SFP Series ExpressPortTM SFP+ UltraPortTM SFP+ Series UE86 Series UE76 Series U77 Series Connector Cage Connector 12 14 14 ExpressPortTM QSFP / QSFP+ Series 16 16 18 UltraPortTM QSFP+ Series U95 Series U95 Series FS1 Series Connector 2xN Combo Cage CXP Series 20 22 22 24 Mini-SAS 26 26 Mini-SAS HD 28 XFP Series CFP2/CFP4 30 30 U99 Series U56 Series U98 Series Host Connector Plug Connector Cage 32 32 32 4 OPTION 3 0 - Standard OPTION 2 5 6 7 16 8 OPTION 3 - Standard 9 16 10 11 UltraPortTM SFP+ Stacked The UltraPort SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications. Stacked versions (2XN) consist of a 2-row cage with integrated connectors. The entire assembly is press-fit pin compliant. P-U95-Z205-XXX1-XX1 P-U95-Z305-XXX1-XX1 Materials * Cage o Base Material: Copper Alloy o Plating: Nickel o Spring Clip: Copper Alloy, Nickel Plating * Connector o Contact Base Material: Gold o Contact Plating: Nickel on Mating Area, o Tin-Lead Over Nickel on Termination o Housings: Glass Reinforced, Thermoplastic o UL94V-0 Rated The UltraPort SFP+ interconnect system is comprised of a 20-position, 2-row integrated connector. General Characteristics * RoHS Compliant * Industry Standard Footprint * Industry Standard EIA-364 * Packaging: Tape and Reel * Halogen Free Mechanical Characteristics * Durability: 250 Mating Cycles min Temperature Rating * Operating Temperature: -55C to +85C * Storage Temperature: -55C to 105C Electrical Characteristics * Hot Swappable * Allows Module Swapping * Operating Voltage: 30V AC * Operating Current: 0.5 A * Spring Contacts for Superior EMI Grounding * Contact Resistance: 10 m max * Insulation Resistance: 1000M min * DWV: 300V DC for 60 Seconds * Differential Impedance: 100+/-10 Configurations (Rows x Ports per Row) * 2x1 * 2x2 * 2x4 * 2x5 * 2x6 * 2x8 Options * Thermoplastic Dust Covers Packaging * Tray Packaging: Cage and Connector Assembly 12 UltraPortTM UE86 3G X X 2 0 X 0 X 6 1 TRAY PACKAGING 1 - Tray packaging (stacked) UE86 PLATING OPTION: CAGE UE86 -Standard SFP+ Cage and Connector with Light Pipes (RoHS) 6 6 - Pre-Plating 3G PLATING OPTION: CONNECTOR X - Various Options Available Consult Sales or Website for Details 3G- 3rd generation 25/32G applications DUST COVER OPTIONS X 0 - Without Dust Covers D - With Dust Covers LIGHT PIPE OPTIONS X - Various Options Available Consult Sales or Website for Details MOUNTING TYPE: CAGE 0 0 - Standard Cage CHASIS EMI OPTIONS MOUNTING TYPE: CONNECTOR 4-Gasket 6-Spring Finger 2 - Standard Press Fit Pins 13 2 UltraPortTM SFP+ SMT Connector and Cages The UltraPort SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 32Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications. Amphenol's UltraPort SFP+ connector shares the same exceptional mating interface and EMI cage dimensions as the SFP+ form factor. The cages are built for use with several board thicknesses and assembly processes to accommodate server and switch applications with great cost savings. The connector accepts multiple transceivers per INF-8081 and combines, transmits, and receives functions in a low cost, compact and flexible format. We offer a wide variety of cage configurations, which have a two-piece construction with enhanced transceiver mating tabs available in press-fit or solder tail versions. U77-3GA6X1M-X091 UE76-3G20-X600T The UltraPort SFP+ interconnect system is comprised of a 20-position hot swappable I/O connector. It supports 32 Gbps applications with a