© Semiconductor Components Industries, LLC, 2015
April, 2020 − Rev. 5 1Publication Order Number:
FS8M/D
8 A Standard Recovery
Surface Mount Rectifiers
FS8G - FS8M
Description
The FS8G to FS8M series offers breakthrough size and
performance. It sinks 8 A DC forward current and provides up to
230 A surge current capability with only 0.37 mA reverse leakage
current. All this capability is packed into a small, flat−lead, TO−277
package, optimized for space−constrained applications.
Features
•Very High forward Surge Capability: IFSM = 230 A
•Low Leakage Current: 0.37 mA at TA = 25°C
•Very Low Profile: Typical Height of 1.1 mm
•Glass Passivated Junction
•HBM (JEDEC A114) > 8 KV; CDM (JEDEC C101C) > 2 KV
•Green Molding Compound as per IEC61249 Standard
•With DAP Option Only
•These Devices are Pb−Free, Halogen Free Free and are RoHS
Compliant
Applications
•General−Purpose Applications
•Reverse Polarity Protection
•Rectifications
www.onsemi.com
MARKING DIAGRAM
$Y = ON Semiconductor Logo
&Z = Assembly Plant Code
&3 = Date Code (Year & Week)
* = Specific Device Code
FS8G, FS8J, FS8K, FS8M
ORDERING INFORMATION
See detailed ordering and shipping information on page 3 o
f
this data sheet.
Rectifier
3
Cathode
Anode 1
$Y&Z&3
*
Anode 2
2
1
3
TO−277−3LD
CASE 340BQ
FS8G − FS8M
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2
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
°
C unless otherwise noted)
Symbol Rating
Value
Unit
FS8G
FS8J
FS8K
FS8M
VRRM Maximum Repetitive Peak Reverse Voltage
400
600
800
1000
V
VRMS Maximum RMS Reverse Voltage
280
420
560
700
V
VDC DC Blocking Voltage
400
600
800
1000
V
I
F(AV)
Maximum Average Rectified Forward Current
8
A
I
FSM
Peak Forward Surge Current: 8.3 ms Single Half
Sine−Wave Superimposed on Rated Load
230
A
T
J
Operating Junction Temperature Range
−55 to +150
°
C
T
STG
Storage Temperature Range
−55 to +150
°
C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
THERMAL CHARACTERISTICS (T
A
= 25
°
C unless otherwise noted) (Note 1)
Symbol
Minimum
Land Pattern
Maximum
Land Pattern
Unit
R
qJA
100
40
°
C/W
ΨJL
20
12
°C/W
6
5
1. The thermal resistances (RqJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1
and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2).
Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.
F
S
F
S
F
S
Figure 1. Minimum Land Pattern of 2 oz Copper Figure 2. Maximum Land Pattern of 2 oz Copper
F
S
F
S
ELECTRICAL CHARACTERISTICS (T
A
= 25
°
C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF Forward Voltage IF = 8 A
−
0.951 1.1 V
I
F
= 8 A, T
A
= 125
°
C
0.845
IR DC Reverse Current VR = VDC
−
0.37 5 mA
V
R
= V
DC,
T
A
= 125
°
C
84
T
rr
Reverse Recovery Time
I
F
= 0.5 A, I
R
= 1 A, I
rr
= 0.25 A
3.37
m
s
C
J
Junction Capacitance
V
R
= 0 V, f = 1 MHz
118
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
FS8G − FS8M
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3
ORDERING INFORMATION
Part Number
Top Mark
Package
Shipping†
FS8G
FS8G
TO−277 3L
(No DAP Option)
(Pb−Free/Halogen Free
)
5000 / Tape & Reel
FS8J
FS8J
TO−277 3L
(No DAP Option)
(Pb−Free/Halogen Free
)
5000 / Tape & Reel
FS8K
FS8K
TO−277 3L
(No DAP Option)
(Pb−Free/Halogen Free
)
5000 / Tape & Reel
FS8M
FS8M
TO−277 3L
(No DAP Option)
(Pb−Free/Halogen Free
)
5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
FS8G − FS8M
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4
TYPICAL PERFORMANCE CHARACTERISTICS
VF, Forward Voltage (V)
IF, Forward Current (A)
0.5 0.6 0.7 0.8 0.9
Figure 3. Forward Current Derating Curve
Ambient / Lead Temperature (5C)
IF, Average Forward Current (A)
0 25 50 75 100 125 150
0
1
2
3
4
5
6
7
8
9
TA (3 cm x 3 cm Pad)
TL (Cathode, Min. Pad)
TA (Min. Pad)
175
0 100 200 300 400 500 600 700 800
VR, Reverse Voltage (V)
IR, Reverse Current (mA)
VR, Reverse Voltage (V)
CJ, Junction Capacitance (pF)
Figure 4. Typical Junction Capacitance
Figure 5. Typical Reverse Characteristics Figure 6. Typical Forward Characteristics
0.1 1 10 100
10
100
1000
1E−3
0.01
0.1
1
10
100
1000
TA = −55°C
TA = 75°C
TA = 25°C
TA = 125°C
TA = 150°C
900 1000 1
10
TA = 150°C
TA = −55°C
TA = 125°C
TA = 25°C
TA = 75°C
1.0 1.1 1.2
1 10 100
0
50
100
150
200
250
300
Figure 7. Maximum Non−Repetitive Peak
Forward Surge Current
Number of Cycles
Peak Forward Surge Current (A)
Figure 8. Typical Non−Repetitive Forward Surge
Current
100
1000
10000
10 100 1000 10000
Tp, Square Waveform Pulse Duration (ms)
IFSM, Non−Repetitive Forward
Surge Current (A)
NOTE: Typical performance bases on a limited sample
size, not guarantee rating.
TO−277−3LD
CASE 340BQ
ISSUE O
DATE 30 SEP 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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TO−277−3LD
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1
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