This document provides an overview of the MPC555 microcontroller, including a block
diagram s howing th e major mod ular compone nts and sec tions that li st the majo r feat ures. The
MPC555 member of the Freescale MPC500 RISC Microcontroller family.
1 Introduction
The MPC555 device offers the following features:
PowerPC™ core with floating-point unit
26 Kbytes fast RAM and 6 Kbytes TPU microcode RAM
448 Kbytes Flash EEPROM with 5-V programming
5-V I/O system
Serial system: queued serial multi-channel module (QSMCM), dual CAN 2.0B
controller
modules (TouCANTM)
50-channel timer system: dual time processor units (TPU3), modular I/O system
(MIOS1)
32 analog inputs: dual queued analog-to-digital converters (QADC64)
Submicron HCMOS (CDR1) technology
272-pin plastic ball grid array (PBGA) packaging
40-MHz operation, -40 °C to 125 °C wi th dua l supply (3.3 V, 5 V) ( -5 5 °C to 125 °C
for the suffix A device)
32-bit archit ecture (PowerP C ISA a rchit ectur e compliant)
Core performance measured at 52.7-Kbyte Dhrystones (v2.1) @ 40 MHz
Fully static, low power operation
Integrated double-precision floating-point unit
Precise exception model
Table 1. MPC555 Features
Device Flash Code Compress ion
MPC555 448 Kbytes Code compression not supported
Product Brief
MPC555PB/D
Rev. 3, 2/2003
MPC555 Product Brief
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2MPC555 Product Brief
Block Diagram
Extensive system development support
On-chip watchpoints and breakpoints
Program flow tracking
BDM on-chip emulation development interface
1.1 Block Diagram
Figure 1 is a block diagram of the MPC555.
Figure 1. MPC555 Block Diagram
1.2 Key Features
The MPC555 key features are explained in the following sections.
1.2.1 Four-Bank Memory Controller
Works with SRAM, EPROM, Flash EEPROM, and other peripherals
Byte write enables
32-bit address decodes with bit masks
USIU
RCPU
Burst
Interface
256 Kbytes
Flash
192 Kbytes
Flash
16 Kbytes
SRAM
10 Kbytes
SRAM
L2U
E-bus
UIMB
QADC QADC QSMCM TouCAN
TPU3 DPTRAM TPU3 TouCAN MIOS1
L-bus
IMB3
U-bus
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MPC555 Product Brief 3
Key Features
1.2.2 U-Bus System Interface Unit (USIU)
Clock synt he siz er
Power management
Reset controller
MPC555 decrementer and time base
Real-time clock register
Periodic interrupt timer
Hardware bus monitor and software watchdog timer
Interrupt controller that supports up to eight external and eight internal interrupts
IEEE 1149.1 JTAG test access port
External bus interface
24 address pins, 32 data pins
Supports multiple master designs
Four-beat transfer bursts, two-clock minimum bus transactions
Supports 5V inputs, provides 3.3-V outputs
1.2.3 Flexible Memory Protection Unit
Four instruction regions and four data regions
4-Kbyte to 16-Mbyte region size support
Default attributes available in one global entry
Attribute supp ort for speculative accesses
1.2.4 448-Kbyte Flash EEPROM Memory
One 256-Kbyte and one 192-Kbyte module
Page read mode
Block (32 -Kbyte) eras able
External 4.75-V to 5.25-V program and erase power supply
1.2.5 26-Kbytes of Static RAM
One 16-Kbyte and one 10-Kbyte module
Fast (one-clock) access
Keep-alive power
Soft defect detection (SDD)
1.2.6 General-Purpose I/O Support
Address (24) and data (32) pins can be used for general-purpose I/O in single-chip mode
Nine general-purpose I/O pins in MIOS1 unit
Many peripheral pins can be used for general-purpose I/O when not used for primary function
5-V tolerant inputs/outputs
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4MPC555 Product Brief
Key Features
1.2.7 Two Time Processor Units (TPU3)
Each TPU3 module provides these features:
A dedicated micro-engine operates independently of the RCPU
16 independent programmable channels and pins
Each channel has an event register consisting of a 16-bit capture register, a 16-bit compare
register and a 16-bit comparator
Nine pre-programmed timer functions are available
Any channel can perform any time function
Each timer function can be assigned to more than one channel
Two timer count registers with programmable prescalers
Each channel can be synchronized to one or both counters
Selectable channel priority levels
5-V tolerant inputs/outputs
6-Kbyte dual port TPU RAM (DPTRAM) is shared by the two TPU3 modules for TPU microcode
1.2.8 18-Channel Modular I/O System (MIOS1)
Ten double action submodules (DASM)
