For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
________________General Description
The MAX1630–MAX1635 are buck-topology, step-down,
switch-mode, power-supply controllers that generate
logic-supply voltages in battery-powered systems. These
high-performance, dual/triple-output devices include on-
board power-up sequencing, power-good signaling with
delay, digital soft-start, secondary winding control, low-
dropout circuitry, internal frequency-compensation net-
works, and automatic bootstrapping.
Up to 96% efficiency is achieved through synchronous
rectification and Maxim’s proprietary Idle Mode™ control
scheme. Efficiency is greater than 80% over a 1000:1
load-current range, which extends battery life in system-
suspend or standby mode. Excellent dynamic response
corrects output load transients caused by the latest
dynamic-clock CPUs within five 300kHz clock cycles.
Strong 1A on-board gate drivers ensure fast external
N-channel MOSFET switching.
These devices feature a logic-controlled and synchroniz-
able, fixed-frequency, pulse-width-modulation (PWM)
operating mode. This reduces noise and RF interference
in sensitive mobile communications and pen-entry appli-
cations. Asserting the SKIP pin enables fixed-frequency
mode, for lowest noise under all load conditions.
The MAX1630–MAX1635 include two PWM regulators,
adjustable from 2.5V to 5.5V with fixed 5.0V and 3.3V
modes. All these devices include secondary feedback
regulation, and the MAX1630/MAX1632/MAX1633/
MAX1635 each contain 12V/120mA linear regulators. The
MAX1631/MAX1634 include a secondary feedback input
(SECFB), plus a control pin (STEER) that selects which
PWM (3.3V or 5V) receives the secondary feedback sig-
nal. SECFB provides a method for adjusting the sec-
ondary winding voltage regulation point with an external
resistor divider, and is intended to aid in creating auxiliary
voltages other than fixed 12V.
The MAX1630/MAX1631/MAX1632 contain internal out-
put overvoltage and undervoltage protection features.
________________________Applications
Notebook and Subnotebook Computers
PDAs and Mobile Communicators
Desktop CPU Local DC-DC Converters
____________________________Features
♦96% Efficiency
♦+4.2V to +30V Input Range
♦2.5V to 5.5V Dual Adjustable Outputs
♦Selectable 3.3V and 5V Fixed or Adjustable
Outputs (Dual Mode™)
♦12V Linear Regulator
♦Adjustable Secondary Feedback
(MAX1631/MAX1634)
♦5V/50mA Linear Regulator Output
♦Precision 2.5V Reference Output
♦Programmable Power-Up Sequencing
♦Power-Good (RESET) Output
♦Output Overvoltage Protection
(MAX1630/MAX1631/MAX1632)
♦Output Undervoltage Shutdown
(MAX1630/MAX1631/MAX1632)
♦200kHz/300kHz Low-Noise, Fixed-Frequency
Operation
♦Low-Dropout, 99% Duty-Factor Operation
♦2.5mW Typical Quiescent Power (+12V input, both
SMPSs on)
♦4μA Typical Shutdown Current
♦28-Pin SSOP Package
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
________________________________________________________________ Maxim Integrated Products 1
5V
LINEAR
12V
LINEAR
POWER-UP
SEQUENCE
POWER-
GOOD
3.3V
SMPS
5V
SMPS
RESETON/OFF
+5V (RTC)
+3.3V
INPUT
+5V
+12V
________________Functional Diagram
19-0480; Rev 4; 8/05
EVALUATION KIT
AVAILABLE
_______________Ordering Information
Ordering Information continued at end of data sheet.
Pin Configurations and Selector Guide appear at end of data
sheet.
Idle Mode and Dual Mode are trademarks of Maxim Integrated
Products.
+ Denotes lead-free package.
PART TEMP RANGE
PIN-PACKAGE
MAX1630CAI 0°C to +70°C 28 SSOP
MAX1630CAI+ 0°C to +70°C 28 SSOP
MAX1630EAI+ -40°C to +85°C 28 SSOP
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V+ = 15V, both PWMs on, SYNC = VL, VL load = 0mA, REF load = 0mA, SKIP = 0V, TA= TMIN to TMAX, unless otherwise noted.
Typical values are at TA= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V+ to GND ..............................................................-0.3V to +36V
PGND to GND.....................................................................±0.3V
VL to GND ................................................................-0.3V to +6V
BST3, BST5 to GND ...............................................-0.3V to +36V
LX3 to BST3..............................................................-6V to +0.3V
LX5 to BST5..............................................................-6V to +0.3V
REF, SYNC, SEQ, STEER, SKIP, TIME/ON5,
SECFB, RESET to GND ............................................-0.3V to +6V
VDD to GND............................................................-0.3V to +20V
RUN/ON3, SHDN to GND.............................-0.3V to (V+ + 0.3V)
12OUT to GND ...........................................-0.3V to (VDD + 0.3V)
DL3, DL5 to PGND........................................-0.3V to (VL + 0.3V)
DH3 to LX3 ...............................................-0.3V to (BST3 + 0.3V)
DH5 to LX5 ...............................................-0.3V to (BST5 + 0.3V)
VL, REF Short to GND ................................................Momentary
12OUT Short to GND..................................................Continuous
REF Current...........................................................+5mA to -1mA
VL Current.........................................................................+50mA
12OUT Current ...............................................................+200mA
VDD Shunt Current............................................................+15mA
Operating Temperature Ranges
MAX163_CAI.......................................................0°C to +70°C
MAX163_EAI....................................................-40°C to +85°C
Storage Temperature Range .............................-65°C to +160°C
Continuous Power Dissipation (TA= +70°C)
SSOP (derate 9.52mW/°C above +70°C) ....................762mW
Lead Temperature (soldering, 10s) .................................+300°C
CONDITIONS
V4.2 30.0Input Voltage Range
UNITSMIN TYP MAXPARAMETER
Either SMPS
V+ = 4.2V to 30V, CSH3–CSL3 = 0V,
CSL3 tied to FB3
VREF 5.5
V2.42 2.5 2.58
3V Output Voltage in
Adjustable Mode
Output Voltage Adjust Range
Either SMPS, 5.2V < V+ < 30V %/V0.03
Either SMPS, 0V < CSH_–CSL_ < 80mV
Line Regulation
Dual Mode comparator
%-2
V0.5 1.1Adjustable-Mode Threshold Voltage
Load Regulation
SYNC = VL
From enable to 95% full current limit with respect to
fOSC (Note 1)
270 300 330
Clk512
SKIP = 0V, not tested
Soft-Start Ramp Time
mV10 25 40Idle Mode Threshold
SYNC = 0V kHz
170 200 230
Oscillator Frequency
V+ = 4.2V to 30V, 0mV < CSH3–CSL3 < 80mV,
FB3 = 0V V3.20 3.39 3.473V Output Voltage in Fixed Mode
V+ = 4.2V to 30V, CSH5–CSL5 = 0V,
CSL5 tied to FB5 V2.42 2.5 2.58
5V Output Voltage in
Adjustable Mode
V+ = 5.2V to 30V, 0mV < CSH–CSL5 < 80mV,
FB5 = 0V V4.85 5.13 5.255V Output Voltage in Fixed Mode
SYNC = VL 97 98
SYNC = 0V (Note 2) %
98 99
Maximum Duty Factor
CSH3–CSL3 or CSH5–CSL5 80 100 120
SKIP = VL or VDD < 13V or SECFB < 2.44V mV
-50 -100 -150
Current-Limit Threshold
MAIN SMPS CONTROLLERS
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(V+ = 15V, both PWMs on, SYNC = VL, VL load = 0mA, REF load = 0mA, SKIP = 0V, TA= TMIN to TMAX, unless otherwise noted.
Typical values are at TA= +25°C.)
V+ = VL = 0V,
CSL3 = CSH3 = CSL5 = CSH5 = 5.5V µA0.01 10
Not tested
Current-Sense Input Leakage Current
Not tested
Rising edge, hysteresis = 1% (Note 3)
VDD < 13V or SECFB < 2.44V
V18 20
µs1
Falling edge (MAX1631/MAX1634)
DL Pulse Width
Falling edge (Note 3)
VDD Shunt Threshold
V2.44 2.60
V13 14
CONDITIONS
VDD Regulation Threshold
SECFB Regulation Threshold
VDD = 20V (Note 3)
VDD = 5V, off mode (Notes 3, 4) µA30VDD Leakage Current
mA10VDD Shunt Sink Current
ns200
ns200SYNC Input High Pulse Width
SYNC Input Low Pulse Width
13V < VDD < 18V, 0mA < ILOAD < 120mA V11.65 12.1 12.5012OUT Output Voltage
UNITSMIN TYP MAXPARAMETER
Not tested ns200SYNC Rise/Fall Time
kHz240 350SYNC Input Frequency Range
VDD = 18V, run mode, no 12OUT load
12OUT forced to 11V, VDD = 13V
µA50 100
mA15012OUT Current Limit
Quiescent VDD Current
Rising edge of CSL5, hysteresis = 1%
Falling edge, hysteresis = 1%
V4.2 4.5 4.7
V3.5 3.6 3.7
VL Undervoltage Lockout
Fault Threshold
VL Switchover Threshold
SHDN = V+, RUN/ON3 = TIME/ON5 = 0V,
5.3V < V+ < 30V, 0mA < ILOAD < 50mA V4.7 5.1VL Output Voltage
Falling edge V1.8 2.4
µA10REF Sink Current
REF Fault Lockout Voltage
V+ = 4V to 24V, SHDN = 0V
V+ = 4.2V to 5.5V, both SMPSs off,
includes current into SHDN
µA410
µA50 200
V+ Standby Supply Current
in Dropout
V+ Shutdown Supply Current
V+ = 5.5V to 30V, both SMPSs off,
includes current into SHDN
VL switched over to CSL5, 5V SMPS on
µA30 60
µA550V+ Operating Supply Current
V+ Standby Supply Current
0µA < ILOAD < 50µA
No external load (Note 5)
12.5
V2.45 2.5 2.55REF Output Voltage
2.5 4
Both SMPSs enabled, FB3 = FB5 = 0V,
CSL3 = CSH3 = 3.5V,
CSL5 = CSH5 = 5.3V
mW
1.5 4
Quiescent Power Consumption
(Note 3)
MAX1631/
MAX1634
0mA < ILOAD < 5mA mV
100.0
REF Load Regulation
FLYBACK CONTROLLER
12V LINEAR REGULATOR (Note 3)
INTERNAL REGULATOR AND REFERENCE
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
4 _______________________________________________________________________________________
Note 1: Each of the four digital soft-start levels is tested for functionality; the steps are typically in 20mV increments.
Note 2: High duty-factor operation supports low input-to-output differential voltages, and is achieved at a lowered operating
frequency (see Overload and Dropout Operation section).
Note 3: MAX1630/MAX1632/MAX1633/MAX1635 only.
