LIFCL-17-8SG72I - LATTICE SEMICONDUCTOR

CrossLink-NX Family

Preliminary Data Sheet

FPGA-DS-02049-0.83

November 2020

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

2 FPGA-DS-02049-0.83

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document is proprietary to Lattice Semiconductor, and Lattice reserves the right to make any changes to the information in this document or to any

products at any time without notice.

  CrossLink-NX Family 
 Preliminary Data Sheet 
 
© 2020 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. 
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
FPGA-DS-02049-0.83    3 
Contents 
Acronyms in This Document ............................................................................................................................................... 10 
General Description .................................................................................................................................................... 11 
1. Features ............................................................................................................................................................ 11 
Architecture ................................................................................................................................................................ 14 
1. Overview ........................................................................................................................................................... 14 
2. PFU Blocks ......................................................................................................................................................... 16 
2.1. Slice ............................................................................................................................................................... 16 
2.2. Modes of Operation ...................................................................................................................................... 19 
2.2.1. Logic Mode ........................................................................................................................................... 19 
2.2.2. Ripple Mode ......................................................................................................................................... 19 
2.2.3. RAM Mode ........................................................................................................................................... 19 
2.2.4. ROM Mode ........................................................................................................................................... 19 
3. Routing .............................................................................................................................................................. 20 
3.1. Clocking Structure ......................................................................................................................................... 20 
3.2. Global PLL ..................................................................................................................................................... 20 
3.3. Clock Distribution Network ........................................................................................................................... 21 
3.4. Primary Clocks .............................................................................................................................................. 22 
3.5. Edge Clock ..................................................................................................................................................... 23 
3.6. Clock Dividers ................................................................................................................................................ 23 
3.7. Clock Center Multiplexor Blocks ................................................................................................................... 24 
3.8. Dynamic Clock Select .................................................................................................................................... 24 
3.9. Dynamic Clock Control .................................................................................................................................. 25 
3.10. DDRDLL ..................................................................................................................................................... 25 
4. SGMII Clock Data Recovery (CDR) ..................................................................................................................... 26 
5. sysMEM Memory .............................................................................................................................................. 27 
5.1. sysMEM Memory Block ................................................................................................................................ 27 
5.2. Bus Size Matching ......................................................................................................................................... 28 
5.3. RAM Initialization and ROM Operation ........................................................................................................ 28 
5.4. Memory Cascading ....................................................................................................................................... 28 
5.5. Single, Dual and Pseudo-Dual Port Modes ................................................................................................... 28 
5.6. Memory Output Reset .................................................................................................................................. 28 
6. Large RAM ......................................................................................................................................................... 29 
7. sysDSP ............................................................................................................................................................... 29 
7.1. sysDSP Approach Compared to General DSP ................................................................................................ 29 
7.2. sysDSP Architecture Features ....................................................................................................................... 30 
8. Programmable I/O (PIO) .................................................................................................................................... 32 
9. Programmable I/O Cell (PIC) ............................................................................................................................. 32 
9.1. Input Register Block ...................................................................................................................................... 34 
9.2.1. Input FIFO ............................................................................................................................................. 34 
9.2. Output Register Block ................................................................................................................................... 35 
10. Tristate Register Block ....................................................................................................................................... 36 
11. DDR Memory Support ....................................................................................................................................... 37 
11.1. DQS Grouping for DDR Memory ............................................................................................................... 37 
11.2. DLL Calibrated DQS Delay and Control Block (DQSBUF) ........................................................................... 38 
12. sysI/O Buffer...................................................................................................................................................... 40 
12.1. Supported sysI/O Standards ..................................................................................................................... 40 
12.2. sysI/O Banking Scheme ............................................................................................................................ 41 
12.2.1. Typical sysI/O I/O Behavior During Power-up ...................................................................................... 42 
12.2.2. VREF1 and VREF2 ................................................................................................................................. 42 
12.2.3. SysI/O Standards Supported by I/O Bank ............................................................................................ 42 
12.2.4. Hot Socketing ....................................................................................................................................... 43 
12.3. sysI/O Buffer Configurations .................................................................................................................... 43 

CrossLink-NX Family   
Preliminary Data Sheet 
 
© 2020 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. 
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
  FPGA-DS-02049-0.83 
13. Analog Interface ................................................................................................................................................ 44 
13.1. Analog to Digital Converters ..................................................................................................................... 44 
13.2. Continuous Time Comparators ................................................................................................................. 44 
13.3. Internal Junction Temperature Monitoring Diode ................................................................................... 44 
14. IEEE 1149.1-Compliant Boundary Scan Testability ............................................................................................ 44 
15. Device Configuration ......................................................................................................................................... 44 
15.1. Enhanced Configuration Options.............................................................................................................. 45 
15.2.1. Dual-Boot and Multi-Boot Image Support ........................................................................................... 45 
16. Single Event Upset (SEU) Support ..................................................................................................................... 46 
17. On-Chip Oscillator ............................................................................................................................................. 46 
18. User I²C IP .......................................................................................................................................................... 46 
19. Density Shifting ................................................................................................................................................. 47 
20. MIPI D-PHY Blocks ............................................................................................................................................. 47 
21. Peripheral Component Interconnect Express (PCIe) ......................................................................................... 47 
22. Cryptographic Engine ........................................................................................................................................ 49 
DC and Switching Characteristics ................................................................................................................................ 50 
1. Absolute Maximum Ratings .............................................................................................................................. 50 
2. Recommended Operating Conditions1, 2, 3 ......................................................................................................... 51 
3. Power Supply Ramp Rates ................................................................................................................................. 52 
4. Power up Sequence ........................................................................................................................................... 52 
5. On-Chip Programmable Termination ................................................................................................................ 52 
6. Hot Socketing Specifications ............................................................................................................................. 53 
7. ESD Performance ............................................................................................................................................... 53 
8. DC Electrical Characteristics .............................................................................................................................. 54 
9. Supply Currents ................................................................................................................................................. 55 
10. sysI/O Recommended Operating Conditions .................................................................................................... 56 
11. sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 57 
12. sysI/O Differential DC Electrical Characteristics ................................................................................................ 59 
12.1. LVDS .......................................................................................................................................................... 59 
12.2. LVDS25E (Output Only) ............................................................................................................................. 60 
12.3. SubLVDS (Input Only)................................................................................................................................ 61 
12.4. SubLVDSE/SubLVDSEH (Output Only)....................................................................................................... 61 
12.5. SLVS .......................................................................................................................................................... 62 
12.6. Soft MIPI D-PHY ........................................................................................................................................ 63 
12.7. Differential HSTL15D (Output Only) ......................................................................................................... 66 
12.8. Differential SSTL135D, SSTL15D (Output Only) ........................................................................................ 66 
12.9. Differential HSUL12D (Output Only) ......................................................................................................... 66 
12.10. Differential LVCMOS25D, LVCMOS33D, LVTTL33D (Output Only) ........................................................... 66 
13. CrossLink-NX Maximum sysI/O Buffer Speed .................................................................................................... 67 
14. Typical Building Block Function Performance ................................................................................................... 69 
15. Derating Timing Tables ...................................................................................................................................... 70 
16. CrossLink-NX External Switching Characteristics .............................................................................................. 70 
17. CrossLink-NX sysCLOCK PLL Timing (VCC = 1.0 V) ............................................................................................... 79 
18. CrossLink-NX Internal Oscillators Characteristics .............................................................................................. 80 
19. CrossLink-NX User I2C Characteristics ............................................................................................................... 80 
20. CrossLink-NX Analog-Digital Converter (ADC) Block Characteristics ................................................................. 81 
21. CrossLink-NX Comparator Block Characteristics ............................................................................................... 82 
22. CrossLink-NX Digital Temperature Readout Characteristics ............................................................................. 82 
23. CrossLink-NX Hardened MIPI D-PHY Characteristics ......................................................................................... 82 
24. CrossLink-NX Hardened PCIe Characteristics .................................................................................................... 86 
24.1. PCIe (2.5 Gb/s) .......................................................................................................................................... 86 
24.2. PCIe (5 Gb/s) ............................................................................................................................................. 88 
25. CrossLink-NX Hardened SGMII Receiver Characteristics ................................................................................... 89 
25.1. SGMII Rx Specifications ............................................................................................................................ 89 

  CrossLink-NX Family 
 Preliminary Data Sheet 
 
© 2020 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. 
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
FPGA-DS-02049-0.83    5 
3.26. CrossLink-NX sysCONFIG Port Timing Specifications ........................................................................................ 90 
3.27. JTAG Port Timing Specifications ........................................................................................................................ 96 
3.28. Switching Test Conditions ................................................................................................................................. 97 
4. Pinout Information ..................................................................................................................................................... 98 
4.1. Signal Descriptions* ........................................................................................................................................... 98 
4.2. Pin Information Summary ............................................................................................................................... 104 
4.2.1. CrossLink-NX Family .................................................................................................................................... 104 
5. Ordering Information ............................................................................................................................................... 107 
5.1. CrossLink-NX Part Number Description .......................................................................................................... 107 
5.2. Ordering Part Numbers ................................................................................................................................... 108 
5.2.1. Commercial ................................................................................................................................................. 108 
5.2.2. Industrial ..................................................................................................................................................... 108 
Supplemental Information ............................................................................................................................................... 110 
For Further Information ................................................................................................................................................ 110 
Revision History ................................................................................................................................................................ 111 

CrossLink-NX Family   
Preliminary Data Sheet 
 
© 2020 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. 
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
6    FPGA-DS-02049-0.83 
Figures 
Figure 2.1. Simplified Block Diagram, CrossLink-NX-40 Device (Top Level) ........................................................................ 15 
Figure 2.2. Simplified Block Diagram, CrossLink-NX-17 Device (Top Level) ........................................................................ 15 
Figure 2.3. PFU Diagram ..................................................................................................................................................... 16 
Figure 2.4. Slice Diagram .................................................................................................................................................... 17 
Figure 2.5. Slice configuration for LUT4 and LUT5 .............................................................................................................. 18 
Figure 2.6. General Purpose PLL Diagram ........................................................................................................................... 21 
Figure 2.7. Clocking ............................................................................................................................................................. 22 
Figure 2.8. Edge Clock Sources per Bank ............................................................................................................................ 23 
Figure 2.9. DCS_CMUX Diagram ......................................................................................................................................... 24 
Figure 2.10. DCS Waveforms .............................................................................................................................................. 25 
Figure 2.11. DLLDEL Functional Diagram ............................................................................................................................ 26 
Figure 2.12. CrossLink-NX DDRDLL Architecture ................................................................................................................ 26 
Figure 2.13. SGMII CDR IP ................................................................................................................................................... 27 
Figure 2.14. Memory Core Reset ........................................................................................................................................ 29 
Figure 2.15. Comparison of General DSP and CrossLink-NX Approaches ........................................................................... 30 
Figure 2.16. CrossLink-NX DSP Functional Block Diagram .................................................................................................. 31 
Figure 2.17. Group of Two High Performance Programmable I/O Cells ............................................................................. 33 
Figure 2.18. Wide Range Programmable I/O Cells .............................................................................................................. 33 
Figure 2.19. Input Register Block for PIO on Top, Left, and Right Sides of the Device ....................................................... 34 
Figure 2.20. Input Register Block for PIO on Bottom Side of the Device ............................................................................ 35 
Figure 2.21. Output Register Block on Top, Left, and Right Sides ...................................................................................... 35 
Figure 2.22. Output Register Block on Bottom Side ........................................................................................................... 36 
Figure 2.23. Tristate Register Block on Top, Left, and Right Sides ...................................................................................... 36 
Figure 2.24. Tristate Register Block on Bottom Side .......................................................................................................... 37 
Figure 2.25. DQS Grouping on the Bottom Edge ................................................................................................................ 38 
Figure 2.26. DQS Control and Delay Block (DQSBUF) ......................................................................................................... 39 
Figure 2.27. sysI/O Banking ................................................................................................................................................ 42 
Figure 2.28. PCIe Core ......................................................................................................................................................... 48 
Figure 2.29. PCIe Soft IP Wrapper....................................................................................................................................... 48 
Figure 2.30. Cryptographic Engine Block Diagram .............................................................................................................. 49 
Figure 3.1. On-Chip Termination ........................................................................................................................................ 52 
Figure 3.2. LVDS25E Output Termination Example ............................................................................................................ 60 
Figure 3.3. SubLVDS Input Interface ................................................................................................................................... 61 
Figure 3.4. SubLVDS Output Interface ................................................................................................................................ 61 
Figure 3.5. SLVS Interface ................................................................................................................................................... 62 
Figure 3.6. MIPI Interface ................................................................................................................................................... 63 
Figure 3.7. Receiver RX.CLK.Centered Waveforms ............................................................................................................. 76 
Figure 3.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms ......................................................................... 76 
Figure 3.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms ................................................................... 77 
Figure 3.10. Transmit TX.CLK.Aligned Waveforms .............................................................................................................. 77 
Figure 3.11. DDRX71 Video Timing Waveforms .................................................................................................................. 78 
Figure 3.12. Receiver DDRX71_RX Waveforms ................................................................................................................... 78 
Figure 3.13. Transmitter DDRX71_TX Waveforms .............................................................................................................. 79 
Figure 3.14. Master SPI POR/REFRESH Timing .................................................................................................................... 91 
Figure 3.15. Slave SPI/I2C/I3C POR/REFRESH Timing .......................................................................................................... 92 
Figure 3.16. Master SPI PROGRAMN Timing ...................................................................................................................... 92 
Figure 3.17. Slave SPI/I2C/I3C PROGRAMN Timing ............................................................................................................. 93 
Figure 3.18. Master SPI Configuration Timing .................................................................................................................... 93 
Figure 3.19. Slave SPI Configuration Timing ....................................................................................................................... 94 
Figure 3.20. I2C /I3C Configuration Timing ......................................................................................................................... 94 
Figure 3.21. Master SPI Wake-Up Timing ........................................................................................................................... 95 
Figure 3.22. Slave SPI/I2C/I3C Wake-Up Timing .................................................................................................................. 95 

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 7

Figure 3.23. JTAG Port Timing Waveforms ......................................................................................................................... 96

Figure 3.24. Output Test Load, LVTTL and LVCMOS Standards .......................................................................................... 97

CrossLink-NX Family   
Preliminary Data Sheet 
 
© 2020 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. 
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
8    FPGA-DS-02049-0.83 
Tables 
Table 1.1. CrossLink-NX Family Selection Guide ................................................................................................................. 13 
Table 2.1. Resources and Modes Available per Slice .......................................................................................................... 16 
Table 2.2. Slice Signal Descriptions ..................................................................................................................................... 18 
Table 2.3. Number of Slices Required to Implement Distributed RAM .............................................................................. 19 
Table 2.4. sysMEM Block Configurations ............................................................................................................................ 28 
Table 2.5. Maximum Number of Elements in a sysDSP block ............................................................................................. 32 
Table 2.6. Input Block Port Description .............................................................................................................................. 34 
Table 2.7. Output Block Port Description ........................................................................................................................... 36 
Table 2.8. Tristate Block Port Description .......................................................................................................................... 37 
Table 2.9. DQSBUF Port List Description ............................................................................................................................. 39 
Table 2.10. Single-Ended I/O Standards ............................................................................................................................. 40 
Table 2.11. Differential I/O Standards ................................................................................................................................ 41 
Table 2.12. Single-Ended I/O Standards Supported on Various Sides ................................................................................ 43 
Table 2.13. Differential I/O Standards Supported on Various Sides ................................................................................... 43 
Table 3.1. Absolute Maximum Ratings ............................................................................................................................... 50 
Table 3.2. Recommended Operating Conditions ................................................................................................................ 51 
Table 3.3. Power Supply Ramp Rates ................................................................................................................................. 52 
Table 3.4. On-Chip Termination Options for Input Modes ................................................................................................. 52 
Table 3.5. Hot Socketing Specifications for GPIO ............................................................................................................... 53 
Table 3.6. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions) ................................ 54 
Table 3.7. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions) ................................. 54 
Table 3.8. Capacitors – Wide Range (Over Recommended Operating Conditions) ............................................................ 54 
Table 3.9. Capacitors – High Performance (Over Recommended Operating Conditions) .................................................. 55 
Table 3.10. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions) ........................... 55 
Table 3.11. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions) ................. 55 
Table 3.12. sysI/O Recommended Operating Conditions ................................................................................................... 56 
Table 3.13. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions) ............. 57 
Table 3.14. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions) ... 58 
Table 3.15. I/O Resistance Characteristics (Over Recommended Operating Conditions) .................................................. 58 
Table 3.16. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)1 ........................................... 59 
Table 3.17. LVDS25E DC Conditions .................................................................................................................................... 60 
Table 3.18. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions) ............................. 61 
Table 3.19. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions) .......................... 61 
Table 3.20. SLVS Input DC Characteristics (Over Recommended Operating Conditions) ................................................... 62 
Table 3.21. SLVS Output DC Characteristics (Over Recommended Operating Conditions) ................................................ 62 
Table 3.22. Soft D-PHY Input Timing and Levels ................................................................................................................. 64 
Table 3.23. Soft D-PHY Output Timing and Levels .............................................................................................................. 65 
Table 3.24. Soft D-PHY Clock Signal Specification ............................................................................................................... 65 
Table 3.25. Soft D-PHY Data-Clock Timing Specifications ................................................................................................... 66 
Table 3.26. CrossLink-NX Maximum I/O Buffer Speed1, 2, 3, 4, 7 ............................................................................................ 67 
Table 3.27. Pin-to-Pin Performance .................................................................................................................................... 69 
Table 3.28. Register-to-Register Performance.................................................................................................................... 69 
Table 3.29. CrossLink-NX External Switching Characteristics (VCC = 1.0 V) ......................................................................... 70 
Table 3.30. sysCLOCK PLL Timing (VCC = 1.0 V) .................................................................................................................... 79 
Table 3.31. Internal Oscillators (VCC = 1.0 V) ....................................................................................................................... 80 
Table 3.32. User I2C Specifications (VCC = 1.0 V) .................................................................................................................. 80 
Table 3.33. ADC Specifications ............................................................................................................................................ 81 
Table 3.34. Comparator Specifications ............................................................................................................................... 82 
Table 3.35. DTR Specifications ............................................................................................................................................ 82 
Table 3.36. Hardened D-PHY Input Timing and Levels ....................................................................................................... 82 
Table 3.37. Hardened D-PHY Output Timing and Levels ..................................................................................................... 84 
Table 3.38. Hardened D-PHY Pin Characteristic Specifications .......................................................................................... 85 

  CrossLink-NX Family 
 Preliminary Data Sheet 
 
© 2020 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. 
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
FPGA-DS-02049-0.83    9 
Table 3.39. Hardened D-PHY Clock Signal Specification ..................................................................................................... 85 
Table 3.40. Hardened D-PHY Data-Clock Timing Specifications ......................................................................................... 86 
Table 3.41. PCIe (2.5 Gb/s) ................................................................................................................................................. 86 
Table 3.42. PCIe (5 Gb/s) .................................................................................................................................................... 88 
Table 3.43. SGMII Rx ........................................................................................................................................................... 89 
Table 3.44. CrossLink-NX sysCONFIG Port Timing Specifications ....................................................................................... 90 
Table 3.45. JTAG Port Timing Specifications ....................................................................................................................... 96 
Table 3.46. Test Fixture Required Components, Non-Terminated Interfaces .................................................................... 97 
 

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

10 FPGA-DS-02049-0.83

Acronyms in This Document

A list of acronyms used in this document.

Acronym

Definition

BGA

Ball Grid Array

CDR

Clock and Data Recovery

CRC

Cycle Redundancy Code

DCC

Dynamic Clock Control

DCS

Dynamic Clock Select

DDR

Double Data Rate

DLL

Delay Locked Loops

DSP

Digital Signal Processing

EBR

Embedded Block RAM

ECC

Error Correction Coding

ECLK

Edge Clock

FFT

Fast Fourier Transforms

FIFO

First In First Out

FIR

Finite Impulse Response

Logic Cell

LRAM

Large RAM

LVCMOS

Low-Voltage Complementary Metal Oxide Semiconductor

LVDS

Low-Voltage Differential Signaling

LVPECL

Low Voltage Positive Emitter Coupled Logic

LVTTL

Low Voltage Transistor-Transistor Logic

LUT

Look Up Table

MLVDS

Multipoint Low-Voltage Differential Signaling

PCI

Peripheral Component Interconnect

PCS

Physical Coding Sublayer

PCLK

Primary Clock

PDPR

Pseudo Dual Port RAM

PFU

Programmable Functional Unit

PIC

Programmable I/O Cells

PLL

Phase Locked Loops

POR

Power On Reset

SCI

SERDES Client Interface

SER

Soft Error Rate

SEU

Single Event Upset

SLVS

Scalable Low-Voltage Signaling

SPI

Serial Peripheral Interface

SPR

Single Port RAM

SRAM

Static Random-Access Memory

TAP

Test Access Port

TDM

Time Division Multiplexing

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 11

1. General Description

CrossLink™-NX family of low-power FPGAs can be used

in a wide range of applications, and are optimized for

bridging and processing needs in Embedded Vision

applications – supporting a variety of high bandwidth

sensor and display interfaces, video processing and

machine learning inferencing. It is built on Lattice

Nexus FPGA platform, using low-power 28 nm FD-SOI

technology. It combines the extreme flexibility of an

FPGA with the low power and high reliability (due to

extremely low SER) of FD-SOI technology, and offers

small footprint package options.

CrossLink-NX supports a variety of interfaces including

MIPI D-PHY (CSI-2, DSI), LVDS, SLVS, subLVDS, PCI

Express (Gen1, Gen2), SGMII (Gigabit Ethernet), and

more.

Processing features of CrossLink-NX include up to 39K

Logic Cells, 56 18x18 multipliers, 2.9 Mb of embedded

memory (consisting of EBR and LRAM blocks),

distributed memory, DRAM interfaces (supporting

DDR3, DDR3L, LPDDR2, and LPDDR3 up to 1066 Mbps x

16 data width).

CrossLink-NX FPGAs support fast configuration of its

reconfigurable SRAM-based logic fabric, and ultra-fast

configuration (in under 3 ms) of its programmable

sysI/O™. Security features to secure user designs

include bitstream encryption and password protection.

In addition to the high reliability inherent to FD-SOI

technology (due to its extremely low SER), active

reliability features such as built-in frame-based

SED/SEC (for SRAM-based logic fabric), and ECC (for

EBR and LRAM) are also supported. Built-in ADC is

available in each device for system monitoring

functions.

Lattice Radiant® design software allows large complex

user designs to be efficiently implemented on

CrossLink-NX FPGA family. Synthesis library support for

CrossLink-NX devices is available for popular logic

synthesis tools. Radiant tools use the synthesis tool

output along with constraints from its floor planning

tools, to place and route the user design in CrossLink-

NX device. The tools extract timing from the routing,

and back-annotate it into the design for timing

verification.

Lattice provides many pre-engineered IP (Intellectual

Property) modules for CrossLink-NX family. By using

these configurable soft IP cores as standardized blocks,

you are free to concentrate on the unique aspects of

your design, increasing your productivity.

