Make sure the next Card you purchase has... BU-6474X/6484X/6486X MINI-ACE(R) MARK3/MICRO-ACE(R)*-TE TM (R) FEATURES * Fully Integrated 3.3 or 5.0 Volt, 1553 A/B Notice 2 Terminal * World's First all 3.3 Volt Terminal * Transceiver Power-Down Options * World's Smallest CQFP MIL-STD-1553 Device * 80-pin Ceramic Flat/Gull Wing Package or 324-Ball BGA Package * Enhanced Mini-ACE Architecture * Multiple Configurations: - RT-only, 4K RAM - BC/RT/Monitor, 4K RAM - BC/RT/Monitor, 64K RAM DESCRIPTION The Mini-ACE Mark3 and Micro-ACE-TE are the world's first MIL-STD-1553 terminals which can be powered entirely by +3.3 volts, thus eliminating the need for a +5 volt power supply. With a package body of 0.880 inches square and a gull wing "toe-to-toe" dimension of 1.110 inches, the Mini-ACE Mark3 is the industry's smallest ceramic gull-lead 1553 terminal. At 0.815 inches square, the Micro-ACE-TE (BGA package) provides the smallest industry footprint, enabling its use in applications where PC board space is at a premium. These devices integrate dual 3.3 or 5 volt transceivers, 3.3 or 5.0 volt protocol logic, and either 4K or 64K words of internal RAM. The architecture is identical to that of the Enhanced Mini-ACE, and most features are functionally and software compatible with the previous Mini-ACE (Plus) and ACE generations. A salient feature of the Mini-ACE Mark3 and Micro-ACE-TE is the advanced bus controller architecture. This provides methods to control message scheduling, the means to minimize host overhead for asynchronous message insertion, facilitate bulk data transfers and double buffering, and support various message retry and bus switching strategies. The remote terminal architecture provides flexibility in meeting all common MIL-STD-1553 protocols. The choice of RT data buffering and interrupt options provides robust support for synchronous and asynchronous messaging, while ensuring data sample consistency and supporting bulk data transfers. The monitor mode provides true message monitoring, and supports filtering on an RT address/T-R bit/subaddress basis. The Mini-ACE Mark3 and Micro-ACE-TE incorporate fully autonomous builtin self-tests of internal protocol logic and RAM. The terminals provide the same flexibility in host interface configurations as the ACE/Mini-ACE, along with a reduction in the host processor's worst case holdoff time. Data Device Corporation 105 Wilbur Place Bohemia, New York 11716 631-567-5600 Fax: 631-567-7358 www.ddc-web.com * Supports 1553A/B Notice 2, McAir, STANAG 3838 Protocols * MIL-STD-1553, McAir, and MILSTD-1760 Transceiver Options * Highly Flexible Host Side Interface * Compatible With Mini-ACE and ACE Generations * Highly Autonomous BC with Built-In Message Sequence Controller * Choice of Single, Double, and Circular RT Buffering Options * Selective Message Monitor * Comprehensive Built-In Self-Test * Choice Of 10, 12, 16, or 20 MHz Clock Inputs * Software Libraries and Drivers available for Windows(R) 9x/2000/XP, Windows NT(R), VxWorks(R) and Linux * Available with Full Military Temperature Range and Screening FOR MORE INFORMATION CONTACT: Technical FOR MORESupport: INFORMATION CONTACT: 1-800-DDC-5757 ext. 7771 Technical Support: 1-800-DDC-5757 ext. 7771 * The technology used in DDC's Micro-ACE series of products may be subject to one or more patents pending. All trademarks are the property of their respective owners. (c) 2002 Data Device Corporation Data Device Corporation www.ddc-web.com 2 BU-6474X/6484X/6486X AL-11/12-0 TRANSCEIVER B TRANSCEIVER A DUAL ENCODER/DECODER, MULTIPROTOCOL AND MEMORY MANAGEMENT CLK_IN, TAG_CLK, MSTCLR, SSFLAG/EXT_TRG, TX-INH_A, TX-INH_B, SLEEPIN/UPADDREN INCMD/MCRST RTAD4-RTAD0, RTADP, RTADD_LAT TX/RX_B (Note 2) (1:2.07) TX/RX_B TX/RX_A (Note 2) PROCESSOR AND MEMORY INTERFACE LOGIC ADDRESS BUFFERS ADDRESS BUS A15-A0 D15-D0 INT ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR, 8/16-BIT/DTREQ, POLARITY_SEL/DTACK IOEN, READYD TRANSPARENT/BUFFERED, STRBD, SELECT, RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN, MSB/LSB/DTGRT DATA BUFFERS DATA BUS SHARED RAM (1) FIGURE 1. MINI-ACE MARK3 AND MICRO-ACE-TE BLOCK DIAGRAM Notes: 1. See Ordering Information for Available Memory Options. 2. Transformer-coupled configuration and ratio shown. MISCELLANEOUS RT ADDRESS CH. B CH. A (1:2.07) TX/RX_A Vcc INTERRUPT REQUEST PROCESSOR AND MEMORY CONTROL PROCESSOR ADDRESS BUS PROCESSOR DATA BUS TABLE 1. MINI-ACE MARK3 SERIES SPECIFICATIONS PARAMETER ABSOLUTE MAXIMUM RATING Supply Voltage (Note 12) * Logic +5V * Logic +3.3V * RAM +5V * Transceivers +5V * Transceivers +3.3V (not during transmit) * Transceivers +3.3V (during transmit) Logic * +5V Logic Input Range * +3.3V Logic Input Range MIL-STD-1553 Transceiver Signals * BU-64XXXX3/4 Powered Input Range (Note 17) Unpowered Input Range * BU-64XXXXC/D Powered Input Range (Note 18) Unpowered Input Range MIN RECEIVER Differential Input Resistance (Notes 1-6) +5.0V +3.3V Differential Input Capacitance (Notes 1-6) +5.0V +3.3V Threshold Voltage, Transformer Coupled, Measured on Stub Common-Mode Voltage (Note 7) MAX UNITS -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 6.0 4.1 6.0 7.0 6.0 4.5 V V V V V V -0.3 -0.3 6.0 6.0 V V -5V_XCVR - 0.3 -1.5 5V_XCVR + 0.3 +1.5 V V -3.3V_XCVR - 0.3 -1 3.3V_XCVR + 0.3 +1 V V 2.5 2.0 k k 0.200 TRANSMITTER Differential Output Voltage * Direct Coupled Across 35 , Measured on Bus * Transformer Coupled Across 70 , Measured on Bus BU-64XXXXX-XX0 BU-64XXXXX-XX2 (Note 13) Output Noise, Differential (Direct Coupled) Output Offset Voltage, Transformer Coupled Across 70 Rise/Fall Time BU-64XXXX8/3 BU-64XXXX9/4 25 40 0.860 10 pF pF Vp-p Vpeak 6 7 9 Vp-p 18 20 20 21.5 27 27 10 250 Vp-p Vp-p mVp-p mVp 150 250 300 300 nsec nsec -250 100 200 LOGIC VIH All signals except CLK_IN CLK_IN VIL All signals except CLK_IN CLK_IN Schmidt Hysteresis All signals except CLK_IN CLK_IN IIH, IIL All signals except CLK_IN IIH (Vcc=3.6V, VIN=Vcc) IIH (Vcc=3.6V, VIN=2.7V) IIL (Vcc=3.6V, VIN=0.4V) IIH, IIL All signals except CLK_IN IIH (Vcc=5.25V, Vin=Vcc) IIH (Vcc=5.25V, IIH Vin=2.7V) IIL (Vcc=5.25V, Vin=0.4V) VOH (Vcc=3.0V, VIH=2.7V, VIL=0.2V, IOH=max) VOL (Vcc=3.0V, VIH=2.7V, VIL=0.2V, IOL=max) VOH (Vcc=4.5V, VIH=2.7V, VIL=0.2V, IOH=max) VOL (Vcc=4.5V, VIH=2.7V, VIL=0.2V, IOL=max) Data Device Corporation www.ddc-web.com TYP 2.1 0.8*Vcc V V 0.7 0.2*Vcc 0.4 1.0 V V -10 -350 -350 10 -33 -33 A A A -10 -350 -350 2.4 10 -50 -50 A A A V V V V 0.4 2.4 0.4 3 V V BU-6474X/6484X/6486X AL-11/12-0 TABLE 1. MINI-ACE MARK3 SERIES SPECIFICATIONS (CONT.) PARAMETER MIN LOGIC (CONT.) CLK_IN IIH IIL IOL (Vcc = 4.5V) IOH (Vcc = 4.5V) IOL (Vcc = 3.0V) IOH (Vcc = 3.0V) CI (Input Capacitance) CIO (Bi-directional signal input capacitance) -10 -10 3.4 MAX UNITS 10 10 A A mA mA mA mA pF pF -3.4 2.2 -2.2 50 50 POWER SUPPLY REQUIREMENTS Voltages/Tolerances (Note 12) * Logic +3.3V * Logic +5.0V * RAM +5.0V * Transceivers +3.3V * Transceivers +5.0V Current Drain (Total Hybrid) (Note 14) BU-64743X8/9-XX0, BU-64843X8/9-XX0 (1553&McAir) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64743F/G3/4-XX0, BU-64843F/G3/4-XX0 (1553&McAir) +5V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle * +3.3V (Logic) BU-64745F/G3/4-XX0, BU-64845F/G3/4-XX0 (1553&McAir) +5V (Logic, RAM, Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64745F/G3-XX2, BU-64845F/G3-XX2 (1760) +5V (Logic, RAM, Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64863X8/9-XX0 (1553&McAir) * Idle w/ transceiver SLEEPIN enabled * Idle w/ transceiver SLEEPIN disabled * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64863F/G3/4-XX0 (1553&McAir) +5V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle * +3.3V (Logic, 64K RAM) BU-64743X8-XX2, BU-64843X8-XX2 (1760) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle Data Device Corporation www.ddc-web.com TYP 3.00 4.5 4.5 3.14 4.75 4 3.3 5.0 5.0 3.3 5.0 3.60 5.5 5.5 3.46 5.25 V V V V V 56 246 436 816 95 300 500 900 mA mA mA mA 65 169 273 481 25 100 205 310 520 40 mA mA mA mA mA 116 222 328 540 160 265 370 580 mA mA mA mA 116 233 350 584 160 276 392 625 mA mA mA mA 31 77 267 457 837 69 110 315 515 915 mA mA mA mA mA 65 169 273 481 21 100 205 310 520 55 mA mA mA mA mA 55 216 377 699 95 315 535 975 mA mA mA mA BU-6474X/6484X/6486X AL-11/12-0 TABLE 1. MINI-ACE MARK3 SERIES SPECIFICATIONS (CONT.) PARAMETER POWER SUPPLY REQUIREMENTS (CONT.) BU-64743F/G3-XX2, BU-64843F/G3-XX2 (1760) +5V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle * +3.3V (Logic) BU-64840B3-X02 (1760) +5V (Logic, Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64840B3-X02 (1760) +5V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle * +3.3V (Logic) BU-64863X8-XX2 (1760) * Idle w/ transceiver SLEEPIN enabled * Idle w/ transceiver SLEEPIN disabled * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64863F/G3-XX2 (1760) +5V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle * +3.3V (Logic, 64K RAM) BU-64860B(R)3-X02 (1760) +5V (Logic, 64K RAM, Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64860B(R)3-X02 (1760) +5V (64K RAM, Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle * +3.3V (Logic) MIN BU-64743X0-XX0, BU-64843X0-XX0 (Xcvrless) BU-64863X0-XX0 (Xcvrless) BU-64X43XC/D-XXX * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64863XC/D-XXX * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle Data Device Corporation www.ddc-web.com 5 TYP MAX UNITS 65 180 295 525 25 100 216 332 565 40 mA mA mA mA mA 116 233 350 584 160 276 392 625 mA mA mA mA 65 180 295 525 25 100 216 332 565 40 mA mA mA mA mA 27 76 237 398 720 69 110 330 550 990 mA mA mA mA mA 65 180 295 525 21 100 216 332 565 55 mA mA mA mA mA 116 228 340 563 180 296 412 645 mA mA mA mA 66 174 282 498 25 120 236 352 585 40 mA mA mA mA mA 25 21 40 55 mA mA 25 158 316 608 51 225 399 747 mA mA mA mA 46 179 337 629 66 240 414 762 mA mA mA mA BU-6474X/6484X/6486X AL-11/12-0 TABLE 1. MINI-ACE MARK3 SERIES SPECIFICATIONS (CONT.) PARAMETER POWER DISSIPATION TOTAL HYBRID (NOTES 14 AND 15) BU-64743X8/9-XX0, BU-64843X8/9-XX0 (1553&McAir) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64743F/G3/4-XX0, BU-64843F/G3/4-XX0 (1553&McAir) +3.3V (Logic) +5.0V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64745F/G3/4-XX0, BU-64845F/G3/4-XX0 (1553&McAir) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64745F/G3-XX2, BU-64845F/G3-XX2 (1760) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64863X8/9-XX0 (1553&McAir) * Idle w/ transceiver SLEEPIN enabled * Idle w/ transceiver SLEEPIN disabled * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64863F/G3/4-XX0 (1553&McAir) +3.3V (Logic, 64K RAM) +5.0V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64743X8-XX2, BU-64843X8-XX2 (1760) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64743F/G3-XX2, BU-64843F/G3-XX2 (1760) +3.3V (Logic) +5.0V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64840B3-X02 (1760) +5.0V (Logic, Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64840B3-X02 (1760) +3.3V (Logic) +5.0V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64X43XC/D-XXX * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle Data Device Corporation www.ddc-web.com MIN 6 TYP MAX UNITS 0.18 0.57 0.91 1.58 0.31 0.69 1.04 1.74 W W W W 0.41 0.70 0.94 1.40 0.63 0.85 1.07 1.51 W W W W 0.64 0.93 1.22 1.81 0.88 1.11 1.33 1.97 W W W W 0.64 0.99 1.34 2.04 0.88 1.17 1.46 2.05 W W W W 0.10 0.25 0.62 0.97 1.64 0.23 0.36 0.73 1.09 1.79 W W W W W 0.44 0.74 0.99 1.44 0.68 0.90 1.12 1.56 W W W W 0.18 0.49 0.76 1.31 0.31 0.71 1.08 1.83 W W W W 0.41 0.72 0.97 1.45 0.63 0.86 1.09 1.56 W W W W 0.58 0.87 1.13 1.62 0.80 1.03 1.26 1.73 W W W W 0.41 0.72 0.97 1.45 0.63 0.86 1.09 1.56 W W W W 0.08 0.22 0.32 0.45 0.19 0.33 0.47 0.62 W W W W BU-6474X/6484X/6486X AL-11/12-0 TABLE 1. MINI-ACE MARK3 SERIES SPECIFICATIONS (CONT.) PARAMETER POWER DISSIPATION (CONT) TOTAL HYBRID (NOTES 14 AND 15) BU-64863X8-XX2 (1760) * Idle w/ transceiver SLEEPIN enabled * Idle w/ transceiver SLEEPIN disabled * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64863F/G3-XX2 (1760) +3.3V (Logic, 64K RAM) +5.0V (Ch. A, Ch. B) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64860B(R)3-X02 (1760) +5.0V (Logic, Ch. A, Ch. B, 64K RAM) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64860B(R)3-X02 (1760) +3.3V (Logic) +5.0V (Ch. A, Ch. B, 64K RAM) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64743X0-XX0, BU-64843X0-XX0 (Xcvrless) BU-64863X0-XX0 (Xcvrless) BU-64863XC/D-XXX * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle HOTTEST DIE BU-64XXXX8/9-XX0 (1553&McAir) * Idle w/ transceiver SLEEPIN enabled (BU-64863 only) * Idle w/ transceiver SLEEPIN disabled * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64XXXX3/4-XX0 (1553&McAir) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle BU-64XXXX8-XX2 (1760) * Idle w/ transceiver SLEEPIN enabled (BU-64863 only) * Idle w/ transceiver SLEEPIN disabled * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle HOTTEST DIE BU-64XXXX3-XX2 (1760) * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle MIN BU-64XX3X0-XX0 (Xcvrless) BU-64XX3XC/D-XXX * Idle * 25% Duty Transmitter Cycle * 50% Duty Transmitter Cycle * 100% Duty Transmitter Cycle Data Device Corporation www.ddc-web.com 7 TYP MAX UNITS 0.09 0.25 0.53 0.93 1.36 0.23 0.36 0.74 1.12 1.87 W W W W W 0.44 0.76 1.01 1.50 0.68 0.91 1.14 1.61 W W W W 0.64 0.87 1.12 1.60 0.90 1.13 1.36 1.83 W W W W 0.40 0.71 0.95 1.41 0.08 0.07 0.73 0.96 1.19 1.66 0.132 0.182 W W W W W W 0.15 0.29 0.39 0.52 0.24 0.38 0.52 0.67 W W W W 0.01 0.05 0.39 0.72 1.38 0.02 0.09 0.47 0.82 1.52 W W W W W 0.16 0.39 0.61 1.06 0.25 0.47 0.69 1.13 W W W W 0.01 0.05 0.39 0.60 1.15 0.02 0.09 0.49 0.85 1.61 W W W W W 0.16 0.40 0.63 1.11 0.25 0.48 0.71 1.18 W W W W 0.08 0.13 W 0.07 0.20 0.30 0.42 0.11 0.25 0.39 0.54 W W W W BU-6474X/6484X/6486X AL-11/12-0 TABLE 1. MINI-ACE MARK3 SERIES SPECIFICATIONS (CONT.) PARAMETER CLOCK INPUT * Frequency: Nominal Values Default Mode Option Option Option * Long Term Tolerance 1553A Compliance 1553B Compliance * Short Term Tolerance, 1 second 1553A Compliance 1553B Compliance Duty Cycle 1553 MESSAGE TIMING Completion of CPU Write (BC Start)-to-Start of First Message for Non-enhanced BC Mode MIN -0.01 -0.10 % % -0.001 -0.01 40 0.001 0.01 60 % % % 2.5 s 9.5 10 to 10.5 s s 18.0 22.5 50.5 129.5 19.5 23.5 51.5 131 s s s s 7 s s 11 C/W 15 C/W +125 +85 +70 +100 +150 C C C C C 660.5 THERMAL FLAT PACK/GULL WING 80-pin Ceramic Package Thermal Resistance, Junction-to-Case, Hottest Die (JC) Note 16 9 MICRO-ACE-TE BGA 324-ball BGA Package (see Thermal Management section Junction-to-Balls, Hottest Die (JB) -55 -40 0 -40 -65 SOLDERING/MOUNTING FLAT PACK/GULL WING Lead Temperature (soldering, 10 sec.) 324-BALL BGA PACKAGE The reflow profile detailed in IPC/JEDEC J-STD-020 is applicable for both leaded and lead-free products Refer to DDC's Application Note #A/N49 "BGA User's Guide" for additional important mounting information. PHYSICAL CHARACTERISTICS Package Body Size 80-pin Ceramic Flat pack or Gull Wing 324-ball BGA Micro-ACE-TE Moisture Sensitivity Level Electrostatic Discharge Sensitivity +300 C +245 C 0.880 X 0.880 X 0.13 (22.35 X 22.35 X 3.3) 0.815 X 0.815 X 0.12 (20.7 X 20.7 X 3.05) in. (mm) in. (mm) MSL-3 ESD Class 0 Lead Toe-to-Toe Distance 80-pin Gull Wing Weight 80-pin Ceramic Flat pack or Gull Wing 324-ball BGA Data Device Corporation www.ddc-web.com MHz MHz MHz MHz 4 ALL PACKAGES Operating Case/Ball Temperature -1XX, -4XX -2XX, -5XX -3XX, -8XX -EXX Storage Temperature UNITS 0.01 0.10 17.5 21.5 49.5 127 RT Response Time (mid-parity to mid-sync) (Note 11) Transmitter Watchdog Timeout MAX 16.0 12.0 10.0 20.0 BC Intermessage Gap (Note 8) Non-enhanced (Mini-ACE compatible) BC mode Enhanced BC mode (Note 9) BC/RT/MT Response Timeout (Note 10) * 18.5 nominal * 22.5 nominal * 50.5 nominal * 128.0 nominal TYP 8 1.110 (28.194) in. (mm) 0.353 (10) .088 (2.5) oz (g) oz (g) BU-6474X/6484X/6486X AL-11/12-0 TABLE 1 Notes: Notes 1 through 6 are applicable to the Receiver Differential Resistance and Receiver Differential Input Capacitance specifications: (1) Specifications include both transmitter and receiver (tied together internally). (2) Impedance parameters are specified directly between pins TX/ RX_A(B) and TX/RX_A(B) of the Mini-ACE Mark3 hybrid. (3) It is assumed that all power and ground inputs to the hybrid are connected. (4) The specifications are applicable for both unpowered and powered conditions. (5) The specifications assume a 2 volt rms balanced, differential, sinusoidal input. The applicable frequency range is 75 kHz to 1 MHz. (6) Minimum resistance and maximum capacitance parameters are guaranteed over the operating range, but are not tested. (7) Assumes a common-mode voltage within the frequency range of dc to 2 MHz, applied to pins of the isolation transformer on the stub side (either direct or transformer coupled), and referenced to hybrid ground. Transformer must be a DDC recommended transformer or other transformer that provides an equivalent minimum CMRR. (8) Typical value for minimum intermessage gap time. Under software control, this may be lengthened (to 65,535 ms - message time) in increments of 1 s. If ENHANCED CPU ACCESS, bit 14 of Configuration Register #6, is set to logic "1", then host accesses during BC Start-of-Message (SOM) and End-of-Message (EOM) transfer sequences could have the effect of lengthening the intermessage gap time. For each host access during an SOM or EOM sequence, the intermessage gap time will be lengthened by 6 clock cycles. Since there are 7 internal transfers during SOM and 5 during EOM, this could theoretically lengthen the intermessage gap by up to 72 clock cycles; i.e., up to 7.2 ms with a 10 MHz clock, 6.0 s with a 12 MHz clock, 4.5 s with a 16 MHz clock, or 3.6 s with a 20 MHz clock. (9) For Enhanced BC mode, the typical value for intermessage gap time is approximately 10 clock cycles longer than for the nonenhanced BC mode. That is, an addition of 1.0 s at 10 MHz, 833 ns at 12 MHz, 625 ns at 16 MHz, or 500 ns at 20 MHz. TABLE 1 Notes (Cont.): (10)Software programmable (4 options). Includes RT-to-RT Timeout (measured mid-parity of transmit Command Word to mid-sync of transmitting RT Status Word). (11)Measured from mid-parity crossing of Command Word to mid-sync crossing of RT's Status Word. (12)External 10 F tantalum and 0.1 F capacitors should be located as close as possible to the voltage input pins/balls. (13)MIL-STD-1760 requires a 20 Vp-p minimum output on the stub connection. (14)Current drain and power dissipation specs are preliminary and subject to change. (15)Power dissipation is the input power minus the power delivered to the 1553 fault isolation resistors, the power delivered to the bus termination resistors, and the copper losses in the transceiver isolation transformer and the bus coupling transformer. An illustration of external power dissipation for transformer coupled configuration (while transmitting) is: 0.14 watts for the active isolation transformer, 0.08 watts for the active bus coupling transformer, 0.45 watts for each of the two bus isolation resistors and 0.15 watts for each of the two bus termination resistors. (16)JC is measured to bottom of ceramic case. (17)Assuming the use of isolation transformers with the turns ratios shown in Figure 16 and in the absence of common mode signal on the 1553 stub, this equates to a nominal stub voltage of 38 VoltsPKto-PK transformer-coupled, or 53 VoltsPK-to-PK direct-coupled. (18)Assuming the use of isolation transformers with the turns ratios shown in Figure 16 and in the absence of common mode signal on the 1553 stub, this equates to a nominal stub voltage of 29.8 VoltsPK-to-PK transformer-coupled, or 38.2 VoltsPK-to-PK direct-coupled." Data Device Corporation www.ddc-web.com INTRODUCTION The Mini-ACE Mark3 is the world's first MIL-STD-1553 terminal which can be powered entirely by 3.3 volts, thus eliminating the need for a 5 volt power supply. The BU-6474X RT only, and BU-6484X/6486X BC/RT/MT Mini-ACE Mark3 family of MILSTD-1553 terminals comprise a complete integrated interface between a host processor and a MIL-STD-1553 bus. The Mini-ACE Mark3 is available in a 0.88 square inch flat pack or gull wing package with a "toe-to-toe" dimension of 1.110 inches, as well as a 324ball BGA. The Mini-ACE Mark3 is the industry's smallest ceramic gull-lead 1553 terminal, enabling its use in applications where PC board space is at a premium. At 0.815 inches square, the MicroACE-TE provides the smallest MIL-STD-1553 footprint in the industry. The Mark3's architecture is identical to that of the Enhanced Mini-ACE, and most features are functionally and software compatible with the previous Mini-ACE (Plus) and ACE generations. The Mini-ACE Mark3 provides complete multiprotocol support of MIL-STD-1553A/B/McAir and STANAG 3838. The Mark3 integrates dual transceiver, protocol logic, and either 4K or 64K words of internal RAM. The BU-6486X BC/RT/MT terminal includes 64K words of internal RAM, with built-in parity checking. The Mini-ACE Mark3 includes dual 3.3 volt or 5.0 volt voltage source transceivers for improved line driving capability, with options for MIL-STD-1760 and McAir compatibility. Mark3 versions with 64K x 17 RAM and all versions of the Micro-ACE-TE with the 8/9 transceiver option offer an additional transceiver power-down (SLEEPIN) option to further reduce device power consumption. To provide further flexibility, the Mini-ACE Mark3 may operate with a choice of 10, 12, 16, or 20 MHz clock inputs. One of the new salient features of the Mark3 is its Enhanced bus controller architecture. The Enhanced BC's highly autonomous message sequence control engine provides a means for offloading the host processor for implementing multiframe message scheduling, message retry schemes, data double buffering, and asynchronous message insertion. For the purpose of performing messaging to the host processor, the Enhanced BC mode includes a General Purpose Queue, along with user-defined interrupts. A second major new feature of the Mark3 is the incorporation of a fully autonomous built-in self-test. This test provides comprehensive testing of the internal protocol logic. A separate test verifies the operation of the internal RAM. Since the self-tests are fully autonomous, they eliminate the need for the host to write and read stimulus and response vectors. The Mini-ACE Mark3 RT offers the same choices of single, double, and circular buffering for individual subaddresses as the ACE, Mini-ACE (Plus) and Enhanced Mini-ACE. New enhancements to the RT architecture include a global circular buffering option for multiple (or all) receive subaddresses, a 50% rollover interrupt for circular buffers, an interrupt status queue for logging up to 32 interrupt events, and an option to automatically initialize 9 BU-6474X/6484X/6486X AL-11/12-0 to RT mode with the Busy bit set. The interrupt status queue and 50% rollover interrupt features are also included as improvements to the Mark3's Monitor architecture. teristics of standard production units. Internal daisy chain interconnections are made by copper PWB traces. TRANSCEIVERLESS "COMPATIBLE" VERSION OF MICRO-ACE-TE To minimize board space and "glue" logic, the Mini-ACE Mark3 terminals provide the same wide choice of host interface configurations as the ACE, Mini-ACE (Plus) and Enhanced MiniACE. This includes support of interfaces to 16-bit or 8-bit processors, memory or port type interfaces, and multiplexed or nonmultiplexed address/data buses. In addition, with respect to ACE/ Mini-ACE (Plus), the worst case processor wait time has been significantly reduced. For example, assuming a 16 MHz clock, this time has been reduced from 2.8 s to 632 ns for read accesses, and to 570 ns for write accesses. All versions of the Micro-ACE-TE, 324-ball BGA are transceiverless "Compatible". These devices contain fully functional, dualredundant, MIL-STD-1553 transceivers with internal / intermediate connections brought out to balls. These intermediate connections allow devices to be used in transceiverless mode for direct interfacing to MIL-STD-1773 (fiber optic) transceivers. Mandatory Additional Connections (See TABLE 59) are required if these devices are not utilized in their transceiverless mode. BU-61860E3 +5.0V -ACE (MICRO-ACE) & TRANSFORMER EVALUATION BOARD The Mini-ACE Mark3 series terminals operate over the full military temperature range of -55 to +125C and are available screened to MIL-PRF-38534C. The terminals are ideal for military and industrial processor-to-1553 applications powered by 3.3 volts only. The BU-61860E3 board is intended to support customers who are interested in electrically connecting and evaluating the performance of +5.0V Enhanced Mini-ACE and/or +5.0V -ACE series of products. The user will be able to quickly perform functional tests and run their system software utilizing this relatively small (2.0" x 2.5") evaluation board. MICRO-ACE-TE IN SIMPLE SYSTEM RT (SSRT) MODE The Micro-ACE-TE with 4K RAM (BU-64843B(R)8), MILSTD-1553 terminal can provide a complete interface between a simple system and a MIL-STD-1553 bus when configured as an SSRT. These terminals integrate dual transceiver, protocol logic, and a FIFO memory for received messages in a 324-ball BGA. The internal architecture is identical to that of the original BU-61703/61705 Simple System RT (SSRT). The BU-61860E3 (see FIGURE 19) consists of a PC board incorporating a +5.0V -ACE (BU-61860B3, BC / RT / MT with 64K x 17 RAM), necessary decoupling capacitors, and associated isolation transformers. The MIL-STD-1760 outputs are user configurable as either Stub (transformer) or Direct coupling. The board supports the signal fan-out (see TABLE 72) of the +5.0V -ACE to 112 pins subdivided into (4) dual inline, berg type pin rows. These pins (0.025" square max) and their row placement adhere to standard 0.100" vector board spacing. The SSRT configured Micro-ACE-TE incorporates a built-in selftest (BIT). This BIT, which is processed following power turn-on or after receipt of an Initiate self-test mode command, provides a comprehensive test of the encoders, decoders, protocol, transmitter watchdog timer, and protocol section. The SSRT configured, Micro-ACE-TE also includes an auto-configuration feature. BU-64863E8 MINI-ACE MARK3 (+3.3V) & TRANSFORMER EVALUATION BOARD The BU-64863E8 board is intended to support customers who are interested in electrically connecting and evaluating the performance of the +3.3V Mini-ACE Mark3 and/or +3.3V MicroACE-TE series of products. The user will be able to quickly perform functional tests and run their system software utilizing this relatively small (2.0" x 2.5") evaluation board. The Micro-ACE-TE when configured as an SSRT is ideal for munitions stores and other simple systems that do not require a microprocessor. To streamline the interface to simple systems it includes an internal 32-word FIFO for received data words. This serves to ensure that only complete, consistent blocks of validated data words are transferred to a system. The BU-64863E8 (see FIGURE 20) consists of a PC board incorporating a +3.3V Mini-ACE Mark3 (BU-64863G8, BC / RT / MT with 64K x 17 RAM), necessary decoupling capacitors, and associated isolation transformers. The MIL-STD-1553 outputs have been factory configured for Stub (transformer) coupling. The board supports the signal fan-out (see TABLE 71) of the +3.3V Mini-ACE Mark3 to 112 pins subdivided into (4) dual inline, berg type pin rows. These pins (0.025" square max) and their row placement adhere to standard 0.100" vector board spacing. Detailed SSRT configuration information can be found in Application Note AN/B-37. TEST COMPONENTS Daisy chain mechanical samples of the Micro-ACE-TE, 324-ball BGA (BU-64863B8-600) are available. These are used to verify both the electrical and mechanical integrity of the solder joints between the BGA package and the board. Ball pairs are internally wired so that the user can test for electrical continuity between balls. Refer to TABLE 70 for interconnection details. TRANSCEIVERS The transceivers in the Mini-ACE Mark3 series terminals are fully monolithic, requiring only a +3.3 or 5.0 volt power input. The transmitters are voltage sources, providing improved line driving capa- Although these units are inert, they are fully populated with silicon die so that they closely match the thermal and mechanical characData Device Corporation www.ddc-web.com 10 BU-6474X/6484X/6486X AL-11/12-0 INTERNAL REGISTERS bility over current sources. This serves to improve performance on long buses with many taps. Mark3 versions with 64K x 17 RAM and all versions of tthe Micro-ACE-TE with the 8/9 transceiver option offer an additional transceiver power-down (SLEEPIN) option to further reduce device power consumption. The transmitters also offer an option that satisfies the MIL-STD-1760 requirement for a minimum of 20 volts peak-to-peak, transformer coupled output. The address mapping for the Mini-ACE Mark3 registers is illustrated in TABLE 2. TABLE 2. ADDRESS MAPPING ADDRESS LINES A4 A3 A2 A1 A0 Besides eliminating the demand for an additional power supply, the use of a +3.3 volt only transceiver (5.0 volt available) requires the use of a step-up, rather than a step-down, isolation transformer. This provides the advantage of a higher terminal input impedance than is possible for a 15V, 12V or 5V transmitter. As a result, there is a greater margin for the input impedance test, mandated for the 1553 validation test. This allows for longer cable lengths between a system connector and the isolation transformers of an embedded 1553 terminal. REGISTER DESCRIPTION/ACCESSIBILITY 0 0 0 0 0 Interrupt Mask Register #1 (RD/WR) 0 0 0 0 1 Configuration Register #1 (RD/WR) 0 0 0 1 0 Configuration Register #2 (RD/WR) 0 0 0 1 1 Start/Reset Register (WR) 0 0 0 1 1 Non-Enhanced BC/RT Command Stack Pointer / Enhanced BC Instruction List Pointer Register (RD) 0 0 1 0 0 BC Control Word / RT Subaddress Control Word Register (RD/WR) To provide compatibility to McAir specs, the Mini-ACE Mark3 is available with an option for transmitters with increased rise and fall times. 