CPC1963GSTR - IXYS - Datasheet.Directory

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

DS-CPC1963-R07 1

CPC1963

AC Power Switch

Part Number Description

CPC1963G 6-Pin DIP (50/Tube)

CPC1963GS 6-Pin Surface Mount (50/Tube)

CPC1963GSTR 6-Pin Surface Mount (1000/Reel)

Parameter Ratings Units

Blocking Voltage 600 VP

Load Current 500 mArms

On State Voltage Drop 1.4 Vrms (at IL = 500mA)

Applications

Features

Description

Ordering Information

Pin Configuration

• Programmable Control

• Process Control

• Power Control Panels

• Remote Switching

• Gas Pump Electronics

• Contactors

• Large Relays

• Solenoids

• Motors

• Heaters

• Load Current up to 0.5Arms

• 600VP Blocking Voltage

• 5mA Sensitivity

• Zero-Crossing Detection

• DC Control, AC Output

• Optically Isolated

• Low EMI and RFI Generation

• High Noise Immunity

• Flammability Rating UL 94 V-0

The CPC1963 is an AC Solid State Switch using

optical coupling with dual power SCR outputs to

produce an alternative to optocoupler and Triac circuits.

The CPC1963 switches are robust enough to provide a

blocking voltage of up to 600VP .

In addition, tightly controlled zero cross circuitry

ensures switching of AC loads without the generation

of transients.

The input and output circuits are optically coupled

to provide 3750Vrms of isolation and noise immunity

between control and load circuits. As a result, the

CPC1963 is well suited for industrial environments

where electromagnetic interference could disrupt the

operation of electromechanical relays.

Approvals

• UL Recognized Component: File E69938

• CSA Certified Component: Certificate 1172007

AC Load

– LED

+ LED

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

2R07

CPC1963

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Typical values are characteristic of the device at +25°C,

and are the result of engineering evaluations. They are

provided for information purposes only, and are not part of

the manufacturing testing requirements.

Absolute Maximum Ratings @ 25ºC

Electrical Characteristics @ 25ºC

Parameter Ratings Units

Blocking Voltage 600 VP

Reverse Input Voltage 5 V

Input Control Current

Peak (10ms)

50 mA

Input Power Dissipation 1150 mW

Total Package Dissipation 2800 mW

Isolation Voltage, Input to Output 3750 Vrms

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

1 Derate linearly 1.33 mW / ºC

2 Derate linearly 6.67 mW / ºC

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics

Operating Voltage Range VT- 20 - 260 Vrms

Load Current, Continuous VL=120Vrms IL0.005 - 0.5 Arms

Off State Leakage Current V = 600V ILEAK --1mA

On-State Voltage Drop IL=500 mArms VON - - 1.4 Vrms

Critical Rate of Rise 3- dV/dt 1000 - - V/µs

Switching Speeds

Turn-on IF=5 mA ton - - 0.5 cycles

Turn-off toff - - 0.5

Zero-Cross Turn-On Voltage 11st half-cycle - 2 10 V

Subsequent half-cycle - - 1 -

Operating Frequency - 20 - 500 Hz

Load Power Factor for Guaranteed Turn-On 2- PF 0.25 - - -

Input Characteristics

Input Control Current to Activate 4-I

F- 0.23 5 mA

Input Drop-out Voltage - 0.8 - - V

Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V

Reverse Input Current VR=5V IR- - 10 µA

Common Characteristics

Input to Output Capacitance VIO=0V, f=1MHz CIO -3-pF

1 Zero Cross 1st half-cycle @ <100Hz

2 Snubber circuits may be required at low power factors.

3 Tested in accordance with EIA/NARM standard RS-443.

4 For high noise environments use at least 10mA LED drive current.

INTEGRATED CIRCUITS DIVISION

CPC1963

www.ixysic.com 3

R07

PERFORMANCE DATA*

1.17 1.19 1.21 1.23 1.25

LED Forward Voltage Drop (V)

Device Count (N)

Typical LED Forward Voltage Drop

=5mA, T

=25ºC)

1.05 1.07 1.09 1.111.06 1.08 1.10

Output Voltage Drop (Vrms)

Device Count (N)

Typical On-State

Output Voltage Drop Distribution

=25ºC)

610 630 650 670660640620

Blocking Voltage (VP)

Device Count (N)

Typical Blocking Voltage Distribution

=25ºC)