backward compatibility for next generation Ethernet and Fibre Channel applications General Characteristics * RoHS Compliant * Industry Standard Footprint * Industry Standard EIA-364 * Halogen Free Electrical Characteristic * Operating voltage: 30 V AC * Rated current: 0.5 A * Dielectric withstanding voltage: 300V AC * Insulation resistance: 1000 M * Differential impedance: 100 +/-10 Packaging * Tape and Reel Materials * Cage: o Base Material: Copper alloy o Plating: Nickel plating, bright tin or matte tin over nickel * Connector: o Base Material: Copper alloy o Plating: Gold over Nickel in contact areas o Housing: Lead-free solder reflow process compatible thermoplastic, UL 94 V-0 rated Temperature Rating * Operating temperature: -55 to +85 * Storage temperature: -55 to +85 Configurations (Rows x Ports/Row) * 1x1 * 1x2 * 1x4 * 1x6 14 UE76 3G 20 UltraPortTM X 6 0 0 T PACKAGING P UE76 T T- Tape and reel packaging SERIES DESIGNATION (RoHS) 3G 3rd Generation- 25/32G Ganged Connector 20 20 SMT connector X PLATING OPTION 3 0 OPTION 2 0 OPTION 1 6 2- 0.76um Gold at mating area gold flash in termination 3- 0.76um Gold at mating area gold flash 3.0-7.62um matte tin in termination 5- 0.38um Gold at mating area gold flash in termination 6- 0.38um gold at mating area 3.0-7.62um matte tin in termination UltraPortTM U77 3G U77 3G A X X X X SERIES DESIGNATION (RoHS) X X X X PACKAGING 1-Tray Packaging T - Tape and Reel Packaging 3rd Generation- 25/32G Ganged Cage OPTION 1 A X X 7 - Cage with Extra Bottom Spring Fingers, No Bottom Mid G-Pins STYLE A - One Row NUMBER OF PORT IN ROW DUST COVER OPTION N-1XN(N=1,2,3,4,6,8) X 0 - Without Dust Covers D - With Dust Covers EMI CHASSIS GROUNDING PLATING OPTIONS FOR CAGE 4 - Gasket 2-Nickel Plating 6 - Spring Finger 3-Matte Tin Plating 6-Silver-Nickel Material (No Plating) HEAT SINK AND LIGHT PIPE OPTION 1- No Heat Sink/ Light Pipe PCB MOUNTING OPTION X - Various Options Available Consult Sales or Website for Details 15 X The ExpressPortTM QSFP+/QSFP interconnect system is comprised of a 38 position 0.8mm picth SMT connector, and a press-fit cage desgined to comply with the Quad Small Form-factor Pluggable(QSFP) Transciever inteneded for extral connections. High speed serial interconnect application include clusters, servers, and storage devices. U90-XXX1-1XXX U90-G351-101A U90-XXX1-1XXX Mechanical Characteristics * Cage is Keyed According to QSFP MSA o QSFP+: SFF-8436 o E-Series: SFF-8672 * Durability: 250 Mating Cycles min * Connector Insertion Froce: 40 N max * Connector Withdrawal Force: 30 N max Electrical Characteristics * Hot Swappable * Operating Voltage: 30V * Operating Current: 0.5A * DifferentiaI Impedance: 100 +/- 10 * DWV: 300 V AC * Insulation Resistance: 1000M min * Contact Resistance: 70 m max 16 17 16 18 19 UltraPortTM QSFP+ Stacked The UltraPortTM QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. High speed serial interconnect applications include clusters, servers, and storage devices. P-U95-Z105-XXX1-XX1 P-U95-Z205-XXX1-XX1 P-U95-Z305-XXX1-XX1 The UltraPortTM QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications and supports 32 Gbps per channel. Each port offers 4 channels to increase port density. General Characteristics * RoHS Compliant * Industry Standard Footprint * Belly-to-belly Mount * Combos are tray packed * Dust cover for front face is available (bulk packed) Connector Mechanical Characteristics * Insertion force: 40 N maximum * Withdrawal