Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
Document Number: MC33897
Rev. 18.0, 4/2012
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2006 - 2012. All rights reserved.
Single Wire CAN Transceiver
The 33897 series provides a physical layer for di gital
communication using a Carrier Sense Multip le Access/Collision
Resolution (CSMA/CR) data link operating over a single wire medium.
This is more commonly referred to as single-wire Controller Area
Network (SWCAN).
The 33897 series operates directly from a vehicle's 12 V battery
system or a broad range of DC-power sources. It can operate at low or
high (33.33 kbps or 83.33 kbps) data rates. A high-voltage wake-up
feature allows the device to control the regulator used in support of the
MCU and other logic. The device includes a control pin that can be
used to put the module regulator into Sleep mode. The presence of a
defined wake-up voltage level on the bus will reactivate the control line
to turn the regulator and the system back ON.
The device complies with the GMW3089 v2.4 General Motors
Corporation specificati on.
Features
• Waveshaping for low Electromagnetic Interference (EMI)
• Detects and automatically handles loss of ground
• Worst-case Sleep mode current of only 60 μA
• Current limit prevents damage due to bus shorts
• Built-in thermal shutdown on bus output
• Protected against vehicular electrical transients
• Under-voltage lockout prevents false data with low battery
Figure 1. 33897 Simplified Application Diagram
SINGLE-WIRE CAN
TRANSCEIVER
33897
EF (PB-FREE) SUFFIX
98ASB42565B
14-PIN SOICN
ORDERING INFORMATION
Device Temperature
Range (TA)Package
MCZ33897TEF/R2 -40 to 125 °C 14 SOICN
*MC33897CTEF/R2
*Recommended device for all new designs
VBATT
4
MODE 1
MODE 0
RXD
TXD
GND
LOAD
CNTL
BUS
MCU
Battery
Voltage
EN
Power
source
Regulator
V
CC
SWC Bus
33897
Analog Integrated Circuit Device Data
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33897
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
Figure 2. 33897 Simplified Internal Block Diagram
Control
MODE0
MODE1
TX Bus DRVR
Bus RCVR
Load Switch
Wave Shaping En
HVWU En
TXData
TXD
HVWU Det
RXD
RXData
Timers Timer
OSC
Undervoltage
Detect
LOAD
BAT
CNTL
GND
BUS
Disable
Disable
Mode
VBATT
TXD BUS DRVR
BUS RCVR
HVWU Enable
Waveshaping Enable
TXD Data Disable
HVWU Detect
RXD Data
Mode
Control
CNTL
Disable
Analog Integrated Circuit Device Data
4Freescale Semiconductor
33897
PIN CONNECTIONS
PIN CONNECTIONS
Figure 3. 33897 Pin Conne ctions
Table 2. Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section, beginning on page 12.
33897 Pin Pin Name Formal Name Definition
1, 7, 8, 14 GND Ground Electrical Common Ground and Heat removal. A good thermal path will also reduce
the die temperature.
2TXD Transmit Data Data input here will appear on the BUS pin. A logic [0] will assert the bus, a logic [1]
will make the bus go to the recessive state.
3, 4 MODE0,
MODE1 Mode Control These Pins control Sleep mode, Transmit Level, and Speed. They have weak pull-
downs.
5RXD Receive Data Open drain output of the data on BUS. A recessive bus = a logic [1], a dominant bus
= logic [0]. An external pull-up is required.
6, 13 NC No Connect No internal connection to these Pins. Pin 13 can be connected to GND.
9CNTL Control Provides a battery level logic signal.
10 VBATT Battery Power input. An external diode is needed for reverse battery protection.
11 LOAD Load The external bus load resistor connects here to prevent bus pull-up in the event of
loss of module ground.