Note 4: Off mode for the 12V linear regulator occurs when the SMPS that has flyback feedback (VDD) steered to it is disabled. In
situations where the main outputs are being held up by external keep-alive supplies, turning off the 12OUT regulator pre-
vents a leakage path from the output-referred flyback winding, through the rectifier, and into VDD.
Note 5: Since the reference uses VL as its supply, the reference’s V+ line-regulation error is insignificant.
ELECTRICAL CHARACTERISTICS (continued)
(V+ = 15V, both PWMs on, SYNC = VL, VL load = 0mA, REF load = 0mA, SKIP = 0V, TA= TMIN to TMAX, unless otherwise noted.
Typical values are at TA= +25°C.)
Typical hysteresis = +10°C
From each SMPS enabled, with respect to fOSC
°C150
Clk5000 6144 7000
With respect to unloaded output voltage
Output Undervoltage Lockout Time
Thermal Shutdown Threshold
With respect to fOSC
Falling edge, CSL_ driven 2%
below RESET trip threshold
Clk27,000 32,000 37,000
µs1.5
With respect to unloaded output voltage,
falling edge; typical hysteresis = 1%
RESET Propagation Delay
RESET Delay Time
%-7 -5.5 -4
CONDITIONS
RESET Trip Threshold
RESET, ISINK = 4mA
RUN/ON3, SKIP, TIME/ON5 (SEQ = REF),
SHDN, STEER, SYNC, SEQ; VPIN = 0V or 3.3V
V0.4
µA±1Input Leakage Current
Logic Output Low Voltage
CSL_ driven 2% above overvoltage trip threshold µs
FB3, FB5; SECFB = 2.6V
1.5Overvoltage-Fault Propagation Delay
nA150
With respect to unloaded output voltage %60 70 80
Feedback Input Leakage Current
Output Undervoltage Threshold
%4710Overvoltage Trip Threshold
RUN/ON3, SKIP, TIME/ON5 (SEQ = REF),
SHDN, STEER, SYNC
RUN/ON3, SKIP, TIME/ON5 (SEQ = REF),
SHDN, STEER, SYNC
V2.4
V0.6Logic Input Low Voltage
Logic Input High Voltage
UNITSMIN TYP MAXPARAMETER
High or low
DL3, DH3, DL5, DH5; forced to 2V
Ω1.5 7
A1Gate Driver Sink/Source Current
Gate Driver On-Resistance
RESET = 3.5V mA1Logic Output High Current
TIME/ON5 = 0V, SEQ = 0V or VL
SEQ = 0V or VL
µA2.5 3 3.5
V2.4 2.6TIME/ON5 Input Trip Level
TIME/ON5 Source Current
TIME/ON5; RUN/ON3 = 0V, SEQ = 0V or VL Ω15 80TIME/ON5 On-Resistance
FAULT DETECTION (MAX1630/MAX1631/MAX1632)
INPUTS AND OUTPUTS
RESET
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
_______________________________________________________________________________________ 5
100
50
0.001 0.01 0.1 1 10
EFFICIENCY vs. 5V OUTPUT CURRENT
60
MAX1630/35-01
5V OUTPUT CURRENT (A)
EFFICIENCY (%)
70
80
90
ON5 = 5V
ON3 = 0V
f = 300kHz
MAX1631/MAX1634
V+ = 6V
V+ = 15V
100
50
0.001 0.01 0.1 1 10
EFFICIENCY vs. 3.3V OUTPUT CURRENT
60
MAX1630/35-02
3.3V OUTPUT CURRENT (A)
EFFICIENCY (%)
70
80
90
ON3 = ON5 = 5V
f = 300kHz
MAX1631/MAX1634
V+ = 6V
V+ = 15V
800
0
15 20
MAX1632/MAX1635
MAXIMUM 15V VDD OUTPUT
CURRENT vs. SUPPLY VOLTAGE
600
MAX 1630/35-03
SUPPLY VOLTAGE (V)
MAXIMUM OUTPUT CURRENT (mA)
0
200
10
400
5
VDD > 13V
5V REGULATING
5V LOAD = 0A
5V LOAD = 3A
500
0
15 20
MAX1630/MAX1633
MAXIMUM 15V VDD OUTPUT
CURRENT vs. SUPPLY VOLTAGE
400
MAX 1630/35-04
SUPPLY VOLTAGE (V)
MAXIMUM OUTPUT CURRENT (mA)
0
200
100
10
300
5
VDD > 13V
3.3V REGULATING
3.3V LOAD = 0A
3.3V LOAD = 3A
10,000
1
030
STANDBY INPUT CURRENT
vs. INPUT VOLTAGE
1000
MAX1630/35-07
INPUT VOLTAGE (V)
INPUT CURRENT (μA)
15
10
510 25
100
20
ON3 = ON5 = 0V
NO LOAD
30
0
5
030
PWM MODE INPUT CURRENT
vs. INPUT VOLTAGE
MAX1630/35-05
INPUT VOLTAGE (V)
INPUT CURRENT (mA)
15
10
15
510 25
20
25
20
ON3 = ON5 = 5V
SKIP = VL
NO LOAD
10
0.01
030
IDLE MODE INPUT CURRENT
vs. INPUT VOLTAGE
MAX1630/35-06
INPUT VOLTAGE (V)
INPUT CURRENT (mA)
15
0.1
510 25
1
20
ON3 = ON5 = 5V
SKIP = 0V
NO LOAD
10
0
030
SHUTDOWN INPUT CURRENT
vs. INPUT VOLTAGE
8
MAX1630/35-08
INPUT VOLTAGE (V)
INPUT CURRENT (μA)
15
4
2
510 25
6
20
SHDN = 0V
1000
1
0.001 0.1 101
MINIMUM VIN TO VOUT DIFFERENTIAL
vs. 5V OUTPUT CURRENT
10
100
MAX1630/35-09
5V OUTPUT CURRENT (A)
MIN VIN TO VOUT DIFFERENTIAL (mV)
0.01
5V, 3A CIRCUIT
VOUT > 4.8V
f = 300kHz
__________________________________________Typical Operating Characteristics
(Circuit of Figure 1, 3A Table 1 components, TA = +25°C, unless otherwise noted.)
__________________________________________________________________________Pin Description
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
6 _______________________________________________________________________________________
____________________________________Typical Operating Characteristics (continued)
(Circuit of Figure 1, 3A Table 1 components, TA = +25°C, unless otherwise noted.)
Feedback Input for the 3.3V SMPS; regulates at FB3 = REF (approx. 2.5V) in adjustable mode. FB3 is a
Dual Mode input that also selects the 3.3V fixed output voltage setting when tied to GND. Connect FB3
to a resistor divider for adjustable-output mode.
FB33
12V/120mA Linear Regulator Output. Input supply comes from VDD. Bypass 12OUT to GND with
1µF minimum.
12OUT
(MAX1630/
32/33/35)
Current-Sense Input. Also serves as the feedback input in fixed-output mode.CSL32
FUNCTIONNAMEPIN
Logic-Control Input for secondary feedback. Selects the PWM that uses a transformer and secondary
feedback signal (SECFB):
STEER = GND: 3.3V SMPS uses transformer
STEER = VL: 5V SMPS uses transformer
STEER
(MAX1631/
MAX1634)
Current-Sense Input for the 3.3V SMPS. Current-limit level is 100mV referred to CSL3.CSH31
4
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
_______________________________________________________________________________________ 7
_________________________________________________Pin Description (continued)
PIN FUNCTIONNAME
Dual-Purpose Timing Capacitor Pin and ON/OFF Control Input. See Power-Up Sequencing and
ON/
OFF
Controls section.
TIME/ON57
Oscillator Synchronization and Frequency Select. Tie to VL for 300kHz operation; tie to GND for 200kHz
operation. Can be driven at 240kHz to 350kHz for external synchronization.
SYNC6
Active-Low Timed Reset Output. RESET swings GND to VL. Goes high after a fixed 32,000 clock-cycle
delay following power-up.
RESET
11
Logic-Control Input that disables Idle Mode when high. Connect to GND for normal use.
SKIP
10
2.5V Reference Voltage Output. Bypass to GND with 1µF minimum.REF9
Low-Noise Analog Ground and Feedback Reference PointGND8
Feedback Input for the 5V SMPS; regulates at FB5 = REF (approx. 2.5V) in adjustable mode. FB5 is a
Dual Mode input that also selects the 5V fixed output voltage setting when tied to GND. Connect FB5 to
a resistor divider for adjustable-output mode.
FB512
Gate-Drive Output for the 5V, high-side N-channel switch. DH5 is a floating driver output that swings
from LX5 to BST5, riding on the LX5 switching node voltage.
DH516
Pin-Strap Input that selects the SMPS power-up sequence:
SEQ = GND: 5V before 3.3V, RESET output determined by both outputs
SEQ = REF: Separate ON3/ON5 controls, RESET output determined by 3.3V output
SEQ = VL: 3.3V before 5V, RESET output determined by both outputs
SEQ15
Power GroundPGND20
Gate-Drive Output for the low-side synchronous-rectifier MOSFET. Swings 0V to VL.DL519
Boost capacitor connection for high-side gate drive (0.1µF)BST518
Switching Node (inductor) Connection. Can swing 2V below ground without hazard.LX517
Current-Sense Input for the 5V SMPS. Current-limit level is 100mV referred to CSL5.CSH514
Current-Sense Input for the 5V SMPS. Also serves as the feedback input in fixed-output mode, and as
the bootstrap supply input when the voltage on CSL5/VL is > 4.5V.
CSL513
Shutdown Control Input, active low. Logic threshold is set at approximately 1V. For automatic start-up,
connect SHDN to V+ through a 220kΩresistor and bypass SHDN to GND with a 0.01µF capacitor.
SHDN
23
Battery Voltage Input, +4.2V to +30V. Bypass V+ to PGND close to the IC with a 0.22µF capacitor.
Connects to a linear regulator that powers VL.
V+22
5V Internal Linear-Regulator Output. VL is also the supply voltage rail for the chip. After the 5V SMPS
output has reached +4.5V (typical), VL automatically switches to the output voltage via CSL5 for boot-
strapping. Bypass to GND with 4.7µF. VL supplies up to 25mA for external loads.
VL21
Supply Voltage Input for the 12OUT Linear Regulator. Also connects to an internal resistor divider for
secondary winding feedback, and to an 18V overvoltage shunt regulator clamp.
VDD
(MAX1630/
32/33/35)
Secondary Winding Feedback Input. Normally connected to a resistor divider from an auxiliary output.
SECFB regulates at VSECFB = 2.5V (see Secondary Feedback Regulation Loop section). Tie to VL if not
used.
SECFB
(MAX1631/
MAX1634)
Boost Capacitor Connection for high-side gate drive (0.1µF) BST325
Gate-Drive Output for the low-side synchronous-rectifier MOSFET. Swings 0V to VL.DL324
ON/OFF Control Input. See Power-Up Sequencing and ON/
OFF
Controls section.