0 0 1 0 1 Time Tag Register (RD/WR) 0 0 1 1 0 Interrupt Status Register #1 (RD) 0 0 1 1 1 Configuration Register #3 (RD/WR) The receiver sections of the Mini-ACE Mark3 are fully compliant with MIL-STD-1553B Notice 2 in terms of front end overvoltage protection, threshold, common-mode rejection, and word error rate. 0 1 0 0 0 Configuration Register #4 (RD/WR) 0 1 0 0 1 Configuration Register #5 (RD/WR) 0 1 0 1 0 RT / Monitor Data Stack Address Register (RD) 0 1 0 1 1 BC Frame Time Remaining Register (RD) REGISTER AND MEMORY ADDRESSING 0 1 1 0 0 BC Time Remaining to Next Message Register (RD) 0 1 1 0 1 Non-Enhanced BC Frame Time / Enhanced BC Initial Instruction Pointer / RT Last Command / MT Trigger Word Register (RD/WR) 0 1 1 1 0 RT Status Word Register (RD) 0 1 1 1 1 RT BIT Word Register (RD) 1 0 0 0 0 Test Mode Register 0 1 0 0 0 1 Test Mode Register 1 1 0 0 1 0 Test Mode Register 2 1 0 0 1 1 Test Mode Register 3 1 0 1 0 0 Test Mode Register 4 1 0 1 0 1 Test Mode Register 5 1 0 1 1 0 Test Mode Register 6 1 0 1 1 1 Test Mode Register 7 1 1 0 0 0 Configuration Register #6 (RD/WR) 1 1 0 0 1 Configuration Register #7 (RD/WR) 1 1 0 1 0 RESERVED 1 1 0 1 1 BC Condition Code Register (RD) 1 1 0 1 1 BC General Purpose Flag Register (WR) 1 1 1 0 0 BIT Test Status Register (RD) 1 1 1 0 1 Interrupt Mask Register #2 (RD/WR) 1 1 1 1 0 Interrupt Status Register #2 (RD) 1 1 1 1 1 BC General Purpose Queue Pointer / RT-MT Interrupt Status Queue Pointer Register (RD/ WR) The software interface of the Mini-ACE Mark3 to the host processor consists of 24 internal operational registers for normal operation, an additional 24 test registers, plus 64K words of shared memory address space. The Mini-ACE Mark3's 4K X 16 or 64K X 17 internal RAM resides in this address space. For normal operation, the host processor only needs to access the lower 32 register address locations (00-1F). The next 32 locations (20-3F) should be reserved, since many of these are used for factory test. Data Device Corporation www.ddc-web.com 11 BU-6474X/6484X/6486X AL-11/12-0 TABLE 3. INTERRUPT MASK REGISTER #1 (READ/WRITE 00H) BIT DESCRIPTION 15(MSB) RESERVED 14 RAM PARITY ERROR 13 BC/RT TRANSMITTER TIMEOUT 12 BC/RT COMMAND STACK ROLLOVER 11 MT COMMAND STACK ROLLOVER 10 MT DATA STACK ROLLOVER 9 HANDSHAKE FAIL 8 BC RETRY 7 RT ADDRESS PARITY ERROR 6 TIME TAG ROLLOVER 5 RT CIRCULAR BUFFER ROLLOVER 4 BC CONTROL WORD/RT SUBADDRESS CONTROL WORD EOM 3 BC END OF FRAME 2 FORMAT ERROR 1 BC STATUS SET/RT MODE CODE/MT PATTERN TRIGGER 0(LSB) END OF MESSAGE TABLE 4. CONFIGURATION REGISTER #1 (READ/WRITE 01H) BIT BC FUNCTION (Bits 11-0 Enhanced Mode Only) RT WITHOUT ALTERNATE STATUS RT WITH ALTERNATE MONITOR FUNCTION STATUS (Enhanced Only) (Enhanced mode only bits 12-0) 15 (MSB) RT/BC-MT (logic 0) (logic 1) (logic 1) (logic 0) 14 MT/BC-RT (logic 0) (logic 0) (logic 0) (logic 1) 13 CURRENT AREA B/A CURRENT AREA B/A CURRENT AREA B/A CURRENT AREA B/A 12 MESSAGE STOP-ON-ERROR MESSAGE MONITOR ENABLED (MMT) MESSAGE MONITOR ENABLED MESSAGE MONITOR ENABLED 11 FRAME STOP-ON-ERROR DYNAMIC BUS CONTROL ACCEPTANCE S10 TRIGGER WORD ENABLED 10 STATUS SET STOP-ON-MESSAGE BUSY S09 START-ON-TRIGGER 9 STATUS SET STOP-ON-FRAME SERVICE REQUEST S08 STOP-ON-TRIGGER 8 FRAME AUTO-REPEAT SSFLAG S07 NOT USED 7 EXTERNAL TRIGGER ENABLED RTFLAG (Enhanced Mode Only) S06 EXTERNAL TRIGGER ENABLED 6 INTERNAL TRIGGER ENABLED NOT USED S05 NOT USED 5 INTERMESSAGE GAP TIMER ENABLED NOT USED S04 NOT USED 4 RETRY ENABLED NOT USED S03 NOT USED 3 DOUBLED/SINGLE RETRY NOT USED S02 NOT USED 2 BC ENABLED (Read Only) NOT USED S01 MONITOR ENABLED (Read Only) 1 BC FRAME IN PROGRESS (Read Only) NOT USED S00 MONITOR TRIGGERED (Read Only) 0 (LSB) BC MESSAGE IN PROGRESS (Read Only) RT MESSAGE IN PROGRESS (Enhanced mode only, Read Only) RT MESSAGE IN PROGRESS (Read Only) MONITOR ACTIVE (Read Only) Data Device Corporation www.ddc-web.com 12 BU-6474X/6484X/6486X AL-11/12-0 TABLE 5. CONFIGURATION REGISTER #2 (READ/WRITE 02H) BIT TABLE 8. BC CONTROL WORD REGISTER (READ/WRITE 04H) DESCRIPTION BIT 14 RAM PARITY ENABLE 13 BUSY LOOKUP TABLE ENABLE 12 RX SA DOUBLE BUFFER ENABLE 11 OVERWRITE INVALID DATA 10 256-WORD BOUNDARY DISABLE 9 TIME TAG RESOLUTION 2 8 TIME TAG RESOLUTION 1 7 TIME TAG RESOLUTION 0 6 CLEAR TIME TAG ON SYNCHRONIZE 5 LOAD TIME TAG ON SYNCHRONIZE 4 DESCRIPTION TRANSMIT TIME TAG FOR SYNCHRONIZE MODE 15(MSB) COMMAND 15(MSB) ENHANCED INTERRUPTS 14 MESSAGE ERROR MASK 13 SERVICE REQUEST BIT MASK 12 BUSY BIT MASK 11 SUBSYSTEM FLAG BIT MASK 10 TERMINAL FLAG BIT MASK 9 RESERVED BITS MASK 8 RETRY ENABLED 7 BUS CHANNEL A/B 6 OFF-LINE SELF-TEST 5 MASK BROADCAST BIT INTERRUPT STATUS AUTO CLEAR 4 EOM INTERRUPT ENABLE 3 LEVEL/PULSE INTERRUPT REQUEST 3 1553A/B SELECT 2 CLEAR SERVICE REQUEST 2 MODE CODE FORMAT 1 ENHANCED RT MEMORY MANAGEMENT 1 BROADCAST FORMAT 0(LSB) SEPARATE BROADCAST DATA 0(LSB) RT-to-RT FORMAT TABLE 9. RT SUBADDRESS CONTROL WORD (READ/WRITE 04H) TABLE 6. START/RESET REGISTER (WRITE 03H) BIT BIT DESCRIPTION DESCRIPTION 15(MSB) RX: DOUBLE BUFFER ENABLE 15(MSB) RESERVED 14 TX: EOM INT 13 TX: CIRC BUF INT 12 TX: MEMORY MANAGEMENT 2 (MM2) RESERVED 11 TX: MEMORY MANAGEMENT 1 (MM1) 11 CLEAR RT HALT 10 TX: MEMORY MANAGEMENT 0 (MM0) 10 CLEAR SELF-TEST REGISTER 9 RX: EOM INT INITIATE RAM SELF-TEST 8 RX: CIRC BUF INT 7 RX: MEMORY MANAGEMENT 2 (MM2) 6 RX: MEMORY MANAGEMENT 1 (MM1) 5 RX: MEMORY MANAGEMENT 0 (MM0) 4 BCST: EOM INT 14 RESERVED 13 RESERVED 12 9 8 RESERVED 7 INITIATE PROTOCOL SELF-TEST 6 BC/MT STOP-ON-MESSAGE 5 BC STOP-ON-FRAME 3 BCST: CIRC BUF INT 4 TIME TAG TEST CLOCK 2 BCST: MEMORY MANAGEMENT 2 (MM2) 3 TIME TAG RESET 1 BCST: MEMORY MANAGEMENT 1 (MM1) 2 INTERRUPT RESET 0(LSB) BCST: MEMORY MANAGEMENT 0 (MM0) 1 BC/MT START 0(LSB) RESET TABLE 10. TIME TAG REGISTER (READ/WRITE 05H) TABLE 7. BC/RT COMMAND STACK POINTER REG. (READ 03H) BIT DESCRIPTION BIT 15(MSB) COMMAND STACK POINTER 15 DESCRIPTION 15(MSB) TIME TAG 15 * * * * * * * * * 0(LSB) * * 0(LSB) COMMAND STACK POINTER 0 Data Device Corporation www.ddc-web.com 13 * TIME TAG 0 BU-6474X/6484X/6486X AL-11/12-0 TABLE 13. CONFIGURATION REGISTER #4 (READ/WRITE 08H) TABLE 11. INTERRUPT STATUS REGISTER #1 (READ 06H) BIT DESCRIPTION BIT DESCRIPTION 15(MSB) MASTER INTERRUPT 15(MSB) EXTERNAL BIT WORD ENABLE 14 RAM PARITY ERROR 14 INHIBIT BIT WORD IF BUSY 13 TRANSMITTER TIMEOUT 13 MODE COMMAND OVERRIDE BUSY 12 BC/RT COMMAND STACK ROLLOVER 12 EXPANDED BC CONTROL WORD ENABLE 11 MT COMMAND STACK ROLLOVER 11 BROADCAST MASK ENA/XOR 10 MT DATA STACK ROLLOVER 10 RETRY IF -A AND M.E. 9 HANDSHAKE FAIL 9 RETRY IF STATUS SET 8 BC RETRY 8 1ST RETRY ALT/SAME BUS 7 RT ADDRESS PARITY ERROR 7 2ND RETRY ALT/SAME BUS 6 TIME TAG ROLLOVER 6 VALID M.E./NO DATA 5 RT CIRCULAR BUFFER ROLLOVER 5 VALID BUSY/NO DATA 4 BC CONTROL WORD/RT SUBADDRESS CONTROL WORD EOM 4 MT TAG GAP OPTION 3 LATCH RT ADDRESS WITH CONFIG #5 2 TEST MODE 2 1 TEST MODE 1 0(LSB) TEST MODE 0 3 BC END OF FRAME 2 FORMAT ERROR 1 BC STATUS SET / RT MODE CODE / MT PATTERN TRIGGER 0(LSB) END OF MESSAGE TABLE 14. CONFIGURATION REGISTER #5 (READ/WRITE 09H) BIT DESCRIPTION 15(MSB) 12 / 16 MHZ CLOCK SELECT TABLE 12. CONFIGURATION REGISTER #3 (READ/WRITE 07H) 14 SINGLE-ENDED SELECT 13 EXTERNAL TX INHIBIT A 12 EXTERNAL TX INHIBIT B 15(MSB) ENHANCED MODE ENABLE 11 EXPANDED CROSSING ENABLED 14 BC/RT COMMAND STACK SIZE 1 10 RESPONSE TIMEOUT SELECT 1 13 BC/RT COMMAND STACK SIZE 0 9 RESPONSE TIMEOUT SELECT 0 12 MT COMMAND STACK SIZE 1 8 GAP CHECK ENABLED 11 MT COMMAND STACK SIZE 0 7 BROADCAST DISABLED 10 MT DATA STACK SIZE 2 6 RT ADDRESS LATCH/TRANSPARENT 9 MT DATA STACK SIZE 1 5 RT ADDRESS 4 8 MT DATA STACK SIZE 0 4 RT ADDRESS 3 7 ILLEGALIZATION DISABLED 3 RT ADDRESS 2 6 OVERRIDE MODE T/R ERROR 2 RT ADDRESS 1 5 ALTERNATE STATUS WORD ENABLE 4 ILLEGAL RX TRANSFER DISABLE 1 RT ADDRESS 0 3 BUSY RX TRANSFER DISABLE 0(LSB) RT ADDRESS PARITY 2 RTFAIL / RTFLAG WRAP ENABLE 1 1553A MODE CODES ENABLE 0(LSB) ENHANCED MODE CODE HANDLING BIT DESCRIPTION TABLE 15. RT / MONITOR DATA STACK ADDRESS REGISTER (READ/WRITE 0AH) BIT DESCRIPTION 15(MSB) RT / MONITOR DATA STACK ADDRESS 15 * * * * * 0(LSB) Data Device Corporation www.ddc-web.com 14 * RT / MONITOR DATA STACK ADDRESS 0 BU-6474X/6484X/6486X AL-11/12-0 TABLE 16. BC FRAME TIME REMAINING REGISTER (READ/WRITE 0BH) BIT TABLE 20. RT BIT WORD REGISTER (READ 0FH) DESCRIPTION BIT DESCRIPTION 15(MSB) TRANSMITTER TIMEOUT * * 14 LOOP TEST FAILURE B * * 13 LOOP TEST FAILURE A * 12 HANDSHAKE FAILURE 11 TRANSMITTER SHUTDOWN B 10 TRANSMITTER SHUTDOWN A 9 TERMINAL FLAG INHIBITED 8 BIT TEST FAIL 7 HIGH WORD COUNT 6 LOW WORD COUNT 5 INCORRECT SYNC RECEIVED 4 PARITY / MANCHESTER ERROR RECEIVED 3 RT-to-RT GAP / SYNC / ADDRESS ERROR 2 RT-to-RT NO RESPONSE ERROR 1 RT-to-RT 2ND COMMAND WORD ERROR 0(LSB) COMMAND WORD CONTENTS ERROR 15(MSB) BC FRAME TIME REMAINING 15 * 0(LSB) BC FRAME TIME REMAINING 0 Note: resolution = 100 s per LSB TABLE 17. BC MESSAGE TIME REMAINING REGISTER (READ/WRITE 0CH) BIT DESCRIPTION 15(MSB) BC MESSAGE TIME REMAINING 15 * * * * * * 0(LSB) BC MESSAGE TIME REMAINING 0 Note: resolution = 1 s per LSB TABLE 18. BC FRAME TIME / RT LAST COMMAND / MT TRIGGER REGISTER (READ/WRITE 0DH) BIT TABLE 21. CONFIGURATION REGISTER #6 (READ/WRITE 18H) DESCRIPTION BIT 15(MSB) BIT 15 DESCRIPTION 15(MSB) ENHANCED BUS CONTROLLER * * 14 ENHANCED CPU ACCESS * * 13 * * COMMAND STACK POINTER INCREMENT ON EOM (RT, MT) 12 GLOBAL CIRCULAR BUFFER ENABLE 11 GLOBAL CIRCULAR BUFFER SIZE 2 10 GLOBAL CIRCULAR BUFFER SIZE 1 9 GLOBAL CIRCULAR BUFFER SIZE 0 8 DISABLE INVALID MESSAGES TO INTERRUPT STATUS QUEUE 7 DISABLE VALID MESSAGES TO INTERRUPT STATUS QUEUE 6 INTERRUPT STATUS QUEUE ENABLE 5 RT ADDRESS SOURCE 4 ENHANCED MESSAGE MONITOR 3 RESERVED 2 64-WORD REGISTER SPACE 1 CLOCK SELECT 1 0(LSB) CLOCK SELECT 0 0(LSB) BIT 0 TABLE 19. RT STATUS WORD REGISTER (READ/WRITE 0EH) BIT DESCRIPTION 15(MSB) LOGIC "0" 14 LOGIC "0" 13 LOGIC "0" 12 LOGIC "0" 11 LOGIC "0" 10 MESSAGE ERROR 9 INSTRUMENTATION 8 SERVICE REQUEST 7 RESERVED 6 RESERVED 5 RESERVED 4 BROADCAST COMMAND RECEIVED 3 BUSY 2 SSFLAG 1 DYNAMIC BUS CONTROL ACCEPT 0(LSB) TERMINAL FLAG Data Device Corporation www.ddc-web.com 15 BU-6474X/6484X/6486X AL-11/12-0 TABLE 22. CONFIGURATION REGISTER #7 (READ/WRITE 19H) BIT TABLE 24. BC GENERAL PURPOSE FLAG REGISTER (WRITE 1BH) DESCRIPTION BIT DESCRIPTION 15(MSB) MEMORY MANAGEMENT BASE ADDRESS 15 15(MSB) CLEAR GENERAL PURPOSE FLAG 7 14 MEMORY MANAGEMENT BASE ADDRESS 14 14 CLEAR GENERAL PURPOSE FLAG 6 13 MEMORY MANAGEMENT BASE ADDRESS 13 13 CLEAR GENERAL PURPOSE FLAG 5 12 MEMORY MANAGEMENT BASE ADDRESS 12 12 CLEAR GENERAL PURPOSE FLAG 4 11 MEMORY MANAGEMENT BASE ADDRESS 11 11 CLEAR GENERAL PURPOSE FLAG 3 10 MEMORY MANAGEMENT BASE ADDRESS 10 10 CLEAR GENERAL PURPOSE FLAG 2 9 RESERVED 9 CLEAR GENERAL PURPOSE FLAG 1 8 RESERVED 8 CLEAR GENERAL PURPOSE FLAG 0 7 RESERVED 7 SET GENERAL PURPOSE FLAG 7 6 RESERVED 6 SET GENERAL PURPOSE FLAG 6 5 RESERVED 5 SET GENERAL PURPOSE FLAG 5 4 RT HALT ENABLE 4 SET GENERAL PURPOSE FLAG 4 3 1553B RESPONSE TIME 3 SET GENERAL PURPOSE FLAG 3 2 ENHANCED TIMETAG SYNCHRONIZE 2 SET GENERAL PURPOSE FLAG 2 1 ENHANCED BC WATCHDOG TIMER ENABLED 1 SET GENERAL PURPOSE FLAG 1 0(LSB) MODE CODE RESET / INCMD SELECT 0(LSB) SET GENERAL PURPOSE FLAG 0 TABLE 25. BIT TEST STATUS FLAG REGISTER (READ 1CH) TABLE 23. BC CONDITION REGISTER (READ 1BH) BIT BIT DESCRIPTION DESCRIPTION 15(MSB) LOGIC "1" 15(MSB) PROTOCOL BUILT-IN TEST COMPLETE 14 RETRY 1 14 PROTOCOL BUILT-IN TEST IN-PROGRESS 13 RETRY 0 13 PROTOCOL BUILT-IN TEST PASSED 12 BAD MESSAGE 12 PROTOCOL BUILT-IN TEST ABORT 11 MESSAGE STATUS SET 11 PROTOCOL BUILT-IN-TEST COMPLETE / IN-PROGRESS 10 GOOD BLOCK TRANSFER 10 LOGIC "0" 9 FORMAT ERROR 9 LOGIC "0" 8 NO RESPONSE 8 LOGIC "0" 7 GENERAL PURPOSE FLAG 7 7 RAM BUILT-IN TEST COMPLETE 6 GENERAL PURPOSE FLAG 6 6 RAM BUILT-IN TEST IN-PROGRESS 5 GENERAL PURPOSE FLAG 5 5 RAM BUILT-IN TEST IN-PASSED 4 GENERAL PURPOSE FLAG 4 4 LOGIC "0" 3 GENERAL PURPOSE FLAG 3 3 LOGIC "0" 2 GENERAL PURPOSE FLAG 2 2 LOGIC "0" 1 EQUAL FLAG / GENERAL PURPOSE FLAG 1 1 LOGIC "0" 0(LSB) LESS THAN FLAG / GENERAL PURPOSE FLAG 1 0(LSB) LOGIC "0" Note: If the Mini-ACE Mark3 is not online in enhanced BC mode (i.e., processing instructions), the BC condition code register will always return a value of 0000. Data Device Corporation www.ddc-web.com 16 BU-6474X/6484X/6486X AL-11/12-0 TABLE 28. BC GENERAL PURPOSE QUEUE POINTER REGISTER RT, MT INTERRUPT STATUS QUEUE POINTER REGISTER (READ/WRITE1FH) TABLE 26. INTERRUPT MASK REGISTER #2 (READ/WRITE 1DH) BIT DESCRIPTION 15(MSB) NOT USED 14 BC OP CODE PARITY ERROR 13 RT ILLEGAL COMMAND/MESSAGE MT MESSAGE RECEIVED 12 GENERAL PURPOSE QUEUE / INTERRUPT STATUS QUEUE ROLLOVER 14 QUEUE POINTER BASE ADDRESS 14 13 QUEUE POINTER BASE ADDRESS 13 11 CALL STACK POINTER REGISTER ERROR 12 QUEUE POINTER BASE ADDRESS 12 10 BC TRAP OP CODE 11 QUEUE POINTER BASE ADDRESS 11 9 RT COMMAND STACK 50% ROLLOVER 10 QUEUE POINTER BASE ADDRESS 10 8 RT CIRCULAR BUFFER 50% ROLLOVER 9 QUEUE POINTER BASE ADDRESS 9 7 MONITOR COMMAND STACK 50% ROLLOVER 8 QUEUE POINTER BASE ADDRESS 8 6 MONITOR DATA STACK 50% ROLLOVER 7 QUEUE POINTER BASE ADDRESS 7 5 ENHANCED BC IRQ3 6 QUEUE POINTER BASE ADDRESS 6 4 ENHANCED BC IRQ2 5 QUEUE POINTER ADDRESS 5 3 ENHANCED BC IRQ1 4 QUEUE POINTER ADDRESS 4 2 ENHANCED BC IRQ0 3 QUEUE POINTER ADDRESS 3 1 BIT TEST COMPLETE 2 QUEUE POINTER ADDRESS 2 0(LSB) NOT USED 1 QUEUE POINTER ADDRESS 1 0(LSB) QUEUE POINTER ADDRESS 0 BIT DESCRIPTION 15(MSB) QUEUE POINTER BASE ADDRESS 15 TABLE 27. INTERRUPT STATUS REGISTER #2 (READ 1EH) BIT DESCRIPTION 15(MSB) MASTER INTERRUPT 14 BC OP CODE PARITY ERROR 13 RT ILLEGAL COMMAND/MESSAGE MT MESSAGE RECEIVED 12 GENERAL PURPOSE QUEUE / INTERRUPT STATUS QUEUE ROLLOVER 11 CALL STACK POINTER REGISTER ERROR 10 BC TRAP OP CODE 9 RT COMMAND STACK 50% ROLLOVER 8 RT CIRCULAR BUFFER 50% ROLLOVER 7 MONITOR COMMAND STACK 50% ROLLOVER 6 MONITOR DATA STACK 50% ROLLOVER 5 ENHANCED BC IRQ3 4 ENHANCED BC IRQ2 3 ENHANCED BC IRQ1 2 ENHANCED BC IRQ0 1 BIT TEST COMPLETE 0(LSB) INTERRUPT CHAIN BIT Data Device Corporation www.ddc-web.com 17 BU-6474X/6484X/6486X AL-11/12-0 NOTE: TABLES 29 TO 35 ARE NOT REGISTERS, BUT THEY ARE WORDS STORED IN RAM. TABLE 29. BC MODE BLOCK STATUS WORD BIT TABLE 31. 1553 COMMAND WORD DESCRIPTION BIT DESCRIPTION 15(MSB) EOM 15(MSB) REMOTE TERMINAL ADDRESS BIT 4 14 SOM 14 REMOTE TERMINAL ADDRESS BIT 3 13 CHANNEL B/A 13 REMOTE TERMINAL ADDRESS BIT 2 12 ERROR FLAG 12 REMOTE TERMINAL ADDRESS BIT 1 11 STATUS SET 11 REMOTE TERMINAL ADDRESS BIT 0 10 FORMAT ERROR 10 TRANSMIT / RECEIVE 9 NO RESPONSE TIMEOUT 9 SUBADDRESS / MODE BIT 4 8 LOOP TEST FAIL 8 SUBADDRESS / MODE BIT 3 7 MASKED STATUS SET 7 SUBADDRESS / MODE BIT 2 6 RETRY COUNT 1 6 SUBADDRESS / MODE BIT 1 5 RETRY COUNT 0 5 SUBADDRESS / MODE BIT 0 4 GOOD DATA BLOCK TRANSFER 4 DATA WORD COUNT / MODE CODE BIT 4 3 WRONG STATUS ADDRESS / NO GAP 3 DATA WORD COUNT / MODE CODE BIT 3 2 WORD COUNT ERROR 2 DATA WORD COUNT / MODE CODE BIT 2 1 INCORRECT SYNC TYPE 1 DATA WORD COUNT / MODE CODE BIT 1 0(LSB) INVALID WORD 0(LSB) DATA WORD COUNT / MODE CODE BIT 0 TABLE 30. RT MODE BLOCK STATUS WORD BIT TABLE 32. WORD MONITOR IDENTIFICATION WORD DESCRIPTION BIT DESCRIPTION 15(MSB) EOM 14 SOM 13 CHANNEL B/A * * 12 ERROR FLAG * * 11 RT-to-RT FORMAT 10 FORMAT ERROR 8 GAP TIME (LSB) 9 NO RESPONSE TIMEOUT 7 WORD FLAG 8 LOOP TEST FAIL 6 THIS RT 7 DATA STACK ROLLOVER 5 BROADCAST 6 ILLEGAL COMMAND WORD 4 ERROR 5 WORD COUNT ERROR 3 COMMAND / DATA 4 INCORRECT DATA SYNC 2 CHANNEL B/A 3 INVALID WORD 1 CONTIGUOUS DATA / GAP 2 RT-to-RT GAP / SYNC / ADDRESS ERROR 0(LSB) MODE_CODE 1 RT-to-RT 2ND COMMAND ERROR 0(LSB) COMMAND WORD CONTENTS ERROR Data Device Corporation www.ddc-web.com 15(MSB) * 18 GAP TIME (MSB) * BU-6474X/6484X/6486X AL-11/12-0 TABLE 33. MESSAGE MONITOR MODE BLOCK STATUS WORD BIT TABLE 35. 1553B STATUS WORD DESCRIPTION BIT DESCRIPTION 15(MSB) EOM 15(MSB) REMOTE TERMINAL ADDRESS BIT 4 14 SOM 14 REMOTE TERMINAL ADDRESS BIT 3 13 CHANNEL B/A 13 REMOTE TERMINAL ADDRESS BIT 2 12 ERROR FLAG 12 REMOTE TERMINAL ADDRESS BIT 1 11 RT-to-RT TRANSFER 11 REMOTE TERMINAL ADDRESS BIT 0 10 FORMAT ERROR 10 MESSAGE ERROR 9 NO RESPONSE TIMEOUT 9 INSTRUMENTATION 8 GOOD DATA BLOCK TRANSFER 8 SERVICE REQUEST 7 DATA STACK ROLLOVER 7 RESERVED 6 RESERVED 6 RESERVED 5 WORD COUNT ERROR 5 RESERVED 4 INCORRECT SYNC 4 BROADCAST COMMAND RECEIVED 3 INVALID WORD 3 BUSY 2 RT-to-RT GAP / SYNC / ADDRESS ERROR 2 SSFLAG 1 RT-to-RT 2ND COMMAND ERROR 1 DYNAMIC BUS CONTROL ACCEPTANCE 0(LSB) COMMAND WORD CONTENTS ERROR 0(LSB) TERMINAL FLAG TABLE 34. RT/MONITOR INTERRUPT STATUS WORD (FOR INTERRUPT STATUS QUEUE) BIT DEFINITION FOR MESSAGE INTERRUPT EVENT NON-TEST REGISTER FUNCTION SUMMARY DEFINITION FOR NON-MESSAGE INTERRUPT EVENT A summary of the Mini-ACE Mark3 24 non-test registers follows. 15 TRANSMITTER TIMEOUT NOT USED 14 ILLEGAL COMMAND NOT USED 13 MONITOR DATA STACK 50% ROLLOVER NOT USED 12 MONITOR DATA STACK ROLLOVER NOT USED 11 RT CIRCULAR BUFFER 50% ROLLOVER NOT USED 10 RT CIRCULAR BUFFER ROLLOVER NOT USED 9 MONITOR COMMAND (DESCRIPTOR) STACK 50% ROLLOVER NOT USED 8 MONITOR COMMAND (DESCRIPTOR) STACK ROLLOVER NOT USED 7 RT COMMAND (DESCRIPTOR) STACK 50% ROLLOVER NOT USED 6 RT COMMAND (DESCRIPTOR) STACK ROLLOVER NOT USED 5 HANDSHAKE FAIL NOT USED START/RESET REGISTER 4 FORMAT ERROR TIME TAG ROLLOVER 3 MODE CODE INTERRUPT RT ADDRESS PARITY ERROR 2 SUBADDRESS CONTROL WORD EOM PROTOCOL SELF-TEST COMPLETE 1 END-OF-MESSAGE (EOM) RAM PARITY ERROR 0 "1" FOR MESSAGE INTERRUPT EVENT "0" FOR NON-MESSAGE INTERRUPT EVENT The Start/Reset Register is used for "command" type functions such as software reset, BC/MT Start, Interrupt reset, Time Tag Reset, Time Tag Register Test, Initiate protocol self-test, Initiate RAM self-test, Clear self-test register, and Clear RT Halt. The Start/Reset Register also includes provisions for stopping the BC in its auto-repeat mode, either at the end of the current message or at the end of the current BC frame. Data Device Corporation www.ddc-web.com INTERRUPT MASK REGISTERS #1 AND #2 Interrupt Mask Registers #1 and #2 are used to enable and disable interrupt requests for various events and conditions. NOTE: Please see Appendix "F" of the Enhanced Mini-ACE Users Guide for important information applicable only to RT MODE operation, enabling of the interrupt status queue and use of specific non-message interrupts. CONFIGURATION REGISTERS #1 AND #2 Configuration Registers #1 and #2 are used to select the MiniACE Mark3's mode of operation, and for software control of RT Status Word bits, Active Memory Area, BC Stop-On-Error, RT Memory Management mode selection, and control of the Time Tag operation. 19 BU-6474X/6484X/6486X AL-11/12-0 BC/RT COMMAND STACK REGISTER vidual receive (broadcast) subaddresses, and the alternate (fully software programmable) RT Status Word. For MT mode, use of the Enhanced Mode enables the Selective Message Monitor, the combined RT/Selective Monitor modes, and the monitor triggering capability. The BC/RT Command Stack Register allows the host CPU to determine the pointer location for the current or most recent message. BC INSTRUCTION LIST POINTER REGISTER RT/MONITOR DATA STACK ADDRESS REGISTER The BC Instruction List Pointer Register may be read to determine the current location of the Instruction List Pointer for the Enhanced BC mode. The RT/Monitor Data Stack Address Register provides a read/ writable indication of the last data word stored for RT or Monitor modes. BC CONTROL WORD/RT SUBADDRESS CONTROL WORD REGISTER BC FRAME TIME REMAINING REGISTER In BC mode, the BC Control Word/RT Subaddress Control Word Register allows host access to the current word or most recent BC Control Word. The BC Control Word contains bits that select the active bus and message format, enable off-line self-test, masking of Status Word bits, enable retries and interrupts, and specify MIL-STD-1553A or -1553B error handling. In RT mode, this register allows host access to the current or most recent Subaddress Control Word. The Subaddress Control Word is used to select the memory management scheme and enable interrupts for the current message. The BC Frame Time Remaining Register provides a read-only indication of the time remaining in the current BC frame. In the enhanced BC mode, this timer may be used for minor or major frame control, or as a watchdog timer for the BC message sequence control processor. The resolution of this register is 100 s/LSB. BC TIME REMAINING TO NEXT MESSAGE REGISTER The BC Time Remaining to Next Message Register provides a read-only indication of the time remaining before the start of the next message in a BC frame. In the enhanced BC mode, this timer may also be used for the BC message sequence control processor's Delay (DLY) instruction, or for minor or major frame control. The resolution of this register is 1 s/LSB. TIME TAG REGISTER The Time Tag Register maintains the value of a real-time clock. The resolution of this register is programmable from among 2, 4, 8, 16, 32, and 64 s/LSB. The Start-of-Message (SOM) and Endof-Message (EOM) sequences in BC, RT, and Message Monitor modes cause a write of the current value of the Time Tag Register to the stack area of the RAM. BC FRAME TIME/ RT LAST COMMAND /MT TRIGGER WORD REGISTER In BC mode, this register is used to program the BC frame time, for use in the frame auto-repeat mode. The resolution of this register is 100 s/LSB, with a range up to 6.55 seconds. In RT mode, this register stores the current (or most previous) 1553 Command Word processed by the Mini-ACE Mark3 RT. In the Word Monitor mode, this register is used to specify a 16-bit Trigger (Command) Word. The Trigger Word may be used to start or stop the monitor, or to generate interrupts. INTERRUPT STATUS REGISTERS #1 AND #2 Interrupt Status Registers #1 and #2 allow the host processor to determine the cause of an interrupt request by means of one or two read accesses. The interrupt events of the two Interrupt Status Registers are mapped to correspond to the respective bit positions in the two Interrupt Mask Registers. Interrupt Status Register #2 contains an INTERRUPT CHAIN bit, used to indicate an interrupt event from Interrupt Status Register #1. BC INITIAL INSTRUCTION LIST POINTER REGISTER The BC Initial Instruction List Pointer Register enables the host to assign the starting address for the enhanced BC Instruction List. CONFIGURATION REGISTERS #3, #4, AND #5 Configuration Registers #3, #4, and #5 are used to enable many of the Mini-ACE Mark3's advanced features that were implemented by the prior generation products, the ACE and Mini-ACE (Plus). For BC, RT, and MT modes, use of the Enhanced Mode enables the various read-only bits in Configuration Register #1. For BC mode, Enhanced Mode features include the expanded BC Control Word and BC Block Status Word, additional Stop-OnError and Stop-On-Status Set functions, frame auto-repeat, programmable intermessage gap times, automatic retries, expanded Status Word Masking, and the capability to generate interrupts following the completion of any selected message. For RT mode, the Enhanced Mode features include the expanded RT Block Status Word, combined RT/Selective Message Monitor mode, automatic setting of the TERMINAL FLAG Status Word bit following a loop test failure; the double buffering scheme for indiData Device Corporation www.ddc-web.com RT STATUS WORD REGISTER AND BIT WORD REGISTERS The RT Status Word Register and BIT Word Registers provide read-only indications of the RT Status and BIT Words. CONFIGURATION REGISTERS #6 AND #7: Configuration Registers #6 and #7 are used to enable the MiniACE Mark3 features that extend beyond the architecture of the ACE/Mini-ACE (Plus). These include the Enhanced BC mode; RT Global Circular Buffer (including buffer size); the RT/MT Interrupt Status Queue, including valid/invalid message filtering; enabling a software-assigned RT address; clock frequency selection; a base address for the "non-data" portion of Mini-ACE 20 BU-6474X/6484X/6486X AL-11/12-0 BC GENERAL PURPOSE QUEUE POINTER Mark3 memory; LSB filtering for the Synchronize (with data) time tag operations; and enabling a watchdog timer for the Enhanced BC message sequence control engine. The BC General Purpose Queue Pointer provides a means for initializing the pointer for the General Purpose Queue, for the Enhanced BC mode. In addition, this register enables the host to determine the current location of the General Purpose Queue pointer, which is incremented internally by the Enhanced BC message sequence control engine. NOTE: Please see Appendix "F" of the Enhanced Mini-ACE User's Guide for important information applicable only to RT MODE operation, enabling of the interrupt status queue and use of specific non-message interrupts. RT/MT INTERRUPT STATUS QUEUE POINTER The RT/MT Interrupt Status Queue Pointer provides a means for initializing the pointer for the Interrupt Status Queue, for RT, MT, and RT/MT modes. In addition, this register enables the host to determine the current location of the Interrupt Status Queue pointer, which is incremented by the RT/MT message processor. BC CONDITION CODE REGISTER The BC Condition Code Register is used to enable the host processor to read the current value of the Enhanced BC Message Sequence Control Engine's condition flags. BC GENERAL PURPOSE FLAG REGISTER BUS CONTROLLER (BC) ARCHITECTURE The BC General Purpose Flag Register allows the host processor to be able to set, clear, or toggle any of the Enhanced BC Message Sequence Control Engine's General Purpose condition flags. The BC functionality for the Mini-ACE Mark3 includes two separate architectures: (1) the older, non-Enhanced Mode, which provides complete compatibility with the previous ACE and MiniACE (Plus) generation products; and (2) the newer, Enhanced BC mode. The Enhanced BC mode offers several new powerful architectural features. These include the incorporation of a highly autonomous BC message sequence control engine, which greatly serves to offload the operation of the host CPU. BIT TEST STATUS REGISTER The BIT Test Status Register is used to provide read-only access to the status of the protocol and RAM built-in self-tests (BIT). BC INSTRUCTION LIST BC INSTRUCTION LIST POINTER REGISTER INITIALIZE BY REGISTER 0D (RD/WR); READ CURRENT VALUE VIA REGISTER 03 (RD ONLY) MESSAGE CONTROL/STATUS BLOCK OP CODE BC CONTROL WORD PARAMETER (POINTER) COMMAND WORD (Rx Command for RT-to-RT transfer) DATA BLOCK POINTER DATA BLOCK TIME-TO-NEXT MESSAGE TIME TAG WORD BLOCK STATUS WORD LOOPBACK WORD RT STATUS WORD 2nd (Tx) COMMAND WORD (for RT-to-RT transfer) 2nd RT STATUS WORD (for RT-to-RT transfer) FIGURE 2. BC MESSAGE SEQUENCE CONTROL Data Device Corporation www.ddc-web.com 21 BU-6474X/6484X/6486X AL-11/12-0 The Enhanced BC's message sequence control engine provides a high degree of flexibility for implementing major and minor frame scheduling; capabilities for inserting asynchronous messages in the middle of a frame; to separate 1553 message data from control/status data for the purpose of implementing double buffering and performing bulk data transfers; for implementing message retry schemes, including the capability for automatic bus channel switchover for failed messages; and for reporting various conditions to the host processor by means of four userdefined interrupts and a general purpose queue. sequence control. The Mini-ACE Mark3 supports highly autonomous BC operation, which greatly offloads the operation of the host processor. The operation of the Mini-ACE Mark3's message sequence control engine is illustrated in FIGURE 2. The BC message sequence control involves an instruction list pointer register; an instruction list which contains multiple 2-word entries; a message control/status stack, which contains multiple 8-word or 10-word descriptors; and data blocks for individual messages. In both the non-Enhanced and Enhanced BC modes, the MiniACE Mark3 BC implements all MIL-STD-1553B message formats. Message format is programmable on a message-by-message basis by means of the BC Control Word and the T/R bit of the Command Word for the respective message. The BC Control Word allows 1553 message format, 1553A/B type RT, bus channel, self-test, and Status Word masking to be specified on an individual message basis. In addition, automatic retries and/or interrupt requests may be enabled or disabled for individual messages. The BC performs all error checking required by MIL-STD1553B. This includes validation of response time, sync type and sync encoding, Manchester II encoding, parity, bit count, word count, Status Word RT Address field, and various RT-to-RT transfer errors. The Mini-ACE Mark3 BC response timeout value is programmable with choices of 18, 22, 50, and 130 s. The longer response timeout values allow for operation over long buses and/or the use of repeaters. The initial value of the instruction list pointer register is initialized by the host processor (via Register 0D), and is incremented by the BC message sequence processor (host readable via Register 03). During operation, the message sequence control processor fetches the operation referenced by the instruction list pointer register from the instruction list. Note that the pointer parameter referencing the first word of a message's control/status block (the BC Control Word) must contain an address value that is modulo 8. Also, note that if the message is an RT-to-RT transfer, the pointer parameter must contain an address value that is modulo 16. OP CODES The instruction list pointer register references a pair of words in the BC instruction list: an op code word, followed by a parameter word. The format of the op code word, which is illustrated in FIGURE 3, includes a 5-bit op code field and a 5-bit condition code field. The op code identifies the instruction to be executed by the BC message sequence controller. In its non-Enhanced Mode, the Mini-ACE Mark3 may be programmed to process BC frames of up to 512 messages with no processor intervention. In the Enhanced BC mode, there is no explicit limit to the number of messages that may be processed in a frame. In both modes, it is possible to program for either single frame or frame auto-repeat operation. In