1.1. Features

 Programmable Architecture

 17K to 39K logic cells

 24 to 56 18 x 18 multipliers (in sysDSP™

blocks)

 2.5 to 2.9 Mb of embedded memory blocks

(EBR, LRAM)

 36 to 192 programmable sysI/O (High

Performance and Wide Range I/O)

 MIPI D-PHY

 Up to two hardened 4-lane MIPI D-PHY

interfaces

 Up to 8 lanes total

 Transmit or receive

 Supports CSI-2, DSI

 20 Gbps aggregate bandwidth

 2.5Gbps per lane, 10 Gbps per D-PHY

interface

 Additional Soft D-PHY interfaces supported by

High Performance (HP) sysI/O

 Transmit or receive

 Supports CSI-2, DSI

 Up to 1.5 Gbps per lane

 Programmable sysI/O supports wide variety of

interfaces

 High Performance (HP) on bottom I/O dual

rank

 Supports up to 1.8 V VCCIO

 Mixed voltage support (1.0 V, 1.2 V, 1.5 V,

1.8 V)

 High-speed differential up to 1.5 Gbps

 Supports soft D-PHY (Tx/Rx), LVDS 7:1

(Tx/Rx), SLVS (Tx/Rx), subLVDS (Rx)

 Supports SGMII (Gb Ethernet) – 2

channels (Tx/Rx) at 1.25 Gbps

 Dedicated DDR3/DDR3L and

LPDDR2/LPDDR3 memory support with

DQS logic, up to 1066 Mbps data-rate and

x16 data-width

 Wide Range (WR) on Left, Right and Top I/O

Banks

 Supports up to 3.3 V VCCIO

 Mixed voltage support (1.2 V, 1.5 V, 1.8 V,

2.5 V, 3.3 V)

 Programmable slew rate (slow, med, fast)

 Controlled impedance mode

 Emulated LVDS support

 Hot-socketing

CrossLink-NX Family

Preliminary Data Sheet

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12 FPGA-DS-02049-0.83

 Power Modes – Low Power versus High-

Performance

 User selectable

 Low-Power mode for power and/or thermal

challenges

 High-Performance mode for faster processing

 Small footprint package options

 4 x 4 mm2 to 10 x 10 mm2 package options

 2x SGMII CDR at up to 1.25 Gbps – to support 2

channels SGMII using HP I/O

 CDR for RX

 8b/10b decoding

 Independent Loss of Lock (LOL) detector for

each CDR block

 sysCLOCK™ analog PLLs

 Three in 39K LC and two in 17K LC device

 Six outputs per PLL

 Fractional N

 Programmable and dynamic phase control

 sysDSP Enhanced DSP blocks

 Hardened pre-adder

 Dynamic Shift for AI/ML support

 Four 18 x 18, eight 9 x 9, two 18 x 36, or 36 x

 Advanced 18 x 36, two 18 x 18, or four 8 x 8

MAC

 Flexible memory resources

 Up to 1.5 Mb sysMEM™ Embedded Block RAM

(EBR)

 Programmable width

 ECC

 FIFO

 80k to 240k bits distributed RAM

 Large RAM Blocks

 0.5 Mbits per block

 Up to five blocks (2.5 Mb total) per device

 SERDES – PCIe Gen2 x1 channel (Tx/Rx) hard IP in

39K LC device

 Hard IP supports

 Gen1, Gen2, Multi-Function, End Point,

Root Complex

 APB control bus

 AHB-Lite for data bus

 Internal bus interface support

 APB control bus

 AHB-Lite for data bus

 AXI4-streaming

 Configuration – Fast, Secure

 SPI – x1, x2, x4 up to 150 MHz

 Master and Slave SPI support

 JTAG

 I2C and I3C

 Ultrafast I/O configuration for instant-on

support

 Less than 15 ms full device configuration for

LIFCL-40

 Bitstream Security

 Encryption

 Cryptographic engine

 Bitstream encryption – using AES-256

 Bitstream authentication – using ECDSA

 Hashing algorithms – SHA, HMAC

 True Random Number Generator

 AES 128/256 Encryption

 Single Event Upset (SEU) Mitigation Support

 Extremely low Soft Error Rate (SER) due to FD-

SOI technology

 Soft Error Detect – Embedded hard macro

 Soft Error Correction – Without stopping user

operation

 Soft Error Injection – Emulate SEU event to

debug system error handling

 ADC – 1 MSPS, 12-bit SAR

 2 ADCs per device

 3 Continuous-time Comparators

 Simultaneous sampling

 System Level Support

 IEEE 1149.1 and IEEE 1532 compliant

 Reveal Logic Analyzer

 On-chip oscillator for initialization and general

use

 1.0 V core power supply

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02049-0.83 13

Table 1.1. CrossLink-NX Family Selection Guide

CrossLink-NX Family:

Device

LIFCL-17

LIFCL-40

Logic Cells¹

17K

39K

Embedded Memory (EBR) Blocks (18 Kb)

Embedded Memory (EBR) Bits (Kb)

432

1,512

Distributed RAM Bits (Kb)

240

Large Memory (LRAM) Blocks

Large Memory (LRAM) Bits (Kb)

2560

1024

18 X 18 Multipliers

ADC Blocks

450 MHz High Frequency Oscillator

128 KHz Low Power Oscillator

GPLL

Hardened 10 Gbps D-PHY Quads²

Hardened 2.5 Gbps D-PHY Data Lanes (total)²

PCIe Gen2 Hard IP

—

Packages (Size, Ball Pitch)

D-PHY Quads (D-PHY Data Lanes) / Wide Range (WR) GPIOs

(Top/Left/Right Banks) / High Performance (HP) GPIOs (Bottom

Banks)

72 wlcsp (3.7 x 4.1 mm2, 0.4 mm)

1(4)/16/24

—

72 QFN (10 x 10 mm2, 0.5 mm)

1(4)/18/22

121 csfBGA (6 x 6 mm2, 0.5 mm)

2(8)/24/48

256 caBGA (14 x 14 mm2, 0.8 mm)

2(8)/30/48

2(8)/89/74, PCIe x1

289 csBGA (9.5 x 9.5 mm2, 0.5 mm)

—

2(8)/106/74, PCIe x1

400 caBGA (17 x 17 mm², 0.8 mm)

—

2(8)/118/74, PCIe x1

Notes:

1. Logic Cells = LUTs x 1.2 effectiveness.

2. Additional soft D-PHY Tx/Rx interfaces (at up to 1.5 Gbps per lane) are available using sysI/O.

CrossLink-NX Family

Preliminary Data Sheet

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14 FPGA-DS-02049-0.83

2. Architecture

2.1. Overview

Each CrossLink-NX device contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Interspersed

between the rows of logic blocks are rows of sysMEM Embedded Block RAM (EBR) and rows of sysDSP Digital Signal

Processing blocks, as shown in Figure 2.1. The CrossLink-NX-40 devices have two rows of DSP

blocks and contain three

rows of sysMEM EBR blocks. In addition, CrossLink-NX-40 devices includes two Large SRAM blocks. The sysMEM EBR

blocks are large, dedicated 18 Kb fast memory blocks and have built-in ECC and FIFO support. Each sysMEM block can

be configured to a single, pseudo dual or true dual port memory in a variety of depths and widths as RAM

or ROM.

Each DSP block supports variety of multiplier, adder configurations with one 108-bit or two 54-bit accumulators

supported, which are the building blocks for complex signal processing capabilities.

Each PIC block encompasses two PIO (PIO pairs) with their respective sysI/O buffers. The sysI/O buffers of the

CrossLink-NX devices are arranged in seven banks allowing the implementation of a wide variety of I/O standards. The

Wide Range (WR) I/O banks that are located in the top, left and right sides of the device provide flexible ranges of

general purpose I/O configurations up to 3.3 V VCCIOs. The banks located in the bottom side of the device are

dedicated to High Performance (HP) interfaces such as LVDS, MIPI, DDR3, LPDDR2, and LPDDR3 supporting up to 1.8 V

VCCIOs.

The Programmable Functional Unit (PFU) contains the building blocks for logic, arithmetic, RAM and ROM functions.

The PFU block is optimized for flexibility, allowing complex designs to be implemented quickly and efficiently.

Logic

Blocks are arranged in a two-dimensional array. The registers in PFU and sysI/O blocks in CrossLink-NX devices can be

configured to be SET or RESET. After power up and the

device is configured, it enters into user mode with these

registers SET/RESET according to the configuration setting, allowing the device entering to a known state for

predictable system function.

In addition, CrossLink-NX-40 devices provide various system level hard IP functional and interface blocks such as PCIe,

D-PHY, I2C, SGMII/CDR, and ADC blocks. PCIe hard IP supports PCIe 2.0 and D-PHY supports up to 2.5 Gbps per lane.

CrossLink-NX devices also provide security features to help secure user designs and deliver more robust reliability

features to the user designs by using enhanced frame-based SED/SEC functions.

Other blocks provided include PLLs, DLLs, and configuration functions. The PLL and DLL blocks are

located at the

corners of each device. CrossLink-NX devices also include Lattice Memory Mapped Interface (LMMI) which is a Lattice

standardized interface for simple read and write operations to support controlling internal IPs.

Every device in the family has a JTAG port. This family also provides an on-chip oscillator and soft error

detect

capability. The CrossLink-NX devices use 1.0 V as their core voltage.

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02049-0.83 15

PLL D-PHY (4 Lanes) D-PHY (4 Lanes) PCIe

OSC Configuration & Security

I/O Bank (Bank 0)

Large

RAM

ADC

(2Ch)

Large

RAM

I/O Bank

(Bank 1)

I/O Bank

(Bank 2)

I/O Bank (Bank 5) I/O Bank (Bank 4) I/O Bank (Bank 3) PLL

I/O Bank

(Bank 7)

I/O Bank

(Bank 6)

PLL

CDR

(2Ch)

Figure 2.1. Simplified Block Diagram, CrossLink-NX-40 Device (Top Level)

D-PHY (4 Lanes) D-PHY (4 Lanes)

OSC Configuration and Security

I/O Bank (Bank 0)

ADC

(2Ch)

I/O Bank

(Bank 1)

Large

RAM

I/O Bank (Bank 5) PLL

Large

RAM

Large

RAM

Large

RAM

Large

RAM

I/O Bank (Bank 4) I/O Bank (Bank 3)

PLL

CDR

(2Ch)

Figure 2.2. Simplified Block Diagram, CrossLink-NX-17 Device (Top Level)

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

16 FPGA-DS-02049-0.83

2.2. PFU Blocks

The core of the CrossLink-NX device consists of PFU blocks. Each PFU block consists of four interconnected

slices

numbered 0-3 as shown in Figure 2.3. Each slice contains two LUTs. All the interconnections to and from

PFU blocks are

from routing.

The PFU block can be used in Distributed RAM or ROM function, or used to perform Logic, Arithmetic, or ROM

functions. Table 2.1 shows the functions each slice can perform in either mode.

Slice 0

LUT4 &

CARRY

D D

Slice 1 Slice 2

From

Routing

Slice 3

D D D D

FF FF FF FF FF FF

Routing

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

Figure 2.3. PFU Diagram

2.2.1. Slice

Each slice contains two LUT4s feeding two registers. In Distributed SRAM mode, Slice 0 and Slice 1 are configured as

distributed memory, and Slice 2 is not available as it is used to support Slice 0 and Slice 1 while Slice 3 is available as

Logic or ROM. Table 2.1 shows the capability of the slices

along with the operation modes they enable. In addition,

each Slice contains logic that allows the LUTs to be combined to perform a LUT5 function. There is control logic to

perform set/reset functions (programmable as synchronous/ asynchronous), clock select, chip-select, and wider

RAM/ROM functions.

Table 2.1. Resources and Modes Available per Slice

Slice

PFU (Used in Distributed SRAM)

PFU (Not used as Distributed SRAM)

Resources

Modes

Resources

Modes

Slice 0

2 LUT4s and 2 Registers

RAM

2 LUT4s and 2 Registers

Logic, Ripple, ROM

Slice 1

2 LUT4s and 2 Registers

RAM

2 LUT4s and 2 Registers

Logic, Ripple, ROM

Slice 2

2 LUT4s and 2 Registers

RAM

2 LUT4s and 2 Registers

Logic, Ripple, ROM

Slice 3

2 LUT4s and 2 Registers

Logic, Ripple, ROM

2 LUT4s and 2 Registers

Logic, Ripple, ROM

Figure 2.4 shows an overview of the internal logic of the slice. The registers in the slice can be configured for

positive/negative edge trigger.

Each slice has 17 input signals: 16 signals from routing and one from the carry-chain (from the adjacent slice or

PFU).

Three of them are used for FF control and shared between two slices (0/1 or 2/3). There are five outputs: four to

routing and one to carry-chain (to the adjacent PFU). Table 2.2 and

Figure 2.4 list the signals associated with all the

slices. Figure 2.5 shows the slice signals that support a LUT5 or two LUT5 functions. F0 can be configured to have a

LUT4 or LUT5 output while F1 is for a LUT4 output.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 17

LUT5

and

Carry

Figure 2.4. Slice Diagram

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

18 FPGA-DS-02049-0.83

*Note: In RAM mode, LUT4s use the following signals:

QWD0/1

QWDN0/1

QWAS00~03, QWAS10~13

LUT4

SEL

Figure 2.5. Slice configuration for LUT4 and LUT5

Table 2.2. Slice Signal Descriptions

Function

Type

Signal Names

Description

Input

Data signal

A0, B0, C0, D0

Inputs to LUT4

Input

Data signal

A1, B1, C1, D1

Inputs to LUT4

Input

Data signal

M0, M1

Direct input to FF from fabric

Input

Control signal

SEL

LUT5 mux control input

Input

Data signal

DI0, DI1

Inputs to FF from LUT4 F0/F1 outputs

Input

Control signal

Clock Enable

Input

Control signal

LSR

Local Set/Reset

Input

Control signal

CLKIN

System Clock

Input

Inter-PFU signal

FCI

Fast Carry-in1

Output

Data signals

LUT4/LUT5 output signal

Output

Data signals

LUT4 output signal

Output

Data signals

Q0, Q1

Output

Inter-PFU signal

FCO

Fast carry chain output1

Note: See Figure 2.4 for connection details.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 19

2.2.2. Modes of Operation

Slices 0-2 have up to four potential modes of operation: Logic, Ripple, RAM and ROM. Slice 3 is not needed for

RAM

mode, it can be used in Logic, Ripple, or ROM modes.

2.2.2.1. Logic Mode

In this mode, the LUTs in each slice are configured as 4-input combinatorial lookup tables. A LUT4 can have 16

possible

input combinations. Any four input logic functions can be generated by programming this lookup table.

Since there are

two LUT4s per slice, a LUT5 can be constructed within one slice.

2.2.2.2. Ripple Mode

Ripple mode supports the efficient implementation of small arithmetic functions. In ripple mode, the following

functions can be implemented by each slice:

 Addition 2-bit

 Subtraction 2-bit

 Add/Subtract 2-bit using dynamic control

 Up counter 2-bit

 Down counter 2-bit

 Up/Down counter with asynchronous clear 2-bit using dynamic control

 Up/Down counter with preload (sync) 2-bit using dynamic control

 Comparator functions of A and B inputs 2-bit

 A greater-than-or-equal-to B

 A not-equal-to B

 A less-than-or-equal-to B

 Up/Down counter with A greater-than-or-equal-to B comparator 2-bit using dynamic control

 Up/Down counter with A less-than-or-equal-to B comparator 2-bit using dynamic control

 Multiplier support Ai*Bj+1 + Ai+1*Bj in one logic cell with 2 logic cells per slice

 Serial divider 2-bit mantissa, shift 1bit/cycle

 Serial multiplier 2-bit, shift 1bit/cycle or 2bit/cycle

Ripple Mode includes an optional configuration that performs arithmetic using fast carry chain methods. In this

configuration (also referred to as CCU2 mode) two additional signals, Carry Generate and Carry Propagate, are

generated on a per slice basis to allow fast arithmetic functions to be constructed by concatenating Slices.

2.2.2.3. RAM Mode

In this mode, a 16 x 4-bit distributed single or pseudo dual port RAM can be constructed in one PFU using each LUT

block in

Slice 0 and Slice 1 as a 16 x 2-bit memory in each slice. Slice 2 is used to provide memory address and control

signals. CrossLink-NX devices support distributed memory initialization.

The Lattice design tools support the creation of a variety of different size memories. Where appropriate, the software

constructs these using distributed memory primitives that represent the capabilities of the PFU. Table 2.3 lists the

number of slices required to implement different distributed RAM primitives. For more information about

using RAM in

CrossLink-NX devices, refer to CrossLink-NX Memory Usage Guide (FPGA-TN-02094).

Table 2.3. Number of Slices Required to Implement Distributed RAM

SPR 16 X 4

PDPR 16 X 4

Number of slices

Note: SPR = Single Port RAM, PDPR = Pseudo Dual Port RAM

2.2.2.4. ROM Mode

ROM mode uses the LUT logic; hence, Slice 0 through Slice 3 can be used in ROM mode. Preloading is accomplished

through the programming interface during PFU configuration.

For more information, refer to CrossLink-NX Memory Usage Guide (FPGA-TN-02094).

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

20 FPGA-DS-02049-0.83

2.3. Routing

There are many resources provided in the CrossLink-NX devices to route signals individually or as busses with

control signals. The routing resources consist of switching circuitry, buffers and metal interconnect (routing)

segments.

The CrossLink-NX family has an enhanced routing architecture that produces a compact design. The Radiant software

tool suites take the output of the synthesis tool and places and routes the design.

2.3.1. Clocking Structure

The CrossLink-NX clocking structure consists of clock synthesis blocks, sysCLOCK PLL; balanced clock tree networks,

PCLK and ECLK; and efficient clock logic modules, Clock Dividers (PCLKDIV and ECLKDIV) and Dynamic Clock Select

(DCS), Dynamic Clock Control (DCC), and DLL. Each of these functions is described as follow.

2.3.2. Global PLL

The Global PLLs (GPLL) provide the ability to synthesize clock frequencies. The devices in the CrossLink-NX family

support two or three full-featured General Purpose GPLLs. The Global PLLs provide the ability to synthesize

clock

frequencies.

The architecture of the GPLL is shown in Figure 2.6. A description of the GPLL functionality follows.

REFCK is the reference frequency input to the PLL and its source can come from external CLK inputs or

from internal

routing. The CLKI input feeds into the input Clock Divider block.

CLKFB is the feedback signal to the GPLL which can come from internal feedback path or routing. The feedback divider

is used to multiply the reference frequency and thus synthesize a higher or lower frequency clock

output.

The PLL has six clock outputs CLKOP, CLKOS, CLKOS2, CLKOS3, CLKOS4, and CLKOS5. Each output has its own output

divider,

thus allowing the GPLL to generate different frequencies for each output. The output dividers can have a value

from

1 to 128. Each GPLL output can be used to drive the primary clock

or edge clock networks.

The setup and hold times of the device can be improved by programming a phase shift into the output clocks which

advances or delays the output clock with reference to the un-shifted output clock.

This phase shift can be either

programmed during configuration or can be adjusted dynamically using the DIRSEL, DIR, DYNROTATE, and LOADREG

ports.

The LOCK signal is asserted when the GPLL determines it has achieved lock and de-asserted if a loss of lock is

detected.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 21

(To bypass muxes)

Figure 2.6. General Purpose PLL Diagram

For more details on the PLL, you can refer to the CrossLink-NX sysCLOCK PLL/DLL Design and Usage Guide (FPGA-TN-

02095).

2.3.3. Clock Distribution Network

There are two main clock distribution networks for any member of the CrossLink-NX product family, namely Primary

Clock (PCLK) and Edge Clock (ECLK). These clock networks can be driven from many different sources, such as Clock

Pins, PLL outputs, DLLDEL outputs, Clock divider outputs, SERDES/PCS clocks and

user logic. There are clock divider

blocks (ECLKDIV and PCLKDIV) to provide a slower clock from

these clock sources.

CrossLink-NX supports glitchless Dynamic Clock Control (DCC) for the PCLK Clock

to save dynamic power. There are also

Dynamic Clock Selection logic to allow glitchless selection between two clocks for

the PCLK network (DCS).

Overview of Clocking Network is shown in Figure 2.7 for CrossLink-NX device. The shaded blocks (PCIe and upper left

PLL) are not available in the 17K Logic Cell device.

CrossLink-NX Family

Preliminary Data Sheet

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22 FPGA-DS-02049-0.83

BMID

PLL

12 DCC

16 DCC

18 DCC

PLL PLL

OSCMIPI_DPHY0 MIPI_DPHY1 BANK 0 PCLK

BANK 1 PCLK BANK 2 PCLK

BANK 3 PCLK

BANK 4 PCLKBANK 5 PCLK ECLK ECLK ECLK

TMID

RMID

LMID

Figure 2.7. Clocking

2.3.4. Primary Clocks

The CrossLink-NX device family provides low-skew, high fan-out clock distribution to all synchronous elements in

the

FPGA fabric through the Primary Clock Network. The CrossLink-NX PCLK clock network is a balanced clock structure

which is designed to minimize the clock skew among all the final destination of the IPs in the FPGA core that needs a

clock source.

The primary clock network is divided into two clock domains depending on the device density. Each of these domains

has 16 clocks that can be distributed to the fabric in the domain.

The Lattice Radiant software can automatically route each clock to one of the domains up to a maximum of

16 clocks

per domain. You can change how the clocks are routed by specifying a preference in the Lattice

Radiant software to

locate the clock to a specific domain. The CrossLink-NX device provides you with a maximum of

64 unique clock input

sources that can be routed to the primary Clock network.

Primary clock sources are:

 Dedicated clock input pins

 PLL outputs

 PCLKDIV, ECLKDIV outputs

 Internal FPGA fabric entries (with minimum general routing)

 SGMII-CDR, D-PHY, PCIe clocks

 OSC clock

These sources are routed to each of four clock switches called a Mid Mux (LMID, RMID, TMID, BMID). The outputs of

the Mid MUX are routed to

the center of the FPGA where additional clock switches (DSC_CMUX) are used to route the

primary clock

sources to primary clock distribution to the CrossLink-NX fabric. These routing muxs are shown in

Figure 2.7.

There are potentially 64

unique clock domains that can be used in the largest CrossLink-NX Device. For more

information about the primary

clock tree and connections, refer to CrossLink-NX sysCLOCK PLL/DLL Design and Usage

Guide (FPGA-TN-02095).

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 23

2.3.5. Edge Clock

CrossLink-NX devices have a number of high-speed edge clocks that are intended for use with the PIO in the

implementation of high-speed interfaces. There are four (4) ECLK networks per bank I/O on the Bottom side of

the

devices. For power management, the Edge clock network is powered by a separate power domain (to reduce power

noise injection from the core and reduce overall noise induced jitter) while controlled by the same logic that gates the

FPGA core and PCLK domains.

Each Edge Clock can be sourced from the following:

 Dedicated PIO Clock input pins (PCLK)

 DLLDEL output (PIO Clock delayed by 90°)

 PLL outputs (CLKOP, CLKOS, CLKOS2, CLKOS3, CLKOS4, and CLKOS5)

 Internal Nodes

Figure 2.8 illustrates the various ECLK sources. Bank 3 is shown in the example. Bank 4 and Bank 5 are similar.

ECLKSYNC

From Banks 4, 5

ECLKSYNC

To Banks 4,5 Muxes

Bank 3 ECLK Tree

From Fabric

Bank 3 PCLK Pin (even)

Bank 3 PCLK Pin (odd)

DLLDEL

Bottom

Left GPLL

Bottom

Right GPLL

ECLKDIV BMID

Figure 2.8. Edge Clock Sources per Bank

The edge clocks have low injection delay and low skew. They are typically used for DDR Memory or Generic DDR

interfaces. For detailed information on Edge Clock connections, refer to CrossLink-NX sysCLOCK PLL/DLL Design and

Usage Guide (FPGA-TN-02095).

2.3.6. Clock Dividers

CrossLink-NX devices have two distinct types of clock divider, Primary and Edge. There are from one (1) to eight (8)

Primary Clock Divider (PCLKDIV) and which are located in the DCS_CMUX block(s) at the center of the device. There are

twelve (12) ECLKDIV dividers per device, locate near the bottom high-speed I/O banks.