force: 30 N maximum * Durability: 250 mating cycles Material Requirements Electrical connector chicklets: * Contact area to have 15 '' and 30 '' gold option, over 50 '' nickel on mating area * Press fit termination to have 100-300 '' nickel * Molding body LCP Housing: Glass-reinforced thermoplastic, UL 94 V-0 rated Cage: Copper alloy, tin over nickel or nickel only plating Temperature Rating Temperature rise: Meets the requirement of 30 C T Operating and storage temperature: -40 to +85 C Connector Electrical Characteristics * Maximum current: 0.5A per contact * Maximum voltage: 30V per contact * LLCR: 80 m max * Insulation Resistance: 1000 M at 100V DC for 60 seconds * DWV: 300V minimum DC for 60 seconds Available Options * Various EMI Shielding Options * Heat Sinks * Light Pipes * Dust Covers * Through and Behind the Bezel and Hybrid Cage Options Available Configurations (Rows x Ports/Row) * 2x1,2x2,2x3,2x4 Supports Multiple Data Transfer Protocols * Infiniband : 4x SDR/DDR/QDR/HDR * 100 Gigabit Ethernet 20 UltraPortTM U95 Z 05 U95 Z 1-Standard Z-Standard 0 5 21 UltraPortTM QSFP+ SMT Connector and Cages New QSFP version as an extension of the H-Series, similar to the zQSFP/zQSFP+, tentatively named hQSFP The UltraPortTM QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The UltraPortTM QSFP+ connecter supports next generation 100G+ applications and transmits up to 40 Gbps per-serial-lane making it the fastest connector in the QSFP+ market. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes crosstalk and transmission line impedance discontinuity across the connector interface at speeds up to 32 Gbps. U95-T6X1-1XXX FS1-Z38-20Z6-10 General Characteristics * RoHS Compliant * Industry Standard Footprint (SFF 8665) * Belly-to-belly Mount Available Configurations (Rows x Ports/Row) * 1x1,1x2,1x3,1x4,1x6 Connector Mechanical Characteristics * Insertion force: 40 N maximum * Withdrawal force: 30 N maximum * Durability: 300 mating cycles Connector Electrical Characteristics * Maximum current: 0.5A per contact * Maximum voltage: 30V per contact * LLCR: 80 m max * Insulation Resistance: 1000 M at 100V DC for 60 seconds * DWV: 300V minimum DC for 60 seconds Available Options * Various EMI Shielding Options * Heat Sinks * Light Pipes * Dust Covers * Through and Behind the Bezel and Hybrid Cage Options U95-T1X1-1XXX Material Requirements Contacts: * Base material : Phosphor Bronze * Contact Normal Force : 60g nominal * Formed edge * Plating : o Mating area : 30 microinches (0.76 m) " min Gold over 50 " (1.27m) min Nickel o Solder tails :100 microinches (2.54 m) " min Tin over 50 " (1.27m) min Nickel * Housing: Black color, glass-reinforced, lead-free solder reflow process compatible thermoplastic, UL94V-0 rated * Resonance dampening feature: Conductive polymer Temperature Rating Temperature rise: Meets the requirement of 30 C T Operating and storage temperature: -40 to +85 C Signal Integrity * Insertion loss : Max 1.0 dB at 16 GHz * Return loss : Less than -10 dB at 18 GHz * Common mode conversion : Lesss than * 7.0 dB at 18 GHz * NEXT (Near End Cross Talk) less than * 50 dB range of 1MHz to 20GHz * FEXT (Far End Cross Talk) less than * 30 dB range of 1MHz to 20GHz 22 Z Z6 + UltraPortTM QSFP+ Z Standard Standard 6 Standard Z 5 T + UltraPortTM QSFP+ 5 T and Optional LP 1 - Tray Packaging (Light Pipe and/or Heat Sink Shipped Loose if Ordered) A - Tray Packaging (Light Pipe and/or Heat Sink Assembled to the Cage) with Heat Sink and Clip 1 - Dual Barrel Light Pipe - Round Outlet 7- Single Barrel Light Pipe -Round Outlet R Y - Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated) and Clip (H=6.94 mm) W - Extruded Custom Heat Sink for Front to Back Air Flow (Nickel Plated) and Clip (H=8.72 mm) 23 Amphenol's CXP connector comes in a one-piece press-fit assmebly system with twelve channels of up to 20 Gbps, resulting in 240 Gbps of total bandwidth - the fastest and most dense I/O on the market today. