C1 C2
B2
A1 A2
BOTTOM VIEW
(Bump Facing Up)
C1C2
B2
A1A2
TOP VIEW
(Bump Facing Down)
TPD2F702
www.ti.com
SLLS986A –FEBRUARY 2010–REVISED MARCH 2010
TWO-CHANNEL EMI FILTER FOR AUDIO SPEAKER/AVIF CONNECTOR
Check for Samples: TPD2F702
1FEATURES
• Two-Channel EMI Filter for Audio Speaker or • Pi-Style (C-R-C) Filter Configuration
AVIF Ports (C1 = 30 pF, R = 15 Ω, C2 = 5000 pF)
• Best in class EMI Noise Filtering for Audio • Ultra Low Leakage Current (100-nA max)
Applications (-3dB Bandwidth = 1.2MHz) • Space-Saving WCSP Package and
• > 50 dB Crosstalk Attenuation at 100 MHz Flow-Through Pin Mapping
• Integrated ESD Protection Exceeds • Industrial Temperature Range: –40°C to 85°C
IEC61000-4-2 (Level 4) at the Connector Ports
(Level 4) on the Connector Side APPLICATIONS
• Mobile Phones
– ±15-kV Human-Body Model (HBM) • PDAs
– ±30-kV IEC 61000-4-2 Contact Discharge • Headsets
– ±30-kV IEC 61000-4-2 Air-Gap Discharge • Portable Gaming
YFK PACKAGE
TERMINAL ASSIGNMENTS
1 2
ACh 1 Input, ESD Level 1 Ch 1 Output, ESD Level 4
BDepopulated Ball Ground
CCh 2 Input, ESD Level 1 Ch 2 Output, ESD Level 4
DESCRIPTION/ORDERING INFORMATION
The TPD2F702 is a two-channel EMI filter for audio interface applications. With the integration of 5000 pF
capacitor in a space saving low noise WCSP package, the TPD2F702 offers superior EMI noise supression
(2MHz to 6GHz) compared to discrete implementation. The device is optimized for AVIF connector or speaker
port interfaces. This low-pass filter array also provides system level ESD protection to eliminate the need for
external ESD clamps. The TPD2F702 exceeds ±30-kV ratings per IEC6100-4-2 Contact and Air-Gap
specifications. It is primarily used in the mobile-phone audio headphone speaker interface, but can be used in
other audio applications.
The TPD2F702 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to
electromagnetic interferences. This filter includes ESD protection circuitry which prevents damage to the
application when subjected to ESD surges far exceeding IEC 61000-4-2 (Level 4).
The TPD2F702 is specified for –40°C to 85°C operation.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
R = 15 W
GND
Ch_Out
Ch_In
IEC 61000-4-2
(Level 4) ESD
IEC 61000-4-2
(Level 1) ESD
C1 =
30 pF
C2 =
5000 pF
TPD2F702
SLLS986A –FEBRUARY 2010–REVISED MARCH 2010
www.ti.com
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
–40°C to 85°C WCSP – YFK Tape and reel TPD2F702YFKR 5V
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
SCHEMATIC
(One of Two Channels)
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VIO Continuous IO voltage –5.5 5.5 V
Total power dissipation 200 mW
TACharacterized free-air operating temperature range –40 85 °C
Reflow temperature 1.6 mm (1/16 inch) from case for 10 seconds 260 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT
VIO Continuous IO voltage –5 5 V
ESD RATINGS ESD TYPE TERMINAL TYP UNIT
Input ±4
IEC 61000-4-2 Contact Discharge kV
Output ±30
Input ±4
IEC 61000-4-2 Air-Gap Discharge kV
Output ±30
Input ±15
Human-Body Model kV
Output ±15
2Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2F702
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09
frequency(Hz)
dB
A1-C2
A2-C1
-50.0
-45.0
-40.0
-35.0
-30.0
-25.0
-20.0
-15.0
-10.0
-5.0
0.0
1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09
Frequency (Hz)
Insertion Loss (dB)
(DC Bias @ 0.0V)
(DC Bias @ 2.5V)
3 dB drop/bias of 0.0 V
-3dB = 1.18 MHz
3 dB drop/bias of 2.5 V
-3 dB = 1.28 MHz
S21
TPD2F702
www.ti.com
SLLS986A –FEBRUARY 2010–REVISED MARCH 2010
ELECTRICAL CHARACTERISTICS
TA= –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
II= 1 mA Input pin ±14 ±18.2
VBR DC break-down voltage V
IO= 1 mA Output pin ±14 ±18.2
IIO Current from input or output VIor VO= 2.5 V Input, output pins 0.01 0.1 mA
VI= 0 V, VOSC = 30 mV,
C1 Capacitance of the input terminal Input pin 30 pF
f = 100 kHz
VO= 0 V, VOSC = 30 mV,
C2 Capacitance of the output terminal Output pin 5000 pF
f = 100 kHz
R Series resistor 12 15 18 Ω
Output clamp 1
Rdyn Dynamic resistance II= 1.5 A or IO= 1.5 A Ω
Input clamp 3
fCCut-off frequency ZSOURCE = 50 Ω, ZLOAD = 50 Ω1.2 MHz
TYPICAL OPERATING CHARACTERISTICS
Figure 1. Insertion Loss Figure 2. Channel-to-Channel Crosstalk with 50 ΩTermination
for the Non-Measuring Pins
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPD2F702
0.00E+00
2.00E-09
4.00E-09
6.00E-09
8.00E-09
1.00E-08
-5 -4 -3 -2 -1 0 1 2 3 4 5
DC Bias (Volt)
IO Capacitance (Farad)
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09
frequency(Hz)
dB
A1-C2
A2-C1
-40
-20
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
-120
-100
-80
-60
-40
-20
0
20
40
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
TPD2F702
SLLS986A –FEBRUARY 2010–REVISED MARCH 2010
www.ti.com
TYPICAL OPERATING CHARACTERISTICS (continued)
Figure 3. Channel-to-Channel Crosstalk with No Termination for Figure 4. IO Capacitance Versus IO Voltage (Measured at f = 100
the Non-Measuring Pins kHz)
Figure 5. IEC Clamping Waveforms +8 kV Contact, Out Stressed Figure 6. IEC Clamping Waveforms –8 kV Contact, Out Stressed
and In Measured and In Measured
4Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2F702
-40
-20
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
-120
-100
-80
-60
-40
-20
0
20
40
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
TPD2F702
www.ti.com
SLLS986A –FEBRUARY 2010–REVISED MARCH 2010
TYPICAL OPERATING CHARACTERISTICS (continued)
Figure 7. IEC Clamping Waveforms +15 kV Contact, Out Figure 8. IEC Clamping Waveforms –15 kV Contact, Out
Stressed and In Measured Stressed and In Measured
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPD2F702
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPD2F702YFKR DSBGA YFK 5 3000 180.0 8.4 1.02 1.42 0.62 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Aug-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPD2F702YFKR DSBGA YFK 5 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Aug-2011
Pack Materials-Page 2
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