents a logic high once the digital algorithm has detected a
valid tone pair (signal condition). Any momentary loss of signal condition will cause ESt to
return to a logic low.
17 19 St/GT
Steering Input/Guard time (Output) Bidirectional.
A voltage greater than V
TSt
detected at
St causes the device to register the detected tone pair and update the output latch. A
voltage less than V
TSt
frees the device to accept a new tone pair. The GT output acts to
reset the external steering time-constant; its state is a function of ESt and the voltage on St.
18 20 V
DD
Positive power supply (Input)
. +5V typical.
7,
16
NC No Connection.
1
2
3
4
5
6
7
8
910
18
17
16
15
14
13
12
11
IN+
IN-
GS
VRef
INH
PWDN
OSC1
OSC2
VSS
VDD
St/GT
ESt
StD
Q4
Q3
Q2
Q1
TOE
18 PIN PLASTIC DIP/SOIC
1
2
3
4
5
6
7
8
9
10 11
12
20
19
18
17
16
15
14
13
IN+
IN-
GS
VRef
INH
PWDN
NC
OSC1
OSC2
VSS
20 PIN SSOP
VDD
St/GT
ESt
StD
Q4
Q3
Q2
Q1
TOE
NC
ISO
2
-CMOS
MT8870D/MT8870D-1
4-13
Functional Description
The MT8870D/MT8870D-1 monolithic DTMF
receiver offers small size, low power consumption
and high performance. Its architecture consists of a
bandsplit filter section, which separates the high and
low group tones, followed by a digital counting
section which verifies the frequency and duration of
the received tones before passing the corresponding
code to the output bus.
Filter Section
Separation of the low-group and high group tones is
achieved by applying the DTMF signal to the inputs
of two sixth-order switched capacitor bandpass
filters, the bandwidths of which correspond to the low
and high group frequencies. The filter section also
incorporates notches at 350 and 440 Hz for
exceptional dial tone rejection (see Figure 3). Each
filter output is followed by a single order switched
capacitor filter section which smooths the signals
prior to limiting. Limiting is performed by high-gain
comparators which are provided with hysteresis to
prevent detection of unwanted low-level signals. The
outputs of the comparators provide full rail logic
swings at the frequencies of the incoming DTMF
signals.
Decoder Section
Following the filter section is a decoder employing
digital counting techniques to determine the
frequencies of the incoming tones and to verify that
they correspond to standard DTMF frequencies. A
complex averaging algorithm protects against tone
simulation by extraneous signals such as voice while
Figure 4 - Basic Steering Circuit
providing tolerance to small frequency deviations
and variations. This averaging algorithm has been
developed to ensure an optimum combination of
immunity to talk-off and tolerance to the presence of
interfering frequencies (third tones) and noise. When
the detector recognizes the presence of two valid
tones (this is referred to as the “signal condition” in
some industry specifications) the “Early Steering”
(ESt) output will go to an active state. Any
subsequent loss of signal condition will cause ESt to
assume an inactive state (see “Steering Circuit”).
Steering Circuit
Before registration of a decoded tone pair, the
receiver checks for a valid signal duration (referred to
as character recognition condition). This check is
performed by an external RC time constant driven by
ESt. A logic high on ESt causes v
c
(see Figure 4) to
rise as the capacitor discharges. Provided signal
VDD
C
vc
VDD
St/GT
ESt
StD
MT8870D/
MT8870D-1
R
tGTA=(RC)In(VDD/VTSt)
tGTP=(RC)In[VDD/(VDD-VTSt)]
Figure 3 - Filter Response
0
10
20
30
40
50
ATTENUATION
(dB)
XY ABCD
1kHz
EF G H
PRECISE
DIAL TONES
X=350 Hz
Y=440 Hz
DTMF TONES
A=697 Hz
B=770 Hz
C=852 Hz
D=941 Hz
E=1209 Hz
F=1336 Hz
G=1477 Hz
H=1633 Hz
FREQUENCY (Hz)
MT8870D/MT8870D-1
ISO
2
-CMOS
4-14
condition is maintained (ESt remains high) for the
validation period (t
GTP
), v
c
reaches the threshold
(V
TSt
) of the
steering logic to register the tone pair,
latching its corresponding 4-bit code (see Table 1)
into the output latch. At this point the GT output is
activated and drives v
c
to V
DD
. GT continues to drive
high as long as ESt remains high. Finally, after a
short delay to allow the output latch to settle, the
delayed steering output flag (StD) goes high,
signalling that a received tone pair has been
registered. The contents of the output latch are made
available on the 4-bit output bus by raising the three
state control input (TOE) to a logic high. The
steering circuit works in reverse to validate the
interdigit pause between signals. Thus, as well as
rejecting signals too short to be considered valid, the
receiver will tolerate signal interruptions (dropout)
too short to be considered a valid pause. This facility,
together with the capability of selecting the steering
time constants externally, allows the designer to
tailor performance to meet a wide variety of system
requirements.
