NTC Thermistors
T (˚C)
0
–20
–40 20 40 60 80 100 120 140
1000
R
T
/R
25
100
10
1
0.1
0.01
0.001
5000
6000
4000
3000
2000
B=1000
R (
?
)
T (˚C)
2.4
12.9 3.4 3.9 4.4
125 85 50 25 0 –20 –40
10000000
1000000
100000
10000
10
1000
100
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2
5
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0
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5
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50
=
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0
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T
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The NTC Thermistors
This is a Negative Temperature Coeffi cient Resistor whose resistance changes as ambient temperature changes. Therm-
istor comprises 2 or 4 kinds of metal oxides of iron, nickel, cobalt, manganese and copper, be ing shaped and sintered
at high temperature (1200 to 1500 °C)
■ Recommended Applications
● For temperature measurement or temperature detection :
thermometer, temperature controller
● For temperature compensation : transistor circuit,
measuring instruments
■ Features
● Temperature Coeffi cient of Resistance is negative and
extremely large
● Various kinds of types especially smaller ones are
available.
● Resistance values are available from 22 Ω to 470 kΩ
Fig. 1
Fig. 2
■ Physical Characteristics of NTC Thermistors
Thermistor is a resistor sensitive to temperature utilizing
the large temperature-coefficient of metal oxide semi-
conductor. And its temperature dependency of resistance
value is indicated by the following equation:
R=R0 exp B .................................... (1)
T
0: Standard Temperature 298.15 K(25 °C)
R
0: Resistance at T0 K
B: Thermistor Constant (K)
So called Temperature Coefficient (a) is generally
indicated as follows:
a= .................................................................... (2)
But a is not adequate for use as a constant, because a
change by temperature is considerably large, so B Value
is used as a coeffi cient of thermistor.
1
T
1
T0
( )[ ]
B
T2
■ Major Characteristics of NTC Thermistors
The relation between resistance and temperature of a
thermistor is linear as shown in Fig. 2, in which resistance
is shown in vertical direction in a logarithmic scale and
reciprocal of absolute temperature in horizontal direction.
Bias degrees in these straight lines are determined according
to the B Value expressed by the following equation.
B =
.................................................. (3)
R
1: Resistance at T1 K
R
2: Resistance at T2 K
When calculated from this equation, B Value is a variable
in a strict sense, and the resistance is expressed by the
following equation:
R = AT–C exp D/T ........................................................ (4)
In (4), C is a small positive or negative constant and quite
negligible except use in precision temperature-measuring
device, thereby the B Value is, in practical usage, to be
considered as a constant. In Fig. 1,
the relation between the resistance ratio RT/R25
(R25: Resistance at 25 °C, RT
: Resistance at T °C) and B Value is
shown with T °C, in the horizontal direction.
1
T1
1
T2
knR1 – knR2
Sep. 201000
2
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
&
1
3
2
5+&(+"
3456789 10 11 12
$PNNPO$PEF
ERT J
Product Code Type Code
NTC
Thermistors
Chip Type (SMD)
Multilayer Type
4J[F$PEF
“0201”
“0402”
“0603”
Z
0
1
1BDLBHJOH
4UZMF$PEF
E
V
±1%
±2%
±3%
±5%
F
G
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J
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/PNJOBM3FTJTUBODF
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The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
#7BMVF$MBTT$PEF
2701 to 2800
3301 to 3400
3801 to 3900
4001 to 4100
4201 to 4300
4301 to 4400
4401 to 4500
4601 to 4700
A
G
M
P
R
S
T
V4QFDJBM
4QFDJGJDBUJPO
“0201”, “0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
Narrow
Tolerance
Type
Standard
Type
5
4
3
2
1
Multilayer NTC Thermistors
Series: ERTJ
■ Recommended Applications
● Mobile Phone
· Temperature compensation for crystal oscillator
· Temperature compensation for semiconductor
devices
● Personal Computer
· Temperature detection for CPU and memory device
· Temperature compensation for ink-viscosity
(Inkjet Printer)
● Battery Pack
· Temperature detection of battery cells
● Liquid Crystal Display
· Temperature compensation of display contrast
· Temperature compensation of display backlighting
(CCFL)
■ Features
● Surface Mount Device (0201, 0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 125 °C)
● Environmentally-friendly lead-free
● RoHS compliant
■ Explanation of Part Numbers
■ Construction
No Name
ASemiconductive Ceramics
BInternal electrode
CTerminal
electrode
Substrate electrode
DIntermediate electrode
EExternal electrode
Dec. 201301
3
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
L
T
W
L
1
L
2
E
C
D
A
W
2
W
1
B
100 min.
Vacant position
Top cover tape
400 min.
160 min.
