VOUT
VIN
CS
SS
OUT
FEEDBACK
WITH
ISOLATION
COMP GND
RT
VCC
LM5021
90 ~ 264 Vac
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LM5021
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LM5021 AC-DC Current-Mode PWM Controller
1 Features 3 Description
The LM5021 off-line pulse width modulation (PWM)
1 Ultra-low Startup Current (25 µA Maximum) controller contains all of the features needed to
Current Mode Control implement highly efficient off-line single-ended
Skip Cycle Mode for Low Standby Power flyback and forward power converters using current-
mode control. The LM5021 features include an ultra-
Single Resistor Programmable Oscillator low (25 µA) start-up current, which minimizes power
Synchronizable Oscillator losses in the high voltage start-up network. A skip
Adjustable Soft-Start cycle mode reduces power consumption with light
loads for energy conserving applications (ENERGY
Integrated 0.7-A Peak Gate Driver STAR®, CECP, and so forth). Additional features
Direct Opto-Coupler Interface include under-voltage lockout, cycle-by-cycle current
Maximum Duty Cycle Limiting (80% for LM5021-1 limit, hiccup mode overload protection, slope
or 50% for LM5021-2) compensation, soft-start and oscillator
Slope Compensation (LM5021-1 Only) synchronization capability. This high performance 8-
pin IC has total propagation delays less than 100 ns
Undervoltage Lockout (UVLO) with Hysteresis and a 1-MHz capable oscillator that is programmed
Cycle-by-Cycle Overcurrent Protection with a single resistor.
Hiccup Mode for Continuous Overload Protection Device Information(1)
Leading Edge Blanking of Current Sense Signal PART NUMBER PACKAGE BODY SIZE (NOM)
Packages: VSSOP-8 or PDIP-8 VSSOP (8) 3.00 mm × 3.00 mm
LM5021 PDIP (8) 9.81 mm × 6.35 mm
2 Applications
(1) For all available packages, see the orderable addendum at
DCM/CCM Flyback Converters the end of the datasheet.
Industrial Power Conversion
SMPS for Smart Meters and Audio Amplifiers
Building Automation and White Goods SMPS
Isolated Telecom Power Supplies
Simplified Application Diagram
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
www.ti.com
Table of Contents
7.3 Feature Description................................................. 11
1 Features.................................................................. 17.4 Device Functional Modes........................................ 16
2 Applications ........................................................... 18 Application and Implementation ........................ 17
3 Description............................................................. 18.1 Application Information............................................ 17
4 Revision History..................................................... 28.2 Typical Application ................................................. 19
5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 26
6 Specifications......................................................... 410 Layout................................................................... 26
6.1 Absolute Maximum Ratings ..................................... 410.1 Layout Guidelines ................................................. 26
6.2 ESD Ratings ............................................................ 410.2 Layout Example .................................................... 27
6.3 Recommended Operation Conditions....................... 411 Device and Documentation Support................. 28
6.4 Thermal Information.................................................. 411.1 Trademarks........................................................... 28
6.5 Electrical Characteristics........................................... 511.2 Electrostatic Discharge Caution............................ 28
6.6 Typical Performance Characteristics ........................ 711.3 Glossary................................................................ 28
7 Detailed Description.............................................. 912 Mechanical, Packaging, and Orderable
7.1 Overview................................................................... 9Information........................................................... 28
7.2 Functional Block Diagram....................................... 10
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2013) to Revision E Page
Added, updated, or revised the following sections: Pin Configuration and Functions;Specifications;Detailed
Description;Application and Implementation;Power Supply Recommendations;Layout;Device and Documentation
Support; and Mechanical, Packaging, and Orderable Information......................................................................................... 1
Changes from Revision C (March 2013) to Revision D Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 19
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Product Folder Links: LM5021
VIN
VCC
OUT
RT
CS
GND
SS
COMP 1
2
3
4
8
7
6
5
LM5021
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SNVS359E MAY 2005REVISED DECEMBER 2014
5 Pin Configuration and Functions
8-Pin VSSOPand PDIP
Packages DGK and P
(Top View)
Pin Functions
PIN I/O DESCRIPTION APPLICATION INFORMATION
NO. NAME
Control input for the Pulse Width Modulator COMP pull-up is provided by an internal 5K resistor which
1 COMP I and Hiccup comparators. may be used to bias an opto-coupler transistor.
Input to start-up regulator. The VIN pin is clamped at 36 V
2 VIN I Input voltage. by an internal zener diode.
VCC provides bias to controller and gate drive sections of
Output only of a linear bias supply
3 VCC O the LM5021. An external capacitor must be connected from
regulator. Nominally 8.5 V. this pin to ground.
High current output to the external MOSFET gate input with
4 OUT O MOSFET gate driver output. source/sink current capability of 0.3 A and 0.7 A
respectively.
5 GND Ground return. Current sense input for current mode control and over-
current protection. Current limiting is accomplished using a
dedicated current sense comparator. If the CS comparator
6 CS I Current Sense input. input exceeds 0.5 V the OUT pin switches low for cycle-by-
cycle current limit. CS is held low for 90ns after OUT
switches high to blank the leading edge current spike.
An external resistor connected from RT to GND sets the
Oscillator timing resistor pin and
7 RT / SYNC O oscillator frequency. This pin will also accept
synchronization input. synchronization pulses from an external clock.
An external capacitor and an internal 22 µA current source
8 SS O Soft-start / Hiccup time set the soft-start ramp. The soft -start capacitor controls
both the soft-start rate and the hiccup mode period.
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6 Specifications
6.1 Absolute Maximum Ratings (1)(2)
MIN MAX UNIT
VIN to GND –0.3 30 V
VIN Clamp Continuous Current 5 mA
CS to GND –0.3 1.25 V
RT to GND –0.3 5.5 V
All other pins to GND –0.3 7.0 V
Operating Junction Temperature 150
Storage temperature range, Tstg –65 150 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operation Conditions are
conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical
Characteristics .
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operation Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VIN Voltage (1) 8 30 V
Junction Temperature –40 125 °C
(1) After initial turn-on at VIN = 20 V.