RUN/ON328
Gate-Drive Output for the 3.3V, high-side N-channel switch. DH3 is a floating driver output that swings
from LX3 to BST3, riding on the LX3 switching node voltage.
DH327
Switching Node (inductor) Connection. Can swing 2V below ground without hazard.LX326
5
_______Standard Application Circuit
The basic MAX1631/MAX1634 dual-output 3.3V/5V
buck converter (Figure 1) is easily adapted to meet a
wide range of applications with inputs up to 28V by
substituting components from Table 1. These circuits
represent a good set of tradeoffs between cost, size,
and efficiency, while staying within the worst-case
specification limits for stress-related parameters, such
as capacitor ripple current. Don’t change the frequency
of these circuits without first recalculating component
values (particularly inductance value at maximum bat-
tery voltage). Adding a Schottky rectifier across each
synchronous rectifier improves the efficiency of these
circuits by approximately 1%, but this rectifier is other-
wise not needed because the MOSFETs required for
these circuits typically incorporate a high-speed silicon
diode from drain to source. Use a Schottky rectifier
rated at a DC current equal to at least one-third of the
load current.
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
8 _______________________________________________________________________________________
MAX1631
MAX1634
V+ SHDN VLSECFB
INPUT ON/OFF
C3
GND
REF SEQ
1μF
+2.5V ALWAYS ON
*1A SCHOTTKY DIODE REQUIRED
FOR THE MAX1631 (SEE OUTPUT
OVERVOLTAGE PROTECTION SECTION).
+5V ALWAYS ON
Q1
5V ON/OFF
3.3V ON/OFF
Q4
0.1μF
0.1μF
L2 R2 +3.3V OUTPUT
C2
*
4.7μF
0.1μF
4.7μF
0.1μF
10Ω
0.1μF
Q3
0.1μF
DL3
CSH3
CSL3
FB3
RESET RESET OUTPUT
SKIP
STEER
Q2
L1
R1
+5V OUTPUT
C1 DL5
LX5
DH5
BST5 BST3
SYNC
DH3
LX3
PGND
CSL5
CSH5
RUN/ON3
TIME/ON5
FB5
*
Figure 1. Standard 3.3V/5V Application Circuit (MAX1631/MAX1634)
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
_______________________________________________________________________________________ 9
Input Range
Application
Table 1. Component Selection for Standard 3.3V/5V Application
Table 2. Component Suppliers
4.75V to 18V
PDA
2A
4.75V to 28V
Notebook
3A
4.75V to 24V
Workstation
4A
Frequency 300kHz
1/2 IR IRF7301;
1/2 Siliconix Si9925DQ; or
1/2 Motorola MMDF3N03HD or
MMDF4N01HD (10V max)
300kHz
IR IRF7403 or IRF7401 (18V
max); Siliconix Si4412DY; or
Motorola MMSF5N03HD or
MMSF5N02HD (18V max)
200kHz
IR IRF7413 or
Siliconix Si4410DYQ1, Q3 High-Side
MOSFETs
Q2, Q4 Low-Side
MOSFETs
1/2 IR IRF7301;
1/2 Siliconix Si9925DQ; or
1/2 Motorola MMDF3N03HD or
MMDF4N01HD (10V max)
10µF, 30V Sanyo OS-CON;
22µF, 35V AVX TPS; or
Sprague 594D
IR IRF7403 or IRF7401 (18V
max); Siliconix Si4412DY; or
Motorola MMSF5N03HD or
MMSF5N02HD (18V max)
2 x 10µF, 30V Sanyo OS-CON;
2 x 22µF, 35V AVX TPS; or
Sprague 594D
IR IRF7413 or
Siliconix Si4410DY
3 x 10µF, 30V Sanyo OS-CON;
4 x 22µF, 35V AVX TPS; or
Sprague 595D
C1, C2 Output Capacitors 220µF, 10V AVX TPS or
Sprague 595D
0.033ΩIRC LR2010-01-R033 or
Dale WSL2010-R033-F
2 x 220µF, 10V AVX TPS or
Sprague 595D
0.02ΩIRC LR2010-01-R020 or
Dale WSL2010-R020-F
4 x 220µF, 10V AVX TPS or
Sprague 595D
0.012ΩDale WSL2512-R012-F
R1, R2 Resistors
C3 Input Capacitor
15µH, 2.4A Ferrite
Coilcraft DO3316P-153 or
Sumida CDRH125-150
10µH, 4A Ferrite
Coilcraft DO3316P-103 or
Sumida CDRH125-100
4.7µH, 5.5A Ferrite
Coilcraft DO3316-472 or
5.2µH, 6.5A Ferrite Sumida
CDRH127-5R2MC
L1, L2 Inductors
AVX (1) 803-626-3123
(1) 516-435-1824
FACTORY FAX
(COUNTRY CODE)
(803) 946-0690
(516) 435-1110
USA PHONE
Coilcraft (1) 847-639-1469 (847) 639-6400
Central
Semiconductor
COMPANY
Coiltronics (1) 561-241-9339
(1) 605-665-1627
(561) 241-7876
(605) 668-4131
International
Rectifier (IR) (1) 310-322-3332 (310) 322-3331
Dale
IRC (1) 512-992-3377
(1) 714-960-6492
(512) 992-7900
(714) 969-2491Matsuo
Motorola (1) 602-994-6430
(81) 3-3494-7414
FACTORY FAX
(COUNTRY CODE)
(602) 303-5454
(805) 867-2555*
USA PHONE
Siliconix (1) 408-970-3950
(1) 603-224-1430
Sanyo (81) 7-2070-1174
(408) 988-8000
(619) 661-6835
(603) 224-1961
Sumida (81) 3-3607-5144 (847) 956-0666
Sprague
TDK (1) 847-390-4428
(1) 702-831-3521
(847) 390-4373
(702) 831-0140
Transpower
Technologies
NIEC
COMPANY
Murata-Erie (1) 814-238-0490 (814) 237-1431
*Distributor
LOAD CURRENT
COMPONENT
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
10 ______________________________________________________________________________________
LPF
60kHz
REF
1.75V
2.68V
2.388V
R3
R4
-
+
+
-
4.5V
REF
2.5V
REF
200kHz
TO
300kHz
OSC
5V
PWM
LOGIC
5V
LINEAR
REG
VL
BST3
DH3
LX3
DL3
+3.3V
VL
ON/OFF
INPUT
+5V ALWAYS ON
CSL5
SHDN V+ SYNC
12V
LINEAR
REG
+12V
13V BST5 RAW +15V
DH5
DL5
VL
PGND
CSH5
CSL5
CSH3
CSL3
FB5
RESET
SEQ
2.6V
1V
0.6V 0.6V
VL
GND RUN/ON3
TIME/ON5
REF
LX5 +5V
12OUT
VDD
IN
SECFB
3.3V
PWM
LOGIC
REF
OUTPUTS
UP
-
+
-
+
+
-
-
+
-
+
+
-
+
-
LPF
60kHz
TIMER
POWER-ON
SEQUENCE
LOGIC
R1
R2
FB3
-
+
+
-
MAX1632
OV/UV
FAULT
Figure 2. MAX1632 Block Diagram
_______________Detailed Description
The MAX1630 is a dual, BiCMOS, switch-mode power-
supply controller designed primarily for buck-topology
regulators in battery-powered applications where high effi-
ciency and low quiescent supply current are critical. Light-
load efficiency is enhanced by automatic Idle Mode™
operation, a variable-frequency pulse-skipping mode that
reduces transition and gate-charge losses. Each step-
down, power-switching circuit consists of two N-channel
MOSFETs, a rectifier, and an LC output filter. The output
voltage is the average AC voltage at the switching node,
which is regulated by changing the duty cycle of the
MOSFET switches. The gate-drive signal to the N-channel
high-side MOSFET must exceed the battery voltage, and
is provided by a flying-capacitor boost circuit that uses a
100nF capacitor connected to BST_.
Devices in the MAX1630 family contain ten major circuit
blocks (Figure 2).
The two pulse-width modulation (PWM) controllers each
consist of a Dual Mode™ feedback network and multi-
plexer, a multi-input PWM comparator, high-side and
low-side gate drivers, and logic. MAX1630/MAX1631/
MAX1632 contain fault-protection circuits that monitor
the main PWM outputs for undervoltage and overvolt-
age. A power-on sequence block controls the power-
up timing of the main PWMs and determines whether
one or both of the outputs are monitored for undervolt-
age faults. The MAX1630/MAX1632/MAX1633/
MAX1635 include a secondary feedback network and
12V linear regulator to generate a 12V output from a
coupled-inductor flyback winding. The MAX1631/
MAX1634 have a secondary feedback input (SECFB)
instead, which allows a quasi-regulated, adjustable-
output, coupled-inductor flyback winding to be attached
to either the 3.3V or the 5V main inductor. Bias genera-
tor blocks include the 5V IC internal rail (VL) linear regu-
lator, 2.5V precision reference, and automatic bootstrap
switchover circuit. The PWMs share a common
200kHz/300kHz synchronizable oscillator.
These internal IC blocks aren’t powered directly from
the battery. Instead, the 5V VL linear regulator steps
down the battery voltage to supply both VL and the
gate drivers. The synchronous-switch gate drivers are
directly powered from VL, while the high-side switch
gate drivers are indirectly powered from VL via an
external diode-capacitor boost circuit. An automatic
bootstrap circuit turns off the +5V linear regulator and
powers the IC from the 5V PWM output voltage if the
output is above 4.5V.
PWM Controller Block
The two PWM controllers are nearly identical. The only
differences are fixed output settings (3.3V vs. 5V), the
VL/CSL5 bootstrap switch connected to the +5V PWM,
and SECFB. The heart of each current-mode PWM con-
troller is a multi-input, open-loop comparator that sums
three signals: the output voltage error signal with
respect to the reference voltage, the current-sense sig-
nal, and the slope compensation ramp (Figure 3). The
PWM controller is a direct-summing type, lacking a tra-
ditional error amplifier and the phase shift associated
with it. This direct-summing configuration approaches
ideal cycle-by-cycle control over the output voltage.
When SKIP = low, Idle Mode circuitry automatically
optimizes efficiency throughout the load current range.
Idle Mode dramatically improves light-load efficiency
by reducing the effective frequency, which reduces
switching losses. It keeps the peak inductor current
above 25% of the full current limit in an active cycle,
allowing subsequent cycles to be skipped. Idle Mode
transitions seamlessly to fixed-frequency PWM opera-
tion as load current increases.
With SKIP = high, the controller always operates in
fixed-frequency PWM mode for lowest noise. Each
pulse from the oscillator sets the main PWM latch that
turns on the high-side switch for a period determined
by the duty factor (approximately VOUT/VIN). As the
high-side switch turns off, the synchronous rectifier
latch sets; 60ns later, the low-side switch turns on. The
low-side switch stays on until the beginning of the next
clock cycle.