Vacant position
t
P1P2P0
K0
fD0
A
B
F
W
E
Tape running direction
Chip component
Feeding hole Chip pocket
t2Chip component
Feeding hole Chip pocket
fD0
P1P2P0Tape running direction
EF
W
B
A
t1
t1
P1P2P0Tape running direction
t2Chip component
Feeding hole Chip pocket
fD0
A
B
F
W
E
■ Dimensions in mm (not to scale)
Size Code (EIA) LWTL
1, L2
Z(0201) 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05
0(0402) 1.0±0.1 0.50±0.05 0.50±0.05 0.25±0.15
1(0603) 1.60±0.15 0.8±0.1 0.8±0.1 0.3±0.2
■ Packaging Methods
● Standard Packing Quantities ● Reel for Taping
Symbol fA
fB
CDEW
1W2
Dim.
(mm) 180–3
60.0+1.0
13.0±0.5
21.0±0.8 2.0±0.5
9.0+1. 0
11.4 ±1.0
0
Taped end
● Leader Part and Taped End
Leader part
(Unit : mm)
● Pitch 2 mm (Pressed Carrier Taping) : Size 0201
● Pitch 2 mm (Punched Carrier Taping) : Size 0402
● Pitch 4 mm (Punched Carrier Taping) : Size 0603
Symbol
ABWFEP
1P2P0fD0t1t2
Dim.
(mm)
1.0
±0.1 1.8
±0.1 8.0
±0.2 3.50
±0.05
1.75
±0.10 4.0
±0.1 2.00
±0.05
4.0
±0.1
1.5+0.1
0
1.1
max. 1.4
max.
Symbol
ABWFEP
1P2P0fD0t1t2
Dim.
(mm)
0.62
±0.05
1.12
±0.05
8.0
±0.2 3.50
±0.05
1.75
±0.10 2.00
±0.05
2.00
±0.05
4.0
±0.1
1.5+0.1
0
0.7
max. 1.0
max.
Symbol
ABWFEP
1P2P0fD0tK
0
Dim.
(mm)
0.36
±0.03
0.66
±0.03
8.0
±0.2 3.50
±0.05
1.75
±0.10 2.00
±0.05
2.00
±0.05
4.0
±0.1
1.5+0.1
0
0.55
max. 0.36
±0.03
(Unit : mm)
■ Minimum Quantity / Packing Unit
0
0
Size
Code
Thickness
(mm) Kind of Taping Pitch
(mm)
Quantity
(pcs./reel)
Z(0201) 0.3
Pressed Carrier Taping
2 15,000
0(0402) 0.5
Punched Carrier Taping
2 10,000
1(0603) 0.8 4 4,000
Part Number
(Size)
Minimum Quantity
/ Packing Unit
Packing Quantity
in Carton
Carton
L×W×H (mm)
ERTJZ
(0201) 15,000 300,000 250×200×200
ERTJ0
(0402) 10,000 200,000 250×200×200
ERTJ1
(0603) 4,000 80,000 250×200×200
Part No., quantity and country of origin are designated
o
n outer packages in English.
Dec. 201301
4
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
■ Ratings
Size code (EIA) Z(0201) 0(0402) 1(0603)
Operating
Temperature Range –40 to 125 °C
Rated Maximum
Power Dissipation✽133 mW 66 mW 100 mW
Dissipation
Factor✽2
approximately
1 mW/°C
approximately
2 mW/°C
approximately
3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The Maximum Power Dissipation under ambient temperature 25 °C or less is the same with the rated maximum power dissipation, and Maximum
power dissipation beyond 25 °C depends on the Decreased power dissipation curve.
· Please see “Operating Power” for details paging 371.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under
stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
● Resistance ratios to R25 at each temperature/Reference values
(for obtaining resistance at each temperature by using R25 shown in part number)
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
B25/50=kn (R25/R50)
1/298.15–1/323.15 B25/85=kn (R25/R85)
1/298.15–1/358.15
✽1 Other than ERTJ0ET104□ in B25/50=4500K.
✽2 ERTJ0ET104□ only.
