CY74FCT16240ATPACT - Texas Instruments

16-Bit Buffers/Line Drivers

CY74FCT16240T

CY74FCT162240T

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modiﬁed to remove devices not offered.

SCCS027B - August 1994 - Revised September 2001

1CY74FCT162240T

Features

•I

off supports partial-power-down mode operation

• Edge-rate control circuitry for signiﬁcantly improved

noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)

packages

• Industrial temperature range of –40˚C to +85˚C

•VCC = 5V ± 10%

CY74FCT16240T Features:

• 64 mA sink current, 32 mA source current

• Typical VOLP (ground bounce)

<1.0V at VCC = 5V, TA = 25˚C

CY74FCT162240T Features:

• Balanced output drivers: 24 mA

• Reduced system switching noise

• Typical VOLP (ground bounce)

<0.6V at VCC = 5V, TA= 25˚C

Functional Description

These 16-bit buffer/line drivers are used in memory driver,

clock driver, or other bus interface applications, where high

speed and low power are required. With ﬂow-through pinout

and small shrink packaging, board layout is simpliﬁed. The

three-state controls are designed to allow 4-, 8-, or 16-bit

operation.

This device is fully speciﬁed for partial-power-down

applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backﬂow through the device

when it is powered down.

The CY74FCT16240T is ideally suited for driving

high-capacitance loads and low-impedance backplanes.

The CY74FCT162240T has 24-mA balanced output drivers

with current limiting resistors in the outputs. This reduces the

need for external terminating resistors and provides for mini-

mal undershoot and reduced ground bounce. The

CY74FCT162240T is ideal for driving transmission lines.

GND

Logic Block Diagrams Pin Configuration

1OE

SSOP/TSSOP

Top View

FCT16240–1

1Y1

1Y2

1Y3

1Y4

1A1

1A2

1A3

1A4

1OE

FCT16240–2

2Y1

2Y2

2Y3

2Y4

2A1

2A2

2A3

2A4

2OE

1Y1

1Y2

1Y3

1Y4

1A1

1A2

1A3

1A4

2OE

GND

VCC

2Y3

2Y4

2Y1

2Y2

2A1

2A2

2A3

2A4

VCC

GND

3Y3

3Y4

3Y1

3Y2

3A1

3A2

3A3

3A4

GND

VCC

4Y3

4Y4

4Y1

4Y2

4A1

4A2

4A3

4A4

VCC

GND

3OE

4OE

FCT16240–3

3Y1

3Y2

3Y3

3Y4

3A1

3A2

3A3

3A4

3OE

FCT16240–4

4Y1

4Y2

4Y3

4Y4

4A1

4A2

4A3

4A4

4OE

FCT16240–5

CY74FCT16240T

CY74FCT162240T

Maximum Ratings[2, 3]

(Above which the useful life may be impaired. For user

guidelines, not tested.)

Storage Temperature ......................Com’l.–55°C to +125°C

Ambient Temperature with

Power Applied..................................Com’l.–55°C to +125°C

DC Input Voltage ........................................... –0.5V to +7.0V

DC Output Voltage......................................... –0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin) ........................–60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage

(per MIL-STD-883, Method 3015) .............................>2001V

Pin Summary

Name Description

OE Three-State Output Enable Inputs (Active LOW)

A Data Inputs

Y Three-State Outputs

Function Table[1]