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 11
Table 3. SKIP PWM Table
Low Light
LOAD
CURRENT
Pulse-skipping, supply cur-
rent = 250µA at VIN = 12V,
discontinuous inductor
current
DESCRIPTION
Low Heavy Constant-frequency PWM,
continuous inductor current
SKIP
Idle
MODE
PWM
High Light PWM Constant-frequency PWM,
continuous inductor current
PWMHigh Heavy Constant-frequency PWM,
continuous inductor current
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
12 ______________________________________________________________________________________
SHOOT-
THROUGH
CONTROL
R
Q
30mV
RQ
LEVEL
SHIFT
1μs
SINGLE-SHOT
1X
MAIN PWM
COMPARATOR
OSC
LEVEL
SHIFT
CURRENT
LIMIT
SYNCHRONOUS
RECTIFIER CONTROL
REF
SHDN
CK
-100mV
CSH_
CSL_
FROM
FEEDBACK
DIVIDER
BST_
DH_
LX_
VL
DL_
PGND
S
S
SLOPE COMP
SKIP
REF
SECFB
COUNTER
DAC
SOFT-START
Figure 3. PWM Controller Detailed Block Diagram
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 13
Figure 4. Main PWM Comparator Block Diagram
FB_
REF
CSH_
CSL_
SLOPE COMPENSATION
VL
I1
R1 R2
TO PWM
LOGIC
OUTPUT DRIVER
UNCOMPENSATED
HIGH-SPEED
LEVEL TRANSLATOR
AND BUFFER
I2 I3 VBIAS
In PWM mode, the controller operates as a fixed-
frequency current-mode controller where the duty ratio
is set by the input/output voltage ratio. The current-
mode feedback system regulates the peak inductor
current value as a function of the output-voltage error
signal. In continuous-conduction mode, the average
inductor current is nearly the same as the peak current,
so the circuit acts as a switch-mode transconductance
amplifier. This pushes the second output LC filter pole,
normally found in a duty-factor-controlled (voltage-
mode) PWM, to a higher frequency. To preserve inner-
loop stability and eliminate regenerative inductor
current “staircasing,” a slope compensation ramp is
summed into the main PWM comparator to make the
apparent duty factor less than 50%.
The MAX1630 family uses a relatively low loop gain,
allowing the use of lower-cost output capacitors. The
relative gains of the voltage-sense and current-sense
inputs are weighted by the values of current sources
that bias three differential input stages in the main PWM
comparator (Figure 4). The relative gain of the voltage
comparator to the current comparator is internally fixed
at K = 2:1. The low loop gain results in the 2% typical
load-regulation error. The low value of loop gain helps
reduce output filter capacitor size and cost by shifting
the unity-gain crossover frequency to a lower level.
The output filter capacitors (Figure 1, C1 and C2) set a
dominant pole in the feedback loop that must roll off the
loop gain to unity before encountering the zero intro-
duced by the output capacitor’s parasitic resistance
(ESR) (see Design Procedure section). A 60kHz pole-
zero cancellation filter provides additional rolloff above
the unity-gain crossover. This internal 60kHz lowpass
compensation filter cancels the zero due to filter capaci-
tor ESR. The 60kHz filter is included in the loop in both
fixed-output and adjustable-output modes.
Synchronous Rectifier Driver (DL)
Synchronous rectification reduces conduction losses in
the rectifier by shunting the normal Schottky catch diode
with a low-resistance MOSFET switch. Also, the synchro-
nous rectifier ensures proper start-up of the boost gate-
driver circuit. If the synchronous power MOSFETs are
omitted for cost or other reasons, replace them with a
small-signal MOSFET, such as a 2N7002.
If the circuit is operating in continuous-conduction
mode, the DL drive waveform is simply the complement
of the DH high-side drive waveform (with controlled
dead time to prevent cross-conduction or “shoot-
through”). In discontinuous (light-load) mode, the syn-
chronous switch is turned off as the inductor current
falls through zero. The synchronous rectifier works
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
14 ______________________________________________________________________________________
under all operating conditions, including Idle Mode.
The SECFB signal further controls the synchronous
switch timing in order to improve multiple-output cross-
regulation (see Secondary Feedback Regulation Loop
section).
Internal VL and REF Supplies
An internal regulator produces the +5V supply (VL) that
powers the PWM controller, logic, reference, and other
blocks within the IC. This 5V low-dropout linear regula-
tor supplies up to 25mA for external loads, with a
reserve of 25mA for supplying gate-drive power.
Bypass VL to GND with 4.7µF.
Important: Ensure that VL does not exceed 6V.
Measure VL with the main output fully loaded. If it is
pumped above 5.5V, either excessive boost diode
capacitance or excessive ripple at V+ is the probable
cause. Use only small-signal diodes for the boost cir-
cuit (10mA to 100mA Schottky or 1N4148 are pre-
ferred), and bypass V+ to PGND with 4.7µF directly at
the package pins.
The 2.5V reference (REF) is accurate to ±2% over tem-
perature, making REF useful as a precision system ref-
erence. Bypass REF to GND with 1µF minimum. REF
can supply up to 5mA for external loads. (Bypass REF
with a minimum 1µF/mA reference load current.)
However, if extremely accurate specifications for both
the main output voltages and REF are essential, avoid
loading REF more than 100µA. Loading REF reduces
the main output voltage slightly, because of the refer-
ence load-regulation error.
When the 5V main output voltage is above 4.5V, an
internal P-channel MOSFET switch connects CSL5 to
VL, while simultaneously shutting down the VL linear
regulator. This action bootstraps the IC, powering the
internal circuitry from the output voltage, rather than
through a linear regulator from the battery.
Bootstrapping reduces power dissipation due to gate
charge and quiescent losses by providing that power
from a 90%-efficient switch-mode source, rather than
from a much less efficient linear regulator.
Boost High-Side Gate-Drive Supply
(BST3 and BST5)
Gate-drive voltage for the high-side N-channel switches
is generated by a flying-capacitor boost circuit
(Figure 2). The capacitor between BST_ and LX_ is
alternately charged from the VL supply and placed par-
allel to the high-side MOSFET’s gate-source terminals.
On start-up, the synchronous rectifier (low-side
MOSFET) forces LX_ to 0V and charges the boost
capacitors to 5V. On the second half-cycle, the SMPS
turns on the high-side MOSFET by closing an internal
switch between BST_ and DH_. This provides the nec-
essary enhancement voltage to turn on the high-side
switch, an action that “boosts” the 5V gate-drive signal
above the battery voltage.
Ringing at the high-side MOSFET gate (DH3 and DH5)
in discontinuous-conduction mode (light loads) is a nat-
ural operating condition. It is caused by residual ener-
gy in the tank circuit, formed by the inductor and stray
capacitance at the switching node, LX. The gate-drive
negative rail is referred to LX, so any ringing there is
directly coupled to the gate-drive output.
Current-Limiting and Current-Sense
Inputs (CSH and CSL)
The current-limit circuit resets the main PWM latch and
turns off the high-side MOSFET switch whenever the
voltage difference between CSH and CSL exceeds
100mV. This limiting is effective for both current flow
directions, putting the threshold limit at ±100mV. The
tolerance on the positive current limit is ±20%, so the
external low-value sense resistor (R1) must be sized for
80mV/IPEAK, where IPEAK is the required peak inductor
current to support the full load current, while compo-
nents must be designed to withstand continuous cur-
rent stresses of 120mV/R1.
For breadboarding or for very-high-current applications,
it may be useful to wire the current-sense inputs with a
twisted pair, rather than PC traces. (This twisted pair
needn’t be anything special; two pieces of wire-wrap
wire twisted together are sufficient.) This reduces the
possible noise picked up at CSH_ and CSL_, which can
cause unstable switching and reduced output current.
The CSL5 input also serves as the IC’s bootstrap sup-
ply input. Whenever VCSL5 > 4.5V, an internal switch
connects CSL5 to VL.
Oscillator Frequency and
Synchronization (SYNC)
The SYNC input controls the oscillator frequency. Low
selects 200kHz; high selects 300kHz. SYNC can also
be used to synchronize with an external 5V CMOS or
TTL clock generator. SYNC has a guaranteed 240kHz
to 350kHz capture range. A high-to-low transition on
SYNC initiates a new cycle.
300kHz operation optimizes the application circuit for
component size and cost. 200kHz operation provides
increased efficiency, lower dropout, and improved
load-transient response at low input-output voltage dif-
ferences (see Low-Voltage Operation section).
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 15
Table 4. Operating Modes
SEQ RUN/ON3 DESCRIPTION
XLow XAll circuit blocks turned off. Supply current = 4µA.
SHDN TIME/ON5
X
MODE
Shutdown
Low StandbyLowHigh Ref Both SMPSs off. Supply current = 30µA.
Low RunHigh
High RunLowHigh Ref 5V SMPS enabled/3.3V off
High Ref 3.3V SMPS enabled/5V off
High RunHigh
Timing capacitor StandbyLowHigh GND Both SMPSs off. Supply current = 30µA.
Timing capacitor RunHigh
Timing capacitor StandbyLowHigh VL Both SMPSs off. Supply current = 30µA.
High
High Ref Both SMPSs enabled
GND Both SMPSs enabled. 5V enabled before 3.3V.
Timing capacitor RunHighHigh VL Both SMPSs enabled. 3.3V enabled before 5V.
X = Don’t Care
Shutdown Mode
Holding SHDN low puts the IC into its 4µA shutdown
mode. SHDN is logic input with a threshold of about 1V
(the VTH of an internal N-channel MOSFET). For auto-
matic start-up, bypass SHDN to GND with a 0.01µF
capacitor and connect it to V+ through a 220kΩresistor.
Power-Up Sequencing
and ON/
OFF
Controls
Start-up is controlled by RUN/ON3 and TIME/ON5 in
conjunction with SEQ. With SEQ tied to REF, the two
control inputs act as separate ON/OFF controls for
each supply. With SEQ tied to VL or GND, RUN/ON3
becomes the master ON/OFF control input and
TIME/ON5 becomes a timing pin, with the delay
between the two supplies determined by an external
capacitor. The delay is approximately 800µs/nF. The
+3.3V supply powers-up first if SEQ is tied to VL, and
the +5V supply is first if SEQ is tied to GND. When driv-
ing TIME/ON5 as a control input with external logic,
always place a resistor (>1kΩ) in series with the input.
This prevents possible crowbar current due to the inter-
nal discharge pull-down transistor, which turns on in
standby mode and momentarily at the first power-up or
in shutdown mode.
RESET
Power-Good Voltage Monitor
The power-good monitor generates a system RESET sig-
nal. At first power-up, RESET is held low until both the
3.3V and 5V SMPS outputs are in regulation. At this point,
an internal timer begins counting oscillator pulses, and
RESET continues to be held low until 32,000 cycles have
elapsed. After this timeout period (107ms at 300kHz or
160ms at 200kHz), RESET is actively pulled up to VL. If
SEQ is tied to REF (for separate ON3/ON5 controls), only
the 3.3V SMPS is monitored—the 5V SMPS is ignored.
