INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-PLA140-R09 1
PLA140
Single-Pole Normally Open
OptoMOS® Relay
Applications
Features
Description
Ordering Information
Parameter Rating Units
Blocking Voltage 400 VP
Load Current 250 mArms / mADC
On-Resistance (max) 8
Pin Configuration
Part Number Description
PLA140 6-Pin DIP (50/Tube)
PLA140S 6-Pin Surface Mount (50/Tube)
PLA140STR 6-Pin Surface Mount (1,000/Reel)
Switching Characteristics of
Normally Open Devices
• Low On-Resistance, High Current Handling
• Low Drive Power Requirements
• 3750Vrms Input/Output Isolation
• High Reliability
• VDE Compatible
• FCC Compatible
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Flammability Rating UL 94 V-0
• Small 6-Pin Package
• Surface Mount Tape & Reel Version Available
• Telecommunications
• Telecomm Switching
• Hook Switch
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• Automotive
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
Form-A
I
F
I
LOAD
10%
90%
ton toff
1
3
2
4
5
6
+ Control
– Control
Do Not Use
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
– Control
Do Not Use
+ Load
– Load
DC Only Configuration
The PLA140 is a single-pole normally open
(1-Form-A) Solid State Relay that uses optically
coupled MOSFET technology to provide 3750Vrms of
input-to-output isolation.
MOSFET output switches, which use IXYS
Integrated Circuits' patented OptoMOS architecture,
are controlled by a highly efficient infrared LED.
The PLA140’s combination of low on-resistance and
high load current handling makes it suitable for a
variety of industrial applications.
Because Solid State Relays like the PLA140 have no
moving parts, they offer faster, bounce-free switching
in a more compact surface mount or though hole
package than traditional electromechanical relays.
INTEGRATED CIRCUITS DIVISION
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2R09
PLA140
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Ratings Units
Blocking Voltage 400 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current (Continuous)
AC/DC Configuration IF=5mA IL
- - 250 mArms / mADC
DC Configuration - - 350 mADC
Peak Load Current IF=5mA , t=10ms ILPK - - ±500 mAP
On-Resistance
AC/DC Configuration IF=5mA , IL=250mA RON
- 5.5 8
DC Configuration IF=5mA , IL=350mA - 1.5 3
Off-State Leakage Current VL=400VPILEAK -- 1 µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.4 3 ms
Turn-Off toff - 0.19 1
Output Capacitance IF=0mA , VL=50V, f=1MHz COUT -18 - pF
Input Characteristics
Input Control Current to Activate IL=250mA IF- 0.46 5 mA
Input Control Current to Deactivate - IF0.2 0.44 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance VIO=0V, f=1MHz CIO -3 - pF
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PLA140
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R09
LED Forward Voltage (V)
1.235 1.240 1.245 1.250 1.255 1.260 1.265
Device Count (N)
0
5
10
15
20
25
30
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
LED Current (mA)
0.28 0.34 0.40 0.46 0.52 0.58 0.64 0.70
Device Count (N)
0
5
10
15
20
Typical IF for Switch Operation
(IL=250mA)
On-Resistance (:)
4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4
Device Count (N)
0
5
10
15
20
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=250mA)
Turn-On Time (ms)
0.675 0.750 0.825 0.900 0.975 1.050 1.125 1.200
Device Count (N)
0
5
10
15
20
25
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
Turn-Off Time (ms)
0.13 0.15 0.17 0.19 0.21 0.23 0.25 0.27
Device Count (N)
0
5
10
15
20
25
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
Blocking Voltage (VP)
442 448 454 460 466 472 478 484
Device Count (N)
0
5
10
15
20
Typical Blocking Voltage Distribution
(N=50, IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.44
0.46
0.48
0.50
0.52
0.54
0.56
0.58
0.60
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
Typical Turn-On Time vs. Temperature
(IF=5mA, IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.14
0.16
0.18
0.20
0.22
0.24
0.26
Typical Turn-Off Time vs. Temperature
(IF=5mA, IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
LED Current (mA)
0 1020304050
Turn-On Time (ms)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Current (mA)
0 1020304050
Turn-Off Time (ms)
0.16
0.18
0.20
0.22
0.24
0.26
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
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4R09
PLA140
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
3
4
5
6
7
8
9
Typical On-Resistance vs. Temperature
AC/DC Configuration
(IF=5mA, IL=100mA)
Load Voltage (V)
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
Load Current (A)
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
Typical Load Current vs. Load Voltage
AC/DC Configuration
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
100
125
150
175
200
225
250
275
Maximum Load Current
vs. Temperature - AC/DC Configuration
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
Typical On-Resistance vs. Temperature
DC-Only Configuration
(IF=5mA, IL=100mA)
Load Voltage (V)
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Load Current (A)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
Typical Load Current vs. Load Voltage
DC-Only Configuration
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
150
175
200
225
250
275
300
325
350
375
Maximum Load Current
vs. Temperature - DC-Only Configuration
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
440
450
460
470
480
490
500
510
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
10
20
30
40
50
60
70
80
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(VL=400V)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.2
0.4
0.6
0.8
1.0
1.2
Energy Rating Curve
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
PLA140
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R09
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
PLA140 / PLA140S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
PLA140 250ºC 30 seconds 1
PLA140S 250ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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6R09
PLA140
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020) 6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
PLA140
PLA140S
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
7
PLA140
Specification: DS-PLA140-R09
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/27/2018
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
A0 = 10.10
(0.398)
P1 = 12.00
(0.472)
K1 = 3.80
(0.15)
K0 = 4.90
(0.19)
User Direction of Feed
PLA140STR Tape & Reel
