DATA SHEET PHOTOCOUPLER PS2503-1,-2,-4,PS2503L-1,-2,-4 LOW INPUT CURRENT, HIGH SPEED SWITCHING MULTI PHOTOCOUPLER SERIES -NEPOC Series- DESCRIPTION The PS2503-1, -2, -4 and PS2503L-1, -2, -4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor. The PS2503-1, -2, -4 are in a plastic DIP (Dual In-line Package) and the PS2503L-1, -2, -4 are lead bending type (Gull-wing) for surface mount. FEATURES PIN CONNECTION * High isolation voltage (BV = 5 000 Vr.m.s.) (Top View) * High-speed switching (tr = 20 s TYP., tf = 30 s TYP.) * Ordering number of tape product: PS2503L-1-E3, E4, F3, F4, PS2503L-2-E3, E4 PS2503-1, PS2503L-1 4 * Safety standards 3 1. Anode 2. Cathode 3. Emitter 4. Collector * UL approved: File No. E72422 * CSA approved: No. CA 101391 1 APPLICATIONS 2 PS2503-2, PS2503L-2 8 * Measurement equipment 7 6 5 1, 3. Anode 2, 4. Cathode 5, 7. Emitter 6, 8. Collector * Programmable logic controller * Telephone/Telegraph Receiver 1 * Power supply 2 3 4 PS2503-4, PS2503L-4 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 1, 3, 5, 7. Anode 2, 4, 6, 8. Cathode 9, 11, 13, 15. Emitter 10, 12, 14, 16. Collector The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PN10227EJ02V0DS (2nd edition) Date Published March 2006 CP(K) Printed in Japan The mark shows major revised points. NEC Compound Semiconductor Devices, Ltd. 1993, 2006 PS2503-1,-2,-4,PS2503L-1,-2,-4 PACKAGE DIMENSIONS (UNIT : mm) DIP Type PS2503-2 PS2503-1 4.60.5 6.50.5 6.50.5 9.70.5 7.62 0 to 15 +0.1 0.25 -0.05 1.250.15 3.50.3 3.30.5 4.150.4 3.50.3 3.30.5 4.150.4 7.62 0.500.10 1.250.15 0.500.10 0.25 M 0.25 M 2.54 2.54 PS2503-4 6.50.5 19.80.5 3.50.3 3.30.5 4.150.4 7.62 0.500.10 1.250.15 2.54 2 0.25 M Data Sheet PN10227EJ02V0DS 0 to 15 +0.1 0.25 -0.05 0 to 15 +0.1 0.25 -0.05 PS2503-1,-2,-4,PS2503L-1,-2,-4 Lead Bending Type PS2503L-2 PS2503L-1 4.60.5 0.90.25 9.600.4 1.250.15 0.25 M 0.25 M 2.54 0.1 +0.1 -0.05 0.90.25 9.600.4 1.250.15 0.15 0.15 PS2503L-4 1.250.15 0.25 M 2.54 0.15 Data Sheet PN10227EJ02V0DS 0.1 +0.1 -0.05 0.25 +0.1 -0.05 6.50.5 19.80.5 3.50.3 2.54 0.25 +0.1 -0.05 3.50.3 0.1 +0.1 -0.05 3.50.3 0.25 +0.1 -0.05 6.50.5 6.50.5 9.70.5 0.90.25 9.600.4 3 PS2503-1,-2,-4,PS2503L-1,-2,-4 MARKING EXAMPLE PS2503-1 PS2503-2, -4 No. 1 pin Mark No. 1 pin Mark 2503 ML601 M L Assembly Lot 6 01 N Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code Package Standard PKG Made in Japan Made in Taiwan Data Sheet PN10227EJ02V0DS 6 01 Week Assembled Year Assembled (Last 1 Digit) In-house Code CTR Rank Code Package New PKG New PKG 4 L Standard PKG L Country Assembled Type Number Assembly Lot PS2503-2 NL601 Made in Japan Made in Taiwan L PS2503-1,-2,-4,PS2503L-1,-2,-4 ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Application Part Approval Number Specification PS2503-1 PS2503-1-A Pb-Free PS2503L-1 PS2503L-1-A PS2503L-1-E3 PS2503L-1-E3-A PS2503L-1-E4 PS2503L-1-E4-A PS2503L-1-F3 PS2503L-1-F3-A PS2503L-1-F4 PS2503L-1-F4-A PS2503-2 PS2503-2-A PS2503L-2 PS2503L-2-A PS2503L-2-E3 PS2503L-2-E3-A PS2503L-2-E4 PS2503L-2-E4-A PS2503-4 PS2503-4-A PS2503L-4 PS2503L-4-A Magazine case 100 pcs Standard products *1 PS2503-1 (UL, CSA Approved) Embossed Tape 1 000 pcs/reel Embossed Tape 2 000 pcs/reel Magazine case 45 pcs PS2503-2 Embossed Tape 1 000 pcs/reel Magazine case 20 pcs PS2503-4 *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified) Ratings Parameter Diode Symbol PS2503-2,-4 PS2503L-2,-4 