Guard Time Adjustment
In many situations not requiring selection of tone
duration and interdigital pause, the simple steering
circuit shown in Figure 4 is applicable. Component
values are chosen according to the formula:
t
REC
=t
DP
+t
GTP
t
ID
=t
DA
+t
GTA
The value of t
DP
is a device parameter (see Figure
11) and t
REC
is the minimum signal duration to be
recognized by the receiver. A value for C of 0.1
µ
F is
Figure 5 - Guard Time Adjustment
Table 1. Functional Decode Table
L=LOGIC LOW, H=LOGIC HIGH, Z=HIGH IMPEDANCE
X = DON‘T CARE
recommended for most applications, leaving R to be
selected by the designer.
Different steering arrangements may be used to
select independently the guard times for tone
present (t
GTP
) and tone absent (t
GTA
). This may be
necessary to meet system specifications which place
both accept and reject limits on both tone duration
and interdigital pause. Guard time adjustment also
allows the designer to tailor system parameters
such as talk off and noise immunity. Increasing t
REC
improves talk-off performance since it reduces the
probability that tones simulated by speech will
maintain signal condition long enough to be
registered. Alternatively, a relatively short t
REC
with
a long t
DO
would be appropriate for extremely noisy
environments where fast acquisition time and
immunity to tone drop-outs are required. Design
information for guard time adjustment is shown in
Figure 5.
VDD
St/GT
ESt
C1
R1R2
a) decreasing tGTP; (tGTP<tGTA)
tGTP=(RPC1)In[VDD/(VDD-VTSt)]
tGTA=(R1C1)In(VDD/VTSt)
RP=(R1R2)/(R1+R2)
VDD
St/GT
ESt
C1
R1R2
tGTP=(R1C1)In[VDD/(VDD-VTSt)]
tGTA=(RPC1)In(VDD/VTSt)
RP=(R1R2)/(R1+R2)
b) decreasing tGTA; (tGTP>tGTA)
Digit TOE INH ESt Q4Q3Q2Q1
ANYLXHZZZZ
1HXH0001
2HXH0010
3HXH0011
4HXH0100
5HXH0101
6HXH0110
7HXH0111
8HXH1000
9HXH1001
0HXH1010
*HXH1011
#HXH1100
AHLH1101
BHLH1110
CHLH1111
DHLH0000
AHHL
undetected, the output code
will remain the same as the
previous detected code
BHHL
CHHL
DHHL
ISO2-CMOS MT8870D/MT8870D-1
4-15
Power-down and Inhibit Mode
A logic high applied to pin 6 (PWDN) will power down
the device to minimize the power consumption in a
standby mode. It stops the oscillator and the
functions of the filters.
Inhibit mode is enabled by a logic high input to the
pin 5 (INH). It inhibits the detection of tones
representing characters A, B, C, and D. The output
code will remain the same as the previous detected
code (see Table 1).
Differential Input Configuration
The input arrangement of the MT8870D/MT8870D-1
provides a differential-input operational amplifier as
well as a bias source (VRef) which is used to bias the
inputs at mid-rail. Provision is made for connection of
a feedback resistor to the op-amp output (GS) for
adjustment of gain. In a single-ended configuration,
the input pins are connected as shown in Figure 10
with the op-amp connected for unity gain and VRef
biasing the input at 1/2VDD. Figure 6 shows the
differential configuration, which permits the
adjustment of gain with the feedback resistor R5.
Crystal Oscillator
The internal clock circuit is completed with the
addition of an external 3.579545 MHz crystal and is
normally connected as shown in Figure 10 (Single-
Ended Input Configuration). However, it is possible to
configure several MT8870D/MT8870D-1 devices
employing only a single oscillator crystal. The
oscillator output of the first device in the chain is
coupled through a 30 pF capacitor to the oscillator
input (OSC1) of the next device. Subsequent devices
are connected in a similar fashion. Refer to Figure 7
for details. The problems associated with unbalanced
loading are not a concern with the arrangement
shown, i.e., precision balancing capacitors are not
required.
