DATA SH EET
Product specification
Supersedes data of April 1992 1996 May 24
DISCRETE SEMICONDUCTORS
1N4001G to 1N4007G
Rectifiers
handbook, 2 columns
M3D116
1996 May 24 2
Philips Semiconductors Product specification
Rectifiers 1N4001G to 1N4007G
FEATURES
•Glass passivated
•High maximum operating
temperature
•Low leakage current
•Excellent stability
•Available in ammo-pack.
DESCRIPTION
Rugged glass package, using a high
temperature alloyed construction.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
Fig.1 Simplified outline (SOD57) and symbol.
2/3 page (Datasheet)
MAM047
ka
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage
1N4001G −50 V
1N4002G −100 V
1N4003G −200 V
1N4004G −400 V
1N4005G −600 V
1N4006G −800 V
1N4007G −1000 V
VRcontinuous reverse voltage
1N4001G −50 V
1N4002G −100 V
1N4003G −200 V
1N4004G −400 V
1N4005G −600 V
1N4006G −800 V
1N4007G −1000 V
IF(AV) average forward current averaged over any 20 ms
period; Tamb =75°C; see Fig.2 −1.00 A
averaged over any 20 ms
period; Tamb = 100 °C; see Fig.2 −0.75 A
IFcontinuous forward current Tamb =75°C; see Fig.2 −1.00 A
IFRM repetitive peak forward current −10 A
IFSM non-repetitive peak forward current half sinewave; 60 Hz −30 A
Tstg storage temperature −65 +175 °C
Tjjunction temperature −65 +175 °C
1996 May 24 3
Philips Semiconductors Product specification
Rectifiers 1N4001G to 1N4007G
ELECTRICAL CHARACTERISTICS
Tj=25°C; unless otherwise specified.
THERMAL CHARACTERISTICS
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.4.
For more information please refer to the
“General Part of associated Handbook”
.
SYMBOL PARAMETER CONDITIONS MAX. UNIT
VFforward voltage IF= 1 A; see Fig.3 1.1 V
VF(AV) full-cycle average forward voltage IF(AV) = 1 A 0.8 V
IRreverse current VR=V
Rmax 10 µA
VR=V
Rmax; Tamb = 100 °C50µA
I
R(AV) full-cycle average reverse current VR=V
RRMmax; Tamb =75°C30µA
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 46 K/W
Rth j-a thermal resistance from junction to ambient note 1 100 K/W
1996 May 24 4
Philips Semiconductors Product specification
Rectifiers 1N4001G to 1N4007G
GRAPHICAL DATA
Fig.2 Maximum forward current as a function of
ambient temperature.
handbook, halfpage
0 200
0
MBH386
0.5
1
1.5
100 Tamb (°C)
IF
(A)
Fig.3 Forward current as a function of forward
voltage; typical values.
handbook, halfpage
1.50 0.5
IF
(A)
10−1
1
10
MBH385
1VF (V)
(2)(1) (3)
(1) Tamb = 100 °C.
(2) Tamb = 20°C.
(3) Tamb =−50 °C.
Fig.4 Device mounted on a printed-circuit board.
handbook, halfpage
MGA200
3
2
7
50
25
50
Dimensions in mm.
1996 May 24 5
Philips Semiconductors Product specification
Rectifiers 1N4001G to 1N4007G
PACKAGE OUTLINE
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Dimensions in mm.
Fig.5 SOD57.
handbook, full pagewidth
,
,
,
3.81
max
MBC880
ka
28 min28 min 4.57
max
0.81
max
