74AHC245PW-T - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1998 Sep 21

File under Integrated Circuits, IC06

1999 Sep 28

INTEGRATED CIRCUITS

74AHC245; 74AHCT245

Octal bus transceiver; 3-state

1999 Sep 28 2

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

FEATURES

•ESD protection:

HBM EIA/JESD22-A114-A

exceeds 2000 V

MM EIA/JESD22-A115-A

exceeds 200 V

CDM EIA/JESD22-C101

exceeds 1000 V

•Balanced propagation delays

•All inputs have a Schmitt-trigger

action

•Inputsacceptsvoltageshigherthan

VCC

•For AHC only:

operates with CMOS input levels

•For AHCT only:

operates with TTL input levels

•Specified from

−40 to +85 and +125 °C.

DESCRIPTION

The 74AHC/AHCT245 is a

high-speed Si-gate CMOS device.

The 74AHC/AHCT245 is an octal

transceiver featuring non-inverting

3-state bus compatible outputs in

both send and receive directions.

The74AHC245/74AHCT245features

an Output Enable (OE) input for easy

cascading and a send/receive (DIR)

input for direction control.

OE controls the outputs so that the

buses are effectively isolated.

FUNCTION TABLE

See Note 1.

Note

1. H = HIGH voltage level;

L = LOW voltage level;

X = don’t care;

Z = high-impedance OFF-state.

QUICK REFERENCE DATA

GND = 0 V; Tamb =25°C; tr=t

f≤3.0 ns.

Notes

1. CPD is used to determine the dynamic power dissipation (PDin µW).

PD=C

PD ×VCC2×fi+∑(CL×VCC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

∑(CL×VCC2×fo) = sum of outputs;

CL= output load capacitance in pF;

VCC = supply voltage in Volts.

2. The condition is VI= GND to VCC.

INPUTS INPUTS/OUTPUTS

OE DIR AnBn

L L A = B inputs

L H inputs B = A

HXZZ

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

AHC AHCT

tPHL/tPLH propagation delay CL=15pF;

CC =5V 3.5 5.0 ns

Anto Bn, Bnto An

CIinput capacitance VI=V

CC or GND 3.5 3.5 pF

COoutput

capacitance 4.0 4.0 pF

CPD power dissipation

capacitance CL=50pF;

f = 1 MHz;

notes 1 and 2

12 15 pF

1999 Sep 28 3

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

ORDERING INFORMATION

PINNING

OUTSIDE NORTH

AMERICA NORTH AMERICA PACKAGES

PINS PACKAGE MATERIAL CODE

74AHC245D 74AHC245D 20 SO plastic SOT163-1

74AHC245PW 74AHC245PW DH 20 TSSOP plastic SOT360-1

74AHCT245D 74AHCT245D 20 SO plastic SOT163-1

74AHCT245PW 7AHCT245PW DH 20 TSSOP plastic SOT360-1

PIN SYMBOL DESCRIPTION

1 DIR direction control

2to9 A

0to A7data inputs/outputs

10 GND ground (0 V)

11 to 18 B7to B0data inputs/outputs

19 OE output enable input (active LOW)

20 VCC DC supply voltage

Fig.1 Pin configuration.

handbook, halfpage

DIR

GND

VCC

10 11

245

MNA173

1999 Sep 28 4

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

Fig.2 Logic symbol.

handbook, halfpage

1DIR

MNA174

Fig.3 IEEE/IEC logic symbol.

handbook, halfpage

173

119

3EN1

3EN2

MNA175

1999 Sep 28 5

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

RECOMMENDED OPERATING CONDITIONS

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. For SO packages: above 70 °C the value of PDderates linearly with 8 mW/K.

For TSSOP packages: above 60 °C the value of PDderates linearly with 5.5 mW/K.

SYMBOL PARAMETER CONDITIONS 74AHC 74AHCT UNIT

MIN. TYP. MAX. MIN. TYP. MAX.

VCC DC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V

VIinput voltage 0 −5.5 0 −5.5 V

VOoutput voltage 0 −VCC 0−VCC V

Tamb operating ambient temperature

range see DC and AC

characteristics per

device

−40 +25 +85 −40 +25 +85 °C

−40 +25 +125 −40 +25 +125 °C

tr,tf (∆t/∆f) input rise and fall rates VCC = 3.3 V ±0.3 V −−100 −−−ns/V

VCC =5V±0.5 V −−20 −−20

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC DC supply voltage −0.5 +7.0 V

VIinput voltage range −0.5 +7.0 V

IIK DC input diode current VI<−0.5 V; note 1 −−20 mA

IOK DC output diode current VO<−0.5 Vor VO>V

CC + 0.5 V; note 1 −±20 mA

IODC output source or sink current −0.5V<V

O<V

CC + 0.5 V −±25 mA

ICC DC VCC or GND current −±75 mA

Tstg storage temperature range −65 +150 °C

PDpower dissipation per package for temperature range: −40 to +125 °C; note 2 −500 mW