Figure 6 - Differential Input Configuration
Figure 7 - Oscillator Connection
Table 2. Recommended Resonator Specifications
Note: Qm=quality factor of RLC model, i.e., 1/2ΠƒR1C1.
Parameter Unit Resonator
R1 Ohms 10.752
L1 mH .432
C1 pF 4.984
C0 pF 37.915
Qm - 896.37
f%±0.2%
C1R1
C2R4
R3
IN+
IN-
+
-
R5GS
R2VRef
MT8870D/
MT8870D-1
Differential Input Amplifier
C1=C2=10 nF
R1=R4=R5=100 k
R2=60k, R3=37.5 k
All resistors are ±1% tolerance.
All capacitors are ±5% tolerance.
R3=R2R5
R2+R5
VOLTAGE GAIN (Av diff)= R5
R1
INPUT IMPEDANCE
(ZINDIFF) = 2 R12+1
ωc
2
OSC1
OSC2
OSC2
OSC1
C
X-tal
C
To OSC1 of next
MT8870D/MT8870D-1
C=30 pF
X-tal=3.579545 MHz
MT8870D/MT8870D-1 ISO2-CMOS
4-16
Applications
RECEIVER SYSTEM FOR BRITISH TELECOM
SPEC POR 1151
The circuit shown in Fig. 9 illustrates the use of
MT8870D-1 device in a typical receiver system. BT
Spec defines the input signals less than -34 dBm as
the non-operate level. This condition can be attained
by choosing a suitable values of R1 and R2 to
provide 3 dB attenuation, such that -34 dBm input
signal will correspond to -37 dBm at the gain setting
pin GS of MT8870D-1. As shown in the diagram, the
component values of R3 and C2 are the guard time
requirements when the total component tolerance is
6%. For better performance, it is recommended to
use the non-symmetric guard time circuit in Fig. 8.
Figure 8 - Non-Symmetric Guard Time Circuit
tGTP=(RPC1)In[VDD/(VDD-VTSt)]
tGTA=(R1C1)In(VDD/VTSt)
RP=(R1R2)/(R1+R2)
VDD
St/GT
ESt
C1
R2
R1Notes:
R1=368K Ω ± 1%
R2=2.2M Ω ± 1%
C1=100nF ± 5%
Figure 9 - Single-Ended Input Configuration for BT or CEPT Spec
IN+
IN-
GS
VRef
INH
PWDN
OSC 1
OSC 2
VSS TOE
VDD
St/GT
ESt
StD
Q4
Q3
Q2
Q1
DTMF
Input
C1
R1
R2
X1
VDD
C2
R3
MT8870D-1
NOTES:
R1 = 102KΩ ± 1%
R2 = 71.5KΩ ± 1%
R3 = 390KΩ ±1 %
C1,C2 = 100 nF ± 5%
X1 = 3.579545 MHz ± 0.1%
VDD = 5.0V ± 5%
ISO2-CMOS MT8870D/MT8870D-1
4-17
Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.
Derate above 75 °C at 16 mW / °C. All leads soldered to board.
Typical figures are at 25°C and are for design aid only: not guaranteed and not subject to production testing.
Typical figures are at 25°C and are for design aid only: not guaranteed and not subject to production testing.
Absolute Maximum Ratings
Parameter Symbol Min Max Units
1 DC Power Supply Voltage VDD 7V
2 Voltage on any pin VIVSS-0.3 VDD+0.3 V
3 Current at any pin (other than supply) II10 mA
4 Storage temperature TSTG -65 +150 °C
5 Package power dissipation PD500 mW
Recommended Operating Conditions - Voltages are with respect to ground (VSS) unless otherwise stated.
Parameter Sym Min TypMax Units Test Conditions
1 DC Power Supply Voltage VDD 4.75 5.0 5.25 V
2 Operating Temperature TO-40 +85 °C
3 Crystal/Clock Frequency fc 3.579545 MHz
4 Crystal/Clock Freq.Tolerance fc ±0.1 %
DC Electrical Characteristics - VDD=5.0V± 5%, VSS=0V, -40°C TO +85°C, unless otherwise stated.