The PCLKDIV supports ÷2, ÷4, ÷8, ÷16, ÷32, ÷64, ÷128, and ÷1 (bypass) operation. The PCLKDIV is fed from a DCSMUX

within the DCS_CMUX block. The clock divider output drives one input of the DCS Dynamic Clock Select within the

DSC_CMUX block. The Reset (RST) control signal is asynchronously and forces all outputs to low. The divider output

starts at next cycle after the reset is synchronously released. The PCLKDIV is shown in context in Figure 2.9.

The ECLKDIV

is intended to generate a slower-speed system clock from a high-speed edge clock. The block operates in

a ÷2, ÷3.5, ÷4, or ÷5 mode and maintains a known phase relationship between the divided down clock and the high-

speed clock

based on the release of its reset signal. The ECLKDIV

can be fed from selected PLL outputs, external primary

clock pins (with or without DLLDEL

Delay) or from routing. The clock divider outputs feed into the Bottom Mid-mux

(BMID). The Reset (RST) control signal is asynchronously and forces all outputs to low. The divider output starts at next

cycle after the reset is synchronously released.

The ECLKDIV block is shown in context in Figure 2.8. For further information on clock dividers, refer to

CrossLink-NX

sysCLOCK PLL/DLL Design and Usage Guide (FPGA-TN-02095).

CrossLink-NX Family

Preliminary Data Sheet

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24 FPGA-DS-02049-0.83

2.3.7. Clock Center Multiplexor Blocks

All clock sources are selected and combined for primary clock routing through the Dynamic Clock Selector Center

Multiplexor logic (DCS_CMUX). There are one (1) or two (2) DCS_CMUX blocks per device. Each DCS_CMUX block

contains 2 DCSMUX blocks, 1 PCLKDIV, 1 DCS block, and 1 or 2 CMUX blocks. See Figure 2.9 for a representative

DCS_CMUX block diagram.

The heart of the DCS_CMUX is the Center Multiplexor (CMUX) block, inputs up to 64 feed clock sources (Mid-muxes

(RMID, LMID, TMIC, BMID) and DCC) and to drive up to 16 primary clock trunk lines.

Up to two (2) clock inputs to the DCS_CMUX can be routed through a Dynamic Clock Select block then routed to the

CMUX. One (1) input to the DCS can be optionally divided by the Primary Clock Divider (PCLKDIV). For more information

about the DCS_CMUX, refer to CrossLink-NX sysCLOCK PLL/DLL Design and Usage Guide (FPGA-TN-02095).

DCS_CMUX

16x (partial

(16/64):1)

CMUX

DCS

dcs2cmux0

DCMUX

(62:1)

PCLKDIV

DCMUX

(62:1)

62 62 62

dcs1 dcs0

16x (partial

(16/64):1)

CMUX

Figure 2.9. DCS_CMUX Diagram

2.3.8. Dynamic Clock Select

The Dynamic Clock Select (DCS) is a smart multiplexer function available in the primary clock routing. It switches

between two independent

input clock sources. Depending on the operation modes, it switches between two (2)

independent input clock

sources either with or without any glitches. This is achieved regardless of when the select

signal is toggled. Both

input clocks must be running to achieve functioning glitchless DCS output clock, but running

clocks are not required when used as non-glitchless normal clock multiplexer.

There are one (1) or two (2) DCS blocks per device that feed all clock domains. The DCS blocks are located in the

DCS_MUX block. The inputs to the DCS blocks come from MIDMUX outputs and user logic clocks via DCC elements. The

DCS elements are located at the center of the PLC array core. The output of the DCS is connected to the inputs of

Primary Clock Center MUXs (CMUX).

Figure 2.10 shows the timing waveforms of the default DCS operating mode. The DCS block can be programmed to

other modes. For more information about the DCS, refer to CrossLink-NX sysCLOCK PLL/DLL Design and Usage Guide

(FPGA-TN-02095).

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 25

CLK0

CLK1

SEL

DCSOUT

clk1

pos clk1

neg

clk0

pos

clk0

neg

Figure 2.10. DCS Waveforms

2.3.9. Dynamic Clock Control

The Dynamic Clock Control (DCC), Domain Clock enable/disable feature allows internal logic control of the domain

primary clock network. When a clock network is disabled, the clock signal is static and not toggle. All the logic fed by

that clock does

not toggle, reducing the overall power consumption of the device. The disable function is glitchless, and

does not

increase the clock latency to the primary clock network.

Four additional DCC elements control the clock inputs from the CrossLink-NX domain logic to the Center MUX elements

(DSC_CMUX).

This DCC controls the clock sources from the Primary CLOCK MIDMUX before they are fed to the Primary Center

MUXs

that drive the domain clock network. For more information about the DCC, refer to CrossLink-NX sysCLOCK PLL/DLL

Design and Usage Guide (FPGA-TN-02095).

2.3.10. DDRDLL

CrossLink-NX has 2 identical DDRDLL blocks, located in the lower left and lower right corners of the device. Each

DDRDLL (master DLL block) can generate a phase shift code representing the amount of delay in a delay

block that

corresponding to 90-degree phase of the reference clock input, and provide this code to every individual DQS block and

DLLDEL slave delay element. The reference clock can be either from

PLL, or input pin. This code is used in the DQSBUF

block that controls a set of DQS pin groups to interface with

DDR memory (slave DLL). The DQSBUF uses this code to

controls the DQS

input of the DDR memory to 90 degree shift to clock DQs at the center of the data eye for DDR

memory interface.

 The code is also sent to another slave DLL, DLLDEL, that takes a primary clock input and generates a 90 degree shift

clock output to drive the clocking structure. This is useful to interface edge-aligned Generic DDR, where 90 degree

clocking needs to be created. Not all primary clock inputs have associated DLLDEL control. Figure 2.11 shows

DDRDLL connectivity to a DLLDEL block (connectivity to DQSBUF blocks is similar).

CrossLink-NX Family

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26 FPGA-DS-02049-0.83

DLLDEL

PCLK Input

code1

code2

To both BMID and

ECLKINMUX

Left DDRDLL

Right DDRDLL

Figure 2.11. DLLDEL Functional Diagram

Each DDRDLL can generate delay code based on the reference clock frequency. The slave DLL (DQSBUF and DLLDEL) use

the code to delay the signal, to create the phase

shifted signal used for either DDR memory, or creating 90 degree shift

clock. Figure 2.12 shows the DDRDLL and

the slave DLLs on the top level view.

BANK5 ECLK

DLLDEL

BANK4 ECLK

DLLDEL DQS0 DQS1

BANK3 ECLK

DLLDEL DQS0 DQS1

Refclk Sel Refclk Sel

Left

DDRDLL Right

DDRDLL

Digital Delay Code (L) Digital Delay Code (R)

Figure 2.12. CrossLink-NX DDRDLL Architecture

2.4. SGMII Clock Data Recovery (CDR)

The CrossLink-NX-40 Device includes two hardened Clock Data Recovery (CDR). The CDR’s enables Serial Gigabit Media

Independent Interface (SGMII) solutions. There are three main blocks in each CDR, the CDR, deserializer and FIFO. Each

CDR features two loops. The first loop is locked to the reference clock. Once locked, the loop switches to the data path

loop where the CDR tracks the data signals to generate the correcting signals needed to achieve and maintain phase

lock with the data. The data is then passed through a deserializer which deserialize the data to 10-bit parallel data. The

10-bit parallel data is then sent to the FIFO bridge which allows the CDR to interface with the rest of the FPGA.

Figure 2.13 shows a block diagram of the SGMII CDR IP.

The two hardened blocks are located at the bottom left of the chip and uses the high speed I/O Bank 5 for the

differential pair input. It is recommended that the reference clock should be entered through a GPIO that has

connection to the PLL on the lower left corner as well.

For more information about how to implement the hardened CDR for your SGMII solution, refer to the CrossLink-NX

High-Speed I/O Interface (FPGA-TN-02097).

CrossLink-NX Family

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FPGA-DS-02049-0.83 27

SGMII CDR IP

DESERIALIZER FIFO

DUAL_LOOP

CDR

rxd_des

rclk_des

rxd<9:0> sgmii_rxd<9:0>

lmmi_rdata[7:0]

lmmi_rdata_valid

lmmi_ready

lmmi_dk

lmmi_request

lmmi_wrdn

lmmi_offset[3:0]

lmmi_wdata[7:0]

lmmi_reset

ip_ready

sgmii_cdr_icnst<1:0>

sgmii_in

dco_calib_rst

dco_facq_rst

rrst

sgmii_refclk(125 MHz) sgmii_pclk

sgmii_rclk

Figure 2.13. SGMII CDR IP

2.5. sysMEM Memory

CrossLink-NX devices contain a number of sysMEM Embedded Block RAM (EBR). The EBR consists of an 18 Kb RAM with

memory core, dedicated input registers and output registers as well as optional pipeline registers at the outputs. Each

EBR includes functionality to support true dual-port, pseudo dual-port, single-port RAM, ROM and built in FIFO. In

CrossLink-NX, unused EBR blocks is powered down to minimize power consumption.

2.5.1. sysMEM Memory Block

The sysMEM block can implement single port, dual port or pseudo dual port memories. Each block can be used in a

variety of depths and widths as listed in Table 2.4. FIFO’s can be implemented using the built in read and write address

counters and programmable full, almost full, empty and almost empty flags. The EBR block facilitates parity checking by

supporting an optional parity bit for each data byte. EBR blocks provide byte-enable support for configurations with 18-

bit and 36-bit data widths. For more information, refer to CrossLink-NX Memory Usage Guide (FPGA-TN-02094).

EBR also provides a build in ECC engine. The ECC engine supports a write data width of 32 bits and it can be cascaded

for larger data widths such as x64. The ECC parity generator creates and stores parity data for each 32-bit word written.

When a read operation is performed, it compares the data with its associated parity data and report back if any Single

Event Upset (SEU) event has disturbed the data. Any single bit data disturb is automatically corrected at the data

output. In addition, two dedicated error flags indicate if a single-bit or two-bit error has occurred.

CrossLink-NX Family

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28 FPGA-DS-02049-0.83

Table 2.4. sysMEM Block Configurations

Memory Mode

Configurations

Single Port

16,384 x 1

8,192 x 2

4,096 x 4

2,048 x 9

1,024 x 18

512 x 36

True Dual Port

16,384 x 1

8,192 x 2

4,096 x 4

2,048 x 9

1,024 x 18

Pseudo Dual Port

16,384 x 1

8,192 x 2

4,096 x 4

2,048 x 9

1,024 x 18

512 x 36

2.5.2. Bus Size Matching

All of the multi-port memory modes support different widths on each of the ports (except ECC mode which only

supports a write data width of 32 bits). The RAM bits are mapped LSB

word 0 to MSB word 0, LSB word 1 to MSB word

1, and so on. Although the word size and number of words for

each port varies, this mapping scheme applies to each

port.

2.5.3. RAM Initialization and ROM Operation

If desired, the contents of the RAM can be pre-loaded during device configuration. By preloading the RAM block

during

the chip configuration cycle and disabling the write controls, the sysMEM block can also be utilized as a

ROM.

2.5.4. Memory Cascading

Larger and deeper blocks of RAM can be created using EBR sysMEM Blocks. Typically, the Lattice design tools

cascade

memory transparently, based on specific design inputs.

2.5.5. Single, Dual and Pseudo-Dual Port Modes

In all the sysMEM RAM modes, the input data and address for the ports are registered at the input of the memory

array. The output data of the memory is optionally registered at the output.

2.5.6. Memory Output Reset

The EBR utilizes latches at the A and B output ports. These latches can be reset asynchronously or synchronously. RSTA

and RSTB are local signals, which reset the output latches associated with Port A

and Port B, respectively. The Global

Reset (GSRN) signal can reset both ports. The output data latches and associated resets for both ports are as shown in

Figure 2.14. The optional Pipeline Registers at the outputs of both ports are also reset in the same way.

CrossLink-NX Family

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FPGA-DS-02049-0.83 29

SET

LCLR

Output Data

Latches

Memory Core

Port A[17:0]

SET

DPort B[17:0]

RSTB

GSRN

Programmable Disable

RSTA

LCLR

Figure 2.14. Memory Core Reset

For further information on the sysMEM EBR block, see the list of technical documentation in Supplemental Information

section.

2.6. Large RAM

The CrossLink-NX device includes additional memory resources in the form of Large Random-Access Memory (LRAM)

blocks.

The LRAM is designed to work as Single-Port RAM, Dual-Port RAM, Pseudo Dual-Port RAM, and ROM memories. It is

meant to function as additional memory resources for you beyond what is available in the EBR and PFU.

Each individual Large RAM block contains 0.5 Mbit of memory, and has a programmable data width of up to 32 bits.

Cascading Large RAM blocks allows data widths of up to 64 bits. Additionally, there is the ability to use either Error

Correction Coding (ECC) or byte enable.

2.7. sysDSP

The CrossLink-NX family provides an enhanced sysDSP architecture, making it ideally suited for low-cost, high-

performance Digital Signal Processing (DSP) applications. Typical functions used in these applications are Finite

Impulse

Response (FIR) filters, Fast Fourier Transforms (FFT) functions, Correlators, Reed-Solomon/Turbo/Convolution encoders

and decoders. These complex signal processing functions use similar building blocks such as multiply-adders and

multiply-accumulators.

2.7.1. sysDSP Approach Compared to General DSP

Conventional general-purpose DSP chips typically contain one to four (Multiply and Accumulate) MAC units with fixed

data-width multipliers; this leads to limited parallelism and limited throughput. Their throughput is increased by higher

clock speeds. In the CrossLink-NX device family, there are many DSP blocks that can be used to support different data

widths. This allows you to use highly parallel implementations of DSP functions. You can optimize DSP performance

versus area by choosing appropriate levels of parallelism. Figure 2.15 compares the fully

serial implementation to the

mixed parallel and serial implementation.

CrossLink-NX Family

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30 FPGA-DS-02049-0.83

Operand

AOperand

Function Implemented in General

Purpose DSP

Single

Multiplier

Accumulator

M loops

Function Implemented in

CrossLink-NX

Operand

AOperand

Operand

BOperand

Multiplier

0Multiplier

Multiplier

Operand

Output

(k adds)

m/k

accumulate

m/k

loops

Figure 2.15. Comparison of General DSP and CrossLink-NX Approaches

2.7.2. sysDSP Architecture Features

The CrossLink-NX sysDSP Slice has been significantly enhanced to provide functions needed for advanced processing

applications. These enhancements provide improved flexibility and resource utilization.

The CrossLink-NX sysDSP Slice supports many functions that include the following:

 Symmetry support. The primary target application is wireless. 1D Symmetry is useful for many applications that

use FIR filters when their coefficients have symmetry or asymmetry characteristics. The main motivation for using

1D symmetry is cost/size optimization. The expected size reduction is up to 2x.

 Odd Mode – Filter with Odd number of taps

 Even Mode – Filter with Even number of taps

 Two dimensional (2D) Symmetry Mode – Supports 2D filters for mainly video applications

 Dual-multiplier architecture. Lower accumulator overhead to half and the latency to half compared to single

multiplier architecture.

 Fully cascadable DSP across slices. Support for symmetric, asymmetric and non-symmetric filters.

 Multiply (36 x 36, two 18 x 36, four 18 x 18 or eight 9 x 9)

 Multiply Accumulate (supports one 18 x 36 multiplier result accumulation, two 18 x 18 multiplier result

accumulation or four 9 x 9 multiplier result accumulation)

 Two Multiplies feeding one Accumulate per cycle for increased processing with lower latency (two 18 x 18

Multiplies feed into an accumulator that can accumulate up to 54 bits)

 Pipeline registers

 1D Symmetry support. The coefficients of FIR filters have symmetry or negative symmetry characteristics.

 Odd Mode – Filter with Odd number of taps

 Even Mode – Filter with Even number of taps

 2D Symmetry support. The coefficients of 2D FIR filters have symmetry or negative symmetry characteristics.

 3*3 and 3*5 – Internal DSP Slice support

 5*5 and larger size 2D blocks – Semi internal DSP Slice support

CrossLink-NX Family

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FPGA-DS-02049-0.83 31

 Flexible saturation and rounding options to satisfy a diverse set of applications situations

 Flexible cascading DSP blocks

 Minimizes fabric use for common DSP functions

 Enables implementation of FIR Filter or similar structures using dedicated sysDSP slice resources only

 Provides matching pipeline registers

 Can be configured to continue cascading from one row of sysDSP slices to another for longer cascade

chains

 RTL Synthesis friendly synchronous reset on all registers, while still supporting asynchronous reset for legacy

users

 Dynamic MUX selection to allow Time Division Multiplexing (TDM) of resources for applications that require

processor-like flexibility that enables different functions for each clock cycle

For most cases, as shown in Figure 2.16, the CrossLink-NX sysDSP is backwards-compatible with the LatticeECP3™

sysDSP block, such that, legacy applications can be targeted to CrossLink-NX sysDSP. Figure 2.16 shows the diagram of

sysDSP.

Input

REG

Input

REG

Input

18 X 18

Input

REG

Input

REG

Input

18 X 18

18 X 36 (CSA)

Input

REG

Input

REG

Input

18 X 18

Input

REG

Input

REG

Input

18 X 18

18 X 36 (CSA)

36 X 36 (CSA)

REG 18REG 18REG 18REG 18REG 18REG 18REG 18REG 18

ACC54ACC54

Output RegisterOutput Register

Note : All Registers inside the DSP Block are Bypassable via Configuration Setting

9 + 99 + 99 + 99 + 99 + 99 + 99 + 99 + 9

9 x 99 x 99 x 99 x 99 x 99 x 99 x 99 x 9

Figure 2.16. CrossLink-NX DSP Functional Block Diagram

The CrossLink-NX sysDSP block supports the following basic elements.

 MULT (Multiply)

 MAC (Multiply, Accumulate)

 MULTADDSUB (Multiply, Addition/Subtraction)

 MULTADDSUBSUM (Multiply, Addition/Subtraction, Summation)

CrossLink-NX Family

Preliminary Data Sheet

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32 FPGA-DS-02049-0.83

Table 2.5 shows the capabilities of CrossLink-NX sysDSP block versus the above functions.

Table 2.5. Maximum Number of Elements in a sysDSP block

Width of Multiply

x18

x36

MULT

MAC

—

MULTADDSUB

—

MULTADDSUBSUM

—

Some options are available in the four elements. The input register in all the elements can be directly loaded or can

loaded as a shift register from previous operand registers. By selecting dynamic operation, the following operations are

possible:

 In the Add/Sub option, the Accumulator can be switched between addition and subtraction on every cycle.

 The loading of operands can switch between parallel and serial operations.

For further information, refer to CrossLink-NX sysDSP Usage Guide (FPGA-TN-02096).

2.8. Programmable I/O (PIO)

The programmable logic associated with an I/O is called a PIO. The individual PIO are connected to their respective

sysI/O buffers and pads. On the CrossLink-NX devices, the Programmable I/O cells (PIC) are assembled into groups of

two PIO

cells called a Programmable I/O Cell or PIC. The PICs are placed on all four sides of the device.

On all the CrossLink-NX devices, two adjacent PIO can be combined to provide a complementary output driver

pair.

2.9. Programmable I/O Cell (PIC)

CrossLink-NX is consists of base PIC and gearing PIC, base PIC covers top, left right bank, gearing PIC covers bottom

banks only that supports DDR operation. gearing PIC contains the edge monitor to center to locate the center of data

window.

The PIC contains three blocks: an input register block, output register block, and tristate register block. These

blocks

contain registers for operating in a variety of modes along with the necessary clock and selection logic.

CrossLink-NX Family

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FPGA-DS-02049-0.83 33

Core

Logic/

Routing

Output and

Tristate

Block

1 PIC

Input

Block

PIO B

PIO A

Output and

Tristate

Block

Input

Block

Input and Output

Gearbox

Figure 2.17. Group of Two High Performance Programmable I/O Cells

Core

Logic/

Routing

Output and

Tristate

Block

1 PIC

Input

Block

PIO B

PIO A

Output and

Tristate

Block

Input

Block

Figure 2.18. Wide Range Programmable I/O Cells

CrossLink-NX Family

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34 FPGA-DS-02049-0.83

2.9.1. Input Register Block

The input register blocks for the PIO on all edges contain delay elements and registers that can be used to condition

high-speed interface signals before they are passed to the device core. In addition, the input register blocks for

the PIO

on the bottom edges include built-in FIFO logic to interface to DDR and LPDDR memory.

The Input register block on the bottom side includes gearing logic and registers to implement IDDRX1,

IDDRX2, IDDRX4,

IDDRX5 gearing functions. With two PICs sharing the DDR register path, it can also implement IDDRX71 function used

for

7:1 LVDS interfaces. It uses three sets of registers – shift, update, and transfer to implement gearing and the clock

domain transfer. The first stage registers samples the high-speed input data by the high-speed edge clock on its

rising

and falling edges. The second stage registers perform data alignment based on the control signals. The third

stage

pipeline registers pass the data to the device core synchronized to the low-speed system clock. For more information

on gearing function, refer to CrossLink-NX High-Speed I/O Interface (FPGA-TN-02097).

2.9.2.1. Input FIFO

The CrossLink-NX PIO has dedicated input FIFO per single-ended pin for input data register for DDR Memory

interfaces.

The FIFO resides before the gearing logic. It transfers data from DQS domain to continuous ECLK

domain. On the Write

side of the FIFO, it is clocked by DQS clock, which is the delayed version of the DQS Strobe

signal from DDR memory. On

the Read side of FIFO, it is clocked by ECLK. ECLK may be any high-speed clock

with identical frequency as DQS (the

frequency of the memory chip). Each DQS group has one FIFO control block.

It distributes FIFO read/write pointer to

every PIC in same DQS group. DQS Grouping and DQS Control Block is

described in DDR Memory Support section.

Table 2.6. Input Block Port Description

Name

Type

Description

Input

High Speed Data Input

Q[1:0]/Q[3:0]/Q[6:0]/Q[7:0]/Q[9:0]

Output

Low Speed Data to the device core

RST

Input

Reset to the Output Block

SCLK

Input

Slow Speed System Clock

ECLK

Input

High Speed Edge Clock

DQS

Input

Clock from DQS control Block used to clock DDR memory data

ALIGNWD

Input

Data Alignment signal from device core.

Figure 2.19 shows the input register block for the PIO on the top, left, and right edges.

Programmable

Delay Cell

INFF

SCLK

RST Q[1:0]

INCK

INFF

IDDRX1

Figure 2.19. Input Register Block for PIO on Top, Left, and Right Sides of the Device

CrossLink-NX Family

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FPGA-DS-02049-0.83 35

Figure 2.20 shows the input register block for the PIO located on the bottom edge.

IN FF

Delayed DQS

ECLK

SCLK

RST

ALIGNWD

FIFO Q[1:0]/

Q[3:0]/

Q[6:0]*/

Q[7:0]/

Q[9:0]

IN CK

IN FF

Generic

IDDRX1

IDDRX2

IDDRX71*

Memory

IDDRX2

ECLK

Programmable

Delay Cell

*For 7:1 LVDS interface only. It is required to use PIO pair pins (PIOA/B or PIOC/D).

IDDRX4

IDDRX5

Figure 2.20. Input Register Block for PIO on Bottom Side of the Device

2.9.2. Output Register Block

The output register block registers signal from the core of the device before they are passed to the sysI/O buffers.

