LCB710 Single-Pole, Normally Closed OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) LED Current to Operate Rating 60 1 0.6 2 Units VP Arms / ADC mA Features * * * * * * * * * * * * 1A Load Current 0.6 Max On-Resistance 2mA Control Current 3750Vrms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable Small 6-Pin Package Tape & Reel, Surface Mount Version Available Description LCB710 is a single-pole normally closed (1-Form-B) solid state relay that uses optically coupled technology to provide an enhanced 3750Vrms isolation barrier between the input and the output of the relay. The efficient MOSFET switches use IXYS Integrated Circuits Division's patented OptoMOS architecture. The optically coupled output is controlled by a highly efficient GaAlAs infrared LED. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 Ordering Information Part # LCB710 LCB710S LCB710STR Description 6-Lead DIP (50/Tube) 6-Lead Surface Mount (50/Tube) 6-Lead Surface Mount (1000/Reel) Applications * * * * * * * * * * * Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (gas, oil, electric and water) Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Pin Configuration AC/DC Configuration + Control - Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control - Control Do Not Use 1 6 2 5 3 4 + Load - Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-LCB710-R02 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LCB710 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Ratings 60 5 50 1 Units VP V mA A 100 800 3750 8 -40 to +85 -40 to +125 mW mW Vrms kV C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25C Parameter Output Characteristics Load Current AC/DC Configuration, Continuous DC Configuration, Continuous Peak On-Resistance 1 AC/DC Configuration DC Configuration Switching Speeds Turn-On Turn-Off Off-State Leakage Current Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 Conditions Symbol IF=0mA IL IF=0mA , t < 10ms IF=0mA, IL=1A IF=0mA, IL=2A IF=5mA, VL=10V Min Typ Max Units ILPK - - 1 2 5 Arms / ADC ADC AP RON - 0.39 0.1 0.6 0.2 ton - 0.63 3 toff 1.5 125 3 1 - A pF ms IF=2mA, VL=60V IF=2mA, VL=50V, f=1MHz ILEAK COUT - IL=1A IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.22 0.21 1.2 - 2 1.4 10 mA mA V A - CI/O - 3 - pF Measurement taken within 1 second of on-time. 2 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION LCB710 PERFORMANCE DATA* (@25C Unless Otherwise Noted) 25 25 20 20 15 10 5 0 Typical Turn-On Time (N=50, IF=5mA) 15 10 5 0 0.54 15 10 5 0 0.22 0.23 0.24 0.25 LED Current (mA) 15 10 5 Turn-On Time (ms) 1.5 1.3 1.2 1.1 1.0 -40 0.32 IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA -20 0 20 40 60 Temperature (C) 80 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Turn-On Time (ms) 0.20 0.16 -20 0 20 40 60 Temperature (C) 80 100 15 10 5 71 73 75 77 79 Blocking Voltage (VP) 81 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 8 6 5 4 3 2 1 0 10 20 30 40 LED Forward Current (mA) 10 20 30 40 LED Forward Current (mA) 50 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mA) 2.6 2.4 0.8 0.7 0.6 0.5 0.4 -40 0 50 Typical Turn-On Time vs. Temperature (IF=5mA, IL=100mA) 0.9 0.24 1.9 7 0 Typical IF for Switch Operation vs. Temperature (IL=100mA) 0.28 0.12 -40 0.640 0.638 0.636 0.634 0.632 0.630 0.628 0.626 0.624 0.622 0.620 100 1.8 20 69 Turn-Off Time (ms) 1.6 1.4 1.5 1.6 1.7 Turn-Off Time (ms) Typical Blocking Voltage Distribution (N=50, IF=2mA) 0.381 0.384 0.387 0.390 