Characteristics Sym Min TypMax Units Test Conditions
1S
U
P
P
L
Y
Standby supply current IDDQ 10 25 µA PWDN=VDD
2 Operating supply current IDD 3.0 9.0 mA
3 Power consumption PO15 mW fc=3.579545 MHz
4
I
N
P
U
T
S
High level input VIH 3.5 V VDD=5.0V
5 Low level input voltage VIL 1.5 V VDD=5.0V
6 Input leakage current IIH/IIL 0.1 µAV
IN=VSS or VDD
7 Pull up (source) current ISO 7.5 20 µA TOE (pin 10)=0,
VDD=5.0V
8 Pull down (sink) current ISI 15 45 µA INH=5.0V, PWDN=5.0V,
VDD=5.0V
9 Input impedance (IN+, IN-) RIN 10 M@ 1 kHz
10 Steering threshold voltage VTSt 2.2 2.4 2.5 V VDD = 5.0V
11
O
U
T
P
U
T
S
Low level output voltage VOL VSS+0.03 V No load
12 High level output voltage VOH VDD-0.03 V No load
13 Output low (sink) current IOL 1.0 2.5 mA VOUT=0.4 V
14 Output high (source) current IOH 0.4 0.8 mA VOUT=4.6 V
15 VRef output voltage VRef 2.3 2.5 2.7 V No load, VDD = 5.0V
16 VRef output resistance ROR 1k
MT8870D/MT8870D-1 ISO2-CMOS
4-18
Typical figures are at 25 °C and are for design aid only: not guaranteed and not subject to production testing.
*NOTES
1. dBm= decibels above or below a reference power of 1 mW into a 600 ohm load.
2. Digit sequence consists of all DTMF tones.
3. Tone duration= 40 ms, tone pause= 40 ms.
4. Signal condition consists of nominal DTMF frequencies.
5. Both tones in composite signal have an equal amplitude.
6. Tone pair is deviated by ±1.5 %± 2 Hz.
7. Bandwidth limited (3 kHz ) Gaussian noise.
8. The precise dial tone frequencies are (350 Hz and 440 Hz) ± 2 %.
9. For an error rate of better than 1 in 10,000.
10. Referenced to lowest level frequency component in DTMF signal.
11. Referenced to the minimum valid accept level.
12. Guaranteed by design and characterization.
Operating Characteristics - VDD=5.0V±5%, VSS=0V, -40°C TO +85°C ,unless otherwise stated.
Gain Setting Amplifier
Characteristics Sym Min TypMax Units Test Conditions
1 Input leakage current IIN 100 nA VSS VIN VDD
2 Input resistance RIN 10 M
3 Input offset voltage VOS 25 mV
4 Power supply rejection PSRR 50 dB 1 kHz
5 Common mode rejection CMRR 40 dB 0.75 V VIN 4.25 V biased
at VRef =2.5 V
6 DC open loop voltage gain AVOL 32 dB
7 Unity gain bandwidth fC0.30 MHz
8 Output voltage swing VO4.0 Vpp Load 100 k to VSS @ GS
9 Maximum capacitive load (GS) CL100 pF
10 Resistive load (GS) RL50 k
11 Common mode range VCM 2.5 Vpp No Load
MT8870D AC Electrical Characteristics -V
DD=5.0V ±5%, VSS=0V, -40°C TO +85°C , using Test Circuit shown in
Figure 10.
Characteristics Sym Min TypMax Units Notes*
1Valid input signal levels (each
tone of composite signal)
-29 +1 dBm 1,2,3,5,6,9
27.5 869 mVRMS 1,2,3,5,6,9
2 Negative twist accept 8 dB 2,3,6,9,12
3 Positive twist accept 8 dB 2,3,6,9,12
4 Frequency deviation accept ±1.5% ± 2 Hz 2,3,5,9
5 Frequency deviation reject ±3.5% 2,3,5,9
6 Third tone tolerance -16 dB 2,3,4,5,9,10
7 Noise tolerance -12 dB 2,3,4,5,7,9,10
8 Dial tone tolerance +22 dB 2,3,4,5,8,9,11
ISO2-CMOS MT8870D/MT8870D-1
4-19
Typical figures are at 25 °C and are for design aid only: not guaranteed and not subject to production testing.
*NOTES
1. dBm= decibels above or below a reference power of 1 mW into a 600 ohm load.