the auto-repeat mode, the frame repetition rate may be controlled either internally, using a programmable BC frame timer, or from an external trigger input. Most of the operations are conditional, with execution dependent on the contents of the condition code field. Bits 3-0 of the condition code field identifies a particular condition. Bit 4 of the condition code field identifies the logic sense ("1" or "0") of the selected condition code on which the conditional execution is dependent. TABLE 36 lists all the op codes, along with their respective mnemonic, code value, parameter, and description. TABLE 37 defines all the condition codes. ENHANCED BC MODE: MESSAGE SEQUENCE CONTROL One of the major new architectural features of the Mini-ACE Mark3 series is its advanced capability for BC message 15 Odd Parity 14 13 12 11 OpCode Field 10 9 8 7 6 5 0 1 0 1 0 4 3 2 1 0 Condition Code Field FIGURE 3. BC OP CODE FORMAT Data Device Corporation www.ddc-web.com 22 BU-6474X/6484X/6486X AL-11/12-0 Eight of the condition codes (8 through F) are set or cleared as the result of the most recent message. The other eight are defined as "General Purpose" condition codes GP0 through GP7. There are three mechanisms for programming the values of the General Purpose Condition Code bits: (1) They may be set, cleared, or toggled by the host processor, by means of the BC GENERAL PURPOSE FLAG REGISTER; (2) they may be set, cleared, or toggled by the BC message sequence control processor, by means of the GP Flag Bits (FLG) instruction; and (3) GP0 and GP1 only (but none of the others) may be set or cleared by means of the BC message sequence control processor's Compare Frame Timer (CFT) or Compare Message Timer (CMT) instructions. In the case of an RT-to-RT transfer message, the size of the message control/status block increases to 16 words. However, in this case, the last six words are not used; the ninth and tenth words are for the second command word and second status word. The third word in the message control/status block is a pointer that references the first word of the message's data word block. Note that the data word block stores only data words, which are to be either transmitted or received by the BC. By segregating data words from command words, status words, and other control and "housekeeping" functions, this architecture enables the use of convenient, usable data structures, such as circular buffers and double buffers. The host processor also has read-only access to the BC condition codes by means of the BC CONDITION CODE REGISTER. Other operations support program flow control; i.e., jump and call capability. The call capability includes maintenance of a call stack which supports a maximum of four (4) entries; there is also a return instruction. In the case of a call stack overrun or underrun, the BC will issue a CALL STACK POINTER REGISTER ERROR interrupt, if enabled. Note that four (4) instructions are unconditional. These are Compare to Frame Timer (CFT), Compare to Message Timer (CMT), GP Flag Bits (FLG), and Execute and Flip (XQF). For these instructions, the Condition Code Field is "don't care". That is, these instructions are always executed, regardless of the result of the condition code test. Other op codes may be used to delay for a specified time; start a new BC frame; wait for an external trigger to start a new frame; perform comparisons based on frame time and time-to-next message; load the time tag or frame time registers; halt; and issue host interrupts. In the case of host interrupts, the message control processor passes a 4-bit user-defined interrupt vector to the host, by means of the Mini-ACE Mark3's Interrupt Status Register. All of the other instructions are conditional. That is, they will only be executed if the condition code specified by the condition code field in the op code word tests true. If the condition code field tests false, the instruction list pointer will skip down to the next instruction. As shown in TABLE 36, many of the operations include a singleword parameter. For an XEQ (execute message) operation, the parameter is a pointer to the start of the message's Control / Status block. For other operations, the parameter may be an address, a time value, an interrupt pattern, a mechanism to set or clear general purpose flag bits, or an immediate value. For several op codes, the parameter is "don't care" (not used). The purpose of the FLG instruction is to enable the message sequence controller to set, clear, or toggle the value(s) of any or all of the eight general purpose condition flags. The op code parity bit encompasses all sixteen bits of the op code word. This bit must be programmed for odd parity. If the message sequence control processor fetches an undefined op code word, an op code word with even parity, or bits 9-5 of an op code word do not have a binary pattern of 01010, the message sequence control processor will immediately halt the BC's operation. In addition, if enabled, a BC TRAP OP CODE interrupt will be issued. Also, if enabled, a parity error will result in an OP CODE PARITY ERROR interrupt. TABLE 37 describes the Condition Codes. As described above, some of the op codes will cause the message sequence control processor to execute messages. In this case, the parameter references the first word of a message Control/Status block. With the exception of RT-to-RT transfer messages, all message status/control blocks are eight words long: a block control word, time-to-next-message parameter, data block pointer, command word, status word, loopback word, block status word, and time tag word. Data Device Corporation www.ddc-web.com 23 BU-6474X/6484X/6486X AL-11/12-0 TABLE 36. BC OPERATIONS FOR MESSAGE SEQUENCE CONTROL INSTRUCTION MNEMONIC OP CODE (HEX) CONDITIONAL OR DESCRIPTION UNCONDITIONAL Message Control / Conditional Executes the message at the specified Message Control/Status Status Block (See Note) Block Address if the condition flag tests TRUE, otherwise conAddress tinue execution at the next OpCode in the instruction list. PARAMETER Execute Message XEQ 0001 Jump JMP 0002 Instruction List Address Conditional Subroutine Call CAL 0003 Instruction List Address Conditional Subroutine Return RTN 0004 Not Used (Don't Care) Conditional Interrupt Request IRQ 0006 Interrupt Bit Pattern in 4 LS bits Conditional Halt HLT 0007 Not Used (Don't Care) Conditional Delay DLY 0008 Delay Time Value (Resolution = 1S / LSB) Conditional Wait Until Frame Timer =0 WFT 0009 Not Used (Don't Care) Conditional Compare to Frame Timer CFT 000A Delay Time Value (Resolution = 100S / LSB) Unconditional Compare to Message Timer CMT 000B Delay Time Value (Resolution = 1S / LSB) Unconditional Jump to the OpCode specified in the Instruction List if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Jump to the OpCode specified by the Instruction List Address and push the Address of the Next OpCode on the Call Stack if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Note that the maximum depth of the subroutine call stack is four. Return to the OpCode popped off the Call Stack if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Generate an interrupt if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. The passed parameter (Interrupt Bit Pattern) specifies which of the ENHANCED BC IRQ bit(s) (bits 5-2) will be set in Interrupt Status Register #2. Only the four LSBs of the passed parameter are used. A parameter where the four LSBs are logic "0" will not generate an interrupt. Stop execution of the Message Sequence Control Program until a new BC Start is issued by the host if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Delay the time specified by the Time parameter before executing the next OpCode if the condition flag tests TRUE, otherwise continue execution at the next OpCode without delay. The delay generated will use the Time to Next Message Timer. Wait until Frame Time counter is equal to Zero before continuing execution of the Message Sequence Control Program if the condition flag tests TRUE, otherwise continue execution at the next OpCode without delay. Compare Time Value to Frame Time Counter. The LT/GP0 and EQ/GP1 flag bits are set or cleared based on the results of the compare. If the value of the CFT's parameter is less than the value of the frame time counter, then the LT/GP0 and NE/GP1 flags will be set, while the GT-EQ/GP0 and EQ/GP1 flags will be cleared. If the value of the CFT's parameter is equal to the value of the frame time counter, then the GT-EQ/GP0 and EQ/ GP1 flags will be set, while the LT/GP0 and NE/GP1 flags will be cleared. If the value of the CFT's parameter is greater than the current value of the frame time counter, then the GT-EQ/ GP0 and NE/GP1 flags will be set, while the LT/GP0 and EQ/ GP1 flags will be cleared. Compare Time Value to Message Time Counter. The LT/GP0 and EQ/GP1 flag bits are set or cleared based on the results of the compare. If the value of the CMT's parameter is less than the value of the message time counter, then the LT/GP0 and NE/GP1 flags will be set, while the GT-EQ/GP0 and EQ/GP1 flags will be cleared. If the value of the CMT's parameter is equal to the value of the message time counter, then the GT-EQ/GP0 and EQ/GP1 flags will be set, while the LT/GP0 and NE/GP1 flags will be cleared. If the value of the CMT's parameter is greater than the current value of the message time counter, then the GT-EQ/GP0 and NE/GP1 flags will be set, while the LT/GP0 and EQ/GP1 flags will be cleared. NOTE: While the XEQ (Execute Message) instruction is conditional, not all condition codes may be used to enable its use. The ALWAYS and NEVER condition codes may be used. The eight general purpose flag bits, GP0 through GP7, may also be used. However, if GP0 through GP7 are used, it is imperative that the host processor not modify the value of the specific general purpose flag bit that enabled a particular message while that message is being processed. Similarly, the LT, GT-EQ, EQ, and NE flags, which the BC only updates by means of the CFT and CMT instructions, may also be used. However, these two flags are dual use. Therefore, if these are used, it is imperative that the host processor not modify the value of the specific flag (GP0 or GP1) that enabled a particular message while that message is being processed. The NORESP, FMT ERR, GD BLK XFER, MASKED STATUS SET, BAD MESSAGE, RETRY0, and RETRY1 condition codes are not available for use with the XEQ instruction and should not be used to enable its execution. Data Device Corporation www.ddc-web.com 24 BU-6474X/6484X/6486X AL-11/12-0 TABLE 36. BC OPERATIONS FOR MESSAGE SEQUENCE CONTROL (CONT.) INSTRUCTION MNEMONIC OP CODE (HEX) GP Flag Bits FLG 000C PARAMETER Used to set, clear, or toggle GP (General Purpose) Flag bits (See description) CONDITIONAL OR UNCONDITIONAL Unconditional DESCRIPTION Used to set, toggle, or clear any or all of the eight general purpose flags. The table below illustrates the use of the GP Flag Bits instruction for the case of GP0 (General Purpose Flag 0). Bits 1 and 9 of the parameter byte affect flag GP1, bits 2 and 10 effect GP2, etc., according to the following rules: Bit 8 Bit 0 Effect on GP0 0 0 No Change 0 1 Set Flag 1 0 Clear Flag 1 1 Toggle Flag Load Time Tag Counter LTT 000D Time Value. Resolution (s/ LSB) is defined by bits 9, 8, and 7 of Configuration Register #2. Conditional Load Time Tag Counter with Time Value if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Load Frame Timer LFT 000E Time Value (resolution = 100 s/LSB) Conditional Load Frame Timer Register with the Time Value parameter if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Start Frame Timer SFT 000F Not Used (Don't Care) Conditional Start Frame Time Counter with Time Value in Time Frame register if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Time Tag Register PTT 0010 Not Used (Don't Care) Conditional Push the value of the Time Tag Register on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Block Status Word PBS 0011 Not Used (Don't Care) Conditional Push the Block Status Word for the most recent message on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Immediate Value PSI 0012 Immediate Value Conditional Push Immediate data on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Push Indirect PSM 0013 Memory Address Conditional Push the data stored at the specified memory location on the General Purpose Queue if the condition flag tests TRUE, otherwise continue execution at the next OpCode in the instruction list. Wait for External Trigger WTG 0014 Not Used (Don't Care) Conditional Wait for a logic "0"-to-logic "1" transition on the EXT_TRIG input signal before proceeding to the next OpCode in the instruction list if the condition flag tests TRUE, otherwise continue execution at the next OpCode without delay. Execute and Flip XQF 0015 Message Control / Status Block Address Unconditional Execute (unconditionally) the message referenced by the Message Control/Status Block Address. Following the processing of this message, if the condition flag tests TRUE, the BC will toggle bit 4 in the Message Control/Status Block Address, and store the new Message Block Address as the updated value of the parameter following the XQF instruction code. As a result, the next time that this line in the instruction list is executed, the Message Control/Status Block at the updated address (old address XOR 0010h), rather than the old address, will be processed. If the condition flag tests FALSE, the value of the Message Control/ Status Block Address parameter will not change. Data Device Corporation www.ddc-web.com 25 BU-6474X/6484X/6486X AL-11/12-0 TABLE 37. BC CONDITION CODES BIT CODE NAME (BIT 4 = 0) INVERSE (BIT 4 = 1) 0 LT/GP0 GT-EQ/ GP0 Less than or GP0 flag. This bit is set or cleared based on the results of the compare. If the value of the CMT's parameter is less than the value of the message time counter, then the LT/GP0 and NE/GP1 flags will be set, while the GT-EQ/GP0 and EQ/GP1 flags will be cleared. If the value of the CMT's parameter is equal to the value of the message time counter, then the GT-EQ/GP0 and EQ/GP1 flags will be set, while the LT/GP0 and NE/GP1 flags will be cleared. If the value of the CMT's parameter is greater than the current value of the message time counter, then the GT-EQ/GP0 and NE/GP1 flags will be set, while the LT/GP0 and EQ/GP1 flags will be cleared. Also, General Purpose Flag 1 may be also be set or cleared by a FLG operation. 1 EQ/GP1 NE/GP1 Equal Flag. This bit is set or cleared after CFT or CMT operation. If the value of the CMT's parameter is equal to the value of the message time counter, then the EQ/GP1 flag will be set and the NE/GP1 bit will be cleared. If the value of the CMT's parameter is not equal to the value of the message time counter, then the NE/GP1 flag will be set and the EQ/GP1bit will be cleared. Also, General Purpose Flag 1 may be also be set or cleared by a FLG operation. 2 3 4 5 6 7 GP2 GP3 GP4 GP5 GP6 GP7 GP2 GP3 GP4 GP5 GP6 GP7 General Purpose Flags may be set, cleared, or toggled by a FLG operation. The host processor can set, clear, or toggle these flags in the same way as the FLG instruction by means of the BC GENERAL PURPOSE FLAG REGISTER. 8 NORESP RESP NORESP indicates that an RT has either not responded or has responded later than the BC No Response Timeout time. The Mini-ACE Mark3's No Response Timeout Time is defined per MIL-STD-1553B as the time from the mid-bit crossing of the parity bit of the last word transmitted by the BC to the mid-sync crossing of the RT Status Word. The value of the No Response Timeout value is programmable from among the nominal values 18.5, 22.5, 50.5, and 130 s (1 s) by means of bits 10 and 9 of Configuration Register #5. 9 FMT ERR FMT ERR FMT ERR indicates that the received portion of the most recent message contained one or more violations of the 1553 message validation criteria (sync, encoding, parity, bit count, word count, etc.), or the RT's status word received from a responding RT contained an incorrect RT address field. A GD BLK XFER GD BLK XFER For the most recent message, GD BLK XFER will be set to logic "1" following completion of a valid (error-free) RT-to-BC transfer, RT-to-RT transfer, or transmit mode code with data message. This bit is set to logic "0" following an invalid message. GOOD DATA BLOCK TRANSFER is always logic "0" following a BC-to-RT transfer, a mode code with data, or a mode code without data. The Loop Test has no effect on GOOD DATA BLOCK TRANSFER. GOOD DATA BLOCK TRANSFER may be used to determine if the transmitting portion of an RT-to-RT transfer was error free. B MASKED STATUS BIT MASKED STATUS BIT Indicates that one or both of the following conditions have occurred for the most recent message: (1) If one (or more) of the Status Mask bits (14 through 9) in the BC Control Word is logic "0" and the corresponding bit(s) is (are) set (logic "1") in the received RT Status Word. In the case of the RESERVED BITS MASK (bit 9) set to logic "0," any or all of the 3 Reserved Status Word bits being set will result in a MASKED STATUS SET condition; and/or (2) If BROADCAST MASK ENABLED/XOR (bit 11 of Configuration Register #4) is logic "1" and the MASK BROADCAST bit of the message's BC Control Word is logic "0" and the BROADCAST COMMAND RECEIVED bit in the received RT Status Word is logic "1." C BAD MESSAGE GOOD MESSAGE BAD MESSAGE indicates either a format error, loop test fail, or no response error for the most recent message. Note that a "Status Set" condition has no effect on the "BAD MESSAGE/GOOD MESSAGE" condition code. D RETRY0 RETRY0 E RETRY1 RETRY1 These two bits reflect the retry status of the most recent message. The number of times that the message was retried is delineated by these two bits as shown below: RETRY COUNT 1 RETRY COUNT 0 Number of (bit 14) (bit 13) Message Retries 0 0 0 0 1 1 1 0 N/A 1 1 2 F ALWAYS NEVER Data Device Corporation www.ddc-web.com FUNCTIONAL DESCRIPTION The ALWAYS flag should be set (bit 4 = 0) to designate an instruction as unconditional. The NEVER bit (bit 4 = 1) can be used to implement a NOP or "skip" instruction. 26 BU-6474X/6484X/6486X AL-11/12-0 BC MESSAGE SEQUENCE CONTROL the old address. The operation of the XQF instruction is illustrated in FIGURE 4. The Mini-ACE Mark3 BC message sequence control capability enables a high degree of offloading of the host processor. This includes using the various timing functions to enable autonomous structuring of major and minor frames. In addition, by implementing conditional jumps and subroutine calls, the message sequence control processor greatly simplifies the insertion of asynchronous, or "out-of-band" messages. There are multiple ways of utilizing the "execute and flip" instruction. One is to facilitate the implementation of a double buffering data scheme for individual messages. This allows the message sequence control processor to "ping-pong" between a pair of data buffers for a particular message. By doing so, the host processor can access one of the two Data Word blocks, while the BC reads or writes the alternate Data Word block. EXECUTE AND FLIP OPERATION The Mini-ACE Mark3 BC's XQF, or "Execute and Flip" operation, provides some unique capabilities. Following execution of this unconditional instruction, if the condition code tests TRUE, the BC will modify the value of the current XQF instruction's pointer parameter by toggling bit 4 of the pointer. That is, if the selected condition flag tests true, the value of the parameter will be updated to the value = old address XOR 0010h. As a result, the next time that this line in the instruction list is executed, the Message Control/Status Block at the updated address (old address XOR 0010h) will be processed, rather than the one at (part of) BC INSTRUCTION LIST A second application of the "execute and flip" capability is in conjunction with message retries. This allows the BC to not only switch buses when retrying a failed message, but to automatically switch buses permanently for all future times that the same message is to be processed. This not only provides a high degree of autonomy from the host CPU, but saves BC bandwidth, by eliminating the need for future attempts to process messages on an RT's failed channel. XQF MESSAGE CONTROL/STATUS BLOCK 0 POINTER XX00h POINTER DATA BLOCK 0 MESSAGE CONTROL/STATUS BLOCK 1 XX00h POINTER DATA BLOCK 1 FIGURE 4. EXECUTE and FLIP (XQF) OPERATION Data Device Corporation www.ddc-web.com 27 BU-6474X/6484X/6486X AL-11/12-0 GENERAL PURPOSE QUEUE Register will always point to the next address location (modulo 64); that is, the location following the last location written by the BC message sequence control engine. The Mini-ACE Mark3 BC allows for the creation of a general purpose queue. This data structure provides a means for the message sequence processor to convey information to the BC host. The BC op code repertoire provides mechanisms to push various items on this queue. These include the contents of the Time Tag Register, the Block Status Word for the most recent message, an immediate data value, or the contents of a specified memory address. If enabled, a BC GENERAL PURPOSE QUEUE ROLLOVER interrupt will be issued when the value of the queue pointer address rolls over at a 64-word boundary. The rollover will always occur at a modulo 64 address. FIGURE 5 illustrates the operation of the BC General Purpose Queue. Note that the BC General Purpose Queue Pointer BC GENERAL PURPOSE QUEUE (64 Locations) LAST LOCATION BC GENERAL PURPOSE QUEUE POINTER REGISTER NEXT LOCATION FIGURE 5. BC GENERAL PURPOSE QUEUE Data Device Corporation www.ddc-web.com 28 BU-6474X/6484X/6486X AL-11/12-0 REMOTE TERMINAL (RT) ARCHITECTURE Other features of the Mini-ACE Mark3 RT include a set of interrupt conditions, a flexible status queue with filtering based on valid and/or invalid messages, flexible command illegalization, programmable busy by subaddress, multiple options on time tagging, and an "auto-boot" feature which allows the RT to initialize as an online RT with the busy bit set following power turn-on. The Mini-ACE Mark3's RT architecture builds upon that of the ACE and Mini-ACE. The Mini-ACE Mark3 provides multiprotocol support, with full compliance to all of the commonly used data bus standards, including MIL-STD-1553A, MIL-STD-1553B Notice 2, STANAG 3838, General Dynamics 16PP303, and McAir A3818, A5232, and A5690. For the Mini-ACE Mark3 RT mode, there is programmable flexibility enabling the RT to be configured to fulfill any set of system requirements. This includes the capability to meet the MIL-STD-1553A response time requirement of 2 to 5 s, and multiple options for mode code subaddresses, mode codes, RT status word, and RT BIT word. RT MEMORY ORGANIZATION TABLE 38 illustrates a typical memory map for an Mini-ACE Mark3 RT with 4K RAM. The two Stack Pointers reside in fixed locations in the shared RAM address space: address 0100 (hex) for the Area A Stack Pointer and address 0104 for the Area B Stack Pointer. In addition to the Stack Pointer, there are several other areas of the shared RAM address space that are designated as fixed locations (all shown in bold). These are for the Area A and Area B lookup tables, the illegalization lookup table, the busy lookup table, and the mode code data tables. The Mini-ACE Mark3 RT protocol design implements all of the MIL-STD-1553B message formats and dual redundant mode codes. The design has passed validation testing for MIL-STD1553B compliance. The Mini-ACE Mark3 RT performs comprehensive error checking including word and format validation, and checks for various RT-to-RT transfer errors. One of the main features of the Mini-ACE Mark3 RT is its choice of memory management options. These include single buffering by subaddress, double buffering for individual receive subaddresses, circular buffering by individual subaddresses, and global circular buffering for multiple (or all) subaddresses. The RT lookup tables (reference TABLE 39) provide a mechanism for allocating data blocks for individual transmit, receive, or broadcast subaddresses. The RT lookup tables include subaddress control words as well as the individual data block pointers. If command illegalization is used, address range 0300-03FF is used for command illegalizing. The descriptor stack RAM area, as well as the individual data blocks, may be located in any of the non-fixed areas in the shared RAM address space. Note that in TABLE 38, there is no area allocated for "Stack B". This is shown for purpose of simplicity of illustration. Also, note that in TABLE 38, the allocated area for the RT command stack is 256 words. However, larger stack sizes are possible. That is, the RT command stack size may be programmed for 256 words (64 messages), 512, 1024, or 2048 words (512 messages) by means of bits 14 and 13 of Configuration Register 3. TABLE 38. TYPICAL RT MEMORY MAP (SHOWN FOR 4K RAM) ADDRESS (HEX) DESCRIPTION 0000-00FF Stack A 0100 Stack Pointer A 0101 Global Circular Buffer A Pointer TABLE 39. RT LOOK-UP TABLES 0102-0103 RESERVED 0104 Stack Pointer B AREA A AREA B DESCRIPTION COMMENT 0105 Global Circular Buffer B Pointer 0106-0107 RESERVED 0108-010F Mode Code Selective Interrupt Table 0140 * * * 015F 01C0 * * * 01DF Rx(/Bcst) SA0 * * * Rx(/Bcst) SA31 Receive (/Broadcast) Lookup Pointer Table 0160 * * * 017F 01E0 * * * 01FF Tx SA0 * * * Tx SA31 Transmit Lookup Pointer Table 0180 * * * 019F 0200 * * * 021F Bcst SA0 * * * Bcst SA31 Broadcast Lookup Pointer Table (Optional) 01A0 * * * 01BF 0220 * * * 023F SACW SA0 * * * SACW SA31 Subaddress Control Word Lookup Table (Optional) 0110-013F Mode Code Data 0140-01BF Lookup Table A 01C0-023F Lookup Table B 0240-0247 Busy Bit Lookup Table 0248-025F (not used) 0260-027F Data Block 0 0280-02FF Data Block 1-4 0300-03FF Command Illegalizing Table 0400-041F Data Block 5 0420-043F Data Block 6 * * * * * * 0FE0-0FFF Data Block 100 Data Device Corporation www.ddc-web.com 29 BU-6474X/6484X/6486X AL-11/12-0 RT MEMORY MANAGEMENT Like the subaddress circular buffer, the size of the global circular buffer is programmable, with a range of 128 to 8192 data words. The Mini-ACE Mark3 provides a variety of RT memory management capabilities. As with the ACE and Mini-ACE, the choice of memory management scheme is fully programmable on a transmit/receive/broadcast subaddress basis. The double buffering feature provides a means for the host processor to easily access the most recent, complete received block of valid Data Words for any given subaddress. In addition to helping ensure data sample consistency, the circular buffer options provide a means for greatly reducing host processor overhead for multi-message bulk data transfer applications. In compliance with MIL-STD-1553B Notice 2, received data from broadcast messages may be optionally separated from nonbroadcast received data. For each transmit, receive or broadcast subaddress, either a single-message data block, a double buffered configuration (two alternating Data Word blocks), or a variable-sized (128 to 8192 words) subaddress circular buffer may be allocated for data storage. The memory management scheme for individual subaddresses is designated by means of the subaddress control word (reference TABLE 40). End-of-message interrupts may be enabled either globally (following all messages), following error messages, on a transmit/ receive/broadcast subaddress or mode code basis, or when a circular buffer reaches its midpoint (50% boundary) or lower (100%) boundary. A pair of interrupt status registers allow the host processor to determine the cause of all interrupts by means of a single read operation. For received data, there is also a global circular buffer mode. In this configuration, the data words received from multiple (or all) subaddresses are stored in a common circular buffer structure. TABLE 40. RT SUBADDRESS CONTROL WORD - MEMORY MANAGEMENT OPTIONS DOUBLE-BUFFERED OR GLOBAL CIRCULAR BUFFER (bit 15) SUBADDRESS CONTROL WORD BITS MM2 MM1 MM0 MEMORY MANAGEMENT SUBADDRESS BUFFER SCHEME DESCRIPTION 0 0 0 0 Single Message 1 0 0 0 For Receive or Broadcast: Double Buffered For Transmit: Single Message 0 0 0 1 128-Word 0 0 1 0 256-Word 0 0 1 1 512-Word 0 1 0 0 1024-Word 0 1 0 1 2048-Word 0 1 1 0 4096-Word 0 1 1 1 8192-Word Subaddress specific circular buffer of specified size. (for receive and / or broadcast subaddresses only) 1 Data Device Corporation www.ddc-web.com 1 1 1 30 Global Circular Buffer: The buffer size is specified by Configuration Register #6, bits 11-9. The pointer to the global circular buffer is stored at address 0101 (for Area A) or address 0105 (for Area B) BU-6474X/6484X/6486X AL-11/12-0 SINGLE BUFFERED MODE CIRCULAR BUFFER MODE The operation of the single buffered RT mode is illustrated in FIGURE 6. In the single buffered mode, the respective lookup table entry must be written by the host processor. Received data words are written to, or transmitted data words are read from the data word block with starting address referenced by the lookup table pointer. In the single buffered mode, the current lookup table pointer is not updated by the Mini-ACE Mark3 memory management logic. Therefore, if a subsequent message is received for the same subaddress, the same Data Word block will be overwritten or overread. The operation of the Mini-ACE Mark3's circular buffer RT memory management mode is illustrated in FIGURE 8. As in the single buffered and double buffered modes, the individual lookup table entries are initially loaded by the host processor. At the start of each message, the lookup table entry is stored in the third position of the respective message block descriptor in the descriptor stack area of RAM. Receive or transmit data words are transferred to (from) the circular buffer, starting at the location referenced by the lookup table pointer. In general, the location after the last data word written or read (modulo the circular buffer size) during the message is written to the respective lookup table location during the end-of-message sequence. By so doing, data for the next message for the respective