6.4 Thermal Information LM5021
THERMAL METRIC(1) DGK P UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 163.3 53.5
RθJC(top) Junction-to-case (top) thermal resistance 56.7 42.9
RθJB Junction-to-board thermal resistance 83.2 30.6 °C/W
ψJT Junction-to-top characterization parameter 5.9 20.1
ψJB Junction-to-board characterization parameter 81.9 30.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
MIN and MAX limits apply –40°C TJ125°C. Unless otherwise specified: TJ= +25°C, VIN = 15 V, RT= 44.2 k.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STARTUP CIRCUIT
IST Start up current Before VCC Enable 18 25 µA
VVIN_EN VCC Regulator enable threshold 17 20 23 V
VVIN_DIS VCC Regulator disable threshold 7.25 V
VVIN_CMP VIN ESD clamp voltage I = 5 mA 30 36 40 V
IVIN Operating supply current COMP = 0 VDC 2.5 3.75 mA
VCC SUPPLY
VVCC_EN Controller enable threshold 6.5 7 7.5 V
VVCC_DIS Controller disable threshold 5.3 5.8 6.3 V
VVCC VCC regulated output No External Load 8 8.5 9 V
VVCC_DO VCC dropout voltage (VIN - VCC) I = 5 mA 1.7 V
IVCC_LIM VCC regulator current limit VCC = 7.5 V (2) 15 22 mA
SKIP CYCLE MODE COMPARATOR
VSKP Skip cycle mode enable threshold [COMP - 1.25 V] 75 125 175 mV
VSKP_HYS Skip cycle mode hysteresis 5 mV
CURRENT LIMIT
CS stepped from 0 to
0.6 V, time to OUT
tCS_DLY CS limit to OUT delay 35 ns
transition low,
Cload = 0
VCS_MAX CS limit threshold 0.45 0.5 0.55 V
tLEB Leading edge blanking time 90 ns
RCS_BNK CS blanking sinking impedance 35 55
SOFT-START
VSS_OCV SS pin open-circuit voltage 4.3 5.2 6.1 V
ISS Soft-start current source 15 22 30 µA
VSS_OFF Soft-start to COMP offset 0.35 0.55 0.75 V
RCOMP COMP sinking impedance During SS ramp 60
OSCILLATOR
FOSC Frequency1 (RT = 44.2K) 135 150 165 kHz
FOSC Frequency2 (RT = 13.3K) 440 500 560 kHz
VSYNC Sync threshold 2.4 3.2 3.8 V
PWM COMPARATOR
COMP set to 2 V
CS stepped 0 to 0.4
tPWM_DLY COMP to OUT delay V, time to OUT 20 ns
transition low,
Cload = 0
DMIN Min duty cycle COMP = 0 V 0%
DMAX Max duty cycle (-1 Device) 75% 80% 85%
DMAX Max duty cycle (-2 Device) 50%
KPWM COMP to PWM comparator gain 0.33
VCOMP_OC COMP open circuit voltage 4.2 5.1 6 V
VCOMP_MAXD COMP at max duty cycle 2.75 V
ICOMP COMP short circuit current COMP = 0 V 0.6 1.1 1.5 mA
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Device thermal limitations may limit usable range.
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Electrical Characteristics (continued)
MIN and MAX limits apply –40°C TJ125°C. Unless otherwise specified: TJ= +25°C, VIN = 15 V, RT= 44.2 k.(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SLOPE COMPENSATION
CS pin to PWM
Slope comp amplitude
VSLP Comparator offset at 70 90 110 mV
(LM5021-1 only) maximum duty cycle
OUTPUT SECTION
IOUT = 50 mA,
VOUTH OUT high saturation 0.6 1.1 V
VCC - OUT
VOUTL OUT low saturation IOUT = 100 mA 0.3 1 V
IO_SRC Peak source current OUT = VCC/2 0.3 A
IO_SNK Peak sink current OUT = VCC/2 0.7 A
trRise time Cload = 1nF 25 ns
tfFall time Cload = 1nF 10 ns
HICCUP MODE
VOVLD Over load detection threshold COMP pin VSS-OCV 0.8 VSS-OCV 0.6 VSS-OCV 0.4 V
VHIC Hiccup mode threshold SS pin VSS-OCV 0.8 VSS-OCV 0.6 VSS-OCV 0.4 V
VRST Hiccup mode Restart threshold SS pin 0.1 0.3 0.5 V
IDTCS Dead-time current source 0.1 0.25 0.4 µA
Overload detection timer current
IOVCS 6 10 14 µA
source
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1 10 100 1000
SOFTSTART CAPACITANCE (nF)
0.01
0.1
1
10
100
OFF TIME (s)
TEMPERATURE (oC)
OUT PEAK CURRENT (A)
-40 0 40 80 120
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Sinking
Sourcing
0 500 1000 1500 2000
OUT DRIVER LOAD (pF)
VIN CURRENT (mA)
2
3
4
5
6
FS = 160 kHz
FS = 80 kHz
FS = 40 kHz
15 16 17 18 19 20 21
VIN VOLTAGE (V)
0
2
4
6
8
10
12
14
16
VIN CURRENT (PA)
VIN Falling
VIN Rising
010 20 30
VIN (V)
VIN CURRENT (mA)
0
1
2
3
LM5021
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SNVS359E MAY 2005REVISED DECEMBER 2014
6.6 Typical Performance Characteristics
Unless otherwise specified: TJ= 25°C.
Figure 1. VIN Start-Up Current Figure 2. VIN UVLO
Figure 3. VIN Current vs OUT Load Figure 4. VIN Voltage Falling vs VCC Voltage
Figure 5. OUT Driver Current vs Temperature Figure 6. Hiccup Mode Deadtime vs Softstart Capacitance
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RT (kQ)
OUT SWITCHING FREQUENCY (kHz)
1 10 100 1000
10
100
1000
LM5021-1
LM5021-2
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
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Typical Performance Characteristics (continued)
Unless otherwise specified: TJ= 25°C.
Figure 7. Output Switching Frequency vs RT
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7 Detailed Description
7.1 Overview
The LM5021 is a single ended current mode controller primarily intended for use in offline forward or flyback
converters. It is also useful for boost converters. Low startup current and a wide UVLO hysteresis make low
dissipation startup circuits simple to implement. An on board 7-V regulator supplies stable power for device
operation and can supply external circuitry. A soft start function minimizes stresses during startup and allows the
converter to come to steady state operating conditions gradually.
The device comes in two versions with different maximum duty cycles. The LM5021-1 has a maximum duty cycle
of 80% while the LM5021-2 has a maximum duty cycle of 50%. For current mode control applications where the
duty cycle can exceed 50%, slope compensation is implemented by simply adding a resistor between the
LM5021-1 CS pin and the current sense filter capacitor.
Cycle-by-cycle overcurrent sensing provides robust protection. A 500-mV maximum current sense threshold
minimizes power dissipation in supplies that sense the main switch current directly with a resistor. For a
sustained overcurrent condition, the controller will enter a hiccup mode to reduce component stresses. The
controller automatically restarts when the overload condition is removed.
The switching frequency is programmable using a single resistor connected from the RT pin to GND. For
applications that require it, the switching frequency can be synchronized to an external clock source by
capacitively coupling a pulse train into the RT pin.
Skip cycle operation is implemented to reduce input power and increase efficiency at light load conditions. For
applications where this is not desirable, skip cycle operation may be disabled by adding an offset voltage to the
CS pin.