12 BUS Bus This pin connects to the bus through external components.
GND
VBATT
CNTL
GND
NC
BUS
LOAD
GND
RXD
NC
GND
TXD
MODE0
MODE1
5
6
7
2
3
4
14
10
9
8
13
12
11
1
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Analog Integrated Circuit Device Data
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33897
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Rating Symbol Value Unit
Electrical Ratings
Supply Voltage VBATT - 0.3 to 40 V
Input Logic Voltage VIN - 0.3 to 7.0 V
RXD Pin Voltage VRXD - 0.3 to 7.0 V
CNTL Pin Voltage VCNTL - 0.3 to 40 V
ESD Voltage(1)
Human Body Model
All Pins Except BUS
BUS Pin
Machine Model
VESD
± 2000
± 4000
± 100
V
Thermal Ratings
Ambient Operating Temperature(1) TA- 40 to 125 °C
Junction Operating Temperature TJ- 40 to 150 °C
Storage Temperature TSTG - 55 to 150 °C
Junction-to-Ambient Thermal Resistance RθJA 150 °C/W
Peak Package Reflow Temperature During Reflow (2), (3) TPPRT Note 3. °C
Notes
1. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω),
Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
6Freescale Semiconductor
33897
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions of -40 °C ≤ TA ≤ 125 °C, unless otherwise stated. Voltages are relative to GND, unless
otherwise noted. All positive currents are into the pin. All negative currents are out of the pin.
Characteristic Symbol Min Typ Max Unit
GENERAL
Quiescent Current
Sleep
5.0 V ≤ VBATT ≤ 13 V (4)
Awake with Transmitter Disabled
5.0 V ≤ VBATT ≤ 26.5 V
Awake with Transmitter Enabled
5.0 V ≤ VBATT ≤ 26.5 V
IQSLP
IQATDIS
IQATEN
–
–
–
45
–
–
60
4.0
9.0
μA
mA
mA
Under-voltage Shutdown VBATTUV 4.0 –5.0 V
Under-voltage Hysteresis VUVHYS 0.1 –0.5 V
Thermal Shutdown (5)
5.0 V ≤ VBATT ≤ 26.5 V TSD 150 –190 °C
Thermal Shutdown Hysteresis (5)
5.0 V ≤ VBATT ≤ 26.5 V TSDHYS 10 –20 °C
LOGIC I /O, MODE0, MODE1, TXD, RXD
Logic Input Low Level (MODE0, MODE1, and TXD)
5.0 V ≤ VBATT ≤ 26.5 V VIL – – 0.8 V
Logic Input High Level (MODE0, MODE1, and TXD)
5.0 V ≤ VBATT ≤ 26.5 V VIH 2.0 – – V
Mode Pin Pull-down Current (MODE0 and MODE1)
Pin Voltage = 0.8 V, 5.0 V ≤ VBATT ≤ 26.5 V IPD 10 –50
μA
Receiver Output Low (RXD)