Output Undervoltage Shutdown Protection
(MAX1630/MAX1631/MAX1632)
The output undervoltage lockout circuit is similar to
foldback current limiting, but employs a timer rather
than a variable current limit. Each SMPS has an under-
voltage protection circuit that is activated 6144 clock
cycles after the SMPS is enabled. If either SMPS output
is under 70% of the nominal value, both SMPSs are
latched off and their outputs are clamped to ground by
the synchronous rectifier MOSFETs (see Output
Overvoltage Protection section). They won’t restart until
SHDN or RUN/ON3 is toggled, or until V+ power is
cycled below 1V. Note that undervoltage protection can
make prototype troubleshooting difficult, since you
have only 20ms or 30ms to figure out what might be
wrong with the circuit before both SMPSs are latched
off. In extreme cases, it may be useful to substitute the
MAX1633/MAX1634/MAX1635 into the prototype
breadboard until the prototype is working properly.
Output Overvoltage Protection
(MAX1630/MAX1631/MAX1632)
Both SMPS outputs are monitored for overvoltage. If
either output is more than 7% above the nominal regu-
lation point, both low-side gate drivers (DL_) are
latched high until SHDN or RUN/ON3 is toggled, or until
V+ power is cycled below 1V. This action turns on the
synchronous rectifiers with 100% duty, in turn rapidly
discharging the output capacitors and forcing both
SMPS outputs to ground. The DL outputs are also kept
high whenever the corresponding SMPS is disabled,
and in shutdown if VL is sustained.
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
16 ______________________________________________________________________________________
Discharging the output capacitor through the main
inductor causes the output to momentarily go below
GND. Clamp this negative pulse with a back-biased 1A
Schottky diode across the output capacitor (Figure 1).
To ensure overvoltage protection on initial power-up,
connect signal diodes from both output voltages to VL
(cathodes to VL) to eliminate the VL power-up delay.
This circuitry protects the load from accidental overvolt-
age caused by a short-circuit across the high-side
power MOSFETs. This scheme relies on the presence
of a fuse, in series with the battery, which is blown by
the resulting crowbar current. Note that the overvoltage
circuitry will interfere with external keep-alive supplies
that hold up the outputs (such as lithium backup or hot-
swap power supplies); in such cases, the MAX1633,
MAX1634, or MAX1635 should be used.
Low-Noise Operation (PWM Mode)
PWM mode (SKIP = high) minimizes RF and audio
interference in noise-sensitive applications (such as hi-
fi multimedia-equipped systems), cellular phones, RF
communicating computers, and electromagnetic pen-
entry systems. See the summary of operating modes in
Table 2. SKIP can be driven from an external logic
signal.
Interference due to switching noise is reduced in PWM
mode by ensuring a constant switching frequency, thus
concentrating the emissions at a known frequency out-
side the system audio or IF bands. Choose an oscillator
frequency for which switching frequency harmonics
don’t overlap a sensitive frequency band. If necessary,
synchronize the oscillator to a tight-tolerance external
clock generator. To extend the output-voltage-regula-
tion range, constant operating frequency is not main-
tained under overload or dropout conditions (see
Overload and Dropout Operation section.)
PWM mode (SKIP = high) forces two changes upon the
PWM controllers. First, it disables the minimum-current
comparator, ensuring fixed-frequency operation.
Second, it changes the detection threshold for reverse-
current limit from 0mV to -100mV, allowing the inductor
current to reverse at light loads. This results in fixed-
frequency operation and continuous inductor-current
flow. This eliminates discontinuous-mode inductor ring-
ing and improves cross regulation of transformer-
coupled multiple-output supplies, particularly in circuits
that don’t use additional secondary regulation via
SECFB or VDD.
In most applications, tie SKIP to GND to minimize qui-
escent supply current. VL supply current with SKIP high
is typically 20mA, depending on external MOSFET gate
capacitance and switching losses.
Internal Digital Soft-Start Circuit
Soft-start allows a gradual increase of the internal cur-
rent-limit level at start-up to reduce input surge currents.
Both SMPSs contain internal digital soft-start circuits,
each controlled by a counter, a digital-to-analog con-
verter (DAC), and a current-limit comparator. In shut-
down or standby mode, the soft-start counter is reset to
zero. When an SMPS is enabled, its counter starts
counting oscillator pulses, and the DAC begins incre-
menting the comparison voltage applied to the current-
limit comparator. The DAC output increases from 0mV to
100mV in five equal steps as the count increases to 512
clocks. As a result, the main output capacitor charges
up relatively slowly. The exact time of the output rise
depends on output capacitance and load current, and
is typically 1ms with a 300kHz oscillator.
Dropout Operation
Dropout (low input-output differential operation) is
enhanced by stretching the clock pulse width to
increase the maximum duty factor. The algorithm fol-
lows: If the output voltage (VOUT) drops out of regula-
tion without the current limit having been reached, the
SMPS skips an off-time period (extending the on-time).
At the end of the cycle, if the output is still out of regula-
tion, the SMPS skips another off-time period. This
action can continue until three off-time periods are
skipped, effectively dividing the clock frequency by as
much as four.
The typical PWM minimum off-time is 300ns, regardless
of the operating frequency. Lowering the operating fre-
quency raises the maximum duty factor above 98%.
Adjustable-Output Feedback
(Dual Mode FB)
Fixed, preset output voltages are selected when FB_ is
connected to ground. Adjusting the main output volt-
age with external resistors is simple for any of the
MAX1630 family ICs, through resistor dividers connect-
ed to FB3 and FB5 (Figure 2). Calculate the output volt-
age with the following formula:
VOUT = VREF (1 + R1 / R2)
where VREF = 2.5V nominal.
The nominal output should be set approximately 1% or
2% high to make up for the MAX1630’s -2% typical
load-regulation error. For example, if designing for a
3.0V output, use a resistor ratio that results in a nominal
output voltage of 3.05V. This slight offsetting gives the
best possible accuracy. Recommended normal values
for R2 range from 5kΩto 100kΩ. To achieve a 2.5V
nominal output, simply connect FB_ directly to CSL_.
Remote output-voltage sensing, while not possible in
fixed-output mode due to the combined nature of the
voltage-sense and current-sense inputs (CSL3 and
CSL5), is easy to do in adjustable mode by using the top
of the external resistor divider as the remote sense point.
When using adjustable mode, it is a good idea to
always set the “3.3V output” to a lower voltage than the
“5V output.” The 3.3V output must always be less than
VL, so that the voltage on CSH3 and CSL3 is within the
common-mode range of the current-sense inputs. While
VL is nominally 5V, it can be as low as 4.7V when lin-
early regulating, and as low as 4.2V when automatically
bootstrapped to CSH5.
Secondary Feedback Regulation Loop
(SECFB or VDD)
A flyback-winding control loop regulates a secondary
winding output, improving cross-regulation when the
primary output is lightly loaded or when there is a low
input-output differential voltage. If VDD or SECFB falls
below its regulation threshold, the low-side switch is
turned on for an extra 1µs. This reverses the inductor
(primary) current, pulling current from the output filter
capacitor and causing the flyback transformer to oper-
ate in forward mode. The low impedance presented by
the transformer secondary in forward mode dumps cur-
rent into the secondary output, charging up the sec-
ondary capacitor and bringing VDD or SECFB back into
regulation. The secondary feedback loop does not
improve secondary output accuracy in normal flyback
mode, where the main (primary) output is heavily
loaded. In this condition, secondary output accuracy is
determined by the secondary rectifier drop, transformer
turns ratio, and accuracy of the main output voltage. A
linear post-regulator may still be needed to meet strict
output-accuracy specifications.
Devices with a 12OUT linear regulator have a VDD pin
that regulates at a fixed 13.5V, set by an internal resis-
tor divider. The MAX1631/MAX1634 have an adjustable
secondary output voltage set by an external resistor
divider on SECFB (Figure 5). Ordinarily, the secondary
regulation point is set 5% to 10% below the voltage nor-
mally produced by the flyback effect. For example, if
the output voltage as determined by turns ratio is 15V,
set the feedback resistor ratio to produce 13.5V.
Otherwise, the SECFB one-shot might be triggered
unintentionally, unnecessarily increasing supply current
and output noise.
12V Linear Regulator Output
(MAX1630/MAX1632/MAX1633/MAX1635)
The MAX1630/MAX1632/MAX1633/MAX1635 include a
12V linear regulator output capable of delivering 120mA
of output current. Typically, greater current is available
at the expense of output accuracy. If an accurate output
of more than 120mA is needed, an external pass tran-
MAX1631
MAX1634
POSITIVE
SECONDARY
OUTPUT
MAIN
OUTPUT
DH_
V+
SECFB
2.5V REF
R2
R1
1-SHOT
TRIG
DL_
WHERE VREF (NOMINAL) = 2.5V+VTRIP = VREF (1 + –––)
R1
R2
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 17
Figure 5. Adjusting the Secondary Output Voltage with SECFB
MAX1630
MAX1632
MAX1633
MAX1635
VDD OUTPUT
+12V OUTPUT
200mA
MAIN
OUTPUT
2N3906
0.1μF
0.1μF
0.1μF
2.2μF
10μF
10Ω
V+
VDD
12OUT
DH_
DL_
Figure 6. Increased 12V Linear Regulator Output Current
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
18 ______________________________________________________________________________________
Kool-Mu is a registered trademark of Magnetics Div., Spang & Co.
sistor can be added. Figure 6’s circuit delivers more
than 200mA. Total output current is constrained by the
V+ input voltage and the transformer primary load (see
Maximum 15V VDD Output Current vs. Supply Voltage
graphs in the Typical Operating Characteristics).
__________________Design Procedure
The three predesigned 3V/5V standard application cir-
cuits (Figure 1 and Table 1) contain ready-to-use solu-
tions for common application needs. Also, two standard
flyback transformer circuits support the 12OUT linear
regulator in the Applications Information section. Use
the following design procedure to optimize these basic
schematics for different voltage or current require-
ments. But before beginning a design, firmly establish
the following:
Maximum input (battery) voltage, VIN(MAX). This
value should include the worst-case conditions, such
as no-load operation when a battery charger or AC
adapter is connected but no battery is installed.
VIN(MAX) must not exceed 30V.
Minimum input (battery) voltage, VIN(MIN). This
should be taken at full load under the lowest battery
conditions. If VIN(MIN) is less than 4.2V, use an external
circuit to externally hold VL above the VL undervoltage
lockout threshold. If the minimum input-output differ-
ence is less than 1.5V, the filter capacitance required to
maintain good AC load regulation increases (see Low-
Voltage Operation section).
