MSP Vishay Sfernice Precision Surface Mount Resistors Wirewound or Metal Film Technologies FEATURES * Approved according CECC 40402-801 (wirewound) * Wide range of ohmic values (0.04 to 1 M) * Low temperature coefficient ( 25 ppm/C available) * Good electrical insulation * All welded construction and molded encapsulant * High power ratings (up to 2.5 W) * Stability class 0.5 * Pure matte tin termination * Compliant to RoHS directive 2002/95/EC Specially designed for surface mounting, the MSP series uses either wirewound or metal film technology. The molded package ensures mechanical and climatic protection as well as high dielectric insulation. The MSP design is compatible with surface mounting equipment and can withstand wave and reflow soldering techniques. DIMENSIONS in millimeters Recommended Soldering Areas E Z C A W B F SERIES AND STYLES D F X X Z AVERAGE MASS (g) 2.9 6 0.2 4.1 9.4 0.8 4.1 12.7 1.5 A B C D E F W X MSP 1 6.9 3.8 3.8 2.5 6.5 1.4 2.7 MSP 2 11.4 5 7 5 11 2.4 5.2 MSP 3 14.8 6.6 7 5 14.4 2.4 5.2 Note * General tolerance: 0.2 mm TECHNICAL SPECIFICATIONS RESISTIVE TECHNOLOGY Vishay Sfernice Series CECC 40402-801 Metric Size Rated Dissipation at + 25 C, P25 5 % E24 Series Ohmic Range in Relation to Tolerance (with Prefered Ohmic Value Series) 2 % E48 Series 1 % E96 Series 0.5 % E96 Series 0.1 % E192 Series Approved Range 1 % or CECC 40402-801 Class 0.5 Limiting Element Voltage, Umax. AC/DC www.vishay.com 14 WIREWOUND METAL FILM MSP 1 B RW1 0704M 1W 0.04 to 2.2K 0.04 to 2.2K 0.04 to 2.2K 0.4 to 2.2K MSP 2 B RW2 1107M 2W 0.04 to 4.7K 0.04 to 4.7K 0.04 to 4.7K 0.4 to 4.7K MSP 3 B RW3 1607M 2.5 W 0.04 to 13K 0.05 to 13K 0.05 to 13K 0.3 to 13K - - - 0.5 1K 50 V 0.5 2.2K 120 V 0.1 4.12K 200 V For technical questions, contact: sfer@vishay.com MSP 1 C 0704M 0.5 W MSP 2 C 1107M 1W - - - - 10 to 332K 10 to 332K 10 332K 10 to 1M 10 to 1M 10 332K - - 300 V 350 V Document Number: 50003 Revision: 02-Oct-09 MSP Vishay Sfernice Precision Surface Mount Resistors Wirewound or Metal Film Technologies TECHNICAL SPECIFICATIONS (continued) RESISTIVE TECHNOLOGY Wirewound Series Critical Resistance MSP 1 B - Metal Film MSP 2 B - MSP 3 B - CECC 40402-801 - 55 C/+ 200 C <1 100 ppm/C 1 to < 10 50 ppm/C 10 25 ppm/C Temperature Coefficient E6 10-6/h Failure Rate with CECC Approval E6 10-6/h E0 or A 10-4/h MSP 1 C MSP 2 C 180K 122.5K - 55 C/+ 155 C 10 k to 332 k K3: 50 ppm/C K4: 25 ppm/C > 332 k K3: 50 ppm/C - - MECHANICAL SPECIFICATIONS RESISTIVE TECHNOLOGY Wirewound Metal Film Encapsulant Thermoset Resistive Element CuNi or NiCr Ceramic Substrate Alumina or Steatite Termination NiCr or NiP Alumina Electrolytic pure matte tin ENVIRONMENTAL SPECIFICATIONS RESISTIVE TECHNOLOGY Temperature Range Wirewound Metal Film - 55 C to 275 C - 55 C to 155 C 55/200/56 55/125/10 Climatic Category (LCT/UCT/days) PERFORMANCE CONDITIONS TESTS Short Time Overload Load Life Dielectric w/s Voltage Rapid Change of Temperature Climatic Sequence Humidity (Steady State) Substrate Bending Test Shock Vibration Resistance to Soldering Heat Document Number: 50003 Revision: 02-Oct-09 Wirewound Metal Film IEC 60115-1 5 Pr or U = 2 Umax./5 s IEC 60115-1 90'/30' cycles 1000 h Pr + 25 C 8000 h Pr IEC 60115-1 URMS = 500 V/60 s IEC 60115-1 IEC 60068-2-14 Test Na 5 cycles (30' at LCT/30' at UCT) - 55 C/+ 200 C - 55 C/+ 125 C IEC 60115-1 - 55 C/+ 200 C - 55 C/+ 125 C IEC 60115-1 IEC 60068-2-3 Test Ca 95 % HR/40 C 56 days 10 days IEC 60115-1 IEC 60068-2-21 Test Ue3 2 mm/10 times IEC 60115-1 IEC 60068-2-27 Test Ea 50 g's/half sine/3 times by direction (i.e. 18 shocks) IEC 60115-1 IEC 60068-2-6 Test Fc 10 Hz/2000 Hz 10 Hz/500 Hz IEC 60115-1 IEC 60068-2-58 Solder bath 260 C/10 s REQUIREMENTS Wirewound Metal Film CECC 40402-801 (0.25 % + 0.05 ) 0.25 % (0.5 % + 0.05 ) 1% (3 % + 0.05 ) No flashover or breakdown Leakage current < 10 A (0.25 % + 0.05 ) 0.25 % (0.5 % + 0.05 ) 0.5 % (0.5 % + 0.05 ) 1% (0.25 % + 0.05 ) 0.25 % (0.25 % + 0.05 ) N/A (0.25 % + 0.05 ) 0.25 % (0.5 % + 0.05 ) N/A For technical questions, contact: sfer@vishay.com www.vishay.com 15 MSP Precision Surface Mount Resistors Wirewound or Metal Film Technologies Vishay Sfernice POWER RATING TEMPERATURE RISE 250 MSP C 25 0 - 100 0 - 55 25 50 100 155 1B 100 3 B SP 2 B M SP 2 C M 50 0 250 275 200 150 MS P 50 SP M C 75 200 1 MSP B SP 100 M HOT SPOT TEMPERATURE IN C RATED POWER IN % 125 0 0.5 1 1.5 2 2.5 3 RATED POWER IN W AMBIENT TEMPERATURE IN C SURFACE MOUNTING OF MSP B Soldering cycle: 2 min at 215 C or 10 s at 260 C or with an iron 40 W: 3 s at 350 C. Soldering is possible by wave, reflow and vapor phase. NON INDUCTIVE WINDING FOR MSP B Non inductive (Ayrton Perry) winding available. Please consult Vishay Sfernice. PACKAGING In bulk (plastic bag of 100 units or multiples) In tube: MSP1 70 units per tube MSP2 50 units per tube MSP3 40 units per tube In reel of 500 units for MSP1 and MSP2 DIMENSIONS in millimeters - Informative Data P0 T1 T W T2 T4 T3 P Cross section of tube Tube MSP 2 MSP 3 K0 Reel TUBE PACKAGING MSP 1 B0 A0 REEL PACKAGING T1 T2 T3 T4 Length A0 B0 K0 P0 W T 6.6 6.8 4.6 4.8 530 3.9 7.35 4.25 4 12 0.254 8 7.43 11.91 5.36 4 24 0.368 12 9.2 8.7 8 7.5 615 P N/A MARKING Vishay Sfernice trademark, ohmic value (in ), tolerance (in %), series and style, technology, manufacturing date. www.vishay.com 16 For technical questions, contact: sfer@vishay.com Document Number: 50003 Revision: 02-Oct-09 MSP Vishay Sfernice Precision Surface Mount Resistors Wirewound or Metal Film Technologies ORDERING INFORMATION MSP 1 SERIES STYLE B 48U7 1% TC TECHNOLOGY NON INDUCTIVE OHMIC VALUE TOLERANCE WINDING Optional B: Wirewound C: Metal Film BA100 Applicable only in "C" technology e3 PACKAGING LEAD (Pb)-FREE SAP PART NUMBERING GUIDELINES M GLOBAL MODEL MSP S P 1 B 4 8 R 7 OPTION SIZE OHMIC VALUE TOL. Blank or N (Non inductive winding) 1B 2B 3B The first four digits are significant figures and the last digit specifies the number of zeros to follow. R designates decimal point. B = 0.1 % F=1% G=2% J=5% K = 10 % 1C 2C B= Wirewound C= Metal film Document Number: 50003 Revision: 02-Oct-09 48R70 = 48.7 48701 = 48 700 10002 = 100 000 R0100 = 0.01 R4700 = 0.47 ... 0 F TEMP. COEF. Blank or Applicable only on metal film technologies 1C and 2C: E K3 or H K4 For technical questions, contact: sfer@vishay.com T 2 0 E 3 PACKAGING SPECIAL RoHS S14 = Bag (100 pieces) R10 = Reel (500 pieces) T25 = Tube (70 pieces) T17 = Tube (40 pieces) T20 = Tube (50 pieces) As applicable E3 = Pure tin www.vishay.com 17 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1