ERTJ□□A〜
ERTJ□□G〜ERTJ□□M〜ERTJ□□P〜ERTJ□□R〜ERTJ0ES〜ERTJ1VS〜ERTJ□□T〜ERTJ0ET104□ERTJ□□V〜
B25/50 2750 K 2800 K (3375 K) 3900 K 4050 K 4250K 4330K (4330K) 4500K 4500K 4700K
B25/85 (2700 K) (2750 K) 3435 K (3970 K) (4100 K) (4300K) (4390K) 4390K (4450K) (4580K) (4750K)
T(°C)
✽1✽2
-40
13.05 13.28 20.52 32.11 33.10 43.10 45.67 45.53 63.30 47.07 59.76
-35
10.21 10.40 15.48 23.29 24.03 30.45 32.08 31.99 42.92 33.31 41.10
-30
8.061 8.214 11.79 17.08 17.63 21.76 22.80 22.74 29.50 23.80 28.61
-25
6.427 6.547 9.069 12.65 13.06 15.73 16.39 16.35 20.53 17.16 20.14
-20
5.168 5.261 7.037 9.465 9.761 11.48 11.91 11.89 14.46 12.49 14.33
-15
4.191 4.261 5.507 7.147 7.362 8.466 8.743 8.727 10.30 9.159 10.31
-10
3.424 3.476 4.344 5.444 5.599 6.300 6.479 6.469 7.407 6.772 7.482
-5
2.819 2.856 3.453 4.181 4.291 4.730 4.845 4.839 5.388 5.046 5.481
0
2.336 2.362 2.764 3.237 3.312 3.582 3.654 3.650 3.966 3.789 4.050
5
1.948 1.966 2.227 2.524 2.574 2.734 2.778 2.776 2.953 2.864 3.015
10
1.635 1.646 1.806 1.981 2.013 2.102 2.128 2.126 2.221 2.179 2.262
15
1.380 1.386 1.474 1.567 1.584 1.629 1.642 1.641 1.687 1.669 1.710
20
1.171 1.174 1.211 1.247 1.255 1.272 1.277 1.276 1.293 1.287 1.303
25
1 1 1 1 1 1 1 1 1 1 1
30
0.8585 0.8565 0.8309 0.8072 0.8016 0.7921 0.7888 0.7890 0.7799 0.7823 0.7734
35
0.7407 0.7372 0.6941 0.6556 0.6461 0.6315 0.6263 0.6266 0.6131 0.6158 0.6023
40
0.6422 0.6376 0.5828 0.5356 0.5235 0.5067 0.5004 0.5007 0.4856 0.4876 0.4721
45
0.5595 0.5541 0.4916 0.4401 0.4266 0.4090 0.4022 0.4025 0.3874 0.3884 0.3723
50
0.4899 0.4836 0.4165 0.3635 0.3496 0.3319 0.3251 0.3254 0.3111 0.3111 0.2954
55
0.4309 0.4238 0.3543 0.3018 0.2881 0.2709 0.2642 0.2645 0.2513 0.2504 0.2356
60
0.3806 0.3730 0.3027 0.2518 0.2386 0.2222 0.2158 0.2161 0.2042 0.2026 0.1889
65
0.3376 0.3295 0.2595 0.2111 0.1985 0.1832 0.1772 0.1774 0.1670 0.1648 0.1523
70
0.3008 0.2922 0.2233 0.1777 0.1659 0.1518 0.1463 0.1465 0.1377 0.1348 0.1236
75
0.2691 0.2600 0.1929 0.1504 0.1393 0.1264 0.1213 0.1215 0.1144 0.1108 0.1009
80
0.2417 0.2322 0.1672 0.1278 0.1174 0.1057 0.1011 0.1013 0.09560 0.09162 0.08284
85
0.2180 0.2081 0.1451 0.1090 0.09937 0.08873 0.08469 0.08486 0.08033 0.07609 0.06834
90
0.1974 0.1871 0.1261 0.09310 0.08442 0.07468 0.07122 0.07138 0.06782 0.06345 0.05662
95
0.1793 0.1688 0.1097 0.07980 0.07200 0.06307 0.06014 0.06028 0.05753 0.05314 0.04712
100
0.1636 0.1528 0.09563 0.06871 0.06166 0.05353 0.05099 0.05112 0.04903 0.04472 0.03939
105
0.1498 0.1387 0.08357 0.05947 0.05306 0.04568 0.04340 0.04351 0.04198 0.03784 0.03308
110
0.1377 0.1263 0.07317 0.05170 0.04587 0.03918 0.03708 0.03718 0.03609 0.03218 0.02791
115
0.1270 0.1153 0.06421 0.04512 0.03979 0.03374 0.03179 0.03188 0.03117 0.02748 0.02364
120
0.1175 0.1056 0.05650 0.03951 0.03460 0.02916 0.02734 0.02742 0.02702 0.02352 0.02009
125
0.1091 0.09695 0.04986 0.03470 0.03013 0.02527 0.02359 0.02367 0.02351 0.02017 0.01712
Dec. 201301
5
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
1.0
Test Sample
0.5R 0.3/Size:0201
0.5/Size:0402
Board
1.0
Test
Sample Unit : mm
20
45±2 45±2
Bending
distance
Unit : mm
R340
■ Speci cation and Test Method
Item Speci cation Test Method
Rated Zero-power
Resistance (R25)
Within the specifi ed tolerance. The value of the d.c. resistance shall be measured at
the rated ambient temperature of 25.0 ±0.1 °C under
the power less than 0.1mW which is negligible self
heat generation.
B Value Within the specifi ed tolerance.
✽ Individual Specifi cation shall specify B25/50 or
B25/85.
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (°C) and T2 (°C).
The B value is calculated by the following equation.