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Product Folder Links: LM5021
CS
SS
VIN
GND
VCC
8.5V LINEAR
REGULATOR
OSC
OUT
SLOPE COMPENSATION RAMP GENERATOR
DRIVER
PWM
COMPARATOR
5.2V
CLK
22 PA
10 PA
0.25 PA
COMP
SKIP CYCLE
COMPARATOR
MAX DUTY LIMIT
LM5021 - 1 (80%)
LM5021 - 2 (50%)
(LM5021 - 1 ONLY)
+
-
+
-
1.8k
5k
2R
R
125 mV
CURRENT LIMIT
COMPARATOR
36V
CLAMP
RT/ SYNC
50 PA
0 PA
VIN UVLO
20V RISING
7.25V FALLING EN
VCC_UVLO
QS
R
+
-PWM
LOGIC
+
-SS
5.2V
1.25V
550 mV
VCC_UVLO
VCC_UVLO
DIS
SOFTSTART
AND
HICCUP
MODE
LOGIC
COMP
VCC_UVLO
VCC UVLO
7V RISING
5.8V FALLING
1
500 mV
CLK
Leading Edge Blanking
7
23
4
8
5
6
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
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7.2 Functional Block Diagram
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RT = 6.63 x 109
2 x FSW
RT = 6.63 x 109
FSW
LM5021
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7.3 Feature Description
7.3.1 PWM Comparator and Slope Compensation
The PWM comparator compares the current sense signal with the loop error voltage from the COMP pin. The
COMP pin voltage is reduced by 1.25 V then attenuated by a 3:1 resistor divider. The PWM comparator input
offset voltage is designed such that less than 1.25 V at the COMP pin will result in a zero duty cycle at the
controller output.
For duty cycles greater than 50 percent, current mode control circuits are subject to sub-harmonic oscillation. By
adding an additional fixed slope voltage ramp signal (slope compensation) to the current sense signal, this
oscillation can be avoided. The LM5021-1 integrates this slope compensation by summing a ramp signal
generated by the oscillator with the current sense signal. The slope compensation is generated by a current ramp
driven through an internal 1.8 kresistor connected to the CS pin. Additional slope compensation may be added
by increasing the resistance between the current sense filter capacitor and the CS pin, thereby increasing the
voltage ramp created by the oscillator current ramp. Since the LM5021-2 is not capable of duty cycles greater
than 50%, there is no slope compensation feature in this device.
7.3.2 Current Limit and Current Sense
The LM5021 provides a cycle-by-cycle over current protection feature. Current limit is triggered by an internal
current sense comparator threshold which is set at 500 mV. If the CS pin voltage plus the slope compensation
voltage exceeds 500 mV, the OUT pin output pulse will be immediately terminated.
An RC filter, located near the LM5021, is recommended for the CS pin to attenuate the noise coupled from the
power FET's gate to source. The CS pin capacitance is discharged at the end of each PWM clock cycle by an
internal switch. The discharge switch remains on for an additional 90ns leading edge blanking interval to
attenuate the current sense transient that occurs when the external power FET is turned on. In addition to
providing leading edge blanking, this circuit also improves dynamic performance by discharging the current
sense filter capacitor at the conclusion of every cycle.
The LM5021 CS comparator is very fast, and may respond to short duration noise pulses. Layout considerations
are critical for the current sense filter and sense resistor. The capacitor associated with the CS filter must be
placed very close to the device and connected directly to the pins of the IC (CS and GND). If a current sense
transformer is used, both leads of the transformer secondary should be routed to the sense resistor, which
should also be located close to the IC. If a current sense resistor located in the power FET's source is used for
current sense, a low inductance resistor is required. In this case, all of the noise sensitive low current grounds
should be connected in common near the IC and then a single connection should be made to the power ground
(sense resistor ground point).
7.3.3 Oscillator, Shutdown and Sync Capability
A single external resistor connected between RT and GND pins sets the LM5021 oscillator frequency. The
LM5021-2 device, with 50% maximum duty cycle, includes an internal flip-flop that divides the oscillator
frequency by two. This method produces a precise 50% maximum duty cycle limit. Because of this frequency
divider, the oscillator frequency of the LM5021-2 is actually twice the frequency of the gate drive output (OUT).
For the LM5021-1 device, the oscillator frequency and the operational output frequency are the same. To set a
desired output switching frequency (Fsw), the RT resistor can be calculated from:
LM5021-1:
(1)
LM5021-2:
(2)
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Toff = CSS x (VHC - VRST)
IDTCS = CSS x (4.6V - 0.3V)
0.25 PA
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
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Feature Description (continued)
The LM5021 can also be synchronized to an external clock. The external clock must have a higher frequency
than the free running oscillator frequency set by the RT resistor. The clock signal should be capacitively coupled
into the RT pin with a 100pF capacitor. A peak voltage level greater than 3.8 V at the RT pin is required for
detection of the sync pulse. The dc voltage across the RT resistor is internally regulated at 2 V. Therefore, the ac
pulse superimposed on the RT resistor must have 1.8-V or greater amplitude to successfully synchronize the
oscillator. The sync pulse width should be set between 15 ns to 150 ns by the external components. The RT
resistor is always required, whether the oscillator is free-running or externally synchronized. The RT resistor
should be located very close to the device and connected directly to the pins of the LM5021 (RT and GND).
7.3.4 Gate Driver and Max Duty Cycle Limit
The LM5021 provides a gate driver (OUT), which can source peak current of 0.3A and sink 0.7A. The LM5021 is
available in two duty-cycle limit options. The maximum output duty-cycle is typically 80% for the LM5021-1
option, and precisely equal to 50% for the LM5021-2 option. The maximum duty cycle function for the LM5021-2
is accomplished with an internal toggle flip-flop to ensure an accurate duty cycle limit. The internal oscillator
frequency of the LM5021-2 is therefore twice the switching frequency of the PWM controller (OUT pin).
The 80% maximum duty-cycle function for the LM5021-1 is determined by the internal oscillator. For the
LM5021-1 the internal oscillator frequency and the switching frequency of the PWM controller are the same.
7.3.5 Soft-Start
The soft-start feature allows the power converter to gradually reach the initial steady state operating point, thus
reducing start-up stresses and current surges. An internal 22 µA current source charges an external capacitor
connected to the SS pin. The capacitor voltage will ramp up slowly, limiting the COMP pin voltage and the duty
cycle of the output pulses. The soft-start capacitor is also used to generate the hiccup mode delay time when the
output of the switching power supply is continuously overloaded.
7.3.6 Hiccup Mode Overload Current Limiting
Hiccup mode is a method of protecting the power supply from over-heating and damage during an extended
overload condition. When the output fault is removed the power supply will automatically restart.