Inductor Value
The exact inductor value isn’t critical and can be freely
adjusted to make trade-offs between size, cost, and
efficiency. Lower inductor values minimize size and
cost, but reduce efficiency due to higher peak-current
levels. The smallest inductor is achieved by lowering
the inductance until the circuit operates at the border
between continuous and discontinuous mode. Further
reducing the inductor value below this crossover point
results in discontinuous-conduction operation even at
full load. This helps lower output filter capacitance
requirements, but efficiency suffers due to high I2R
losses. On the other hand, higher inductor values mean
greater efficiency, but resistive losses due to extra wire
turns will eventually exceed the benefit gained from
lower peak-current levels. Also, high inductor values
can affect load-transient response (see the VSAG equa-
tion in the Low-Voltage Operation section). The equa-
tions that follow are for continuous-conduction
operation, since the MAX1630 family is intended mainly
for high-efficiency, battery-powered applications. See
Appendix A in Maxim’s Battery Management and DC-
DC Converter Circuit Collection for crossover-point and
discontinuous-mode equations. Discontinuous conduc-
tion doesn’t affect normal Idle Mode operation.
Three key inductor parameters must be specified:
inductance value (L), peak current (IPEAK), and DC
resistance (RDC). The following equation includes a
constant, LIR, which is the ratio of inductor peak-to-
peak AC current to DC load current. A higher LIR value
allows smaller inductance, but results in higher losses
and higher ripple. A good compromise between size
and losses is found at a 30% ripple-current to load-
current ratio (LIR = 0.3), which corresponds to a peak
inductor current 1.15 times higher than the DC load
current.
where: f = switching frequency, normally 200kHz or
300kHz
IOUT = maximum DC load current
LIR = ratio of AC to DC inductor current, typi-
cally 0.3; should be selected for >0.15
The nominal peak inductor current at full load is 1.15 x
IOUT if the above equation is used; otherwise, the peak
current can be calculated by:
The inductor’s DC resistance should be low enough that
RDC x IPEAK < 100mV, as it is a key parameter for effi-
ciency performance. If a standard off-the-shelf inductor
is not available, choose a core with an LI2rating greater
than L x IPEAK2 and wind it with the largest-diameter
wire that fits the winding area. For 300kHz applications,
ferrite core material is strongly preferred; for 200kHz
applications, Kool-Mu®(aluminum alloy) or even pow-
dered iron is acceptable. If light-load efficiency is unim-
portant (in desktop PC applications, for example), then
low-permeability iron-powder cores, such as the
Micrometals type found in Pulse Engineering’s 2.1µH
PE-53680, may be acceptable even at 300kHz. For
high-current applications, shielded-core geometries,
such as toroidal or pot core, help keep noise, EMI, and
switching-waveform jitter low.
I= I+
V (V -V
2 x f x L x V
PEAK LOAD
OUT IN(MAX) OUT
IN(MAX)
)
L = VV - V
V x f x I x LIR
OUT IN(MAX) OUT
IN(MAX) OUT
()
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 19
Current-Sense Resistor Value
The current-sense resistor value is calculated according
to the worst-case-low current-limit threshold voltage
(from the Electrical Characteristics table) and the peak
inductor current:
Use IPEAK from the second equation in the Inductor
Value section
Use the calculated value of RSENSE to size the MOSFET
switches and specify inductor saturation-current ratings
according to the worst-case high-current-limit threshold
voltage:
Low-inductance resistors, such as surface-mount
metal-film, are recommended.
Input Capacitor Value
Connect low-ESR bulk capacitors and small ceramic
capacitors (0.1µF) directly to the drains on the high-
side MOSFETs. The bulk input filter capacitor is usually
selected according to input ripple current requirements
and voltage rating, rather than capacitor value.
Electrolytic capacitors with low enough effective series
resistance (ESR) to meet the ripple current requirement
invariably have sufficient capacitance values.
Aluminum electrolytic capacitors, such as Sanyo
OS-CON or Nichicon PL, are superior to tantalum
types, which carry the risk of power-up surge-current
failure, especially when connecting to robust AC
adapters or low-impedance batteries. RMS input ripple
current (IRMS) is determined by the input voltage and
load current, with the worst case occurring at VIN = 2 x
VOUT:
Bypassing V+
Bypass the V+ input with a 4.7µF tantalum capacitor
paralleled with a 0.1µF ceramic capacitor, close to the
IC. A 10Ωseries resistor to VIN is also recommended.
Bypassing VL
Bypass the VL output with a 4.7µF tantalum capacitor
paralleled with a 0.1µF ceramic capacitor, close to the
device.
Output Filter Capacitor Value
The output filter capacitor values are generally deter-
mined by the ESR and voltage rating requirements, rather
than actual capacitance requirements for loop stability. In
other words, the low-ESR electrolytic capacitor that meets
the ESR requirement usually has more output capaci-
tance than is required for AC stability. Use only special-
ized low-ESR capacitors intended for switching-regulator
applications, such as AVX TPS, Sprague 595D, Sanyo
OS-CON, or Nichicon PL series. To ensure stability, the
capacitor must meet both minimum capacitance and
maximum ESR values as given in the following equations:
(can be multiplied by 1.5; see text below)
These equations are worst case, with 45 degrees of
phase margin to ensure jitter-free, fixed-frequency
operation and provide a nicely damped output
response for zero to full-load step changes. Some cost-
conscious designers may wish to bend these rules with
less-expensive capacitors, particularly if the load lacks
large step changes. This practice is tolerable if some
bench testing over temperature is done to verify
acceptable noise and transient response.
No well-defined boundary exists between stable and
unstable operation. As phase margin is reduced, the
first symptom is a bit of timing jitter, which shows up as
blurred edges in the switching waveforms where the
scope won’t quite sync up. Technically speaking, this
jitter (usually harmless) is unstable operation, since the
duty factor varies slightly. As capacitors with higher
ESRs are used, the jitter becomes more pronounced,
and the load-transient output voltage waveform starts
looking ragged at the edges. Eventually, the load-tran-
sient waveform has enough ringing on it that the peak
noise levels exceed the allowable output voltage toler-
ance. Note that even with zero phase margin and gross
instability present, the output voltage noise never gets
much worse than IPEAK x RESR (under constant loads).
Designers of RF communicators or other noise-sensi-
tive analog equipment should be conservative and stay
within the guidelines. Designers of notebook computers
and similar commercial-temperature-range digital
C>
V (1 + V / V )
V x R x f
<
OUT
REF OUT IN(MIN)
OUT SENSE
RRxV
V
ESR SENSE OUT
REF
I = I x V(V-V)
V
Therefore, when V is 2 x V :
I I
2
RMS LOAD OUT IN OUT
IN
IN OUT
RMS LOAD
=
I = 120mV
R
PEAK(MAX) SENSE
R = 80mV
I
SENSE PEAK
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
20 ______________________________________________________________________________________
systems can multiply the RESR value by a factor of 1.5
without hurting stability or transient response.
The output voltage ripple is usually dominated by the
filter capacitor’s ESR, and can be approximated as
IRIPPLE x RESR. There is also a capacitive term, so the
full equation for ripple in continuous-conduction mode
is VNOISE (p-p) = IRIPPLE x [RESR + 1/(2 x πx f x
COUT)]. In Idle Mode, the inductor current becomes
discontinuous, with high peaks and widely spaced
pulses, so the noise can actually be higher at light load
(compared to full load). In Idle Mode, calculate the out-
put ripple as follows:
Transformer Design
(for Auxiliary Outputs Only)
Buck-plus-flyback applications, sometimes called “cou-
pled-inductor” topologies, need a transformer to gener-
ate multiple output voltages. Performing the basic
electrical design is a simple task of calculating turns
ratios and adding the power delivered to the secondary
to calculate the current-sense resistor and primary
inductance. However, extremes of low input-output dif-
ferentials, widely different output loading levels, and
high turns ratios can complicate the design due to par-
asitic transformer parameters such as interwinding
capacitance, secondary resistance, and leakage
inductance. For examples of what is possible with real-
world transformers, see the Maximum Secondary
Current vs. Input Voltage graph in the Typical
Operating Characteristics section.
Power from the main and secondary outputs is com-
bined to get an equivalent current referred to the main
output voltage (see the Inductor Value section for para-
meter definitions). Set the current-sense resistor resis-
tor value at 80mV / ITOTAL.
PTOTAL = The sum of the output power from all outputs
ITOTAL = PTOTAL / VOUT = The equivalent output cur-
rent referred to VOUT
where: VSEC = the minimum required rectified sec-
ondary output voltage
VFWD = the forward drop across the secondary
rectifier
VOUT(MIN) = the minimum value of the main
output voltage (from the Electrical
Characteristics)
VRECT = the on-state voltage drop across the
synchronous rectifier MOSFET
VSENSE = the voltage drop across the sense
resistor
In positive-output applications, the transformer sec-
ondary return is often referred to the main output volt-
age, rather than to ground, to reduce the needed turns
ratio. In this case, the main output voltage must first be
subtracted from the secondary voltage to obtain VSEC.
Selecting Other Components
MOSFET Switches
The high-current N-channel MOSFETs must be logic-level
types with guaranteed on-resistance specifications at
VGS = 4.5V. Lower gate threshold specifications are bet-
ter (i.e., 2V max rather than 3V max). Drain-source break-
down voltage ratings must at least equal the maximum
input voltage, preferably with a 20% derating factor. The
best MOSFETs will have the lowest on-resistance per
nanocoulomb of gate charge. Multiplying RDS(ON) x QG
provides a good figure for comparing various MOSFETs.
Newer MOSFET process technologies with dense cell
structures generally perform best. The internal gate
drivers tolerate >100nC total gate charge, but 70nC is a
more practical upper limit to maintain best switching
times.
In high-current applications, MOSFET package power
dissipation often becomes a dominant design factor.
I2R power losses are the greatest heat contributor for
both high-side and low-side MOSFETs. I2R losses are
distributed between Q1 and Q2 according to duty fac-
tor (see the following equations). Generally, switching
losses affect only the upper MOSFET, since the
Schottky rectifier clamps the switching node in most
cases before the synchronous rectifier turns on. Gate-
charge losses are dissipated by the driver and don’t
heat the MOSFET. Calculate the temperature rise
according to package thermal-resistance specifications
to ensure that both MOSFETs are within their maximum
junction temperature at high ambient temperature. The
worst-case dissipation for the high-side MOSFET
occurs at both extremes of input voltage, and the
worst-case dissipation for the low-side MOSFET occurs
at maximum input voltage.
L(primary) = V(V -V)
V x f x I x LIR
Turns Ratio N = V + V
V+V+V
OUT IN(MAX) OUT
IN(MAX) TOTAL
SEC FWD
OUT(MIN) RECT SENSE
V = 0.02 x R
R
0.0003 x Lx 1 / V 1 / (V - V )
(R ) x C
NOISE(p-p) ESR
SENSE
OUT IN OUT
SENSE 2OUT
+
+
[]
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 21
where: on-state voltage drop VQ_ = ILOAD x RDS(ON)
CRSS = MOSFET reverse transfer capacitance
IGATE =DH driver peak output current capabil-
ity (1A typical)
20ns = DH driver inherent rise/fall time
Under output short-circuit, the MAX1633/MAX1634/
MAX1635’s synchronous rectifier MOSFET suffers extra
stress because its duty factor can increase to greater
than 0.9. It may need to be oversized to tolerate a con-
tinuous DC short circuit. During short circuit, the
MAX1630/MAX1631/MAX1632’s output undervoltage
shutdown protects the synchronous rectifier under out-
put short-circuit conditions.