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3ba and the Infiniband CXP12x QDR standards. It also enables pluggable copper or optical cables to increase the flexibility of system-level hardware for end users. The CXP interconnect system is ideal for network switches, routers, severs, and storage devices. 24 25 26 27 28 7 - Same as 3, but with enhanced chicklet 29 30 31 P-U20-KCFP2-1XXX P-U98-C1X1-X0XX The CFP2 and CFP4 interconnect systems are comprised of insert molding assemblies for top side contacts and press-fit cage assemblies. Both CFP2 and CFP4 have a plug connector on the mating interface that improves accuracy and aids in achieving high speed performance. Key Features General Characteristics * Two piece electrical connector for superior electrical * Complies with IEEE and ITU-T applications performance and superior mechanical integrity * 0.6mm contact pitch * Supports LC, MTP12 and MTP24 optical connector * CFP2 has 104 positions, CFP4 has 56 positions. types * Rated for 25 Gbps per ch. with resonance dampening for * Alternative solutions to limitations of QSFP+: improved signal integrity. thermal, jitter budget and reach * Module and host systems are hot pluggable, not damaged by insertion/removal Mechanical Characteristics * Integrated kickout spring with cage assembly for CFP4 * Maximum Insertion Force: 80N (Cage and Connector) * Maximum Extraction Force: 80N (Cage and Connector) Materials * Minimum Cage Retention: 180N * Cage * Minimum Module Retention: 90 N oBase Material: Copper Alloy * Durability: 200 Mating Cycles min oPlating: Nickel * oHeat Sink: Aluminum Alloy oHeat Sink Clip: Stainless Steel oDust Cover: Thermoplastic oConnector cover: Zinc Alloy Connector oContact Base Material: Phosphor Bronze oContact Plating: Gold on Mating Area, Matte Tin on Termination oHousings: Glass Reinforced, Lead-Free Solder Reflow Process Compatible Thermoplastic, UL94V-0 Rate d oResonance Dampening Feature: Conductive Polymer Electrical Characteristics * Operating Voltage: 3.3 V * Operating Current: 1.875A 32 Applications * Supports 40Gbit/s and 100Gbit/s interfaces for Ethernet (IEEE802.3), Telecommunication (ITU-T) and other optical networking applications * Supports single mode and multimode fiber optics * Accommodates a wide range of power dissipations and applications * Nominal signalling rate of 25Gbit/s per ch. Options * Heat Sink and Clip oStandard: Aluminum Alloy oCustom designs available * EMI Gasket * Connector Cover * Dust Cover 0 -With Connector Cover, No Kickout Spring * A -Without Connector Cover or Kickout Spring * B -Without Connector Cover, With Kickout Spring C -With Connector Cover & Kickout Spring *CPF2 Only 2 -Standard Heat Sink (Hard Coat Anodized) And Clip MYLAR TAPE OPTION 1 -Standard (No Mylar Tape) 2 -With Mylar Tape on Bottom Cage 33 34 35 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Amphenol: SASF3110061C SASF8100241 SASF5140241 SASF5110262C U65B041210 UE78A11180D61H FS1SF414E1