Surface-mounted MEMS Switch 2SMES-01 Surface-mounted, ultracompact SPDT MEMS switch usable up to 10-GHz band (typical). Exceptional high-frequency characteristics in a broad spectrum up to 10 GHz (typical) At 8 GHz (50): Isolation: 30 dB min., Insertion loss: 1 dB max. Ultracompact size: 5.2x3.0x1.8 mm (LxWxH) Contact switching endurance of over 100 million cycles. (0.5 mA at 0.5 VDC, resistive load) Power consumption of 10 W max. RoHS compliant Equivalent Circuit Design Application Example * Semiconductor testers +V1 GND * High-frequency measurement devices +V2 * RF components RF_1 RF_C RF_2 List of Models Standard Models with Surface-mounting Terminals Classification Structure Single-side stable Plastic sealed Contact form SPDT Model 2SMES-01 Packaging Package quantity Model Minimum order 2" IC Pack 56/Tray 2SMES-01 1 JEDEC Tray 250/Tray 2SMES-01CT 150 1 2SMES-01 2SMES-01 Specifications Contact Switching Ratings Item Load Resistive load High-frequency Characteristics Item Frequency 2 GHz 8 GHz 10 GHz 12 GHz Rated load 0.5 mA at 0.5 VDC Isolation --- 30 dB Rated carry current 100 mA at 10 VDC Insertion Loss --- 1 dB --- 0.5 VDC Return Loss --- 10 dB 0.5 mADC Maximum peak power 36 dBm --- --- Maximum carry power 30 dBm --- --- 1 dB (Typ.) RF: 30 dBm* Maximum switching voltage Maximum switching current Maximum switching capacity 0.25 mW Note: Unless otherwise specified, initial values are based on a temperature of 23C and a humidity of 65%. * These values are for a V.SWR of 1.2 or less at the load. Note: 3 dB --- 1. The impedance of the measurement system is 50 . 2. The above values are initial values. 3. These values are for a V.SWR of less than 1.2 at the load. 4. Unless otherwise specified, initial values are based on a temperature of 23C and a humidity of 65%. Input Ratings Rated voltage (VDC) DC Note: 345% Rated current (mA) --- Must operate voltage (V) 90% max. of rated voltage Must release voltage (V) 10% min. of rated voltage Absolute maximum voltage (V) 40 Unless otherwise specified, initial values are based on a temperature of 23C and a humidity of 65%. Characteristics Classification Single-side stable model Item Model 2SMES-01 Contact resistance 1,500 m max. * Operating time 100 s max. (Depends on the rated voltage operation.) 100 s max. (Depends on the rated voltage operation.) Release time Insulation resistance V-GND 100 M (at 40 VDC) others 100 M (at 100 VDC) Vibration resistance Destruction 10 Hz to 500 Hz 10 G Malfunction 10 Hz to 500 Hz 10 G Shock resistance Destruction 1,000 m/s2 (100 G) Malfunction 1,000 m/s2 (100 G) Life Mechanical expectancy Electrical 100,000,000 Operations min. ESD 100 V (Human body model) Ambient temperature Operating: -20C to 85C (with no icing or condensation) Ambient humidity Operating: 5% to 85% Weight Approx. 0.1 g Note: 100,000,000 Operations min. 1. The above values are initial values. 2. Unless otherwise specified, initial values are based on a temperature of 23C and a humidity of 65%. * The contact resistance was measured with 10 mA at 1 VDC with a voltage drop method. 2 Rated power consumption (W) 10 2SMES-01 2SMES-01 Typical Example of Drive Circuit for RF MEMS Switch +Vcc INPUT 1 Vcont_1 Gate Driver RF_1 R RF_com R INPUT 2 RF_2 DRIVER IC Vcont_2 2SMES-01 1. This Switch uses an integrated structure for the DC-GND on the input side and the RF-GND on the output side. For a relay drive circuit, first be sure to ground the GND pins and then use a high-side switch to turn the operating voltage ON and OFF. 2. This Switch uses an electrostatic drive relay. To turn OFF the relay, the charge accumulated on the primary side must be discharged. Install a discharge circuit in the relay drive circuit. The resistance value for discharge circuit must be 1 M or less. If there is no discharge circuit, the relay will not turn OFF. This may result in contact sticking. 