Figure 8,Figure 9, and Figure 10 illustrate the equivalent circuit of the hiccup mode for LM5021 and the relevant
waveforms. During start-up and in normal operation, the external soft-start capacitor Css is pulled up by a current
source that delivers 22 µA to the SS pin capacitor. In normal operation, the soft-start capacitor continues to
charge and eventually reaches the saturation voltage of the current source (VSS_OCV, nominally 5.2 V). During
start-up the COMP pin voltage follows the SS capacitor voltage and gradually increases the peak current
delivered by the power supply. When the output of the switching power supply reaches the desired voltage, the
voltage feedback amplifier takes control of the COMP signal (via the opto-coupler). In normal operation the
COMP level is held at an intermediate voltage between 1.25 V and 2.75 V controlled by the voltage regulation
loop. When the COMP pin voltage is below 1.25 V, the duty-cycle is zero. When the COMP level is above 2.75
V, the duty cycle will be limited by the 0.5-V threshold of cycle-by-cycle current limit comparator.
If the output of the power supply is overloaded, the voltage regulation loop demands more current by increasing
the COMP pin control voltage. When the COMP pin exceeds the over voltage detection threshold (VOVLD,
nominally 4.6 V), the SS capacitor Css will be discharged by a 10 µA overload detection timer current source,
IOVCS. If COMP remains above VOVLD long enough for the SS capacitor to discharge to the Hiccup mode
threshold (VHIC, nominally 4.6 V), the controller enters the hiccup mode. The OUT pin is then latched low and the
SS capacitor discharge current source is reduced from 10 µA to 0.25 µA, the dead-time current source, IDTCS.
The SS pin voltage is slowly reduced until it reaches the Restart threshold (VRST, nominally 0.3 V). Then a new
start-up sequence commences with 22 µA current source charging the capacitor CSS. The slow discharge of the
SS capacitor from the Hiccup threshold to the Restart threshold provides an extended off time that reduces the
overheating of components including diodes and MOSFETs due to the continuous overload. The off time during
the hiccup mode can be calculated from the following equation:
(3)
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Product Folder Links: LM5021
SS
OUT
5.2V
QS
+
-
550 mV
0.25 PA
EN
DRIVER
PWM
22 PA
EN
5.2V
RESTART
COMPARATOR
-
+
0.3V
10 PA
EN
4.6V
OVERLOAD
DETECTION
-
+
R
HICCUP MODE
COMPARATOR
+
-
4.6V
COMP
Toverload = CSS x (VSS_OCV - VHC)
IOVCS = CSS x 0.6V
10 PA
LM5021
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SNVS359E MAY 2005REVISED DECEMBER 2014
Feature Description (continued)
Example:
Toff = 808 ms, assuming the CSS capacitor value is 0.047 µF
Short duration intermittent overloads will not trigger the hiccup mode. The overload duration required to trigger
the hiccup response is set by the capacitor CSS, the 10 µA discharge current source and voltage difference
between the saturation level of the SS pin and the Hiccup mode threshold. Figure 10 shows the waveform of SS
pin with a short duration overload condition. The overload time required to enter the hiccup mode can be
calculated from the following equation:
(4)
Example:
Toverload = 2.82 ms, assuming the CSS capacitor value is 0.047 µF
Figure 8. Hiccup Mode Control
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Product Folder Links: LM5021
SS
COMP
+22 PA
5.2V
4.6V -10 PA
during over
load
+22 PA
after releasing the over load
SS
COMP
Soft-Start Normal
operation Overload
Detection SMPS latched
OFF Soft-Start
+22 PA
-10 PA
-0.25 PA+22 PA
5.2V
4.6V
0.3V
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
www.ti.com
Feature Description (continued)
Figure 9. Waveform at SS and COMP Pin due to Continuous Overload
Figure 10. Waveform at SS and COMP Pin due to Brief Overload
7.3.7 Skip Cycle Operation
During light load conditions, the efficiency of the switching power supply typically drops as the losses associated
with switching and operating bias currents of the converter become a significant percentage of the power
delivered to the load. The largest component of the power loss is the switching loss associated with the gate
driver and external MOSFET gate charge. Each PWM cycle consumes a finite amout of energy as the MOSFET
is turned on and then turned off. These switching losses are proportional to the frequency of operation. The Skip
Cycle function integrated within the LM5021 controller reduces the average switching frequency to reduce
switching losses and improve efficiency during light load conditions.
When a light load condition occurs, the COMP pin voltage is reduced by the voltage feedback loop to reduce the
peak current delivered by the controller. Referring to Figure 11, the PWM comparator input tracks the COMP pin
voltage through a 1.25 V level shift circuit and a 3:1 resistor divider. As the COMP pin voltage falls, the input to
the PWM comparator falls proportionately. When the PWM comparator input falls to 125 mV, the Skip Cycle
comparator detects the light load condition and disables output pulses from the controller. The controller
continues to skip switching cycles until the power supply output falls and the COMP pin voltage increases to
demand more output current. The number of cycles skipped will depend on the load and the response time of the
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Product Folder Links: LM5021
LM5021
VIN
CS
OUT
Voffset > 125 mV
RSense
VCC
PWM
LOGIC
PWM
COMPARATOR
5.2V
COMP
SKIP CYCLE
COMPARATOR
+
-
+
-
1.25V
5k 2R
R
125 mV
+
-
1.8k
CLK
500 mV
CURRENT LIMIT
COMPARATOR
CS
LEADING EDGE
BLANKING
LM5021
www.ti.com
SNVS359E MAY 2005REVISED DECEMBER 2014
Feature Description (continued)
frequency compensation network. Eventually the COMP voltage will increase when the voltage loop requires
more current to sustain the regulated output voltage. When the PWM comparator input exceeds 130 mV (5 mV
hysteresis), normal fixed frequency switching resumes. Typical power supply designs will produce a short burst
of output pulses followed by a long skip cycle interval. The average switching frequency in the Skip Cycle mode
can be a small fraction of the normal operating frequency of the power supply.
The skip cycle mode of operation can be disabled by adding an offset voltage to the CS pin (refer to Figure 12).
A resistive divider connected to a regulated source, injecting a 125 mV offset (minimum) on the CS pin, will force
the voltage at the PWM Comparator to be greater than 125 mV, disabling the Skip Cycle Comparator.
Figure 11. Skip Cycle Control
Figure 12. Disabling the Skip Cycle Mode
Copyright © 2005–2014, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LM5021
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
www.ti.com
7.4 Device Functional Modes
7.4.1 Operation With VIN Below 20 V
When a converter is first powered up, there is typically no voltage present on the VIN pin of the controller and the
controller is in a low current startup mode. In this mode, there is no activity at the OUT pin and the device is
internally in a shutdown mode that consumes minimal current, typically 18 µA. The startup circuit must be
capable of supplying the maximum startup current of 25 µA, plus additional current to charge the VIN capacitor to
20 V in any required startup time, at the minimum desired startup voltage for the converter. Once the VIN voltage
reaches the startup voltage of 20 V, normal operation in soft start commences. The converter will continue to
operate until the VIN voltage falls below the turn off threshold of 7.25 V
7.4.2 Operation in Soft Start
Soft-start mode occurs after the VIN pin reaches the startup voltage after being below 7.25 V or after a hiccup
overcurrent cycle. In this mode the reference voltage applied to the PWM comparator from the COMP pin is
clamped and allowed to rise at a rate determined by the charging of a capacitor connected to the SS pin. This
ramped voltage controls the amount of peak current in the power stage and allows it to increase slowly to reduce
stresses on system components. When the clamp level exceeds the level required by the voltage applied to the
COMP pin externally, the external feedback circuitry supplying the voltage on COMP assumes control pf the
power stage peak current.