CrossLink-NX output data path has output programmable flip flops and output gearing logic. On the bottom side, the

output register block can support 1x, 2x, x4, x5, and 7:1 gearing enabling high speed DDR interfaces and DDR

memory

interfaces. On the top, left, and right sides, the banks support 1x gearing. CrossLink-NX output data path diagram is

shown in Figure 2.21. The programmable delay cells are also available in the output data path.

For detailed description of the output register block modes and usage, you can refer to CrossLink-NX High-Speed I/O

Interface (FPGA-TN-02097).

DProgrammable

Delay Cell Q

Generic

ODDRX1

OUTFF

RST

SCLK

D[1:0]

Figure 2.21. Output Register Block on Top, Left, and Right Sides

CrossLink-NX Family

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36 FPGA-DS-02049-0.83

Generic

ODDRX1/

ODDRX2/

ODDR71*

Memory

ODDRX2

OSHX2

Programmable

Delay Cell

OUTFF

RST

SCLK

ECLK

DQSW

DQSW270

*For 7:1 LVDS interface only. It is required to use PIO pair pins PIOA/B.

ODDRX4

ODDRX5

Q[1:0]/

Q[3:0]/

Q[6:0]*/

Q[7:0]/

Q[9:0]

Figure 2.22. Output Register Block on Bottom Side

Table 2.7. Output Block Port Description

Name

Type

Description

Output

High Speed Data Output

Input

Data from core to output SDR register

Q[1:0]/Q[3:0]/Q[6:0]/Q[7:0]/Q[9:0]

Input

Low Speed Data from device core to output DDR register

RST

Input

Reset to the Output Block

SCLK

Input

Slow Speed System Clock

ECLK

Input

High Speed Edge Clock

DQSW

Input

Clock from DQS control Block used to generate DDR memory DQS output

DQSW270

Input

Clock from DQS control Block used to generate DDR memory DQ output

2.10. Tristate Register Block

The tristate register block registers tristate control signals from the core of the device before they are passed to the

sysI/O buffers. The block contains a register for SDR operation. In SDR, TD input feeds one of the flip-flops that

then

feeds the output. In DDR, operation used mainly for DDR memory interface can be implemented on the bottom side of

the device. Here, two inputs feed the tristate registers clocked by both ECLK and SCLK.

Figure 2.23 and Figure 2.24 show the Tristate Register Block functions on the device. For detailed description of

the

tristate register block modes and usage, you can refer to CrossLink-NX High-Speed I/O Interface (FPGA-TN-02097).

TSFF

RST

SCLK

Figure 2.23. Tristate Register Block on Top, Left, and Right Sides

CrossLink-NX Family

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FPGA-DS-02049-0.83 37

TSFF

TD TQ

THSX2

RST

SCLK

ECLK

DQSW

DQSW270

T[1:0]

Figure 2.24. Tristate Register Block on Bottom Side

Table 2.8. Tristate Block Port Description

Name

Type

Description

Input

Tristate Input to Tristate SDR Register

RST

Input

Reset to the Tristate Block

TD[1:0]

Input

Tristate input to TSHX2 function

SCLK

Input

Slow Speed System Clock

ECLK

Input

High Speed Edge Clock

DQSW

Input

Clock from DQS control Block used to generate DDR memory DQS output

DQSW270

Input

Clock from DQS control Block used to generate DDR memory DQ output

Output

Output of the Tristate block

2.11. DDR Memory Support

2.11.1. DQS Grouping for DDR Memory

Certain PICs have additional circuitry to allow the implementation of high-speed source synchronous and DDR3/DDR3L,

LPDDR2 or LPDDR3 memory interfaces. The support varies by the edge of the device as detailed below.

The Bottom side of the PIC have fully functional elements supporting DDR3/DDR3L, LPDDR2, or LPDDR3 memory

interfaces. Every 16 PIO on the bottom side are grouped into one DQS group, as shown in Figure 2.25. Within each DQS

group, there are two pre-placed pins for DQS and DQS# signals. The rest of the pins in the DQS group can be used as

DQ signals and DM signal. The number of pins in each DQS group bonded out is package dependent. DQS groups with

less than 11 pins bonded out can only be used for LPDDR2/3 Command/ Address busses. In DQS groups with more than

11 pins bonded out, up to two pre-defined pins are assigned to be used as virtual VCCIO, by driving these pins to HIGH,

and connecting these pins to VCCIO power supply. These connections create soft connections to VCCIO thru these

output pins, and make better connections on VCCIO to help to reduce SSO noise. For details, refer to CrossLink-NX High-

Speed I/O Interface (FPGA-TN-02097).

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38 FPGA-DS-02049-0.83

PIO B

PIO A

PIO B

PIO A

PIO B

PIO A

PIO B

PIO A

DQS

PIO B

PIO A

PIO B

PIO A

PIO B

PIO A

PIO B

PIO A

DQSBUF

sysIO Buffer

Delay

Pad B

Pad A

Pad B

Pad A

Pad B (C)

Pad A (T)

Pad B (C)

Pad A (T)

Pad B

Pad A

Pad B

Pad A

Pad B (C)

Pad A (T)

Pad B (C)

Pad A (T)

Figure 2.25. DQS Grouping on the Bottom Edge

2.11.2. DLL Calibrated DQS Delay and Control Block (DQSBUF)

To support DDR memory interfaces (DDR3/DDR3L, LPDDR2/3), the DQS strobe signal from the memory must be used

capture the data (DQ) in the PIC registers during memory reads. This signal is output from the DDR memory

device

aligned to data transitions and must be time shifted before it can be used to capture data in the PIC. This

time shifted is

achieved by using DQSBUF programmable delay line in the DQS Delay Block (DQS read circuit).

The DQSBUFL is

implemented as a slave delay line and works in conjunction with a master DDRDLL.

This block also includes slave delay line to generate delayed clocks used in the write side to generate DQ and DQS

with

correct phases within one DQS group. There is a third delay line inside this block used to provide write leveling

feature

for DDR write if needed.

Each of the read and write side delays can be dynamically shifted using margin control signals that can be controlled by

the core logic.

FIFO Control Block include here generates the Read and Write Pointers for the FIFO block inside the Input Register

Block. These pointers are generated to control the DQS to ECLK domain crossing using the FIFO module.

CrossLink-NX Family

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FPGA-DS-02049-0.83 39

Slave Delay Line (RD) with

Adjustment/Margin Test

Slave Delay (WR) with

Adjustment/Margin Test and Write Leveling

DQS

READ[1:0]

READ_CLK_SEL[2:0]

BURST_DET

Preamble/Postamble Management

FIFO Control and Data Valid

Generation

SCLK

ECLK

RD_CODN, RD_DIRECTION, RD_MOVE

WR_LOADN, WR_DIRECTION, WR_MOVE

DELAY CODE[8:0]

WRPNTR[2:0]

RDPNTR[2:0]

DATAVALID

DQSR90

Rd_cout

WRITE_LEVELING_LOADN

WRITE_LEVELING_DIRECTION

WRITE_LEVELING_MOVE

RST

DONE_GWE

GSR

DELAY CODE[8:0]

DQSW

DQSW270

WR_COUT

Figure 2.26. DQS Control and Delay Block (DQSBUF)

Table 2.9. DQSBUF Port List Description

Name

Type

Description

DQS

Input

DDR memory DQS strobe

READ[1:0]

Input

Read Input from DDR Controller

READCLKSEL[2:0]

Input

Read pulse selection

SCLK

Input

Slow System Clock

ECLK

Input

High Speed Edge Clock (same frequency as DDR memory)

RDLOADN, RDMOVE, RDDIRECTION

Input

Dynamic Margin Control ports for Read delay

WRLOADN, WRMOVE, WRDIRECTION

Input

Dynamic Margin Control ports for Write delay

DELAYCODE_I[8:0]

Input

Dynamic Delay Control

WRITE_LEVELING_LOADN,

WRITE_LEVELING_DIRECTION,

WRITE_LEVELING_MOVE

Input

Write Leveling Control

DQSR90

Output

90 delay DQS used for Read

DQSW270

Output

90 delay clock used for DQ Write

DQSW

Output

Clock used for DQS Write

RDPNTR[2:0]

Output

Read Pointer for IFIFO module

WRPNTR[2:0]

Output

Write Pointer for IFIFO module

DATAVALID

Output

Signal indicating start of valid data

BURSTDET

Output

Burst Detect indicator

RD_COUT

Output

Read Count

WR_COUT

Output

Write Count

DELAYCODE_O[8:0]

Output

Dynamic Delay Control

CrossLink-NX Family

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40 FPGA-DS-02049-0.83

2.12. sysI/O Buffer

Each I/O is associated with a flexible buffer referred to as a sysI/O buffer. These buffers are arranged around the

periphery of the device in groups referred to as banks. The sysI/O buffers allows you to implement the wide variety

standards that are found in today’s systems including LVDS, HSUL, SSTL Class I and II, LVCMOS,

LVTTL, and MIPI.

The CrossLink-NX family contains multiple Programmable I/O Cell (PIC) blocks. Each PIC contains two Programmable

I/O, PIOA and PIOB. Each PIO includes a sysI/O buffer and I/O logic. Two adjacent PIO can be joined to provide a

differential I/O pair. These two pairs are referred to as True and Comp, where True Pad is associated with the positive

side of the differential I/O, and the complement with the negative.

The top, left and right side banks support I/O standards from 3.3 V to 1.0 V while the bottom supports I/O standards

from 1.8 V to 1.0 V. Every pair of I/O on the bottom bank also have a true LVDS and SLVS Tx Driver. In addition, the

bottom bank supports single-ended input termination. Both static and dynamic termination are supported. Dynamic

termination is used to support the DDR/LPDDR interface standards. For more information about DDR implementation

in I/O Logic and DDR memory interface support, refer to CrossLink-NX High-Speed I/O Interface (FPGA-TN-02097).

2.12.1. Supported sysI/O Standards

CrossLink-NX sysI/O buffer supports both single-ended differential and differential standards. Single-ended standards

can be further subdivided into internally ratioed standards such as LVCMOS, LVTTL, and externally referenced

standards such as HSUL and SSTL. The buffers support the LVTTL, LVCMOS 1.0 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V

standards. Differential standards supported include LVDS, SLVS, differential LVCMOS, differential SSTL, and differential

HSUL. For better support of video standards, subLVDS and MIPI_D-PHY are also supported. Table 2.10 and Table 2.11

provide a list of sysI/O standards supported in CrossLink-NX devices.

Table 2.10. Single-Ended I/O Standards

Standard

Input

Output

Bi-directional

LVTTL33

Yes

LVCMOS33

Yes

LVCMOS25

Yes

LVCMOS18

Yes

LVCMOS15

Yes

LVCMOS12

Yes

LVCMOS10

Yes

HTSL15 I

Yes

SSTL 15 I

Yes

SSTL 135 I

Yes

HSUL12

Yes

LVCMOS18H

Yes

LVCMOS15H

Yes

LVCMOS12H

Yes

LVCMOS10H

Yes

LVCMOS10R

Yes

—

Yes*

*Note: Output supported by LVCMOS10H.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 41

Table 2.11. Differential I/O Standards

Standard

Input

Output

Bi-directional

LVDS

Yes

SUBLVDS

Yes

—

SLVS

Yes

—

SUBLVDSE

—

Yes

—

SUBLVDSEH

—

Yes

—

LVDSE

—

Yes

—

MIPI_D-PHY

Yes

HSTL15D_I

Yes

SSTL15D_I

Yes

SSTL15D_II

Yes

SSTL135D_I

Yes

SSTL135D_II

Yes

HSUL12D

Yes

LVTTL33D

—

Yes

—

LVCMOS33D

—

Yes

—

LVCMOS25D

—

Yes

—

2.12.2. sysI/O Banking Scheme

CrossLink-NX devices have up to 8 banks in total. For 40K device, there are one bank on top, two banks each at left and

right side of device, and three on the bottom side of device. For 17K device, one bank on top, one on right side and

three on the bottom side of device. The higher density CrossLink-NX device has more pins in each bank. Bank 0, Bank 1,

Bank 2, Bank 6, and Bank 7 support up to VCCIO 3.3 V while Bank 3, Bank 4, and Bank 5 support up to VCCIO 1.8 V. In

addition, Bank 3, Bank 4, and Bank 5 support two VREF inputs for flexibility to receive two different referenced input

levels on the same bank. Figure 2.27 shows the location of each bank.

CrossLink-NX Family

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42 FPGA-DS-02049-0.83

Bank 7*

Bank 6*

Bank 5 Bank 4 Bank 3

Bank 0

Bank 1

Bank 2*

GND

VCCIO(0)

GND VCCIO(1)

GND VCCIO(2)

GND

VCCIO(7)

GND

VCCIO(6)

GND GND GND

VCCIO(5)

VREF1(5)

VREF2(5)

VCCIO(4)

VREF1(4)

VREF2(4)

VCCIO(3)

VREF1(3)

VREF2(3)

*Note: Bank not available in LIFCL-17.

Figure 2.27. sysI/O Banking

2.12.2.1. Typical sysI/O I/O Behavior During Power-up

The internal Power-On-Reset (POR) signal is deactivated when VCC and VCCAUX have reached satisfactory levels. After the

POR signal is deactivated, the FPGA core logic becomes active. It is your responsibility to ensure that all other VCCIO

banks are active with valid input logic levels to properly control the output logic states of all the I/O banks that are

critical to the application. For more information about controlling the output logic state with valid input logic levels

during power-up in CrossLink-NX devices, see the list of technical documentation in Supplemental Information section.

The VCC and VCCAUX supply the power to the FPGA core fabric, whereas the VCCIO supplies power to the I/O buffers. In

order to simplify the system design while providing consistent and predictable I/O behavior, it is recommended that

the I/O buffers be powered-up prior to the FPGA core fabric. For different power supply voltage level by the I/O banks,

please refer to CrossLink-NX sysI/O Usage Guide (FPGA-TN-02067) for detailed information.

2.12.2.2. VREF1 and VREF2

Bank 3, Bank 4, and Bank 5 can support two separate VREF input voltage, VREF1, and VREF2. To assign a VREF driver,

use IO_Type = VREF1_DRIVER or VREF2_DRIVER. To assign VREF to a buffer, use VREF1_LOAD or VREF2_LOAD.

2.12.2.3. SysI/O Standards Supported by I/O Bank

All banks can support multiple I/O standards under the VCCIO rules discussed above. Table 2.12 and Table 2.13

summarize the I/O standards supported on various sides of the CrossLink-NX device.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 43

Table 2.12. Single-Ended I/O Standards Supported on Various Sides

Standard

Top

Left*

Right

Bottom

LVTTL33

Yes

—

LVCMOS33

Yes

—

LVCMOS25

Yes

—

LVCMOS18

Yes

—

LVCMOS15

Yes

—

LVCMOS12

Yes

—

LVCMOS10

Yes

—

LVCMOS18H

—

Yes

LVCMOS15H

—

Yes

LVCMOS12H

—

Yes

LVCMOS10H

—

Yes

LVCMOS10R

—

Yes

HTSL15 I

—

Yes

SSTL 15 I, II

—

Yes

SSTL 135 I, II

—

Yes

HSUL12

—

Yes

*Note: Left bank is not available in LIFCL-17.

Table 2.13. Differential I/O Standards Supported on Various Sides

Standard

Top

Left*

Right

Bottom

LVDS

—

Yes

SUBLVDS

—

Yes

SLVS

—

Yes

SUBLVDSE

Yes

—

SUBLVDSEH

—

Yes

LVDSE

Yes

—

MIPI_D-PHY

—

Yes

HSTL15D_I

—

Yes

SSTL15D_I

—

Yes

SSTL15D_II

—

Yes

SSTL135D_I

—

Yes

SSTL135D_II

—

Yes

HSUL12D

—

Yes

LVTTL33D

Yes

—

LVCMOS33D

Yes

—

LVCMOS25D

Yes

—

*Note: Left bank is not available in LIFCL-17.

2.12.2.4. Hot Socketing

CrossLink-NX devices have been carefully designed to ensure predictable behavior during power-up and power-down.

During power-up and power-down sequences, the I/O remain in tristate until the power supply voltage is

high enough

to ensure reliable operation. In addition, leakage into I/O pins is controlled within specified limits.

Bank 0, Bank 1,

Bank 2, Bank 6, and Bank 7 are fully hot socket able while Bank 3, Bank 4, and Bank 5 are not supported.

2.12.3. sysI/O Buffer Configurations

This section describes the various sysI/O features available on the CrossLink-NX device. Refer to CrossLink-NX sysI/O

Usage Guide (FPGA-TN-02067) for detailed information.

CrossLink-NX Family

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44 FPGA-DS-02049-0.83

2.13. Analog Interface

The CrossLink-NX family provides an analog interface, consisting of two Analog to Digital Convertors (ADC), three

continuous time comparators and an internal junction temperature monitoring diode. The two ADCs can sample the

input sequentially or simultaneously.

2.13.1. Analog to Digital Converters

The Analog to Digital Convertor is a 12-bit, 1 MSPS SAR (Successive Approximation Resistor/capacitor) architecture

converter. The ADC supports both continuous and single shot conversion modes.

The ADC input is selected among pre-selected GPIO input pairs, dedicated analog input pair, the internal junction

temperature sensing diode and internal voltage rails. The input signal can be converted in either uni-polar or bi-polar

mode.

The reference voltage is selectable between the 1.2 V internal reference generator and an external reference. The ADC

can convert up to a 1.8 V input signal with a 1.8 V external reference voltage. The ADC has an auto-calibration function

which calibrates the gain and offset.

2.13.2. Continuous Time Comparators

The continuous-time comparator can be used to compare a pre-selected GPIO’s input pairs or one dedicated

comparator input pair. The output of the comparator is provided as continuous and latched data.

2.13.3. Internal Junction Temperature Monitoring Diode

On-die junction temperature can be monitored using the internal junction temperature monitoring diode. The PTAT

(proportional to absolute temperature) diode voltage can be monitored by the ADC to provide a digital temperature

readout. Refer to CrossLink-NX ADC Usage Guide (FPGA-TN-02129) for more details.

2.14. IEEE 1149.1-Compliant Boundary Scan Testability

All CrossLink-NX devices have boundary scan cells that are accessed through an IEEE 1149.1 compliant Test

Access Port

(TAP). This allows functional testing of the circuit board on which the device is mounted through a

serial scan path that

can access all critical logic nodes. Internal registers are linked internally, allowing test data to

be shifted in and loaded

directly onto test nodes, or test data to be captured and shifted out for verification. The test

access port consists of

dedicated I/O: TDI, TDO, TCK, and TMS. The test access port uses VCCIO1 for power

supply. The test access port is

supported for VCCIO1 = 1.8 V - 3.3 V.

For more information, refer to CrossLink-NX sysCONFIG Usage Guide (FPGA-TN-02099).

2.15. Device Configuration

All CrossLink-NX devices contain two ports that can be used for device configuration. The Test Access Port

(TAP), which

supports bit-wide configuration, and the sysCONFIG port, support serial, quad, and byte configuration. The TAP

supports both the IEEE Standard 1149.1 Boundary Scan specification and the IEEE Standard

1532 In-System

Configuration specification. The JTAG_EN is the only dedicated pin supported by sysCONFIG. PPROGRAMN/INITN/DONE

are enabled by default, but can be turned into GPIO. The remaining sysCONFIG pins are used as dual function pins.

Refer to CrossLink-NX sysCONFIG Usage Guide (FPGA-TN-02099) for more information about using

the dual-use pins as

general purpose I/O.

There are various ways to configure a CrossLink-NX device:

 JTAG

 Standard Serial Peripheral Interface (SPI) – Interface to boot PROM Support x1, x2, x4 wide SPI memory

interfaces.

(Master SPI mode)

 Inter-Integrated Circuit Bus (I2C)

 Improved Inter-Integrated Circuit Bus (I3C)

 System microprocessor to drive a serial slave SPI port (SSPI mode)

CrossLink-NX Family

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FPGA-DS-02049-0.83 45

 Lattice Memory Mapped Interface (LMMI), refer to CrossLink-NX sysI/O Usage Guide (FPGA-TN-02067) for

condition.

 JTAG, SSPI, MSPI, I2C, and I3C are supported for VCCIO = 1.8 V - 3.3 V

On power-up, based on the voltage level (high or low) of the PROGRAMN pin the FPGA SRAM is configured by the

appropriate sysCONFIG port. If PROGRAMN pin is low, the FPGA is in the Slave configuration ports (Slave SPI, Slave I2C

or Slave I3C) and is waiting for the correct Slave Configuration port activation key. PROGRAMN pin must be driven high

within 400 ns of the end of transmission of the Slave Configuration port activation key, that is, the de-assertion of

SCSN. If no slave port is declared active before the PROGRAMN pin is sensed HIGH, the FPGA is in Master SPI booting

sequence (mode). In Master SPI booting mode, the FPGA boots from an external SPI boot PROM. Once a configuration

port is activated, it remains active throughout that configuration cycle. The IEEE 1149.1 port can be activated any

time

after power-up by enabling the JTAG_EN pin and sending the appropriate command through the TAP port.

2.15.1. Enhanced Configuration Options

CrossLink-NX devices have enhanced configuration features such as:

 Early I/O release

 Bitstream Decryption

 Decompression Support

 Watchdog Timer support

 Dual and Multi-boot image support

Early I/O Release is a new configuration feature in which certain I/O banks are released earlier so that customer

systems have minimal disruption. For more details, refer to CrossLink-NX sysCONFIG Usage Guide (FPGA-TN-02099).

Note that for Engineer Sample silicon (ES suffix), an Early I/O Release enabled bitstream is not compatible with direct

SRAM programming (aka Fast Programming in Radiant Programmer). If attempted, the configuration operation fails

and the part must be power-cycled before it can accept a non-Early I/O Release enabled bitstream.

Watchdog Timer is a new configuration feature that helps you add a programmable timer option for timeout

applications.

2.15.2.1. Dual-Boot and Multi-Boot Image Support

Dual-boot and multi-boot images are supported for applications requiring reliable remote updates of configuration

data for the system FPGA. After the system is running with a basic configuration, a new boot image can be downloaded

remotely and stored in a separate location in the configuration storage device. Any time after the update the

CrossLink-

NX devices can be re-booted from this new configuration file. If there is a problem, such as corrupt

data during

download or incorrect version number with this new boot image, the CrossLink-NX device can revert

back to the

original backup golden configuration and try again. This all can be done without power cycling the system. For more

information, refer to CrossLink-NX sysCONFIG Usage Guide (FPGA-TN-02099).

CrossLink-NX Family

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46 FPGA-DS-02049-0.83

2.16. Single Event Upset (SEU) Support

CrossLink-NX devices are unique due to the underlying technology used to build these devices is much more robust and

less prone to soft errors.

CrossLink-NX devices have an improved hardware implemented Soft Error Detection (SED) circuit which can be used to

detect SRAM errors and allow them to be corrected. There are two layers of SED implemented in CrossLink-NX making

it more robust and reliable.

The SED hardware in CrossLink-NX devices is part of the Configuration block. The SED module in CrossLink-NX is an

enhanced version as compared to the SED modules implemented in other Lattice devices. The configuration data is

divided into frames so that the entire FPGA can be programmed precisely with ease. The SED hardware reads data

from the FPGAs configuration memory and performs Error Correcting Code (ECC) calculation on every frame of

configuration data (see Figure 2.1). Once a single bit of error is detected, Soft Error Upset (SEU), a notification is

generated and SED resumes operation. For single bit errors, the corrected value is rewritten to the particular frame

using ECC information. If more than one-bit error is detected within one frame of configuration data, an error message

is generated. CrossLink-NX devices also have a dedicated logic to perform Cycle Redundancy Code (CRC) checks. This

CRC runs in parallel for the entire bitstream along with ECC.