To reduce EMI, add a 0.1µF ceramic capacitor from the
high-side switch drain to the low-side switch source.
Rectifier Clamp Diode
The rectifier is a clamp across the low-side MOSFET
that catches the negative inductor swing during the
60ns dead time between turning one MOSFET off and
each low-side MOSFET on. The latest generations of
MOSFETs incorporate a high-speed silicon body diode,
which serves as an adequate clamp diode if efficiency
is not of primary importance. A Schottky diode can be
placed in parallel with the body diode to reduce the for-
ward voltage drop, typically improving efficiency 1% to
2%. Use a diode with a DC current rating equal to one-
third of the load current; for example, use an MBR0530
(500mA-rated) type for loads up to 1.5A, a 1N5819 type
for loads up to 3A, or a 1N5822 type for loads up to
10A. The rectifier’s rated reverse breakdown voltage
must be at least equal to the maximum input voltage,
preferably with a 20% derating factor.
Boost-Supply Diode D2
A signal diode such as a 1N4148 works well in most
applications. If the input voltage can go below +6V, use
a small (20mA) Schottky diode for slightly improved
efficiency and dropout characteristics. Don’t use large
power diodes, such as 1N5817 or 1N4001, since high
junction capacitance can pump up VL to excessive
voltages.
Rectifier Diode D3
(Transformer Secondary Diode)
The secondary diode in coupled-inductor applications
must withstand flyback voltages greater than 60V,
which usually rules out most Schottky rectifiers.
Common silicon rectifiers, such as the 1N4001, are also
prohibited because they are too slow. This often makes
fast silicon rectifiers such as the MURS120 the only
choice. The flyback voltage across the rectifier is relat-
ed to the VIN - VOUT difference, according to the trans-
former turns ratio:
where: N = the transformer turns ratio SEC/PRI
VSEC = the maximum secondary DC output
voltage
VOUT = the primary (main) output voltage
Subtract the main output voltage (VOUT) from VFLYBACK
in this equation if the secondary winding is returned to
VOUT and not to ground. The diode reverse breakdown
rating must also accommodate any ringing due to leak-
age inductance. D3’s current rating should be at least
twice the DC load current on the secondary output.
Low-Voltage Operation
Low input voltages and low input-output differential
voltages each require extra care in their design. Low
absolute input voltages can cause the VL linear regula-
tor to enter dropout and eventually shut itself off. Low
input voltages relative to the output (low VIN-VOUT dif-
ferential) can cause bad load regulation in multi-output
flyback applications (see the design equations in the
Transformer Design section). Also, low VIN-VOUT differ-
entials can also cause the output voltage to sag when
the load current changes abruptly. The amplitude of the
sag is a function of inductor value and maximum duty
factor (an Electrical Characteristics parameter, 98%
guaranteed over temperature at f = 200kHz), as follows:
The cure for low-voltage sag is to increase the output
capacitor’s value. For example, at VIN = +5.5V, VOUT =
+5V, L = 10µH, f = 200kHz, ISTEP = 3A, a total capaci-
tance of 660µF keeps the sag less than 200mV. Note
that only the capacitance requirement increases, and
the ESR requirements don’t change. Therefore, the
added capacitance can be supplied by a low-cost bulk
capacitor in parallel with the normal low-ESR capacitor.
V= (I ) x L
2 x C x (V x D - V )
SAG STEP 2
OUT IN(MAX) MAX OUT
V = V + (V - V ) x N
FLYBACK SEC IN OUT
PD(upper FET) = (I ) x R x DUTY
+ V x I x f x V x C
I20ns
PD(lower FET) = (I ) x R x (1 - DUTY)
DUTY = (V + V ) / (V - V )
LOAD 2DS(ON)
IN LOAD IN RSS
GATE
LOAD 2DS(ON)
OUT Q2 IN Q1
+
⎛
⎝
⎜
⎞
⎠
⎟
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
22 ______________________________________________________________________________________
Table 5. Low-Voltage Troubleshooting Chart
SYMPTOM
Sag or droop in VOUT under
step-load change
CONDITION
Low VIN-VOUT
differential, <1.5V
ROOT CAUSE
Limited inductor-current
slew rate per cycle.
SOLUTION
Increase bulk output capacitance
per formula (see Low-Voltage
Operation section). Reduce inductor
value.
Low VIN-VOUT
differential, <1V
Maximum duty-cycle limits
exceeded.
Dropout voltage is too high
(VOUT follows VIN as VIN
decreases)
Reduce operation to 200kHz.
Reduce MOSFET on-resistance and
coil DCR.
Low VIN-VOUT
differential,
VIN < 1.3 x VOUT (main)
Not enough duty cycle left
to initiate forward-mode
operation. Small AC current
in primary can’t store ener-
gy for flyback operation.
Low VIN-VOUT
differential, <0.5V
Secondary output won’t
support a load
Reduce operation to 200kHz.
Reduce secondary impedances;
use a Schottky diode, if possible.
Stack secondary winding on the
main output.
Normal function of internal
low-dropout circuitry.
Unstable—jitters between
different duty factors and
frequencies
Increase the minimum input voltage
or ignore.
Low input voltage, <4.5V VL output is so low that it
hits the VL UVLO threshold.
Low input voltage, <5V
Won’t start under load or
quits before battery is
completely dead
Supply VL from an external source
other than VIN, such as the system
+5V supply.
VL linear regulator is going
into dropout and isn’t provid-
ing good gate-drive levels.
Poor efficiency
Use a small 20mA Schottky diode
for boost diode D2. Supply VL from
an external source.
________________Applications Information
Heavy-Load Efficiency Considerations
The major efficiency-loss mechanisms under loads are,
in the usual order of importance:
•P(I2R) = I2R losses
•P(tran) = transition losses
•P(gate) = gate-charge losses
•P(diode) = diode-conduction losses
•P(cap) = capacitor ESR losses
•P(IC) = losses due to the IC’s operating supply
supply current
Inductor core losses are fairly low at heavy loads
because the inductor’s AC current component is small.
Therefore, they aren’t accounted for in this analysis.
Ferrite cores are preferred, especially at 300kHz, but
powdered cores, such as Kool-Mu, can work well.
where RDC is the DC resistance of the coil, RDS(ON) is
the MOSFET on-resistance, and RSENSE is the current-
sense resistor value. The RDS(ON) term assumes identi-
cal MOSFETs for the high-side and low-side switches,
because they time-share the inductor current. If the
MOSFETs aren’t identical, their losses can be estimat-
ed by averaging the losses according to duty factor.
where CRSS is the reverse transfer capacitance of the
high-side MOSFET (a data-sheet parameter), IGATE is the
DH gate-driver peak output current (1.5A typical), and
20ns is the rise/fall time of the DH driver (20ns typical).
P(gate) = qG x f x VL
where VL is the internal-logic-supply voltage (+5V), and qG
is the sum of the gate-charge values for low-side and high-
side switches. For matched MOSFETs, qG is twice the
data-sheet value of an individual MOSFET. If VOUT is set to
less than 4.5V, replace VL in this equation with VBATT. In
this case, efficiency can be improved by connecting VL to
an efficient 5V source, such as the system +5V supply.
P(diode) = diode- conduction losses
= I x V x t x f
LOAD FWD D
PD(tran) = transition loss = V x I x f x 3
2 x
(V x C / I ) + 20ns
IN LOAD
IN RSS GATE
[]
Efficiency = P / P x 100%
= P / (P + P ) x 100%
P = P(I R) + P(tran) + P(gate) +
P(diode) + P(cap) + P(IC)
P = (I R) = (I ) x (R + R + R )
OUT IN
OUT OUT TOTAL
TOTAL 2
2LOAD 2DC DS(ON) SENSE
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 23
where tDis the diode-conduction time (120ns typical)
and VFWD is the forward voltage of the diode.
This power is dissipated in the MOSFET body diode if
no external Schottky diode is used.
where IRMS is the input ripple current as calculated in the
Design Procedure and Input Capacitor Value sections.
Light-Load Efficiency Considerations
Under light loads, the PWM operates in discontinuous
mode, where the inductor current discharges to zero at
some point during the switching cycle. This makes the
inductor current’s AC component high compared to the
load current, which increases core losses and I2R loss-
es in the output filter capacitors. For best light-load effi-
ciency, use MOSFETs with moderate gate-charge
levels, and use ferrite, MPP, or other low-loss core
material. Avoid powdered-iron cores; even Kool-Mu
(aluminum alloy) is not as good as ferrite.
PC Board Layout Considerations
Good PC board layout is required in order to achieve
specified noise, efficiency, and stability performance.
The PC board layout artist must be given explicit
instructions, preferably a pencil sketch showing the
placement of power-switching components and high-
current routing. See the PC board layout in the
MAX1630 Evaluation Kit manual for examples. A
ground plane is essential for optimum performance. In
most applications, the circuit will be located on a multi-
layer board, and full use of the four or more copper lay-
ers is recommended. Use the top layer for high-current
connections, the bottom layer for quiet connections
(REF, SS, GND), and the inner layers for an uninterrupt-
ed ground plane. Use the following step-by-step guide:
1) Place the high-power components (Figure1, C1, C3,
Q1, Q2, D1, L1, and R1) first, with any grounded
connections adjacent.
Priority 1: Minimize current-sense resistor trace
lengths and ensure accurate current
sensing with Kelvin connections (Figure 7).
Priority 2: Minimize ground trace lengths in the
high-current paths (discussed below).
Priority 3: Minimize other trace lengths in the high-
current paths.
Use >5mm-wide traces
CIN to high-side MOSFET drain: 10mm
max length
Rectifier diode cathode to low-side
MOSFET: 5mm max length
LX node (MOSFETs, rectifier cathode,
inductor): 15mm max length
Ideally, surface-mount power components are butted
up to one another with their ground terminals almost
touching. These high-current grounds are then con-
nected to each other with a wide filled zone of top-layer
copper so they don’t go through vias. The resulting top-
layer “sub-ground-plane” is connected to the normal
inner-layer ground plane at the output ground termi-
nals, which ensures that the IC’s analog ground is
sensing at the supply’s output terminals without interfer-
ence from IR drops and ground noise. Other high-
current paths should also be minimized, but focusing
primarily on short ground and current-sense con-
nections eliminates about 90% of all PC board lay-
out problems (see the PC board layouts in the
MAX1630 Evaluation Kit manual for examples).