7.4.3 Operation Under Normal Conditions
Once the converter has completed soft start, it operates at either a fixed switching frequency with the output
pulse width determined by the voltage applied to the COMP pin and the ramp applied to the CS pin, or in a skip
cycle mode when the converter load is light. For the normal fixed frequency mode of operation the output is set
high when the oscillator starts a new clock cycle (or every other clock cycle in the LM5021-2). The CS pin is
connected to the current sensing network for the converter and the voltage on that pin is compared to one-third
of the voltage applied to the COMP pin less 1.25 V (see the Functional Block Diagram section) from the external
error amplifier and compensation circuit. The CS pin signal should be a linearly increasing ramp proportional to
the current in the power stage of the converter. The output pulse terminates when the voltage at the CS pin
exceeds one-third of the voltage on COMP less 1.25 V.
7.4.4 Operation in Skip Cycle
During periods of minimal output power demand, the controller will operate in a skip cycle mode to reduce power
consumption and increase efficiency at lighter loads. Skip cycle mode is entered when in normal operation the
voltage on COMP is reduced by the external error amplifier to the point that the voltage on the PWM comparator
falls below 125 mV. This will typically be about 1.625 V or lower at the COMP pin. When this mode is entered,
the controller inhibits pulses on the output until the error amplifier and compensation circuit requires
approximately 130 mV at the input of the PWM comparator. This is approximately 1.64 V at the COMP pin. The
number and frequency of pulses in the skip cycle mode is dependent on the load and response time of the
external error amplifier and compensation circuit. Skip cycle operation may be disabled by adding a 125-mV DC
offset to the CS pin.
7.4.5 Operation at Overload
If the load on the converter increases beyond design limitations, the converter can fail due to component over
stress. The LM5021 uses a fixed maximum CS pin voltage of 500 mV to limit the amount of current in the
converter power stage. The output pulse will terminate when the CS pin voltage exceeds this threshold
regardless of the current command voltage applied to the COMP pin. For short time duration overload events,
the converter will operate normally with typically a small transient drop in output voltage that is corrected by the
error amplifier when the overload is removed. If the overload is longer in duration, the error amplifier will apply
higher and higher voltage to the COMP pin as the output voltage sags. If the COMP pin voltage exceeds the
overload threshold of 4.6 V, the converter will enter hiccup mode.
7.4.6 Operation in Hiccup Mode
If during an overload, the COMP pin voltage rises above 4.6 V, hiccup mode operation is started. In this mode,
the OUT pin is held low and the soft start capacitor is discharged using a 10-µA current source. When the soft
start capacitor discharges to 0.3 V, a new startup sequence begins with the controller in the soft start mode.
16 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated
Product Folder Links: LM5021
UPPER
LOWER
INTERNAL
BIAS
GENERATOR
VCC
UVLO
S
R
Q
+
HV
VIN VCC
REGULATOR VCC
Rstart
CVIN VIN
UVLO
CVCC
Enable Driver
TRANSFORMER
BIAS
WINDING
LM5021
www.ti.com
SNVS359E MAY 2005REVISED DECEMBER 2014
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Startup Circuit
Referring to Figure 13, the input capacitor CVIN is trickle charged through the start-up resistor Rstart, when the
rectified ac input voltage HV is applied. The VIN current consumed by the LM5021 is only 18 µA (nominal) while
the capacitor CVIN is initially charged to the start-up threshold. When the input voltage, VIN reaches the upper
VIN UVLO threshold of 20 V, the internal VCC linear regulator is enabled. The VCC regulator will remain on until
VIN falls to the lower UVLO threshold of 7.25 V (12.5 V hysteresis). When the VCC regulator is turned on, the
external capacitor at the VCC pin begins to charge. The PWM controller, soft-start circuit and gate driver are
enabled when the VCC voltage reaches the VCC UVLO upper threshold of 7 V. The VCC UVLO has 1.2 V
hysteresis between the upper and lower thresholds to avoid chattering during transients on the VCC pin. When
the VCC UVLO enables the switching power supply, energy is transferred from the primary to the secondary
transformer winding(s). A bias winding, shown in Figure 13, delivers power to the VIN pin to sustain the VCC
regulator. The voltage supplied should be from 11 V (VCC regulated voltage maximum plus VCC regulator
dropout voltage) to 30 V (maximum operating VIN voltage). The bias winding should always be connected to the
VIN pin as shown in Figure 13. Do not connect the bias winding to the VCC pin. The start-up sequence is
completed and normal operation begins when the voltage from the bias winding is sufficient to maintain VCC
level greater than the VCC UVLO threshold (5.8 V typical).
The LM5021 is designed for ultra-low start-up current into the VIN pin. To achieve this very low start-up current,
the VCC regulator of the LM5021 is unique as compared to the VCC regulator used in other controllers of the
LM5xxx family. The LM5021 is designed specifically for applications with the bias winding connected to the VIN
pin as shown in Figure 13.
NOTE
It is not recommended that the bias winding be connected to the VCC pin of the LM5021.
Doing so can cause the device to operate incorrectly or not at all.
The size of the start-up resistor Rstart not only affects power supply start-up time, but also power supply
efficiency since the resistor dissipates power in normal operation. The ultra low start-up current of the LM5021
allows a large value Rstart resistor (up to 3 M) for improved efficiency with reasonable start-up time.
Figure 13. Start-Up Circuit Block Diagram
Copyright © 2005–2014, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LM5021
TVIN_THRESHOLD = RSTART x CVIN x ln 1 - HV
20V -1
Tmax = CVIN x (19.15V - 8.5V)
6.25 mA
= 17 ms
8.5V x CVCC
VIN = 20V - CVIN
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
www.ti.com
Application Information (continued)
8.1.2 Relationship Between Input Capacitor CIN and VCC Capacitor CVCC
The internal VCC linear regulator is enabled when VIN reaches 20 V. The drop in VIN due to charge transfer
from CVIN to CVCC after the regulator is enabled can be calculated from the following equations where VIN' is the
voltage on CVIN immediately after the VCC regulator charges CVCC.