transmit, receive(/broadcast), or broadcast subaddress will be accessed from the next lower contiguous block of locations in the circular buffer. SUBADDRESS DOUBLE BUFFERING MODE The Mini-ACE Mark3 provides a double buffering mechanism for received data, that may be selected on an individual subaddress basis for any or all receive (and/or broadcast) subaddresses. This is illustrated in FIGURE 7. It should be noted that the Subaddress Double Buffering mode is applicable for receive data only, not for transmit data. Double buffering of transmit messages may be easily implemented by software techniques. For the case of a receive (or broadcast receive) message with a data word error, there is an option such that the lookup table pointer will only be updated following receipt of a valid message. That is, the pointer will not be updated following receipt of a message with an error in a data word. This allows failed messages in a bulk data transfer to be retried without disrupting the circular buffer data structure, and without intervention by the RT's host processor. The purpose of the subaddress double buffering mode is to provide data sample consistency to the host processor. This is accomplished by allocating two 32-word data word blocks for each individual receive (and/or broadcast receive) subaddress. At any given time, one of the blocks will be designated as the "active" 1553 block while the other will be considered as "inactive". The data words for the next receive command to that subaddress will be stored in the active block. Following receipt of a valid message, the Mini-ACE Mark3 will automatically switch the active and inactive blocks for that subaddress. As a result, the latest, valid, complete data block is always accessible to the host processor. CONFIGURATION REGISTER 15 13 STACK POINTERS GLOBAL CIRCULAR BUFFER Beyond the programmable choice of single buffer mode, double buffer mode, or circular buffer mode, programmable on an individual subaddress basis, the Mini-ACE Mark3 RT architecture provides an additional option, a variable sized global circular LOOK-UP TABLE (DATA BLOCK ADDR) DESCRIPTOR STACKS 0 CURRENT AREA B/A DATA BLOCKS BLOCK STATUS WORD TIME TAG WORD LOOK-UP TABLE ADDR DATA BLOCK POINTER (See note) DATA BLOCK RECEIVED COMMAND WORD DATA BLOCK Note: Lookup table is not used for mode commands when enhanced mode codes are enabled. FIGURE 6. RT SINGLE BUFFERED MODE Data Device Corporation www.ddc-web.com 31 BU-6474X/6484X/6486X AL-11/12-0 buffer. The Mini-ACE Mark3 RT allows for a mix of single buffered, double buffered, and individually circular buffered subaddresses, along with the use of the global double buffer for any arbitrary group of receive(/broadcast) or broadcast subaddresses. The pointer to the Global Circular Buffer will be stored in location 0101 (for Area A), or location 0105 (for Area B). The global circular buffer option provides a highly efficient method for storing received message data. It allows for frequently used subaddresses to be mapped to individual data blocks, while also providing a method for asynchronously received messages to infrequently used subaddresses to be logged to a common area. Alternatively, the global circular buffer provides an efficient means for storing the received data words for all subaddresses. Under this method, all received data words are stored chronologically, regardless of subaddress. In the global circular buffer mode, the data for multiple receive subaddresses is stored in the same circular buffer data structure. The size of the global circular buffer may be programmed for 128, 256, 512, 1024, 2048, 4096, or 8192 words, by means of bits 11, 10, and 9 of Configuration Register #6. As shown in TABLE 40, individual subaddresses may be mapped to the global circular buffer by means of their respective subaddress control words. CONFIGURATION REGISTER 15 13 STACK POINTERS DESCRIPTOR STACK LOOK-UP TABLES 0 DATA BLOCKS CURRENT AREA B/A BLOCK STATUS WORD X..X 0 YYYYY TIME TAG WORD DATA BLOCK POINTER DATA BLOCK 0 DATA BLOCK POINTER X..X 1 YYYYY RECEIVED COMMAND WORD DATA BLOCK 1 RECEIVE DOUBLE BUFFER ENABLE MSB SUBADDRESS CONTROL WORD FIGURE 7. RT DOUBLE BUFFERED MODE CONFIGURATION REGISTER 15 13 STACK POINTERS DESCRIPTOR STACK CIRCULAR DATA BUFFER LOOK-UP TABLES 0 CURRENT AREA B/A BLOCK STATUS WORD TIME TAG WORD DATA BLOCK POINTER RECEIVED COMMAND WORD LOOK-UP TABLE ADDRESS LOOK-UP TABLE ENTRY POINTER TO CURRENT DATA BLOCK POINTER TO NEXT DATA BLOCK * RECEIVED (TRANSMITTED) MESSAGE DATA (NEXT LOCATION) 128, 256 8192 WORDS Notes: 1. TX/RS/BCST_SA look-up table entry is updated following valid receive (broadcast) message or following completion of transmit message 2. For the Global Circular Buffer Mode, the pointer is read from and re-written to Address 0101 (for Area A) or Address 0105 (for Area B). CIRCULAR BUFFER ROLLOVER FIGURE 8. RT CIRCULAR BUFFERED MODE Data Device Corporation www.ddc-web.com 32 BU-6474X/6484X/6486X AL-11/12-0 RT DESCRIPTOR STACK The 50% rollover interrupt is beneficial for performing bulk data transfers. For example, when using circular buffering for a particular receive subaddress, the 50% rollover interrupt will inform the host processor when the circular buffer is half full. At that time, the host may proceed to read the received data words in the upper half of the buffer, while the Mini-ACE Mark3 RT writes received data words to the lower half of the circular buffer. Later, when the RT issues a 100% circular buffer rollover interrupt, the host can proceed to read the received data from the lower half of the buffer, while the Mini-ACE Mark3 RT continues to write received data words to the upper half of the buffer. The descriptor stack provides a chronology of all messages processed by the Mini-ACE Mark3 RT. Reference FIGURES 6, 7, and 8. Similar to BC mode, there is a four-word block descriptor in the Stack for each message processed. The four entries to each block descriptor are the Block Status Word, Time Tag Word, the pointer to the start of the message's data block, and the 16-bit received Command Word. The RT Block Status Word includes indications of whether a particular message is ongoing or has been completed, what bus channel it was received on, indications of illegal commands, and flags denoting various message error conditions. For the double buffering, subaddress circular buffering, and global circular buffering modes, the data block pointer may be used for locating the data blocks for specific messages. Note that for mode code commands, there is an option to store the transmitted or received data word as the third word of the descriptor, in place of the data block pointer. Interrupt status queue. The Mini-ACE Mark3 RT, Monitor, and combined RT/Monitor modes include the capability for generating an interrupt status queue. As illustrated in FIGURE 10, this provides a chronological history of interrupt generating events and conditions. In addition to the Interrupt Mask Register, the Interrupt Status Queue provides additional filtering capability, such that only valid messages and/or only invalid messages may result in the creation of an entry to the Interrupt Status Queue. Queue entries for invalid and/or valid messages may be disabled by means of bits 8 and 7 of configuration register #6. The Time Tag Word provides a 16-bit indication of relative time for individual messages. The resolution of the Mini-ACE Mark3's time tag is programmable from among 2, 4, 8, 16, 32, or 64 s/ LSB. There is also a provision for using an external clock input for the time tag. If enabled, there is a time tag rollover interrupt, which is issued when the value of the time tag rolls over from FFFF(hex) to 0. Other time tag options include the capabilities to clear the time tag register following receipt of a Synchronize (without data) mode command and/or to set the time tag following receipt of a Synchronize (with data) mode command. For the latter, there is an added option to filter the "set" capability based on the LSB of the received data word being equal to logic "0". The interrupt status queue is 64 words deep, providing the capability to store entries for up to 32 messages. These events and conditions include both message-related and non-message related events. Note that the Interrupt Vector Queue Pointer Register will always point to the next location (modulo 64) following the last vector/pointer pair written by the Mini-ACE Mark3 RT. The pointer to the Interrupt Status Queue is stored in the INTERRUPT VECTOR QUEUE POINTER REGISTER (register address 1F). This register must be initialized by the host, and is subsequently incremented by the RT message processor. The interrupt status queue is 64 words deep, providing the capability to store entries for up to 32 messages. RT INTERRUPTS The Mini-ACE Mark3 offers a great deal of flexibility in terms of RT interrupt processing. By means of the Mini-ACE Mark3's two Interrupt Mask Registers, the RT may be programmed to issue interrupt requests for the following events/conditions: End-of(every)Message, Message Error, Selected (transmit or receive) Subaddress, 100% Circular Buffer Rollover, 50% Circular Buffer Rollover, 100% Descriptor Stack Rollover, 50% Descriptor Stack Rollover, Selected Mode Code, Transmitter Timeout, Illegal Command, and Interrupt Status Queue Rollover. The queue rolls over at addresses of modulo 64. The events that result in queue entries include both message-related and nonmessage-related events. Note that the Interrupt Vector Queue Pointer Register will always point to the next location (modulo 64) following the last vector/pointer pair written by the Mini-ACE Mark3 RT, Monitor, or RT/Monitor. Interrupts for 50% Rollovers of Stacks and Circular Buffers. The Mini-ACE Mark3 RT and Monitor are capable of issuing host interrupts when a subaddress circular buffer pointer or stack pointer crosses its mid-point boundary. For RT circular buffers, this is applicable for both transmit and receive subaddresses. Reference FIGURE 9. There are four interrupt mask and interrupt status register bits associated with the 50% rollover function: (1) RT circular buffer; (2) RT command (descriptor) stack; (3) Monitor command (descriptor) stack; and (4) Monitor data stack. Data Device Corporation www.ddc-web.com Each event that causes an interrupt results in a two-word entry to be written to the queue. The first word of the entry is the interrupt vector. The vector indicates which interrupt event(s)/ condition(s) caused the interrupt. The interrupt events are classified into two categories: message interrupt events and non-message interrupt events. Messagebased interrupt events include End-of-Message, Selected mode code, Format error, Subaddress control word interrupt, RT Circular buffer Rollover, Handshake failure, RT Command stack rollover, transmitter timeout, MT Data Stack rollover, 33 BU-6474X/6484X/6486X AL-11/12-0 DESCRIPTOR STACK CIRCULAR BUFFER* (128,256,...8192 WORDS) LOOK-UP TABLE BLOCK STATUS WORD TIME TAG WORD DATA BLOCK POINTER RECEIVED COMMAND WORD DATA POINTER RECEIVED (TRANSMITTED) MESSAGE DATA 50% ROLLOVER INTERRUPT 50% Note The example shown is for an RT Subaddress Circular Buffer. The 50% and 100% Rollover Interrupts are also applicable to the RT Global Circular Buffer, RT Command Stack, Monitor Command Stack, and Monitor Data Stack. 100% ROLLOVER INTERRUPT 100% FIGURE 9. 50% and 100% ROLLOVER INTERRUPTS INTERRUPT STATUS QUEUE (64 Locations) DESCRIPTOR STACK INTERRUPT VECTOR INTERRUPT VECTOR QUEUE POINTER REGISTER (IF) PARAMETER (POINTER) NEXT VECTOR BLOCK STATUS WORD TIME TAG DATA BLOCK POINTER RECEIVED COMMAND DATA WORD BLOCK FIGURE 10. RT (and MONITOR) INTERRUPT STATUS QUEUE (shown for message Interrupt event) Data Device Corporation www.ddc-web.com 34 BU-6474X/6484X/6486X AL-11/12-0 MT Command Stack rollover, RT Command Stack 50% rollover, MT Data Stack 50% rollover, MT Command Stack 50% rollover, and RT Circular buffer 50% rollover. Non-message interrupt events/conditions include time tag rollover, RT address parity error, RAM parity error, and BIT completed. For a RAM Parity Error non-message interrupt, the parameter will be the RAM address where the parity check failed. For the RT address Parity Error, Protocol Self-test Complete, and Time Tag rollover non-message interrupts, the parameter is not used; it will have a value of 0000. Bit 0 of the interrupt vector (interrupt status) word indicates whether the entry is for a message interrupt event (if bit 0 is logic "1") or a non-message interrupt event (if bit 0 is logic "0"). It is not possible for one entry on the queue to indicate both a message interrupt and a non-message interrupt. If enabled, an INTERRUPT STATUS QUEUE ROLLOVER interrupt will be issued when the value of the queue pointer address rolls over at a 64-word address boundary. As illustrated in FIGURE 10, for a message interrupt event, the parameter word is a pointer. The pointer will reference the first word of the RT or MT command stack descriptor (i.e., the Block Status Word). NOTE: Please see Appendix "F" of the Enhanced Mini-ACE User's Guide for important information applicable only to RT MODE operation, enabling of the interrupt status queue and use of specific non-message interrupts. TABLE 41. ILLEGALIZATION TABLE MEMORY MAP ADDRESS DESCRIPTION 300 301 302 303 * * * 33F 340 341 342 * * * 37D 37E 37F 380 381 382 383 * * * 3BE 3BF 3C0 3C1 3C2 3C3 * * * 3FC 3FD 3FE 3FF Brdcst / Rx, SA 0. MC15-0 Brdcst / Rx, SA 0. MC31-16 Brdcst / Rx, SA 1. WC15-0 Brdcst / Rx, SA 1. WC31-16 * * * Brdcst / Rx, SA 31. MC31-16 Brdcst / Tx, SA 0. MC15-0 Brdcst / Tx, SA 0. MC31-16 Brdcst / Tx, SA 1. WC15-0 * * * Brdcst / Tx, SA 30. WC31-16 Brdcst / Tx, SA 31. MC15-0 Brdcst / Tx, SA 31. MC31-16 Own Addr / Rx, SA 0. MC15-0 Own Addr / Rx, SA 0. MC31-16 Own Addr / Rx, SA 1. WC15-0 Own Addr / Rx, SA 1. WC31-16 * * * Own Addr / Rx, SA 31. MC15-0 Own Addr / Rx, SA 31. MC31-16 Own Addr / Tx, SA 0. MC15-0 Own Addr / Tx, SA 0. MC31-16 Own Addr / Tx, SA 1. WC15-0 Own Addr / Tx, SA 1. WC31-16 * * * Own Addr / Tx, SA 30. WC15-0 Own Addr / Tx, SA 30. WC31-16 Own Addr / Tx, SA 31. MC15-0 Own Addr / Tx, SA 31. MC31-16 Data Device Corporation www.ddc-web.com 35 BU-6474X/6484X/6486X AL-11/12-0 RT COMMAND ILLEGALIZATION RT AUTO-BOOT OPTION The Mini-ACE Mark3 provides an internal mechanism for RT Command Word illegalizing. By means of a 256-word area in shared RAM, the host processor may designate that any message be illegalized, based on the command word T/R bit, subaddress, and word count/mode code fields. The Mini-ACE Mark3 illegalization scheme provides the maximum in flexibility, allowing any subset of the 4096 possible combinations of broadcast/ own address, T/R bit, subaddress, and word count/mode code to be illegalized. If utilized, the RT pin-programmable auto-boot option allows the Mini-ACE Mark3 RT to automatically initialize as an active remote terminal with the Busy status word bit set to logic "1" immediately following power turn-on. This is a useful feature for MIL-STD-1760 applications, in which the RT is required to be responding within 150 ms after power-up. This feature is available for versions of the Mini-ACE Mark3 with 4K words of RAM. OTHER RT FEATURES The Mini-ACE Mark3 includes options for the Terminal flag status word bit to be set either under software control and/or automatically following a failure of the loopback self-test. Other software programmable RT options include software programmable RT status and RT BIT words, automatic clearing of the Service Request bit following receipt of a Transmit vector word mode command, options regarding Data Word transfers for the Busy and Message error (illegal) Status word bits, and options for the handling of 1553A and reserved mode codes. The address map of the Mini-ACE Mark3's illegalizing table is illustrated in TABLE 41. BUSY BIT The Mini-ACE Mark3 RT provides two different methods for setting the Busy status word bit: (1) globally, by means of Configuration Register #1; or (2) on a T/R-bit/subaddress basis, by means of a RAM lookup table. If the host CPU asserts the BUSY bit to logic "0" in Configuration Register #1, the Mini-ACE Mark3 RT will respond to all non-broadcast commands with the Busy bit set in its RT Status Word. MONITOR ARCHITECTURE Alternatively, there is a Busy lookup table in the Mini-ACE Mark3 shared RAM. By means of this table, it is possible for the host processor to set the busy bit for any selectable subset of the 128 combinations of broadcast/own address, T/R bit, and subaddress. The Mini-ACE Mark3 includes three monitor modes: (1) A Word Monitor mode (2) A selective message monitor mode If the busy bit is set for a transmit command, the Mini-ACE Mark3 RT will respond with the busy bit set in the status word, but will not transmit any data words. If the busy bit is set for a receive command, the RT will also respond with the busy status bit set. There are two programmable options regarding the reception of data words for a non-mode code receive command for which the RT is busy: (1) to transfer the received data words to shared RAM; or (2) to not transfer the data words to shared RAM. (3) A combined RT/message monitor mode For new applications, it is recommended that the selective message monitor mode be used, rather than the word monitor mode. Besides providing monitor filtering based on RT address, T/R bit, and subaddress, the message monitor eliminates the need to determine the start and end of messages by software. TABLE 42. RT BIT WORD RT ADDRESS BIT DESCRIPTION The Mini-ACE Mark3 offers several different options for designating the Remote Terminal address. These include the following: (1) hardwired, by means of the 5 RT ADDRESS inputs, and the RT ADDRESS PARITY input; (2) by means of the RT ADDRESS (and PARITY) inputs, but latched via hardware, on the rising edge of the RT_AD_LAT input signal; (3) input by means of the RT ADDRESS (and PARITY) inputs, but latched via host software; and (4) software programmable, by means of an internal register. In all four configurations, the RT address is readable by the host processor. 15(MSB) TRANSMITTER TIMEOUT RT BUILT-IN-TEST (BIT) WORD The bit map for the Mini-ACE Mark3's internal RT Built-in-Test (BIT) Word is indicated in TABLE 42. Data Device Corporation www.ddc-web.com 36 14 LOOP TEST FAILURE B 13 LOOP TEST FAILURE A 12 HANDSHAKE FAILURE 11 TRANSMITTER SHUTDOWN B 10 TRANSMITTER SHUTDOWN A 9 TERMINAL FLAG INHIBITED 8 BIT TEST FAILURE 7 HIGH WORD COUNT 6 LOW WORD COUNT 5 INCORRECT SYNC RECEIVED 4 PARITY / MANCHESTER ERROR RECEIVED 3 RT-to-RT GAP / SYNC ADDRESS ERROR 2 RT-to-RT NO RESPONSE ERROR 1 RT-to-RT 2ND COMMAND WORD ERROR 0 (LSB) COMMAND WORD CONTENTS ERROR BU-6474X/6484X/6486X AL-11/12-0 TABLE 43. TYPICAL WORD MONITOR MEMORY MAP HEX ADDRESS FUNCTION 0000 First Received 1553 Word 0001 First Identification Word 0002 Second Received 1553 Word 0003 Second Identification Word 0004 Third Received 1553 Word 005 Third Identification Word * * * * * * 0100 Stack Pointer (Fixed Location - gets overwritten) * * * FFFF * * * Received 1553 Words and Identification Word both the trigger and the interrupt is stored in the Monitor Trigger Word Register. The pattern recognition interrupt is enabled by setting the MT Pattern Trigger bit in Interrupt Mask Register #1. The pattern recognition trigger is enabled by setting the Trigger Enable bit in Configuration Register #1 and selecting either the Start-on-trigger or the Stop-on-trigger bit in Configuration Register #1. The Word Monitor may also be started by means of a low-to-high transition on the EXT_TRIG input signal. SELECTIVE MESSAGE MONITOR MODE The Mini-ACE Mark3 Selective Message Monitor provides monitoring of 1553 messages with filtering based on RT address, T/R bit, and subaddress with no host processor intervention. By autonomously distinguishing between 1553 command and status words, the Message Monitor determines when messages begin and end, and stores the messages into RAM, based on a programmable filter of RT address, T/R bit, and subaddress. WORD MONITOR MODE In the Word Monitor Terminal mode, the Mini-ACE Mark3 monitors both 1553 buses. After the software initialization and Monitor Start sequences, the Mini-ACE Mark3 stores all Command, Status, and Data Words received from both buses. For each word received from either bus, a pair of words is stored to the Mini-ACE Mark3's shared RAM. The first word is the word received from the 1553 bus. The second word is the Monitor Identification (ID), or "Tag" word. The ID word contains information relating to bus channel, word validity, and inter-word time gaps. The data and ID words are stored in a circular buffer in the shared RAM address space. The selective monitor may be configured as just a monitor, or as a combined RT/Monitor. In the combined RT/Monitor mode, the Mini-ACE Mark3 functions as an RT for one RT address (including broadcast messages), and as a selective message monitor for the other 30 RT addresses. The Mini-ACE Mark3 Message Monitor contains two stacks, a command stack and a data stack, that are independent from the RT command stack. The pointers for these stacks are located at fixed locations in RAM. MONITOR SELECTION FUNCTION Following receipt of a valid command word in Selective Monitor mode, the Mini-ACE Mark3 will reference the selective monitor lookup table to determine if the particular command is enabled. The address for this location in the table is determined by means of an offset based on the RT Address, T/R bit, and Subaddress bit 4 of the current command word, and concatenating it to the monitor lookup table base address of 0280 (hex). The bit location within this word is determined by subaddress bits 3-0 of the current command word. WORD MONITOR MEMORY MAP A typical word monitor memory map is illustrated in TABLE 43. TABLE 43 assumes a 64K address space for the Mini-ACE Mark3's monitor. The Active Area Stack pointer provides the address where the first monitored word is stored. In the example, it is assumed that the Active Area Stack Pointer for Area A (location 0100) is initialized to 0000. The first received data word is stored in location 0000, the ID word for the first word is stored in location 0001, etc. If the specified bit in the lookup table is logic "0", the command is not enabled, and the Mini-ACE Mark3 will ignore this command. If this bit is logic "1", the command is enabled and the Mini-ACE Mark3 will create an entry in the monitor command descriptor stack (based on the monitor command stack pointer), and store the data and status words associated with the command into sequential locations in the monitor data stack. In addition, for an RT-to-RT transfer in which the receive command is selected, the second command word (the transmit command) is stored in the monitor data stack. The current Monitor address is maintained by means of a counter register. This value may be read by the CPU by means of the Data Stack Address Register. It is important to note that when the counter reaches the Stack Pointer address of 0100 or 0104, the initial pointer value stored in this shared RAM location will be overwritten by the monitored data and ID Words. When the internal counter reaches an address of FFFF (or 0FFF, for an Mini-ACE Mark3 with 4K RAM), the counter rolls over to 0000. WORD MONITOR TRIGGER The address definition for the Selective Monitor Lookup Table is illustrated in TABLE 44. In the Word Monitor mode, there is a pattern recognition trigger and a pattern recognition interrupt. The 16-bit compare word for Data Device Corporation www.ddc-web.com 37 BU-6474X/6484X/6486X AL-11/12-0 TABLE 45. TYPICAL SELECTIVE MESSAGE MONITOR MEMORY MAP (shown for 4K RAM for "Monitor only" mode) TABLE 44. MONITOR SELECTION TABLE LOOKUP ADDRESS BIT DESCRIPTION 15(MSB) Logic "0" 14 Logic "0" 13 Logic "0" 12 Logic "0" 11 Logic "0" 10 Logic "0" 9 ADDRESS (HEX) DESCRIPTION 0000-0101 Not Used 0102 Monitor Command Stack Pointer A (fixed location) 0103 Monitor Data Stack Pointer A (fixed location) 0104-0105 Not Used 0106 Monitor Command Stack Pointer B (fixed location) Logic "1" 0107 Monitor Data Stack Pointer B (fixed location) 8 Logic "0" 0108-027F Not Used 7 Logic "1" 0280-02FF Selective Monitor Lookup Table (fixed location) 6 RTAD_4 0300-03FF Not Used 5 RTAD_3 0400-07FF Monitor Command Stack A 4 RTAD_2 0800-0FFF Monitor Data Stack A 3 RTAD_1 2 RTAD_0 1 TRANSMIT / RECEIVE 0(LSB) data words and the receiving RT's status word stored in the monitor data stack. SUBADDRESS 4 SELECTIVE MESSAGE MONITOR MEMORY ORGANIZATION The size of the monitor command stack is programmable, with choices of 256, 1K, 4K, or 16K words. The monitor data stack size is programmable with choices of 512, 1K, 2K, 4K, 8K, 16K, 32K or 64K words. A typical memory map for the Mini-ACE Mark3 in the Selective Message Monitor mode, assuming a 4K RAM space, is illustrated in TABLE 45. This mode of operation defines several fixed locations in the RAM. These locations are allocated in a way in which none of them overlap with the fixed RT locations. This allows for the combined RT/Selective Message Monitor mode. MONITOR INTERRUPTS Selective monitor interrupts may be issued for End-of-message and for conditions relating to the monitor command stack pointer and monitor data stack pointer. The latter, as shown in FIGURE 9, include Command Stack 50% Rollover, Command Stack 100% Rollover, Data Stack 50% Rollover, and Data Stack 100% Rollover. The fixed memory map consists of two Monitor Command Stack Pointers (locations 102 and 106 hex), two Monitor Data Stack Pointers (locations 103 and 107 hex), and a Selective Message Monitor Lookup Table (locations 0280 through 02FF hex). For this example, the Monitor Command Stack size is assumed to be 1K words, and the Monitor Data Stack size is assumed to be 2K words. The 50% rollover interrupts may be used to inform the host processor when the command stack or data stack is half full. At that time, the host may proceed to read the received messages in the upper half of the respective stack, while the Mini-ACE Mark3 monitor writes messages to the lower half of the stack. Later, when the monitor issues a 100% stack rollover interrupt, the host can proceed to read the received data from the lower half of the stack, while the Mini-ACE Mark3 monitor continues to write received data words to the upper half of the stack. FIGURE 11 illustrates the Selective Message Monitor operation. Upon receipt of a valid Command Word, the Mini-ACE Mark3 will reference the Selective Monitor Lookup Table to determine if the current command is enabled. If the current command is disabled, the Mini-ACE Mark3 monitor will ignore (and not store) the current message. If the command is enabled, the monitor will create an entry in the Monitor Command Stack at the address location referenced by the Monitor Command Stack Pointer, and an entry in the monitor data stack starting at the location referenced by the Monitor Data Stack Pointer. INTERRUPT STATUS QUEUE Like the Mini-ACE Mark3 RT, the Selective Monitor mode includes the capability for generating an interrupt status queue. As illustrated in FIGURE 10, this provides a chronological history of interrupt generating events. Besides the two Interrupt Mask Registers, the Interrupt Status Queue provides additional filtering capability, such that only valid messages and/or only invalid messages may result in entries to the Interrupt Status Queue. The interrupt status queue is 64 words deep, providing the capability to store entries for up to 32 monitored messages. The format of the information in the data stack depends on the format of the message that was processed. For example, for a BC-to-RT transfer (receive command), the monitor will store the command word in the monitor command descriptor stack, with the Data Device Corporation www.ddc-web.com 38 BU-6474X/6484X/6486X AL-11/12-0 MISCELLANEOUS decoders' sampling frequency, this serves to widen the tolerance to zero-crossing distortion, and reduce the bit error rate. CLOCK INPUT The Mini-ACE Mark3 decoder is capable of operating from a 10, 12, 16, or 20 MHz clock input. Depending on the configuration of the specific model Mini-ACE Mark3 terminal, the selection of the clock input frequency may be chosen by one of either two methods. For all versions, the clock frequency may be specified by means of the host processor writing to Configuration Register #6. With the second method, which is applicable only for the versions incorporating 4K (but not 64K) words of internal RAM, the clock frequency may be specified by means of the input signals that are otherwise used as the A15 and A14 address lines. For interfacing to fiber optic transceivers (e.g., for MIL-STD-1773 applications), the decoders are capable of operating with singleended, rather than double-ended, input signals. The standard transceiverless version (BU-64XXXX0) of the Mini-ACE Mark3 is internally strapped for single-ended input signals. For applications involving the use of double-ended transceivers, it is suggested that you contact the factory at DDC regarding a doubleended transceiverless version of the Mini-ACE Mark3. TIME TAG The Mini-ACE Mark3 includes an internal read/writable Time Tag Register. This register is a CPU read/writable 16-bit counter with a programmable resolution of either 2, 4, 8, 16, 32, or 64 s per LSB. Another option allows software controlled incrementing of the Time Tag Register. This supports self-test for the Time Tag Register. For each message processed, the value of the Time ENCODER/DECODERS For the selected clock frequency, there is internal logic to derive the necessary clocks for the Manchester encoder and decoders. For all clock frequencies, the decoders sample the receiver outputs on both edges of the input clock. By in effect doubling the CONFIGURATION REGISTER #1 15 13 MONITOR COMMAND STACK POINTERS MONITOR COMMAND STACKS MONITOR DATA STACKS 0 CURRENT AREA B/A BLOCK STATUS WORD CURRENT COMMAND WORD TIME TAG WORD DATA BLOCK POINTER RECEIVED COMMAND WORD MONITOR DATA BLOCK #N MONITOR DATA BLOCK #N + 1 MONITOR DATA STACK POINTERS NOTE IF THIS BIT IS "0" (NOT