2. Digit sequence consists of all DTMF tones.
3. Tone duration= 40 ms, tone pause= 40 ms.
4. Signal condition consists of nominal DTMF frequencies.
5. Both tones in composite signal have an equal amplitude.
6. Tone pair is deviated by ±1.5 %± 2 Hz.
7. Bandwidth limited (3 kHz ) Gaussian noise.
8. The precise dial tone frequencies are (350 Hz and 440 Hz) ± 2 %.
9. For an error rate of better than 1 in 10,000.
10. Referenced to lowest level frequency component in DTMF signal.
11. Referenced to the minimum valid accept level.
12. Referenced to Fig. 10 input DTMF tone level at -25dBm (-28dBm at GS Pin) interference frequency range between 480-3400Hz.
13. Guaranteed by design and characterization.
MT8870D-1 AC Electrical Characteristics -V
DD=5.0V±5%, VSS=0V, -40°C TO +85°C , using Test Circuit shown
in Figure 10.
Characteristics Sym Min TypMax Units Notes*
1Valid input signal levels (each
tone of composite signal)
-31 +1 dBm Tested at VDD=5.0V
1,2,3,5,6,9
21.8 869 mVRMS
2 Input Signal Level Reject -37 dBm Tested at VDD=5.0V
1,2,3,5,6,9
10.9 mVRMS
3 Negative twist accept 8 dB 2,3,6,9,13
4 Positive twist accept 8 dB 2,3,6,9,13
5 Frequency deviation accept ±1.5%± 2 Hz 2,3,5,9
6 Frequency deviation reject ±3.5% 2,3,5,9
7 Third zone tolerance -18.5 dB 2,3,4,5,9,12
8 Noise tolerance -12 dB 2,3,4,5,7,9,10
9 Dial tone tolerance +22 dB 2,3,4,5,8,9,11
MT8870D/MT8870D-1 ISO2-CMOS
4-20
Typical figures are at 25°C and are for design aid only: not guaranteed and not subject to production testing.
*NOTES:
1. Used for guard-time calculation purposes only.
2. These, user adjustable parameters, are not device specifications. The adjustable settings of these minimums and maximums
are recommendations based upon network requirements.
3. With valid tone present at input, tPU equals time from PDWN going low until ESt going high.
Figure 10 - Single-Ended Input Configuration
AC Electrical Characteristics - VDD=5.0V±5%, VSS=0V, -40°C To +85°C , using Test Circuit shown in Figure 10.
Characteristics Sym Min TypMax Units Conditions
1
T
I
M
I
N
G
Tone present detect time tDP 5 11 14 ms Note 1
2 Tone absent detect time tDA 0.5 4 8.5 ms Note 1
3 Tone duration accept tREC 40 ms Note 2
4 Tone duration reject tREC 20 ms Note 2
5 Interdigit pause accept tID 40 ms Note 2
6 Interdigit pause reject tDO 20 ms Note 2
7
O
U
T
P
U
T
S
Propagation delay (St to Q) tPQ 811µs TOE=VDD
8 Propagation delay (St to StD) tPStD 12 16 µs TOE=VDD
9 Output data set up (Q to StD) tQStD 3.4 µs TOE=VDD
10 Propagation delay (TOE to Q ENABLE) tPTE 50 ns load of 10 k,
50 pF
11 Propagation delay (TOE to Q DISABLE) tPTD 300 ns load of 10 k,
50 pF
12 P
D
W
N
Power-up time tPU 30 ms Note 3
13 Power-down time tPD 20 ms
14
C
L
O
C
K
Crystal/clock frequency fC3.5759 3.5795 3.5831 MHz
15 Clock input rise time tLHCL 110 ns Ext. clock
16 Clock input fall time tHLCL 110 ns Ext. clock
17 Clock input duty cycle DCCL 40 50 60 % Ext. clock
18 Capacitive load (OSC2) CLO 30 pF
IN+
IN-
GS
VRef
INH
PDWN
OSC 1
OSC 2
VSS TOE
VDD
St/GT
ESt
StD
Q4
Q3
Q2
Q1
DTMF
Input
C1
R1
R2
X-tal
VDD
C2
R3
NOTES:
R1,R2=100KΩ ± 1%
R3=300KΩ ± 1%
C1,C2=100 nF ± 5%
X-tal=3.579545 MHz ± 0.1%
MT8870D/MT8870D-1
ISO2-CMOS MT8870D/MT8870D-1
4-21
Figure 11 - Timing Diagram
EXPLANATION OF EVENTS
EXPLANATION OF SYMBOLS
A) TONE BURSTS DETECTED, TONE DURATION INVALID, OUTPUTS NOT UPDATED.