BT1/T2=kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
T1T2
B25/50 25.0 ±0.1 °C 50.0 ±0.1 °C
B25/85 25.0 ±0.1 °C 85.0 ±0.1 °C
Adhesion The terminal electrode shall be free from peeling
or signs of peeling.
Applied force :
Size 0201 : 2 N
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0201, 0402
Size : 0603
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Bending distance : 1 mm
Bending speed : 1 mm/s
Resistance to
Soldering Heat
There shall be no cracks and other mechanical
damage.
Nallow Tol. type Standard type
R25 change : within ±2 % within ±3 %
B Value change : within ±1 % within ±2 %
Soldering bath method
Solder temperature : 270 ±5 °C
Dipping period : 3.0 ±0.5 s
Preheat condition :
Step Temp (°C) Period (s)
1 80 to 100 120 to 180
2 150 to 200 120 to 180
Solderability More than 75 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period : 4 ±1 s
Solder : H63A (JIS–Z–3282)
Dec. 201301
6
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
■ Part Number List of Narrow Tolerance Type (Resistance Tolerance : ±2 %, ±1 %)
● 0201(EIA)
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code G P S V
Nominal B value
✽() Reference value
B25/50
B25/85
(3375 K)
3435 K±1 %
4050 K±1 %
(4100 K)
4330 K±1 %
(4390 K)
4700 K±1 %
(4750 K)
10 kΩ±1 %(F)
or
±2 %(G)
ERTJ0EG103□A
47 kΩERTJ0EP473□
100 kΩERTJ0ES104□ERTJ0EV104□
□ : Resistance Tolerance Code
Avoid fl ow soldering.
● 0603(EIA)
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code G S
Nominal B value
✽() Reference value
B25/50
B25/85
(3375 K)
3435 K±1 %
(4330 K)
4390 K±1 %
10 kΩ±1 %(F)
or
±2 %(G)
ERTJ1VG103□A
100 kΩERTJ1VS104□A
□ : Resistance Tolerance Code
Avoid fl ow soldering.
■ Speci cation and Test Method
Item Speci cation Test Method
Temperature
Cycling
Nallow Tol. type Standard type
R25 change : within ±2 % within ±3 %
B Value change : within ±1 % within ±2 %
Conditions of one cycle
Step 1 : –40 °C, 30±3 min
Step 2 : Room temp., 3 min max.
Step 3 : 125 °C, 30±3 min.
Step 4 : Room temp., 3 min max.
Number of cycles: 100 cycles
Moisture
Resistance
Nallow Tol. type Standard type
R25 change : within ±2 % within ±3 %
B Value change : within ±1 % within ±2 %
Temperature : 85 ±2 °C
Relative humidity : 85 ±5 %
Test period : 1000 +48/0 h
Damp Heat Load Nallow Tol. type Standard type
R25 change : within ±2 % within ±3 %
B Value change : within ±1 % within ±2 %
Temperature : 85 ±2 °C
Relative humidity : 85 ±5 %
Applied power : 10 mW
Test period : 500 +24/0 h
Cold Resistance Nallow Tol. type Standard type
R25 change : within ±2 % within ±3 %
B Value change : within ±1 % within ±2 %
Temperature : –40 ±3 °C
Test period : 1000 +48/0 h
Dry Heat
Resistance
Nallow Tol. type Standard type
R25 change : within ±2 % within ±3 %
B Value change : within ±1 % within ±2 %
Temperature : 125 ±3 °C
Test period : 1000 +48/0 h
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code G P V
Nominal B value
✽() Reference value
B25/50
B25/85
(3375 K)
3435 K±1 %
4050 K±1 %
(4100 K)
4700 K±1 %
(4750 K)
10 kΩ±1 %(F)
or
±2 %(G)
ERTJZEG103□A
47 kΩERTJZEP473□
100 kΩERTJZEV104□
□ : Resistance Tolerance Code
Avoid fl ow soldering.
● 0402(EIA)
Dec. 201301
7
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
■ Part Number List of Standard Type (Resistance Tolerance : ±5 %, ±3 %)
● 0201(EIA)
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code G P T V
Nominal B value
✽() Reference value
B25/50
B25/85
(3375 K)
3435 K±2 %
4050 K±3 %
(4100 K)
4500 K±2 %
(4450 K)
4700 K±2 %
(4750 K)
2.0 kΩ
±3 %(H)
or
±5 %(J)
ERTJZET202□
3.0 kΩERTJZET302□
4.7 kΩERTJZET472□
10 kΩERTJZEG103□A
47 kΩERTJZEP473□
100 kΩERTJZEV104□
□ : Resistance Tolerance Code
Avoid fl ow soldering.
● 0402(EIA)
□ : Resistance Tolerance Code
Avoid fl ow soldering.