Unit Reverse Voltage VR 6 V Forward Current (DC) IF 80 mA/ch Power Dissipation Derating Power Dissipation *1 Peak Forward Current Transistor PS2503-1, PS2503L-1 PD/C 1.5 1.2 mW/C PD 150 120 mW/ch IFP 1 A/ch Collector to Emitter Voltage VCEO 40 V Emitter to Collector Voltage VECO 0.6 V IC 30 mA/ch Collector Current Power Dissipation Derating Power Dissipation Isolation Voltage *2 PC/C 1.5 1.2 mW/C PC 150 120 mW/ch BV 5 000 Vr.m.s. Operating Ambient Temperature TA -55 to +100 C Storage Temperature Tstg -55 to +150 C *1 PW = 100 s, Duty Cycle = 1% *2 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together (PS2503-1, PS2503L-1). Pins 1-4 shorted together, 5-8 shorted together (PS2503-2, PS2503L-2). Pins 1-8 shorted together, 9-16 shorted together (PS2503-4, PS2503L-4). Data Sheet PN10227EJ02V0DS 5 PS2503-1,-2,-4,PS2503L-1,-2,-4 ELECTRICAL CHARACTERISTICS (TA = 25 C) Parameter Diode Transistor Symbol Conditions Forward Voltage VF IF = 1 mA Reverse Current IR VR = 5 V Terminal Capacitance Ct V = 0 V, f = 1.0 MHz ICEO VCE = 40 V, IF = 0 mA CTR IF = 1 mA, VCE = 5 V Collector to Emitter Dark MIN. TYP. MAX. Unit 1.1 1.3 V 5 A 50 pF 100 nA 400 % 0.25 V Current Coupled Current Transfer Ratio 100 200 *1 (IC/IF) Collector Saturation VCE(sat) IF = 1 mA, IC = 0.2 mA Voltage VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1.0 MHz 0.5 pF *2 Rise Time tr VCC = 5 V, IF = 1 mA, RL = 10 k 20 s *2 tf 30 *1 CTR rank (only PS2503-1, PS2503L-1) K : 200 to 400 (%) L : 150 to 300 (%) M : 100 to 200 (%) *2 Test circuit for switching time Pulse Input IF VCC PW = 100 s Duty Cycle = 1/10 50 6 RI-O Fall Time 10 11 Isolation Resistance VOUT RL = 10 k Data Sheet PN10227EJ02V0DS PS2503-1,-2,-4,PS2503L-1,-2,-4 TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE Transistor Power Dissipation PC (mW) Diode Power Dissipation PD (mW) 150 PS2503-1 PS2503L-1 100 PS2503-2 PS2503L-2 PS2503-4 PS2503L-4 1.5 mW/C 50 1.2 mW/C 0 25 50 100 75 TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 125 150 PS2503-2 PS2503L-2 PS2503-4 PS2503L-4 1.2 mW/C 25 75 50 100 150 12 50 Collector Current IC (mA) 10 4 mA 5 mA TA = +100 C +60 C +25 C 5 0 C -25 C -55 C 1 0.5 10 3 mA 8 2 mA 6 1.5 mA 4 1 mA 0.8 mA IF = 0.6 mA 2 0.1 0.8 0.9 1.0 1.1 1.2 1.3 1.4 0 1.5 2 4 6 8 10 Forward Voltage VF (V) Collector to Emitter Voltage VCE (V) COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 30 100 10 mA 50 VCE = 40 V 30 V 20 V 10 V 10 Collector Current IC (mA) Collector to Emitter Dark Current ICEO (nA) 125 COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE FORWARD CURRENT vs. FORWARD VOLTAGE 0.7 100 Ambient Temperature TA (C) Ambient Temperature TA (C) Forward Current IF (mA) 1.5 mW/C 50 0 150 PS2503-1 PS2503L-1 100 5.0 1.0 0.3 -25 0 25 50 75 100 10 2 mA 1 mA IF = 0.8 mA 1 0.5 0.1 0 Ambient Temperature TA (C) Remark 5 mA 5 0.2 0.4 0.6 0.8 1.0 Collector Saturation Voltage VCE(sat) (V) The graphs indicate nominal characteristics. Data Sheet PN10227EJ02V0DS 7 PS2503-1,-2,-4,PS2503L-1,-2,-4 NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE CURRENT TRANSFER RATIO vs. FORWARD CURRENT Normalized Current Transfer Ratio CTR 400 Current Transfer Ratio CTR (%) 1.4 1.2 1.0 0.8 0.6 0.4 Normalized to 1.0 at TA = 25 C, IF = 1 mA, VCE = 5 V 0.2 0 -30 25 0 50 75 VCE = 5 V 300 200 Sample A B C 100 0 0.3 0.5 100 CTR = 290 %, VCC = 5 V, IF = 1 mA, RL = 10 k 100 50 tf ts tr td 50 Switching