Technical Data 4348 Effective July 2017 Supersedes February 2009 HCP0704 High current power inductors Applications Product features * 6.8 x 6.8 x 4.2 mm surface mount package * Iron powder core material * * * High current carrying capacity, low core losses * Tight DCR tolerance for sensing circuits * Inductance range from 0.40 H to 4.7 H * Current range from 5.0 A to 27 A * Frequency range up to 2 MHz * Halogen free, lead free, RoHS compliant * Voltage Regulator Module (VRM) * Multi-phase regulators * Desktop and servers * Base station equipment * Notebook and laptop regulators * Data networking and storage systems * Point-of-load modules (POL) * Battery power systems * DCR sensing circuits Environmental Data * Storage temperature range (Component): -40 C to +155 C Magnetically shielded, low EMI * High temperature core material eliminates thermal aging issues Operating temperature range: -40 C to +155 C (ambient plus self-temperature rise) * Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE Technical Data 4348 Effective July 2017 Product Specifications Part Number6 OCL1 25% (H) FLL2 Min. (H) 0.40 0.60 1.00 1.80 2.30 3.30 4.70 0.28 0.42 0.7 1.26 1.56 2.31 3.29 HCP0704-R40-R HCP0704-R60-R HCP0704-1R0-R HCP0704-1R8-R HCP0704-2R3-R HCP0704-3R3-R HCP0704-4R7-R Isat4 @ +25 C (A) 27 21 17 13 11.5 9.5 8.0 Irms3 (A) 17 14 12 8.5 7.5 6.0 5.0 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.10 Vrms, 0.0 Adc 2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1 DCR (m) @ +20 C 3.2 10% 4.5 10% 6.2 10% 11.0 10% 16.5 10% 25.0 10% 29.5 10% K-factor5 383.1 313.5 265.3 202.8 164.2 149.9 127.7 4 Isat: Peak current for approximately 20% rolloff at +25 C. 5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I : (Gauss), K: (K-factor 3 Irms: DC current for an approximate temperature rise of 40 C without core loss. Derating from table), L: (inductance in H), I (peak-to-peak ripple current in amps). 6 Part Number Definition: HCP0704-xxx-R * HCP0704 = Product code and size * xxx= Inductance value in H, R = decimal point. If no "R" is present, then third character = # of zeros * "-R" suffix = RoHS compliant is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed +125 C under worst case operating conditions verified in the end application. Dimensions (mm) T op V iew R ecom m ended P ad Layout B ottom V iew S ide V iew H C P 0704-R 40 to 2R 3= 1.20 +/- 0.2 H C P 0704-3R 3 to 4R 7= 1.00 +/- 0.2 H C P 0704-R 40 to 1R 0= 4.20 m ax H C P 0704-1R 8 to 4R 7= 4.00 m ax 7.60 6.80 M ax 2.50(2x) 1 w w llyy R H C P0704 xxx 3.30.3 6.80 M ax 1 S chem atic 2 2 4.00(2x) 1 2 The nominal DCR test point is in the middle of the terminal Part Marking: HCP0704 xxx = Inductance value in H. (R = Decimal point). If no "R" is present, then last character is # of zeros wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor Packaging information (mm) Supplied in tape and reel packaging, 1000 parts per 13" diameter reel. 1.5 Dia min. 4.0 2.0 1.5 Dia. +0.1/-0.0 1.75 A Section A-A 1 HCP0704 xxx wwllyy R 7.50 2 HCP0704-R40 to 1R0= 4.2 HCP0704-1R8 to 4R7= 4.0 2 www.eaton.com/electronics A 6.9 12.0 User direction of feed 7.5 16.0 0.3 HCP0704 High current power inductors Technical Data 4348 Effective July 2017 Temperature rise vs. total loss 60 Te mpe ta ture R is e (C) 50 40 30 20 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Tota l Los s (W) Core loss vs. Bp-p 5 0 0 kHz 1 MHz C ore L os s ( W ) 10 1 0 0 kHz 2 5 0 kHz 1 0. 1 0. 01 0. 001 10 100 1000 10000 B p-p ( G aus s ) www.eaton.com/electronics 3 Technical Data 4348 Effective July 2017 Inductance characteristics % o f O C L v s % o f I sat 100% 80% % o f O CL 25C 60% 40% 20% 0% 0% 20% 40% 60% 80% % o f I sat 4 www.eaton.com/electronics 100% 120% 140% 160% Technical Data 4348 Effective July 2017 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak * Temperature min. (Tsmin) Standard SnPb Solder Lead (Pb) Free Solder 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics (c) 2017 Eaton All Rights Reserved Printed in USA Publication No. 4348 BU-SB09086 July 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.