SELECTED) NO WORDS ARE STORED IN EITHER THE COMMAND STACK OR DATA STACK. IN ADDITION, THE COMMAND AND DATA STACK POINTERS WILL NOT BE UPDATED. SELECTIVE MONITOR LOOKUP TABLES OFFSET BASED ON RTA4-RTA0, T/R, SA4 SELECTIVE MONITOR ENABLE (SEE NOTE) FIGURE 11. SELECTIVE MESSAGE MONITOR MEMORY MANAGEMENT Data Device Corporation www.ddc-web.com 39 BU-6474X/6484X/6486X AL-11/12-0 Tag Register is loaded into the second location of the respective descriptor stack entry ("TIME TAG WORD") for both the BC and RT modes. For the Mini-ACE Mark3's Enhanced BC mode, there are four user-defined interrupt bits. The BC Message Sequence Control Engine includes an instruction enabling it to issue these interrupts at any time. The functionality involving the Time Tag Register that's compatible with ACE/Mini-ACE (Plus) includes: the capability to issue an interrupt request and set a bit in the Interrupt Status Register when the Time Tag Register rolls over FFFF to 0000; for RT mode, the capability to automatically clear the Time Tag Register following reception of a Synchronize (without data) mode command, or to load the Time Tag Register following a Synchronize (with data) mode command. For RT and Monitor modes, the Mini-ACE Mark3 architecture includes an Interrupt Status Queue. This provides a mechanism for logging messages that result in interrupt requests. Entries to the Interrupt Status Queue may be filtered such that only valid and/or invalid messages will result in entries on the queue. The Mini-ACE Mark3 incorporates additional interrupt conditions beyond the ACE/Mini-ACE (Plus), based on the addition of Interrupt Mask Register #2 and Interrupt Status Register #2. This is accomplished by chaining the two Interrupt Status Registers using the INTERRUPT CHAIN BIT (bit 0) in Interrupt Status Register #2 to indicate that an interrupt has occurred in Interrupt Status Register #1. Additional interrupts include "Self-Test Completed", masking bits for the Enhanced BC Control Interrupts, 50% Rollover interrupts for RT Command Stack, RT Circular Buffers, MT Command Stack, and MT Data Stack; BC Op Code Parity Error, (RT) Illegal Command, (BC) General Purpose Queue or (RT/MT) Interrupt Status Queue Rollover, Call Stack Pointer Register Error, BC Trap Op Code, and the four UserDefined interrupts for the Enhanced BC mode. Additional time tag features supported by the Mini-ACE Mark3 include the capability for the BC to transmit the contents of the Time Tag Register as the data word for a Synchronize (with data) mode command; the capability for the RT to "filter" the data word for the Synchronize with data mode command, by only loading the Time Tag Register if the LSB of the received data word is "0"; an instruction enabling the BC Message Sequence Control engine to load the Time Tag Register with a specified value; and an instruction enabling the BC Message Sequence Control engine to write the value of the Time Tag Register to the General Purpose Queue. INTERRUPTS BUILT-IN TEST The Mini-ACE Mark3 series terminals provide many programmable options for interrupt generation and handling. The interrupt output pin (INT) has three software programmable modes of operation: a pulse, a level output cleared under software control, or a level output automatically cleared following a read of the Interrupt Status Register (#1 or #2). A salient feature of the Mini-ACE Mark3 is its highly autonomous self-test capability. This includes both protocol and RAM selftests. Either or both of these self-tests may be initiated by command(s) from the host processor. The protocol test consists of a comprehensive toggle test of the terminal's logic. The test includes testing of all registers, Manchester decoders, protocol logic, and memory management logs. This test is completed in approximately 32,000 clock cycles. That is, about 1.6 ms with a 20 MHz clock, 2.0 ms at 16 MHz, 2.7 ms at 12 MHz, and 3.2 ms at 10 MHz. Individual interrupts are enabled by the two Interrupt Mask Registers. The host processor may determine the cause of the interrupt by reading the two Interrupt Status Registers, which provide the current state of interrupt events and conditions. The Interrupt Status Registers may be updated in two ways. In one interrupt handling mode, a particular bit in Interrupt Status Register #1 or #2 will be updated only if the event occurs and the corresponding bit in Interrupt Mask Register #1 or #2 is enabled. In the enhanced interrupt handling mode, a particular bit in one of the Interrupt Status Registers will be updated if the event/ condition occurs regardless of the value of the corresponding Interrupt Mask Register bit. In either case, the respective Interrupt Mask Register (#1 or #2) bit is used to enable an interrupt for a particular event/condition. There is also a separate built-in test (BIT) for the Mini-ACE Mark3's 4K X 16 or 64K X 16 shared RAM. This test consists of writing and then reading/verifying the two walking patterns "data = address" and "data = address inverted". This test takes 10 clock cycles per word. For a Mini-ACE Mark3 with 4K words of RAM, this is about 2.0 ms with a 20 MHz clock, 2.6 ms at 16 MHz, 3.4 ms at 12 MHz, or 4.1 ms at 10 MHz. For an Mini-ACE Mark3 with 64K words of RAM, this test takes about 32.8 ms with a 20 MHz clock, 40.1 ms at 16 MHz, 54.6 ms at 12 MHz, or 65.6 ms at 10 MHz. The Mini-ACE Mark3 supports all the interrupt events from ACE/ Mini-ACE (Plus), including RAM Parity Error, Transmitter Timeout, BC/RT Command Stack Rollover, MT Command Stack and Data Stack Rollover, Handshake Error, BC Retry, RT Address Parity Error, Time Tag Rollover, RT Circular Buffer Rollover, BC Message, RT Subaddress, BC End-of-Frame, Format Error, BC Status Set, RT Mode Code, MT Trigger, and End-of-Message. Data Device Corporation www.ddc-web.com The Mini-ACE Mark3 built-in protocol test is performed automatically at power-up. In addition, the protocol or RAM self-tests may be initiated by a command from the host processor, via the START/RESET REGISTER. For RT mode, this may include the host processor invoking self-test following receipt of an Initiate self-test mode command. The results of the self-test are host 40 BU-6474X/6484X/6486X AL-11/12-0 accessible by means of the BIT status register. For RT mode, the result of the self-test may be communicated to the bus controller via bit 8 of the RT BIT word ("0" = pass, "1" = fail). compatibility to ACE and Mini-ACE, the default for this RAM area is 0000h-03FFh. HOST PROCESSOR INTERFACE Assuming that the protocol self-test passes, all of the register and shared RAM locations will be restored to their state prior to the self-test, with the exception of the 60 RAM address locations 0342-037D and the TIME TAG REGISTER. Note that for RT mode, these locations map to the illegalization lookup table for "broadcast transmit subaddresses 1 through 30" (non-mode code subaddresses). Since MIL-STD-1553 does not define these as valid command words, this section of the illegalization lookup table is normally not used during RT operation. The TIME TAG REGISTER will continue to increment during the self-test. The Mini-ACE Mark3 supports a wide variety of processor interface configurations. These include shared RAM and DMA configurations, straightforward interfacing for 16-bit and 8-bit buses, support for both non-multiplexed and multiplexed address/data buses, non-zero wait mode for interfacing to a processor address/data buses, and zero wait mode for interfacing (for example) to microcontroller I/O ports. In addition, with respect to the ACE/Mini-ACE, the Mini-ACE Mark3 provides two major improvements: (1) reduced maximum host access time for shared RAM mode; and (2) increased maximum DMA grant time for the transparent/DMA mode. If there is a failure of the protocol self-test, it is possible to access information about the first failed vector. This may be done by means of the Mini-ACE Mark3's upper registers (register addresses 32 through 63). Through these registers, it is possible to determine the self-test ROM address of the first failed vector, the expected response data pattern (from the ROM), the register or memory address, and the actual (incorrect) data value read from register or memory. The on-chip self-test ROM is 4K X 24. The Mini-ACE Mark3's maximum host holdoff time (time prior to the assertion of the READYD handshake signal) has been significantly reduced. For ACE/Mini-ACE, this maximum holdoff time is 17 internal word transfer cycles, resulting in an overall holdoff time of approximately 4.6 s, using a 16 MHz clock. By comparison, using the Mini-ACE Mark3's ENHANCED CPU ACCESS feature, this worst-case holdoff time is reduced significantly, to a single internal transfer cycle. For example, when operating the Mini-ACE Mark3 in its 16-bit buffered, non-zero wait configuration with a 16 MHz clock input, this results in a maximum overall host transfer cycle time of 632 ns for a read cycle, or 570 ns for a write cycle. Note that the RAM self-test is destructive. That is, following the RAM self-test, regardless of whether the test passes or fails, the shared RAM is not restored to its state prior to this test. Following a failed RAM self-test, the host may read the internal RAM to determine which location(s) failed the walking pattern test. In addition, when using the ACE or Mini-ACE in the transparent/ DMA configuration, the maximum request-to-grant time, which occurs prior to an RT start-of-message sequence, is 4.0 s with a 16 MHz clock, or 3.5 s with a 12 MHz clock. For the Mini-ACE Mark3 functioning as a MIL-STD-1553B RT, this time has been increased to 8.5 s at 10 MHz, 9 s at 12 MHz, 10 s at 16 MHz, and 10.5 s at 20MHz. This provides greater flexibility, particularly for systems in which a host has to arbitrate among multiple DMA requestors. RAM PARITY The BC/RT/MT version of the Mini-ACE Mark3 is available with options of 4K or 64K words of internal RAM. For the 64K option, the RAM is 17 bits wide. The 64K X 17 internal RAM allows for parity generation for RAM write accesses, and parity checking for RAM read accesses. This includes host RAM accesses, as well as accesses by the Mini-ACE Mark3's internal logic. When the MiniACE Mark3 detects a RAM parity error, it reports it to the host processor by means of an interrupt and a register bit. Also, for the RT and Selective Message Monitor modes, the RAM address where a parity error was detected will be stored on the Interrupt Status Queue (if enabled). By far, the most commonly used processor interface configuration is the 16-bit buffered, non-zero wait mode. This configuration may be used to interface between 16-bit or 32-bit microprocessors and an Mini-ACE Mark3. In this mode, only the Mini-ACE Mark3's internal 4K or 64K words of internal RAM are used for storing 1553 message data and associated "housekeeping" functions. That is, in this configuration, the Mini-ACE Mark3 will never attempt to access memory on the host bus. RELOCATABLE MEMORY MANAGEMENT LOCATIONS In the Mini-ACE Mark3's default configuration, there is a fixed area of shared RAM addresses, 0000h-03FF, that is allocated for storage of the BC's or RT's pointers, counters, tables, and other "non-message" data structures. As a means of reducing the overall memory address space for using multiple Mini-ACE Mark3's in a given system (e.g., for use with the DMA interface configuration), the Mini-ACE Mark3 allows this area of RAM to be relocated by means of 6 configuration register bits. To provide backwards Data Device Corporation www.ddc-web.com FIGURE 12 illustrates a generic connection diagram between a 16-bit (or 32-bit) microprocessor and an Mini-ACE Mark3 for the 16-bit buffered configuration, while FIGURES 13 and 14, and associated tables illustrate the processor read and write timing respectively. 41 BU-6474X/6484X/6486X AL-11/12-0 +3.3V CLK IN CLOCK OSCILLATOR D15-D0 TX/RXA N/C A15-A12 CH. A TX/RXA A11-A0 ADDR_LAT CPU ADDRESS LATCH (NOTE 1) TRANSPARENT/BUFFERED +3.3V 16/8_BIT +3.3 V N/C TRIGGER_SEL N/C HOST TX/RXB MSB/LSB (NOTE 2) POLARITY_SEL (NOTE 3) ZERO_WAIT CH. B Mini-ACE Mark3 TX/RXB SELECT ADDRESS DECODER MEM/REG RD/WR RD/WR CPU STROBE STRBD CPU ACKNOWLEDGE READYD (NOTE 4) TAG_CLK RTAD4-RTAD0 RTADP RT ADDRESS, PARITY +3.3 V RESET MSTCLR SSFLAG/EXT_TRIG CPU INTERRUPT REQUEST INT NOTES: 1. CPU ADDRESS LATCH SIGNAL PROVIDED BY PROCESSORS WITH MULTIPLEXED ADDRESS/DATA BUSES. FOR PROCESSORS WITH NON-MULTIPLEXED ADDRESS AND DATA BUSES, ADDR_LAT SHOULD BE CONNECTED TO +3.3V. 2. IF POLARITY_SEL = "1", RD/WR IS HIGH TO READ, LOW TO WRITE. IF POLARITY_SEL = "0", RD/WR IS LOW TO READ, HIGH TO WRITE. 3. ZERO_WAIT SHOULD BE STRAPPED TO LOGIC "1" FOR NON-ZERO WAIT INTERFACE AND TO LOGIC "0" FOR ZERO WAIT INTERFACE. 4. CPU ACKNOWLEDGE PROCESSOR INPUT ONLY FOR NON-ZERO WAIT TYPE OF INTERFACE. FIGURE 12. HOST PROCESSOR INTERFACE - 16-BIT BUFFERED CONFIGURATION Data Device Corporation www.ddc-web.com 42 BU-6474X/6484X/6486X AL-11/12-0 t5 CLOCK IN t1 SELECT (Note 2,7) t6 t2 t14 t18 STRBD (Note 2) MEM/REG VALID (Note 3,4,7) t3 t7 t8 RD/WR (Note 4,5) t11 IOEN (Note 2,6) t13 READYD t4 (Note 6) A15-A0 t9 t19 t10 t15 t12 VALID (Note 7,8,9) t16 D15-D0 VALID (Note 6) t17 NOTES: 1. For the 16-bit buffered nonzero wait configuration, TRANSPARENT/BUFFERED must be connected to logic "0". ZERO_WAIT and DTREQ / 16/8 must be connected to logic "1". The inputs TRIGGER_SEL and MSB/LSB may be connected to either Vcc or ground. 2. SELECT and STRBD may be tied together. IOEN goes low on the first rising CLK edge when SELECT * STRBD is sampled low (satisfying t1) and the Mark3's protocol/memory management logic is not accessing the internal RAM. When this occurs, IOEN goes low, starting the transfer cycle. After IOEN goes low, SELECT may be released high. 3. MEM/REG must be presented high for memory access, low for register access. 4. MEM/REG and RD/WR are buffered transparently until the first falling edge of CLK after IOEN goes low. After this CLK edge, MEM/REG and RD/WR become latched internally. 5. The logic sense for RD/WR in the diagram assumes that POLARITY_SEL is connected to logic "1". If POLARITY_SEL is connected to logic "0", RD/WR must be asserted low to read. 6. The timing for IOEN, READYD and D15-D0 assumes a 50 pf load. For loading above 50 pf, the validity of IOEN, READYD, and D15-D0 is delayed by an additional 0.14 ns/pf typ, 0.28 ns/pf max. 7. The timing for A15-A0, MEM/REG and SELECT assumes that ADDR-LAT is connected to logic "1". Refer to Address Latch timing for additional details. 8. The address bus A15-A0 is internally buffered transparently until the first rising edge of CLK after IOEN goes low. After this CLK edge, A15-A0 become latched internally. 9. Setup time given for use in worst case timing calculations. None of the Mark3's input signals are required to be synchronized to the system clock. When SELECT and STRBD do not meet the setup time of t1, but occur during the setup window of an internal flip-flop, an additional clock cycle will be inserted between the falling clock edge that latches MEM/REG and RD/WR and the rising clock edge that latches the Address (A15-A0). When this occurs, the delay from IOEN falling to READYD falling (t11) increases by one clock cycle and the address hold time (t10) must be increased by one clock cycle. FIGURE 13. CPU READING RAM / REGISTER (16-BIT BUFFERED, NONZERO WAIT) Data Device Corporation www.ddc-web.com 43 BU-6474X/6484X/6486X AL-11/12-0 TABLE FOR FIGURE 13. CPU READING RAM OR REGISTERS (SHOWN FOR 16-BIT, BUFFERED, NONZERO WAIT MODE) DESCRIPTION REF t1 t2 t3 t4 NOTES SELECT and STRBD low setup time prior to clock rising edge 2, 9 SELECT and STRBD low to IOEN low (uncontended access @ 20 MHz) 5V LOGIC 3.3V LOGIC MIN TYP MAX MIN 10 15 TYP MAX UNITS ns 2, 6 100 105 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 20 MHz) 2, 6 3.6 3.6 s (contended access, with ENHANCED CPU ACCESS = "1" @ 20 MHz) 2, 6 515 520 ns (uncontended access @ 16 MHz) 2, 6 112 117 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 16 MHz) 2, 6 4.6 4.6 s (contended access, with ENHANCED CPU ACCESS = "1" s @ 16 MHz) 2, 6 630 635 ns (uncontended access @ 12 MHz) 2, 6 133 138 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 12 MHz) 2, 6 6.0 6.0 s (contended access, with ENHANCED CPU ACCESS = "1" @ 12 MHz) 2, 6 815 820 ns (uncontended access @ 10 MHz) 2, 6 150 155 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 10 MHz) 2, 6 7.2 7.2 s (contended access, with ENHANCED CPU ACCESS = "1" @ 10 MHz) 2, 6 965 970 ns Time for MEM/REG and RD/WR to become valid following SELECT and STRBD low (@ 20 MHz) 3, 4, 5, 7 15 10 ns @ 16 MHz 3, 4, 5, 7 21 16 ns @ 12 MHz 3, 4, 5, 7 32 27 ns @ 10 MHz 3, 4, 5, 7 40 35 ns Time for Address to become valid following SELECT and STRBD low (@ 20MHz) 17 12 ns @ 16 MHz 30 25 ns @ 12 MHz 50 45 ns @ 10 MHz 67 62 ns 40 40 ns t5 CLOCK IN rising edge delay to IOEN falling edge 6 t6 SELECT hold time following IOEN falling 2 0 0 ns t7 MEM/REG, RD/WR setup time prior to CLOCK IN falling edge 3, 4, 5, 7 10 15 ns t8 MEM/REG, RD/WR hold time following CLOCK IN falling edge 3, 4, 5, 7 30 30 ns t9 Address valid setup time prior to CLOCK IN rising edge 7, 8 30 35 ns t10 t11 Address hold time following CLOCK IN rising edge 7, 8, 9 30 30 ns IOEN falling delay to READYD falling (@ 20 MHz) 6, 9 135 @ 16 MHz 6, 9 170 187.5 205 @ 12 MHz 6, 9 235 250 265 @ 10 MHz 6, 9 285 300 315 t12 Output Data valid prior to READYD falling (@ 20 MHz) 150 165 135 150 165 ns 170 187.5 205 ns 235 250 265 ns 285 300 315 ns 6 21 11 ns @ 16 MHz 6 33 23 ns @ 12 MHz 6 54 44 ns @ 10 MHz 6 71 61 ns t13 CLOCK IN rising edge delay to READYD falling t14 READYD falling to STRBD rising release time t15 STRBD rising edge delay to IOEN rising edge and READYD rising edge t16 Output Data hold time following STRBD rising edge t17 STRBD rising delay to output data tri-state t18 STRBD high hold time from READYD rising t19 CLOCK IN rising edge delay to output data valid Data Device Corporation www.ddc-web.com 6 6 40 40 ns ns 30 40 ns 0 0 40 0 40 0 40 44 ns ns ns 40 ns BU-6474X/6484X/6486X AL-11/12-0 t6 CLOCK IN t1 SELECT (Note 2,7) t7 t2 t16 t18 STRBD (Note 2) MEM/REG VALID (Note 3,4,7) t3 t8 t9 RD/WR (Note 4,5) t14 IOEN (Note 2,6) t15 READYD t4 (Note 6) A15-A0 t10 t17 t12 VALID (Note 7,8,9,10) t5 D15-D0 t11 VALID (Note 9,10) t13 NOTES: 1. For the 16-bit buffered nonzero wait configuration TRANSPARENT/BUFFERED must be connected to logic "0", ZERO_WAIT and DTREG / 16/8 must be connected to logic "1". The inputs TRIGGER_SEL and MSB/LSB may be connected to either Vcc or ground. 2. SELECT and STRBD may be tied together. IOEN goes low on the first rising CLK edge when SELECT * STRBD is sampled low (satisfying t1) and the Mark3's protocol/memory management logic is not accessing the internal RAM. When this occurs, IOEN goes low, starting the transfer cycle. After IOEN goes low, SELECT may be released high. 3. MEM/REG must be presented high for memory access, low for register access. 4. MEM/REG and RD/WR are buffered transparently until the first falling edge of CLK after IOEN goes low. After this CLK edge, MEM/REG and RD/WR become latched internally. 5. The logic sense for RD/WR in the diagram assumes that POLARITY_SEL is connected to logic "1". If POLARITY_SEL is connected to logic "0", RD/WR must be asserted high to write. 6. The timing for the IOEN and READYD outputs assume a 50 pf load. For loading above 50 pf, the validity of IOEN and READYD is delayed by an additional 0.14 ns/pf typ, 0.28 ns/pf max. 7. The timing for A15-A0, MEM/REG, and SELECT assumes that ADDR-LAT is connected to logic "1". Refer to Address Latch timing for additional details. 8. The address bus A15-A0 and data bus D15-D0 are internally buffered transparently until the first rising edge of CLK after IOEN goes low. After this CLK edge, A15-A0 and D15-D0 become latched internally. 9. Setup time given for use in worst case timing calculations. None of the Mark3's input signals are required to be synchronized to the system clock. When SELECT and STRBD do not meet the setup time of t1, but occur during the setup time of an internal flip-flop, an additional clock cycle may be inserted between the falling clock edge that latches MEM/REG and RD/WR and the rising clock edge that latches the address (A15-A0) and data (D15-D0). When this occurs, the delay from IOEN falling to READYD falling (t14) increases by one clock cycle and the address and data hold time (t12 and t13) must be increased by one clock. FIGURE 14. CPU WRITING RAM / REGISTER (16-BIT BUFFERED, NONZERO WAIT) Data Device Corporation www.ddc-web.com 45 BU-6474X/6484X/6486X AL-11/12-0 TABLE FOR FIGURE 14. CPU WRITING RAM OR REGISTERS (SHOWN FOR 16-BIT, BUFFERED, NONZERO WAIT MODE) REF t1 t2 t3 t4 t5 DESCRIPTION NOTES SELECT and STRBD low setup time prior to clock rising edge 2, 10 SELECT and STRBD low to IOEN low (uncontended access @ 20 MHz) 2, 6 5V LOGIC 3.3V LOGIC MIN TYP MAX MIN TYP MAX 10 15 UNITS ns 100 105 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 20 MHz) 2, 6 3.6 3.6 s (contended access, with ENHANCED CPU ACCESS = "1" @ 20 MHz) 2, 6 465 470 ns (uncontended access @ 16 MHz) 2, 6 112 117 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 16 MHz) 2, 6 4.6 4.6 s (contended access, with ENHANCED CPU ACCESS = "1" @ 16 MHz) 2, 6 565 570 ns (uncontended access @ 12 MHz) 2, 6 133 138 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 12 MHz) 2, 6 6.0 6.0 s (contended access, with ENHANCED CPU ACCESS = "1" @ 12 MHz) 2, 6 732 737 ns (uncontended access @ 10 MHz) 2, 6 150 155 ns (contended access, with ENHANCED CPU ACCESS = "0" @ 10 MHz) 2, 6 7.2 7.2 s (contended access, with ENHANCED CPU ACCESS = "1" @ 10 MHz) 2, 6 865 870 ns 3, 4, 5, 7 15 10 ns @ 16 MHz 3, 4, 5, 7 21 16 ns @ 12 MHz 3, 4, 5, 7 32 27 ns @ 10 MHz 3, 4, 5, 7 40 35 ns 17 12 ns @ 16 MHz 30 25 ns @ 12 MHz 50 45 ns @ 10 MHz 67 62 ns 37 32 ns @ 16 MHz 50 45 ns @ 12 MHz 70 65 ns @ 10 MHz 87 82 ns 40 ns Time for MEM/REG and RD/WR to become valid following SELECT and STRBD low (@ 20 MHz) Time for Address to become valid following SELECT and STRBD low (@ 20MHz) Time for data to become valid following SELECT and STRBD low (@ 20 MHz) t6 CLOCK IN rising edge delay to IOEN falling edge 6 t7 SELECT hold time following IOEN falling 2 0 0 ns t8 MEM/REG, RD/WR setup time prior to CLOCK IN falling edge 3, 4, 5, 7 10 15 ns t9 MEM/REG, RD/WR setup time following CLOCK IN falling edge 3, 4, 5, 7 30 35 ns t10 Address valid setup time prior to CLOCK IN rising edge 7, 8 30 35 ns t11 Data valid setup time prior to CLOCK IN rising edge t12 Address valid hold time following CLOCK IN rising edge t13 t14 Data valid hold time following CLOCK IN rising edge IOEN falling delay to READYD falling @ 20 MHz 40 10 15 ns 7, 8, 9 30 30 ns 9 10 15 ns 6, 9 85 100 115 100 115 ns @ 16 MHz 6, 9 110 125 140 110 125 140 ns @ 12 MHz 6, 9 152 167 182 152 167 182 ns @ 10 MHz 6, 9 185 200 215 185 200 215 ns 6 40 40 ns ns 6 30 40 ns t15 CLOCK IN rising edge delay to READYD falling t16 READYD falling to STRBD rising release time t17 STRBD rising delay to IOEN rising edge and READYD rising edge t18 STRBD high hold time from . rising Data Device Corporation www.ddc-web.com 10 46 85 10 ns BU-6474X/6484X/6486X AL-11/12-0 +3.3 VOLT INTERFACE TO MIL-STD-1553 BUS (BU-64XXXX8/9) The Mini-ACE Mark3 is the world's first MIL-STD-1553 terminal powered entirely by 3.3 volts. Unique isolation transformer turns ratios, single output winding transformers and new interconnection methods are required in order to meet mandated MILSTD-1553 differential voltage levels. The center tap of the primary winding (the side of the transformer that connects to the Mark3) must be directly connected to the +3.3 volt plane. Additionally, a 10f, low inductance tantalum capacitor and a 0.01f ceramic capacitor must be mounted as close as possible and with the shortest leads to the center tap of the transformer(s) and ground plane. FIGURE 15 illustrates the two possible interface methods between the Mini-ACE Mark3 series and a MIL-STD-1553 bus. Connections for both direct (short stub, 1:3.75) and transformer (long stub, 1:2.7) coupling, as well as nominal peak-to-peak voltage levels at various points (when transmitting), are indicated in the diagram. Additionally, during transmission large currents flow from the transformer center tap, through the primaries and the TX/RX pins, and then out the transceiver grounds (pins 22 and 79) into the ground plane. The traces in this path should be sized accordingly and the connections to the ground plane should be as short as possible. 3.3V DATA BUS Z0 10F + SHORT STUB (DIRECT COUPLED) .01F (1:3.75) Mini-ACE Mark3/ Micro-ACE-TE 1 FT MAX TX/RX 55 (7.4 Vpp) 28 Vpp 7 Vpp 55 TX/RX DIRECT-COUPLED ISOLATION TRANSFORMER 3.3V 10F + OR .01F LONG STUB (TRANSFORMER COUPLED) (1:2.7) 0.75 Z0 20 FT MAX TX/RX 28 Vpp 20 Vpp (7.4 Vpp) Mini-ACE Mark3/ Micro-ACE-TE (1:1.41) TX/RX 7 Vpp 0.75 Z0 TRANSFORMER-COUPLED ISOLATION TRANSFORMER COUPLING TRANSFORMER NOTES: 1. Transformer center tap capacitors: use a 10F tantalum for low inductance, and a 0.01F ceramic. Both must be mounted as close as possible, and with the shortest leads to the center tap of the transformer(s) and ground. 2. Connect the Mark3 hybrid grounds as directly as possible to the 3.3V ground plane. 3. Zo = 70 to 85 Ohms. Z0 FIGURE 15. BU-64XXXX8/9 (+3.3 VOLT) INTERFACE TO MIL-STD-1553 BUS Data Device Corporation www.ddc-web.com 47 BU-6474X/6484X/6486X AL-11/12-0 +3.3 VOLT INTERFACE TO MIL-STD-1553 BUS (BU-64XXXXC/D) plane. The traces in this path should be sized accordingly and the connections to the ground plane should be as short as possible. FIGURE 16 illustrates the two possible interface methods between the Mini-ACE Mark3 series and a MIL-STD-1553 bus. Connections for both direct (short stub, 1:2.65) and transformer (long stub, 1:2.07) coupling, as well as nominal peak-to-peak voltage levels at various points (when transmitting), are indicated in the diagram. A 10f, low inductance tantalum capacitor and a 0.01f ceramic capacitor must be mounted as close as possible and with the shortest leads to the transceiver power input of the Mini-ACE Mark 3. The center tap of the primary winding (the side of the transformer that connects to the Mark3) must be directly connected to ground. Additionally, during transmission, large currents flow from the transceiver power supply through the TX/RX pins into the transformer primaries and then out the center tap into the ground DATA BUS Z0 3.3V + 10F .01F SHORT STUB (DIRECT COUPLED) (1:2.65) 1 FT MAX 55 TX/RX 7 Vpp 28 Vpp Mini-ACE Mark3/ Micro-ACE-TE 55 TX/RX DIRECT-COUPLED ISOLATION TRANSFORMER OR 3.3V + 10F .01F LONG STUB (TRANSFORMER COUPLED) (1:2.07) (1:1.41) 0.75 Z0 20 FT MAX TX/RX 28 Vpp 20 Vpp Mini-ACE Mark3/ Micro-ACE-TE TX/RX 7 Vpp 0.75 Z0 TRANSFORMER-COUPLED ISOLATION TRANSFORMER COUPLING TRANSFORMER NOTES: 1. Connect the Mark3 hybrid grounds as directly as possible to the 3.3V ground plane. 