ΔVIN x CVIN =ΔVCC x CVCC (5)
(20 V VIN') CVIN = 8.5V CVCC (6)
(7)
Assuming CVIN value as 10 µF, and CVCC of 1µF, then the drop in VIN will be 0.85 V, or the VIN value drops to
19.15 V. The value of the VCC capacitor can be small (less than 1 uF) as it supplies only transient gate drive
current of a short duration. The CVIN capacitor must be sized to supply the gate drive current and the quiescent
current of LM5021, until the transformer bias winding delivers sufficient voltage to VIN to sustain the VCC
voltage.
The CVIN capacitor value can be calculated from the operating VCC load current after its output voltage reaches
the VCC UVLO threshold. For example, if the LM5021 is driving an external MOSFET with total gate charge (Qg)
of 25nC, the average gate drive current is Qg x Fsw, where Fsw is the switching frequency. Assuming a
switching frequency of 150KHz, the average gate drive current is 3.75 mA. Since the IC consumes approximately
2.5 mA operating current in addition to the gate current, the total current drawn from CVIN capacitor is the
operating current plus the gate charge current, or 6.25 mA. The CVIN capacitor must supply this current for a brief
time until the transformer bias winding takes over. The CVIN voltage must not fall below 8.5 V during the start-up
sequence or the cycle will be restarted. The maximum allowable start-up time can be calculated using the value
of CVIN, the change in voltage allow at VIN (19.15 V 8.5 V) and the VCC regulator current (6.25 mA). Tmax, the
maximum time allowed to energize the bias winding is:
(8)
If the calculated value of Tmax is too small, the value of Cin should be increased further to allow more time
before the transformer bias winding takes over and delivers the operating current to the VCC regulator.
Increasing CVIN will increase the time from the application of the rectified ac (HV in Figure 13) to the time when
VIN reaches the 20 V start threshold. The initial charging time of CVIN is:
(9)
18 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated
Product Folder Links: LM5021
NOTES:
1)
85Vac-130Vac Input
24V/1.45A 2%
GND
1
Do not populate
4kV Isolation barier
180Vac for 35ms
Isat > 2.4A
1
Program
R19 for development purpose only
Program pin 0V -> Vout=24V
Program pin open -> Vout=8V
TP8 -> 8V
1
1
Fsw = 145kHz
TP1
R12
22k
TP6
J2
R19
49.9
L2
1uH
R8
2
R16
4.7
C8
100n
Q4
STP11NK40ZFP
TP11
TP10
D4
20CTQ150
R6
100
+
C13
22u
50V
D9
BZX585-C15
Q3
MMBT2222A
1
HS1
TP7
TP4
TP2
C9
6.8u
R24
43.2k
R26
4.7k
R32
221k
C24
1n
C23
100p
C3
470n
L1
10mH
1
24
5
U4
CNY17F-3M
J1
R3
S10K175E2K1
C1
2200p
+C4
82u
350V
C12
1u
R23
0.2
TP12
TP5
TP9
C18
1n
500V
D1
US1G
C5 100p
C2
2200p
1
COMP
2
VIN
3
VCC
4
OUT
5GND
6CS
7RT
8SS
U1
LM5021-2
C14
220n
R21
tbd
C15
150pF C17
1uF
C21
R17
22.1k
R2
10k
Q1
BSS127
R1
1.5M
R5
1.5M
D5
BZX585-C27
C6
10n
Q5
BSS138
R30
21k
TP8
R31
100
C25
1n
D8
TS4148 RZ
D7
BZX585-C10
Q2
MMBT2222A
R10
47k
R28
6.34k
3
4
1
2
5
U3
OPA170AIDBV
R20
100
C19
100n
R14
13k
C16
100n
R25
69.8k
R27
100k
R15
100k
C20
1u
TP13
D10
TLV431BDBZ
R4
2.5
+C7
220u
TP3
R7
10
R22
100
3
1
2
4
D3
DF06S
4
3
2
1
6
7
12
15
11
14
T1
85 uH
+C10
220u
D6
ES1D
R33
76.8k
R34
24.3k
C11
220p
R9
100k
1
1
1
1
1
1
1
1
11
1
1
1
1
1
1
1
1
VIN
+8V
+8V
U_BULK
5.1V
5.1V
PROGRAM
24V
U_BULK
LM5021
www.ti.com
SNVS359E MAY 2005REVISED DECEMBER 2014
8.2 Typical Application
Figure 14. Typical Application Circuit
Copyright © 2005–2014, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LM5021
BULK(max)
D4 OUT
ps
V184 V
V V 24 V 112 V
n 2.083
= + = + =
PS
50
n 2.083
24
= =
BULK(min)
IN
IN(min)
4
LINE
2 2
IN(min) BULK(min)
1 V
2P 0.25 arcsin( )
2 V
C(2V V ) f
é ù
´ + ´
ê ú
p´
ë û
=- ´
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
www.ti.com
8.2.1 Design Requirements
DESIGN PARAMETER VALUE
Input voltage range 85 Vac - 130 Vac
Output voltage 24 Vdc or 8 Vdc (programmable)
Output current 1.45 Adc at 24 Vdc
Switching frequency 145 kHz
Maximum duty cycle 50%
Isolation level 4 kV
Footprint 68 mm × 34 mm
8.2.2 Detailed Design Procedure
8.2.2.1 Primary Bulk Capacitance
The primary side bulk cap, C4, is selected based on the power level and the desired minimum bulk voltage level.
The bulk capacitor value can be calculated as:
where
PIN is the maximum input power. Input power is the maximum output power divided target efficiency.
VIN(min) is the minimum AC input voltage RMS value.
VBULK(min) is the target minimum bulk voltage.
fLINE is the line frequency. (10)
Based on the equation, to achieve 70-V minimum bulk voltage, the bulk capacitor should be larger than 72 µF
and 82 µF was chosen in the design.
8.2.2.2 Transformer
The transformer design starts with selecting a suitable switching frequency. Generally, the switching frequency
selection is based on the tradeoff between the converter size and efficiency. Higher switching frequency results
in smaller transformer size, but the switching losses will increase, potentially impacting efficiency. Sometimes,
the switching frequency is selected to avoid certain frequencies or harmonics that could interfere with those used
for communication. The frequency selection is beyond the scope of this datasheet.
EMI regulations place limits on EMI noise at 150 kHz and higher. For this design, 145 kHz is selected for the
switching frequency to minimize transformer size while keeping the switching frequency below the EMI regulation
band.
The transformer turns ratio can be selected based on the desired MOSFET voltage rating and diode voltage
rating. Since the maximum input voltage is 130 V AC, the peak bulk voltage can be calculated as:
VBULK(max) =2× VIN(max) = 184 V (11)
To take advantage of the low Rdson of lower voltage MOSFETs, a target device rating of 400 V is selected.