2) Place the IC and signal components. Keep the main
switching nodes (LX nodes) away from sensitive
analog components (current-sense traces and REF
capacitor). Place the IC and analog components on
the opposite side of the board from the power-
switching node. Important: the IC must be no far-
ther than 10mm from the current-sense resistors.
Keep the gate-drive traces (DH_, DL_, and BST_)
shorter than 20mm and route them away from CSH_,
CSL_, and REF.
3) Use a single-point star ground where the input
ground trace, power ground (sub-ground-plane),
and normal ground plane meet at the supply’s out-
put ground terminal. Connect both IC ground pins
and all IC bypass capacitors to the normal ground
plane.
P(cap) = input capacitor ESR loss = (I ) x R
RMS 2ESR
MAX1630
SENSE RESISTOR
HIGH CURRENT PATH
Figure 7. Kelvin Connections for the Current-Sense Resistors
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
24 ______________________________________________________________________________________
_______________________________________________________________________________Application Circuits
RESET
FB5
MAX1630
MAX1633
SHDN SYNC
INPUT
+5.2V TO +24V
PGND
SEQ
REF
11
9
15
12
13
14
20
19
17
16 Q3
Q4
L2 R2
C2
18
4
23 22
10Ω
621
POWER-GOOD
7
10 8
5V ON/OFF
SKIP
V+ VL
DL5
LX5
DH5
BST5
2.2μF
0.1μF
0.1μF
0.1μF
1μF
0.1μF
4.7μF
2.7μF
1N5819
4.7μF
12OUT
C3 C4
+12V
AT 120mA
+5V OUTPUT (3A)
+5V
ALWAYS ON
GND
+2.5V REF
3
*
2
1
24
Q1
Q2
T1
1:4
C1
R1
5
0.1μF
0.1μF
1N5819
+3.3V
OUTPUT
(3A)
*
TIME/ON5
RUN/ON3
FB3
28
3V ON/OFF
26
25
27
CSL5
CSH5
CSL3
CSH3
DL3
LX3
DH3
BST3
VDD
ON/OFF
TO +3.3V OUTPUT TO +5V OUTPUT
R1 = R2 = 20mΩ
L2 = 10μH SUMIDA CDRH125-100
T1 = 10μH 1:4 TRANSFORMER
TRANSPOWER TECHNOLOGIES TTI-5902
Q1–Q4 = Si4410DY or IRF7413
C1 = 3 x 220μF 10V SPRAGUE 594D227X0010D2T
C2 = 2 x 220μF 10V SPRAGUE 594D227X0010D2T
C3 = C4 = 2 x 10μF 30V SANYO OS-CON 30SC10M
*VL DIODES AND OUTPUT SCHOTTKY DIODES REQUIRED
FOR THE MAX1630 ONLY (SEE OUTPUT OVERVOLTAGE PROTECTION
AND OUTPUT UNDERVOLTAGE SHUTDOWN PROTECTION SECTIONS).
**
Figure 8. Triple-Output Application for Low-Voltage Batteries (MAX1630/MAX1633)
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 25
_____________________________________________________________Application Circuits (continued)
2.2μF
5
RESET
FB5
MAX1632
MAX1635
PGND
SEQ
REF
11
9
15
12
13
14
20
19
17
16 Q3
Q4
T2
1:2.2
R2
D5
D2
18
POWER-GOOD
7
10 8
5V ON/OFF
SKIP
DL5
LX5
DH5
BST5
VDD
2.2μF
0.1μFC2
0.1μF
1μF
1N5819
+5V OUTPUT (3A)
GND
+2.5V REF
3
*
2
1
24
Q1
D1
Q2
L1
R1 0.1μF
0.1μF
1N5819
+3.3V OUTPUT (3A)
ON/OFF
*
TIME/ON5
RUN/ON3
FB3
28
3V ON/OFF
26
25
27
CSL5
CSH5
CSL3
CSH3
DL3
LX3
DH3
BST3
SHDN SYNC
INPUT
+6.5V TO +28V
4
23 22
10Ω
621
V+ VL
0.1μF
0.1μF
4.7μF
4.7μF
12OUT
C3
C1
C4
TO +3.3V OUTPUT TO +5V OUTPUT
+12V AT 120mA
+5V ALWAYS ON
R1 = R2 = 20mΩ
L1 = 10μH SUMIDA CDRH125-100
T2 = 10μH 1:2.2 TRANSFORMER
TRANSPOWER TECHNOLOGIES TTI-5870
Q1–Q4 = Si4410DY or IRF7413
C1 = 3 x 220μF 10V SPRAGUE 594D227X0010D2T
C2 = 2 x 220μF 10V SPRAGUE 594D227X0010D2T
C3 = C4 = 2 x 10μF 30V SANYO OS-CON 30SC10M
*VL DIODES AND OUTPUT SCHOTTKY DIODES REQUIRED
FOR THE MAX1632 ONLY (SEE OUTPUT OVERVOLTAGE PROTECTION
AND OUTPUT UNDERVOLTAGE SHUTDOWN PROTECTION SECTIONS).
**
Figure 9. Triple-Output Application for High-Voltage Batteries (MAX1632/MAX1635)
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
26 ______________________________________________________________________________________
OPEN
MAX1631
MAX1634
V+ SHDN VLSECFB
INPUT
+6V TO +24V
C3
10Ω
ON/OFF
GND
REF SEQSYNC
1μF
5V ALWAYS ON
Q1
ON/OFF
ON/OFF
0.1μF
0.1μF
4.7μF
4.7μF
0.1μF
Q3
DL3
CSH3
CSL3
FB3
RESET RESET OUTPUT
SKIP
STEER
L1
R1
2.5V OUTPUT
C1 DL5
LX5
DH5
BST5 25
27
26
24
1
2
3
11
10
4
8
28
7
12
13
14
20
19
17
16
18
22 23 5 21
15
69
BST3
DH3
LX3
PGND
CSL5
CSH5
RUN/ON3
TIME/ON5
0Ω
FB5
0.1μF
0.1μF
L2 R2 +3.3V OUTPUT
R1 = R2 = 15mΩ
L1 = L2 = 6.8μH SUMIDA CDRH 127-6R8MC
Q1 = Q4 = Si4410DY or 1RF7413
C1 = C2 = 2X SANYO OS-CON 10 SA220M
C3 = 4X SANYO OS-CON 30SC10M
*VL DIODES AND OUTPUT SCHOTTKY DIODES REQUIRED
FOR THE MAX1631 ONLY (SEE OUTPUT OVERVOLTAGE PROTECTION
AND OUTPUT UNDERVOLTAGE SHUTDOWN PROTECTION SECTIONS).
*
**
OPEN
0Ω
*Q4
1N5819
Q2
1N5819
C2
Figure 10. Dual, 4A, Notebook Computer Power Supply
_____________________________________________________________Application Circuits (continued)
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
______________________________________________________________________________________ 27
________________________________________________________________________________Pin Configurations
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RUN/ON3
DH3
LX3
BST3
DL3
SHDN
SEQ
V+
VL
PGND
DL5
BST5
LX5
DH5
CSH5
CSL5
FB5
RESET
SKIP
REF
GND
TIME/ON5
SYNC
VDD
12OUT
FB3
CSL3
CSH3
SSOP SSOP
MAX1630
MAX1632
MAX1633
MAX1635
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RUN/ON3
DH3
LX3
BST3
DL3
SHDN
SEQ
V+
VL
PGND
DL5
BST5
LX5
DH5
CSH5
CSL5
FB5
RESET
SKIP
REF
GND
TIME/ON5
SYNC
SECFB
STEER
FB3
CSL3
CSH3
TOP VIEW
MAX1631
MAX1634
_______________________________________________________________Selector Guide
MAX1631
MAX1633
MAX1632
MAX1634
MAX1635
DEVICE
None (SECFB input)
12V Linear Regulator
12V Linear Regulator
None (SECFB input)
12V Linear Regulator
AUXILIARY OUTPUT
12V Linear Regulator
Selectable (STEER pin)
Feeds into the 3.3V SMPS
Feeds into the 5V SMPS
Selectable (STEER pin)
Feeds into the 5V SMPS
SECONDARY FEEDBACK
Yes
No
Yes
No
MAX1630
No
OVER/UNDERVOLTAGE
PROTECTION
YesFeeds into the 3.3V SMPS
MAX1630–MAX1635
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
28 ______________________________________________________________________________________
__Ordering Information (continued)
PART TEMP RANGE
PIN-PACKAGE
MAX1631CAI 0°C to +70°C 28 SSOP
MAX1631CAI+ 0°C to +70°C 28 SSOP
MAX1631EAI+ -40°C to +85°C 28 SSOP
MAX1632CAI 0°C to +70°C 28 SSOP
MAX1632CAI+ -40°C to +85°C 28 SSOP
MAX1632EAI+ -40°C to +85°C 28 SSOP
MAX1633CAI 0°C to +70°C 28 SSOP
MAX1633CAI+ 0°C to +70°C 28 SSOP
MAX1633EAI+ -40°C to +85°C 28 SSOP
MAX1634CAI 0°C to +70°C 28 SSOP
MAX1634CAI+ 0°C to +70°C 28 SSOP
MAX1634EAI+ -40°C to +85°C 28 SSOP
MAX1635CAI 0°C to +70°C 28 SSOP
MAX1635CAI+ 0°C to +70°C 28 SSOP
MAX1635EAI+ -40°C to +85°C 28 SSOP
+ Denotes lead-free package.
Multi-Output, Low-Noise Power-Supply
Controllers for Notebook Computers
MAX1630–MAX1635
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 29
© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
SSOP.EPS
PACKAGE OUTLINE, SSOP, 5.3 MM
1
1
21-0056 C
REV.DOCUMENT CONTROL NO.APPROVAL
PROPRIETARY INFORMATION
TITLE:
NOTES:
1. D&E DO NOT INCLUDE MOLD FLASH.
2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006").
3. CONTROLLING DIMENSION: MILLIMETERS.
4. MEETS JEDEC MO150.
5. LEADS TO BE COPLANAR WITHIN 0.10 MM.
7.90
H
L
0∞
0.301
0.025
8∞
0.311
0.037
0∞
7.65
0.63
8∞
0.95
MAX
5.38
MILLIMETERS
B
C
D
E
e
A1
DIM
A
SEE VARIATIONS
0.0256 BSC
0.010
0.004
0.205
0.002
0.015
0.008
0.212
0.008
INCHES
MIN MAX
0.078
0.65 BSC
0.25
0.09
5.20
0.05
0.38
0.20
0.21
MIN
1.73 1.99
MILLIMETERS
6.07
6.07
10.07
8.07
7.07
INCHES
D
D
D
D
D
0.239
0.239
0.397
0.317
0.278
MIN
0.249
0.249
0.407
0.328
0.289
MAX MIN
6.33
6.33
10.33
8.33
7.33
14L
16L
28L
24L
20L
MAX N
A
D
eA1 L
C
HE
N
12
B
0.068
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)