Inputs Outputs

OE A Y

L L H

L H L

H X Z Operating Range

Range Ambient Temperature VCC

Industrial –40°C to +85°C 5V ± 10%

Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions Min. Typ.[4] Max. Unit

VIH Input HIGH Voltage 2.0 V

VIL Input LOW Voltage 0.8 V

VHInput Hysteresis[5] 100 mV

VIK Input Clamp Diode Voltage VCC = Min., IIN= –18 mA –0.7 –1.2 V

IIH Input HIGH Current VCC = Max., VI= VCC ±1µA

IIL Input LOW Current VCC = Max., VI= GND ±1µA

IOZH High Impedance Output Current

(Three-State Output pins) VCC = Max., VOUT = 2.7V ±1µA

IOZL High Impedance Output Current

(Three-State Output pins) VCC = Max., VOUT = 0.5V ±1µA

IOS Short Circuit Current[6] VCC = Max., VOUT = GND –80 –140 –200 mA

IOOutput Drive Current[6] VCC = Max., VOUT = 2.5V –50 –180 mA

IOFF Power-Off Disable VCC = 0V, VOUT ≤4.5V[7] ±1µA

Output Drive Characteristics for CY74FCT16240T

Parameter Description Test Conditions Min. Typ.[4] Max. Unit

VOH Output HIGH Voltage VCC = Min., IOH= –3 mA 2.5 3.5 V

VCC = Min., IOH= –15 mA 2.4 3.5 V

VCC = Min., IOH= –32 mA 2.0 3.0 V

VOL Output LOW Voltage VCC = Min., IOL= 64 mA 0.2 0.55 V

Notes:

1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.

2. Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range.

3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.

4. Typical values are at VCC=5.0V, TA= +25˚C ambient.

5. This parameter is speciﬁed but not tested.

6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample

and hold techniques are preferable in order to minimize internal chip heating and more accurately reﬂect operational values. Otherwise prolonged shorting

of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter

tests, IOS tests should be performed last.

7. Tested at +25˚C.

CY74FCT16240T

CY74FCT162240T

Output Drive Characteristics for CY74FCT162240T

Parameter Description Test Conditions Min. Typ.[4] Max. Unit

IODL Output LOW Current[6] VCC = 5V, VIN = VIH or VIL,VOUT = 1.5V 60 115 150 mA

IODH Output HIGH Current[6] VCC = 5V, VIN = VIH or VIL, VOUT = 1.5V –60 –115 –150 mA

VOH Output HIGH Voltage VCC = Min., IOH = –24 mA 2.4 3.3 V

VOL Output LOW Voltage VCC = Min., IOL = 24 mA 0.3 0.55 V

Capacitance[5] (TA = +25˚C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.[4] Max. Unit

CIN Input Capacitance VIN = 0V 4.5 6.0 pF

COUT Output Capacitance VOUT = 0V 5.5 8.0 pF

Power Supply Characteristics

Parameter Description Test Conditions Typ.[4] Max. Unit

ICC QuiescentPowerSupplyCurrent VCC=Max. VIN≤0.2V,

VIN≥VCC–0.2V 5 500 µA

∆ICC QuiescentPowerSupplyCurrent

(TTL inputs HIGH) VCC=Max. VIN=3.4V[8] 0.5 1.5 mA

ICCD Dynamic Power Supply

Current[9] VCC=Max., One Input Tog-

gling, 50% Duty Cycle, Out-

puts Open, OE=GND

VIN=VCC or

VIN=GND 60 100 µA/MHz

ICTotal Power Supply Current[10] VCC=Max., f1=10 MHz, 50%

Duty Cycle, Outputs Open,

One Bit Toggling, OE=GND

VIN=VCC or

VIN=GND 0.6 1.5 mA

VIN=3.4V or

VIN=GND 0.9 2.3 mA

VCC=Max., f1=2.5 MHz, 50%

Duty Cycle, Outputs Open,

Sixteen Bits Toggling,

OE=GND

VIN=VCC or

VIN=GND 2.4 4.5[11] mA

VIN=3.4V or

VIN=GND 6.4 16.5[11] mA

Notes:

8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.

9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

10. IC=I

QUIESCENT + IINPUTS + IDYNAMIC

IC=I

CC+∆ICCDHNT+ICCD(f0/2 + f1N1)

ICC = Quiescent Current with CMOS input levels

∆ICC= Power Supply Current for a TTL HIGH input (VIN=3.4V)

DH= Duty Cycle for TTL inputs HIGH

NT= Number of TTL inputs at DH

ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)

f0= Clock frequency for registered devices, otherwise zero

f1= Input signal frequency

N1= Number of inputs changing at f1

All currents are in milliamps and all frequencies are in megahertz.