2. Zo = 70 to 85 Ohms. Z0 FIGURE 16. BU-64XXXXC/D (+3.3 VOLT) INTERFACE TO MIL-STD-1553 BUS Data Device Corporation www.ddc-web.com 48 BU-6474X/6484X/6486X AL-11/12-0 +3.3 VOLT ISOLATION TRANSFORMERS In selecting isolation transformers to be used with the Mini-ACE Mark3, there is a limitation on the maximum amount of leakage inductance. If this limit is exceeded, the transmitter rise and fall times may increase, possibly causing the bus amplitude to fall below the minimum level required by MIL-STD-1553. the primary center-tap, the inductance measured across the "secondary" (stub side) winding must also be less than 5.0 H (Transformer Coupled) and 10.0 H (Direct Coupled). The difference between these two measurements is the "differential" leakage inductance. This value must be less than 1.0 H (Transformer Coupled) and 2.0 H (Direct Coupled). In addition, an excessive leakage imbalance may result in a transformer dynamic offset that exceeds 1553 specifications. The maximum allowable leakage inductance is a function of the coupling method. For Transformer Coupled applications, it is a maximum of 5.0 H . For Direct it is a maximum of 10.0 H, and is measured as follows: Beta Transformer Technology Corporation (BTTC), a subsidiary of DDC, manufactures transformers in a variety of mechanical configurations with the required turns ratios of 1:3.75 direct coupled, and 1:2.7 transformer coupled for BU-6XXXXX8/9 Models and the required turns ratios of 1:2.65 direct coupled, and 1:2.07 transformer coupled for BU-6XXXXXC/D Models. TABLE 46 provides a listing of these transformers with the corresponding model numbers. The side of the transformer that connects to the Mark3 is defined as the "primary" winding. If one side of the primary is shorted to the primary center-tap, the inductance should be measured across the "secondary" (stub side) winding. This inductance must be less than 5.0 H (Transformer Coupled) and 10.0 H (Direct Coupled). Similarly, if the other side of the primary is shorted to For further information, contact BTTC at 631-244-7393 or at www.bttc-beta.com. TABLE 46. BTTC TRANSFORMERS FOR USE WITH +3.3 VOLT Mini-ACE Mark3 BTTC PART NUMBER # OF CHANNELS, CONFIGURATION COUPLING RATIO DESCRIPTION COUPLING RATIO (1:X) MOUNTING MAX HEIGHT WIDTH (INCLUDING LEADS) LENGTH (INCLUDING LEADS) BU-6XXXXX8/9 MLP-2033 Single Direct (1:3.75) SMT 0.185" 0.4" 0.52" BU-6XXXXXC/D MLP-2030 Single Direct (1:2.65) SMT 0.185" 0.4" 0.52" BU-6XXXXX8/9 MLP-3033 Single Direct (1:3.75) Through Hole 0.185" 0.4" 0.4" BU-6XXXXX8/9 MLP-2233 Single Transformer (1:2.7) SMT 0.185" 0.4" 0.52" BU-6XXXXXC/D MLP-2230 Single Transformer (1:2.07) SMT 0.185" 0.4" 0.52" BU-6XXXXX8/9 MLP-3233 Single Transformer (1:2.7) Through Hole 0.185" 0.4" 0.4" BU-6XXXXX8/9 MLP-3333 Single Direct & Transformer (1:3.75) & (1:2.7) Through Hole 0.185" 0.4" 0.4" BU-6XXXXXC/D LVB-4230 Single Transformer (1:2.07) SMT 0.165" 1.125" 0.625" BU-6XXXXXC/D DSS-3330 Dual (Side-by-Side) Direct & Transformer (1:2.65) & (1:2.07) SMT 0.185" 0.52" 0.675" BU-6XXXXX8/9 DSS-2033 Dual (Side-by-Side) Direct (1:3.75) SMT 0.13" 0.72" 0.96" BU-6XXXXX8/9 DSS-2233 Dual (Side-by-Side) Transformer (1:2.7) SMT 0.13" 0.72" 0.96" BU-6XXXXX8/9 DSS-1003 Dual (Side-by-Side) Direct & Transformer (1:3.75) & (1:2.7) SMT 0.165" 0.72" 0.96" BU-6XXXXXC/D DSS-1630 Dual (Side-by-Side) Direct & Transformer (1:2.65) & (1:2.07) SMT 0.165" 0.72" 0.96" BU-6XXXXXC/D DLVB-4230 Dual (Stacked) Transformer (1:2.07) SMT 0.165" 0.72" 0.96" BU-6XXXXX8/9 TSM-2033 Dual (Stacked) Direct (1:3.75) SMT 0.32" 0.4" 0.52" BU-6XXXXX8/9 TSM-2233 Dual (Stacked) Transformer (1:2.7) SMT 0.32" 0.4" 0.52" BU-6XXXXXC/D TSM-2230 Dual (Stacked) Transformer (1:2.07) SMT 0.32" 0.4" 0.52" MODEL NUMBER Data Device Corporation www.ddc-web.com 49 BU-6474X/6484X/6486X AL-11/12-0 +5.0 VOLT INTERFACE TO MIL-STD-1553 BUS FIGURE 17 illustrates the interface between the +5.0 volt versions of the Mini-ACE Mark3 series and a MIL-STD-1553 bus. Connections for both direct (short stub) and transformer (long 10F stub) coupling, as well as the nominal peak-to-peak voltage levels at various points (when transmitting), are indicated in the diagram. DATA BUS Z0 5V + .01F (1:2.5) 1 FT MAX 55 TX/RX 11.2 Vpp Mini-ACE Mark3/ Micro-ACE-TE SHORT STUB (DIRECT COUPLED) 7 Vpp 28 Vpp 55 TX/RX ISOLATION TRANSFORMER OR 10F 5V + .01F (1:1.79) LONG STUB (TRANSFORMER COUPLED) (1:1.41) 0.75 Z0 20 FT MAX 28 Vpp 20 Vpp 11.2 Vpp Mini-ACE Mark3/ Micro-ACE-TE 7 Vpp 0.75 Z0 COUPLING TRANSFORMER ISOLATION TRANSFORMER Z0 NOTES: 1. Z 0 = 70 TO 85 OHMS 2. NOMINAL VOLTAGE LEVELS SHOWN FIGURE 17. MINI-ACE MARK3 / MICRO-ACE-TE (+5.0 VOLT) INTERFACE TO MIL-STD-1553 BUS Data Device Corporation www.ddc-web.com 50 BU-6474X/6484X/6486X AL-11/12-0 +5.0 VOLT ISOLATION TRANSFORMERS winding. This inductance must be less than 6.0 H. Similarly, if the other side of the primary is shorted to the primary center-tap, the inductance measured across the "secondary" (stub side) winding must also be less than 6.0 H. In selecting isolation transformers to be used with the Mini-ACE Mark3 / Micro-ACE-TE, there is a limitation on the maximum amount of leakage inductance. If this limit is exceeded, the transmitter rise and fall times may increase, possibly causing the bus amplitude to fall below the minimum level required by MILSTD-1553. In addition, an excessive leakage imbalance may result in a transformer dynamic offset that exceeds 1553 specifications. The difference between these two measurements is the "differential" leakage inductance. This value must be less than 1.0 H. Beta Transformer Technology Corporation (BTTC), a subsidiary of DDC, manufactures transformers in a variety of mechanical configurations with the required turns ratios of 1:2.5 direct coupled, and 1:1.79 transformer coupled. TABLE 47 provides a listing of many of these transformers. The maximum allowable leakage inductance is 6.0 H, and is measured as follows: The side of the transformer that connects to the Mini-ACE Mark3 / Micro-ACE-TE is defined as the "primary" winding. If one side of the primary is shorted to the primary center-tap, the inductance should be measured across the "secondary" (stub side) For further information, contact BTTC at 631-244-7393 or at www.bttc-beta.com. TABLE 47. BTTC TRANSFORMERS FOR USE WITH 5.0 VOLT Mini-ACE Mark3 / MICRO-ACE-TE MOUNTING MAX HEIGHT WIDTH (INCLUDING LEADS) LENGTH (INCLUDING LEADS) (1:2.5) SMT 0.185" 0.4" 0.52" (1:2.5) Through Hole 0.185" 0.4" 0.4" Direct (1:2.5) Through Hole 0.25" 0.35" 0.5" Single Transformer (1:1.79) SMT 0.185" 0.4" 0.52" Single Transformer (1:1.79) Through Hole 0.185" 0.4" 0.4" Single Transformer (1:1.79) Through Hole 0.25" 0.35" 0.5" SMT 0.19" 0.63" 1.13" BTTC PART NUMBER # OF CHANNELS, CONFIGURATION COUPLING RATIO DESCRIPTION COUPLING RATIO (1:X) MLP-2005 Single Direct MLP-3005 Single Direct B-3230 (-30) # Single MLP-2205 MLP-3205 B-3229 (-29) # HLP-6015 # Single Direct & Transformer (1:2.5) & (1:1.79) B-3227 (-27) # Single Direct & Transformer (1:2.5) & (1:1.79) SMT 0.29" 0.63" 1.13" MLP-3305 Single Direct & Transformer (1:2.5) & (1:1.79) Through Hole 0.185" 0.4" 0.4" B-3226 (-26) # Single Direct & Transformer (1:2.5) & (1:1.79) Through Hole 0.25" 0.625" 0.625" HLP-6014 # Single Direct & Transformer (1:2.5) & (1:1.79) Flat Pack 0.19" 0.63" 1.13" B-3231 (-31) # Single Direct & Transformer (1:2.5) & (1:1.79) Flat Pack 0.29" 0.63" 1.13" DSS-2005 Dual (Side-by-Side) Direct (1:2.5) SMT 0.13" 0.72" 0.96" DSS-2205 Dual (Side-by-Side) Transformer (1:1.79) SMT 0.13" 0.72" 0.96" DSS-1005 Dual (Side-by-Side) Direct & Transformer (1:2.5) & (1:1.79) SMT 0.165" 0.72" 0.96" TSM-2005 Dual (Stacked) Direct (1:2.5) SMT 0.32" 0.4" 0.52" TSM-2205 Dual (Stacked) Transformer (1:1.79) SMT 0.32" 0.4" 0.52" TST-9117 # Dual (Stacked) Direct & Transformer (1:2.5) & (1:1.79) SMT 0.335" 1.125" 1.125" TST-9107 # Dual (Stacked) Direct & Transformer (1:2.5) & (1:1.79) Through Hole 0.335" 0.625" 0.625" TST-9127 # Dual (Stacked) Direct & Transformer (1:2.5) & (1:1.79) Flat Pack 0.335" 0.625" 0.625" Notes: 1. All Transformers in the table above can be used with BU-6XXXXX3/6 (1553B transceivers). 2. Transformers identified with "#" in the table above are not recommended for use with the BU-6XXXXX4 (McAir-Compatable transceivers) Data Device Corporation www.ddc-web.com 51 BU-6474X/6484X/6486X AL-11/12-0 THERMAL MANAGEMENT FOR MICRO-ACE-TE (324-BALL BGA PACKAGE) balls be directly soldered to a circuit ground/thermal plane (a circuit trace is insufficient). Operation without an adequate ground/thermal plane is not recommended and extended exposure to these conditions may affect device reliability. Ball Grid Array (BGA) components necessitate that thermal management issues be considered early in the design stage for MIL-STD-1553 terminals. This is especially true if high transmitter duty cycles are expected. The temperature range specified for DDC's Micro-ACE-TE device refers to the temperature at the ball, not the case. The purpose of this ground/thermal plane is to conduct the heat being generated by the transceivers within the package and conduct this heat away from the Micro-ACE-TE. In general, the circuit ground and thermal (chassis) ground are not the same ground plane. It is acceptable for these balls to be directly soldered to a ground plane but it must be located in close physical and thermal proximity ("0.003" pre-preg layer recommended) to the thermal plane. All Micro-ACE-TE devices incorporate multiple package connections which perform the dual function of transceiver circuit ground and thermal heat sink. Refer to the pinout tables for thermal ball connection locations. It is mandatory that these thermal 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 S/N D/C V U T R P N M L K J H G F E D C B A ESD and Pin 1 Identifier BOTTOM VIEW TOP VIEW FIGURE 18. BALL LOCATIONS FOR MICRO-ACE-TE (324-BALL BGA PACKAGE) Data Device Corporation www.ddc-web.com 52 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS TABLE 48. POWER AND GROUND SIGNAL NAME BU-64743F/G0 BU-64843F/G0 BU-64863F/G0 BU-64743F/G3/4 BU-64843F/G3/4 BU-64863F/G3/4 BU-64745F/G3/4 BU-64845F/G3/4 BU-64743F/G8/9/C/D BU-64843F/G8/9/C/D BU-64863F/G8/9/C/D PIN PIN PIN PIN DESCRIPTION + 3.3V_Xcvr - - - 10 + 3.3 Volt Transceiver Power + 5.0V_Xcvr - 10 10 - + 5.0 Volt Transceiver Power + 3.3V_Logic 10, 30, 51, 69 30, 51, 69 - 30, 51, 69 +3.3 Volt Logic Power + 5.0V_Logic - - 30, 51, 69 - +5.0 Volt Logic Power Gnd_Xcvr - 22, 79 22, 79 22, 79 Gnd_Logic 22, 79, 31, 50, 70 31, 50, 70 31, 50, 70 31, 50, 70 Transceiver Ground Logic Ground NOTE: Logic ground and transceiver ground are not tied together inside the package. TABLE 49. 1553 ISOLATION TRANSFORMER (BU-64XXXF/G3/4/8/9/C/D VERSIONS) SIGNAL NAME BU-6474XF/G3/4/8/9/C/D BU-6484XF/G3/4/8/9/C/D BU-64863F/G3/4/8/9/C/D DESCRIPTION PIN TX/RX-A (I/O) 3 TX/RX-A (I/O) 5 TX/RX-B (I/O) 15 TX/RX-B (I/O) 17 Analog Transmit/Receive Input/Outputs. Connect directly to 1553 isolation transformers. TABLE 50. INTERFACE TO EXTERNAL TRANSCEIVER (BU-64XX3F/G0 TRANSCEIVERLESS VERSION) SIGNAL NAME BU-64743F/G0 BU-64843F/G0 BU-64863F/G0 DESCRIPTION PIN TXDATA_A (O) 3 TXDATA_A (O) 5 RXDATA_A (I) 8 RXDATA_A (I, not enabled)* 4 TXINH_A_OUT (O) 11 TXDATA_B (O) 15 TXDATA_B (O) 17 RXDATA_B (I) 21 RXDATA_B (I, not enabled)* 16 TXINH_B_OUT (O) 9 Digital Manchester biphase transmit outputs, A bus Digital Manchester biphase receive inputs, A bus Digital output to inhibit external transmitter, A bus Digital Manchester biphase transmit outputs, B bus Digital Manchester biphase receive inputs, B bus Digital output to inhibit external transmitter, B bus 4K versions: UPADDREN / 64K versions: NC UPADDREN / NC 14 For 4K RAM versions, this signal is always configured as UPADDREN. This signal is used to control the function of the upper 4 address inputs (A15-A12). For these versions of Mark3 if UPADDREN is connected to logic "1", then these four signals operate as address lines A15-A12. If UPADDREN is connected to logic "0", then A15 and A14 function as CLK_SEL_1 and CLK_SEL_0 respectively; A13 MUST be connected to +3.3V-LOGIC; and A12 functions as RTBOOT. *NOTE: Standard transceiverless parts have their receiver inputs internally strapped for single-ended operation. The RXDATAx pins are connected to inputs that are not enabled. Contact the factory for a non-standard part that enables differential receive inputs. Data Device Corporation www.ddc-web.com 53 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 51. DATA BUS SIGNAL NAME BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN D15 (MSB) 59 D14 56 D13 54 D12 55 D11 58 D10 60 D9 57 D8 52 D7 53 D6 41 D5 49 D4 43 D3 48 D2 47 D1 42 D0 (LSB) 46 16-bit bi-directional data bus.This bus interfaces the host processor to the Mini-ACE Mark3's internal registers and internal RAM. In addition, in transparent mode, this bus allows data transfers to take place between the internal protocol/memory management logic and up to 64K x 16 of external RAM. Most of the time, the outputs for D15 through D0 are in the high impedance state. They drive outward in the buffered or transparent mode when the host CPU reads the internal RAM or registers. Also, in the transparent mode, D15-D0 will drive outward (towards the host) when the protocol/management logic is accessing (either reading or writing) internal RAM, or writing to external RAM. In the transparent mode, D15-D0 drives inward when the CPU writes internal registers or RAM, or when the protocol/memory management logic reads external RAM. TABLE 52. PROCESSOR ADDRESS BUS SIGNAL NAME 64K RAM (BU-64863F/GX) A15 (MSB) 4K RAM (BU-6474XF/GX BU-6484XF/GX) A15 / CLK_ SEL_1 BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN 73 16-bit bi-directional address bus. For 64K RAM versions, this signal is always configured as address line A15 (MSB). Refer to the description for A11-A0 below. For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as address line A15. For 4K RAM versions, if UPADDREN is connected to logic "0", this signal operates as CLK_SEL_1. In this case, A15/CLK_SEL_1 and A14/CLK_SEL_0 are used to select the Mark3 clock frequency, as follows: CLK_SEL_1 0 0 1 1 A14 A14 / CLK_ SEL_0 80 CLK_SEL_0 0 1 0 1 Clock Frequency 10 MHz 20 MHz 12 MHz 16 MHz For 64K RAM versions, this signal is always configured as address line A14. Refer to the description of A11-A0 below. For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as A14. For 4K RAM versions, if UPADDREN is connected to logic "0", then this signal operates as CLK_SEL_0. In this case, CLK_SEL_1 and CLK_SEL_0 are used to select the Mark3 clock frequency, as defined in the description for A15/CLK_SEL1 above. Data Device Corporation www.ddc-web.com 54 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 52. PROCESSOR ADDRESS BUS (CONT.) SIGNAL NAME 64K RAM (BU-64863F/GX) A13 4K RAM (BU-6474XF/GX BU-6484XF/GX) A13 / +3.3V/+5.0V LOGIC BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN 77 For 64K RAM versions, this signal is always configured as address line A13. Refer to the description for A11-A0 below. For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as A13. For 4K RAM versions, if UPADDREN is connected to logic "0", then this signal MUST be connected to +3.3V-LOGIC (logic "1") for the BU-64XX3 or +5.0V (logic "1") for the BU-64XX5. A12 A12 / RTBOOT 76 For 64K RAM versions, this signal is always configured as address line A12. Refer to the description for A11-A0 below. For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as A12. For 4K RAM versions, if UPADDREN is connected to logic "0", then this signal functions as RTBOOT. If RTBOOT is connected to logic "0", the Mark3 will initialize in RT mode with the Busy status word bit set following power turn-on. If RTBOOT is hardwired to logic "1", the Mark3 will initialize in either Idle mode (for an RT-only part), or in BC mode (for a BC/RT/MT part). SIGNAL NAME BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN A11 1 A10 2 A09 75 A08 7 A07 12 A06 27 A05 74 A04 78 A03 13 A02 19 A01 33 A00 (LSB) 18 Data Device Corporation www.ddc-web.com Lower 12 bits of 16-bit bi-directional address bus. In both the buffered and transparent modes, the host CPU accesses Mark3 registers and internal RAM by means of A11 - A0 (4K versions). For 64K versions, A15-A12 are also used for this purpose. In buffered mode, A12-A0 (or A15-A0) are inputs only. In the transparent mode, A12-A0 (or A15-A0) are inputs during CPU accesses and become outputs, driving outward (towards the CPU) when the 1553 protocol/memory management logic accesses up to 64K words of external RAM. In transparent mode, the address bus is driven outward only when the signal DTACK is low (indicating that the Mark3 has control of the RAM interface bus) and IOEN is high, indicating a non-host access. Most of the time, including immediately after power turn-on, A12-A0 (or A15-A0) will be in high impedance (input) state. 55 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 53. PROCESSOR INTERFACE CONTROL SIGNAL NAME BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN SELECT (I) 66 Device Select. Generally connected to a CPU address decoder output to select the Mark3 for a transfer to/from either RAM or register. STRBD (I) 68 Strobe Data. Used in conjunction with SELECT to initiate and control the data transfer cycle between the host processor and the Mark3. STRBD must be asserted low through the full duration of the transfer cycle. RD / WR (I) 71 Read/Write. For host processor access, RD/WR selects between reading and writing. In the 16-bit buffered mode, if POL_SEL is logic "0", then RD/WR should be low (logic "0") for read accesses and high (logic "1") for write accesses. If POL_SEL is logic "1", or the interface is configured for a mode other than 16-bit buffered mode, then RD/WR is high (logic "1") for read accesses and low (logic "0") for write accesses. ADDR_LAT(I) / MEMOE (O) 20 Memory Output Enable or Address Latch. In buffered mode, the ADDR_LAT input is used to configure the buffers for A15-A0, SELECT, MEM/REG, and MSB/LSB (for 8-bit mode only) in latched mode (when low) or transparent mode (when high). That is, the Mark3's internal transparent latches will track the values on A15-A0, SELECT, MEM/REG, and MSB/ LSB when ADDR_LAT is high, and latch the values when ADDR_LAT goes low. In general, for interfacing to processors with a non-multiplexed address/data bus, ADDR_LAT should be hardwired to logic "1". For interfacing to processors with a multiplexed address/data bus, ADDR_LAT should be connected to a signal that indicates a valid address when ADDR_LAT is logic "1". In transparent mode, MEMOE output signal is used to enable data outputs for external RAM read cycles (normally connected to the OE input signal on external RAM chips). ZEROWAIT (I) / MEMWR (O) 28 Memory Write or Zero Wait. In buffered mode, input signal (ZEROWAIT) used to select between the zero wait mode (ZEROWAIT = "0") and the non-zero wait mode (ZEROWAIT = "1"). In transparent mode, active low output signal (MEMWR) asserted low during memory write transfers to strobe data into external RAM (normally connected to the WR input signal on external RAM chips). 16 / 8 (I) / DTREQ (O) 29 Data Transfer Request or Data Bus Select. In buffered mode, input signal 16/8 used to select between the 16 bit data transfer mode (16/8= "1") and the 8-bit data transfer mode (16/8 = "0"). In transparent mode (16-bit only), active low level output signal DTREQ used to request access to the processor/RAM interface bus (address and data buses). MSB / LSB (I) / DTGRT (I) 72 Data Transfer Grant or Most Significant Byte/Least Significant Byte. In 8-bit buffered mode, input signal (MSB/LSB) used to indicate which byte is currently being transferred (MSB or LSB). The logic sense of MSB/LSB is controlled by the POL_SEL input. MSB/LSB is not used in the 16-bit buffered mode. In transparent mode, active low input signal (DTGRT) asserted in response to the DTREQ output to indicate that control of the external processor/RAM bus has been transferred from the host processor to the Mark3. Data Device Corporation www.ddc-web.com 56 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 53. PROCESSOR INTERFACE CONTROL (CONT.) SIGNAL NAME BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN POL_SEL (I) / DTACK (O) 35 Data Transfer Acknowledge or Polarity Select. In 16-bit buffered mode, if POL_SEL is connected to logic "1", RD/WR should be asserted high (logic "1") for a read operation and low (logic "0") for a write operation. In 16-bit buffered mode, if POL_SEL is connected to logic "0", RD/WR should be asserted low (logic "0") for a read operation and high (logic "1") for a write operation. In 8-bit buffered mode (TRANSPARENT/ BUFFERED = "0" and 16/8 = "0"), POL_SEL input signal used to control the logic sense of the MSB/LSB signal. If POL_SEL is connected to logic "0", MSB/LSB should be asserted low (logic "0") to indicate the transfer of the least significant byte and high (logic "1") to indicate the transfer of the most significant byte. If POL_SEL is connected to logic "1", MSB/LSB should be asserted high (logic "1") to indicate the transfer of the least significant byte and low (logic "0") to indicate the transfer of the most significant byte. In transparent mode, active low output signal (DTACK) used to indicate acceptance of the processor/RAM interface bus in response to a data transfer grant (DTGRT). Mark3 RAM transfers over A15-A0 and D15-D0 will be framed by the time that DTACK is asserted low. TRIG_SEL (I) / MEMENA_IN (I) 34 Memory Enable or Trigger Select input. In 8-bit buffered mode, input signal (TRIG-SEL) used to select the order in which byte pairs are transferred to or from the Mark3 by the host processor. In the 8-bit buffered mode, TRIG_SEL should be asserted high (logic 1) if the byte order for both read operations and write operations is MSB followed by LSB. TRIG_SEL should be asserted low (logic 0) if the byte order for both read operations and write operations is LSB followed by MSB. This signal has no operation in the 16-bit buffered mode (it does not need to be connected). In transparent mode, active low input MEMENA_IN, used as a Chip Select (CS) input to the Mark3's internal shared RAM. If only internal RAM is used, should be connected directly to the output of a gate that is OR'ing the DTACK and IOEN output signals. MEM / REG(I) 6 Memory/Register. Generally connected to either a CPU address line or address decoder output. Selects between memory access (MEM/REG = "1") or register access (MEM/REG = "0"). SSFLAG (I) / EXT_TRIG(I) 37 Subsystem Flag (RT) or External Trigger (BC/Word Monitor) input. In RT mode, if this input is asserted low, the Subsystem Flag bit will be set in the Mark3's RT Status Word. If the SSFLAG input is logic "0" while bit 8 of Configuration Register #1 has been programmed to logic "1" (cleared), the Subsystem Flag RT Status Word bit will become logic "1," but bit 8 of Configuration Register #1, SUBSYSTEM FLAG, will return logic "1" when read. That is, the sense on the SSFLAG input has no effect on the SUBSYSTEM FLAG register bit. In the non-enhanced BC mode, this signal operates as an External Trigger input. In BC mode, if the external BC Start option is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will issue a BC Start command, starting execution of the current BC frame. In the enhanced BC mode, during the execution of a Wait for External Trigger (WTG) instruction, the Mark3 BC will wait for a low-to-high transition on EXT_TRIG before proceeding to the next instruction. In the Word Monitor mode, if the external trigger is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will initiate a monitor start. This input has no effect in Message Monitor mode. TRANSPARENT/ BUFFERED (I) Data Device Corporation www.ddc-web.com 61 Used to select between the buffered mode (when strapped to logic "0") and transparent/DMA mode (when strapped to logic "1") for the host processor interface. 57 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 53. PROCESSOR INTERFACE CONTROL (CONT.) SIGNAL NAME BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN READYD (O) 62 Handshake output to host processor. For a nonzero wait state read access, READYD is asserted at the end of a host transfer cycle to indicate that data is available to be read on D15 through D0 when asserted (low). For a nonzero wait state write cycle, READYD is asserted at the end of the cycle to indicate that data has been transferred to a register or RAM location. For both nonzero wait reads and writes, the host must assert STRBD low until READYD is asserted low. In the (buffered) zero wait state mode, this output is normally logic "1", indicating that the Mark3 is in a state ready to accept a subsequent host transfer cycle. In zero wait mode, READYD will transition from high to low during (or just after) a host transfer cycle, when the Mark3 initiates its internal transfer to or from registers or internal RAM. When the Mark3 completes its internal transfer, READYD returns to logic "1", indicating it is ready for the host to initiate a subsequent transfer cycle. IOEN(O) 64 I/O Enable. Tri-state control for external address and data buffers. Generally not used in buffered mode. When low, indicates that the Mark3 is currently performing a host access to an internal register, or internal (for transparent mode) external RAM. In transparent mode, IOEN (low) should be used to enable external address and data bus tri-state buffers. SIGNAL NAME TABLE 54. RT ADDRESS BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN RTAD4 (MSB) (I) 40 RT Address input. RTAD3 (I) 39 If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the Mark3's RT address is provided by means of these 5 input signals. In addition, if RT ADDRESS SOURCE is logic "0", the source of RT address parity is RTADP. RTAD2 (I) 24 RTAD1 (I) 45 RTAD0 (LSB) (I) 38 If RT ADDRESS SOURCE is programmed to logic "1", then the Mark3's source for its RT address and parity is under software control, via data lines D5-D0. In this case, the RTAD4-RTAD0 and RTADP signals are not used. RTADP (I) 44 Remote Terminal Address Parity. There are many methods for using these input signals for designating the Mark3's RT address. For details, refer to the description of RT_AD_LAT. This input signal must provide an odd parity sum with RTAD4-RTAD0 in order for the RT to respond to non-broadcast commands. That is, there must be an odd number of logic "1"s from among RTAD-4-RTAD0 and RTADP. RT_AD_LAT (I) 36 RT Address Latch. Input signal used to control the Mark3's internal RT address latch. If RT_AD_LAT is connected to logic "0", then the Mark3 RT is configured to accept a hardwired (transparent) RT address from RTAD4-RTAD0 and RTADP. If RT_AD_LAT is initially logic "0", and then transitions to logic "1", the values presented on RTAD4-RTAD0 and RTADP will be latched internally on the rising edge of RT_AD_LAT. If RT_AD_LAT is connected to logic "1", then the Mark3's RT address is latchable under host processor control. In this case, there are two possibilities: (1) If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the source of the RT Address is the RTAD4-RTAD0 and RTADP input signals. (2) If RT ADDRESS SOURCE is programmed to logic "1", then the source of the RT Address is the lower 6 bits of the processor data bus, D5-D1 (for RTAD4-0) and D0 (for RTADP). In either of these two cases (with RT_AD_LAT = "1"), the processor will cause the RT address to be latched by: (1) Writing bit 15 of Configuration Register #3, ENHANCED MODE ENABLE, to logic "1". (2) Writing bit 3 of Configuration Register #4, LATCH RT ADDRESS WITH CONFIGURATION REGISTER #5, to logic "1". (3) Writing to Configuration Register #5. In the case of RT ADDRESS SOURCE = "1", then the values of RT address and RT address parity must be written to the lower 6 bits of Configuration Register #5, via D5-D0. In the case where RT ADDRESS SOURCE = "0", the bit values presented on D5-D0 become "don't care". Data Device Corporation www.ddc-web.com 58 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 55. MISCELLANEOUS SIGNAL NAME 64K RAM (BU-64863F/G 3/4/8/9/C/D) 4K RAM (BU-6474XF/GX BU-6484XF/GX) 64K RAM (BU-64863F/ G0) SLEEPIN (I) UPADDREN (I) NC BU-6474XF/GX BU-6484XF/GX BU-64863F/GX DESCRIPTION PIN 14 For 64K RAM versions with internal transceivers, this signal is always configured as SLEEPIN. This signal is used to control the transceiver sleep (power-down) circuitry in versions with 8/9 transceivers. For these versions of Mark3 if SLEEPIN is connected to logic "0", the transceivers are fully powered and operate normally. If SLEEPIN is connected to logic "1", the transceivers are in sleep mode (dormant, low-power mode) of operation and are NOT operational. For versions with 3/4/C/D transceivers, this signal has no effect. For 4K RAM versions, this signal is always configured as UPADDREN. This signal is used to control the function of the upper 4 address inputs (A15-A12). For these versions of Mark3 if UPADDREN is connected to logic "1", then these four signals operate as address lines A15-A12. If UPADDREN is connected to logic "0", then A15 and A14 function as CLK_SEL_1 and CLK_SEL_0 respectively; A13 MUST be connected to +3.3V-LOGIC; and A12 functions as RTBOOT. For 64K RAM transceiverless versions, this signal is always a No Connect (NC). INCMD (O) / MCRST (O) 32 In-command or Mode Code Reset. The function of this pin is controlled by bit 0 of Configuration Register #7, MODE CODE RESET/INCMD SELECT. If this register bit is logic "0" (default), INCMD will be active on this pin. For BC, RT, or Selective Message Monitor modes, INCMD is asserted low whenever a message is being processed by the Mark3. In Word Monitor mode, INCMD will be asserted low for as long as the monitor is online. For RT mode, if MODE CODE RESET/INCMD SELECT is programmed to logic "1", MCRST will be active. In this case, MCRST will be asserted low for two clock cycles following receipt of a Reset remote terminal mode command. In BC or Monitor modes, if MODE CODE RESET/INCMD SELECT is logic "1", this signal is inoperative; i.e., in this case, it will always output a value of logic "1". INT (O) 63 Interrupt Request output. If the LEVEL/PULSE interrupt bit (bit 3) of Configuration Register #2 is logic "0", a negative pulse of approximately 500ns in width is output on INT to signal an interrupt request. If LEVEL/PULSE is high, a low level interrupt request output will be asserted on INT. The level interrupt will be cleared (high) after either: (1) The processor writes a value of logic "1" to INTERRUPT RESET, bit 2 of the Start/Reset Register; or (2) If bit 4 of Configuration Register #2, INTERRUPT STATUS AUTO-CLEAR is logic "1" then it will only be necessary to read the Interrupt Status Register (#1 and/or #2) that is requesting an interrupt enabled by the corresponding Interrupt Mask Register. However, for the case where both Interrupt Status Register #1 and Interrupt Status Register #2 have bits set reflecting interrupt events, it will be necessary to read both interrupt status registers in order to clear INT. CLOCK_IN (I) 26 20 MHz, 16 MHz, 12 MHz, or 10 MHz clock input. TX_INH_A (I) 65 Transmitter inhibit inputs for Channel A and Channel B, MIL-STD-1553 transmitters. TX_INH_B (I) 67 For normal operation, these inputs should be connected to logic "0". To force a shutdown of Channel A and/or Channel B, a value of logic "1" should be applied to the respective TX_INH input. MSTCLR(I) 25 Master Clear. Negative true Reset input, normally asserted low following power turn-on. TAG_CLK (I) 23 Time Tag Clock. External clock that may be used to increment the Time Tag Register. This option is selected by setting Bits 7, 8 and 9 of Configuration Register # 2 to Logic "1". Data Device Corporation www.ddc-web.com 59 BU-6474X/6484X/6486X AL-11/12-0 FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) SIGNAL NAME BU-6474XF/GX BU-6484XF/GX BU-64863F/GX TABLE 56. NO USER CONNECTIONS DESCRIPTION PIN 4 8 NC 9 11 No User Connections to these pins allowed. 16 21 Data Device Corporation www.ddc-web.com 60 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS TABLE 57. POWER AND GROUND SIGNAL NAME BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL + 3.3V_Xcvr - + 5.0V_Xcvr F1, F2, U13,V13 DESCRIPTION A4, A5, B4, B5, J1, J2, J3, J4, J5, K1, + 3.3 Volt Transceiver Power K2, K3, K4, K5, U4, U5, V4, V5 - + 5.0 Volt Transceiver Power A8, A9, B8, B9, L16, L17, M16, M17, N12, N13, +3.3 V Logic Power P12, P13, R6, R7, T6, T7, U6, U7, V6, V7 + 3.3V_Logic - + 5.0V/ + 3.3V_Logic A7, L1, L2, L15, L16, M3, P7, P9, R9, V8 - +5.0V/+3.3V Logic Power. These balls may connect to either +5.0V or +3.3V. Refer to input signal VDD_Low (ball A13) to determine voltage selection options. + 5.0V_RAM P4, R4, (BU-64860B(R)3 only) - For BU-64860B3 this ball must be connected to +5.0V Gnd_Xcvr/ Thermal D3, D4, D5, E2, E3, E4, E5, F3, F4, F5, G2, G3, G4, G5, H3, H4, H5, P11, P12, P13, P14, P15, R11, R12, R13, R14, R15, T11, T12, T13, T14, T15, U12, U14 Gnd_Logic E12, E13, E14, F12, F13, F14, G12, G13, G14, H12, H13, H14 VDD_Low (I) A13 D3, D4, D5, E3, E4, E5, F1, F2, F3, F4, F5, G3, G4, G5, L3, Transceiver Ground/Thermal connections. See Thermal Management Section for L4, L5, M3, M4, M5, important user information. N1, N2, N3, N4, N5, P3, P4, P5 E10, E11, E12, F10, F11, F12, G10, G11, G12, H10, H11, H12, Logic Ground. R11, R12, R13, T11, T12, T13, U11, U12, U13 - Input that selects logic threshold voltage. Set to logic "0" for 3.3V threshold and to +5V(logic "1") for 5V threshold. Must match "+5.0V/+3V Logic" input voltage. NOTE: Logic ground and transceiver ground are not tied together inside the package. Data Device Corporation www.ddc-web.com 61 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 58. 