Considering the design margin and extra voltage ringing on the MOSFET drain, the reflected output voltage
should be less than 50 V. The transformer primary to secondary (nPS) turns ratio can be selected as:
(12)
The output rectifier diode (D4) voltage stress is also affected by the turns ratio. The stress applied to the diode is
the output voltage plus the reflected input voltage. The voltage stress on the diode can be calculated as:
(13)
20 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated
Product Folder Links: LM5021
PS OUT
OUT
BULK(min) PS OUT
OUT
OUT SW
n V
IV n V
C 180 F
0.1% V f
´+
³ = m
´ ´
PS OUT
BULK(min) PS OUT
n V
DV n V
=
+
BULK(min) PK _ Q4 BULK(min)
Q4 _ RMS
m SW m SW
22
3 2
PK _ Q4
1 V D I V
I D D I
3 L f L f
æ ö
= ´ - + ´
ç ÷
´ ´
è ø
PS OUT
BULK(min) BULK(min) PS OUT
PK _ Q4 n V
PS OUT m SW
BULK(min) V n V
BULK(min) PS OUT
n V
PIN 1 V V n V
I2 L f
V´
+
+
= + ´
AS
12V
n 1.5
8V
= =
PS OUT
BULK(min) PS OUT
m
IN SW
2
BULK(min)
n V
V
1V n V
L2 50% P f
æ ö
´ç ÷
+
è ø
=´ ´
2
LM5021
www.ti.com
SNVS359E MAY 2005REVISED DECEMBER 2014
Considering the ringing voltage spikes always present in a switching power supply and allowing for voltage
derating (normally 80% derating is used), the diode voltage rating should be higher than 150 V.
The transformer inductance selection is based on the requirement for this converter to remain in discontinuous
conduction (DCM). Selecting a larger inductance would allow the converter operate in continuous conduction
(CCM). CCM operation tends to increase the transformer size. The primary inductance (Lm) can be calculated as:
(14)
In this equation, fsw is the 145-kHz switching frequency. Therefore, the transformer inductance should be
selected as 85 µH.
The auxiliary winding provides the power for LM5021 during normal operation. The auxiliary winding voltage is
the output voltage reflected to the primary side. A higher reflected voltage allows the IC to quickly get energy
from the transformer during startup and makes starting a heavy or highly capacitive load easier. However, a high
auxiliary reflected voltage makes the IC consume more power, reducing efficiency and increasing standby power
consumption. Therefore, a tradeoff is required. In this design, the auxiliary winding voltage is selected to ensure
that there is enough voltage available to ensure the controller will operate when the output voltage is
programmed to the lower 8-V setting. Therefore, the auxiliary winding to the output winding turns ratio is selected
as:
(15)
8.2.2.3 Main Switch FET and Output Rectifier
Based on calculated inductor value and the switching frequency, the current stress of the MOSFET (Q4) and
diode (D4) can be calculated.
The peak current of Q4 can be calculated as:
(16)
The peak current is 2.55 A.
The peak current in D4 is the peak current in Q4 reflected to the secondary side:
ID4 = NPS × IQ4 = 5.3 A (17)
The RMS current in Q4 can be calculated as:
(18)
Here D is the Q4 on time duty cycle at minimum bulk voltage and it can be calculated as:
(19)
The RMS current in Q4 is 0.97 A. Therefore, STP11NK40ZFP is selected.
The average current in D4 is the output current 1.45 A. With a 150-V reverse voltage rating and a 20-A average
current rating, 20CTQ150 is selected.
The output capacitor is selected based on the output voltage ripple requirement. In this design, 0.1% voltage
ripple is assumed. Based on the 0.1% ripple requirement, the capacitor value can be selected based on:
(20)
Considering the tolerance and temperature effect, together with the ripple current rating of the capacitors, the
output capacitor is selected as two 220 uF units in parallel.
Copyright © 2005–2014, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: LM5021
R22
R21 VCC R22
0.125
= ´ -
0.5V
R23
2.5A
=
9
6.63 10
R17
2 145000
´
=
´
LM5021
SNVS359E MAY 2005REVISED DECEMBER 2014
www.ti.com
8.2.2.4 Timing Resistor
The switching frequency is set by R17. From Equation 2:
(21)
Choose R17 as 22.1 k as a common resistor close to the computed value.
8.2.2.5 Soft-Start Time
The soft start time is set by C14. This determines the rate of increase of converter primary peak current at
startup. Set a time that is long enough so that the feedback lop can compensate for the transition from open loop
during soft start to being closed loop as it takes over from soft start. The value is best determined experimentally
after the rest of the converter is complete. For this example, 220 nF was chosen as the best fit for startup time
and startup transient overshoot.
8.2.2.6 Current Sensing Network
The current sensing network consists of C15, R23, R22 and optionally R21. R23 sets the maximum peak current
in the transformer primary. Given a peak current of 2.5 A:
(22)
Select R23 to be 0.2 Ω.
R22 and C15 form a pulse filter that helps provide additional immunity beyond the internal blanking time to the
sudden voltage spike produced on R23 by the parasitic capacitance of the transformer and snubber network for
Q4. The time constant for this filter is best determined experimentally but as a guideline should be no more than
25% of the minimum pulse width of the converter in actual operating conditions. Keeping the impedance low also
helps with preventing noise coupling problems. For this converter 100 Ωand 150 pF were selected to give a time
constant of 67 ns.
R21 is used to disable pulse skip mode if that is needed. To disable pulse skip mode, R21 must produce a 125
mVdc level or slightly higher at the CS pin. To calculate the required value:
(23)
Since VCC is 8 V:
R21 = 63 × R22 (24)
Select R21 to be 6.49 k to disable skip mode operation.
8.2.2.6.1 Gate Drive Resistor
R16 limits the turn on and turn off speed of the power switch, Q4. The purpose for this is controlling the voltage
spike at the drain of Q4 turn off. Selection of this resistor value should be done in conjunction with EMI
compliance testing. Slowing the turn off time of Q4 will reduce EMI but also increase power dissipation in Q4. A
general range of values to consider would be 0 Ωto 10 Ωfor this converter. 4.7 Ωwas chosen as the best
overall solution for this converter.
8.2.2.6.2 VCC Capacitor
C17 provides filtering for the internal linear regulator. Selection is somewhat arbitrary and was picked as 1 µF per
recommendations above.
8.2.2.6.3 Startup Circuit
The startup circuit for this converter illustrates a technique for starting the converter quickly without the need to
wait for the larger VIN capacitance to be trickle charged through high impedance from the bulk voltage. It also
allows the steady state impedance connected to the bulk voltage to be higher than otherwise possible, reducing
power dissipation. The circuit consists of a series pass regulator (R1, R2, R5, Q1, D5 and C6) from the bulk
voltage supply to VIN, a series pass regulator from the rectified AUX winding to VIN (C12, D8, Q3, R12 and D9)
and a turn off circuit that turns off the bulk regulator once the converter is running (D7, R10 and Q2).
