TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1001 Series SP1001 Series - 8pF 15kV Unidirectional TVS Array Pb GREEN RoHS Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features SP1001-02 (SC70-3) SP1001-04 (SC70-5) SP1001-05 (SC70-6) 1 1 3 2 5 1 6 2 2 5 3 3 4 4 SP1001-02 (SOT 553) SP1001-04 (SOT 553) NC 5 SP1001-05 (SOT 563) 1 5 2 2 NC 4 3 4 1 6 2 5 3 4 SP1001-02 2 2 3 t -JHIUOJOH1SPUFDUJPO IEC61000-4-5, 2A (8/20s) t $PNQVUFS1FSJQIFSBMT t -$%1%157T t .PCJMF1IPOFT t 4FU5PQ#PYFT t %JHJUBM$BNFSBT t %7%1MBZFST t %FTLUPQT/PUFCPPLT t .11.1 Application Example 6 1 5 2 LCD module Controller Input 4 Outside World 1 t 4NBMMQBDLBHFTBWFT board space SP1001-05 4 5 4 5 3 SP1001-04 t &4%QSPUFDUJPOPGL7 contact discharge, 30kV air discharge, (Level 4, IEC61000-4-2) Applications SP1001-02 2 t -PXMFBLBHFDVSSFOUPG 0.5A (MAX) at 5V t &'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) Functional Block Diagram 1 t -PXDBQBDJUBODFPGQ' (TYP) per I/O 3 D1 D2 D3 D4 SP 1001-04JTG (SC70-5) SP 1001-04XTG (SOT553) Shield Ground Signal Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 25 Revision: March 20, 2012 SP1001 Series SP1001 Description TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1001 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Units 2 A Storage Temperature Range Operating Temperature -40 to 85 C Storage Temperature -60 to 150 C IPP Peak Current (tp=8/20s) TOP TSTOR Parameter Rating Units -65 to 150 C Maximum Junction Temperature 150 C Maximum Lead Temperature (Soldering 20s-40s) 260 C CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25C) Parameter Symbol Test Conditions Min Typ Max Units VF IF=10mA 0.7 0.9 1.2 V 7.0 7.8 Forward Voltage Drop Reverse Voltage Drop VR IR=1mA Reverse Standoff Voltage VRWM IR1A Reverse Leakage Current ILEAK Clamp Voltage1 VR=5V VC Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance1 CD 8.5 V 5.5 V 0.5 A IPP=1A, tp=8/20s, Fwd 8.0 11.0 V IPP=2A, tp=8/20s, Fwd 9.7 13.0 (VC2 - VC1) / (IPP2 - IPP1) 1.7 IEC61000-4-2 (Contact) 15 IEC61000-4-2 (Air) 30 V kV kV Reverse Bias=0V 12 pF Reverse Bias=2.5V 8 pF Reverse Bias=5V 7 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals between the anode and common cathode of each diode Capacitance vs. Reverse Bias Design Consideration Because of the fast rise-time of the ESD transient, placement of ESD devices is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install the ESD suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 14 12 Capacitance (pF) 10 8 6 4 2 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias (V) SP1001 Series 26 Revision: March 20, 2012 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1001 Series Soldering Parameters Pb - Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds Temperature TP Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 time to peak temperature Peak Temperature (TP) 260+0/-5 C Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes max. Do not exceed 260C Part Numbering System Time Product Characteristics SP1001-0* * T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels G= Green T= Tape & Reel Package J = SC70-3, SC70-5 or SC70-6 X = SOT553 or SOT563 02 = 2 Channel 04 = 4 Channel 05 = 5 Channel Part Marking System Lead Plating Matte Tin (SC70-x) Pre-Plated Frame (SOT5x3) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters A* * 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. A** Product Series Number of Channels A = SP1001 series (varies) 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Assembly Site (varies) Ordering Information Part Number Package Marking Min. Order Qty. SP1001-02JTG SC70-3 A*2 3000 SP1001-02XTG SOT553 A*2 3000 SP1001-04JTG SC70-5 A*4 3000 SP1001-04XTG SOT553 A*4 3000 SP1001-05JTG SC70-6 A*5 3000 SP1001-05XTG SOT563 A*5 3000 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 27 Revision: March 20, 2012 SP1001 Series SP1001 Reflow Condition TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1001 Series Package Dimensions -- SC70 Package SC70-3 B Solder Pad Layout 3 SC70-3 Pins 3 JEDEC MO-203 Millimeters E HE Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 2 1 e e D A2 A A1 e C 6 SC70-5 e 5 not used 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 5 JEDEC MO-203 Millimeters B D Min Max Min Max 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 A2 A A1 e C B 6 5 SC70-6 4 1 2 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 SC70-6 Pins 6 JEDEC MO-203 HE Millimeters Min 3 B D Inches Min Max A 0.80 1.10 0.031 0.043 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 A1 C e L Max A1 A2 A SP1001 Series 0.026 BSC Package Solder Pad Layout E 0.65 BSC HE L B Inches A 3 2 1 SC70-5 Pins HE E 0.026 BSC Package Solder Pad Layout 4 0.66 BSC HE L e Inches Min 0.65 BSC 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 28 Revision: March 20, 2012 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1001 Series Package Dimensions -- SOT553 and SOT563 Package L SOT 553 6 5 (not used) 4 E HE Solder Pad Layout c B Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 e A D 6 5 L 4 E 2 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 SOT 563 Pins 6 Millimeters Solder Pad Layout Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A c B Inches Min HE 3 e 0.50 BSC Package SOT 563 Inches Min A e 5 Millimeters 3 2 SOT 553 Pins e 0.50 BSC 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Embossed Carrier Tape & Reel Specification -- SC70-3 Dimensions Millimetres Min Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 A1 B0 1.00 Ref 2.30 B1 K0 (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Inches Max 0.039 Ref 2.50 0.090 1.90 Ref 1.10 0.098 0.074 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 29 Revision: March 20, 2012 SP1001 Series SP1001 A D TVS Diode Arrays (SPATM Family of Products) General Purpose ESD Protection - SP1001 Series Embossed Carrier Tape & Reel Specification -- SC70-5 and SC70-6 Dimensions Millimetres Min Inches Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max Embossed Carrier Tape & Reel Specification -- SOT553 and SOT563 Dimensions Millimetres Min Min Max 0.073 E 1.65 1.85 0.065 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.1 0.154 0.161 10P0 40.0 +/- 0.20 1.574 +/- 0.008 W 7.70 8.10 0.303 0.318 P 3.90 4.10 0.153 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t SP1001 Series Inches Max 30 Revision: March 20, 2012 0.22 max .009 max (c)2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.