1553 ISOLATION TRANSFORMER SIGNAL NAME BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL D1, D2, E1 D1, D2, E1, E2 TX/RX-A (I/O) G1, H1, H2 G1, G2, H1, H2 TX/RX-B (I/O) U11, V11, V12 L1, L2, M1, M2 TX/RX-B (I/O) U15, V14, V15 P1, P2, R1, R2 TX/RX-A (I/O) DESCRIPTION Analog Transmit/Receive Input/Outputs. Connect directly to 1553 isolation transformers. TABLE 59. MANDATORY ADDITIONAL CONNECTIONS & INTERFACE TO EXTERNAL TRANSCEIVER SIGNAL NAME SNGL_END (I) USING INTERNAL "BUILT-IN" TRANSCEIVERS No Connect "NC" if utilizing "Built-In" Transceivers BU-64743B8/C BU-64840B3/4 BU-64843B(R)8/C BU-64860B(R)3/4 BU-64863B(R)8/C BALL A15 FOR USE WITH EXTERNAL TRANSCEIVERS "TRANSCEIVERLESS" BALL If SNGL_END is connected to logic "0" the Manchester decoder inputs will be configured to accept single-ended input signals (e.g.,MIL-STD-1773 fiber optic receiver outputs). If SNGL_END is connected to logic "1," the decoder inputs will be configured to accept standard double-ended Manchester bi-phase input signals (i.e., MIL-STD-1553 receiver outputs). D14 These two signals MUST be separated for "Transceiverless" operation. TXINH_IN_A TXINH_OUT_A TXDATA_IN_A TXDATA_OUT_A TXDATA_IN_A TXDATA_OUT_A These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal RXDATA_OUT_A "Built-In" transceiver operation. RXDATA_IN_A These two signals MUST be directly connected for normal RXDATA_OUT_A "Built-In" transceiver operation. RXDATA_IN_A A4 E7 A5 E8 Digital transmit inhibit outputs. Connect to TX_INH_OUT inputs of external MIL-STD-1553 transceiver. Asserted high to inhibit when not transmitting on the respective bus. C8 C7 B8 C8 These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase transmit data outputs. Connect directly to corresponding inputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. C4 D7 C5 D8 D10 G8 E10 G7 E9 H8 F9 H7 Transmitter inhibit inputs for Channel A of external MIL-STD-1553 transmitters. To enable transmitter this input should be connected to logic "0". To force a shutdown of Channel A, a value of logic "1" should be applied to the respective TXINH input. These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase transmit data outputs. Connect directly to corresponding inputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase receive data inputs. Connect directly to corresponding outputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase receive data inputs. Connect directly to corresponding outputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. These two signals MUST be separated for "Transceiverless" operation. TXINH_IN_B TXINH_OUT_B These two signals MUST be directly connected for normal "Built-In" transceiver operation. Data Device Corporation www.ddc-web.com T8 N7 Transmitter inhibit inputs for Channel B of external MIL-STD-1553 transmitters. To enable transmitter this input should be connected to logic "0". To force a shutdown of Channel B, a value of logic "1" should be applied to the respective TXINH input. R8 N8 Digital transmit inhibit outputs. Connect to TX_INH_OUT inputs of external MIL-STD-1553 transceiver. Asserted high to inhibit when not transmitting on the respective bus. 62 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 59. MANDATORY ADDITIONAL CONNECTIONS & INTERFACE TO EXTERNAL TRANSCEIVER (CONT.) SIGNAL NAME TXDATA_IN_B TXDATA_OUT_B TXDATA_IN_B TXDATA_OUT_B RXDATA_IN_B RXDATA_OUT_B RXDATA_IN_B RXDATA_OUT_B BU-64743B8/C UTILIZING INTERNAL BU-64840B3/4 BU-64843B(R)8/C BU-64860B(R)3/4 "BUILT-IN" BU-64863B(R)8/C TRANSCEIVERS These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. These two signals MUST be directly connected for normal "Built-In" transceiver operation. BALL BALL R10 L7 P10 L8 N12 M7 M12 M8 M13 P10 M14 P9 N13 R10 N14 R9 FOR USE WITH EXTERNAL TRANSCEIVERS "TRANSCEIVERLESS" These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase transmit data outputs. Connect directly to corresponding inputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase transmit data outputs. Connect directly to corresponding inputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase receive data inputs. Connect directly to corresponding outputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. These two signals MUST be separated for "Transceiverless" operation. Digital manchester biphase receive data inputs. Connect directly to corresponding outputs of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver. TABLE 60. DATA BUS SIGNAL NAME BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL D15 (MSB) D15 D16 D14 E17 F15 D13 E16 E16 D12 E18 F18 D11 E15 E17 D10 F16 E18 D09 F15 F16 D08 F18 G18 D07 F17 F17 D06 G18 J18 D05 G16 H17 D04 G17 H18 D03 G15 G17 D02 H18 J17 D01 J17 K16 D00 (LSB) H17 K17 Data Device Corporation www.ddc-web.com DESCRIPTION 16-bit bi-directional data bus. This bus interfaces the host processor to the MiniACE Mark3's internal registers and internal RAM. In addition, in transparent mode, this bus allows data transfers to take place between the internal protocol/memory management logic and up to 64K x 16 of external RAM. Most of the time, the outputs for D15 through D0 are in the high impedance state. They drive outward in the buffered or transparent mode when the host CPU reads the internal RAM or registers. Also, in the transparent mode, D15-D0 will drive outward (towards the host) when the protocol/management logic is accessing (either reading or writing) internal RAM, or writing to external RAM. In the transparent mode, D15-D0 drives inward when the CPU writes internal registers or RAM, or when the protocol/memory management logic reads external RAM. 63 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 61. PROCESSOR ADDRESS BUS SIGNAL NAME 64K RAM (BU-6486XBX) A15 (MSB) 4K RAM (BU-64743B8 BU-6484XBX) A15 / CLK_ SEL_1 BU-64743B8/C BU-64840B3/4 BU-64843B(R)8/C BU-64860B(R)3/4 BU-64863B(R)8/C BALL BALL C10 A11 DESCRIPTION 16-bit bi-directional address bus. For 64K RAM versions, this signal is always configured as address line A15 (MSB). Refer to the description for A11-A0 below. For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as address line A15. For 4K RAM versions, if UPADDREN is connected to logic "0", this signal operates as CLK_SEL_1. In this case, A15/CLK_SEL_1 and A14/CLK_ SEL_0 are used to select the Mark3 clock frequency, as follows: CLK_SEL_1 0 0 1 1 A14 A14 / CLK_ SEL_0 A10 CLK_SEL_0 0 1 0 1 Clock Frequency 10 MHz 20 MHz 12 MHz 16 MHz For 64K RAM versions, this signal is always configured as address line A14. Refer to the description of A11-A0 below. A7 For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as A14. For 4K RAM versions, if UPADDREN is connected to logic "0", then this signal operates as CLK_SEL_0. In this case, CLK_SEL_1 and CLK_SEL_0 are used to select the Mark3 clock frequency, as defined in the description for A15/CLK_SEL1 above. A13 A13 / LOGIC "1" B10 For 64K RAM versions, this signal is always configured as address line A13. Refer to the description for A11-A0 below. B10 For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as A13. For 4K RAM versions, if UPADDREN is connected to logic "0", then this signal MUST be connected to +3.3V-LOGIC (logic "1"). A12 A12 / RTBOOT A9 For 64K RAM versions, this signal is always configured as address line A12. Refer to the description for A11-A0 below. A10 For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as A12. For 4K RAM versions, if UPADDREN is connected to logic "0", then this signal functions as RTBOOT. If RTBOOT is connected to logic "0", the Mark3 will initialize in RT mode with the Busy status word bit set following power turn-on. If RTBOOT is hardwired to logic "1", the Mark3 will initialize in either Idle mode (for an RT-only part), or in BC mode (for a BC/RT/MT part). Data Device Corporation www.ddc-web.com 64 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 61. PROCESSOR ADDRESS BUS (CONT.) SIGNAL NAME BU-64743B8/C BU-64840B3/4 BU-64843B(R)8/C BU-64860B(R)3/4 BU-64863B(R)8/C 64K RAM (BU-6486XBX) 4K RAM (BU-64743B8 BU-6484XBX) A11 A11 B9 E6 A10 A10 A8 C15 A09 A09 B7 C10 A08 A08 C9 D10 A07 A07 C7 D9 A06 A06 D7 V9 A05 A05 C6 C12 A04 A04 D8 B7 A03 A03 D6 E9 A02 A02 E8 C9 A01 A01 E7 U8 A00 A00 F10 F8 Data Device Corporation www.ddc-web.com BALL DESCRIPTION BALL Lower 12 bits of 16-bit bi-directional address bus. In both the buffered and transparent modes, the host CPU accesses Mark3 registers and internal RAM by means of A11 - A0 (4K versions). For 64K versions, A15-A12 are also used for this purpose. In buffered mode, A12-A0 (or A15-A0) are inputs only. In the transparent mode, A12-A0 (or A15-A0) are inputs during CPU accesses and become outputs, driving outward (towards the CPU) when the 1553 protocol/memory management logic accesses up to 64K words of external RAM. In transparent mode, the address bus is driven outward only when the signal DTACK is low (indicating that the Mark3 has control of the RAM interface bus) and IOEN is high, indicating a non-host access. Most of the time, including immediately after power turn-on, A12-A0 (or A15-A0) will be in high impedance (input) state. 65 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 62. PROCESSOR INTERFACE CONTROL SIGNAL NAME BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL B12 B12 Device Select. Generally connected to a CPU address decoder output to select the Mark3 for a transfer to/from either RAM or register. A12 Strobe Data. Used in conjunction with SELECT to initiate and control the data transfer cycle between the host processor and the Mark3. STRBD must be asserted low through the full duration of the transfer cycle. B11 Read/Write. For host processor access, RD/WR selects between reading and writing. In the 16-bit buffered mode, if POL_SEL is logic "0", then RD/WR should be low (logic "0") for read accesses and high (logic "1") for write accesses. If POL_SEL is logic "1", or the interface is configured for a mode other than 16-bit buffered mode, then RD/WR is high (logic "1") for read accesses and low (logic "0") for write accesses. SELECT (I) STRBD (I) RD / WR (I) A12 A11 DESCRIPTION Memory Output Enable or Address Latch. In buffered mode, the ADDR_LAT input is used to configure the buffers for A15-A0, SELECT, MEM/REG, and MSB/LSB (for 8-bit mode only) in latched mode (when low) or transparent mode (when high). That is, the Mark3's internal transparent latches will track the values on A15-A0, SELECT, MEM/REG, and MSB/ LSB when ADDR_LAT is high, and latch the values when ADDR_LAT goes low. ADDR_LAT(I) / MEMOE (O) L9 U10 In general, for interfacing to processors with a non-multiplexed address/data bus, ADDR_LAT should be hardwired to logic "1". For interfacing to processors with a multiplexed address/data bus, ADDR_LAT should be connected to a signal that indicates a valid address when ADDR_LAT is logic "1". In transparent mode, MEMOE output signal is used to enable data outputs for external RAM read cycles (normally connected to the OE input signal on external RAM chips). ZEROWAIT (I) / MEMWR (O) 16 / 8 (I) / DTREQ (O) Memory Write or Zero Wait. In buffered mode, input signal (ZEROWAIT) used to select between the zero wait mode (ZEROWAIT = "0") and the non-zero wait mode (ZEROWAIT = "1"). M10 T8 In transparent mode, active low output signal (MEMWR) asserted low during memory write transfers to strobe data into external RAM (normally connected to the WR input signal on external RAM chips). L10 R17 Data Transfer Request or Data Bus Select. In buffered mode, input signal 16/8 used to select between the 16 bit data transfer mode (16/8 = "1") and the 8-bit data transfer mode (16/8 = "0"). In transparent mode (16-bit only), active low level output signal DTREQ used to request access to the processor/RAM interface bus (address and data buses). MSB / LSB (I) / DTGRT (I) J7 B6 Data Transfer Grant or Most Significant Byte/Least Significant Byte. In 8-bit buffered mode, input signal (MSB/LSB) used to indicate which byte is currently being transferred (MSB or LSB). The logic sense of MSB/LSB is controlled by the POL_SEL input. MSB/LSB is not used in the 16-bit buffered mode. In transparent mode, active low input signal (DTGRT) asserted in response to the DTREQ output to indicate that control of the external processor/RAM bus has been transferred from the host processor to the Mark3. Data Device Corporation www.ddc-web.com 66 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 62. PROCESSOR INTERFACE CONTROL (CONT.) SIGNAL NAME BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL DESCRIPTION Data Transfer Acknowledge or Polarity Select. In 16-bit buffered mode, if POL_SEL is connected to logic "1", RD/WR should be asserted high (logic "1") for a read operation and low (logic "0") for a write operation. In 16-bit buffered mode, if POL_SEL is connected to logic "0", RD/WR should be asserted low (logic "0") for a read operation and high (logic "1") for a write operation. POL_SEL (I) / DTACK (O) N9 V8 In 8-bit buffered mode (TRANSPARENT/ BUFFERED = "0" and 16/8 = "0"), POL_ SEL input signal used to control the logic sense of the MSB/LSB signal. If POL_ SEL is connected to logic "0", MSB/LSB should be asserted low (logic "0") to indicate the transfer of the least significant byte and high (logic "1") to indicate the transfer of the most significant byte. If POL_SEL is connected to logic "1", MSB/ LSB should be asserted high (logic "1") to indicate the transfer of the least significant byte and low (logic "0") to indicate the transfer of the most significant byte. In transparent mode, active low output signal (DTACK) used to indicate acceptance of the processor/RAM interface bus in response to a data transfer grant (DTGRT). Mark3 RAM transfers over A15-A0 and D15-D0 will be framed by the time that DTACK is asserted low. Memory Enable or Trigger Select input. TRIG_SEL (I) / MEMENA_IN (I) L11 N17 In 8-bit buffered mode, input signal (TRIG-SEL) used to select the order in which byte pairs are transferred to or from the Mark3 by the host processor. In the 8-bit buffered mode, TRIG_SEL should be asserted high (logic 1) if the byte order for both read operations and write operations is MSB followed by LSB. TRIG_SEL should be asserted low (logic 0) if the byte order for both read operations and write operations is LSB followed by MSB. This signal has no operation in the 16-bit buffered mode (it does not need to be connected). In transparent mode, active low input MEMENA_IN, used as a Chip Select (CS) input to the Mark3's internal shared RAM. If only internal RAM is used, should be connected directly to the output of a gate that is OR'ing the DTACK and IOEN output signals. Memory/Register. MEM / REG(I) Data Device Corporation www.ddc-web.com C11 A6 Generally connected to either a CPU address line or address decoder output. Selects between memory access (MEM/REG = "1") or register access (MEM/REG = "0"). 67 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 62 . PROCESSOR INTERFACE CONTROL (CONT.) SIGNAL NAME BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL DESCRIPTION Subsystem Flag (RT) or External Trigger (BC/Word Monitor) input. In RT mode, if this input is asserted low, the Subsystem Flag bit will be set in the Mark3's RT Status Word. If the SSFLAG input is logic "0" while bit 8 of Configuration Register #1 has been programmed to logic "1" (cleared), the Subsystem Flag RT Status Word bit will become logic "1," but bit 8 of Configuration Register #1, SUBSYSTEM FLAG, will return logic "1" when read. That is, the sense on the SSFLAG input has no effect on the SUBSYSTEM FLAG register bit. SSFLAG (I) / EXT_TRIG(I) J8 R8 In the non-enhanced BC mode, this signal operates as an External Trigger input. In BC mode, if the external BC Start option is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will issue a BC Start command, starting execution of the current BC frame. In the enhanced BC mode, during the execution of a Wait for External Trigger (WTG) instruction, the Mark3 BC will wait for a low-to-high transition on EXT_ TRIG before proceeding to the next instruction. In the Word Monitor mode, if the external trigger is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will initiate a monitor start. This input has no effect in Message Monitor mode. TRANSPARENT/ BUFFERED (I) D16 D17 Used to select between the buffered mode (when strapped to logic "0") and transparent/DMA mode (when strapped to logic "1") for the host processor interface. Handshake output to host processor. READYD (O) C15 B15 For a nonzero wait state read access, READYD is asserted at the end of a host transfer cycle to indicate that data is available to be read on D15 through D0 when asserted (low). For a nonzero wait state write cycle, READYD is asserted at the end of the cycle to indicate that data has been transferred to a register or RAM location. For both nonzero wait reads and writes, the host must assert STRBD low until READYD is asserted low. In the (buffered) zero wait state mode, this output is normally logic "1", indicating that the Mark3 is in a state ready to accept a subsequent host transfer cycle. In zero wait mode, READYD will transition from high to low during (or just after) a host transfer cycle, when the Mark3 initiates its internal transfer to or from registers or internal RAM. When the Mark3 completes its internal transfer, READYD returns to logic "1", indicating it is ready for the host to initiate a subsequent transfer cycle. I/O Enable. IOEN(O) Data Device Corporation www.ddc-web.com C14 A15 Tri-state control for external address and data buffers. Generally not used in buffered mode. When low, indicates that the Mark3 is currently performing a host access to an internal register, or internal (for transparent mode) external RAM. In transparent mode, IOEN (low) should be used to enable external address and data bus tri-state buffers. 68 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 63. RT ADDRESS BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL RTAD4 (MSB) (I) J16 J15 RTAD3 (I) K17 M18 RTAD2 (I) L17 J16 RTAD1 (I) K18 L18 RTAD0 (LSB) (I) K16 N18 SIGNAL NAME DESCRIPTION RT Address input. If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the Mark3's RT address is provided by means of these 5 input signals. In addition, if RT ADDRESS SOURCE is logic "0", the source of RT address parity is RTADP. There are many methods for using these input signals for designating the Mark3's RT address. For details, refer to the description of RT_AD_LAT. If RT ADDRESS SOURCE is programmed to logic "1", then the Mark3's source for its RT address and parity is under software control, via data lines D5-D0. In this case, the RTAD4-RTAD0 and RTADP signals are not used. Remote Terminal Address Parity. RTADP (I) J18 K18 This input signal must provide an odd parity sum with RTAD4-RTAD0 in order for the RT to respond to non-broadcast commands. That is, there must be an odd number of logic "1"s from among RTAD-4-RTAD0 and RTADP. RT Address Latch. Input signal used to control the Mark3's internal RT address latch. If RT_AD_LAT is connected to logic "0", then the Mark3 RT is configured to accept a hardwired (transparent) RT address from RTAD4-RTAD0 and RTADP. If RT_AD_LAT is initially logic "0", and then transitions to logic "1", the values presented on RTAD4-RTAD0 and RTADP will be latched internally on the rising edge of RT_AD_LAT. RT_AD_LAT (I) L18 P18 If RT_AD_LAT is connected to logic "1", then the Mark3's RT address is latchable under host processor control. In this case, there are two possibilities: (1) If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the source of the RT Address is the RTAD4-RTAD0 and RTADP input signals. (2) If RT ADDRESS SOURCE is programmed to logic "1", then the source of the RT Address is the lower 6 bits of the processor data bus, D5-D1 (for RTAD4-0) and D0 (for RTADP). In either of these two cases (with RT_AD_LAT = "1"), the processor will cause the RT address to be latched by: (1) Writing bit 15 of Configuration Register #3, ENHANCED MODE ENABLE, to logic "1". (2) Writing bit 3 of Configuration Register #4, LATCH RT ADDRESS WITH CONFIGURATION REGISTER #5, to logic "1". (3) Writing to Configuration Register #5. In the case of RT ADDRESS SOURCE = "1", then the values of RT address and RT address parity must be written to the lower 6 bits of Configuration Register #5, via D5-D0. In the case where RT ADDRESS SOURCE = "0", the bit values presented on D5-D0 become "don't care". Data Device Corporation www.ddc-web.com 69 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 64. MISCELLANEOUS SIGNAL NAME 4K RAM 64K RAM (BU-64743B8/C (BU-6486XB(R)X) BU-6484XB(R)X) Logic "1" UPADDREN (I) BU-64743B8/C BU-64840B3/4 BU-64843B(R)8/C BU-64860B(R)3/4 BU-64863B(R)8/C BALL C12 DESCRIPTION BALL F7 This signal is used to control the function of the upper 4 address inputs (A15-A12). If UPADDREN is connected to logic "1", then these four signals operate as address lines A15-A12. If UPADDREN is connected to logic "0", then A15 and A14 function as CLK_SEL_1 and CLK_SEL_0 respectively; A13 MUST be connected to LOGIC "1"; and A12 functions as RTBOOT. SLEEPIN (I) - R4 For versions with type 8 transceivers, this signal is used to control the transceiver sleep (power-down) circuitry. If SLEEPIN is connected to logic "0", the transceivers are fully powered and operate normally. If SLEEPIN is connected to logic "1", the transceivers are in sleep mode (dormant, low-power mode) of operation and are NOT operational. For versions with type C transceivers, this signal has no effect. INCMD (O) H16 P17 For BC, RT, or Selective Message Monitor modes, INCMD is asserted low whenever a message is being processed by the Micro-ACE-TE. In Word Monitor mode, INCMD will be asserted low for as long as the monitor is online. MCRST (O) B13 D11 For RT mode MCRST will be asserted low for two clock cycles following receipt of a Reset remote terminal mode command. RSTBITEN (I) M18 L14 If this input is set to logic "1", the Built-In-Self-Test (BIST) will be enabled after hardware reset (for example, following power-up). A logic "0" input disables both the power-up and user-initiated automatic BIST. INT (O) D17 D18 Interrupt Request output. If the LEVEL/PULSE interrupt bit (bit 3) of Configuration Register #2 is logic "0", a negative pulse of approximately 500 ns in width is output on INT to signal an interrupt request. If LEVEL/PULSE is high, a low level interrupt request output will be asserted on INT. The level interrupt will be cleared (high) after either: (1) The processor writes a value of logic "1" to INTERRUPT RESET, bit 2 of the Start/Reset Register; or (2) If bit 4 of Configuration Register #2, INTERRUPT STATUS AUTO-CLEAR is logic "1" then it will only be necessary to read the Interrupt Status Register (#1 and/ or #2) that is requesting an interrupt enabled by the corresponding Interrupt Mask Register. However, for the case where both Interrupt Status Register #1 and Interrupt Status Register #2 have bits set reflecting interrupt events, it will be necessary to read both interrupt status registers in order to clear INT. CLOCK_IN (I) M9 T10 20 MHz, 16 MHz, 12 MHz, or 10 MHz clock input. TX_INH_A (I) A14 A14 TX_INH_B (I) C13 B14 MSTCLR (I) B11 R18 Master Clear. Negative true Reset input, normally asserted low following power turn-on. TAG_CLK (I) D18 F14 Time Tag Clock. External clock that may be used to increment the Time Tag Register. This option is selected by setting Bits 7, 8 and 9 of Configuration Register # 2 to Logic "1". Data Device Corporation www.ddc-web.com Transmitter inhibit inputs for Channel A and Channel B, MILSTD-1553 transmitters. For normal operation, these inputs should be connected to logic "0". To force a shutdown of Channel A and/or Channel B, a value of logic "1" should be applied to the respective TX_INH input. 70 BU-6474X/6484X/6486X AL-11/12-0 BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.) TABLE 65. NO USER CONNECTIONS SIGNAL NAME NC BU-64840B3/4 BU-64860B(R)3/4 BU-64743B8/C BU-64843B(R)8/C BU-64863B(R)8/C BALL BALL A1, A2, A3, A6, A16, A17, A18, B1, B2, B3, B4, B5, B6, B14, B15, B16, B17, B18, C1, C2, C3, C16, C17, C18, D9, D11, D12, D13, D14, E6, E11, F6, F7, F8, F11, G6, G7, G8, G9, G10, G11, H6, H7, H8, H9, H10, H11, H15, J1, J2, J3, J4, J5, J6, J9, J10, J11, J12, J13, J14, J15, K1, K2, K3, K4, K5, K6, K7, K8, K9, K10, K11, K12, K13, K14, K15, L3, L4, L5, L6, L7, L8, L12, L13, L14, M1, M2, M4, M5, M6, M7, M8, M11, M15, M16, M17, N1, N2, N3, N4, N5, N6, N7, N8, N10, N11, N15, N16, N17, N18, P1, P2, P3, P5, P6, P8, P16, P17, P18, R1, R2, R3, R5, R6, R7, R16, R17, R18, T1, T2, T3, T4, T5, T6, T7, T9, T10, T16, T17, T18, U1, U2, U3, U4, U5, U6, U7, U8, U9, U10, U16, U17, U18, V1, V2, V3, V4, V5, V6, V7, V9, V10, V16, V17, V18 Data Device Corporation www.ddc-web.com DESCRIPTION A1, A2, A3, A13, A16, A17, A18, B1, B2, B3, B13, B16, B17, B18, C1, C2, C3, C4, C5, C6, C11, C13, C14, C16, C17, C18, D6, D12, D13, D15, E13, E14, E15, F6, F9, F13, G6, G9, G13, G14, G15, G16, H3, H4, H5, H6, H9, H13, H14, H15, H16, J6, J7, J8, J9, J10, J11, J12, J13, J14, K6, K7, K8, K9, K10, K11, K12, K13, K14, No User Connections to these balls allowed. K15, L6, L9, L10, L11, L12, L13, L15, M6, M9, M10, M11, M12, M13, M14, M15, N6, N9, N10, N11, N14, N15, N16, P6, P7, P8, P11, P14, P15, P16, R3, R5, R14, R15, R16, T1, T2, T3, T4, T5, T9, T14, T15, T16, T17, T18, U1, U2, U3, U9, U14, U15, U16, U17, U18, V1, V2, V3, V10, V11, V12, V13, V14, V15, V16, V17, V18 71 BU-6474X/6484X/6486X AL-11/12-0 TABLE 66. MINI-ACE MARK3 BU-64XXXF/G3/4/8/9/C/D VERSIONS PINOUTS PIN FUNCTION PIN FUNCTION 1 A11 41 DB06 2 A10 42 DB01 3 TX/RX_A 43 DB04 4 DO NOT CONNECT - FACTORY TEST POINT 44 RTADP 5 TX/RX_A 45 RTAD1 6 MEM/REG 46 DB00 7 A08 47 DB02 8 DO NOT CONNECT - FACTORY TEST POINT 48 DB03 9 DO NOT CONNECT - FACTORY TEST POINT 49 DB05 10 +3.3V_XCVR for BU-64XXXF/G8/9/C/D or +5.0_XCVR for BU-64XXXF/G3/4 50 GND_LOGIC 51 +3.3V_LOGIC for BU-64XX3 or +5.0V_LOGIC for BU-64XX5 52 DB08 53 DB07 54 DB13 55 DB12 56 DB14 57 DB09 58 DB11 59 DB15 60 DB10 61 TRANS/BUFF 62 READYD 63 INT 64 IOEN 65 TX_INH_A 66 SELECT 67 TX_INH_B 68 STRBD 69 +3.3V_LOGIC for BU-64XX3 or +5.0V_LOGIC for BU-64XX5 70 GND_LOGIC 71 RD/WR 72 MSB/LSB/DTGRT 73 A15* or A15/CLK_SEL_1** 74 A05 75 A09 76 A12* or A12/RTBOOT** 77 A13* or A13/+3.3V_LOGIC** for BU-64XX3 or +5.0V_LOGIC** for BU-64XX5 11 DO NOT CONNECT - FACTORY TEST POINT 12 A07 13 A03 14 SLEEPIN* or UPADDREN** 15 TX/RX_B 16 DO NOT CONNECT - FACTORY TEST POINT 17 TX/RX_B 18 A00 19 A02 20 ADDR_LAT/MEMOE 21 DO NOT CONNECT - FACTORY TEST POINT 22 GND_XCVR 23 TAG_CLK 24 RTAD2 25 MSTCLR 26 CLOCK_IN 27 A06 28 ZEROWAIT/MEMWR 29 16/8/DTREQ 30 +3.3V_LOGIC for BU-64XX3 or +5.0V_LOGIC for BU-64XX5 31 GND_LOGIC 32 INCMD/MCRST 33 A01 34 TRIG_SEL/MEMENA_IN 35 POL_SEL/DTACK 36 RT_AD_LAT 37 SSFLAG/EXT_TRIG 38 RTAD0 78 A04 39 RTAD3 79 GND_XCVR 40 RTAD4 80 A14* or A14/CLK_SEL_0** * Applicable for 64K RAM option. ** Applicable for 4K RAM option. Data Device Corporation www.ddc-web.com 72 BU-6474X/6484X/6486X AL-11/12-0 TABLE 67. MINI-ACE MARK3 BU-64XX3F/G0 (TRANSCEIVERLESS) VERSION PINOUTS PIN FUNCTION PIN FUNCTION 1 A11 41 DB06 2 A10 42 DB01 3 TXDATA_A 43 DB04 4 RXDATA_A *** 44 RTADP 5 TXDATA_A 45 RTAD1 6 MEM/REG 46 DB00 7 A08 47 DB02 8 RXDATA_A 48 DB03 9 TXINH_B_OUT 49 DB05 10 +3.3V_LOGIC 50 GND_LOGIC 11 TXINH_A_OUT 51 3.3V_LOGIC 12 A07 52 DB08 13 A03 53 DB07 14 UPADDREN** or NC* 54 DB13 15 TXDATA_B 55 DB12 16 RXDATA_B *** 56 DB14 17 TXDATA_B 57 DB09 18 A00 58 DB11 19 A02 59 DB15 20 ADDR_LAT/MEMOE 60 DB10 21 RXDATA_B 61 TRANS/BUFF 22 GND_LOGIC 62 READYD 23 TAG_CLK 63 INT 24 RTAD2 64 IOEN 25 MSTCLR 65 TX_INH_A 26 CLOCK_IN 66 SELECT 27 A06 67 TX_INH_B 28 ZEROWAIT/MEMWR 68 STRBD 29 16/8/DTREQ 69 3.3V_LOGIC 30 3.3V_LOGIC 70 GND_LOGIC 31 GND_LOGIC 71 RD/WR 32 INCMD/MCRST 72 MSB/LSB/DTGRT 33 A01 73 A15* or A15/CLK_SEL_1** 34 TRIG_SEL/MEMENA_IN 74 A05 35 POL_SEL/DTACK 75 A09 36 RT_AD_LAT 76 A12* or A12/RTBOOT** 37 SSFLAG/EXT_TRIG 77 A13* or A13/+3.3V_LOGIC** 38 RTAD0 78 A04 39 RTAD3 79 GND_LOGIC 40 RTAD4 80 A14* or A14/CLK_SEL_0** * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** Standard transceiverless parts have their receiver inputs internally strapped for single-ended operation. The RXDATAx pins are connected to inputs that are not enabled. Data Device Corporation www.ddc-web.com 73 BU-6474X/6484X/6486X AL-11/12-0 TABLE 68. MICRO-ACE-TE BU-64743B8/C / BU-648X3B(R)8/C (+3.3V BGA PACKAGE) PINOUTS BALL SIGNAL BALL SIGNAL A1 NC C1 NC A2 NC C2 NC A3 NC C3 NC A4 +3.3V_XCVR C4 NC A5 +3.3V_XCVR C5 NC A6 MEM/REG C6 NC A7 A14* or A14/CLK_SEL_0** C7 TXDATA_IN_A connect to ball C8 A8 +3.3V LOGIC C8 TXDATA_OUT_A connect to ball C7 A9 +3.3V LOGIC C9 A2 A10 A12* or A12/RTBOOT** C10 A9 A11 A15* or A15/CLK_SEL_1** C11 NC A12 STRBD C12 A5 A13 NC C13 NC A14 TX_INH_A C14 NC A15 IOEN C15 A10 A16 NC C16 NC A17 NC C17 NC A18 NC C18 NC B1 NC D1 TX/RX-A B2 NC D2 TX/RX-A B3 NC D3 GND_XCVR/THERMAL*** B4 +3.3V_XCVR D4 GND_XCVR/THERMAL*** B5 +3.3V_XCVR D5 GND_XCVR/THERMAL*** B6 MSB/LSB / DTGRT D6 NC B7 A4 D7 TXDATA_IN_A connect to ball D8 B8 +3.3V LOGIC D8 TXDATA_OUT_A connect to ball D7 B9 +3.3V LOGIC D9 A7 B10 A13* or LOGIC "1"** D10 A8 B11 RD/WR D11 MCRST B12 SELECT D12 NC B13 NC D13 NC B14 TX_INH_B D14 SNGL_END / NC B15 READY D15 NC B16 NC D16 D15 B17 NC D17 TRANS/BUFF B18 NC D18 INT NOTES NOTES * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 74 BU-6474X/6484X/6486X AL-11/12-0 TABLE 68. MICRO-ACE-TE BU-64743B8/C / BU-648X3B(R)8/C (+3.3V BGA PACKAGE) PINOUTS (CONT.) BALL SIGNAL SIGNAL E1 NOTES BALL SIGNAL TX/RX-A G1 TX/RX-A E2 TX/RX-A G2 TX/RX-A E3 GND_XCVR/THERMAL*** G3 GND_XCVR/THERMAL*** E4 GND_XCVR/THERMAL*** G4 GND_XCVR/THERMAL*** E5 