After the ECC is calculated on all frames of configuration data, Cyclic Redundancy Check (CRC) is calculated for the

entire configuration data (bitstream). The data that is read, and the ECC and CRC calculated, do not include EBR Big

SRAM and distributed RAM memory.

For further information on SED support, refer to CrossLink-NX Soft Error Detection (SED)/Correction (SEC) Usage Guide

(FPGA-TN-02076).

2.17. On-Chip Oscillator

The CrossLink-NX device features two different frequency Oscillators. One is tailored for low-power operation that runs

at low frequency (LFOSC). Both Oscillators are controlled with internally generated current.

The LFOSC runs at nominal frequency of 128 kHz. The high frequency oscillator (HFOSC) runs at a nominal frequency of

450 MHz, divisible to 2 MHz to 256 MHz by user option. The LFOSC always run, thus can be used to perform all always-

on functions with the lowest power possible.

2.18. User I²C IP

The CrossLink-NX device has one I²C IP core. The core can be configured either as an I²C master or as an I²C slave. The

pins for the I²C interface are pre-assigned.

The core has the option to delay the either the input or the output, or both, by 50 ns nominal, using dedicated on-chip

delay elements. This provides an easier interface with any external I2C components. In addition, 50 ns glitch filters are

available for both SDA and SCL.

When the IP core is configured as master, it is able to control other devices on the I2C bus through the pre-assigned pin

interface. When the core is configured as the slave, the device is able to provide, for example, I/O expansion to an I²C

Master. The I²C core supports the following functionality:

 Master and Slave operation

 7-bit and 10-bit addressing

 Multi-master arbitration support

 Clock stretching

 Up to 1 MHz data transfer speed (Standard-Mode, Fast-Mode, Fast-Mode Plus)

 General Call support

 Optional receive and transmit data FIFOs with programmable sizes

 Optionally 50 ns delay on input or output data, or both

 Hard-Connection and Programmable I/O Connection Support

 Programmable to a mode compliant with I3C requirements on legacy I2C Slave Devices.

 Fast-Mode and Fast-Mode Plus Support

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FPGA-DS-02049-0.83 47

 Disabled Clock Stretching

 50 ns SCL and SDA Glitch Filter

 Programmable 7-bit Address

For further information on the User I²C, refer to CrossLink-NX I2C Hardened IP Usage Guide (FPGA-TN-02142).

2.19. Density Shifting

The CrossLink-NX family is designed to ensure that different density devices in the same family and in the same

package have the same pinout. Furthermore, the architecture ensures a high success rate when performing design

migration from lower density devices to higher density devices. In many cases, it is also possible to shift a lower

utilization design targeted for a high-density device to a lower density device. However, the exact details of the final

resource utilization impact the likelihood of success in each case. An example is that some user I/O may

become No

Connects in smaller devices in the same package. Refer to the CrossLink-NX Pin Migration Tables

and Lattice Radiant

software for specific restrictions and limitations.

2.20. MIPI D-PHY Blocks

The top side of the device includes two Hardened MIPI D-PHY quads. The Hardened D-PHY can be configured to

support either Camera Serial Interface (CSI-2) or Display Serial Interface (DSI) applications as either transmitter or

receiver. Below is a summary of the features supported by the Hardened D-PHY quads.

 Transmit and receive compliant to MIPI Alliance’s MIPI D-PHY Specification version 1.2

 High-Speed (HS) and Low-Power (LP) mode support (including built-in contention detection)

 Supports continuous clock mode or low power (non-continuous) clock mode

 Up to 10 Gbps per quad (2500 Mbps data rate per lane)

 Supports up to 4 data lanes and one clock lane per Hardened D-PHY

CrossLink-NX’s programmable I/O can also be configured as MIPI D-PHYs, referred to as Soft MIPI D-PHY. The Soft D-

PHY can be configured to support either Camera Serial Interface (CSI-2) or Display Serial Interface (DSI) applications as

either transmitter or receiver. Below is a summary of the features supported by the Soft D-PHY.

 Transmit and receive compliant to MIPI Alliance’s MIPI D-PHY Specification version 1.2

 High-Speed (HS) and Low-Power (LP) mode support (including built-in contention detection)

 Supports continuous clock mode or low power (non-continuous) clock mode

 Up to 6 Gbps per port (1500 Mbps data rate per lane) in 121 csfBGA package

 Up to 5 Gbps per port (1250 Mbps data rate per lane) in other packages

 Supports up to 4 data lanes and one clock lane per port

2.21. Peripheral Component Interconnect Express (PCIe)

The CrossLink-NX-40 Device features one lane of hardened PCIe block on the top side of the device. The PCIe block

implements all three layers defined by the PCI Express Specification: Physical, Data Link, and Transaction as shown in

Figure 2.28. Below is a summary of the features supported by the PCIe:

 Gen 1 (2.5 Gb/s) and Gen 2 (5.0 Gb/s) speed

 PCIe Express Base Specification 3.0 compliant including compliance with earlier PCI Express Specifications

 Multi-function support with up to four physical functions

 Endpoint support

 Type 0 Configuration Registers in Endpoint Mode

 Complete Error-Handling Support

 32-bit Core Data Width

 Many power management features including power budgeting

CrossLink-NX Family

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48 FPGA-DS-02049-0.83

PHY

Layer

Data

Link

Layer

Trans

Layer

PHY

Layer

Data

Link

Layer

Trans

Layer

CLK, CONFIGURATION, AND MANAGEMENT

CONFIGURATION REGISTERS

PHY Interface (PIPE)

PHY TX

PHY RX

VC0_TX

VC0_RX

Power Management

Error Reporting (AER)

LMMI

PCI Express Core

Figure 2.28. PCIe Core

The hardened PCIe block can be instantiated with the primitive PCIe through Lattice Radiant software however, it is not

recommended to directly instantiate the PCIe primitive itself. It is highly recommended to generate the PCIe Endpoint

Soft IP through IP Express instead. In Figure 2.29, the PCIe core is configured as Endpoint using the Soft logic and this

Endpoint soft IP provides a wrapper around the PCIe primitive as well as providing useful functions such as bridging

support for bus interfaces and DMA applications. In addition to the standard Transaction Layer Packet (TLP) interface,

the data interface can also be configured to be AXI4 or AHB-Lite interfaces as well. The PCIe hardened block also

features a register interface of LMMI and User Configuration Space Register Interface (UCFG). With the soft IP, the

interface can be configured to APB or AHB-Lite as well. The PCIe block contains many registers which contains

information about the current status of the PCIe block as well as the capability to dynamically switch PCIe settings. One

easy way to access these registers is through the Reveal Controller Tool.

For more information about the PCIe soft IP, refer to the PCIe Endpoint IP Core document.

Data Interface Conversion

Transaction

Layer Link Layer PHY Layer

AHB-Lite

/AXI-4

AHB-Lite

/APB

Rx TLP

Tx TLP

LMMI

UCFG

rxp_i/

rxpn_i

txp_o/

txpn_o

refclkp_i/

refclkn_i

Top

Soft Logic PCIe Hard IP

Figure 2.29. PCIe Soft IP Wrapper

CrossLink-NX Family

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FPGA-DS-02049-0.83 49

2.22. Cryptographic Engine

The CrossLink-NX family of devices support several cryptographic features that helps customer secure their design.

Some of the key cryptographic features include Advanced Encryption Standard (AES), Hashing Algorithms and true

random number generator (TRNG). The CrossLink-NX device also features bitstream encryption (using AES-256) and

bitstream authentication (using ECDSA), which protects the FPGA design bitstream from copying and tampering.

The Cryptographic Engine (CRE) is the main engine, which is responsible for the bitstream encryption as well as

authentication of the CrossLink-NX device. Once the bitstream is authenticated and the device is ready for user

functions, the CRE is available for you to implement various cryptographic functions in your FPGA design. To enable

specific cryptographic function, the CRE has to be configured by setting a few registers.

The Cryptographic Engine supports the below user-mode features:

 True Random Number generator (TRNG)

 Secure Hashing Algorithm (SHA)-256 bit

 Message authentication codes (MACs) – HMAC

 Lattice Memory Mapped Interface (LMMI) interface to user logic

 High Speed Port (HSP) for FIFO-based streaming data transfer

Cryptographic Engine (CRE)

FPGA

Fabric

LMMI /

High Speed Port

Control Register

CRE Registers

True Random Number Generator (TRNG)

Bitstream Encryption

Bitstream Authentication

SHA256

HMAC SHA256

Unique ID

Advanced Encryption Standard (AES)

Figure 2.30. Cryptographic Engine Block Diagram

CrossLink-NX Family

Preliminary Data Sheet

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50 FPGA-DS-02049-0.83

3. DC and Switching Characteristics

3.1. Absolute Maximum Ratings

Table 3.1. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Unit

VCC, VCCECLK

Supply Voltage

–0.5

1.10

VCCAUX, VCCAUXA,

VCCAUXH3, VCCAUXH4,

VCCAUXH5

Supply Voltage

–0.5

1.98

VCCIO0, 1, 2, 6, 7

I/O Supply Voltage

–0.5

3.63

VCCIO3, 4, 5

I/O Supply Voltage

–0.5

1.98

VCCPLL_DPHY0, 1

Hardened D-PHY PLL Supply Voltage

–0.5

1.10

VCCPLLSD0

SERDES Block PLL Supply Voltage

–0.5

1.98

VCCA_DPHY0, 1

Analog Supply Voltage for Hardened D-PHY

–0.5

1.98

VCC_DPHY0, 1

Digital Supply Voltage for Hardened D-PHY

–0.5

1.10

VCCSD0

SERDES Supply Voltage

–0.5

1.10

VCCADC18

ADC Block 1.8 V Supply Voltage

–0.5

1.98

VCCAUXSD

SERDES and AUX Supply Voltage

–0.5

1.98

—

Input or I/O Voltage Applied, Bank 0, Bank

1,Bank 2, Bank 6, Bank 7

–0.5

3.63

—

Input or I/O Voltage Applied, Bank 3, Bank 4,

Bank 5

–0.5

1.98

—

Voltage Applied on SERDES Pins

–0.5

1.98

Storage Temperature (Ambient)

–65

150

°C

Junction Temperature

—

+125

°C

Notes:

1. Stress above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. Functional

operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is

not implied.

2. Compliance with the Lattice Thermal Management document is required.

3. All voltages referenced to GND.

4. All VCCAUX should be connected on PCB.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 51

3.2. Recommended Operating Conditions1, 2, 3

Table 3.2. Recommended Operating Conditions

Symbol

Parameter

Conditions

Min

Typ.

Max

Unit

VCC, VCCECLK

Core Supply Voltage

VCC = 1.0

0.95

1.00

1.05

VCCAUX

Auxiliary Supply Voltage

Bank 0, Bank 1, Bank 2, Bank 6,

Bank 7

1.746

1.80

1.89

VCCAUXH3/4/5

Auxiliary Supply Voltage

Bank 3, Bank 4, Bank 5

1.746

1.80

1.89

VCCAUXA

Auxiliary Supply Voltage for

core logic

—

1.746

1.80

1.89

VCCIO

I/O Driver Supply Voltage

VCCIO = 3.3 V, Bank 0, Bank 1,

Bank 2, Bank 6, Bank 7

3.135

3.30

3.465

VCCIO = 2.5 V, Bank 0, Bank 1,

Bank 2, Bank 6, Bank 7

2.375

2.50

2.625

VCCIO = 1.8 V, All Banks

1.71

1.80

1.89

VCCIO = 1.5 V, All Banks4

1.425

1.50

1.575

VCCIO = 1.35 V, All Banks (For

DDR3L Only)

1.2825

1.35

1.4175

VCCIO = 1.2 V, All Banks4

1.14

1.20

1.26

VCCIO = 1.0 V, Bank 3, Bank 4,

Bank 5

0.95

1.00

1.05

D-PHY External Power Supplies

VCCA_D-PHY

D-PHY Analog Power

Supply

—

1.71

1.80

1.89

VCC_D-PHY

D-PHY Digital Power Supply

—

0.95

1.00

1.05

VCCPLL_D-PHY

D-PHY PLL Power Supply

—

0.95

1.00

1.05

ADC External Power Supplies

VCCADC18

ADC 1.8 V Power Supply

—

1.71

1.80

1.89

SERDES Block External Power Supplies

VCCSD0

Supply Voltage for SERDES

Block and SERDES I/O

—

0.95

1.00

1.05

VCCPLLSD0

SERDES Block PLL Supply

Voltage

—

1.71

1.80

1.89

VCCAUXSD

SERDES Block Auxiliary

Supply Voltage

—

1.71

1.80

1.89

Operating Temperature

tJCOM

Junction Temperature,

Commercial Operation

—

°C

tJIND

Junction Temperature,

Industrial Operation

—

–40

—

100

°C

Notes:

1. For correct operation, all supplies must be held in their valid operation voltage range.

2. All supplies with same voltage should be from the same voltage source. Proper isolation filters are needed to properly isolate

noise from each other.

3. Common supply rails must be tied together except SERDES.

4. MSPI (Bank0) and JTAG, SSPI, I2C, and I3C (Bank 1) ports are supported for VCCIO = 1.8 V to 3.3 V.

CrossLink-NX Family

Preliminary Data Sheet

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52 FPGA-DS-02049-0.83

3.3. Power Supply Ramp Rates

Table 3.3. Power Supply Ramp Rates

Symbol

Parameter

Min

Typ

Max

Unit

tRAMP

Power Supply ramp rates for all supplies 1

0.1

—

V/ms

Notes:

1. Assumes monotonic ramp rates.

2. All supplies need to be in the operating range as defined in Recommended Operating Conditions1, when the device has

completed configuration and entering into User Mode. Supplies that are not in the operating range needs to be adjusted to

faster ramp rate, or you have to delay configuration or wake up.

3.4. Power up Sequence

Power-On-Reset (POR) puts the CrossLink-NX device into a reset state. There is no power up sequence required for the

CrossLink-NX device.

3.5. On-Chip Programmable Termination

The CrossLink-NX devices support a variety of programmable on-chip terminations options, including:

 Dynamically switchable Single-Ended Termination with programmable resistor values of 40 Ω, 50 Ω, 60 Ω, or 75 Ω.

 Common mode termination of 100 Ω for differential inputs.

VREF

OFF-chip ON-chip

Parallel Single-Ended Input

TERM

control

VCCIO

Zo = 40 , 50 , 60 , or 75

to VCCIO /2

2Zo

Zo = 50

Differential Input

OFF-chip ON-chip

Figure 3.1. On-Chip Termination

See Table 3.4 for termination options for input modes.

Table 3.4. On-Chip Termination Options for Input Modes

IO_TYPE

Differential Termination Resistor*

Terminate to VCCIO/2*

subLVDS

100, OFF

OFF

SLVS

100, OFF

OFF

MIPI_DPHY

100

OFF

HSTL15D_I

100, OFF

OFF

SSTL15D_I

100, OFF

OFF

SSTL135D_I

100, OFF

OFF

HSUL12D

100, OFF

OFF

LVCMOS15H

OFF

LVCMOS12H

OFF

LVCMOS10H

OFF

LVCMOS12H

OFF

LVCMOS10H

OFF

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 53

IO_TYPE

Differential Termination Resistor*

Terminate to VCCIO/2*

LVCMOS18H

OFF

OFF, 40, 50, 60, 75

HSTL15_I

OFF

SSTL15_I

OFF

OFF, 40, 50, 60, 75

SSTL135_I

OFF

OFF, 40, 50, 60, 75

HSUL12

OFF

OFF, 40, 50, 60, 75

*Notes:

 TERMINATE to VCCIO/2 (Single-Ended) and DIFFRENTIAL TERMINATION RESISTOR when turned on can only have

one setting per

bank. Only left and right banks have this feature.

 Use of TERMINATE to VCCIO/2 and DIFFRENTIAL TERMINATION RESISTOR are mutually exclusive in an I/O bank.

On-chip

termination tolerance –10%/+60%.

Refer to CrossLink-NX sysI/O Usage Guide (FPGA-TN-02067) for on-chip termination usage and value ranges.

3.6. Hot Socketing Specifications

Table 3.5. Hot Socketing Specifications for GPIO

Symbol

Parameter

Condition

Min

Typ

Max

Unit

IDK

Input or I/O Leakage Current for

Wide Range I/O (excluding

MCLK/MCSN/MOSI/INITN/DONE)

0 < Vin < Vih(max)

0 < Vcc < Vcc(max)

0 < Vccio < Vccio(max)

0 < Vccaux < Vccaux(max)

—

Input of I/O Leakage Current for

MCLK/MCSN/MOSI/INITN/DONE

pins

VCCIO < VIN < VCCIO + 0.5 V

—

Input or I/O Leakage Current for

Bottom Bank

VCCIO < VIN < VCCIO + 0.5 V

—

Notes:

1. IDK is additive to IPU, IPW, or IBH.

2. Hot socket specification defines when the hot socketed device's junction temperature is at 85 oC or below. When the hot

socketed device's

junction temperature is above 85 oC, the IDK current can exceed the above spec.

3.7. ESD Performance

Refer to the CrossLink-NX Product Family Qualification Summary for complete qualification data,

including ESD

performance.

CrossLink-NX Family

Preliminary Data Sheet

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54 FPGA-DS-02049-0.83

3.8. DC Electrical Characteristics

Table 3.6. DC Electrical Characteristics – Wide Range (Over Recommended Operating Conditions)

Symbol

Parameter

Condition

Min

Typ

Max

Unit

IIL, IIH1

Input or I/O Leakage current

(Commercial/Industrial)

0 ≤ VIN ≤ VCCIO

—

µA

IIH2

Input or I/O Leakage current

VCCIO ≤ VIN ≤ VIH (max)

—

100

µA

IPU

I/O Weak Pull-up Resistor

Current

0 ≤ VIN ≤ 0.7 * VCCIO

–30

—

–150

µA

IPD

I/O Weak Pull-down Resistor

Current

VIL (max) ≤ VIN ≤ VCCIO

—

150

µA

IBHLS

Bus Hold Low Sustaining Current

VIN = VIL (max)

—

µA

IBHHS

Bus Hold High Sustaining Current

VIN = 0.7 * VCCIO

–30

—

µA

IBHLO

Bus hold low Overdrive Current

0 ≤ VIN ≤ VCCIO

—

150

µA

IBHHO

Bus hold high Overdrive Current

0 ≤ VIN ≤ VCCIO

—

–150

µA

VBHT

Bus Hold Trip Points

—

VIL (max)

—

VIH (min)

Notes:

1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output tristated. Bus

Maintenance circuits are disabled.

2. The input leakage current IIH is the worst case input leakage per GPIO when the pad signal is high and also higher than the bank

VCCIO. This is considered a mixed mode input.

3. The hot socket input leakage current IDK specification is shown above. This assumes a monotonic ramp up time of the power

supply after it begins to rise and until it reaches its minimum operation level.

4. I/O Pin capacitance from simulations show a typical range of 3-7 pF @ 25°, F=1 MHz and typical conditions with bus

maintenance circuits disabled.

Table 3.7. DC Electrical Characteristics – High Speed (Over Recommended Operating Conditions)

Symbol

Parameter

Condition

Min

Typ

Max

Unit

IIL, IIH1

Input or I/O Leakage

0 ≤ VIN ≤ VCCIO

—

µA

IPU

I/O Weak Pull-up Resistor

Current

0 ≤ VIN ≤ 0.7 * VCCIO

–30

—

–150

µA

IPD

I/O Weak Pull-down Resistor

Current

VIL (max) ≤ VIN ≤ VCCIO

—

150

µA

IBHLS

Bus Hold Low Sustaining Current

VIN = VIL (max)

—

µA

IBHHS

Bus Hold High Sustaining Current

VIN = 0.7 * VCCIO

–30

—

µA

IBHLO

Bus hold low Overdrive Current

0 ≤ VIN ≤ VCCIO

—

150

µA

IBHHO

Bus hold high Overdrive Current

0 ≤ VIN ≤ VCCIO

—

–150

µA

VBHT

Bus Hold Trip Points

—

VIL

(max)

—

VIH (min)

Notes:

1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output tristated. Bus

Maintenance circuits are disabled.

2. To be updated after design sims.

3. I/O Pin capacitance from simulations show a typical value of 3 pF @ 25°, F=1 MHz and typical conditions with bus maintenance

circuits disabled.

Table 3.8. Capacitors – Wide Range (Over Recommended Operating Conditions)

Symbol

Parameter

Condition

Min

Typ

Max

Unit

C1*

I/O Capacitance*

VCCIO = 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V,

VCC = typ., VIO = 0 to VCCIO + 0.2V

—

C2*

Dedicated Input Capacitance*

VCCIO = 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V,

VCC = typ., VIO = 0 to VCCIO + 0.2V

—

*Note: TA 25 oC, f = 1.0 MHz.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 55

Table 3.9. Capacitors – High Performance (Over Recommended Operating Conditions)

Symbol

Parameter

Condition

Min

Typ

Max

Unit

C1*

I/O Capacitance*

VCCIO = 1.8 V, 1.5 V, 1.2 V, VCC = typ.,

VIO = 0 to VCCIO + 0.2V

—

C2*

Dedicated Input Capacitance*

VCCIO = 1.8 V, 1.5 V, 1.2 V, VCC = typ.,

VIO = 0 to VCCIO + 0.2V

—

C3*

D-PHY I/O Capacitance

VCCA_D-PHY = 1.8 V, VCC = typ., VIO = 0

to VCCA_D-PHY + 0.2V

—

C4*

SERDES I/O Capacitance

VCCSD0 = 1.0 V, VCC = typ., VIO = 0 to

VCCSD0 + 0.2 V

—

*Note: TA 25 oC, f = 1.0 MHz.

Table 3.10. Single Ended Input Hysteresis – Wide Range (Over Recommended Operating Conditions)

IO_TYPE

VCCIO

TYP Hysteresis

LVCMOS33

3.3 V

250 mV

LVCMOS25

3.3 V

200 mV

2.5 V

250 mV

LVCMOS18

1.8 V

180 mV

LVCMOS15

1.5 V

50 mV

LVCMOS12

1.2 V

LVCMOS10

1.2 V

Table 3.11. Single Ended Input Hysteresis – High Performance (Over Recommended Operating Conditions)

IO_TYPE

VCCIO

TYP Hysteresis

LVCMOS18H

1.8 V

180 mV

LVCMOS15H

1.8 V

50 mV

150 mV

1.5 V

LVCMOS12H

1.2 V

LVCMOS10H

1.0 V

> 25 mV

MIPI-LP-RX

1.2 V

180 mV

3.9. Supply Currents

For estimating and calculating current, use Power Calculator in Lattice Design Software.

This operating and peak current is design dependent, and can be calculated in Lattice Design Software. Some blocks

can be placed into low current standby modes. Refer to Power Management and Calculation for CrossLink-NX Devices

(FPGA-TN-02075).

CrossLink-NX Family

Preliminary Data Sheet

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56 FPGA-DS-02049-0.83

3.10. sysI/O Recommended Operating Conditions

Table 3.12. sysI/O Recommended Operating Conditions

Standard

Support Banks

VCCIO (Input)

VCCIO (Output)

Typ.