Eight dedicated PWM sub-modules (PWMSM)
Two 16-bit modulus counter submodules (MCSM)
Two parallel port I/O submodules (PIOSM)
5-V tolerant inputs/outputs
1.2.9 Two Queued Analog-to-Digital Converter Modules
(QADC64)
Each QADC provides:
Up to 16 analog input channels, using internal multiplexing
Up to 41 total input channels, using internal and external multiplexing
10-bit A/D converter with internal sample/hold
Typical conversion time of 10 µs (100,000 samples per second)
Two conversion command queues of variable length
Automated queue modes initiated by:
External edge trigger/level gate
Software co mmand
64 resu lt regi sters
Output data that is right- or left-justified, signed or unsigned
5-V reference and range
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MPC555 Product Brief 5
Key Features
1.2.10 Two CAN 2.0B Controller Modules (TouCAN)
Each TouCAN provides these features:
Full implementation of CAN protocol specification, version 2.0A and 2.0B
Each module has 16 receive/transmit message buffers of 0 to 8 bytes data length
Glo bal mask reg ister for message b uffers 0 to 13
Independent mask registers for message buffers 14 and 15
Programmable transmit-f irst sc heme: lowest ID or lowes t buffer number
16-bit free-running time r for message time-stamp ing
Low power sleep mode with programmable wake-up on bus activity
Programmable I/O modes
Maskable interrupts
Independent of the transmission medium (external transceiver is assumed)
Open network architecture
Multimaster concept
Hig h immunity to EMI
Short latency time for hi gh-priority messages
Low power sleep mode with programmable wakeup on bus activity
1.2.11 Queued Serial Multi-Channel Module (QSMCM)
Qu eued serial peripheral interface (QS PI)
Provides full-duplex communication port for peripheral expansion or interprocessor
communication
Up to 32 preprogrammed transfers, reducing overhead
160-byte queue buffer
Programmable transfer length: from 8 to 16 bits, inclusive
Synchronous interface with baud rate of up to system clock divided by 4
Four programmable peripheral-select pins support up to 16 devices
Wrap-around mode allows continuous sampling for efficient interfacing to serial peripherals
(e.g., – serial A/D converters, I/O latches, etc.)
Two serial communications interfaces (SCI). Each SCI offers these features:
UART mode provides NRZ format and half-or full-duplex interface
16 regi ster receive buffer and 16 regi ster transmit buffer (SCI1 only)
Advanced error de tection and optional pari ty generation and detection
Word length programmable as 8 or 9 bits
Separate transmitter and receiver enable bits and double buffering of data
Wakeup functi ons al low the CPU to run uni nterr upt ed unt il ei ther a true idle l ine i s de tect ed or
a new address byte is received
External source clock for baud generation
Multiplexing of transmit data pins with discrete outputs and receive data pins with discrete
inputs, allowing realization of a low-speed serial protocol
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6MPC555 Product Brief
Key Features
2 MPC555 Addre ss Map
The internal memory map is shown in Figure 2.
Figure 2. MPC555 Internal Memory Map
0x30 7
0x2F
0x30 0000
USIU & Flash
16 Kbytes
0x38 0000
(10 Kbytes)
0x3F
USIU Control Registers
FLASH Module A (64 b ytes)
FLASH Module B (64 bytes)
Kbytes
0x2F C000
0x2F
0x30 8000
0x 37 FFFF
(4 80 Kbytes)
SR A M C ontr ol A
(8bytes)
0x3F 9800
(485.98 Kbytes)
0x38 0010
Res erved for USIU
2F C880
1
BFFF
FFFF
FFF
FFFF
0x
0x2F C000
0x30 0000
0x30 7F80
0x30 7FFF
0x30 7080
0x30 7480
0x30 7884
DPTRAM (6 Kbytes)
QSMCM (4 Kbytes)
MIOS1 (4 Kbytes)
TouCAN_A (1 Kbyte)
TouCAN_B (1 Kbyte)
UIMB Registers
(128 bytes)
TPU3_A (1 Kbyte)
TPU3_B (1 Kbyte)
QADC_A (1 Kbyte)
QADC_B (1 Kbyte)
DPTRAM Control
Reserved (8180 bytes)
Reserved (2 Kbytes)
0x30 2000
0x30 4000
0x30 5000
0x30 6000
Reserved (1920 bytes)
(12 bytes)
IMB3 Address Space
0x2F C800
0x2F C840
UIMB Interface &
(32 Kbytes)
IMB3 Modules
CMF Flash A
Reserved for Flash
Control
Reserved for IMB3
Reserved
SRAM A
256
0x07 0000
0x00 0000
0x06 FFFF
0x30 4400
0x30 4800
0x30 4C00
Kbyte
Kbytes
CMF Flash B
192
SR A M C ontr ol B
0x38 0008
(8 bytes)
(16 Kbytes)
SRAM B
0x04 0000
0x3F C000
(2.6 Mbytes - 16 Kbytes)
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MPC555 Product Brief 7
Key Features
3 MPC555 Pinout Diagram
Figure 3 shows the pinout for the MPC555.
