ATF16LV8C-10XU - ATMEL - Datasheet.Directory

Rev. 0403H–06/06

High-

performance

EE PLD

ATF16LV8C

Features

•3.0V to 5.5V Operation

•Industry-standard Architecture

– Emulates Many 20-pin PALs®

– Low-cost Easy-to-use Software Tools

•High-speed

– 10 ns Maximum Pin-to-pin Delay

•Ultra-low Power

–5 µA (Max) Pin-controlled Power-down Mode Option

– Typical 100 nA Standby

•CMOS and TTL Compatible Inputs and Outputs

– I/O Pin-keeper Circuits

•Advanced Flash Technology

– Reprogrammable

– 100% Tested

•High-reliability CMOS Process

– 20 Year Data Retention

– 100 Erase/Write Cycles

– 2,000V ESD Protection

– 200 mA Latchup Immunity

•Commercial and Industrial Temperature Ranges

•Dual-in-line and Surface Mount Packages in Standard Pinouts

•Inputs are 5V Tolerant

•Green Package Options (Pb/Halide-free/RoHS Compliant) Available

Description

The ATF16LV8C is a high-performance EECMOS programmable logic device that uti-

lizes Atmel’s proven electrically-erasable Flash memory technology. Speeds down to

10 ns and a 5 µA pin-controlled power-down mode option are offered. All speed

Pin Configurations

All Pinouts Top View

Pin Name Function

CLK Clock

I Logic Inputs

I/O Bi-directional Buffers

OE Output Enable

VCC (+3V to 5.5V) Supply

PD Programmable Power-

down Option

PLCC

PD/I3

I/O

GND

I9/OE

I/O

I/CLK

VCC

I/O

DIP/SOIC

I/CLK

PD/I3

GND

VCC

I/O

I9/OE

TSSOP

I/CLK

PD/I3

GND

VCC

I/O

I9/OE

(continued)

ATF16LV8C

ranges are specified over the full 3.0V to 5.25V range for

industrial and commercial temperature ranges.

The ATF16LV8C incorporates a superset of the generic

architectures, which allows direct replacement of the 16R8

family and most 20-pin combinatorial PLDs. Eight outputs

are each allocated eight product terms. Three different

modes of operation, configured automatically with soft-

ware, allow highly complex logic functions to be realized.

The ATF16LV8C can significantly reduce total system

power, thereby enhancing system reliability and reducing

power supply costs. When pin 4 is configured as the

power-down control pin, supply current drops to less than

5µA whenever the pin is high. If the power-down feature

isn't required for a particular application, pin 4 may be used

as a logic input. Also, the pin keeper circuits eliminate the

need for internal pull-up resistors along with their attendant

power consumption.

Block Diagram

Note: 1. Includes optional PD control pin.

Absolute Maximum Ratings*

Temperature Under Bias.................................. -40°C to +85°C *NOTICE: Stresses beyond those listed under “Absolute

Maximum Ratings” may cause permanent dam-

age to the device. This is a stress rating only and

functional operation of the device at these or any

other conditions beyond those indicated in the

operational sections of this specification is not

implied. Exposure to absolute maximum rating

conditions for extended periods may affect device

reliability.

Note: 1. Minimum voltage is -0.6V DC, which may under-

shoot to -2.0V for pulses of less than 20 ns.

Maximum output pin voltage is Vcc + 0.75V DC,

which may overshoot to 7.0V for pulses of less

than 20 ns.

Storage Temperature ..................................... -65°C to +150°C

Voltage on Any Pin with

Respect to Ground .........................................-2.0V to +7.0V(1)

Voltage on Input Pins

with Respect to Ground

During Programming.....................................-2.0V to +14.0V(1)

Programming Voltage with

Respect to Ground .......................................-2.0V to +14.0V(1)

DC and AC Operating Conditions

Commercial

Operating Temperature (Ambient) 0°C - 70°C

VCC Power Supply 3.0V to 5.5V

ATF16LV8C

Note: 1. All ICC parameters measured with outputs open.

2. For DC characteristics, the test condition of VCC = Max corresponds to 3.6V.

AC Waveforms(1)

Note: 1. Timing measurement reference is 1.5V. Input AC driving levels are 0.0V and 3.0V, unless otherwise specified.

DC Characteristics

Symbol Parameter Condition(2) Min Typ Max Units

IIL Input or I/O Low Leakage Current 0 ≤ VIN ≤ VIL(Max) -10 µA

IIH Input or I/O High Leakage Current 1.8 ≤ VIN ≤ VCC 10 µA

ICC1(1) Power Supply Current

15 MHz, VCC = Max,

VIN = 0, VCC,

Outputs Open

Com.