Time t ( s) Switching Time t ( s) 500 5 50 SWITCHING TIME vs. LOAD RESISTANCE SWITCHING TIME vs. AMBIENT TEMPERATURE 10 10 Forward Current IF (mA) Ambient Temperature TA (C) 100 5 1 tr 10 5 td tf IF = 1 mA, VCC = 5 V, CTR = 209 %, 1 ts VCC IF 0.5 VO 50 1 -50 -25 0 25 0.1 100 75 50 Ambient Temperature TA (C) 500 1 k 100 5 k 10 k RL 50 k100 k Load Resistance RL () LONG TERM CTR DEGRADATION FREQUENCY RESPONSE 1.2 0 -3.0 -6.0 -9.0 1 k RL = 5.6 k 300 -12.0 0.6 8 IF = 5 mA TA = 60C 0.4 1k 10 k 100 k 1M 0 Frequency f (Hz) Remark IF = 5 mA TA = 25C 0.8 0.2 -15.0 100 1.0 CTR (Relative Value) Normalized Gain GV VCC = 5 V, CTR = 209 % 102 103 Time (Hr) The graphs indicate nominal characteristics. Data Sheet PN10227EJ02V0DS 104 105 PS2503-1,-2,-4,PS2503L-1,-2,-4 TAPING SPECIFICATIONS (UNIT : mm) 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2503L-1-E3 PS2503L-1-E4 Outline and Dimensions (Reel) 2.00.5 21.00.8 80.01.0 R 1.0 2542.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 1 000 pcs/reel Data Sheet PN10227EJ02V0DS 15.9 to 19.4 Outer edge of flange 9 PS2503-1,-2,-4,PS2503L-1,-2,-4 1.550.1 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 5.30.1 8.00.1 0.4 Tape Direction PS2503L-1-F3 PS2503L-1-F4 Outline and Dimensions (Reel) 2.00.5 21.00.8 1001.0 R 1.0 3302.0 2.00.5 13.00.2 17.51.0 21.51.0 Packing: 2 000 pcs/reel 10 Data Sheet PN10227EJ02V0DS 15.9 to 19.4 Outer edge of flange PS2503-1,-2,-4,PS2503L-1,-2,-4 4.5 MAX. 10.30.1 7.50.1 1.5 +0.1 -0 16.00.3 2.00.1 4.00.1 1.750.1 Outline and Dimensions (Tape) 4.00.1 10.40.1 1.550.1 12.00.1 0.3 Tape Direction PS2503L-2-E4 PS2503L-2-E3 Outline and Dimensions (Reel) R 1.0 1001.0 2.00.5 13.00.2 3302.0 2.00.5 21.00.8 17.51.0 21.51.0 Packing: 1 000 pcs/reel Data Sheet PN10227EJ02V0DS 15.9 to 19.4 Outer edge of flange 11 PS2503-1,-2,-4,PS2503L-1,-2,-4 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature 260C or below (package surface temperature) * Time of peak reflow temperature 10 seconds or less * Time of temperature higher than 220C 60 seconds or less * Time to preheat temperature from 120 to 180C 12030 s * Number of reflows Three * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature 260C or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120C or below (package surface temperature) * Number of times One (Allowed to be dipped in solder including plastic mold portion.) * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron * Peak temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100C. 12 Data Sheet PN10227EJ02V0DS PS2503-1,-2,-4,PS2503L-1,-2,-4 (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler Check the setting values before use, since the forward current conditions at CTR measurement differ according to product. When using products other than at the specified forward current, the characteristics curves may differ from the standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual operating conditions and thoroughly take variations or the like into consideration before use. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10227EJ02V0DS 13 PS2503-1,-2,-4,PS2503L-1,-2,-4 When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. * The information in this document is current as of March, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 14 Data Sheet PN10227EJ02V0DS PS2503-1,-2,-4,PS2503L-1,-2,-4 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0504