1999 Sep 28 6

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

DC CHARACTERISTICS

74AHC family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

OTHER VCC (V) 25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VIH HIGH-level input

voltage 2.0 1.5 −−1.5 −1.5 −V

3.0 2.1 −−2.1 −2.1 −

5.5 3.85 −−3.85 −3.85 −

VIL LOW-level input

voltage 2.0 −− 0.5 −0.5 −0.5 V

3.0 −− 0.9 −0.9 −0.9

5.5 −− 1.65 −1.65 −1.65

VOH HIGH-level output

voltage; all

outputs

VI=V

IH or VIL;

IO=−50 µA2.0 1.9 2.0 −1.9 −1.9 −V

3.0 2.9 3.0 −2.9 −2.9 −

4.5 4.4 4.5 −4.4 −4.4 −

HIGH-level output

voltage VI=V

IH or VIL;

IO=−4.0 mA 3.0 2.58 −−2.48 −2.40 −V

VI=V

IH or VIL;

IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −

VOL LOW-level output

voltage; all

outputs

VI=V

IH or VIL;

IO=50µA2.0 −0 0.1 −0.1 −0.1 V

3.0 −0 0.1 −0.1 −0.1

4.5 −0 0.1 −0.1 −0.1

LOW-level output

voltage VI=V

IH or VIL;

IO=4mA 3.0 −− 0.36 −0.44 −0.55 V

VI=V

IH or VIL;

IO=8mA 4.5 −− 0.36 −0.44 −0.55

IIinput leakage

current VI=V

CC or GND 5.5 −− 0.1 −1.0 −2.0 µA

IOZ 3-state output

OFF current VI=V

IH or VIL;

VO=V

CC or GND 5.5 −− ±0.25 −±2.5 −±10.0 µA

ICC quiescent supply

current VI=V

CC or GND;

IO=0 5.5 −− 4.0 −40 −80 µA

CIinput capacitance −−310−10 −10 pF

1999 Sep 28 7

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

74AHCT family

Over recommended operating conditions; voltages are referenced to GND (ground=0V).

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

OTHER VCC (V) 25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VIH HIGH-level input

voltage 4.5 to 5.5 2.0 −−2.0 −2.0 −V

VIL LOW-level input

voltage 4.5 to 5.5 −− 0.8 −0.8 −0.8 V

VOH HIGH-level output

voltage; all

outputs

VI=V

IH or VIL;

IO=−50 µA4.5 4.4 4.5 −4.4 −4.4 −V

HIGH-level output

voltage VI=V

IH or VIL;

IO=−8.0 mA 4.5 3.94 −−3.8 −3.70 −V

VOL LOW-level output

voltage; all

outputs

VI=V

IH or VIL;

IO=50µA4.5 −0 0.1 −0.1 −0.1 V

LOW-level output

voltage VI=V

IH or VIL;

IO=8mA 4.5 −− 0.36 −0.44 −0.55 V

IIinput leakage

current VI=V

IH or VIL 5.5 −− 0.1 −1.0 −2.0 µA

IOZ 3-state output

OFF current VI=V

IH or VIL;

VO=V

CC or GND

per input pin;

other inputs at

VCC or GND;

IO=0

5.5 −− ±0.25 −±2.5 −±10.0 µA

ICC quiescent supply

current VI=V

CC or GND;

IO=0 5.5 −− 4.0 −40 −80 µA

∆ICC additional

quiescent supply

current per input

VI=V

CC −2.1 V

other inputs at

VCC or GND;

IO=0

4.5 to 5.5 −− 1.35 −1.5 −1.5 mA

CIinput capacitance −−310−10 −10 pF

1999 Sep 28 8

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

AC CHARACTERISTICS

Type 74AHC245

GND = 0 V; tr=t

f≤3.0 ns.

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS CL25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VCC = 3.0 to 3.6 V; note 1

tPHL/tPLH propagation delay

Anto Bn; Bnto An

see Figs 4 and 6 15 pF −5.0 8.4 1.0 10.0 1.0 10.5 ns

tPZL/tPZH propagation delay

OE to An;

OE to Bn; signal

name DIR

see Figs 5 and 6 −6.5 13.2 1.0 15.5 1.0 16.5 ns

tPLZ/tPHZ propagation delay

OE to An;

OE to Bn; signal

name DIR

−7.5 12.5 1.0 15.5 1.0 16.0 ns

tPHL/tPLH propagation delay

Anto Bn; Bnto An

see Figs 4 and 6 50 pF −6.5 11.9 1.0 13.5 1.0 15.0 ns

tPZL/tPZH propagation delay

OE to An;

OE to Bn; signal

name DIR

see Figs 5 and 6 −9.0 16.7 1.0 19.0 1.0 21.0 ns

tPLZ/tPHZ propagation delay

OE to An;

OE to Bn; signal

name DIR

−10.0 15.8 1.0 18.0 1.0 20.0 ns

1999 Sep 28 9

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

Notes

1. Typical values at VCC = 3.3 V.

2. Typical values at VCC = 5.0 V.

VCC = 4.5 to 5.5 V; note 2

tPHL/tPLH propagation delay

Anto Bn; Bnto An

see Figs 4 and 6 15 pF −3.5 5.5 1.0 6.5 1.0 7.0 ns

tPZL/tPZH propagation delay

OE to An;