Single-Ended

LVCMOS33

0, 1, 2, 6, 7

3.3

LVTTL33

0, 1, 2, 6, 7

3.3

LVCMOS25¹, ²

0, 1, 2, 6, 7

2.5, 3.3

2.5

LVCMOS18¹, ²

0, 1, 2, 6, 7

1.2, 1.5, 1.8, 2.5, 3.3

1.8

LVCMOS18H

3, 4, 5

1.8

LVCMOS15¹, ²

0, 1, 2, 6, 7

1.2, 1.5, 1.8, 2.5, 3.3

1.5

LVCMOS15H¹

3, 4, 5

1.5, 1.8

1.5

LVCMOS12¹, ²

0, 1, 2, 6, 7

1.2, 1.5, 1.8, 2.5, 3.3

1.2

LVCMOS12H¹

3, 4, 5

1.2, 1.357, 1.5, 1.8

1.2

LVCMOS10¹

0, 1, 2, 6, 7

1.2, 1.5, 1.8, 2.5, 3.3

—

LVCMOS10H¹

3, 4, 5

1.0, 1.2, 1.357, 1.5, 1.8

1.0

LVCMOS10R¹

3, 4, 5

1.0, 1.2, 1.357, 1.5, 1.8

—

SSTL135_I, SSTL135_II3

3, 4, 5

1.357

1.35

SSTL15_I, SSTL15_II3

3, 4, 5

1.58

HSTL15_I3

3, 4, 5

1.58

HSUL123

3, 4, 5

1.2

MIPI D-PHY LP Input3, 6

3, 4, 5

1.2

Differential6

LVDS

3, 4, 5

1.8

LVDSE5

0, 1, 2, 6, 7

—

2.5

subLVDS

3, 4, 5

1.8

—

subLVDSE5

0, 1, 2, 6, 7

—

1.8

subLVDSEH5

3, 4, 5

—

1.8

SLVS6

3, 4, 5

1.0, 1.2, 1.357, 1.5, 1.84

1.2, 1.357, 1.5, 1.8 4

MIPI D-PHY6

3, 4, 5

1.2

LVCMOS33D5

0, 1, 2, 6, 7

—

3.3

LVTTL33D5

0, 1, 2, 6, 7

—

3.3

LVCMOS25D5

0, 1, 2, 6, 7

—

2.5

SSTL135D_I, SSTL135D_II5

3, 4, 5

—

1.357

SSTL15D_I, SSTL15D_II5

3, 4, 5

—

1.5

HSTL15D_I5

3, 4, 5

—

1.5

HSUL12D5

3, 4, 5

—

1.2

Notes:

1. Single-ended input can mix into I/O Banks with VCCIO different from the standard requires due to some of these input standards

use internal supply voltage source (VCC, VCCAUX) to power the input buffer, which makes them to be independent of VCCIO

voltage. For more details, please refer to CrossLink-NX sysI/O Usage Guide (FPGA-TN-02067). The following is a brief guideline

to follow:

a. Weak pull-up on the I/O must be set to OFF.

b. Bank 3, Bank 4, and Bank 5 I/O can only mix into banks with VCCIO higher than the pin standard, due to clamping diode on

the pin in these banks. Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7 does not have this restriction.

c. LVCMOS25 uses VCCIO supply on input buffer in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7. It can be supported with VCCIO =

3.3 V to meet the VIH and VIL requirements, but there is additional current drawn on VCCIO. Hysteresis has to be disabled

when using 3.3 V supply voltage.

d. LVCMOS15 uses VCCIO supply on input buffer in Bank 3, Bank 4, and Bank 5. It can be supported with VCCIO = 1.8 V to meet

the VIH and VIL requirements, but there is additional current drawn on VCCIO.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 57

2. Single-ended LVCMOS inputs can mixed into I/O Banks with different VCCIO, providing weak pull-up is not used.

For additional information on Mixed I/O in Bank VCCIO, refer to CrossLink-NX sysI/O Usage Guide (FPGA-TN-02067).

3. These inputs use differential input comparator in Bank 3, Bank 4, and Bank 5. The differential input comparator uses VCCAUXH

power supply. These inputs require the VREF pin to provide the reference voltage in the Bank. Refer to CrossLink-NX sysI/O

Usage Guide (FPGA-TN-02067) for details.

4. All differential inputs use differential input comparator in Bank 3, Bank 4, and Bank 5. The differential input comparator uses

VCCAUXH power supply. There is no differential input signaling supported in Bank 0, Bank 1, Bank 2, Bank 6, and Bank 7.

5. These outputs are emulating differential output pair with single-ended output drivers with true and complement outputs

driving on each of the corresponding true and complement output pair pins. The common mode voltage, VCM, is ½ * VCCIO. Refer

to CrossLink-NX sysI/O Usage Guide (FPGA-TN-02067) for details.

6. Soft MIPI D-PHY HS using sysI/O is supported with SLVS input and output that can be placed in banks with VCCIO voltage shown

in SLVS. D-PHY with HS and LP modes supported needs to be placed in banks with VCCIO voltage = 1.2 V. Soft MIPI D-PHY LP input

and output using sysI/O are supported with LVCMOS12.

7. VCCIO = 1.35 V is only supported in Bank 3, Bank 4, and Bank 5, for use with DDR3L interface in the bank. These Input and Output

standards can fit into the same bank with the VCCIO = 1.35 V.

8. LVCMOS15 input uses VCCIO supply voltage. If VCCIO is 1.8 V, the DC levels for LVCMOS15 are still met, but there could be increase

in input buffer current.

3.11. sysI/O Single-Ended DC Electrical Characteristics

Table 3.13. sysI/O DC Electrical Characteristics – Wide Range I/O (Over Recommended Operating Conditions)

Input/Output

Standard

VIL¹

VIH¹

VOL Max

(V)

VOH Min²

(V)

IOL(mA)

IOH(mA)

Min (V)

Max (V)

Min (V)

Max (V)

LVTTL33

LVCMOS33

0.8

2.0

3.465

0.4

VCCIO – 0.4

2, 4, 8, 12

-2, -4, -8,

-12

0.2

VCCIO – 0.2

0.1

LVCMOS25

0.7

1.7

2.625

0.4

VCCIO – 0.4

2, 4, 8, 10

-2, -4, -8,

-10

0.2

VCCIO – 0.2

0.1

LVCMOS18

0.35 * VCCIO

0.65 * VCCIO

1.9

0.4

VCCIO – 0.4

2, 4, 8

-2, -4, -8

0.2

VCCIO – 0.2

0.1

LVCMOS15

0.35 * VCCIO

0.65 * VCCIO

1.575

0.4

VCCIO – 0.4

2, 4

-2, -4, -8,

-12

0.2

VCCIO – 0.2

0.1

LVCMOS12

0.35 * VCCIO

0.65 * VCCIO

1.26

0.4

VCCIO – 0.4

2, 4

-2, -4, -8,

-12

0.2

VCCIO – 0.2

0.1

LVCMOS10

0.3 * VCCIO

0.7 * VCCIO

1.05

No O/P Support

Notes:

1. VCCIO for input level refers to the supply rail level associated with a given input standard or the upstream driver VCCIO rail levels.

2. VCCIO for the output levels refer to the VCCIO of the CrossLink-NX device.

CrossLink-NX Family

Preliminary Data Sheet

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58 FPGA-DS-02049-0.83

Table 3.14. sysI/O DC Electrical Characteristics – High Performance I/O (Over Recommended Operating Conditions)

Input/Output

Standard

VIL¹

VIH¹

VOL Max

(V)

VOH Min²

(V)

IOL (mA)

IOH (mA)

Min (V)

Max (V)

Min (V)

Max (V)

LVCMOS18H

0.35 *

VCCIO

0.65 * VCCIO

1.9

0.4

VCCIO – 0.4

2, 4, 8, 12

-2, -4, -8,

-12

0.2

VCCIO – 0.2

0.1

-0.1

LVCMOS15H

0.35 *

VCCIO

0.65 * VCCIO

1.575

0.4

VCCIO – 0.4

2, 4, 8

-2, -4, -8

0.2

VCCIO – 0.2

0.1

-0.1

LVCMOS12H

0.35 *

VCCIO

0.65 * VCCIO

1.26

0.4

VCCIO – 0.4

2, 4, 8

-2, -4, -8

0.2

VCCIO – 0.2

0.1

-0.1

LVCMOS10H

0.3 * VCCIO

0.7 * VCCIO

1.05

0.25 *

VCCIO

0.75 * VCCIO

2, 4

-2, -4

0.1

VCCIO – 0.1

0.1

-0.1

SSTL15_I

VREF – 0.10

VREF + 0.1

1.575

0.30

VCCIO – 0.30

7.5

–7.5

SSTL15_II

VREF – 0.10

VREF + 0.1

1.575

0.30

VCCIO – 0.30

8.8

–8.8

HSTL15_I

VREF – 0.10

VREF + 0.1

1.575

0.40

VCCIO – 0.40

–8

SSTL135_I

VREF – 0.09

VREF + 0.09

1.418

0.27

VCCIO – 0.27

6.75

–6.75

SSTL135_II

VREF – 0.09

VREF + 0.09

1.418

0.27

VCCIO – 0.27

–8

LVCMOS10R

VREF – 0.10

VREF + 0.10

1.05

—

HSUL12

VREF – 0.10

VREF + 0.10

1.26

0.3

VCCIO – 0.3

8.8, 7.5,

6.25, 5

-8.8, -7.5,

-6.25, -5

Notes:

1. VCCIO for input level refers to the supply rail level associated with a given input standard or the upstream driver VCCIO rail levels.

2. VCCIO for the output levels refer to the VCCIO of the CrossLink-NX device.

Table 3.15. I/O Resistance Characteristics (Over Recommended Operating Conditions)

Parameter

Description

Test Conditions

Min

Typ

Max

Unit

50RS

Output Drive Resistance when 50RS

Drive Strength Selected

VCCIO = 1.8 V, 2.5 V, or 3.3 V

—

Ω

RDIFF

Input Differential Termination

Resistance

Bank 3, Bank 4, and Bank 5, for I/O

selected to be differential

100

Ω

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 59

3.12. sysI/O Differential DC Electrical Characteristics

3.12.1. LVDS

LVDS input buffer on CrossLink-NX is operating with VCCAUX = 1.8 V and independent of Bank VCCIO voltage. LVDS output

buffer is powered by the Bank VCCIO at 1.8 V.

LVDS can only be supported in Bank 3, Bank 4, and Bank 5. LVDS25 output can be emulated with LVDS25E in Bank 0,

Bank 1, Bank 2, Bank 6, and Bank 7. This is described in LVDS25E (Output Only) section.

Table 3.16. LVDS DC Electrical Characteristics (Over Recommended Operating Conditions)1

Parameter

Description

Test Conditions

Min

Typ

Max

Unit

VINP, VINM

Input Voltage

—

1.60

VICM

Input Common Mode Voltage

Half the sum of the two Inputs

0.05

—

1.55 2

VTHD

Differential Input Threshold

Difference between the two Inputs

±100

—

IIN

Input Current

Power On or Power Off

—

±10

µA

VOH

Output High Voltage for VOP or VOM

RT = 100 Ω

—

1.425

1.60

VOL

Output Low Voltage for VOP or VOM

RT = 100 Ω

0.9 V

1.075

—

VOD

Output Voltage Differential

(VOP - VOM), RT = 100 Ω

250

350

450

VOD

Change in VOD Between High and

Low

—

VOCM

Output Common Mode Voltage

(VOP + VOM)/2, RT = 100 Ω

1.125

1.25

1.375

VOCM

Change in VOCM, VOCM(MAX) - VOCM(MIN)

—

ISAB

Output Short Circuit Current

VOD = 0 V Driver outputs shorted to

each other

—

VOS

Change in VOS between H and L

—

Note:

1. LVDS input or output are supported in Bank 3, Bank 4, and Bank 5. LVDS input uses VCCAUX on the differential input comparator,

and can be located in any VCCIO voltage bank. LVDS output uses VCCIO on the differential output driver, and can only be located in

bank with VCCIO = 1.8 V.

2. VICM is depending on VID, input differential voltage, so the voltage on pin cannot exceed VINP/INN(min/max) requirements. VICM(min) =

VINP/INN(min) + ½ VID, VICM(max) = VINP/INN(max) – ½ VID. Values in the table is based on minimum VID of +/- 100 mV.

CrossLink-NX Family

Preliminary Data Sheet

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60 FPGA-DS-02049-0.83

3.12.2. LVDS25E (Output Only)

Three sides of the CrossLink-NX devices, Top, Left and Right, support LVDS25 outputs with emulated complementary

LVCMOS outputs in conjunction with a parallel resistor across the driver outputs. The scheme shown in Figure 3.2 is

one possible solution for point-to-point signals.

Table 3.17. LVDS25E DC Conditions

Parameter

Description

Typical

Unit

VCCIO

Output Driver Supply (±5%)

2.50

ZOUT

Driver Impedance

Ω

Driver Series Resistor (±1%)

158

Ω

Driver Parallel Resistor (±1%)

140

Ω

Receiver Termination (±1%)

100

Ω

VOH

Output High Voltage

1.43

VOL

Output Low Voltage

1.07

VOD

Output Differential Voltage

0.35

VCM

Output Common Mode Voltage

1.25

ZBACK

Back Impedance

100.5

Ω

IDC

DC Output Current

6.03

Figure 3.2. LVDS25E Output Termination Example

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 61

3.12.3. SubLVDS (Input Only)

SubLVDS is a reduced-voltage form of LVDS signaling, very similar to LVDS. It is a standard used in many camera types

of applications, and follow the SMIA 1.0, Part 2: CCP2 Specification. Being similar to LVDS, the CrossLink-NX devices can

support the subLVDS input signaling with the same LVDS input buffer. The output for subLVDS is implemented in

subLVDSE/subLVDSEH with a pair of LVCMOS18 output drivers (see SubLVDSE/SubLVDSEH (Output Only) section).

Table 3.18. SubLVDS Input DC Electrical Characteristics (Over Recommended Operating Conditions)

Parameter

Description

Test Conditions

Min

Typ

Max

Unit

VID

Input Differential Threshold Voltage

Over VICM range

150

200

VICM

Input Common Mode Voltage

Half the sum of the two Inputs

0.4

0.9

1.4

Figure 3.3. SubLVDS Input Interface

3.12.4. SubLVDSE/SubLVDSEH (Output Only)

SubLVDS output uses a pair of LVCMOS18 drivers with True and Complement outputs. The VCCIO of the bank used for

subLVDSE or subLVDSEH needs to be powered by 1.8V. SubLVDSE is for Bank 0, Bank 1, Bank 2, Bank 5, and Bank 6; and

subLVDSEH is for Bank 3, Bank 4, and Bank 5.

Performance of the subLVDSE/subLVDSEH driver is limited to the performance of LVCMOS18.

Table 3.19. SubLVDS Output DC Electrical Characteristics (Over Recommended Operating Conditions)

Parameter

Description

Test Conditions

Min

Typ

Max

Unit

VOD

Output Differential Voltage Swing

—

150

—

VOCM

Output Common Mode Voltage

Half the sum of the two Outputs

—

0.9

—

Figure 3.4. SubLVDS Output Interface

CrossLink-NX Family

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62 FPGA-DS-02049-0.83

3.12.5. SLVS

Scalable Low-Voltage Signaling (SLVS) is based on a point-to-point signaling method defined in the JEDEC

JESD8-13

(SLVS-400) standard. This standard evolved from the traditional LVDS standard with smaller voltage swings and a lower

common-mode voltage. The 200 mV (400 mV p-p)

SLVS swing contributes to a reduction in power.

The CrossLink-NX devices receive SLVS differential input with the LVDS input buffer. This LVDS

input buffer is design to

cover wide input common mode range that can meet the SLVS input standard specified by the JEDEC standard.

Table 3.20. SLVS Input DC Characteristics (Over Recommended Operating Conditions)

Parameter

Description

Test Conditions

Min

Typ

Max

Unit

VID

Input Differential Threshold Voltage

Over VICM range

—

VICM

Input Common Mode Voltage

Half the sum of the two Inputs

200

330

The SLVS output on CrossLink-NX is supported with the LVDS drivers found in Bank 3, Bank 4, and Bank 5. The LVDS

driver on CrossLink-NX is a current controlled driver. It can be configured as LVDS driver, or configured with the 100 Ω

differential termination with center-tap set to VOCM at 200 mV. This means the differential output driver can be placed

into bank with VCCIO = 1.2 V, 1.5 V, or 1.8 V, even if it is powered by VCCIO.

Table 3.21. SLVS Output DC Characteristics (Over Recommended Operating Conditions)

Parameter

Description

Test Conditions

Min

Typ

Max

Unit

VCCIO

Bank VCCIO

—

–5%

1.2,

1.5,

1.8

+ 5%

VOD

Output Differential Voltage Swing

—

140

200

270

VOCM

Output Common Mode Voltage

Half the sum of the two Outputs

150

200

250

ZOS

Single-Ended Output Impedance

—

62.5

Figure 3.5. SLVS Interface

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 63

3.12.6. Soft MIPI D-PHY

When Soft D-PHY is implemented inside the FPGA logic, the I/O interface needs to use sysI/O buffers to connect to

external D-PHY pins.

The CrossLink-NX sysI/O provides support of SLVS, as described in SLVS section, plus the LVCMOS12 input / output

buffers together to support the High Speed (HS) and Low Power (LP) mode as defined in MIPI Alliance Specification for

D-PHY.

To support MIPI D-PHY with SLVS (LVDS) and LVCMOS12, the bank VCCIO cannot be set to 1.5 V or 1.8 V. It has to

connect to 1.2 V, or 1.1 V.

All other DC parameters are the same as listed in SLVS section. DC parameters for the LP driver and receiver are the

same as listed in LVCMOS12.

LP Data_P

LPenable

HSenable

HS Data

LVCMOS12

SLVS

Z0=50

MIPI Receiver

100 Diff

MIPI Divider

On-Chip

MIPI_LP_RX

RXLP_P

HS Data

LVDS

LP Data_N

LPenable

LVCMOS12

MIPI_LP_RX

RXLP_N

Figure 3.6. MIPI Interface

CrossLink-NX Family

Preliminary Data Sheet

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64 FPGA-DS-02049-0.83

Table 3.22. Soft D-PHY Input Timing and Levels

Symbol

Description

Conditions

Min

Typ

Max

Unit

High Speed (Differential) Input DC Specifications

VCMRX(DC)

Common-mode Voltage in High Speed Mode

—

330

VIDTH

Differential Input HIGH Threshold

—

VIDTL

Differential Input LOW Threshold

—

-70

VIHHS

Input HIGH Voltage (for HS mode)

—

460

VILHS

Input LOW Voltage

—

–40

—

VTERM-EN

Single-ended voltage for HS Termination Enable4

—

450

ZID

Differential Input Impedance

—

100

125

Ω

High Speed (Differential) Input AC Specifications

ΔVCMRX(HF)1

Common-mode Interference (>450 MHz)

—

100

ΔVCMRX(LF)2, 3

Common-mode Interference (50 MHz - 450 MHz)

—

–50

—

CCM

Common-mode Termination

—

Low Power (Single-Ended) Input DC Specifications

VIH

Low Power Mode Input HIGH Voltage

—

740

—

VIL

Low Power Mode Input LOW Voltage

—

550

VIL-ULP

Ultra Low Power Input LOW Voltage

—

300

VHYST

Low Power Mode Input Hysteresis

—

℮SPIKE

Input Pulse Rejection

—

300

V∙ps

TMIN-RX

Minimum Pulse Width Response

—

VINT

Peak Interference Amplitude

—

200

fINT

Interference Frequency

—

450

—

MHz

Contention Detector (LP-CD) DC Specifications

VIHCD

Contention Detect HIGH Voltage

—

450

—

VILCD

Contention Detect LOW Voltage

—

200

Notes:

1. This is peak amplitude of sine wave modulated to the receiver inputs.

2. Input common-mode voltage difference compared to average common-mode voltage on the receiver inputs.

3. Exclude any static ground shift of 50 mV.

4. High Speed Differential RTERM is enabled when both DP and DN are below this voltage.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 65

Table 3.23. Soft D-PHY Output Timing and Levels

Symbol

Description

Conditions

Min

Typ

Max

Unit

High Speed (Differential) Output DC Specifications

VCMTX

Common-mode Voltage in High Speed Mode

—

150

200

250

|ΔVCMTX(1,0)|

VCMTX Mismatch Between Differential HIGH

and LOW

—

|VOD|

Output Differential Voltage

|D-PHY-P – D-PHY-

140

200

270

|ΔVOD|

VOD Mismatch Between Differential HIGH and

LOW

—

VOHHS

Single-Ended Output HIGH Voltage

—

360

ZOS

Single Ended Output Impedance

—

Ω

ΔZOS

ZOS mismatch

—

High Speed (Differential) Output AC Specifications

ΔVCMTX(LF)

Common-Mode Variation, 50 MHz – 450 MHz

—

mVRMS

ΔVCMTX(HF)

Common-Mode Variation, above 450 MHz

—

mVRMS

Output 20% - 80% Rise Time

Output 80% - 20% Fall Time

0.08 Gbps ≤ tR ≤ 1.00

Gbps

—

0.30

1.00 Gbps < tR ≤ 1.50

Gbps

—

0.35

Output Data Valid After CLK Output

0.08 Gbps ≤ tF ≤ 1.00

Gbps

—

0.30

1.00 Gbps < tF ≤ 1.50

Gbps

—

0.35

Low Power (Single-Ended) Output DC Specifications

VOH

Low Power Mode Output HIGH Voltage

0.08 Gbps – 1.5 Gbps

1.1

1.2

1.3

VOL

Low Power Mode Input LOW Voltage

—

–50

—

ZOLP

Output Impedance in Low Power Mode

—

110

—

Ω

Low Power (Single-Ended) Output AC Specifications

tRLP

15% - 85% Rise Time

—

tFLP

85% - 15% Fise Time

—

tREOT

HS – LP Mode Rise and Fall Time, 30% - 85%

—

TLP-PULSE-TX

Pulse Width of the LP Exclusive-OR Clock

1st LP XOR Clock

Pulse after STOP

State or Last Pulse

before STOP State

—

All Other Pulses

—

TLP-PER-TX

Period of the LP Exclusive-OR Clock

—

CLOAD

Load Capacitance

—

Table 3.24. Soft D-PHY Clock Signal Specification

Symbol

Description

Conditions

Min

Typ

Max

Unit

Clock Signal Specification

Instantaneous

UIINST

—

12.5

UI Variation

∆UI

—

–10%

—

10%

—

–5%

—

CrossLink-NX Family

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66 FPGA-DS-02049-0.83

Table 3.25. Soft D-PHY Data-Clock Timing Specifications

Symbol

Description

Conditions

Min

Typ

Max

Unit

Data-Clock Timing Specifications

TSKEW[TX]

Data to Clock Skew

0.08 Gbps ≤ TSKEW[TX]

≤ 1.00 Gbps

-0.15

—

0.15

UIINST

1.00 Gbps < TSKEW[TX]

≤ 1.50 Gbps

-0.20

—

0.20

UIINST

TSKEW[TLIS]

Data to Clock Skew

0.08 Gbps ≤ TSKEW[TLIS]

≤ 1.00 Gbps

-0.20

—

0.20

UIINST

1.00 Gbps < TSKEW[TLIS]

≤ 1.50 Gbps

-0.10

—

0.10

UIINST

TSETUP[RX]

Input Data Setup Before CLK

0.08 Gbps ≤ TSETUP[RX]

≤ 1.00 Gbps

0.15

—

1.00 Gbps < TSETUP[RX]

≤ 1.50 Gbps

0.20

—

THOLD[RX]

Input Data Hold After CLK

0.08 Gbps ≤ THOLD[RX]

≤ 1.00 Gbps

0.15

—

1.00 Gbps < THOLD[RX]

≤ 1.50 Gbps

0.20

—

3.12.7. Differential HSTL15D (Output Only)

Differential HSTL outputs are implemented as a pair of complementary single-ended HSTL outputs.

3.12.8. Differential SSTL135D, SSTL15D (Output Only)

Differential SSTL is used for differential clock in DDR3/DDR3L memory interface. All differential SSTL outputs are

implemented as a pair of complementary single-ended SSTL outputs. All allowable single-ended output classes (class I

and class II) are supported.