Figure 3. MPC555 Pinout Diagram
MPC555 Ball Map
12345678
9
1
0
11 12 13 14 15 16
1
718
1
920
A
VDDH
A_TPUC
H1
A_
TPUCH
4A_
TPU
CH8
A
_TPUCH
12
A_T
P
U
C
H
1
5
VRL AAN
0_PQ
B0 AA
N48_
PQB4
A
A
N
52_P
QA0
AAN5
4_PQ
A
2BA
N0_
P
QB
0
BAN2
_PQB2
B
AN3_
PQB3
BA
N51_
P
Q
B7 VDDH MD
A11 M
DA12 MD
A
1
3 VDDH
B
B_T2CLK VDDH A_
T
PUCH6 A_TPUCH10 A_TPUCH11 A_TPUCH14 VRH AAN3_PQB3 AAN49_PQB5 AAN53_PQA1 AAN57_PQA5 BAN1_PQB1 BAN48_PQB4 BAN52_PQA0 BAN54_PQA2 E
T
RIG2 MDA14
M
DA15 VDDH
M
DA28
C
B_
TPU
C
H
15
A_T
2CLK A_
TPUCH
3A_
TPU
CH7
A
_TP
UCH
9A_T
P
U
C
H
1
3 VDDA
AAN
2_PQ
B2 AA
N51_
PQB7
A
A
N
56_P
QA4
AAN5
9_PQ
A
7 BAN49
_P
QB5 B
A
N
5
3
_
PQA1
BA
N56_P
QA
4BA
N57_
P
Q
A5 E
T
R
I
G1 MD
A27 M
DA29 MD
A
3
0MDA
31
D
B_
T
PUCH11 B_
T
PUCH13 A_
T
PUCH0 A_
T
PUCH2 A_TPUCH5 VDDI VSSA AAN1_PQB1 AAN50_PQB6 AAN55_PQA3 AAN58_PQA6 BAN50_PQB6 BAN55_PQA3 BAN58_PQA6 BAN59_PQA7 VDDI VDDL
M
PWM1 MPWM2
M
PW
M
3
E
B
_
TPU
CH7 B_
T
PUCH10 B_T
PUCH
14
VD
DL M
PWM
0
MPWM
17
M
PWM19 MPIO6
F
B_
T
PUCH5 B_TPUCH6 B_
T
PUCH8 B_TPUCH12 MPW
M
16
M
PW
M
18
M
PIO7 MPIO9
G
B
_
T
P
U
CH2 B_TPUC
H
3B_
TPU
C
H
4B_
TPU
CH9
M
PIO5 MPIO8
MPI
O11
M
PIO12
H
B_TPUCH1 B_TPUCH0 B_CNRX0 B_CNTX0 MPIO10 MPIO15 MPIO14 MPIO13
J
T
CK_ DSCK TDO_
D
S
DO TRST_B VDD SRAM VSS VSS VSS VSS V
F
2 _MPIO2 VFLS0
_MPIO3 VF0 _MPIO0 V
F
1 _
M
PIO1
K
TMS TDI_D
SDI S
G
P
_
FR
Z
VD
DL VS
S VSS
VSS
VSS V
D
D
LVFLS1
_MPIO4
A
_CNTX0
A
_CN
RX
0
L
IW
P
1
_
VF
LS I
WP
0 _VFLS
IR
Q3B
_SGP
IRQ4
B
_SGP VSS VSS VSS VSS
P
CS1
_QGP
PC
S0
_QGP MISO _QGP4
M
OSI _QGP5
M
IRQ0B
_
S
G
P
IRQ1B
_SGP
IRQ2B
_
S
GP
SGP_
IRQOUTB VS
S VSS
VSS V
SS
PCS3
_QGP
PCS2
_QGP ECK
SCK
_ QGP6
N
WEB_ A
T
[0] BRB_IWP2 BGB_LWP1 BBB _IWP3
Note
:
The pinout
is a
t
op down vie
w
of
t
he package.
