Bulk Metal® Foil Technology
Molded Resistor Networks
2R, 3R, 4R
Vishay Foil Resistors
www.foilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63044
1Revision: 24-Mar-10
Product may not be to scale
Unitized Resistor Networks are comprised of Vishay S102C
elements combined and molded into single units. This
method of making networks yields some important
advantages that should be considered where space is not a
limitation and maximizing performance is important. To begin
with, the leads that emerge from the package go directly to
the resistance element (or an internal PC board), so the
possibility of thermal EMFs is very low. Next, the value range
of the elements is large (1
Ω
to 150 k
Ω
in a single foil
element) and they can be combined for even higher values.
Finally, these elements possess all the good features of
discrete Bulk Metal® Foil resistors, plus the ability to be
further sorted for TCR track and absolute match before
encapsulation. These networks make excellent voltage
dividers, bridges, and attenuators where performance and
stability are important.
APPLICATIONS
•Differential amplifiers
•Gain defining resistors in digital voltmeters
•Ratio arms in bridge circuits
•Fuel metering systems
•Heads up displays
•Fire control systems
•Spacecraft instrumentation
•Naval weapons systems
•Binary Coded Decimal Ladder Networks
•Binary Ladders (A-D, D-A conversion, current and voltage
summing)
•Ratio and Ratio-matching Networks
•Bridge Networks
•Synchro Input and Summing Networks
•Resolver Networks
•Linear and Linear-summing Networks
•Decoder Networks
•Quadrature Bridge Networks
•Resistive Summing Networks
FEATURES
•Resistance range each resistor: 1 Ω to 150 kΩ
•TCR Tracking: to ± 0.5 ppm/°C
•Nominal TCR each resistor: See Figures 1 and 2 in data
sheet “7 Technical Reasons to Specify Bulk Metal® Foil
Resistor Networks.”
•Nominal tolerance ratio matching between resistors:
from ± 0.005 to ± 1 %
•Absolute tolerance each resistor: ± 1.0 %, ± 0.5 %,
± 0.25 %, 0.1 %, ± 0.05 %, ± 0.02 %, ± 0.01 %, ± 0.005 %
•Power rating: 0.25 watts per resistor
NOTES:
1. Typical is a designer's reference that represents 85 % of
production. Most of the DR's shown are maximums. To ensure
that all typical values are maximums a "burn-in" is required.
2. ΔR: absolute resistance change.
3. ΔRatio: change in ratio between resistors within the network
package from before to after the specified test
4. Depending on construction and ratio value
5. Measured < 0.1 ppm/V and within the measurement capability of
the equipment. Voltage coefficient is “essentially zero”
6. 2 ppm when in hermetically sealed package
TABLE 1 - TYPICAL
1)
PERFORMANCE CHARACTERISTICS
Resistance Temp Characteristic (TCR)
TCR Tracking To Reference Element
± 2 ppm/°C nominal
0.1 ppm/°C to 4 ppm/°C
4)
Max Ambient Temp at Rated Wattage
+ 125 °C
Max Ambient Temp at Zero Power
+ 175 °C
Thermal Shock
Δ
R
2)
Δ
Ratio
3)
0.002 %
0.002 %
Low Temperature Operation
Δ
R
Δ
Ratio
0.005 %
0.002 %
Short Time Overload
Δ
R
Δ
Ratio
0.002 %
0.002 %
Terminal Strength
Δ
R
Δ
Ratio
0.001 %
0.001 %
Resistance to Soldering Heat
Δ
R
Δ
Ratio
0.002 %
0.001 %
Moisture Resistance
Δ
R
Δ
Ratio
0.003 %
0.003 %
Shock
Δ
R
Δ
Ratio
0.001 %
0.001 %
Vibration, High Frequency
Δ
R
Δ
Ratio
0.001 %
0.001 %
Life
0.3 W at + 125 °C
0.02 W at + 60 °C
0.05 W at + 25 °C
Δ
R
Δ
Ratio
Δ
R
Δ
Ratio
Δ
R
Δ
Ratio
0.01 %
0.01 %
0.003 %
0.001 %
0.002 %
0.001 %
High Temperature Exposure
Δ
R
Δ
Ratio
0.01 %
0.01 %
Low Temperature Storage
Δ
R
Δ
Ratio
0.002 %
0.002 %
Insulation Resistance
> 500 000 M
Ω
Dielectric Withstanding Voltage
No Change
Voltage Coefficient
5)
Δ
R
Δ
Ratio
< 0.1 ppm/V
5)
< 0.1 ppm/V
5)
Noise N/A
- 40 dB (non-measurable)
Inductance N/A
0.08 µH
Capacitance N/A
0.5 pf
Rise Time N/A
1 ns at 1 k
Ω
Thermal EMF lead to lead N/A
0.04 µV°C
Thermal EMF air circulation N/A
0.02 µV/°C
Thermal EMF power N/A
0.1 µV for 20 mW
Shelf Life
Δ
R
6)
Δ
Ratio
6)
25 ppm/year
10 ppm/year