GND_XCVR/THERMAL*** G5 GND_XCVR/THERMAL*** NOTES E6 A11 G6 NC E7 TXINH_IN_A connect to ball E8 G7 RXDATA_OUT_A connect to ball G8 E8 TXINH_OUT_A connect to ball E7 G8 RXDATA_IN_A connect to ball G7 E9 A3 G9 NC E10 GND_LOGIC G10 GND_LOGIC E11 GND_LOGIC G11 GND_LOGIC E12 GND_LOGIC G12 GND_LOGIC E13 NC G13 NC E14 NC G14 NC E15 NC G15 NC E16 D13 G16 NC E17 D11 G17 D3 E18 D10 G18 D8 F1 GND_XCVR/THERMAL*** H1 TX/RX-A F2 GND_XCVR/THERMAL*** H2 TX/RX-A F3 GND_XCVR/THERMAL*** H3 NC F4 GND_XCVR/THERMAL*** H4 NC F5 GND_XCVR/THERMAL*** H5 NC F6 NC H6 NC F7 LOGIC 1* or UPADDREN** H7 RXDATA_OUT_A connect to ball H8 F8 A0 H8 RXDATA_IN_A connect to ball H7 F9 NC H9 NC F10 GND_LOGIC H10 GND_LOGIC F11 GND_LOGIC H11 GND_LOGIC F12 GND_LOGIC H12 GND_LOGIC F13 NC H13 NC F14 TAG_CLK H14 NC F15 D14 H15 NC F16 D9 H16 NC F17 D7 H17 D5 F18 D12 H18 D4 * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 75 BU-6474X/6484X/6486X AL-11/12-0 TABLE 68. MICRO-ACE-TE BU-64743B8/C / BU-648X3B(R)8/C (+3.3V BGA PACKAGE) PINOUTS (CONT.) BALL BALL SIGNAL SIGNAL J1 BALL SIGNAL +3.3V_XCVR L1 TX/RX-B J2 +3.3V_XCVR L2 TX/RX-B J3 +3.3V_XCVR L3 GND_XCVR/THERMAL*** J4 +3.3V_XCVR L4 GND_XCVR/THERMAL*** J5 +3.3V_XCVR L5 GND_XCVR/THERMAL*** J6 NC L6 NC J7 NC L7 TXDATA_IN_B connect to ball L8 J8 NC L8 TXDATA_OUT_B connect to ball L7 J9 NC L9 NC J10 NC L10 NC J11 NC L11 NC J12 NC L12 NC J13 NC L13 NC J14 NC L14 RSTBITEN J15 RTAD4 L15 NC J16 RTAD2 L16 +3.3V_LOGIC J17 D2 L17 +3.3V_LOGIC J18 D6 L18 RTAD1 K1 +3.3V_XCVR M1 TX/RX-B K2 +3.3V_XCVR M2 TX/RX-B K3 +3.3V_XCVR M3 GND_XCVR/THERMAL*** K4 +3.3V_XCVR M4 GND_XCVR/THERMAL*** K5 +3.3V_XCVR M5 GND_XCVR/THERMAL*** K6 NC M6 NC K7 NC M7 TXDATA_IN_B connect to ball M8 K8 NC M8 TXDATA_OUT_B connect to ball M7 K9 NC M9 NC K10 NC M10 NC K11 NC M11 NC K12 NC M12 NC K13 NC M13 NC K14 NC M14 NC K15 NC M15 NC K16 D1 M16 +3.3V_LOGIC K17 D0 M17 +3.3V_LOGIC K18 RTADP M18 RTAD3 NOTES NOTES * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 76 BU-6474X/6484X/6486X AL-11/12-0 TABLE 68. MICRO-ACE-TE BU-64743B8/C / BU-648X3B(R)8/C (+3.3V BGA PACKAGE) PINOUTS (CONT.) BALL BALL SIGNAL N1 BALL SIGNAL GND_XCVR/THERMAL*** R1 TX/RX-B N2 GND_XCVR/THERMAL*** R2 TX/RX-B N3 GND_XCVR/THERMAL*** R3 NC N4 GND_XCVR/THERMAL*** R4 SLEEPIN N5 GND_XCVR/THERMAL*** R5 NC N6 NC R6 +3.3V_LOGIC N7 TXINH_IN_B connect to ball N8 R7 +3.3V_LOGIC N8 TXINH_OUT_B connect to ball N7 R8 SSFLAG/EXT_TRIG N9 NC R9 RXDATA_OUT_B connect to ball R10 N10 NC R10 RXDATA_IN_B connect to ball R9 N11 NC R11 GND_LOGIC N12 +3.3V_LOGIC R12 GND_LOGIC N13 +3.3V_LOGIC R13 GND_LOGIC N14 NC R14 NC N15 NC R15 NC N16 NC R16 NC N17 TRIG_SEL/MEMENA_IN R17 16/8 / DTREQ N18 RTAD0 R18 MSTCLR P1 TX/RX-B T1 NC P2 TX/RX-B T2 NC P3 GND_XCVR/THERMAL*** T3 NC P4 GND_XCVR/THERMAL*** T4 NC P5 GND_XCVR/THERMAL*** T5 NC P6 NC T6 +3.3V_LOGIC P7 NC T7 +3.3V_LOGIC P8 NC T8 ZEROWAIT/MEMWR P9 RXDATA_OUT_B connect to ball P10 T9 NC P10 RXDATA_IN_B connect to ball P9 T10 CLOCK_IN P11 NC T11 GND_LOGIC P12 +3.3V_LOGIC T12 GND_LOGIC P13 +3.3V_LOGIC T13 GND_LOGIC P14 NC T14 NC P15 NC T15 NC P16 NC T16 NC P17 INCMD T17 NC P18 RT_AD_LAT T18 NC NOTES NOTES * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 77 BU-6474X/6484X/6486X AL-11/12-0 TABLE 68. MICRO-ACE-TE BU-64743B8/C / BU-648X3B(R)8/C (+3.3V BGA PACKAGE) PINOUTS (CONT.) BALL SIGNAL BALL SIGNAL U1 NC V1 NC U2 NC V2 NC U3 NC V3 NC U4 +3.3V_XCVR V4 +3.3V_XCVR U5 +3.3V_XCVR V5 +3.3V_XCVR U6 +3.3V_LOGIC V6 +3.3V_LOGIC U7 +3.3V_LOGIC V7 +3.3V_LOGIC U8 A1 V8 POL_SEL/DTACK U9 NC V9 A6 U10 ADDR_LAT/MEMOE V10 NC U11 GND_LOGIC V11 NC U12 GND_LOGIC V12 NC U13 GND_LOGIC V13 NC U14 NC V14 NC U15 NC V15 NC U16 NC V16 NC U17 NC V17 NC U18 NC V18 NC NOTES NOTES * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 78 BU-6474X/6484X/6486X AL-11/12-0 TABLE 69. MICRO-ACE-TE BU-648X0B(R)3/4 (+5.0V BGA PACKAGE) PINOUTS BALL SIGNAL BALL SIGNAL A1 NC C1 NC A2 NC C2 NC A3 NC C3 NC NOTES NOTES A4 TXINH_IN_A connect to ball A5 C4 TXDATA_IN_A connect to ball C5 A5 TXINH_OUT_A connect to ball A4 C5 TXDATA_OUT_A connect to ball C4 A6 NC C6 A05 A7 +5.0V/+3.3V_LOGIC C7 A07 A8 A10 C8 TXDATA_IN_A A9 A12* or A12/RTBOOT** C9 A08 A10 A14* or A14/CLK_SEL_0** C10 A15* or A15/CLK_SEL_1** A11 RD/WR C11 MEM/REG A12 STRBD C12 LOGIC "1"* or UPADDREN** A13 VDD_LOW C13 TX_INH_B A14 TX_INH_A C14 IOEN A15 SNGL_END C15 READYD A16 NC C16 NC A17 NC C17 NC A18 NC C18 NC B1 NC D1 TX/RX-A B2 NC D2 TX/RX-A B3 NC D3 GND_XCVR/THERMAL*** B4 NC D4 GND_XCVR/THERMAL*** B5 NC D5 GND_XCVR/THERMAL*** B6 NC D6 A03 B7 A09 D7 A06 B8 TXDATA_OUT_A D8 A04 B9 A11 D9 NC B10 A13* or A13 / LOGIC "1"** D10 RXDATA_IN_A B11 MSTCLR D11 NC B12 SELECT D12 NC B13 MCRST D13 NC B14 NC D14 NC B15 NC D15 D15 B16 NC D16 TRANS/BUFF B17 NC D17 INT B18 NC D18 TAG_CLK connect to ball C8 connect to ball B8 connect to ball E10 * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 79 BU-6474X/6484X/6486X AL-11/12-0 TABLE 69. MICRO-ACE-TE BU-648X0B(R)3/4 (+5.0V BGA PACKAGE) PINOUTS (CONT.) BALL SIGNAL BALL SIGNAL E1 TX/RX-A G1 TX/RX-A E2 GND_XCVR/THERMAL*** G2 GND_XCVR/THERMAL*** E3 GND_XCVR/THERMAL*** G3 GND_XCVR/THERMAL*** E4 GND_XCVR/THERMAL*** G4 GND_XCVR/THERMAL*** E5 GND_XCVR/THERMAL*** G5 GND_XCVR/THERMAL*** E6 NC G6 NC E7 A01 G7 NC E8 A02 G8 NC E9 RXDATA_IN_A connect to ball F9 G9 NC E10 RXDATA_OUT_A connect to ball D10 G10 NC E11 NC G11 NC E12 GND_LOGIC G12 GND_LOGIC E13 GND_LOGIC G13 GND_LOGIC E14 GND_LOGIC G14 GND_LOGIC E15 D11 G15 D03 E16 D13 G16 D05 E17 D14 G17 D04 E18 D12 G18 D06 F1 +5.0V_XCVR H1 TX/RX-A F2 +5.0V_XCVR H2 TX/RX-A F3 GND_XCVR/THERMAL*** H3 GND_XCVR/THERMAL*** F4 GND_XCVR/THERMAL*** H4 GND_XCVR/THERMAL*** F5 GND_XCVR/THERMAL*** H5 GND_XCVR/THERMAL*** F6 NC H6 NC F7 NC H7 NC H8 NC H9 NC NC NOTES F8 NC F9 RXDATA_OUT_A F10 A00 H10 F11 NC H11 NC F12 GND_LOGIC H12 GND_LOGIC F13 GND_LOGIC H13 GND_LOGIC F14 GND_LOGIC H14 GND_LOGIC F15 D09 H15 NC F16 D10 H16 INCMD F17 D07 H17 D00 F18 D08 H18 D02 connect to ball E9 NOTES * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 80 BU-6474X/6484X/6486X AL-11/12-0 TABLE 69. MICRO-ACE-TE BU-648X0B(R)3/4 (+5.0V BGA PACKAGE) PINOUTS (CONT.) BALL SIGNAL BALL SIGNAL J1 NC L1 +5.0V/+3.3V_LOGIC J2 NC L2 +5.0V/+3.3V_LOGIC J3 NC L3 NC J4 NC L4 NC J5 NC L5 NC J6 NC L6 NC J7 MSB/LSB / DTGRT L7 NC J8 SSFLAG/EXT_TRIG L8 NC J9 NC L9 ADDR_LAT/MEMOE J10 NC L10 16/8 / DTREQ J11 NC L11 TRIG_SEL/MEMENA_IN J12 NC L12 NC J13 NC L13 NC J14 NC L14 NC J15 NC L15 +5.0V/+3.3V_LOGIC J16 RTAD4 L16 +5.0V/+3.3V_LOGIC J17 D01 L17 RTAD2 J18 RTADP L18 RT_AD_LAT K1 NC M1 NC K2 NC M2 NC K3 NC M3 +5.0V/+3.3V_LOGIC K4 NC M4 NC K5 NC M5 NC K6 NC M6 NC K7 NC M7 NC K8 NC M8 NC K9 NC M9 CLOCK_IN K10 NC M10 ZEROWAIT/MEMWR K11 NC M11 NC K12 NC M12 TXDATA_OUT_B connect to ball N12 K13 NC M13 RXDATA_IN_B connect to ball M14 K14 NC M14 RXDATA_OUT_B connect to ball M13 K15 NC M15 NC K16 RTAD0 M16 NC K17 RTAD3 M17 NC K18 RTAD1 M18 RSTBITEN NOTES NOTES * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 81 BU-6474X/6484X/6486X AL-11/12-0 TABLE 69. MICRO-ACE-TE BU-648X0B(R)3/4 (+5.0V BGA PACKAGE) PINOUTS (CONT.) BALL SIGNAL BALL SIGNAL N1 NC R1 NC N2 NC R2 NC N3 NC R3 NC N4 NC R4 +5.0V_RAM* or NC** N5 NC R5 NC N6 NC R6 NC N7 NC R7 NC N8 NC R8 TXINH_OUT_B N9 POL_SEL/DTACK R9 +5.0V/+3.3V_LOGIC N10 NC R10 TXDATA_IN_B N11 NC R11 GND_XCVR/THERMAL*** NOTES N12 TXDATA_IN_B connect to ball M12 R12 GND_XCVR/THERMAL*** N13 RXDATA_IN_B connect to ball N14 R13 GND_XCVR/THERMAL*** N14 RXDATA_OUT_B connect to ball N13 R14 GND_XCVR/THERMAL*** N15 NC R15 GND_XCVR/THERMAL*** N16 NC R16 NC N17 NC R17 NC N18 NC R18 NC P1 NC T1 NC P2 NC T2 NC P3 NC T3 NC P4 +5.0V_RAM* or NC** T4 NC P5 NC T5 NC P6 NC T6 NC P7 +5.0V/+3.3V_LOGIC T7 NC P8 NC T8 TXINH_IN_B P9 +5.0V/+3.3V_LOGIC T9 NC P10 TXDATA_OUT_B T10 NC P11 GND_XCVR/THERMAL*** T11 GND_XCVR/THERMAL*** P12 GND_XCVR/THERMAL*** T12 GND_XCVR/THERMAL*** P13 GND_XCVR/THERMAL*** T13 GND_XCVR/THERMAL*** P14 GND_XCVR/THERMAL*** T14 GND_XCVR/THERMAL*** P15 GND_XCVR/THERMAL*** T15 GND_XCVR/THERMAL*** P16 NC T16 NC P17 NC T17 NC P18 NC T18 NC connect to ball R10 NOTES connect to ball T8 connect to ball P10 connect to ball R8 * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 82 BU-6474X/6484X/6486X AL-11/12-0 TABLE 69. MICRO-ACE-TE BU-648X0B(R)3/4 (+5.0V BGA PACKAGE) PINOUTS (CONT.) BALL SIGNAL U1 NC U2 NC U3 NC U4 NC U5 NC U6 NC U7 NC U8 NC U9 NC U10 NC U11 TX/RX-B U12 GND_XCVR/THERMAL*** U13 +5.0V_XCVR U14 GND_XCVR/THERMAL*** U15 TX/RX-B U16 NC U17 NC U18 NC V1 NC V2 NC V3 NC V4 NC V5 NC V6 NC V7 NC V8 +5.0V/+3.3V_LOGIC V9 NC V10 NC V11 TX/RX-B V12 TX/RX-B V13 +5.0V_XCVR V14 TX/RX-B V15 TX/RX-B V16 NC V17 NC V18 NC NOTES * Applicable for 64K RAM option. ** Applicable for 4K RAM option. *** See Thermal Management Section for important user information. Data Device Corporation www.ddc-web.com 83 BU-6474X/6484X/6486X AL-11/12-0 (R)TABLE 70. MICRO-ACE-TE BU-64863B8-600 (BGA PACKAGE) "DAISY CHAIN" MECHANICAL SAMPLE CONNECTIONS BALL PAIRS WIRED TOGETHER BALL PAIRS WIRED TOGETHER BALL PAIRS WIRED TOGETHER BALL PAIRS WIRED TOGETHER BALL PAIRS WIRED TOGETHER A1-A2 E1-E2 J1-J2 N1-N2 U1-U2 A3-A4 E3-E4 J3-J4 N3-N4 U3-U4 A5-A6 E5-E6 J5-J6 N5-N6 U5-U6 A7-A8 E7-E8 J7-J8 N7-N8 U7-U8 A9-A10 E9-E10 J9-J10 N9-N10 U9-U10 A11-A12 E11-E12 J11-J12 N11-N12 U11-U12 A13-A14 E13-E14 J13-J14 N13-N14 U13-U14 A15-A16 E15-E16 J15-J16 N15-N16 U15-U16 A17-A18 E17-E18 J17-J18 N17-N18 U17-U18 B1-B2 F1-F2 K1-K2 P1-P2 V1-V2 B3-B4 F3-F4 K3-K4 P3-P4 V3-V4 B5-B6 F5-F6 K5-K6 P5-P6 V5-V6 B7-B8 F7-F8 K7-K8 P7-P8 V7-V8 B9-B10 F9-F10 K9-K10 P9-P10 V9-V10 B11-B12 F11-F12 K11-K12 P11-P12 V11-V12 B13-B14 F13-F14 K13-K14 P13-P14 V13-V14 B15-B16 F15-F16 K15-K16 P15-P16 V15-V16 B17-B18 F17-F18 K17-K18 P17-P18 V17-V18 C1-C2 G1-G2 L1-L2 R1-R2 C3-C4 G3-G4 L3-L4 R3-R4 C5-C6 G5-G6 L5-L6 R5-R6 C7-C8 G7-G8 L7-L8 R7-R8 C9-C10 G9-G10 L9-L10 R9-R10 C11-C12 G11-G12 L11-L12 R11-R12 C13-C14 G13-G14 L13-L14 R13-R14 C15-C16 G15-G16 L15-L16 R15-R16 C17-C18 G17-G18 L17-L18 R17-R18 D1-D2 H1-H2 M1-M2 T1-T2 D3-D4 H3-H4 M3-M4 T3-T4 D5-D6 H5-H6 M5-M6 T5-T6 D7-D8 H7-H8 M7-M8 T7-T8 D9-D10 H9-H10 M9-M10 T9-T10 D11-D12 H11-H12 M11-M12 T11-T12 D13-D14 H13-H14 M13-M14 T13-T14 D15-D16 H15-H16 M15-M16 T15-T16 D17-D18 H17-H18 M17-M18 T17-T18 Data Device Corporation www.ddc-web.com 84 BU-6474X/6484X/6486X AL-11/12-0 TABLE 71. BU-64863E8 EVALUATION BOARD PINOUTS MADE FROM 80-PIN MINI-ACE MARK3 BU-64863G8 BC/RT/MT 64K RAM P1 PIN # DEVICE PIN # FUNCTION P2 PIN # DEVICE PIN # FUNCTION 1 2 A10 1 - NC 2 1 A11 2 - NC 3 6 MEM/REG 3 - STUB_TX/RX_B 4 7 A08 4 - STUB_TX/RX_B 5 18 A00 5 22, 31, 50, 70, 79 GND 6 13 A03 6 22, 31, 50, 70, 79 GND 7 19 A02 7 - STUB_TX/RX_B 8 12 A07 8 - STUB_TX/RX_B 9 80 A14 9 - NC 10 22, 31, 50, 70, 79 GND 10 - NC 11 22, 31, 50, 70, 79 GND 11 - +3.3V_XFMR_CT 12 22, 31, 50, 70, 79 GND 12 - +3.3V_XFMR_CT 13 77 A13 13 10 +3.3V_XCVR 14 78 A04 14 10 +3.3V_XCVR 15 75 A09 15 - NC 16 76 A12 16 - NC 17 73 A15 17 - STUB_TX/RX_A 18 74 A05 18 - STUB_TX/RX_A 19 71 RD/WR 19 22, 31, 50, 70, 79 GND 20 72 MSB/LSB / DTGRT 20 22, 31, 50, 70, 79 GND 21 30, 51, 69 +3.3V_LOGIC 21 - STUB_TX/RX_A 22 30, 51, 69 +3.3V_LOGIC 22 - STUB_TX/RX_A 23 68 STRBD 23 - NC 24 - NC 24 - NC 25 66 SELECT 26 67 TX_INH_B 27 64 IOEN 28 65 TX_INH_A 29 62 READYD 30 63 INT 31 - NC 32 61 TRANS/BUFF Data Device Corporation www.ddc-web.com 85 BU-6474X/6484X/6486X AL-11/12-0 TABLE 71. BU-64863E8 EVALUATION BOARD PINOUTS (CONT.) MADE FROM 80-PIN MINI-ACE MARK3 BU-64863G8 BC/RT/MT 64K RAM P3 PIN # DEVICE PIN # FUNCTION P4 PIN # DEVICE PIN # FUNCTION 1 14 SLEEPIN 1 41 D06 2 20 ADDR_LAT/MEMOE 2 - NC 3 22, 31, 50, 70, 79 GND 3 43 D04 4 - NC 4 42 D01 5 30, 51, 69 +3.3V_LOGIC 5 45 RTAD1 6 30, 51, 69 +3.3V_LOGIC 6 44 RTADP 7 22, 31, 50, 70, 79 GND 7 47 D02 8 22, 31, 50, 70, 79 GND 8 46 D00 9 22, 31, 50, 70, 79 GND 9 49 D05 10 23 TAG_CLK 10 48 D03 11 24 RTAD2 11 22, 31, 50, 70, 79 GND 12 22, 31, 50, 70, 79 GND 12 22, 31, 50, 70, 79 GND 13 25 MSTCLR 13 30, 51, 69 +3.3V_LOGIC 14 26 CLOCK_IN 14 30, 51, 69 +3.3V_LOGIC 15 22, 31, 50, 70, 79 GND 15 52 D08 16 27 A06 16 53 D07 17 28 ZEROWAIT/MEMWR 17 54 D13 18 29 16/8 / DTREQ 18 55 D12 19 30, 51, 69 +3.3V_LOGIC 19 56 D14 20 30, 51, 69 +3.3V_LOGIC 20 57 D09 21 - NC 21 58 D11 22 - NC 22 59 D15 23 32 INCMD/MCRST 23 60 D10 24 33 A01 24 - NC 25 34 TRIG_SEL/MEMENA_IN 26 35 POL_SEL/DTACK 27 36 RT_AD_LAT 28 37 SSFLAG/EXT_TRIG 29 38 RTAD0 30 39 RTAD3 31 - NC 32 40 RTAD4 Data Device Corporation www.ddc-web.com 86 BU-6474X/6484X/6486X AL-11/12-0 TABLE 72. BU-61860E3 EVALUATION BOARD PINOUTS MADE FROM 128-BALL -ACE (MICRO-ACE) BU-61860B3 BC/RT/MT 64K RAM P1 PIN # DEVICE PIN # FUNCTION P2 PIN # DEVICE PIN # FUNCTION 1 A6 A10 1 - DIR_TX/RX_B 2 B7 A11 2 - DIR_TX/RX_B 3 B13 MEM/REG 3 - STUB_TX/RX_B 4 B5 A08 4 - STUB_TX/RX_B 5 A1 A00 6 B3 A03 5 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 7 A2 A02 8 A5 A07 6 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 9 B10 A14 7 - STUB_TX/RX_B 10 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 8 - STUB_TX/RX_B 9 - DIR_TX/RX_B 10 - DIR_TX/RX_B 11 - NC 12 - NC 11 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 12 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 13 E1,F1,G1 +5.0V Vcc CH A 13 A10 A13 14 E1,F1,G1 +5.0V Vcc CH A 14 A3 A04 15 - DIR_TX/RX_A 15 B6 A09 16 - DIR_TX/RX_A 16 A7 A12 17 - STUB_TX/RX_A 17 A11 A15 18 18 B4 A05 19 A12 RD/WR 20 U6 MSB/LSB / DTGRT 21 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 22 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 23 B14 STRBD 24 - NC 25 B12 SELECT 26 A15 TX_INH_B 27 A17 IOEN 28 A14 TX_INH_A 29 B15 READYD 30 A18 INT 31 B18 TAG_CLK 32 B17 TRANS/BUFF Data Device Corporation www.ddc-web.com 87 STUB_TX/RX_A 19 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 20 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 21 - STUB_TX/RX_A 22 - STUB_TX/RX_A 23 - DIR_TX/RX_A 24 - DIR_TX/RX_A BU-6474X/6484X/6486X AL-11/12-0 TABLE 72. BU-61860E3 EVALUATION BOARD PINOUTS (CONT.) MADE FROM 128-BALL -ACE (MICRO-ACE) BU-61860B3 BC/RT/MT 64K RAM P3 PIN # DEVICE PIN # FUNCTION P4 PIN # DEVICE PIN # FUNCTION 1 N2 UPADDREN 1 J18 D06 2 V8 ADDR_LAT/MEMOE 2 P17 RSTBITEN 3 M18 D04 4 M17 D01 5 V18 RTAD1 6 T18 RTADP 7 G18 D02 8 H18 D00 9 H17 D05 10 G17 D03 11 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 12 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 13 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 14 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 3 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 4 V2 VDD_LOW 5 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 6 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 7 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 8 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 9 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 10 - NC 11 U17 RTAD2 12 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 15 F18 D08 13 B11 MSTCLR 16 F17 D07 14 V9 CLOCK_IN 17 J17 D13 18 E18 D12 15 A9,B9,C17,C18,E2,F2,G2,K17, K18,U4,U9,U13,U14,U15,V1,V4 GND 19 D18 D14 16 A4 A06 20 N18 D09 17 U8 ZEROWAIT/MEMWR 21 E17 D11 18 V7 16/8 / DTREQ 22 D17 D15 19 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 23 N17 D10 24 A13 MCRST 20 A8,A16,B8,B16,L1,L2,L17,L18, U3,V3 +5.0V_LOGIC 21 V13,V14,V15 +5.0V Vcc CH B 22 V13,V14,V15 +5.0V Vcc CH B 23 M1 INCMD 24 B1 A01 25 V6 TRIG_SEL/MEMENA_IN 26 U7 POL_SEL/DTACK 27 P18 RT_AD_LAT 28 T2 SSFLAG/EXT_TRIG 29 V17 RTAD0 30 U18 RTAD3 31 - NC 32 T17 RTAD4 Data Device Corporation www.ddc-web.com 88 BU-6474X/6484X/6486X AL-11/12-0 89 2 X 0.300 [7.62] 0.150 [3.81] 0.100 [2.54] 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 24 23 24 22 21 22 21 20 19 20 19 16 15 16 15 14 13 14 13 12 11 U2 U2 12 11 10 9 10 9 8 7 8 7 6 5 T1 6 5 2.015 [51.18] (MAX) 1.700 [43.18] 1.600 [40.64] 2 X 11 EQUAL SPACES @ 0.100 [2.54] = 1.100 [27.94] (TOL NON-CUM) 18 17 T2 18 17 4 3 4 3 2 1 2 1 P4 P3 27 25 23 21 19 17 15 13 11 9 7 5 28 26 24 22 20 18 16 14 12 10 8 6 2 1 3 29 30 4 31 32 2X 0.600 [15.24] 2X 15 EQUAL SP @ 0.100 [2.54]= 1.500 [38.10] (TOL-NONCUM) 0.100 [2.54] 2.300 [58.42] 0.100 [2.54] 2.200 [55.88] 2.515 [63.88] (MAX) 0.350 [8.89] (MAX) 0.350 [8.89] (MAX) 112 X 0.025 .001 [0.64] 4X 0.230 [5.84] 0.062 (1.57) FIGURE 19. BU-61860E3 +5.0V -ACE (MICRO-ACE) & TRANSFORMER EVALUATION BOARD P2 31 32 P1 23 S/N DC Data Device Corporation www.ddc-web.com BU-6474X/6484X/6486X AL-11/12-0 90 2 X 0.300 [7.62] 0.150 [3.81] 0.100 [2.54] 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 24 23 24 22 21 22 21 20 19 20 19 16 15 16 15 14 13 14 13 12 11 U1 12 11 10 9 10 9 8 7 8 7 6 5 T1 6 5 2.015 [51.18] (MAX) 1.700 [43.18] 1.600 [40.64] 2 X 11 EQUAL SPACES @ 0.100 [2.54] = 1.100 [27.94] (TOL NON-CUM) 18 17 T2 18 17 4 3 4 3 2 1 2 1 P4 P3 7 8 2 4 1 3 5 9 10 6 11 12 19 20 13 21 22 14 23 24 15 25 26 16 27 28 17 29 30 18 31 32 2X 0.600 [15.24] 2X 15 EQUAL SP @ 0.100 [2.54]= 1.500 [38.10] (TOL-NONCUM) 0.100 [2.54] 2.300 [58.42] 0.100 [2.54] 2.200 [55.88] 2.515 [63.88] (MAX) 0.350 [8.89] (MAX) 0.350 [8.89] (MAX) 112 X 0.025 .001 [0.64] 4X 0.230 [5.84] 0.062 (1.57) FIGURE 20. BU-64863E8 MINI-ACE MARK3 (+3.3 VOLT) & TRANSFORMER EVALUATION BOARD P2 31 32 P1 23 S/N DC Data Device Corporation www.ddc-web.com BU-6474X/6484X/6486X AL-11/12-0 4 X 0.880 (22.35) REF #60 #41 #61 #40 0.015 (0.381) TYP. 4 X 19 EQUAL SP @ 0.040 (1.016) = 0.760 (19.304) (TOL. NON-CUM.) TOP VIEW #80 PIN #1 DENOTED BY INDEX MARK 4 X 0.060 (1.524) #21 #20 #1 PIN NUMBERS FOR REFERENCE ONLY 0.130 (3.302) MAX. PIN #1 DENOTED BY INDEX MARK 0.010 (0.254) MAX. 0.004 (0.102) 0.006 (0.152) +0.010 (+0.254) - 0.004 (- 0.102) 1.110 (28.194) 0.060 (1.524) MAX. 0.015 SIDE VIEW Notes: 1) Dimensions are in inches (mm). 2) Tolerances = 0.005 inches unless otherwise specified. 3) Package Material: Alumina (AL203) 4) Lead Material: Kovar, Plated by 50 in. minimum nickel under 60 in. minimum gold. FIGURE 21. MECHANICAL OUTLINE DRAWING FOR MINI-ACE MARK3 80-PIN GULL WING PACKAGE Data Device Corporation www.ddc-web.com 91 BU-6474X/6484X/6486X AL-11/12-0 2 X 2.36 (59.94) REF. 2 X 1.88 (47.75) 0.02 4 X 0.890 (22.606) MAX. 4 X 0.060 (1.524) #60 #41 #40 #61 0.015 (0.381) TYP. 4 X 19 EQUAL SP @ 0.040 (1.016) = 0.760 (19.304) (TOL. NON-CUM.) TOP VIEW #21 #80 #1 #20 PIN NUMBERS FOR REFERENCE ONLY 0.500 (12.7) REF 4 X 0.200 (5.08) 0.008 (0.2032) 0.002 0.025 (0.635) PIN #1 DENOTED BY INDEX MARK 0.910 (23.114) MAX. 0.130 (3.302) MAX. 0.050 (1.27) SIDE VIEW Notes: 1) Dimensions are in inches (mm). 2) Tolerances = 0.005 inches unless otherwise specified. 3) Package Material: Alumina (AL203) 4) Lead Material: Kovar, Plated by 50 in. minimum nickle under 60 in. minimum gold. FIGURE 22. MECHANICAL OUTLINE DRAWING FOR MINI-ACE MARK3 80-PIN FLAT PACKAGE Data Device Corporation www.ddc-web.com 92 BU-6474X/6484X/6486X AL-11/12-0 .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) .065 [1.65] (TYP) 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 17 EQ. SP. @ .0394 [1.00] = .670 [17.02] (TOL NONCUM) (TYP) V U T R P N M L K J H G F E D C B A .0394 [1.00] (TYP) .065 [1.65] (TYP) Triangle denotes Ball A1 BOTTOM VIEW Cover Material Diallyl Phthalate (DAP) 0.015 [0.38] (REF) 0.120 [3.05] (MAX) .022 [0.56] DIA FR4 P.C. Board B = Sn/Pb (63/37) BALL R = Sn/Ag/Cu (96.5/3.0/0.5) BALL SIDE VIEW Notes: 1) Dimensions are in inches (mm). 2) Cover material: Diallyl Phthalate (DAP). 3) Base material: FR4 PC board. 4) Solder Ball Cluster to be centralized within .010 of outline dimensions. 5) The copper pads (324 places) on the bottom of the BGA package are .025" (0.635 mm) in diameter prior to processing. Final ball size is .022" (0.56 mm) after processing (typical). FIGURE 23. MECHANICAL OUTLINE DRAWING FOR MICRO-ACE-TE BGA PACKAGE Data Device Corporation www.ddc-web.com 93 BU-6474X/6484X/6486X AL-11/12-0 ORDERING INFORMATION FOR MINI-ACE MARK3 BU-64XXXXX-XXXX Supplemental Process Requirements: S = Pre-Cap Source Inspection L = 100% Pull Test Q = 100% Pull Test and Pre-Cap Source Inspection K = One Lot Date Code W = One Lot Date Code and Pre-Cap Source Inspection Y = One Lot Date Code and 100% Pull Test Z = One Lot Date Code, Pre-Cap Source Inspection and 100% Pull Test Blank = None of the Above Test Criteria: 0 = Standard Testing 1 = X-Ray 2 = MIL-STD-1760 Amplitude Compliant (not available with Voltage/Transceiver Options 0 "Transceiverless" or 4/9/D "McAir compatible") 3 = MIL-STD-1760 and X-Ray Process Requirements: 0 = Standard DDC practices, no Burn-In 1 = MIL-PRF-38534 Compliant (note 3) 2 = B (note 1) 3 = MIL-PRF-38534 Compliant (note 3) with PIND Testing 4 = MIL-PRF-38534 Compliant (note 3) with Solder Dip 5 = MIL-PRF-38534 Compliant (note 3) with PIND Testing and Solder Dip 6 = B (note 1) with PIND Testing 7 = B (note 1) with Solder Dip 8 = B (note 1) with PIND Testing and Solder Dip 9 = Standard DDC Processing with Solder Dip, no Burn-In (see table on next page) Temperature Range (note 2)/Data Requirements: 1 = -55C to +125C 2 = -40C to +85C 3 = 0C to +70C 4 = -55C to +125C with Variables Test Data 5 = -40C to +85C with Variables Test Data 6 = Custom Part (Reserved) 7 = Custom Part (Reserved) 8 = 0C to +70C with Variables Test Data Voltage/Transceiver Option: 0 = Transceiverless (contact factory for availability) 3 = +5.0 Volts rise/fall times = 100 to 300 ns (-1553B) 4 = +5.0 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible. Not available with Test Criteria option 2 "MIL-STD-1760 Amplitude Compliant") 8 = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 5) (Not available with Logic/RAM Voltage option 5 "+5.0 Volt".) 9 = +3.3 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible. Not available with Test Criteria option 2 "MIL-STD-1760 Amplitude Compliant" or with Logic/RAM Voltage option 5 "+5.0 Volt".) (note 5) C = +3.3 Volts rise/fall times = 100 to 300 ns (-1553B) (note 6) (Not available with Logic/RAM Voltage option 5 "+5.0 Volt".) D = +3.3 Volts rise/fall times = 200 to 300 ns (-1553B and McAir compatible. Not available with Test Criteria option 2 "MIL-STD-1760 Amplitude Compliant" or with Logic/RAM Voltage option 5 "+5.0 Volt".) (note 6) Package Type: F = 80-Lead Flat Pack G = 80-Lead "Gull Wing" (Formed Lead) Logic / RAM Voltage: 3 = 3.3 Volt 5 = 5.0 Volt (applicable only for BU-64745 and BU-64845) Product Type (see next page for Product Matrix): BU-6474 = RT only with 4K RAM BU-6484 = BC /RT / MT with 4K x 16 RAM BU-6486 = BC /RT / MT with 64K x 17 RAM Notes: 1. Standard DDC processing with burn-in and full temp test. See table on next page. 2. Temperature Range applies to case temperature. 3. MIL-PRF-38534 product grading is designated with the following dash numbers: Class H is a -11X, 13X, 14X, 15X, 41X, 43X, 44X, 45X Class G is a -21X, 23X, 24X, 25X, 51X, 53X, 54X, 55X Class D is a -31X, 33X, 34X, 35X, 81X, 83X, 84X, 85X Data Device Corporation www.ddc-web.com 4. The above products contain tin-lead solder finish as applicable to solder dip requirements. 5. Transformer center-tap connected to +3.3V_XCVR, see FIGURE 15 (Obsolete) 6. Transformer center-tap connected to GND, see FIGURE 16 94 BU-6474X/6484X/6486X AL-11/12-0 STANDARD DDC PROCESSING FOR HYBRID AND MONOLITHIC HERMETIC PRODUCTS MIL-STD-883 TEST METHOD(S) CONDITION(S) INSPECTION 2009, 2010, 2017, and 2032 -- SEAL 1014 A and C TEMPERATURE CYCLE 1010 C CONSTANT ACCELERATION 2001 3000g BURN-IN 1015 (note 1), 1030 (note 2) TABLE 1 Notes: 1. For Process Requirement "B" (refer to ordering information), devices may be non-compliant with MILSTD-883, Test Method 1015, Paragraph 3.2. Contact factory for details. 2. When applicable. MINI-ACE MARK3 PRODUCT MATRIX PART NUMBER LOGIC VOLTAGE MEMORY RAM VOLTAGE TRANSCEIVER VOLTAGE BU-64743X3 3.3 V 4K x 16 3.3 V 5.0 V BU-64743X4 3.3 V 4K x 16 3.3 V 5.0 V BU-64743X8 3.3 V 4K x 16 3.3 V 3.3 V BU-64743X9 3.3 V 4K x 16 3.3 V 3.3 V BU-64743XC 3.3 V 4K x 16 3.3 V 3.3 V BU-64743XD 3.3 V 4K x 16 3.3 V 3.3 V BU-64745X3 5.0 V 4K x 16 5.0 V 5.0 V BU-64745X4 5.0 V 4K x 16 5.0 V 5.0 V BU-64843X3 3.3 V 4K x 16 3.3 V 5.0 V BU-64843X4 3.3 V 4K x 16 3.3 V 5.0 V BU-64843X8 3.3 V 4K x 16 3.3 V 3.3 V BU-64843X9 3.3 V 4K x 16 3.3 V 3.3 V BU-64843XC 3.3 V 4K x 16 3.3 V 3.3 V BU-64843XD 3.3 V 4K x 16 3.3 V 3.3 V BU-64845X3 5.0 V 4K x 16 5.0 V 5.0 V BU-64845X4 5.0 V 4K x 16 5.0 V 5.0 V BU-64863X3 3.3 V 64K x 17 3.3 V 5.0 V BU-64863X4 3.3 V 64K x 17 3.3 V 5.0 V BU-64863X8 3.3 V 64K x 17 3.3 V 3.3 V BU-64863X9 3.3 V 64K x 17 3.3 V 3.3 V BU-64863XC 3.3 V 64K x 17 3.3 V 3.3 V BU-64863XD 3.3 V 64K x 17 3.3 V 3.3 V Data Device Corporation www.ddc-web.com 95 BU-6474X/6484X/6486X AL-11/12-0 ORDERING INFORMATION FOR MICRO-ACE-TE (NOTE 3) BU-6XXXXBX-E0X Test Criteria: 0 = 18V Amplitude, only available with "Voltage transceiver option = 4" 2 = MIL-STD-1760 Amplitude Compliant, Standard Process Requirements: 0 = Standard DDC practices, no Burn-In Temperature Range (note 2) /Data Requirements: E = -40C to +100C Voltage/Transceiver Option: 3 = +5.0 Volts rise/fall times = 100 to 300 ns (1553B) 4 = +5.0 Volts 200 to 300 ns rise/fall times, 1553 and McAir compatible (not available with "Test Criteria option = 2") 8 = +3.3 Volts rise/fall times = 100 to 300 ns (1553B) (note 5) C = +3.3 Volts rise/fall times = 100 to 300 ns (1553B) (note 6) Package Type: B = 324-ball BGA Package R = RoHS Compliant 324-ball BGA Package Logic / RAM Voltage: 0 = 3.3 Volt or +5.0 Volt logic (For BU-64860, 64K x 17 RAM voltage is always +5.0V) 3 = 3.3 Volt Product Type (see Product Matrix): BU-6474 = RT only with 4K x 16 RAM BU-6484 = BC /RT / MT with 4K x 16 RAM BU-6486 = BC /RT / MT with 64K x 17 RAM Notes: 1. See Application Note AN/B-37 for SSRT implementation. option if using BU-6484x (BC/RT/MT) with 4K x 16 RAM 2. Temperature range applies to ball temperature. 3. See Micro-ACE TE Product Matrix below for valid ordering options. 4. Unless otherwise specified these products contain tin lead solder 5. Transformer center-tap connected to +3.3V_XCVR, see FIGURE 15 (Obsolete) 6. Transformer center-tap connected to GND, see FIGURE 16 STANDARD DDC PROCESSING FOR BGA PRODUCTS MIL-STD-883 TEST METHOD(S) CONDITION(S) INSPECTION 2010, 2017, and 2032 -- TEMPERATURE CYCLE 1010 B MICRO-ACE TE PRODUCT MATRIX PART NUMBER SPECIAL ORDER MIN QTY MAY APPLY LOGIC VOLTAGE MEMORY RAM VOLTAGE TRANSCEIVER VOLTAGE BU-64743B8-E02 X 3.3V 4K x 16 3.3V 3.3V BU-64840B(R)3-E02 X 3.3V or 5.0V 4K x 16 Same as Logic 5.0V BU-64843B(R)8-E02 3.3V 4K x 16 3.3V 3.3V BU-64843B(R)C-E02 3.3V 4K x 16 3.3V 3.3V BU-64860B(R)3-E02 3.3V or 5.0V 64K x 17 5.0V 5.0V BU-64863B(R)8-E02 3.3V 64K x 17 3.3V 3.3V BU-64863B(R)C-E02 3.3V 64K x 17 3.3V 3.3V BU-64860B(R)4-E00 3.3V or 5.0V 64K x 17 5.0V 5.0V Data Device Corporation www.ddc-web.com 96 BU-6474X/6484X/6486X AL-11/12-0 ORDERING INFORMATION FOR MICRO-ACE-TE MECHANICAL SAMPLE BU-64863B8-600 MICRO-ACE-TE (324 Ball BGA) Mechanical Sample, with "daisy chain" connections of alternating balls, for use in environmental (mechanical / thermal) integrity testing. ORDERING INFORMATION FOR +5.0V TRANSCEIVER EVALUATION BOARD BU-61860E3-300 Evaluation board intended to support customers who are interested in electrically connecting and evaluating the performance of +5.0V Enhanced Mini-ACE and/or +5.0V -ACE (MICRO-ACE) series of products. ORDERING INFORMATION FOR +3.3V TRANSCEIVER EVALUATION BOARD BU-64863E8-300 Evaluation board intended to support customers who are interested in electrically connecting and evaluating the performance of the +3.3V Mini-ACE Mark3 and/or +3.3V MICRO-ACE-TE series of products. The information in this data sheet is believed to be accurate; however, no responsibility is assumed by Data Device Corporation for its use, and no license or rights are granted by implication or otherwise in connection therewith. Specifications are subject to change without notice. Please visit our Web site at www.ddc-web.com for the latest information. 105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2426 For Technical Support - 1-800-DDC-5757 ext. 7771 (R) I FI REG U ST RM Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358 United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264 France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425 Germany - Tel: +49-(0)89-15 00 12-11, Fax: +49-(0)89-15 00 12-22 Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689 Asia -Tel: +65-6489-4801 World Wide Web - http://www.ddc-web.com ERED DATA DEVICE CORPORATION REGISTERED TO: ISO 9001:2008, AS9100C:2009-01 EN9100:2009, JIS Q9100:2009 FILE NO. 10001296 ASH09 AL-11/12-0 97 PRINTED IN THE U.S.A. RECORD OF CHANGE For BU-64743 Data Sheet Revision AE AF Date 6/2009 10/2009 Pages 45, 47 92 AG 4/2010 5, 44, 45, AJ 6/2011 2, 39, 44, 45, 47, 90, 91, 92 AK 12/2011 2, 3-4, 6, 8, 45, 46, 50, 56, 56 - 69, 71 -80, 93 Description Replaced Tables 46 and 47 Changed to "Package Type" ordering description. FROM: R = Lead Free 324-ball BGA Package TO: R = RoHS Compliant 324-ball BGA Package Table 46 (MLP-3233 & MLP-3333 - From: "SMT" To: "Through Hole" Figure 15 ( Deleted "BETA LVB-4103" & "BETA LVB-4203") Added NOT Bar to all occurrences of "RTBOOT" Table 1 (Thermal - 324 BALL BGA PACKAGE) From: Maximum peak temperature of Solder Reflow Profile +260C To: The reflow profile detailed in IPC/JEDEC J-STD-020 is applicable for both leaded and leadfree products +245C (PHYSICAL CHARACTERISTICS - Micro-ACE-TE) Added: Electrostatic Discharge Sensitivity ESD Class 0 Updated Figures 1 and 12. Added Figure 16 (BU-64XXXXC/D). Incremented all following Figure numbers. Update to Figure 17. Replaced Table 46 and corresponding description. Added Options "C" and "D", and notes 5 and 6 to Ordering Information for Mini-ACE Mark3. Added Option "C" and notes to Ordering Information for Micro-ACE-TE Updated Micro-ACE TE Product Matrix from "BU-64840B3-E02" to "BU-64840B(R)3-E02. Table 1: Added Power Specifications for C and D versions. Pages 6 & 8: Clarified that Sleep-in feature is only applicable to the 8/9 version transceivers. Tables 48 and 49: Added versions C and D. Updated Tables 55, 56, 64, 66, 67, 68, and 69. AL 11/2012 3-9 Added versions 4 and C to Tables 57 - 65. Changed transformer winding references from 2.038 to 2.07 on pages 2, 45, and 46. Table 1 edits: Added MIL-STD-1553 transceiver input ranges to Absolute Maximum Rating. Added notes 17 and 18 to Table 1 notes on page 9. Moved supported clock frequencies from minimum column to typical column.