0.393 0.396 0.399 On -Resistance (:) LED Forward Voltage vs. Temperature LED Forward Voltage (V) 25 1.3 0 0.26 1.4 5 1.2 Turn-Off Time (ms) 0.21 10 0.72 0 0.20 LED Current (mA) 0.60 0.63 0.66 0.69 Turn-On Time (ms) Device Count (N) 20 0.57 Typical On-Resistance Distribution (IL=1A) 20 Device Count (N) Device Count (N) 25 15 0 1.220 1.225 1.230 1.235 1.240 1.245 1.250 LED Forward Voltage (V) Typical IF for Switch Operation (N=50, IL=1A) Typical Turn-Off Time (N=50, IF=5mA) 20 Device Count (N) 30 Device Count (N) Device Count (N) Typical LED Forward Voltage Drop (N=50) 2.2 2.0 1.8 1.6 1.4 -20 0 20 40 60 Temperature (C) 80 100 1.2 -40 -20 0 20 40 60 Temperature (C) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCB710 PERFORMANCE DATA* (@25C Unless Otherwise Noted) Typical On-Resistance vs. Temperature AC/DC Configuration (IF=0mA, IL=500mA) 1.0 0.36 0.32 0.5 0.0 -0.5 -20 0 20 40 60 Temperature (C) 80 -1.0 -0.4 -0.3 -0.2 100 2.0 0.3 -40 0.4 -20 0 20 40 60 Temperature (C) 80 100 Maximum Load Current vs. Temperature DC-Only Configuration (IF=0mA) Load Current vs. Load Voltage DC-Only Configuration (IF=0mA) 2.2 0.08 Load Current (A) 0.09 1.0 0.5 1.8 1.6 1.4 1.2 -20 0 20 40 60 Temperature (C) 80 0.0 0.00 100 Typical Blocking Voltage vs. Temperature (IF=2mA) 0.10 80 79 78 77 76 75 74 -20 0 20 40 60 Temperature (C) 80 100 1.0 0.05 0.10 0.15 Load Voltage (V) 0.20 Typical Leakage Current vs. Temperature (IF=2mA, VL=60V) 0.06 0.04 0.02 -20 0 20 40 60 Temperature (C) 80 100 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 450 0.08 0.00 -40 -40 0.25 Output Capacitence (pF) Blocking Voltage (VP) 0.7 0.5 -0.1 0.0 0.1 0.2 Load Voltage (V) 1.5 Load Current (A) 0.10 73 -40 0.8 2.0 0.11 Leakage Current (PA) On Resistance (:) 0.12 81 0.9 0.6 Typical On-Resistance vs. Temperature DC-Only Configuration (IF=0mA, IL=1A) 0.07 -40 Load Current (A) 0.40 0.28 -40 1.1 1.0 0.44 Load Current (A) On-Resistance (:) 0.48 Maximum Load Current vs. Temperature AC/DC Configuration (IF=0mA) Typical Load Current vs. Load Voltage AC/DC Configuration (IF=0mA) 400 350 300 250 200 150 100 -20 0 20 40 60 Temperature (C) 80 100 10s 100s 0.1 1 10 Load Voltage (V) 100 Energy Rating Curve 5.5 Load Current (A) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 10Ps 100Ps 1ms 10ms 100ms Time 1s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION LCB710 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LCB710 / LCB710S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LCB710 / LCB710S 250C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R02 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCB710 Mechanical Dimensions LCB710 8.382 0.381 (0.330 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 0.127 (0.100 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) Pin 1 7.620 0.254 (0.300 0.010) 1.651 0.254 (0.065 0.010) 3.302 0.051 (0.130 0.002) 0.254 0.0127 (0.010 0.0005) 6.350 0.127 (0.250 0.005) 5.080 0.127 (0.200 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 0.076 (0.018 0.003) LCB710S 8.382 0.381 (0.330 0.015) 9.524 0.508 (0.375 0.020) Pin 1 0.635 0.127 (0.025 0.005) PCB Land Pattern 2.54 0.127 (0.100 0.005) 2.54 (0.10) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) Dimensions mm (inches) 1.651 0.254 (0.065 0.010) 6 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION LCB710 LCB710STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LCB710-R02 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012