3. This Switch is designed so that the electrostatic actuator operates at a high speed. Because of this, the time constant of the drive waveform may affect the operating characteristics and life performance of the Switch. Therefore, the drive circuit must be designed so that the square wave time constant () in the vicinity of the operating input pins (Vcont_1 and Vcont_2) is greater than 0.5 s and less than 10 s. 3 2SMES-01 2SMES-01 Engineering Data (for reference) High Frequency Characteristics Insertion Loss Isolation Average value (initial) Average value (initial) 0 0.0 -10 -0.5 -20 -1.0 -30 (dB) -40 (dB) -1.5 -50 -2.0 -60 -2.5 -3.0 -70 0 3 6 9 Frequency (GHz) 12 15 -80 0 3 6 9 Frequency (GHz) 12 15 Return Loss Average value (initial) 0 -10 -20 (dB) -30 -40 -50 Note: 0 3 6 9 Frequency (GHz) 12 15 1. These measurement results are for an ambient temperature of 23C. 2. These high-frequency characteristics were measured with an RF probe (the Switch was not mounted to a PCB). 3. These high-frequency characteristics are the initial measurement results. 4. The high-frequency characteristics depend on the mounting board. Perform sufficient testing on the actual device, including durability tests, before actual use. 4 2SMES-01 2SMES-01 Electrical Endurance (Contact Resistance Shift) 1000 0.5 mA at 0.5 mVDC, Hot switch Contact Resistance Shift (m) 800 600 400 200 0 -200 -400 -600 N = 125 Samples (250 contacts) -800 -1000 0 10 20 30 40 50 60 70 80 90 100 Operating cycles (Million operations) Electrical Endurance (Pickup Voltage/Release Voltage) 35 Must Operate Voltage (30.6 V = 90%) 30 Voltage (V) 25 20 15 Operate Voltage (Ave): Release Voltage (Ave): 10 N = 125 Samples (250 contacts) 5 Must Release Voltage (3.4 V = 10%) 0 0 10 20 30 40 50 60 70 80 90 100 Operating cycles (Million operations) Ambient Temperature vs. Pickup voltage/Release Voltage 34 Pickup/Release Voltage (V) 32 Pickup Voltage Release Voltage 30 28 26 24 22 20 18 16 -30 N = 8 Samples -20 -10 0 10 20 30 40 50 60 70 80 90 100 Ambient Temperature (C) 5 2SMES-01 2SMES-01 Dimensions Note: All units are in millimeters unless otherwise indicated. Mounting PAD Dimensions (Top View) The dimensional tolerance for all measurements is 0.1 mm. 0.7 0.7 3.6 2.65 1.35 0.45 No.11 No.7 5.20.1 30.1 0.6 0.7 0.45 1 pin mark 1.6 1.4 0.45 No.1 0.5 2.2 1.1 No.1 0.4 No.5 0.4 0.4 1.7 0.5 0.7 0.6 1.850.15 No.7 No.5 0.6 1.5 1.45 2.55 3.7 No.11 0.45 1 2.3 0.6 4.9 No. Pin Arrangement 1 GND 2 GND 3 RF_com 4 GND 5 GND 6 RF_2 7 GND 8 Vcont_2 9 GND 10 Vcont_1 11 GND 12 RF_1 Precautions for PCB Design High-frequency GND Pad and High-frequency GND Plane Connections Note: indicates a high-frequency GND pad. In case of Coplanar Waveguide No.11 In case of Microstrip Line No.7 No.1 No.7 No.1 No.5 No.5 Surface high-frequency GND plane Through hole to the internal high-frequency GND plane * Connect all high-frequency GND pads directly to the high-frequency GND plane. Internal Connection (Top View) No.11 No.7 No.1 6 No.11 No.5 Through hole to the internal high-frequency GND plane * Connect each high-frequency GND pad to the internal high-frequency GND plane through the through holes. 2SMES-01 2SMES-01 Temperature (C) Recommended Soldering Method * We recommend a thickness of 150 to 200 m for the solder cream. T4 T3 * We recommend that you use the recommended mounting PAD dimensions for the land pattern. * IRS (Infrared Reflow Soldering) Temperature Profile Conditions During solder reflow, set the temperature conditions for the pins and top surface of the case so that they are at or below the conditions listed in the following table, and then confirm that the conditions are met on the actual device. T2 T1 * Avoid rapid cooling when cleaning after solder mounting. Use an alcohol-based or water-based cleaning solution. Maintain a cleaning temperature of 60C max. t1 Preheating t2 Soldering Time (s) Item Preheating (T1 to T2, t1) Soldering (T3, t2) Terminal 150C to 180C 230C min. 120 