IIN = 2.0 mA, 5.0 V ≤ VBATT ≤ 26.5 V VOL – – 0.45 V
CNTL
CNTL Output Low
IIN = 5.0 μA, 5.0 V ≤ VBATT ≤ 26.5 V VOLCNTL – – 0.8 V
CNTL Output High
IOUT = 180 μA, 5.0 V ≤ VBATT ≤ 26.5 V VOHCNTL VBATT - 0.8 – VBATT
V
Notes
4. After tCNTLFDLY
5. Thermal shutdown causes the BUS output driver to be disabled. Guaranteed by characterization.
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ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
LOAD
LOAD Voltage Rise (6)
Normal Speed and Voltage Mode, Transmit High-
Voltage Mode, Transmit High Speed Mode
IIN = 1.0 mA, 5.0 V ≤ VBATT ≤ 26.5 V
Sleep Mode
IIN = 7.0 mA 33897T
IIN = 7.0 mA (7) 33897CT
Loss of Battery
IIN = 7.0 mA
VLDRISE
–
–
–
–
–
–
–
–
0.1
1.0
0.1
1.0
V
LOAD Leakage During Loss of Module Ground (8)
0.0 V ≤ VBATT ≤ 18 V 33897T
0.0 V ≤ VBATT ≤ 18 V 33897CT
ILDLEAK 0.0
-10 –
–- 90
10
μA
BUS
Passive Out BUS Leakage
Passive In
0.0 V ≤ VBATT ≤ 26.5 V, -1.5 V ≤ VBUS < 0 V
Active In
0.0 V ≤ VBATT ≤ 26.5 V, 0 V < VBUS ≤ 12.5 V
BUS Leakage During Loss of Module Ground (9)
0.0 V ≤ VBATT ≤ 18 V 33897T
0.0 V ≤ VBATT ≤ 18 V 33897CT
ILEAK
ILKAI
IBLKLOG
-5.0
-5.0
-10
0.0
–
–
–
–
5.0
5.0
10
-90
μA
High Voltage Wake-up Mode Output High Voltage
12 V ≤ VBATT ≤ 26.5 V, 200 Ω ≤ RL ≤ 3332 Ω
33897T
33897CT
5.0 V ≤ VBATT < 12 V, 200 Ω ≤ RL ≤ 3332 Ω
VHVWUOHF
VHVWUOHO
9.7
9.9
Lesser of VBAT -
1.5 or 9.7
–
–
–
12.5
12.5
VBATT
V
High Speed Mode Output High Voltage
8.0 V ≤ VBATT ≤ 16 V, 75 Ω ≤ RL ≤ 135 Ω
VOHHS 4.2 –5.1 V
Normal Mode Output High Voltage
6.0 V ≤ VBATT ≤ 26.5 V, 200 Ω ≤ RL ≤ 3332 Ω
5.0 V ≤ VBATT < 6.0 V, 200 Ω ≤ RL ≤ 3332 Ω
VNOHF
VNOHO
4.4
Lesser of VBATT -
1.6 or 4.4
–
–5.1
Lesser of VBATT
or 5.1
V
Notes
6. GMW3089V2.4 specifies the maximum load voltage rise to be 0.1 V whenever module battery is intact, including when in Sleep mode.
The maximum load voltage rise of 1.0 V in Sleep mode is a GM-approved exception to GMW3089V2.4.
7. 33897CT removes the diode drop during Sleep mode.
8. LOAD pin is at system ground voltage.
9. BUS pin is at system ground voltage
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions of -40 °C ≤ TA ≤ 125 °C, unless otherwise stated. Voltages are relative to GND, unless
otherwise noted. All positive currents are into the pin. All negative currents are out of the pin.
Characteristic Symbol Min Typ Max Unit
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33897
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
BUS (CONTINUED)
BUS Low Voltage
5.0 V ≤ VBATT ≤ 26.5 V, 200 Ω ≤ RL ≤ 3332 Ω
VOL - 0.2 –0.2 V
Short-circuit BUS Output Current
Dominant State, 5.0 V ≤ VBATT ≤ 26.5 V IBSC -350 – - 100 mA
Input Threshold
Awake
5.0 V ≤ VBATT ≤ 26.5 V
Sleep
12 V ≤ VBATT ≤ 26.5 V
Sleep
5.0 V ≤ VBATT < 12 V
VBIA
VBISF
VBISO
2.0
6.6
Lesser of 6.6 V or
VBATT - 4.3
–
–
–
2.2
7.9
Lesser of 7.9 V or
VBATT - 3.25
V
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions of -40 °C ≤ TA ≤ 125 °C, unless otherwise stated. Voltages are relative to GND, unless
otherwise noted. All positive currents are into the pin. All negative currents are out of the pin.
Characteristic Symbol Min Typ Max Unit
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ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Character istics
Characteristics noted under conditions of -40 °C ≤ TA ≤ 125 °C, unless otherwise stated. Voltages are relative to GND unless
otherwise noted. All positive currents are into the pin. All negative currents are out of the pin.