B) TONE #n DETECTED, TONE DURATION VALID, TONE DECODED AND LATCHED IN OUTPUTS
C) END OF TONE #n DETECTED, TONE ABSENT DURATION VALID, OUTPUTS REMIAN LATCHED UNTIL NEXT VALID
TONE.
D) OUTPUTS SWITCHED TO HIGH IMPEDANCE STATE.
E) TONE #n + 1 DETECTED, TONE DURATION VALID, TONE DECODED AND LATCHED IN OUTPUTS (CURRENTLY HIGH
IMPEDANCE).
F) ACCEPTABLE DROPOUT OF TONE #n + 1, TONE ABSENT DURATION INVALID, OUTPUTS REMAIN LATCHED.
G) END OF TONE #n + 1 DETECTED, TONE ABSENT DURATION VALID, OUTPUTS REMAIN LATCHED UNTIL NEXT VALID
TONE.
Vin DTMF COMPOSITE INPUT SIGNAL.
ESt EARLY STEERING OUTPUT. INDICATES DETECTION OF VALID TONE FREQUENCIES.
St/GT STEERING INPUT/GUARD TIME OUTPUT. DRIVES EXTERNAL RC TIMING CIRCUIT.
Q1-Q44-BIT DECODED TONE OUTPUT.
StD DELAYED STEERING OUTPUT. INDICATES THAT VALID FREQUENCIES HAVE BEEN PRESENT/ABSENT FOR THE
REQUIRED GUARD TIME THUS CONSTITUTING A VALID SIGNAL.
TOE TONE OUTPUT ENABLE (INPUT). A LOW LEVEL SHIFTS Q1-Q4 TO ITS HIGH IMPEDANCE STATE.
tREC MAXIMUM DTMF SIGNAL DURATION NOT DETECED AS VALID
tREC MINIMUM DTMF SIGNAL DURATION REQUIRED FOR VALID RECOGNITION
tID MAXIMUM TIME BETWEEN VALID DTMF SIGNALS.
tDO MAXIMUM ALLOWABLE DROP OUT DURING VALID DTMF SIGNAL.
tDP TIME TO DETECT THE PRESENCE OF VALID DTMF SIGNALS.
tDA TIME TO DETECT THE ABSENCE OF VALID DTMF SIGNALS.
tGTP GUARD TIME, TONE PRESENT.
tGTA GUARD TIME, TONE ABSENT.
Vin
ESt
St/GT
Q1-Q4
StD
TOE
EVENTS ABC
D
EFG
tREC tREC tID tDO
TONE #n TONE
#n + 1 TONE
#n + 1
tDP tDA
tGTP tGTA
tPQ tQStD
tPSrD
tPTD
tPTE
# n # (n + 1)
HIGH IMPEDANCE
DECODED TONE # (n-1)
VTSt
MT8870D/MT8870D-1 ISO2-CMOS
4-22
Notes:
Package Outlines
Plastic Dual-In-Line Packages (PDIP) - E Suffix
NOTE: Controlling dimensions in parenthesis ( ) are in millimeters.