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code A
Nominal B value
✽() Reference value
B25/50
B25/85
2750 K±3 %
(2700 K)
2800 K±3 %
(2750 K)
22 Ω
±3 %(H)
or
±5 %(J)
ERTJ0EA220□
33 ΩERTJ0EA330□
40 ΩERTJ0EA400□
47 ΩERTJ0EA470□
68 ΩERTJ0EA680□
100 ΩERTJ0EA101□
150 ΩERTJ0EA151□
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code S T V
Nominal B value
✽() Reference value
B25/50
B25/85
4330 K±2 %
(4390 K)
4500 K±2 %
(4450 K, 4580 K)
4700 K±2 %
(4750 K)
1.0 kΩ
±3 %(H)
or
±5 %(J)
ERTJ0ET102□
1.5 kΩERTJ0ET152□
2.0 kΩERTJ0ET202□
2.2 kΩERTJ0ET222□
3.0 kΩERTJ0ET302□
3.3 kΩERTJ0ET332□
4.7 kΩERTJ0ET472□
47 kΩERTJ0EV473□
68 kΩERTJ0EV683□
100 kΩERTJ0ES104□ERTJ0ET104□ERTJ0EV104□
150 kΩERTJ0ET154□ERTJ0EV154□
220 kΩERTJ0EV224□
330 kΩERTJ0EV334□
470 kΩERTJ0EV474□
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code G M P R
Nominal B value
✽() Reference value
B25/50
B25/85
(3375 K)
3435 K±1 %
3900 K±2 %
(3970 K)
4050 K±2 %
(4100 K)
4250 K±2 %
(4300 K)
3.3 kΩ
±3 %(H)
or
±5 %(J)
ERTJ0ER332□
4.7 kΩERTJ0ER472□
6.8 kΩERTJ0ER682□
10 kΩERTJ0EG103□A ERTJ0EM103□ERTJ0ER103□
15 kΩERTJ0ER153□
22 kΩERTJ0ER223□
33 kΩERTJ0EP333□ERTJ0ER333□
47 kΩERTJ0EP473□
100 kΩERTJ0EP104□
Dec. 201301
8
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
● 0603(EIA)
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code A G P
Nominal B value
✽() Reference value
B25/50
B25/85
2750 K±3 %
(2700 K)
2800 K±3 %
(2750 K)
(3375 K)
3435 K±1 %
4050 K±3 %
(4100 K)
22 Ω
±3 %(H)
or
±5 %(J)
ERTJ1VA220□
33 ΩERTJ1VA330□
40 ΩERTJ1VA400□
47 ΩERTJ1VA470□
68 ΩERTJ1VA680□
100 ΩERTJ1VA101□
10 kΩERTJ1VG103□A
47 kΩERTJ1VP473□
Nominal
Resistance
at 25 °C
Resistance
Tolerance
B value class code R S T V
Nominal B value
✽() Reference value
B25/50
B25/85
4250 K±2 %
(4300 K)
(4330 K)
4390 K±1%
4500 K±2 %
(4450 K)
4700 K±2 %
(4750 K)
1.0 kΩ
±3 %(H)
or
±5 %(J)
ERTJ1VT102□
1.5 kΩERTJ1VT152□
2.0 kΩERTJ1VT202□
2.2 kΩERTJ1VT222□
3.0 kΩERTJ1VT302□
3.3 kΩERTJ1VR332□ERTJ1VT332□
4.7 kΩERTJ1VR472□ERTJ1VT472□
6.8 kΩERTJ1VR682□
10 kΩERTJ1VR103□
15 kΩERTJ1VR153□
22 kΩERTJ1VR223□
33 kΩERTJ1VR333□
47 kΩERTJ1VR473□ERTJ1VV473□
68 kΩERTJ1VR683□ERTJ1VV683□
100 kΩERTJ1VS104□A ERTJ1VV104□
150 kΩERTJ1VV154□
□ : Resistance Tolerance Code
Avoid fl ow soldering.
Dec. 201301
9
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer NTC Thermistors
Rth
NTC NTC
[for Low Temp.] [for High Temp.]
Rth
R
R
R
R
C
C
CC
X’tal
Vcc
Output
0TDGSFREFWJBUJPOEGE5QQN
with compensation without compensation
-20
8
0
-8 25 75
Vcc
Rth
RRL
AD
converter
CPU Interface
GMR Head
NTC
Vcc
Rth R
R
R
LCD
NTC
■ Typical Application
● Temperature Detection
Writing current control of HDD
● Temperature Compensation (Pseudo-linearization)
Contrast level control of LCD
● Temperature Compensation (RF circuit)
Temperature compensation of TCXO
Dec. 201301
10
Multilayer NTC Thermistors
25
100
75
Ambient temperature (°C)
Maximum power dissipation
/ Rated maximum power dissipation (%)
125
50
Multilayer Chip NTC Thermistors
Series: ERTJ
■ Operating Conditions and Circuit Design
1. Circuit Design
1.1
Operating Temperature and Storage Temperature
The specified “Operating Temperature Range”
found in the Specifi cations is the absolute maximum
and minimum temperature rating. Every Thermistor
shall be operated within the specified “Operating
Temperature Range”.