Characteristic Symbol Min Typ Max Unit
BUS
Normal Speed Rising Output Delay
200 Ω ≤ RL ≤ 3332 Ω, 1.0 μs ≤ Load Time Constants ≤ 4.0 μs
Measured from TXD = VIL to VBUS as follows:
Max Time to VBUSMOD = 3.7 V, 6.0 V ≤ VBATT ≤ 26.5 V (10)
Min Time to VBUSMOD = 1.0 V, 6.0 V ≤ VBATT ≤ 26.5 V (10)
Max Time to VBUSMOD = 2.7 V, VBATT = 5.0 V (10)
Min Time to VBUSMOD = 1.0 V, VBATT = 5.0 V (10)
t DLYNORMRO 2.0 –6.3
μs
Normal Speed Falling Output Delay
200 Ω ≤ RL ≤ 3332 Ω, 1.0 μs ≤ Load Time Constants ≤ 4.0 μs
Measured from TXD = VIH to VBUS as follows:
Max Time to VBUSMOD = 1.0 V, 6.0 V ≤ VBATT ≤ 26.5 V (10)
Min Time to VBUSMOD = 3.7 V, 6.0 V ≤ VBATT ≤ 26.5 V (10)
Max Time to VBUSMOD = 1.0 V, VBATT = 5.0 V (10)
Min Time to VBUSMOD = 2.7 V, VBATT = 5.0 V (10)
t DLYNORMFO 1.8 –8.5
μs
High Speed Rising Output Delay
75 Ω ≤ RL ≤ 135 Ω, 0.0 μs ≤ Load Time Constants ≤ 1.5 μs,
8.0 V ≤ VBATT ≤ 16 V
Measured from TXD = VIL to VBUS as follows:
Max Time to VBUS = 3.7 V (11)
Min Time to VBUS = 1.0 V (11)
t DLYHSRO 0.1 –1.7
μs
High Speed Falling Output Delay
75 Ω ≤ RL ≤ 135 Ω, 0.0 μs ≤ Load Time Constants ≤ 1.5 μs,
8.0 V ≤ VBATT ≤ 16 V
Measured from TXD = VIH to VBUS as follows:
Max Time to VBUS = 1.0 V (11)
Min Time to VBUS = 3.7 V (11)
t DLYHSFO 0.04 –3.0
μs
Notes
10. VBUSMOD is the voltage at the BUSMOD node in Figure 6, page 13.
11. VBUS is the voltage at the BUS pin in Figure 7, page 14.
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ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
BUS (CONTINUED)
High Voltage Rising Output Delay
200 Ω ≤ RL ≤ 3332 Ω, 1.0 μs ≤ Load Time Constants ≤ 4.0 μs
Measured from TXD=VIL to VBUS as follows:
Max Time to VBUSMOD = 3.7 V, 6.0 V ≤ VBATT ≤ 26.5 V (12)
Min Time to VBUSMOD = 1.0 V, 6.0 V ≤ VBATT ≤ 26.5 V (12)
Max Time to VBUSMOD = 9.4 V, 12.0 V ≤ VBATT ≤ 26.5 V (12)
t DLYHVRO
2.0
2.0
2.0
–
–
–
6.3
6.3
18
μs
High Voltage Falling Output Delay
200 Ω ≤ RL ≤ 3332 Ω, 1.0 μs ≤ Load Time Constants ≤ 4.0 μs,
12.0 V ≤ VBATT ≤ 26.5 V
Measured from TXD=VIH to VBUS as follows:
Max Time to VBUSMOD = 1.0 V (12)
Min Time to VBUSMOD = 3.7 V (12)
t DLYHVFO
1.8
1.8 –
–14
14
μs
RECEIVER RXD
Receive Delay Time (5.0 V ≤ VBATT ≤ 26.5 V)
Awake t RDLY 0.2 –1.0
μs
Receive Delay Time (BUS Rising to RXD Falling, 5.0 V ≤ VBATT ≤ 26.5 V)
Sleep t RDLYSL 10 –70
μs
CNTL
CNTL Falling Delay Time (5.0 V ≤ VBATT ≤ 26.5 V) t CNTLFDLY 300 –1000 ms
Notes
12. VBUSMOD is the voltage at the BUSMOD node in Figure 6, page 13.
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions of -40 °C ≤ TA ≤ 125 °C, unless otherwise stated. Voltages are relative to GND unless
otherwise noted. All positi ve currents are into the pin. All negative currents are out of the pin.