DIM
8-Pin 16-Pin 18-Pin 20-Pin
Plastic Plastic Plastic Plastic
Min Max Min Max Min Max Min Max
A0.210 (5.33) 0.210 (5.33) 0.210 (5.33) 0.210 (5.33)
A20.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95) 0.115 (2.92) 0.195 (4.95)
b0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558)
b20.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77) 0.045 (1.14) 0.070 (1.77)
C0.008
(0.203) 0.014 (0.356) 0.008 (0.203) 0.014(0.356) 0.008 (0.203) 0.014 (0.356) 0.008 (0.203) 0.014 (0.356)
D0.355 (9.02) 0.400 (10.16) 0.780 (19.81) 0.800 (20.32) 0.880 (22.35) 0.920 (23.37) 0.980 (24.89) 1.060 (26.9)
D10.005 (0.13) 0.005 (0.13) 0.005 (0.13) 0.005 (0.13)
E0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26) 0.300 (7.62) 0.325 (8.26)
E10.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11) 0.240 (6.10) 0.280 (7.11)
e0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54)
eA0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62) 0.300 BSC (7.62)
L0.115 (2.92) 0.150 (3.81) 0.115 (2.92) 0.150 (3.81) 0.115 (2.92) 0.150 (3.81) 0.115 (2.92) 0.150 (3.81)
eB0.430 (10.92) 0.430 (10.92) 0.430 (10.92) 0.430 (10.92)
eC0 0.060 (1.52) 0 0.060 (1.52) 0 0.060 (1.52) 0 0.060 (1.52)
E1
321
E
n-2 n-1 n
L
D
D1
b2
A2
e
b
C
eA
Notes:
1) Not to scale
2) Dimensions in inches
3) (Dimensions in millimeters)
A
eB
eC
General-8
Package Outlines
Plastic Dual-In-Line Packages (PDIP) - E Suffix
DIM
22-Pin 24-Pin 28-Pin 40-Pin
Plastic Plastic Plastic Plastic
Min Max Min Max Min Max Min Max
A0.210 (5.33) 0.250 (6.35) 0.250 (6.35) 0.250 (6.35)
A20.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95) 0.125 (3.18) 0.195 (4.95)
b0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558) 0.014 (0.356) 0.022 (0.558)
b20.045 (1.15) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77) 0.030 (0.77) 0.070 (1.77)
C0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381) 0.008 (0.204) 0.015 (0.381)
D1.050 (26.67) 1.120 (28.44) 1.150 (29.3) 1.290 (32.7) 1.380 (35.1) 1.565 (39.7) 1.980 (50.3) 2.095 (53.2)
D10.005 (0.13) 0.005 (0.13) 0.005 (0.13) 0.005 (0.13)
E0.390 (9.91) 0.430 (10.92) 0.600 (15.24) 0.670 (17.02) 0.600 (15.24) 0.670 (17.02) 0.600 (15.24) 0.670 (17.02)
E0.290 (7.37) .330 (8.38)
E10.330 (8.39) 0.380 (9.65) 0.485 (12.32) 0.580 (14.73) 0.485 (12.32) 0.580 (14.73) 0.485 (12.32) 0.580 (14.73)
E10.246 (6.25) 0.254 (6.45)
e0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54) 0.100 BSC (2.54)
eA0.400 BSC (10.16) 0.600 BSC (15.24) 0.600 BSC (15.24) 0.600 BSC (15.24)
eA0.300 BSC (7.62)
eB0.430 (10.92)
L0.115 (2.93) 0.160 (4.06) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08)
α15°15°15°15°
E1
321
E
n-2 n-1 n
L
D
D1
b2
A2
e
b
C
eA
Notes:
1) Not to scale
2) Dimensions in inches
3) (Dimensions in millimeters)
A
eB
α
Shaded areas for 300 Mil Body Width 24 PDIP only
Package Outlines
Lead SOIC Package - S Suffix
NOTES: 1. Controlling dimensions in parenthesis ( ) are in millimeters.
2. Conver ted inch dimensions are not necessarily exact.
DIM 16-Pin 18-Pin 20-Pin 24-Pin 28-Pin
Min Max Min Max Min Max Min Max Min Max
A0.093
(2.35) 0.104
(2.65) 0.093
(2.35) 0.104
(2.65) 0.093
(2.35) 0.104
(2.65) 0.093
(2.35) 0.104
(2.65) 0.093
(2.35) 0.104
(2.65)
A10.004
(0.10) 0.012
(0.30) 0.004
(0.10) 0.012
(0.30) 0.004
(0.10) 0.012
(0.30) 0.004
(0.10) 0.012
(0.30) 0.004
(0.10) 0.012
(0.30)
B0.013
(0.33) 0.020
(0.51) 0.013
(0.33) 0.030
(0.51) 0.013
(0.33) 0.020
(0.51) 0.013
(0.33) 0.020
(0.51) 0.013
(0.33) 0.020
(0.51)
C0.009
(0.231) 0.013
(0.318) 0.009
(0.231) 0.013
(0.318) 0.009
(0.231) 0.013
(0.318) 0.009
(0.231) 0.013
(0.318) 0.009
(0.231) 0.013
(0.318)
D0.398
(10.1) 0.413
