2
P/N: PM1638
MX25V4006E
REV. 1.9, June 02, 2016
Contents
FEATURES .................................................................................................................................................................. 4
GENERAL DESCRIPTION .........................................................................................................................................5
PIN CONFIGURATIONS .............................................................................................................................................. 5
PIN DESCRIPTION ...................................................................................................................................................... 5
BLOCK DIAGRAM ....................................................................................................................................................... 6
MEMORY ORGANIZATION ......................................................................................................................................... 7
Table 1. Memory Organization .................................................................................................................................................7
DEVICE OPERATION .................................................................................................................................................. 8
Figure 1. Serial Peripheral Interface Modes Supported ...........................................................................................................8
DATA PROTECTION ....................................................................................................................................................9
Table 2. Protected Area Sizes ..................................................................................................................................................9
HOLD FEATURE ........................................................................................................................................................ 10
Figure 2. Hold Condition Operation ............................................................................................................. 10
Table 3. COMMAND DEFINITION .........................................................................................................................................12
COMMAND DESCRIPTION ....................................................................................................................................... 13
(1) Write Enable (WREN) .......................................................................................................................................................13
(2) Write Disable (WRDI) ........................................................................................................................................................13
(3) Read Status Register (RDSR) ..........................................................................................................................................14
(4) Write Status Register (WRSR) ..........................................................................................................................................15
Table 4. Protection Modes ......................................................................................................................................................15
(5) Read Data Bytes (READ) .................................................................................................................................................16
(6) Read Data Bytes at Higher Speed (FAST_READ) ...........................................................................................................16
(7) Dual Output Mode (DREAD) .............................................................................................................................................16
(8) Sector Erase (SE) .............................................................................................................................................................16
(9) Block Erase (BE) ...............................................................................................................................................................17
(10) Chip Erase (CE) ..............................................................................................................................................................17
(11) Page Program (PP) .........................................................................................................................................................17
(12) Deep Power-down (DP) ..................................................................................................................................................18
(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) .................................................................18
(14) Read Identication (RDID) ..............................................................................................................................................19
(15) Read Electronic Manufacturer ID & Device ID (REMS) ..................................................................................................19
Table 5. ID Denitions ............................................................................................................................................................19
(16) Read SFDP Mode (RDSFDP) .........................................................................................................................................20
Read Serial Flash Discoverable Parameter (RDSFDP) Sequence ........................................................................................20
Table 6. Signature and Parameter Identication Data Values ...............................................................................................21
Table 7. Parameter Table (0): JEDEC Flash Parameter Tables .............................................................................................22
Table 8. Parameter Table (1): Macronix Flash Parameter Tables ...........................................................................................24
POWER-ON STATE ................................................................................................................................................... 26
ELECTRICAL SPECIFICATIONS .............................................................................................................................. 27
ABSOLUTE MAXIMUM RATINGS .........................................................................................................................................27
Figure 2. Maximum Negative Overshoot Waveform ...............................................................................................................27
CAPACITANCE TA = 25°C, f = 1.0 MHz .................................................................................................................................27
Figure 3. Maximum Positive Overshoot Waveform ................................................................................................................27
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL ..................................................................................28
Figure 5. OUTPUT LOADING ...............................................................................................................................................28
Table 9. DC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.35V - 3.6V) ....................................................29
Table 10. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.35V - 3.6V) ..................................................30
Table 11. Power-Up Timing.....................................................................................................................................................31