11. Values for these conditions are examples of the ICC formula. These limits are speciﬁed but not tested.

CY74FCT16240T

CY74FCT162240T

Switching Characteristics Over the Operating Range[12]

Document #: 38-00395-C

CY74FCT16240AT CY74FCT162240CT Fig.

No.[13]

Parameter Description Min. Max. Min. Max. Unit

tPLH

tPHL Propagation Delay Data to Output 1.5 4.8 1.5 4.3 ns 1, 2

tPZH

tPZL Output Enable Time 1.5 6.2 1.5 5.8 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time 1.5 5.6 1.5 5.2 ns 1, 7, 8

tSK(O) Output Skew[14] 0.5 0.5 ns —

Note:

12. Minimum limits are speciﬁed but not tested on Propagation Delays.

13. See “Parameter Measurement Information” in the General Information section.

14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.

Ordering Information CY74FCT16240

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

4.8 CY74FCT16240ATPVC/PVCT O48 48-Lead (300-Mil) SSOP Industrial

Ordering Information CY74FCT162240

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

4.3 74FCT162240CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial

CY74FCT162240CTPVC O48 48-Lead (300-Mil) SSOP

74FCT162240CTPVCT O48 48-Lead (300-Mil) SSOP

CY74FCT16240T

CY74FCT162240T

Package Diagrams

48-Lead Shrunk Small Outline Package O48

CY74FCT16240T

CY74FCT162240T

Package Diagrams

48-Lead Thin Shrunk Small Outline Package

PACKAGE OPTION ADDENDUM

www.ti.com 7-Jun-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

74FCT162240ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples

74FCT162240CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162240CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162240CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT162240ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

74FCT162240ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available

74FCT16240ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16240ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16240ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

74FCT16240ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162240CTPVC ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT162240ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available

CY74FCT162240ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available

CY74FCT16240ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16240ATPVC ACTIVE SSOP DL 48 25 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16240ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

CY74FCT16240ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available

CY74FCT16240ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available

FCT162240ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples

PACKAGE OPTION ADDENDUM

www.ti.com 7-Jun-2010

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

FCT162240ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples

FCT162240CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

FCT162240CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

FCT162240CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

74FCT162240ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

74FCT162240CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

74FCT162240CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1

CY74FCT16240ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1

CY74FCT16240ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

74FCT162240ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0

74FCT162240CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0

74FCT162240CTPVCT SSOP DL 48 1000 367.0 367.0 55.0

CY74FCT16240ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0

CY74FCT16240ATPVCT SSOP DL 48 1000 367.0 367.0 55.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040048/E 12/01

48 PINS SHOWN

0.730

(18,54)

0.720

(18,29)

4828

0.370

(9,40)

(9,65)

0.380

Gage Plane

DIM

0.420 (10,67)

0.395 (10,03)

A MIN

A MAX

0.010 (0,25)

PINS **

0.630

(16,00)

(15,75)

0.620

0.010 (0,25)

Seating Plane

0.020 (0,51)

0.040 (1,02)

0.008 (0,203)

0.0135 (0,343)

0.008 (0,20) MIN

0.110 (2,79) MAX

0.299 (7,59)

0.291 (7,39)

0.004 (0,10)

0.005 (0,13)

0.025 (0,635)

0°–ā8°

0.005 (0,13)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).

D. Falls within JEDEC MO-118

MECHANICAL DATA

MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040078/F 12/97

48 PINS SHOWN

0,25

0,15 NOM

Gage Plane

6,00

6,20 8,30

7,90

0,75

0,50

Seating Plane

0,27

0,17

1,20 MAX

0,08

0,10

0,50

0°–8°

14,10

13,90

DIM

A MAX

A MIN

PINS **

12,40

12,60

17,10

16,90

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

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