(10.5) 0.447
(11.35) 0.4625
(11.75) 0.496
(12.60) 0.512
(13.00) 0.5985
(15.2) 0.614
(15.6) 0.697
(17.7) 0.7125
(18.1)
E0.291
(7.40) 0.299
(7.40) 0.291
(7.40) 0.299
(7.40) 0.291
(7.40) 0.299
(7.40) 0.291
(7.40) 0.299
(7.40) 0.291
(7.40) 0.299
(7.40)
e0.050 BSC
(1.27 BSC) 0.050 BSC
(1.27 BSC) 0.050 BSC
(1.27 BSC) 0.050 BSC
(1.27 BSC) 0.050 BSC
(1.27 BSC)
H0.394
(10.00) 0.419
(10.65) 0.394
(10.00) 0.419
(10.65) 0.394
(10.00) 0.419
(10.65) 0.394
(10.00) 0.419
(10.65) 0.394
(10.00) 0.419
(10.65)
L0.016
(0.40) 0.050
(1.27) 0.016
(0.40) 0.050
(1.27) 0.016
(0.40) 0.050
(1.27) 0.016
(0.40) 0.050
(1.27) 0.016
(0.40) 0.050
(1.27)
Pin 1
A1
B
e
E
A
LH
C
Notes:
1) Not to scale
2) Dimensions in inches
3) (Dimensions in millimeters)
4) A & B Maximum dimensions include allowable mold flash
DL
4 mils (lead coplanarity)
General-7
Package Outlines
Small Shrink Outline Package (SSOP) - N Suffix
Pin 1
A1
B
e
D
E
A
LH
C
A2
Dim 20-Pin 24-Pin 28-Pin 48-Pin
Min Max Min Max Min Max Min Max
A0.079
(2) - 0.079
(2) 0.079
(2) 0.095
(2.41) 0.110
(2.79)
A10.002
(0.05) 0.002
(0.05) 0.002
(0.05) 0.008
(0.2) 0.016
(0.406)
B0.0087
(0.22) 0.013
(0.33) 0.0087
(0.22) 0.013
(0.33) 0.0087
(0.22) 0.013
(0.33) 0.008
(0.2) 0.0135
(0.342)
C0.008
(0.21) 0.008
(0.21) 0.008
(0.21) 0.010
(0.25)
D0.27
(6.9) 0.295
(7.5) 0.31
(7.9) 0.33
(8.5) 0.39
(9.9) 0.42
(10.5) 0.62
(15.75) 0.63
(16.00)
E0.2
(5.0) 0.22
(5.6) 0.2
(5.0) 0.22
(5.6) 0.2
(5.0) 0.22
(5.6) 0.291
(7.39) 0.299
(7.59)
e0.025 BSC
(0.635 BSC) 0.025 BSC
(0.635 BSC) 0.025 BSC
(0.635 BSC) 0.025 BSC
(0.635 BSC)
A20.065
(1.65) 0.073
(1.85) 0.065
(1.65) 0.073
(1.85) 0.065
(1.65) 0.073
(1.85) 0.089
(2.26) 0.099
(2.52)
H0.29
(7.4) 0.32
(8.2) 0.29
(7.4) 0.32
(8.2) 0.29
(7.4) 0.32
(8.2) 0.395
(10.03) 0.42
(10.67)
L0.022
(0.55) 0.037
(0.95) 0.022
(0.55) 0.037
(0.95) 0.022
(0.55) 0.037
(0.95) 0.02
(0.51) 0.04
(1.02)
Notes:
1) Not to scale
2) Dimensions in inches
3) (Dimensions in millimeters)
4) Ref. JEDEC Standard M0-150/M0118 for 48 Pin
5) A & B Maximum dimensions include allowable mold flash
General-11
Purchase of Zarlink’s I
2
C components conveys a licence under the Philips I
2
C Patent rights to use these components in an I
2
C System, provided that the system conforms
to the I
2
C Standard Specification as defined by Philips
Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2001, Zarlink Semiconductor Inc. All rights reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. trading as Zarlink Semiconductor or its subsidiaries (collectively “Zarlink”) is
believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any
such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights
owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in
combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any
order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information
appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or
suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of
use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such
information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or
parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and
materials are sold and services provided subject to Zarlink Semiconductor’s conditions of sale which are available on request.
World Headquarters - Canada
Tel: +1 (613) 592 0200
Fax: +1 (613) 592 1010
North America - West Coast
Tel: (858) 675-3400
Fax: (858) 675-3450
North America - East Coast
Tel: (978) 322-4800
Fax: (978) 322-4888
Asia/Pacific
Tel: +65 333 6193
Fax: +65 333 6192
Europe, Middle East,
and Africa (EMEA)
Tel: +44 (0) 1793 518528
Fax: +44 (0) 1793 518581
http://www.zarlink.com