0.22 0.24 0.260.21 0.23 0.25 0.27

LED Current (mA)

Device Count (N)

Typical I

for Switch Operation

=25ºC)

LED Forward Voltage Drop (V)

Temperature (ºC)

1.8

1.6

1.4

1.2

1.0

0.8

-40 -20 0 20 40 60 80 120100

IF = 20mA

IF = 50mA

IF = 5mA

IF = 10mA

Typical LED Forward Voltage Drop

vs. Temperature

LED Current (mA)

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

Typical IF for Switch Operation

vs. Temperature

Temperature (ºC)

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90

VON (Vrms)

1.10

1.08

1.06

1.04

1.02

1.00

0.98

0.96

Temperature (ºC)

Typical Output VON vs. Temperature

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

4R07

CPC1963

PERFORMANCE DATA*

800

600

400

200

1200

1400

1000

25 50 85

Critical Rate of Rise (V/µs)

Temperature (ºC)

Typical dV/dt vs. Temperature

63%

10%

Vo = 300V

dV 0.63 x 300V 189

dt RC RC

In accordance with

EIA/NARM Standards

RS-443 for Solid State Relays

dV/dt Method

Leakage (mA)

0.278

0.276

0.274

0.272

0.270

0.268

0.266

0.264

Temperature (ºC)

Typical Leakage vs. Temperature

=600V

)

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90

Load Current (Arms)

-40

1.2

1.0

0.8

0.6

0.4

0.2

05585

Load Current, Free Air

Temperature (ºC)

R4JA=60 ºC/W

Blocking Voltage (VP)

670

660

650

640

630

620

610

Typical Blocking Voltage

vs. Temperature

Temperature (ºC)

20 25 30 35 40 45 50 55 60 65 70 75 80 85 90

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

CPC1963

www.ixysic.com 5

R07

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of

the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of

our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices

when handled according to the limitations and information in that standard as well as to any limitations set forth in the

information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Classiﬁ cation

CPC1963G / CPC1963GS MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the

body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum

Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

Device Classiﬁ cation Temperature (Tc) Dwell Time (tp) Max Reﬂ ow Cycles

CPC1963G 250ºC 30 seconds 1

CPC1963GS 250ºC 30 seconds 3

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage

to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow

up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the

variability of the wash parameters used to clean the board, determination of the bake temperature and duration

necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning

or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the

device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

6R07

CPC1963

MECHANICAL DIMENSIONS

Dimensions

(inches)

PCB Land Pattern

4.445 ± 0.127

(0.175 ± 0.005)

2.159 ± 0.102

(0.085 ± 0.004)

3.302 ± 0.051

(0.130 ± 0.002)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.127

(0.025 ± 0.005)

0.254 ± 0.0127

(0.010 ± 0.0005)

2.540 ± 0.127

(0.100 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

6.350 ± 0.127

(0.250 ± 0.005)

0.457 ± 0.076

(0.018 ± 0.003)

9.525 ± 0.254

(0.375 ± 0.010)

2.54

(0.10)

8.90

(0.350)

1.65

(0.065)

0.65

(0.0256)

Pin 1

Dimensions

(inches)

PCB Hole Pattern

4.064 TYP.

(0.160 TYP.)

2.007 ± 0.102

(0.079 ± 0.004)

3.302 ± 0.051

(0.130 ± 0.002)

7.239 TYP.

(0.285 TYP.)

7.620 ± 0.254

(0.300 ± 0.010)

9.144 ± 0.508

(0.360 ± 0.020)

0.254 TYP.

(0.010 TYP.)

5.080 ± 0.127

(0.200 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

6.350 ± 0.127

(0.250 ± 0.005)

0.457 ± 0.076

(0.018 ± 0.003)

Pin 1

CPC1963G

CPC1963GS

INTEGRATED CIRCUITS DIVISION

Specification: DS-CPC1963-R07

OptoMOS® is a registered trademark of IXYS Integrated Circuits

6/20/2018

For additional information please visit our website at: www.ixysic.com

CPC1963

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes

to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'

Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but

not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property

or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.

Dimensions

(inches)

User Direction of Feed

NOTES:

1. Dimensions carry tolerances of EIA Standard 481-2

2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

=4.20

(0.165)

K =4.90

(0.193)

P1=12.00

(0.472)

W=16.00

(0.63)

Bo=10.30

(0.406)

Ao=10.30

(0.406)

CPC1963GS Tape & Reel