The Thermistors mounted on PCB shall be stored
without operating within the specified “Storage
Temperature Range” in the Specifi cations.
1.2 Operating Power
Thermistors shall not be operated in excess of the
“Maximum power dissipation”.
If the Thermistors are operated beyond the specifi ed
Maximum power dissipation, it may cause burnout
and/or damage due to thermal run away.
For temperature detection applications, the accuracy
may be greatly influenced by self-heat generation
and the heat dissipation of the Thermistor, even
if the Thermistor is operated under the specified
Maximum Power Dissipation.
Please check the safety and reliability of your circuit.
Safety Precautions
Multilayer NTC Thermistors (hereafter referred to as “Thermistors”) should be used for general purpose applications
found in consumer electronics (audio/visual, home, offi ce, information & communication) equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifi cations, as noted
in the Ratings and Specifi ed Conditions section, the Thermistor may fail in a short circuit mode or in an open-circuit
mode. This case results in a burn-out, smoke or fl aming.
For products which require high safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for additional not found in this document.
· When your application may have diffi culty complying with the safety or handling precautions specifi ed below.
· For any applications where a malfunction with this product may directly or indirectly cause hazardous conditions
which could result in death or injury;
1 Aircraft and Aerospace Equipment (artifi cial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (motor vehicles, airplanes, trains, ship, traffi c signal controllers, etc.)
4
Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment
Handling Precautions
[Maximum power dissipation]
· The Maximum power that can be continuously applied
under static air at a certain ambient temperature.
The Maximum power dissipation under an ambient
temperature of 25 °C or less is the same with the
rated maximum power dissipation, and Maximum
power dissipation beyond 25 °C depends on the
Decreased power dissipation curve below.
[Dissipation factor]
· The constant amount power required to raise the
temperature of the Thermistor 1 °C through self heat
generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption of
Thermistor / Temperature rise of element
Decreased power dissipation curve
Sep. 201000
11
Multilayer NTC Thermistors
ab
c
Land SMD
Solder resist
(a) Excessive amount (b) Proper amount (c) Insufficient amount
Solder resist
Land
Portion to be
excessively soldered
A lead wire of
Retro-fitted
component
Soldering
iron
Solder
(Ground solder)
Chassis
Electrode pattern
Solder resist
Solder resist
Solder resist
The lead wire of a
component with lead wires
1.3 Environmental Restrictions
The Thermistors shall not be operated and/or stored
under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid,
chlorine and ammonia
(2) Mechanical conditions
Under severe conditions of vibration or impact
beyond the specified conditions found in the
Specifi cations.
1.4 Measurement of Resistance
The resistance of the Thermistors varies dependent
on ambient temperatures and self-heating. Note the
following points when measuring resistance values of
the Thermistors during inspection or when considering
them for circuits.
1 Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is
recommended for a stable measurement temperature.
2 Power : 0.10 mW max.
4 terminal measurement with a constant-current
power supply is recommended.
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
When the Thermistors are mounted and soldered on
an “Alumina Substrate”, the substrate infl uences the
Thermistors’ reliability against “Temperature Cycles”
and “Heat shock” due to the difference in the thermal
expansion coefficient between them. Confirm that
the actual board used does not deteriorate the
characteristics of the Thermistors.
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown below.
Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive
stress on the Thermistors.
Unit (mm)
Size Code
(EIA)
Component
dimensions abc
LWT
Z(0201) 0.6 0.3 0.3
0.2 to 0.3 0.25 to 0.30 0.2 to 0.3
0(0402) 1.0 0.5 0.5
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
1(0603) 1.6 0.8 0.8
0.8 to 1.0 0.6 to 0.8 0.6 to 0.8
Recommended Land Dimensions
(2) The size of lands shall be designed to have
equal spacing between the right and left sides. If
the amount of solder on the right land is different
from that on the left land, the component may
be cracked by stress since the side with a larger
amount of solder solidifi es later during cooling.
Recommended Amount of Solder
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the pattern
for the following cases;
· Components are arranged closely.
· The Thermistor is mounted near a component
with lead wires.
· The Thermistor is placed near a chassis.
See the table below.
Prohibited Applications and Recommended Applications
Item Prohibited
applications
Improved applications
by pattern division
Mixed mounting
with a component
with lead wires
Arrangement near
chassis
Retro-fi tting of
component with
lead wires
Lateral
arrangement
2.4 Component Layout
The Thermistors/components shall be placed on the
PC board such that both electrodes are subjected
to uniform stresses, or to position the component
electrodes at right angles to the grid glove or
bending line. This should be done to avoid
cracking the Thermistors from bending the PC
board after or during placing/mounting on the PC
board. Placement of the Thermistors near heating
elements also requires that great care be taken
in order to avoid stresses from rapid heating and
cooling.