22 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated
Product Folder Links: LM5021
CQ2
255V
I 85 A
3M
= = m
W
12V 7.5V 1.4V
R12 23.3k
133 A
- -
£m
113V 27V
R1 R2
10 A
-
+ £ m
255V
R2 5.1k
50mA
³ =
LM5021
www.ti.com
SNVS359E MAY 2005REVISED DECEMBER 2014
Q1 is selected for small size and the ability to withstand the maximum bulk voltage. A BSS127 is selected for its
high maximum drain voltage of 600 V.
R2 is selected as 10k simply to limit current through Q1 to less than 50 mA per the BSS127 data sheet, at the
maximum possible bulk voltage.
(25)
The voltage the bulk regulator supplies is equal to the zener voltage of D5 less the threshold voltage of Q1,
typically 4 V. Since the controller requires a maximum of 23 V to start, the zener voltage must be at least 27 V.
D5 is selected as a 27 V device, BZX585-C27.
The bulk series regulator is turned on by R1 and R5. These are only required to supply enough current to bias
D5 and overcome any leakage in Q2, approximately 10 µA. To guarantee operation, bias the circuit with 25 µA
minimum.
(26)
The sum of R1 and R2 must be less than 8.6 MΩ. R1 and R2 are selected as 1.5 M each for common values.
C6 is simply a time delay to soften the startup of the bulk regulator and was arbitrarily chosen as 10 nF.
Turning to the AUX regulator, D8 protects the b-e junction of Q3 while the bulk regulator is active. It is a low
current device that must withstand 27 V minimum. A TS4148 was chosen for this purpose.
Q3 is the pass element for the AUX regulator and is again low current. The only requirement is that the Vce
rating be greater than the maximum rectified AUX voltage of 36 V. A common MMBT2222A was chose for this
function.
The voltage supplied to the controller VIN pin by the AUX regulator is determined by voltage on C13 less 1.4 V
for the drop across D8 and Q3 when the voltage on C13 is less than the zener voltage of D9 or the zener voltage
of D9 less 1.4 V when the voltage on C13 is higher than the zener voltage of D9. The maximum voltage supplied
to the controller is the zener voltage of D9 less 1.4 V. Picking a zener voltage of 15 V lets the controller run at
approximately 13.6 V under normal conditions. A BZX585-C15 is selected.
R12 provides bias for D9 and base drive for Q3. Bias for D9 is small compared to the required base drive for Q3.
The current required from the regulator is the sum of the controller operating current and the drive current for Q4.
The drive current for Q4 depends on the operating frequency and the total gate charge of Q4 at 13.6 V.
IREG > IVIN + IDRV (27)
IVIN = 3.5 mA (28)
IDRV = 40 nC × 145 kHz = 5.8 mA (29)
The regulator must supply a minimum of about 9.5 mA for the controller to function. From the MMBT2222A
datasheet, the minimum current gain is 75 for 10-mA collector current. The worst case base drive occurs when
the output is programmed for 8 V, giving 12 V available to the collector of Q3 and to the base drive resistor R12.
To get a minimum of 10 mA from the regulator requires 133 µA of base drive current. The VIN voltage cannot fall
below 7.25 V or the controller will shut down. R12 must satisfy the following relationship:
(30)
R12 was picked as 22 k for this application.
The bulk regulator turn off circuit simply turns Q1 off when the voltage on C13 exceeds the zener voltage of D7
plus the b-e voltage of Q2 (0.7 V) and whatever voltage is required to get sufficient base drive through R10. The
required collector current is at the maximum bulk voltage of 255 V.
(31)
Current gain for the selected MMBT2222A is over 100 at this level so the base drive required is only 8.5 µA.
Picking R10 as 47 k requires only an additional 400 mV on C13 to effect turn off of the bulk regulator. The bulk
regulator should turn off before the voltage on C13 reaches 12 V. Picking a zener voltage of 10 V with the
BZX585-C10 ensures that the bulk regulator will turn off at no more than 11.8 V.
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8.2.3 Application Curves
All test results use 115-Vac input and 2200-µF external load capacitance.
Figure 16. Bulk Voltage, Output Voltage and Output
Figure 15. AC Inrush Current, No Load Current
Figure 18. Output Ripple: 108 mVpp
Figure 17. Output Overload Hiccup Protection
Figure 20. Typical Switching Waveforms
Figure 19. Converter Efficiency Red: Q4 Drain Voltage, Yellow: Q4 Gate Voltage
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All test results use 115-Vac input and 2200-µF external load capacitance.
Figure 22. Average EMI measurement, Not Done in
Figure 21. Quasi-Peak EMI Measurement, Not Done in Certified Lab
Certified Lab
Figure 23. Thermal Image, Top Side Figure 24. Thermal Image, Bottom Side
Figure 25. Loop Response
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9 Power Supply Recommendations
The LM5021 is designed to run from a power supply in the range of 7.25 V to 30 V connected to VIN. A capacitor
is required from VIN to GND to supply startup energy for the converter. Typical values are a few µF to a few tens
of µF. Electrolytic capacitors are acceptable here.
The internal circuits of the controller operate from an internal 8-V regulator that is brought out on VCC. The VCC
pin needs a small bypass capacitor, typically 100-nF to 1-µF ceramic, closely coupled to the GND pin for best
operation. It is not recommended to directly drive the VCC pin from another power source.
NOTE
It is not recommended that the bias winding be connected to the VCC pin of the LM5021.
Doing so can cause the device to operate incorrectly or not at all.
10 Layout
10.1 Layout Guidelines
In addition to following general power management IC layout guidelines (star grounding, minimal current loops,
reasonable impedance levels, and so on) layout for the LM5021 should take into account the following:
If possible, a ground plane should be used to minimize the voltage drop on the ground circuit and the noise
introduced by parasitic inductances in individual traces.
A decoupling capacitor is required for both the VIN pin and VCC pin and both should be returned to GND as
close to the IC as possible. VIN is the more critical capacitor and should take first priority when connecting to
GND as close as possible to the IC.
The timing setting components such as the RT pin resistor, SS pin capacitor should be directly connected to
the ground plane or returned directly to the GND pin on their own traces.
The CS pin filter capacitor should be as close to the IC possible and grounded right at the IC ground pin. This
ensures the best filtering effect and minimizes the chance of current sense pin malfunction.
Gate driver loop area should be minimized to reduce the EMI noise because of the high di/dt current in the
loop.
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10.2 Layout Example
Figure 26. Layout Example
Figure 27. Top Side View Figure 28. Bottom Side View
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11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
28 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM5021MM-1/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 21-1
LM5021MM-2/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 21-2
LM5021MMX-1/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 21-1
LM5021MMX-2/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 21-2
LM5021NA-1/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 125 LM5021NA
-1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM5021 :
Automotive: LM5021-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM5021MM-1/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5021MM-2/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5021MMX-1/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5021MMX-2/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM5021MM-1/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM5021MM-2/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM5021MMX-1/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM5021MMX-2/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Sep-2018
Pack Materials-Page 2
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