3.12.9. Differential HSUL12D (Output Only)

Differential HSUL is used for differential clock in LPDDR2/LPDDR3 memory interface. All differential HSUL outputs are

implemented as a pair of complementary single-ended HSUL12 outputs. All allowable single-ended drive strengths are

supported.

3.12.10. Differential LVCMOS25D, LVCMOS33D, LVTTL33D (Output Only)

Differential LVCMOS and LVTTL outputs are implemented as a pair of complementary single-ended outputs. All

allowable single-ended output drive strengths are supported.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 67

3.13. CrossLink-NX Maximum sysI/O Buffer Speed

Over recommended operating conditions.

Table 3.26. CrossLink-NX Maximum I/O Buffer Speed1, 2, 3, 4, 7

Buffer

Description

Banks

Max

Unit

Maximum sysI/O Input Frequency

Single-Ended

LVCMOS33

LVCMOS33, VCCIO = 3.3 V

0, 1, 2, 6, 7

200

MHz

LVTTL33

LVTTL33, VCCIO = 3.3 V

0, 1, 2, 6, 7

200

MHz

LVCMOS25

LVCMOS25, VCCIO = 2.5 V

0, 1, 2, 6, 7

200

MHz

LVCMOS18 5

LVCMOS18, VCCIO = 1.8 V

0, 1, 2, 6, 7

200

MHz

LVCMOS18H

LVCMOS18, VCCIO = 1.8 V

3, 4, 5

200

MHz

LVCMOS15 5

LVCMOS15, VCCIO = 1.5 V

0, 1, 2, 6, 7

100

MHz

LVCMOS15H 5

LVCMOS15, VCCIO = 1.5 V

3, 4, 5

150

MHz

LVCMOS12 5

LVCMOS12, VCCIO = 1.2 V

0, 1, 2, 6, 7

MHz

LVCMOS12H 5

LVCMOS12, VCCIO = 1.2 V

3, 4, 5

100

MHz

LVCMOS10 5

LVCMOS 1.0, VCCIO = 1.2 V

0, 1, 2, 6, 7

MHz

LVCMOS10H 5

LVCMOS 1.0, VCCIO = 1.0 V

3, 4, 5

MHz

LVCMOS10R

LVCMOS 1.0, VCCIO independent

3, 4, 5

MHz

SSTL15_I, SSTL15_II

SSTL_15, VCCIO = 1.5 V

3, 4, 5

1066

Mbps

SSTL135_I, SSTL135_II

SSTL_135, VCCIO = 1.35 V

3, 4, 5

1066

Mbps

HSUL12

HSUL_12, VCCIO = 1.2 V

3, 4, 5

1066

Mbps

HSTL15

HSTL15, VCCIO = 1.5 V

3, 4, 5

250

Mbps

MIPI D-PHY (LP Mode)

MIPI, Low Power Mode, VCCIO = 1.2 V

3, 4, 5

Mbps

Differential

LVDS

LVDS, VCCIO independent QFN72, caBGA256,

csBGA289, and caBGA400

3, 4, 5

1250

Mbps

LVDS, VCCIO independent csfBGA121

3, 4, 5

1500

Mbps

subLVDS

subLVDS, VCCIO independent QFN72,

caBGA256, csBGA289, and caBGA400

3, 4, 5

1250

Mbps

subLVDS, VCCIO independent csfBGA121

3, 4, 5

1500

Mbps

SLVS

SLVS similar to MIPI HS, VCCIO independent

QFN72, caBGA256, csBGA289, caBGA400

3, 4, 5

1250

Mbps

SLVS similar to MIPI HS, VCCIO independent

csfBGA121

3, 4, 5

1500

Mbps

MIPI D-PHY (HS Mode)

MIPI, High Speed Mode, VCCIO = 1.2 V3

QFN72, caBGA256, csBGA289, caBGA400

3, 4, 5

1250

Mbps

MIPI, High Speed Mode, VCCIO = 1.2 V3

csfBGA121

3, 4, 5

15008

Mbps

SSTL15D

Differential SSTL15, VCCIO independent

3, 4, 5

1066

Mbps

SSTL135D

Differential SSTL135, VCCIO independent

3, 4, 5

1066

Mbps

HUSL12D

Differential HSUL12, VCCIO independent

3, 4, 5

1066

Mbps

HSTL15D

Differential HSTL15, VCCIO independent

3, 4, 5

250

Mbps

CrossLink-NX Family

Preliminary Data Sheet

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68 FPGA-DS-02049-0.83

Buffer

Description

Banks

Max

Unit

Maximum sysI/O Output Frequency

Single-Ended

LVCMOS33 (all drive strengths)

LVCMOS33, VCCIO = 3.3 V

0, 1, 2, 6, 7

200

MHz

LVCMOS33 (RS50)

LVCMOS33, VCCIO = 3.3 V, RSERIES = 50 Ω

0, 1, 2, 6, 7

200

MHz

LVTTL33 (all drive strengths)

LVTTL33, VCCIO = 3.3 V

0, 1, 2, 6, 7

200

MHz

LVTTL33 (RS50)

LVTTL33, VCCIO = 3.3 V, RSERIES = 50 Ω

0, 1, 2, 6, 7

200

MHz

LVCMOS25 (all drive strengths)

LVCMOS25, VCCIO = 2.5 V

0, 1, 2, 6, 7

200

MHz

LVCMOS25 (RS50)

LVCMOS25, VCCIO = 2.5 V, RSERIES = 50 Ω

0, 1, 2, 6, 7

200

MHz

LVCMOS18 (all drive strengths)

LVCMOS18, VCCIO = 1.8 V

0, 1, 2, 6, 7

200

MHz

LVCMOS18 (RS50)

LVCMOS18, VCCIO = 1.8 V, RSERIES = 50 Ω

0, 1, 2, 6, 7

200

MHz

LVCMOS18H (all drive strengths)

LVCMOS18, VCCIO = 1.8 V

3, 4, 5

200

MHz

LVCMOS18H (RS50)

LVCMOS18, VCCIO = 1.8 V, RSERIES = 50 Ω

3, 4, 5

200

MHz

LVCMOS15 (all drive strengths)

LVCMOS15, VCCIO = 1.5 V

0, 1, 2, 6, 7

100

MHz

LVCMOS15H (all drive strengths)

LVCMOS15, VCCIO = 1.5 V

3, 4, 5

150

MHz

LVCMOS12 (all drive strengths)

LVCMOS12, VCCIO = 1.2 V

0, 1, 2, 6, 7

MHz

LVCMOS12H (all drive strengths)

LVCMOS12, VCCIO = 1.2 V

3, 4, 5

100

MHz

LVCMOS10H (all drive strengths)

LVCMOS12, VCCIO = 1.2 V

3, 4, 5

MHz

SSTL15_I, SSTL15_II

SSTL_15, VCCIO = 1.5 V

3, 4, 5

1066

Mbps

SSTL135_I, SSTL135_II

SSTL_135, VCCIO = 1.35 V

3, 4, 5

1066

Mbps

HSUL12 (all drive strengths)

HSUL_12, VCCIO = 1.2 V

3, 4, 5

1066

Mbps

HSTL15

HSTL15, VCCIO = 1.5 V

3, 4, 5

250

Mbps

MIPI D-PHY (LP Mode)

MIPI, Low Power Mode, VCCIO = 1.2 V

3, 4, 5

Mbps

Differential

LVDS

LVDS, VCCIO = 1.8 V QFN72, caBGA256,

csBGA289, and caBGA400

3, 4, 5

1250

Mbps

LVDS, VCCIO = 1.8 V csfBGA121

3, 4, 5

1500

Mbps

LVDS25E6

LVDS25, Emulated, VCCIO = 2.5 V

0, 1, 2, 6, 7

400

Mbps

SubLVDSE6

subLVDS, Emulated, VCCIO = 1.8 V

0, 1, 2, 6, 7

400

Mbps

SubLVDSEH6

subLVDS, Emulated, VCCIO = 1.8 V

3, 4, 5

800

Mbps

SLVS

SLVS similar to MIPI, VCCIO = 1.2 V

QFN72, caBGA256, csBGA289, caBGA400

3, 4, 5

1250

Mbps

SLVS similar to MIPI, VCCIO = 1.2 V

csfBGA121

3, 4, 5

1500

Mbps

MIPI D-PHY (HS Mode)

MIPI, High Speed Mode, VCCIO = 1.2 V3

QFN72, caBGA256, csBGA289, caBGA400

3, 4, 5

1250

Mbps

MIPI, High Speed Mode, VCCIO = 1.2 V3

csfBGA121

3, 4, 5

15008

Mbps

SSTL15D

Differential SSTL15, VCCIO = 1.5 V

3, 4, 5

1066

Mbps

SSTL135D

Differential SSTL135, VCCIO = 1.35 V

3, 4, 5

1066

Mbps

HUSL12D

Differential HSUL12, VCCIO = 1.2 V

3, 4, 5

1066

Mbps

HSTL15D

Differential HSTL15, VCCIO = 1.5 V

3, 4, 5

250

Mbps

Notes:

1. Maximum I/O speed is the maximum switching rate of the I/O operating within the guidelines of the defining standard. The

actual interface speed performance using the I/O also depends on other factors, such as internal and external timing.

2. These numbers are characterized but not test on every device.

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 69

3. Performance is specified in MHz, as defined in clock rate when the sysI/O is used as pin. For data rate performance, this can be

converted to Mbps, which equals to 2 times the clock rate.

4. LVCMOS and LVTTL are measured with load specified in Table 3.46.

5. These LVCMOS inputs can be placed in different VCCIO voltage. Performance may vary. Please refer to Lattice Design Software

6. These emulated outputs performance is based on externally properly terminated as described in LVDS25E (Output Only) and

SubLVDSE/SubLVDSEH (Output Only).

7. All speeds are measured with fast slew.

8. Subject to verification when package becomes available.

3.14. Typical Building Block Function Performance

These building block functions can be generated using Lattice Design Software Tool. Exact performance may vary with

the device and the design software tool version. The design software tool uses internal parameters that have been

characterized but are not tested on every device.

Table 3.27. Pin-to-Pin Performance

Function

Typ. @ VCC =

1.0 V

Unit

16-Bit Decoder (I/O configured with LVCMOS18, Left and Right Banks)

7.1

16-Bit Decoder (I/O configured with HSTL15_I, Bottom Banks)

5.2

16:1 Mux (I/O configured with LVCMOS18, Left and Right Banks)

7.9

16:1 Mux (I/O configured with HSTL15_I, Bottom Banks)

Note: These functions are generated using Lattice Radiant Design Software tool. Exact performance may vary with the device and

the design software tool version. The design software tool uses internal parameters that have been characterized but are not tested

on every device.

Table 3.28. Register-to-Register Performance

Function

Typ. @ VCC =

1.0 V

Unit

Basic Functions

16-Bit Adder

5002

MHz

32-Bit Adder

407

MHz

16-Bit Counter

325

MHz

32-Bit Counter

303

MHz

Embedded Memory Functions

512 x 36 Single Port RAM, with Output Register

5002

MHz

1024 x 18 True-Dual Port RAM using same clock, with EBR Output Registers

5002

MHz

1024 x 18 True-Dual Port RAM using asynchronous clocks, with EBR Output Registers

5002

MHz

Large Memory Functions

32K x 32 Single Port RAM, with Output Register

1472

MHz

32K x 32 Single Port RAM with ECC, with Output Register

1162

MHz

32K x 32 True-Dual Port RAM using same clock, with EBR Output Registers

340

MHz

Distributed Memory Functions

16 x 4 Single Port RAM (One PFU)

5002

MHz

16 x 2 Pseudo-Dual Port RAM (One PFU)

5002

MHz

16 x 4 Pseudo-Dual Port (Two PFUs)

5002

MHz

DSP Functions

9 x 9 Multiplier with Input Output Registers

351

MHz

9 x 9 Multiplier with Input/Pipelined/Output Registers

218

MHz

18 x 18 Multiplier with Input/Output Registers

248

MHz

18 x 18 Multiplier with Input/Pipelined/Output Registers

191

MHz

CrossLink-NX Family

Preliminary Data Sheet

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70 FPGA-DS-02049-0.83

Function

Typ. @ VCC =

1.0 V

Unit

36 x 36 Multiplier with Input/Output Registers

190

MHz

36 x 36 Multiplier with Input/Pipelined/Output Registers

119

MHz

MAC 9 x 9 with Input/Output Registers

206

MHz

MAC 9 x 9 with Input/Pipelined/Output Registers

223

MHz

Notes:

1. The Clock port is configured with LVDS I/O type. Performance Grade: 9_High-Performance_1.0V.

2. Limited by the Minimum Pulse Width of the component

3. These functions are generated using Lattice Radiant Design Software tool. Exact performance may vary with the device and the

design software tool version. The design software tool uses internal parameters that have been characterized but are not

tested on every device.

4. For the Pipelined designs, the number of pipeline stages used are 2.

3.15. Derating Timing Tables

Logic timing provided in the following sections of this data sheet and the Lattice Radiant design tools are worst case

numbers in the operating range. Actual delays at nominal temperature and voltage for best case process, can be much

better than the values given in the tables. The Lattice Radiant design tool can provide logic timing numbers at a

particular

temperature and voltage.

3.16. CrossLink-NX External Switching Characteristics

Over recommended commercial operating conditions.

Table 3.29. CrossLink-NX External Switching Characteristics (VCC = 1.0 V)

Parameter

Description

–9

–8

–7

Unit

Min

Max

Min

Max

Min

Max

Clocks

Primary Clock

fMAX_PRI

Frequency for Primary Clock

—

400

—

325.2

—

276

MHz

tW_PRI

Clock Pulse Width for

Primary Clock

0.8

—

0.8

—

0.8

—

tSKEW_PRI

Primary Clock Skew Within a

Device

—

450

—

554

—

653

Edge Clock

fMAX_EDGE

Frequency for Edge Clock

Tree

—

800

—

650.4

—

551.7

MHz

tW_EDGE

Clock Pulse Width for Edge

Clock

0.588

—

0.723

—

0.852

—

tSKEW_EDGE

Edge Clock Skew Within a

Device

—

120

—

148

—

174

Generic SDR Input

General I/O Pin Parameters Using Dedicated Primary Clock Input without PLL

tCO

Clock to Output - PIO

Output Register

—

5.40

—

6.64

—

7.83

tSU

Clock to Data Setup - PIO

Input Register

—

Clock to Data Hold - PIO

Input Register

2.70

—

3.32

—

3.92

—

tSU_DEL

Clock to Data Setup - PIO

Input Register with Data

Input Delay

1.20

—

1.48

—

1.74

—

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 71

Parameter

Description

–9

–8

–7

Unit

Min

Max

Min

Max

Min

Max

tH_DEL

Clock to Data Hold - PIO

Input Register with Data

Input Delay

—

General I/O Pin Parameters Using Dedicated Primary Clock Input with PLL

tCOPLL

Clock to Output - PIO

Output Register

—

3.80

—

4.67

—

5.51

tSUPLL

Clock to Data Setup - PIO

Input Register

0.85

—

1.05

—

1.23

—

tHPLL

Clock to Data Hold - PIO

Input Register

0.98

—

1.21

—

1.42

—

tSU_DELPLL

Clock to Data Setup - PIO

Input Register with Data

Input Delay

1.95

—

2.40

—

2.83

—

tH_DELPLL

Clock to Data Hold - PIO

Input Register with Data

Input Delay

—

General I/O Pin Parameters Using Dedicated Edge Clock Input without PLL

tCO

Clock to Output - PIO

Output Register

—

tSU

Clock to Data Setup - PIO

Input Register

—

tHD

Clock to Data Hold - PIO

Input Register

—

tSU_DEL

Clock to Data Setup - PIO

Input Register with Data

Input Delay

—

tH_DEL

Clock to Data Hold - PIO

Input Register with Data

Input Delay

—

General I/O Pin Parameters Using Dedicated Edge Clock Input with PLL

tCOPLL

Clock to Output - PIO

Output Register

—

tSUPLL

Clock to Data Setup - PIO

Input Register

—

tHPLL

Clock to Data Hold - PIO

Input Register

—

tSU_DELPLL

Clock to Data Setup - PIO

Input Register with Data

Input Delay

—

tH_DELPLL

Clock to Data Hold - PIO

Input Register with Data

Input Delay

—

Generic DDR Input/Output

Generic DDRX1 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX1_RX/TX.SCLK.Centered) using PCLK Clock Input -

Figure 3.7 and Figure 3.9

tSU_GDDR1

Input Data Setup Before CLK

0.550

—

0.550

—

0.648

—

0.275

—

0.275

—

0.275

—

tHO_GDDR1

Input Data Hold After CLK

0.550

—

0.550

—

0.648

—

tDVB_GDDR1

Output Data Valid After CLK

Output

0.700

—

0.631

—

0.744

—

–0.300

—

–0.369

—

–0.435

—

ns + 1/2

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

72 FPGA-DS-02049-0.83

Parameter

Description

–9

–8

–7

Unit

Min

Max

Min

Max

Min

Max

tDQVA_GDDR1

Output Data Valid After CLK

Output

0.700

—

0.631

—

0.744

—

–0.300

—

–0.369

—

–0.435

—

ns + 1/2

fDATA_GDDRX1

Input/Output Data Rate

—

500

—

500.0

—

424

Mbps

fMAX_GDDRX1

Frequency of PCLK

—

250

—

250

—

212

MHz

½ UI

Half of Data Bit Time, or 90

degree

—

1.000

—

1.179

—

Output TX to Input RX Margin per Edge

0.150

—

0.081

—

0.095

—

Generic DDRX1 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX1_RX/TX.SCLK.Aligned) using PCLK Clock Input -

Figure 3.8 and Figure 3.10

tDVA_GDDR1

Input Data Valid After CLK

—

-0.550

—

–0.550

—

-0.648

ns + 1/2

—

0.450

—

0.450

—

0.530

—

0.225

—

0.225

—

0.225

tDVE_GDDR1

Input Data Hold After CLK

0.550

—

0.550

—

0.648

—

ns + 1/2

1.550

—

1.550

—

1.827

—

0.775

—

0.775

—

0.775

—

tDIA_GDDR1

Output Data Invalid After

CLK Output

—

0.300

—

0.369

—

0.435

tDIB_GDDR1

Output Data Invalid Before

CLK Output

—

0.300

—

0.369

—

0.435

fDATA_GDDRX1

Input/Output Data Rate

—

500

—

500

—

424

Mbps

fMAX_GDDRX1

Frequency for PCLK

—

250

—

250

—

212

MHz

½ UI

Half of Data Bit Time, or 90

degree

1.000

—

1.000

—

1.179

—

Output TX to Input RX Margin per Edge

0.150

—

0.081

—

0.095

—

Generic DDRX2 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX2_RX/TX.ECLK.Centered) using PCLK Clock Input -

Figure 3.7 and Figure 3.9

tSU_GDDRX2

Data Setup before CLK Input

0.150

—

0.150

—

0.177

—

0.150

—

0.150

—

0.150

—

tHO_GDDRX2

Data Hold after CLK Input

0.150

—

0.150

—

0.177

—

tDVB_GDDRX2

Output Data Valid Before

CLK Output

0.380

—

0.352

—

0.415

—

-0.120

—

–0.148

—

–0.174

—

ns + 1/2

tDQVA_GDDRX2

Output Data Valid After CLK

Output

0.380

—

0.352

—

0.415

—

-0.120

—

–0.148

—

–0.174

—

ns + 1/2

fDATA_GDDRX2

Input/Output Data Rate

—

1000

—

1000

—

848

Mbps

fMAX_GDDRX2

Frequency for ECLK

—

500

—

500

—

424

MHz

½ UI

Half of Data Bit Time, or 90

degree

0.500

—

0.500

—

0.589

—

fPCLK

PCLK frequency

—

250.0

—

250.0

—

212.1

MHz

Output TX to Input RX Margin per Edge

0.230

—

0.202

—

0.239

—

Generic DDRX2 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX2_RX/TX.ECLK.Aligned) using PCLK Clock Input -

Figure 3.8 and Figure 3.10

tDVA_GDDRX2

Input Data Valid After CLK

—

–0.275

—

-0.275

—

–0.324

ns + 1/2 UI

—

0.225

—

0.225

—

0.265

—

0.225

—

0.225

—

0.225

tDVE_GDDRX2

Input Data Hold After CLK

0.275

—

0.275

—

0.324

—

ns + 1/2 UI

0.775

—

0.775

—

0.914

—

0.775

—

0.775

—

0.775

—

tDIA_GDDRX2

Output Data Invalid After

CLK Output

—

0.120

—

0.148

—

0.174

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 73

Parameter

Description

–9

–8

–7

Unit

Min

Max

Min

Max

Min

Max

tDIB_GDDRX2

Output Data Invalid Before

CLK Output

—

0.120

—

0.148

—

0.174

fDATA_GDDRX2

Input/Output Data Rate

—

1000

—

1000

—

848

Mbps

fMAX_GDDRX2

Frequency for ECLK

—

500

—

500

—

424

MHz

½ UI

Half of Data Bit Time, or 90

degree

0.500

—

0.500

—

0.589

—

fPCLK

PCLK frequency

—

250.0

—

250.0

—

212.1

MHz

Output TX to Input RX Margin per Edge

0.105

—

0.077

—

0.091

—

Generic DDRX4 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX4_RX/TX.ECLK.Centered) using PCLK Clock Input -

Figure 3.7 and Figure 3.9 (for csfBGA Package Only)

tSU_GDDRX4

Input Data Set-Up Before

CLK

0.133

—

0.167

—

0.193

—

0.200

—

0.200

—

0.200

—

tHO_GDDRX4

Input Data Hold After CLK

0.133

—

0.167

—

0.193

—

tDVB_GDDRX4

Output Data Valid Before

CLK Output

0.213

—

0.269

—

0.309

—

-0.120

—

–0.148

—

–0.174

—

tDQVA_GDDRX4

Input/Output Data Rate

0.213

—

0.269

—

0.309

—

-0.120

—

–0.148

—

–0.174

—

fDATA_GDDRX4

Frequency for ECLK

—

1500

—

1200

—

1034

Mbps

fMAX_GDDRX4

PCLK frequency

—

750.0

—

600

—

517

MHz

½ UI

Half of Data Bit Time, or 90

degree

0.333

—

0.417

—

0.483

—

fPCLK

Input Data Set-Up Before

CLK

—

187.5

—

150.0

—

129.3

MHz

Output TX to Input RX Margin per Edge

0.080

—

0.102

—

0.116

—

Generic DDRX4 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX4_RX/TX.ECLK.Aligned) using PCLK Clock Input, Left

and Right

sides Only - Figure 3.8 and Figure 3.10 (for csfBGA Package Only)

tDVA_GDDRX4

Input Data Valid After CLK

—

–0.183

—

–0.229

—

–0.266

ns + 1/2 UI

—

0.150

—

0.188

—

0.218

—

0.225

—

0.225

—

0.225

tDVE_GDDRX4

Input Data Hold After CLK

0.183

—

0.229

—

0.266

—

ns + 1/2 UI

0.517

—

0.646

—

0.749

—

0.775

—

0.775

—

0.775

—

tDIA_GDDRX4

Output Data Invalid After

CLK Output

—

0.120

—

0.148

—

0.17

tDIB_GDDRX4

Output Data Invalid Before

CLK Output

—

0.120

—

0.148

—

0.174

fDATA_GDDRX4

Input/Output Data Rate

—

1500

—

1200

—

1034

Mbps

fMAX_GDDRX4

Frequency for ECLK

—

750

—

600

—

517

MHz

½ UI

Half of Data Bit Time, or 90

degree

0.333

—

0.417

—

0.483

—

fPCLK

PCLK frequency

—

187.5

—

150.0

—

129.3

MHz

Output TX to Input RX Margin per Edge

0.030

—

0.040

—

0.044

—

Generic DDRX5 Inputs/Outputs with Clock and Data Centered at Pin (GDDRX5_RX/TX.ECLK.Centered) using PCLK Clock Input -