Sep. 201000
12
Multilayer NTC Thermistors
AB
C
E
D
Slit
Magnitude of stress A>B=C>D>E
Perforation
Supporting
pin
Supporting
pin
Crack
Separation of Solder
Crack
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Thermistors.
(3) The magnitude of mechanical stress applied to
the Thermistors when the circuit board is divided
is in the order of push back < slit < V-groove <
perforation.
Also take into account the layout of the Thermistors
and the dividing/breaking method.
(4) When the Thermistors are placed near heating
elements such as heater, etc., cracks from thermal
stresses may be caused by the following:
· Soldering the Thermistors directly heating
elements.
· Mounting the Thermistors on the same land
that another Thermistor is mounted on.
For the above-mentioned mounting and/or
placement, please contact us in advance,
2.5 Mounting Density and Spaces
If components are arranged in too narrow a space,
the components can be affected by solder bridges
and solder balls. The space between components
should be carefully determined.
■ Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 - 40 °C
and 20 - 70 % RH, not under severe conditions of
high temperature and humidity.
(2) If stored in a place that is humid, dusty, or contains
corrosive gasses (hydrogen sulfide, sulfurous
acid, hydrogen chloride and ammonia etc.), the
solderability of terminal electrodes may deteriorate.
In addition, storage in a place subjected to heating
and/or exposure to direct sunlight will cause
deformed tapes and reels, and component sticking
to tapes, both of which can result in mounting
problems
(3) Do not store components longer than 6 months.
Check the solderability of products that have
been stored for more than 6 months before use
2. Chip Mounting Consideration
(1) When mounting the Thermistors/components on
a PC board, the Thermistor bodies shall be free
from excessive impact loads such as mechanical
impact or stress due to the positioning, pushing
force and displacement of vacuum nozzles during
mounting.
(2) Maintenance and inspection of the Chip Mounter
must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is
too low, the Thermistor will crack from excessive
force during mounting.
The following precautions and recommendations are
for your reference in use.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a
supporting pin on the rear surface of the PC
board to suppress the bending of the PC
board in order to minimize the impact of the
vacuum nozzles. Typical examples are shown
in the table below.
Item Prohibited mounting
Recommended mounting
Single surface
mouting
The supporting pin does not necessarily
have to be positioned beneath the
Thermistor.
Double surface
mounting
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning chucks
shall be controlled. Maintenance and replacement
of positioning chucks shall be performed regularly
to prevent chipping or cracking of the Thermistors
caused by mechanical impact during positioning
due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted
so that the maximum bending of PC board does
not exceed 0.5 mm at 90 mm span. The PC
board shall be supported by an adequate number
of supporting pins.
3. Selection of Soldering Flux
Soldering fl ux may seriously affect the performance
of the Thermistors. The following shall be confi rmed
before use.
(1) The soldering flux should have a halogen based
content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering fl ux with strong acid.
(2) When applying water-soluble soldering flux,
wash the Thermistors sufficiently because the
soldering flux residue on the surface of PC
boards may deteriorate the insulation resistance
on the Thermistors’ surface.
Prohibited layout Recommended layout
Layout the Thermistors sideways
against the stressing direction
Sep. 201000
13
Multilayer NTC Thermistors
Time
Gradual
cooling
5
Heating3
Peak4
Temp. rise
65
2
Preheating1
60 sec max.60 to 120 sec
Temperature (°C)
260
220
180
140
6T
Preheating
Gradual cooling
60 to 120 sec 3 sec max.
4. Soldering
4.1 Re ow Soldering
The reflow soldering temperature conditions are
each temperature curves of Preheating, Temp. rise,
Heating, Peak and Gradual cooling. Large temperature
difference caused by rapid heat application to the
Thermistors may lead to excessive thermal stresses,
contributing to the thermal cracks. The Preheating
temperature requires controlling with great care so
that tombstone phenomenon may be prevented.
Item Temperature Period or Speed
1Preheating 140 to 180 °C 60 to 120 sec
2Temp. rise Preheating temp
to Peak temp. 2 to 5 °C /sec
3Heating 220 °C min. 60 sec max.
4Peak 260 °C max. 10 sec max.
5Gradual cooling Peak temp.
to 140 °C 1 to 4 °C /sec
Recommended pro le of Re ow soldering (EX)
△T : Allowable temperature difference △T < 150 °C
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Thermistors are immersed into a cleaning
solvent, make sure that the surface temperatures of
the devices do not exceed 100 °C.
Performing refl ow soldering twice under the conditions
shown in the fi gure above [Recommended profi le of
Refl ow soldering (EX)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
4.2 Hand Soldering
Hand soldering typically causes significant temperature
change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should be
observed.
· The temperature of the soldering tips should be
controlled with special care.
· The direct contact of soldering tips with the
Thermistors and/or terminal electrodes should be
avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
f1.0 mm or below Thread eutectic solder with
soldering fl ux✽ in the core.