RX
D1_
QGPI
TXD1_
QGPO RXD2_ QGPI TXD2_
QGPO
P
W
E
B_ A
T[
1
]
WEB_
AT[
2] WEB_ AT[3
]
CS0B VPP EPEE
V
S
S
F
V
DDH
R
RD_
WR
B
CS
3
BC
S2
BCS1B
VDD
L VDDF XFC
VD
DSYN
T
OEB TEAB
T
SI
Z
1 VDDL VDDI KAPWR VSSSYN EXTAL
U
TSI
Z0
TAB TS
BBDIP
BVDD
IAddr_
S
GP31 Add
r
_ SGP30
A
ddr_
S
G
P
28 Add
r
_
S
GP29 VDDL Data_
S
GP29
D
a
t
a_ SGP27
D
ata_
SGP25 Da
t
a_
SG
P
23
V
DDL Data_
S
G
P
20 R
CFB
_TXP
EXT
CLK EC
K
_
BUCK XTAL
V
BURSTB BIB_STSB Addr_ SGP11 Addr_ SGP10 Addr_ SGP9 Addr_ SGP8 Addr_ SGP22 Addr_ SGP27 Data_ SGP31 Data_ SGP30 Data_ SGP28 Data_ SGP26 Data_ SGP24 Data_ SGP22 Data_ SGP21 Data_ SGP19 Data_ SGP18 CLKOUT PORESETB SRESETB
W
A
dd
r
_
SGP12 V
DD
HAdd
r
_
S
GP14
A
ddr_
SGP16 Addr_
S
G
P
18 Addr_
S
GP20 Addr_ SG
P
23 Addr_
S
G
P
26
D
a
t
a_ SGP1 Data_
S
G
P
3
D
a
t
a_
S
GP5
D
ata_ SG
P
7Da
t
a_
S
G
P
9Da
t
a_
SGP11
D
a
t
a_ SGP13 Data_
S
G
P
15 Da
t
a_
SGP17 I
R
Q5
B
_SGP VDD
H HRE
SETB
Y
VDDH Addr_ SGP13 Addr_ SGP15 Addr_ SGP17 Addr_ SGP19 Addr_ SGP21 Addr_ SGP24 Addr_ SGP25 Data_ SGP0 Data_ SGP2 Data_ SGP4 Data_ SGP6 Data_ SGP8 Data_ SGP10 Data_ SGP12 Data_ SGP14 Data_ SGP16 IRQ6B _mck2 IRQ7B _mck3 VDDH
VDD
H
=3
vo
lt
powe
r
(I/O
)
V
DDi
=
3 v
o
l
t
po
wer
(in
te
rnal
)V
SS
=
gr
ound VDDH =5
vol
t
powe
r
=Misc
po
wer
y
Dees
Su
bst
ra
te 9
/30
/97
a
21 N
o
vembe
r
1997 V
ersio
n
10.2
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8MPC555 Product Brief
Key Features
4 Supporting Documentation List
This list contains references to currently available and planned documentation.
MPC555 User s Manual (MPC555UM/AD)
RCPU Reference Manual (RCPURM/AD)
Board Strategies for Ensuring Optimum Frequency Synthesizer Performance (AN1282/D)
Using the MIOS on the MPC555 Evaluation Board (AN1778/D)
Exception Table Relocation and Multi-Processor Address Mapping in the Embedded MPC5XX
Family (AN1821/D)
Non-Volatile Memory Technology Overview (AN1837/D)
Designing Expansion Boards for the Freescale EVB555/ETAS ES200 (AN2001/D)
MPC555 Interrupts (AN2109/D)
EMC Guidelines for MPC500-Based Automotive Powertrain Systems (AN2127/D)
Nexus Standard Specification (non-Freescale document)
Nexus Web Site: http://www.nexus5001.org/
IEEE 1149.1 Specification (non-Freescale document)
5 Revision History
Table 2. Revision History
Revision Number Substa ntive Changes Date of Release
2 Existing Document. September 2001
2.1 Added temperature range for suffix A device. 11 December 2002
3 Updated template and formats. 11 February 2003
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Key Features
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Key Features
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