OE to Bn; signal

name DIR

see Figs 5 and 6 −4.0 8.5 1.0 10.0 1.0 11.0 ns

tPLZ/tPHZ propagation delay

OE to An;

OE to Bn; signal

name DIR

−4.5 7.8 1.0 9.2 1.0 10.0 ns

tPHL/tPLH propagation delay

Anto Bn; Bnto An

see Figs 4 and 6 50 pF −5.0 7.5 1.0 8.5 1.0 9.5 ns

tPZL/tPZH propagation delay

OE to An;

OE to Bn; signal

name DIR

see Figs 5 and 6 −5.0 10.6 1.0 12.0 1.0 13.5 ns

tPLZ/tPHZ propagation delay

OE to An;

OE to Bn; signal

name DIR

−6.0 9.7 1.0 11.0 1.0 12.5 ns

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS CL25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

1999 Sep 28 10

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

Type 74AHCT245

GND = 0 V; tr=t

f≤3.0 ns.

Note

1. Typical values at VCC = 5.0 V.

SYMBOL PARAMETER

TEST CONDITIONS Tamb (°C)

UNIT

WAVEFORMS CL25 −40 to +85 −40 to +125

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

VCC = 4.5 to 5.5 V; note 1

tPHL/tPLH propagation delay

Anto Bn; Bnto An

see Figs 4 and 6 15 pF −3.5 7.7 1.0 8.5 1.0 10.0 ns

tPZL/tPZH propagation delay

OE to An;

OE to Bn; signal

name DIR

see Figs 5 and 6 −5.0 13.8 1.0 15.0 1.0 17.5 ns

tPLZ/tPHZ propagation delay

OE to An;

OE to Bn; signal

name DIR

−5.0 14.4 1.0 15.5 1.0 18.0 ns

tPHL/tPLH propagation delay

Anto Bn; Bnto An

see Figs 4 and 6 50 pF −4.5 8.7 1.0 9.5 1.0 11.0 ns

tPZL/tPZH propagation delay

OE to An;

OE to Bn; signal

name DIR

see Figs 5 and 6 −6.0 14.8 1.0 16.0 1.0 18.5 ns

tPLZ/tPHZ propagation delay

OE to An;

OE to Bn; signal

name DIR

−6.0 15.4 1.0 16.5 1.0 19.5 ns

1999 Sep 28 11

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

AC WAVEFORMS

Fig.4 The input (An,B

) to output (Bn,A

) propagation delays.

handbook, halfpage

MNA176

An, Bn INPUT

Bn, An OUTPUT

tPLH tPHL

GND

VOH

VOL

FAMILY VI INPUT

REQUIREMENTS VM

INPUT VM

OUTPUT

AHC GND to VCC 50% VCC 50% VCC

AHCT GND to 3.0 V 1.5 V 50% VCC

Fig.5 The 3-state output enable and disable times.

handbook, full pagewidth

MNA177

tPLZ

tPHZ

outputs

disabled outputs

enabled

VOH − 0.3 V

VOL + 0.3 V

outputs

enabled

OUTPUT

LOW-to-OFF

OFF-to-LOW

OUTPUT

HIGH-to-OFF

OFF-to-HIGH

OEn INPUT

VCC

VOL

VOH

GND

tPZL

tPZH

FAMILY VI INPUT

REQUIREMENTS VM

INPUT VM

OUTPUT

AHC GND to VCC 50% VCC 50% VCC

AHCT GND to 3.0 V 1.5 V 50% VCC

1999 Sep 28 12

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

Fig.6 Load circuitry for switching times.

TEST S1

tPLH/tPHL open

tPLZ/tPZL VCC

tPHZ/tPZH GND

handbook, full pagewidth

open

GND

VCC

VIVO

MNA183

D.U.T.

1000 Ω

PULSE

GENERATOR

1999 Sep 28 13

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 13.0

12.6 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

detail X

0.25

075E04 MS-013AC

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.51

0.49 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

vMA

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

95-01-24

97-05-22

1999 Sep 28 14

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 6.6

6.4 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.5

0.2 8

0.13 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1 MO-153AC 93-06-16

95-02-04

0.25

110

20 11

pin 1 index

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1

max.

1.10

1999 Sep 28 15

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

SOLDERING

Introduction to soldering surface mount packages

Thistext givesa verybrief insightto acomplex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

tothe printed-circuit boardbyscreen printing,stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuitboards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswithleadsonfoursides, thefootprint must

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

1999 Sep 28 16

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, SQFP not suitable suitable

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1999 Sep 28 17

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

NOTES

1999 Sep 28 18

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

NOTES

1999 Sep 28 19

Philips Semiconductors Product speciﬁcation

Octal bus transceiver; 3-state 74AHC245; 74AHCT245

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999 68

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Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PTPhilipsDevelopmentCorporation, SemiconductorsDivision,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands 245002/02/pp20 Date of release: 1999 Sep 28 Document order number: 9397 750 06297