Ind.

60 mA

IPD(1) Power Supply Current, Power-down Mode VCC = Max,

VIN = 0, VCC

0.1 5 µA

IOS Output Short Circuit Current VOUT = 0.5V;

VCC= 3V; TA = 25°C -150 mA

VIL Input Low Voltage MIN < VCC < Max -0.5 0.8 V

VIH Input High Voltage 2.0 VCC + 1 V

VOL Output Low Voltage VCC = Min; All Outputs

IOL = 8 mA 0.5 V

VOH Output High Voltage VCC = Min

IOH = -4 mA 2.4 V

IOL Output Low Current VCC = Min 8 mA

IOH Output High Current VCC = Min -4 mA

ATF16LV8C

Notes: 1. Output data is latched and held.

2. High-Z outputs remain High-Z.

3. Clock and input transitions are ignored.

AC Characteristics

Symbol Parameter

-10 -15

UnitsMin Max Min Max

tPD Input or Feedback to Non-Registered Output 1 10 1 15 ns

tCF Clock to Feedback 5 8 ns

tCO Clock to Output 2 7 2 10 ns

tSInput or Feedback Setup Time 7 12 ns

tHInput Hold Time 0 0 ns

tPClock Period 12 16 ns

tWClock Width 6 8 ns

fMAX

External Feedback 1/(tS+ tCO) 71.4 45.5 MHz

Internal Feedback 1/(tS + tCF) 83.3 50 MHz

No Feedback 1/(tP) 83.3 62.5 MHz

tEA Input to Output Enable — Product Term 3 10 3 15 ns

tER Input to Output Disable — Product Term 2 10 2 15 ns

tPZX OE pin to Output Enable 2 8 2 15 ns

tPXZ OE pin to Output Disable 1.5 8 1.5 15 ns

Power-down AC Characteristics(1)(2)(3)

Symbol Parameter

-10 -15

UnitsMin Max Min Max

tIVDH Valid Input before PD High 10 15 ns

tGVDH Valid OE before PD High 0 0 ns

tCVDH Valid Clock before PD High 0 0 ns

tDHIX Input Don't Care after PD High 10 15 ns

tDHGX OE Don't Care after PD High 10 15 ns

tDHCX Clock Don't Care after PD High 10 15 ns

tDLIV PD Low to Valid Input 10 15 ns

tDLGV PD Low to Valid OE 25 30 ns

tDLCV PD Low to Valid Clock 25 30 ns

tDLOV PD Low to Valid Output 30 35 ns

ATF16LV8C

Input Test Waveforms and

Measurement Levels:

tR, tF < 1.5ns (10% to 90%)

Output Test Loads:

Commercial

Note: Similar devices are tested with slightly different loads.

These load differences may affect output signals’ delay

and slew rate. Atmel devices are tested with sufficient

margins to meet compatible devices.

Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.

Power-up Reset

The ATF16LV8C’s registers are designed to reset during

power-up. At a point delayed slightly from VCC crossing

VRST, all registers will be reset to the low state. As a result,

the registered output state will always be high on power-up.

This feature is critical for state machine initialization.

However, due to the asynchronous nature of reset and the

uncertainty of how VCC actually rises in the system, the

following conditions are required:

1. The VCC rise must be monotonic from below 0.7V.

2. The signals from which the clock is derived must

remain stable during TPR.

3. After TPR, all input and feedback setup times must

be met before driving the clock term high.

OUTPUT

3.3V

CL = 35 pF

R1 = 316

R2 = 348

Pin Capacitance

(f = 1 MHz, T = 25°C)(1)

Typ Max Units Conditions

CIN 58 pF V

IN = 0V

COUT 68 pF V

OUT = 0V

Parameter Description Typ Max Units

TPR

Power-up

Reset Time 600 1,000 ns

VRST

Power-up

Reset

Voltage

2.5 3.0 V

ATF16LV8C

37.0

37.5

38.0

38.5

39.0

39.5

40.0

10 20 30 40 50 60 70 80 90 100

SUPPLY CURRENT

VS. INPUT FREQUENCY

(VCC = 3.3V, TA = 25°C)

ICC mA

FREQUENCY (MHz)

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

-5° 25° 75°

NORMALIZED SUPPLY CURRENT

VS. AMBIENT TEMPERATURE

(VCC = 3.3V, STANDBY)

AMBIENT TEMPERATURE (C)

NORM

ICC mA

20.5

21.0

21.5

22.0

22.5

23.0

23.5

24.0

24.5

25.0

3.0 3.15 3.3 3.45 3.6

OUTPUT SINK CURRENT

VS. SUPPLY VOLTAGE (TA = 25°C, VOL = 0.45V)