Characteristic Symbol Min Typ Max Unit
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33897
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
Figure 4. TXD, Bus and RXD Waveforms in Normal Mode
Figure 5. TXD, Bus and RXD Waveforms in High Speed Mode
* VBUSMOD is the voltage at the BUSMOD node in Figure 7.
TXD
Bus
RXD
V
IL
V
IH
V
BUSMOD
t
DLYNORMFO
V
NOHF
V
BIA
V
IL
V
BIA
t
RDLY
t
DLYNORMRO
t
RDLY
V
IH
V
BUSMOD *
*
* VBUS is the voltage at the BUS pin in Figure 8.
TXD
Bus
RXD
tDLYHSFO TDLYHSRO
VIH
VIL
VBUS *
VBIA
VNOHF
tRDLY
VIH
VBIA VBUS *
VIL
tRDLY
Analog Integrated Circuit Device Data
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33897
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33897 Series is intended for use as a physical laye r
device in a Single Wire CAN communications bus.
Communications takes place from a single pin over a single
wire using a common ground for a current return path. Two
data rates are available, with the high rate used for factory or
assembly line communications and the lower for actual
system communications where the radiated EMI of the higher
rate could be an issue.
Two pins control the mode of operation (sleep, low speed,
high speed, and high voltage wake-up).
FUNCTIONAL PIN DESCRIPTION
The 33897 Series is intended to be used with an MCU to
control its operation and to process and generate the data for
the bus.
GROUND PINS
The four ground pins are not only for electrical conduction,
their number and locations at each of the four corners serve
also to remove heat from the IC. The biggest benefit of this is
obtained by putting a lot of copper on the PCB in this area
and, if ground is an internal layer, by adding numerous
plated-through connections to it with the largest diameter
holes the layout can use.
TXD DATA
The data dr iven onto th e SWCAN bus is inve rted from the
TXD pin. A “1” driven on TXD will result in an undriven
(recessive) state (bus at near zero volts). When the TXD pin
is low, the output goes to a driven state. The voltage and
waveshaping in the driven state is determined by the levels
on the MODE0 and MODE1 Pins (refer to Table 6).
MODE CONTROL
The MODE pins control the transmitter filtering and BUS
voltage and the IC Sleep mode operation. Table 6 shows the
mode versus the logic levels on MODE0 and MODE1.
The MODE0 and MODE1 pins have a weak pull-down in
the IC so that in case the pins are not driven, the device will
enter the Sleep mode. This is usually the situation as the
MCU comes out of reset, before the driving signals have
been configured as outputs.
RXD DATA
The data received on the bus is translated to logic levels
on this pin. This pin is a logic high when the bus is in the
recessive state (near zero volts) and is logic low when the
bus is in either the normal or high voltage dominant state.
This is an open-drain type of output that requires an
external resistor to pull it up. When the device is in sleep
mode, the output will be off unless a high vol tage wake-up
level is detected on the bus. If the wake-up level is detected,
the output will be driven by the data on the bus. If the level of
the data returns to normal level, the output will return to off
after a short delay unless a non-sleep mode cond ition is set
by the MCU.
LOAD SWITCH
This switch is ON in all operating modes unless a loss of
ground is detected. If this happens, the switch is opened and
the resistor normally attached to its pin will no longer pass
current to or from the bus.
CNTL OUTPUT
This logic level signal is used to control a VCC regulator.
When the output is low, the VCC regulator is expected to
shutdown. This is normally used to shut down the MCU and
all the devices powered by VCC when the IC is in Sleep mode.
This is done to save power. When the part is taken out of the
Sleep mode by the higher than normal bus voltage, this pin is
asserted high and the VCC regulator brings its output up to the
regulated level. This starts the MCU, which controls the mode
of the IC. The MCU must change the mode signals to non-
Sleep mode levels in order to keep this pin from going low.