✽ Rosin-based and non-activated flux is
recommended.
(b) Preheating:
The Thermistors shall be preheated so that the
“Temperature Gradient” between the devices
and the tip of soldering iron is 150 °C or below.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be
melted in advance on the soldering tip.)
(d) Gradual cooling:
After soldering, the Thermistors shall be
cooled gradually at room temperature.
Recommended pro le of Hand soldering (EX)
△T : Allowable temperature difference △T < 150 °C
(2) Condition 2 (without preheating)
Hand soldering can be performed without
preheating, by following the conditions below:
(a) Soldering iron tip shall never directly touch
the ceramic and terminal electrodes of the
Thermistors.
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Thermistors for soldering.
Conditions of Hand soldering without preheating
Item Condition
Temperature of Iron tip 270 °C max.
Wattage 20 W max.
Shape of Iron tip f3 mm max.
Soldering time with
a soldering iron 3 sec max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering fl ux residue may remain on the PC board
if cleaned with an inappropriate solvent. This may
deteriorate the electrical characteristics and reliability
of the Thermistors.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient
cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermistors.
(1) Insuffi cient cleaning can lead to:
(a) The halogen substance found in the residue
of the soldering fl ux may cause the metal of
terminal electrodes to corrode.
(b) The halogen substance found in the residue
of the soldering flux on the surface of the
Thermistors may change resistance values.
(c) Water-soluble soldering flux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering fl ux.
Sep. 201000
14
Multilayer NTC Thermistors
Supporting pin
Separated, Crack
Check pin
Check pin
Bending Torsion
PC board
splitting jig
V-groove
PC board
Outline of Jig
PC
board
Chip
component
Loading
point
V-groove
Loading direction
PC
board
Chip component
Loading
point
V-groove
Loading direction
Floor
Crack
Mounted PCB
Crack
(2) Excessive cleaning can lead to:
(a) Overuse of ultrasonic cleaning may deteriorate
the strength of the terminal electrodes or cause
cracking in the solder and /or ceramic bodies of
the Thermistors due to vibration of the PC boards.
Please follow these conditions for Ultrasonic
cleaning:
Ultrasonic wave output : 20 W/L max.
Ultrasonic wave frequency : 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
5.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insuffi cient cleaning due
to the high density of liberated halogen.
6.Inspection Process
When mounted PC boards are inspected with
measuring terminal pins, abnormal and excess
mechanical stress shall not be applied to the PC
board or mounted components, to prevent failure
or damage to the devices.
(1) Mounted PC boards shall be supported by
an adequate number of supporting pins with
bend settings of 90 mm span 0.5 mm max.
(2) Confi rm that the measuring pins have the right
tip shape, are equal in height and are set in the
correct positions.
The following figures are for your reference to
avoid bending the PC board.
Item Prohibited setting Recommended
setting
Bending of
PC board
7. Pr ote c ti ve Co at in g
When the surface of a PC board on which the
Capacitors have been mounted is coated with resin
to protect against moisture and dust, it shall be
confirmed that the protective coating which is
corrosive or chemically active is not used, in order
that the reliability of the Thermistors in the actual
equipment may not be infl uenced. Coating materials
that expand or shrink also may lead to damage to
the Thermistors during the curing process.
8. Dividing/Breaking of PC Boards
(1) Abnormal and excessive mechanical stress such
as bending or torsion shown below can cause
cracking in the Thermistors.
(3) Examples of PCB dividing/breaking jigs:
The outline of PC board breaking jig is shown
below. When PC boards are broken or divided,
loading points should be close to the jig to
minimize the extent of the bending
Also, planes with no parts mounted on should
be used as plane of loading, which generates
a compressive stress on the mounted plane,
in order to prevent tensile stress induced by the
bending, which may cause cracks of the Thermistors
or other parts mounted on the PC boards.
(2) Dividing/Breaking of the PC boards shall be
done carefully at moderate speed by using a jig
or apparatus to prevent the Thermistors on the
boards from mechanical damage.
Prohibited dividing Recommended dividing
9. Mechanical Impact
(1) The Thermistors shall be free from any excessive
mechanical impact.
The Thermistor body is made of ceramics and
may be damaged or cracked if dropped.
Never use a Thermistor which has been
dropped; their quality may be impaired and
failure rate increased.
(2) When handling PC boards with Thermistors
mounted on them, do not allow the Thermistors
to collide with another PC board.
When mounted PC boards are handled or stored
in a stacked state, impact between the corner
of a PC board and the Thermistor may cause
damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the
Thermistor.
■ Other
The various precautions described above are typical.
For special mounting conditions, please contact us.
Sep. 201000
15
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Panasonic:
ERT-J0EV224H ERT-J0EV334H ERT-J0EV474H ERT-JZEG103HA ERT-JZEP473H ERT-JZET202H ERT-
JZET302H