IOL mA

SUPPLY VOLTAGE (V)

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5

IOL mA

OUTPUT VOLTAGE (V)

OUTPUT SINK CURRENT

VS. OUTPUT VOLTAGE (VCC = 5V, TA = 25°C)

3.0 3.3 3.6

1.6

1.4

1.2

1.0

0.8

0.6

NORMALIZED SUPPLY CURRENT

VS. SUPPLY VOLTAGE

(TA = 25°C, STANDBY)

SUPPLY VOLTAGE (V)

NORM

ICC mA

-16

-14

-12

-10

-8

-6

-4

-2

3.0 3.15 3.3 3.45 3.6

OUTPUT SOURCE CURRENT

VS. SUPPLY VOLTAGE (VOH = 2.4V, TA = 25°C)

IOH mA

SUPPLY VOLTAGE (V)

ATF16LV8C

-30

-25

-20

-15

-10

-5

0.5 1.0 1.5 2.0 2.5 3.0 3.

OUTPUT SOURCE CURRENT

VS. OUTPUT VOLTAGE (VCC = 5V, TA = 25°C)

IOH mA

OUTPUT VOLTAGE (V)

0.2

0.4

0.6

0.8

1.0

1.2

3.0 3.25 3.6

NORMALIZED tPD

VS. SUPPLY VOLTAGE (TA = 25°C)

SUPPLY VOLTAGE (V)

NORM

tPD

0.90

0.92

0.94

0.96

0.98

1.00

1.02

1.04

1.06

-5° 25° 75°

NORMALIZED tPD

VS. AMBIENT TEMPERATURE (VCC = 3.3V)

AMBIENT TEMPERATURE (C)

NORM

tPD

0.88

0.90

0.92

0.94

0.96

0.98

1.00

1.02

1.04

1.06

-5° 25° 75°

NORMALIZED tCO

VS. AMBIENT TEMPERATURE (VCC = 3.3V)

AMBIENT TEMPERATURE (C)

NORM

tCO

0.92

0.94

0.96

0.98

1.00

1.02

1.04

1.06

-5° 25°

75°

NORMALIZED tS

VS. AMBIENT TEMPERATURE (VCC = 3.3V)

AMBIENT TEMPERATURE (C)

NORM

0.2

0.4

0.6

0.8

1.0

1.2

-5° 25° 75°

NORMALIZED tH

VS. AMBIENT TEMPERATURE (VCC = 3.3V)

AMBIENT TEMPERATURE (C)

NORM

ATF16LV8C

0.2

0.4

0.6

0.8

1.0

1.2

3.0 3.25 3.6

NORMALIZED tCO

VS. SUPPLY VOLTAGE (TA = 25°C)

SUPPLY VOLTAGE (V)

NORM

tCO

0.2

0.4

0.6

0.8

1.0

1.2

3.0 3.25 3.6

NORMALIZED tS

VS. SUPPLY VOLTAGE (TA = 25°C)

NORM

SUPPLY VOLTAGE (V)

0.2

0.4

0.6

0.8

1.0

1.2

3.0 3.25 3.6

NORMALIZED tH

VS. SUPPLY VOLTAGE (TA = 25°C)

SUPPLY VOLTAGE (V)

NORM

-80

-70

-60

-50

-40

-30

-20

-10

0-0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0

INPUT CLAMP CURRENT

VS. INPUT VOLTAGE (TA = 25°C, VCC = 3.3V)

INPUT VOLTAGE (V)

INPUT

CURRENT

INPUT CURRENT

VS. INPUT VOLTAGE (TA = 25°C, VCC = 3.3V)

INPUT VOLTAGE (V)

INPUT

CURRENT

-20

-15

-10

-5

0 0.5 1.5 2.5 3.3

1.0 2.0 3.0

ATF16LV8C

Using “C” Product for Industrial

To use commercial product for industrial temperature ranges, simply de-rate ICC by 15% on the “C” device. No speed

de-rating is necessary.