s max. 30 s max. Upper surface of case --- --- Peak value (T4) 250C max. 255C max. Safety Precautions Precautions for Correct Use Handling the MEMS Switch Long-term Continuous ON Contacts * Use the MEMS Switch as soon as possible and within one week after opening the moisture-proof packaging. If the MEMS Switch is left exposed for a long period of time after opening the moisture-proof packaging, this may negatively affect the external appearance and sealing performance of the Switch after it is mounted. If you must store the Switch after it has been removed from the moisture-proof packaging, place the Switch back into the moisture-proof packaging, seal the packaging with tape, and store in an environment of 10 to 30C at 30% max. If baking is performed after the Switch is removed from the packaging again, do so at 80C, 5% max. for 60 hours or less (one time only) and mount the switch within 72 hours after baking (MSL3). * Using the MEMS Switch in a circuit that is designed so that no switching is performed and current is applied to the Switch for a long period of time (more than 24 hours) may cause unstable contacts. If the MEMS Switch must be used in this kind of circuit, we recommend adding fail-safe circuits in case the contact fails. Claw Securing Force During Automatic Mounting * During automatic insertion of an MEMS Switch, be sure to set the securing force of each claw to the following value so that the RF MEMS Switch's characteristics will be maintained. * Avoid rapid cooling when cleaning after solder mounting. Use an alcohol-based or water-based cleaning solution. Also, maintain a cleaning temperature of 60C max. Direction C: 2.0 N max. * Do not perform hot switching that exceeds the ratings. (The rated load is 0.5 mA at 0.5 VDC with a resistance load.) * Do not use any ultrasonic cleaning methods. * The MEMS Switch is extremely susceptible to static electricity. Take the necessary precautions to eliminate static electricity when handling the Switch (100 V max.). Implement measures to eliminate static electricity before you handle the MEMS Switch. Contact OMRON for additional guidelines. Precautions for Safe Usage * Do not drop the Switch or attempt to disassemble it. * Always turn OFF the power supply to the drive and load sides and conduct thorough safety checks before replacing the MEMS Switch or performing any wiring. * Do not apply force to the Switch that would result in the Switch deformation or changes in quality. * Do not touch the MEMS Switch pins when power is being supplied. Doing so may result in electrical shock. Usage, Storage, and Transportation Environments * Avoid contact with direct sunlight during use, storage, and transportation. Store the Switch at room temperature, normal humidity, and normal pressure. * Avoid exposure to corrosive gases during usage, storage, and transportation. Coating * Do not use a silicon-based coating when mounting the Switch to the PCB. Also, do not use any cleaning solutions that contain silicon when cleaning the PCB after the relay is mounted. The cleaning solution may remain as a coating on the relay surface.) 7 2SMES-01 2SMES-01 For Reference Only High-frequency Characteristic Measurement Methods and Measurement PCBs PCB for High-frequency Evaluation The high-frequency characteristics of the 2SMES-01 are measured as described below. Material: MEGTRON6 (R5775, permittivity: 3.6) Board thickness t = 1.6 mm Signal line width = 0.5 mm, Space = 0.2 mm (CPW) 2SMES-01 Agilent N5230 Vector Network Analyzer Device mounting area ALL DIMENSIONS SHOWN ARE IN MILLIMETERS. To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527. Cat. No. A178-E1-03 In the interest of product improvement, specifications are subject to change without notice. OMRON Corporation Micro Devices Division H.Q. Micro Devices Division 686-1 Ichimiyake, Yasu, Shiga, 520-2326 JAPAN Tel: (81)77-588-9200/Fax: (81)77-588-9909 0712