There is a delay to allow the MCU to fully wake-up and take
control after the high voltage signaling is removed before the
level on this output returns low. After a delay time, even if the
bus is at high voltage, the IC will return to Sleep mode if both
MODE pins are low.
Table 6. Mode Control Lo gic Levels
Logic Level Operation
MODE0 MODE1
0 0 Sleep mode
0 1 High voltage wake-up mode
1 0 High speed mode
1 1 Normal mode
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33897
FUNCTIONAL DESCRIPTION
FUNCTIONAL BLOCK DIAGRAM COMPONENTS
VBATT INPUT
This power input is not reverse battery protected and
should use an external diode to protect it from damage due
to reverse battery if this protection is desired. The voltage
drop of the diode must be taken into consideration when the
operating range of the system is being determined. This
diode is generally used to protect the entire module from
reverse battery and should be selected accordingly.
BUS I /O
This input / output may requi re electrostatic discharge
(ESD) and /or EMI externa l circuitry. A set of components is
shown in the simplified application diagrams on page 15. The
value of the capacitor should be adjusted downward in direct
proportion to the added capacitance of the ESD or EMI
circuits. The series resistance of the in ductor should be kept
below 3.5 Ω to prevent its voltage drop from significantly
degrading system noise margins.
FUNCTIONAL BLOCK DIAGRAM COMPONENTS
TIMER OSC
This circuit generates a 500 kHz signal to be used for
internal logic. It is the refere nce for some of the required
delays.
TIMERS
This circuit contains the timing logic used to hold the CNTL
active for the required time after the conditions for sleep
mode have been met. It is also used to keep the TXD driver
active for a period of time after it has generated a passive
level on the bus.
MODE CONTROL
This circuit contains the control logic for the various
operating modes and conditions required for the IC.
BUS RCVR
This circuit translates the levels on the BUS pin to a CMOS
level indicating the presence of a logic [0] or a logic [1]. It also
determines the presence of a high voltage wake-up (HVWU)
signal that is passed to Mode Control and Timers circuits. An
analog filter is used to “de-glitch” the high voltage wake-up
signal and prevent false exits from the Sleep mode.
TXD BUS DRVR
This circuit drives the BUS. It can drive it with the higher
voltage wake-up signals when enabled by the Mode Control
circuit. It can also provide waveshaping for reduced EMI or
not provide it for the higher data rate mode. The actual data
is received on TXD at CMOS logic levels, then translated by
this circuit to the necessary operating voltages.
UNDER-VOLTAGE DETECT
This circuit monitors internal operating voltage to assure
proper operation of the part. If a low-voltage condition is
detected, it sends a signal to disable the BUS RCVR and
TXD BUS DRVR circuits. This prevents incorrect data from
being put on the bus or sent to the MCU.
LOAD SWITCH
The LOAD switch provides a path for an external resistor
connected to the BUS to be connected to ground. When a
loss of ground is detected, this switch is opened to prevent
the current that would normally be flowing to the ground from
the module from going back through the load resistor and
raising the bus level. The circuit is opened when the voltage
between GND and VBATT becomes too low as would be the
case if module ground were lost.
BUS LOADING PARAMETERS
Figure 6. Transmitter Delays in Normal and Transmit High Voltage Wake-up Modes
47 μH
1.0 kΩ
CNOM = 100 pF + (n -1) 220 pF R=6.49 kΩ
(n-1)
33897
6.49 kΩ
BUS
LOAD
GND
100 pF
VBATT
Note: The letter ’n’ represents the number of nodes in the system.
BUSMOD
Analog Integrated Circuit Device Data
14 Freescale Semiconductor
33897
FUNCTIONAL DESCRIPTION
FUNCTIONAL BLOCK DIAGRAM COMPONENTS
Figure 7. Transmitter Delays i n Transmit High Speed Mode
130 ΩCNOM = (n) 220 pF R=6.49 kΩ
33897
6.49 kΩ
BUS
LOAD
GND
(n-1)
Note: The letter ’n’ represents the number of nodes in the system.