Ordering Information

tPD

(ns)

tCO

(ns) Ordering Code Package Operation Range

10 7 7 ATF16LV8C-10JC

ATF16LV8C-10PC

ATF16LV8C-10SC

ATF16LV8C-10XC

20J

20P3

20S

20X

Commercial

(0°C to 70°C)

15 12 10 ATF16LV8C-15JC

ATF16LV8C-15PC

ATF16LV8C-15SC

ATF16LV8C-15XC

20J

20P3

20S

20X

Commercial

(0°C to 70°C)

10 7 7 ATF16LV8C-10JI

ATF16LV8C-10PI

ATF16LV8C-10SI

ATF16LV8C-10XI

20J

20P3

20S

20X

Industrial

(-40°C to 85°C)

15 12 10 ATF16LV8C-15JI

ATF16LV8C-15PI

ATF16LV8C-15SI

ATF16LV8C-15XI

20J

20P3

20S

20X

Industrial

(-40°C to 85°C)

Green Package Options (Pb/Halide-free/RoHS Compliant)

tPD

(ns)

tCO

(ns) Ordering Code Package Operation Range

10 7 7 ATF16LV8C-10JU

ATF16LV8C-10SU

ATF16LV8C-10XU

20J

20S

20X

Industrial

(-40°C to 85°C)

Package Type

20J 20-lead, Plastic J-leaded Chip Carrier (PLCC)

20P3 20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

20S 20-lead, 0.300" Wide, Plastic Gull-wing Small Outline (SOIC)

20X 20-lead, 4.4 mm Wide, Plastic Thin Shrink Small Outline (TSSOP)

ATF16LV8C

Packaging Information

20J – PLCC

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO. REV.

Notes: 1. This package conforms to JEDEC reference MS-018, Variation AA.

2. Dimensions D1 and E1 do not include mold protrusion.

Allowable protrusion is .010"(0.254 mm) per side. Dimension D1

and E1 include mold mismatch and are measured at the extreme

material condition at the upper or lower parting line.

3. Lead coplanarity is 0.004" (0.102 mm) maximum.

A 4.191 – 4.572

A1 2.286 – 3.048

A2 0.508 – –

D 9.779 – 10.033

D1 8.890 – 9.042 Note 2

E 9.779 – 10.033

E1 8.890 – 9.042 Note 2

D2/E2 7.366 – 8.382

B 0.660 – 0.813

B1 0.330 – 0.533

e 1.270 TYP

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

1.14(0.045) X 45˚ PIN NO. 1

IDENTIFIER

1.14(0.045) X 45˚

0.51(0.020)MAX

0.318(0.0125)

0.191(0.0075)

45˚ MAX (3X)

D2/E2

E1 E

20J, 20-lead, Plastic J-leaded Chip Carrier (PLCC) B

20J

10/04/01

ATF16LV8C

20P3 – PDIP

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual

Inline Package (PDIP) D

20P3

1/23/04

SEATING PLANE

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A – – 5.334

A1 0.381 – –

D 24.892 – 26.924 Note 2

E 7.620 – 8.255

E1 6.096 – 7.112 Note 2

B 0.356 – 0.559

B1 1.270 – 1.551

L 2.921 – 3.810

C 0.203 – 0.356

eB – – 10.922

eC 0.000 – 1.524

e 2.540 TYP

Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD.

2. Dimensions D and E1 do not include mold Flash or Protrusion.

Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").

ATF16LV8C

20S – SOIC

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

20S, 20-lead, 0.300" Body, Plastic Gull Wing Small Outline (SOIC) B

20S

10/23/03

7.60 (0.2992)

7.40 (0.2914)

0.51(0.020)

0.33(0.013)

10.65 (0.419)

10.00 (0.394)

PIN 1 ID

1.27 (0.050) BSC

13.00 (0.5118)

12.60 (0.4961)

0.30(0.0118)

0.10 (0.0040)

2.65 (0.1043)

2.35 (0.0926)

0º ~ 8º

1.27 (0.050)

0.40 (0.016)

0.32 (0.0125)

0.23 (0.0091)

PIN 1

Dimensions in Millimeters and (Inches).

Controlling dimension: Inches.

JEDEC Standard MS-013

ATF16LV8C

20X – TSSOP

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

20X, (Formerly 20T), 20-lead, 4.4 mm Body Width,

Plastic Thin Shrink Small Outline Package (TSSOP) C

20X

10/23/03

6.60 (.260)

6.40 (.252) 1.20 (0.047) MAX

0.65 (.0256) BSC

0.20 (0.008)

0.09 (0.004)

0.15 (0.006)

0.05 (0.002)

INDEX MARK

6.50 (0.256)

6.25 (0.246)

SEATING

PLANE

4.50 (0.177)

4.30 (0.169)

0.75 (0.030)

0.45 (0.018)

0º ~ 8º

0.30 (0.012)

0.19 (0.007)

Dimensions in Millimeters and (Inches).

Controlling dimension: Millimeters.

JEDEC Standard MO-153 AC

ATF16LV8C

Revision History

Revision Level – Revision Date History

H – June 2006 Added Green package options.

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