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33897
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
The 33897 can be used in applications where the module
includes a regulator that has the capability of going into Sleep
mode by having an Enable pin. See Figure 8. When the
module’s regulator is in Sleep mode, the module is turned off.
The module waits for a defined wake-up voltage level on the
bus. This wake-up voltage will activate the CNTL line, which
enables the regulator and turns the module back ON. This
feature allows the module to be more energy effici ent since
the current consumption is significantly lowered when it goes
into sleep mode.
Figure 8. 33897 Typical Application Schematic
GND
CNTL
VBATT
LOAD
BUS
RXD
MODE0
TXD
Voltage
Regulator
33897
EN
VCC
MCU
10 kΩ2.7 kΩ
6.49 kΩ
1.0 kΩ
Battery
47 μH
SWC BUS
VCC
Power
MODE1
47 pF
100 pF
Source 4.7 μF
4
100 nF
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PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important: For the most current Package revision, visit www.freescale.com and perform a Keyword Search on the
98ASB42565B drawing number below. Dimensions shown are provided for reference ONLY.
EF (Pb-FREE) SUFFIX
14-pin SOICN
98ASB42565B
ISSUE J
Analog Integrated Circuit Device Data
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PACKAGING
PACKAGE DIMENSIONS
EF (Pb-FREE) SUFFIX
14-pin SOICN
98ASB42565B
ISSUE J
Analog Integrated Circuit Device Data
18 Freescale Semiconductor
33897
REVISION HISTORY
REVISION HISTORY
REVISION DATE DESCRIPTION OF CHANGES
9.0 5/2005 • Converted to Freescale format
• Added A & B Versions
• Updated Device Variation Table, and Note “* Recommended device for all new designs”
• Added EF (Pb-Free) Devices, and higher soldering temperature
10.0 8/2005 • Implemented Revision History page
• Updated Simplified Application Diagrams
• Updated Typical Application Schematic
11.0 12/2005 • Added 33897C and D versions and Timing Diagrams
12.0 1/2006 • Updated Table 4, Static Electrical Characteristics - LOAD and BUS parameters
• Updated Ordering Information.
13.0 6/2006 • Removed “Unless otherwise noted” from Static Electrical Characteristics & Dynamic Electrical
Characteristics table introductions
14.0 8/2006 • Added Part Numbers MC33897TD and MC33897TEF to Ordering Information on Page 1.
• Added 33897T to Table 1, Device Variations on Page 3, Referencing Electrical Changes per Errata
MC33897TER, Revision 3 and specifying ESD variations
15.0 10/2006 • Removed Part Numbers MC33897TD/R2, MC33897TEF/R2, MC33897CLEF/R2, PC33897CLEF/
R2, MC33897DLEF/R2, and PC33897DLEF/R2
• Added Part Numbers MCZ33897EF/R2, MCZ33897TEF/R2, MCZ33897AEF/R2, MCZ33897CEF/
R2, MCZ33897BEF/R2, and MCZ33897DEF/R2 to the Ordering Information block on Page 1.
• Updated Device Variations on page 2 for “T” suffix products
• Split out Human Body Model on page 5 to differentiate between T and non-T versions
• Added Under-voltage Hysteresis on page 6
• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 5. Added note with instructions to obtain this information from
www.freescale.com.
16.0 6/2007 • Removed watermark, “Advance Information” from page 1.
17.0 1/2011 • Improved HBM ESD All Pins Except BUS to ±2.0 kV on MC33897CT
• Added MC33897CTEKF/R2 to the ordering information
• Removed all 8-Pin SOICN device information
• Changed Short-circuit BUS Output Current to -100 mA (Approved by GM)
18.0 4/2012 • Updated Quiescent Current IQSLP to 60 μA max.
Document Number: MC33897
Rev. 18.0
4/2012
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