Figure 3.7 and Figure 3.9 (for csfBGA Package Only)

tSU_GDDRX5

Input Data Set-Up Before

CLK

0.160

—

0.167

—

0.200

—

0.200

—

0.200

—

0.200

—

tHO_GDDRX5

Input Data Hold After CLK

0.160

—

0.167

—

0.200

—

tWINDOW_GDDRX5C

Input Data Valid Window

0.320

—

0.333

—

0.400

—

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

74 FPGA-DS-02049-0.83

Parameter

Description

–9

–8

–7

Unit

Min

Max

Min

Max

Min

Max

tDVB_GDDRX5

Output Data Valid Before

CLK Output

0.280

—

0.269

—

0.326

—

–0.120

—

–0.148

—

–0.174

—

ns+1/2UI

tDQVA_GDDRX5

Output Data Valid After CLK

Output

0.280

—

0.269

—

0.326

—

–0.120

—

–0.148

—

–0.174

—

ns+1/2UI

fDATA_GDDRX5

Input/Output Data Rate

—

1250

—

1200

—

1000

Mbps

fMAX_GDDRX5

Frequency for ECLK

—

625

—

600

—

500

MHz

½ UI

Half of Data Bit Time, or 90

degree

0.400

—

0.417

—

0.500

—

fPCLK

PCLK frequency

—

125.0

—

120.0

—

100.0

MHz

Output TX to Input RX Margin per Edge

0.120

—

0.102

—

0.126

—

Generic DDRX5 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX5_RX/TX.ECLK.Aligned) using PCLK Clock Input -

Figure 3.8 and Figure 3.10 (for csfBGA Package Only)

tDVA_GDDRX5

Input Data Valid After CLK

—

–0.220

—

–0.229

—

–0.275

ns + 1/2 UI

—

0.180

—

0.188

—

0.225

—

0.225

—

0.225

—

0.225

tDVE_GDDRX5

Input Data Hold After CLK

0.220

—

0.229

—

0.275

—

ns + 1/2 UI

0.620

—

0.646

—

0.775

—

0.775

—

0.775

—

0.775

—

tWINDOW_GDDRX5A

Input Data Valid Window

0.440

—

0.458

—

0.550

—

tDIA_GDDRX5

Output Data Invalid After

CLK Output

—

0.120

—

0.148

—

0.174

tDIB_GDDRX5

Output Data Invalid Before

CLK Output

—

0.120

—

0.148

—

0.174

fDATA_GDDRX5

Input/Output Data Rate

—

1250

—

1200

—

1000

Mbps

fMAX_GDDRX5

Frequency for ECLK

—

625

—

600

—

500

MHz

½ UI

Half of Data Bit Time, or 90

degree

0.400

—

0.417

—

0.500

—

fPCLK

PCLK frequency

—

125.0

—

120.0

—

100.0

MHz

Output TX to Input RX Margin per Edge

0.060

—

0.040

—

0.051

—

Soft D-PHY DDRX4 Inputs/Outputs with Clock and Data Centered at Pin, using PCLK Clock Input (for csfBGA Package Only)

tSU_GDDRX4_MP

Input Data Set-Up Before

CLK

0.133

—

0.167

—

0.193

—

0.200

—

0.200

—

0.200

—

tHO_GDDRX4_MP

Input Data Hold After CLK

0.133

—

0.167

—

0.193

—

tDVB_GDDRX4_MP

Output Data Valid Before

CLK Output

0.133

—

0.167

—

0.193

—

0.200

—

0.200

—

0.200

—

–0.133

—

–0.167

—

–0.193

—

ns + 1/2 UI

tDQVA_GDDRX4_MP

Output Data Valid After CLK

Output

0.200

—

0.250

—

0.290

—

–0.133

—

–0.167

—

0.193

—

ns + 1/2 UI

fDATA_GDDRX4_MP

Input Data Bit Rate for MIPI

PHY

—

1500

—

1200

—

1034

Mbps

½ UI

Half of Data Bit Time, or 90

degree

0.333

—

0.417

—

0.483

—

fPCLK

PCLK frequency

—

187.5

—

150.0

—

129.3

MHz

Output TX to Input RX Margin per Edge

0.067

0.083

0.097

Video DDRX71 Inputs/Outputs with Clock and Data Aligned at Pin (GDDRX71_RX.ECLK) using PLL Clock Input - Figure 3.12 and

Figure 3.13

tRPBi_DVA

Input Valid Bit "i" switch

from CLK Rising Edge ("i" = 0

to 6, 0 aligns with CLK)

—

0.300

—

0.300

—

0.300

—

–0.212

—

–0.212

—

–0.249

ns+(1/2+i)*UI

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02049-0.83 75

Parameter

Description

–9

–8

–7

Unit

Min

Max

Min

Max

Min

Max

tRPBi_DVE

Input Hold Bit "i" switch

from CLK Rising Edge ("i" = 0

to 6, 0 aligns with CLK)

0.700

—

0.700

—

0.700

—

0.212

—

0.212

—

0.249

—

ns+(1/2+i)*UI

tTPBi_DOV

Data Output Valid Bit "i"

switch from CLK Rising Edge

("i" = 0 to 6, 0 aligns with

CLK)

—

0.159

—

0.159

—

0.187

ns+i*UI

tTPBi_DOI

Data Output Invalid Bit "i"

switch from CLK Rising Edge

("i" = 0 to 6, 0 aligns with

CLK)

-0.159

—

-0.159

—

-0.187

—

ns+(i+ 1)*UI

tTPBi_skew_UI

TX skew in UI

—

0.150

—

0.150

—

0.150

Serial Data Bit Time, = 1UI

1.058

—

1.058

—

1.247

—

fDATA_TX71

DDR71 Serial Data Rate

—

945

—

945

—

802

Mbps

fMAX_TX71

DDR71 ECLK Frequency

—

473

—

473

—

401

MHz

fCLKIN

7:1 Clock (PCLK) Frequency

—

135.0

—

135.0

—

114.5

MHz

Output TX to Input RX Margin per Edge

0.159

—

0.159

—

0.187

—

Memory Interface

DDR3/DDR3L/LPDDR2/LPDDR3 READ (DQ Input Data are Aligned to DQS) - Figure 3.8

tDVBDQ_DDR3

tDVBDQ_DDR3L

tDVBDQ_LPDDR2

tDVBDQ_LPDDR3

Data Output Valid before

DQS Input

—

–0.258

—

ns + 1/2 UI

tDVADQ_DDR3

tDVADQ_DDR3L

tDVADQ_LPDDR2

tDVADQ_LPDDR3

Data Output Valid after DQS

Input

0.131

—

ns + 1/2 UI

fDATA_DDR3 fDATA_DDR3L

fDATA_LPDDR2

fDATA_LPDDR3

DDR Memory Data Rate

—

1066

—

Mb/s

fMAX_ECLK_DDR3

fMAX_ECLK_DDR3L

fMAX_ECLK_LPDDR2

fMAX_ECLK_LPDDR3

DDR Memory ECLK

Frequency

—

533

—

MHz

fMAX_SCLK_DDR3

fMAX_SCLK_DDR3L

fMAX_SCLK_LPDDR2

fMAX_SCLK_LPDDR3

DDR Memory SCLK

Frequency

—

133.3

—

MHz

DDR3/DDR3L/LPDDR2/LPDDR3 WRITE (DQ Output Data are Centered to DQS) - Figure 3.11

tDQVBS_DDR3

tDQVBS_DDR3L

tDQVBS_LPDDR2

tDQVBS_LPDDR3

Data Output Valid before

DQS Output

—

–0.235

—

ns + 1/2 UI

tDQVAS_DDR3

tDQVAS_DDR3L

tDQVAS_LPDDR2

tDQVAS_LPDDR3

Data Output Valid after DQS

Output

0.235

—

ns + 1/2 UI

fDATA_DDR3 fDATA_DDR3L

fDATA_LPDDR2

fDATA_LPDDR3

DDR Memory Data Rate

—

1066

—

Mb/s

CrossLink-NX Family

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76 FPGA-DS-02049-0.83

Parameter

Description

–9

–8

–7

Unit

Min

Max

Min

Max

Min

Max

fMAX_ECLK_DDR3

fMAX_ECLK_DDR3L

fMAX_ECLK_LPDDR2

fMAX_ECLK_LPDDR3

DDR Memory ECLK

Frequency

—

533

—

MHz

fMAX_SCLK_DDR3

fMAX_SCLK_DDR3L

fMAX_SCLK_LPDDR2

fMAX_SCLK_LPDDR3

DDR Memory SCLK

Frequency

—

133.3

—

MHz

Notes:

1. Commercial timing numbers are shown. Industrial numbers are typically slower and can be extracted from the Lattice Radiant

software.

2. General I/O timing numbers are based on LVCMOS 2.5, 12 mA, Fast Slew Rate, 0 pf load.

Generic DDR timing are numbers based on LVDS I/O.

DDR3 timing numbers are based on SSTL15.

LPDDR2 and LPDDR3 timing numbers are based on HSUL12.

3. Uses LVDS I/O standard for measurements.

4. Maximum clock frequencies are tested under best case conditions. System performance may vary upon the user environment.

5. All numbers are generated with the Lattice Radiant software.

tSU/tDVBDQ

Rx CLK (in)

Rx DATA (in)

tHD/tDVADQ

tSU/tDVBDQ

tHD/tDVADQ

Figure 3.7. Receiver RX.CLK.Centered Waveforms

tSU

Rx CLK (in)

or DQS Input

tHD

tSU

tHD

1/2 UI 1/2 UI

1 UI

Rx DATA (in)

or DQ Input

Figure 3.8. Receiver RX.CLK.Aligned and DDR Memory Input Waveforms

CrossLink-NX Family

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FPGA-DS-02049-0.83 77

Tx CLK (out)

or DQS Output

Tx DATA (out)

or DQ Output

tDVB/tDQVBS

1/2 UI 1/2 UI

tDVA/tDQVA

tDVB/tDQVBS

tDVA/tDQVAS

Figure 3.9. Transmit TX.CLK.Centered and DDR Memory Output Waveforms

Tx CLK (out)

Tx DATA (out)

1 UI

tDIA

tDIB

tDIA

tDIB

Figure 3.10. Transmit TX.CLK.Aligned Waveforms

CrossLink-NX Family

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78 FPGA-DS-02049-0.83

Clock In

108 MHz

Receiver – Shown for one LVDS Channel

# of Bits

Data In

756 Mb/s

Transmitter – Shown for one LVDS Channel

Clock Out

108 MHz

# of Bits

Data Out

756 Mb/s

For each Channel:

7-bit Output Words

to FPGA Fabric

Bit #

00 – 1

00 – 2

00 – 3

00 – 4

00 – 5

00 – 6

00 – 7

Bit #

10 – 8

11 – 9

12 – 10

13 – 11

14 – 12

15 – 13

16 – 14

Bit #

20 – 15

21 – 16

22 – 17

23 – 18

24 – 19

25 – 20

26 – 21

Bit #

30 – 22

31 – 23

32 – 24

33 – 25

34 – 26

35 – 27

36 – 28

Bit #

30 – 15

31 – 16

32 – 17

33 – 18

34 – 19

35 – 20

36 – 21

Bit #

40 – 22

41 – 23

42 – 24

43 – 25

44 – 26

45 – 27

46 – 28

Bit #

20 – 8

21 – 9

22 – 10

23 – 11

24 – 12

25 – 13

26 – 14

Bit #

10 – 1

11 – 2

12 – 3

13 – 4

14 – 5

15 – 6

16 – 7

For each Channel:

7-bit Output Words

to FPGA Fabric

Figure 3.11. DDRX71 Video Timing Waveforms

tSU_0

CLK (in)

DATA (in)

tHD_0

1/2 UI 1/2 UI

1 UI

Bit 0 Bit 1 Bit i

tSU_i

tHD_i

Figure 3.12. Receiver DDRX71_RX Waveforms

CrossLink-NX Family

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FPGA-DS-02049-0.83 79

tDIB_0

CLK (out)

DATA (out)

tDIA_0

1 UI

Bit 0 Bit 1 Bit i

tDIB_i

tDIA_i

Figure 3.13. Transmitter DDRX71_TX Waveforms

3.17. CrossLink-NX sysCLOCK PLL Timing (VCC = 1.0 V)

Over recommended operating conditions.

Table 3.30. sysCLOCK PLL Timing (VCC = 1.0 V)

Parameter

Descriptions

Conditions

Min

Typ.

Max

Units

fIN

Input Clock Frequency (CLKI, CLKFB)

—

500

MHz

fOUT

Output Clock Frequency

—

6.25

—

800

MHz

fVCO

PLL VCO Frequency

—

800

—

1600

MHz

fPFD3

Phase Detector Input Frequency

Without SSC or

Fractional-N

Enabled

—

500

MHz

With SSC or

Fractional-N

Enabled

—

100

MHz

fSSC_MOD_STEP

Spread Spectrum Clock Modulation Frequency

Step

—

0.25

—

AC Characteristics

tDT

Output Clock Duty Cycle

—

tPH4

Output Phase Accuracy

—

–5

—

tOPJIT1

Output Clock Period Jitter

fOUT ≥ 100 MHz

—

100

ps p-p

fOUT < 100 MHz

—

0.025

UIPP

Output Clock Cycle-to-Cycle Jitter

fOUT ≥ 100 MHz

—

200

ps p-p

fOUT < 100 MHz

—

0.05

UIPP

Output Clock Phase Jitter

fPFD ≥ 100 MHz

—

200

ps p-p

fPFD < 100 MHz

—

0.05

UIPP

tSPO

Static Phase Offset

Divider ratio =

integer

—

400

ps p-p

fBW

PLL Loop Bandwidth

fPFD ≥ 20 MHz

—

MHz

fPFD < 20 MHz

—

MHz

tLOCK2

PLL Lock-in Time

—

tUNLOCK

PLL Unlock Time (from RESET goes HIGH)

—

CrossLink-NX Family

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80 FPGA-DS-02049-0.83

Parameter

Descriptions

Conditions

Min

Typ.

Max

Units

tIPJIT

Input Clock Period Jitter

fPFD ≥ 20 MHz

—

500

ps p-p

fPFD < 20 MHz

—

0.01

UIPP

tHI

Input Clock High Time

90% to 90%

0.5

—

tLO

Input Clock Low Time

10% to 10%

0.5

—

tRST

RST/ Pulse Width

—

tRSTREC

RST Recovery Time

—

fSSC_MOD

Spread Spectrum Clock Modulation Frequency

—

200

KHz

fSSC_MOD_STEP

Spread Spectrum Clock Modulation Amplitude

Step Size

—

0.25

—

Notes:

1. Jitter sample is taken over 10,000 samples for Period jitter, and 1,000 samples for Cycle-to-Cycle jitter of the primary PLL output

with

clean reference clock with no additional I/O toggling.

2. Output clock is valid after tLOCK for PLL reset and dynamic delay adjustment.

3. Period jitter and cycle-to-cycle jitter numbers are guaranteed for fPFD > 10 MHz. For fPFD < 10 MHz, the jitter numbers may not

be met in certain conditions.

3.18. CrossLink-NX Internal Oscillators Characteristics

Table 3.31. Internal Oscillators (VCC = 1.0 V)

Symbol

Parameter Description

Min

Typ

Max

Unit

fCLKHF

HFOSC CLKK Clock Frequency

405

450

495

MHz

fCLKLF

LFOSC CLKK Clock Frequency

25.6

38.4

kHz

DCHCLKHF

HFOSC Duty Cycle (Clock High Period)

DCHCLKLF

LFOSC Duty Cycle (Clock High Period)

3.19. CrossLink-NX User I2C Characteristics

Table 3.32. User I2C Specifications (VCC = 1.0 V)

Symbol

Parameter

Description

STD Mode

FAST Mode

FAST Mode Plus2

Units

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

fscl

SCL Clock

Frequency

—

100

—

400

—

1000

kHz

TDELAY

Optional delay

through delay block

—

Notes:

1. Refer to the I2C Specification for timing requirements. User design should set constraints in Lattice Design Software to meet this

industrial I2C Specification.

2. Fast Mode Plus maximum speed may be achieved by using external pull up resistor on I2C bus. Internal pull up may not be

sufficient to support the maximum speed.

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FPGA-DS-02049-0.83 81

3.20. CrossLink-NX Analog-Digital Converter (ADC) Block Characteristics

Table 3.33. ADC Specifications

Symbol

Description

Condition

Min

Typ

Max

Unit

VREFINT_ADC

ADC Internal Reference

Voltage

—

1.2

—

VREFEXT_ADC

ADC External Reference

Voltage

—

1.0

—

1.8

NRES_ADC

ADC Resolution

—

bits

ENOBADC

Effective Number of Bits

—

10.8

—

bits

VSR_ADC

ADC Input Range

Bipolar Mode, Internal VREF

VCM_ADC ―

VREFINT_ADC/4

VCM_ADC

VCM_ADC +

VREFINT_ADC/4

Bipolar Mode, External VREF

VCM_ADC ―

VREFEXT_ADC/4

VREFEXT_ADC

VCM_ADC +

VREFEXT_ADC/4

Uni-polar Mode, Internal

VREF

—

VREFINT_ADC

Uni-polar Mode, External

VREF

—

VREFEXT_ADC

VCM_ADC

ADC Input Common Mode

Voltage (for fully differential

signals)

Internal VREF

—

VREFINT_ADC/2

—

External VREF

—

VREFEXT_ADC/2

—

fCLK_ADC

ADC Clock Frequency

—

MHz

DCCLK_ADC

ADC Clock Duty Cycle

—

fINPUT_ADC

ADC Input Frequency

—

500

kHz

FSADC

ADC Sampling Rate

—

MS/s

NTRACK_ADC

ADC Input Tracking Time

—

cycles

RIN_ADC

ADC Input Equivalent

Resistance

1 MS/s, Sampled @ 2 clock

cycles

—

116

—

KΩ

tCAL_ADC

ADC Calibration Time

—

6500

cycles

LOUTput_ADC

ADC Conversion Time

—

cycles

DNLADC

ADC Differential

Nonlinearity

—

–0.9

—

0.9

LSB

INLADC

ADC Integral Nonlinearity

—

–1.5

—

1.5

LSB

SFDRADC

ADC Spurious Free Dynamic

Range

—

dBc

THDADC

ADC Total Harmonic

Distortion

—

–76

–73

SNRADC

ADC Signal to Noise Ratio

—

65.7

67.5

—

SNDRADC

ADC Signal to Noise Plus

Distortion Ratio

—

ERRGAIN_ADC

ADC Gain Error

—

0.5

1.0

FSADC

ERROFFSET_ADC

ADC Offset Error

—

0.5

1.0

FSADC

CIN_ADC

ADC Input Equivalent

Capacitance

—

CrossLink-NX Family

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82 FPGA-DS-02049-0.83

3.21. CrossLink-NX Comparator Block Characteristics

Table 3.34. Comparator Specifications

Symbol

Description

Min

Typ

Max

Unit

fIN_COMP

Comparator Input Frequency

—

MHz

VIN_COMP

Comparator Input Voltage

—

VCCADC18

VOFFSET_COMP

Comparator Input Offset

–10

—

VHYST_COMP

Comparator Input Hysteresis

—

VLATENCY_COMP

Comparator Latency

—

3.22. CrossLink-NX Digital Temperature Readout Characteristics

Digital temperature Readout (DTR) is implemented in one of the internal Analog-Digital-Converter (ADC) channel.

Table 3.35. DTR Specifications

Symbol

Description

Condition

Min

Typ

Max

Unit

DTRRANGE

DTR Detect Temperature Range

—

–40

—

125

°C

DTRACCURACY

DTR Accuracy

with external

voltage reference

–2

—

°C

DTRRESOLUTION

DTR Resolution

with external

voltage reference

–0.3

—

0.3

°C

3.23. CrossLink-NX Hardened MIPI D-PHY Characteristics

Table 3.36. Hardened D-PHY Input Timing and Levels

Symbol

Description

Conditions

Min

Typ

Max

Unit

High Speed (Differential) Input DC Specifications

VCMRX(DC)

Common-mode Voltage in High Speed

Mode

—

330

VIDTH

Differential Input HIGH Threshold

0.08 Gbps ≤ VIDTH ≤ 1.5 Gbps

—

1.5 Gbps < VIDTH ≤ 2.5 Gbps

—

VIDTL

Differential Input LOW Threshold

0.08 Gbps ≤ VIDTL ≤ 1.5 Gbps

—

–70

1.5 Gbps < VIDTL ≤ 2.5 Gbps

—

–40

VIHHS

Input HIGH Voltage (for HS mode)

—

460

VILHS

Input LOW Voltage

—

–40

—

VTERM-EN

Single-ended voltage for HS Termination

Eanble4

—

450

ZID

Differential Input Impedance

—

100

125

Ω

High Speed (Differential) Input AC Specifications

ΔVCMRX(HF)1

Common-mode Interference (>450 MHz)

0.08 Gbps ≤ ∆VCMRX(HF) ≤ 1.5

Gbps

—

100

1.5 Gbps < ∆VCMRX(HF) ≤ 2.5

Gbps

—

ΔVCMRX(LF)2, 3

Common-mode Interference (50 MHz - 450

MHz)

0.08 Gbps ≤ ∆VCMRX(LF) ≤ 1.5

Gbps

–50

—

1.5 Gbps < ∆VCMRX(LF) ≤ 2.5

Gbps

–25

—

CCM

Common-mode Termination

—

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FPGA-DS-02049-0.83 83

Symbol

Description

Conditions

Min

Typ

Max

Unit

Low Power (Single-Ended) Input DC Specifications

VIH

Low Power Mode Input HIGH Voltage

—

740

—

VIL

Low Power Mode Input LOW Voltage

—

550

VIL-ULP

Ultra Low Power Input LOW Voltage

—

300

VHYST

Low Power Mode Input Hysteresis

—

℮SPIKE

Input Pulse Rejection

—

300

V∙ps

TMIN-RX

Minimum Pulse Width Response

—

VINT

Peak Interference Amplitude

—

200

fINT

Interference Frequency

—

450

—

MHz

Contention Detector (LP-CD) DC Specifications

VIHCD

Contention Detect HIGH Voltage

—

450

—

VILCD

Contention Detect LOW Voltage

—

200

Notes:

1. This is peak amplitude of sine wave modulated to the receiver inputs.

2. Input common-mode voltage difference compared to average common-mode voltage on the receiver inputs.

3. Exclude any static ground shift of 50 mV.

4. High Speed Differential RTERM is enabled when both DP and DN are below this voltage.

CrossLink-NX Family

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84 FPGA-DS-02049-0.83

Table 3.37. Hardened D-PHY Output Timing and Levels

Symbol

Description

Conditions

Min

Typ

Max

Unit

High Speed (Differential) Output DC Specifications

VCMTX

Common-mode Voltage in High Speed Mode

—

150

200

250

|ΔVCMTX(1,0)|

VCMTX Mismatch Between Differential HIGH

and LOW

—

|VOD|

Output Differential Voltage

|D-PHY-P – D-PHY-

140

200

270

|ΔVOD|

VOD Mismatch Between Differential HIGH and

LOW

—

VOHHS

Single-Ended Output HIGH Voltage

—

360

ZOS

Single Ended Output Impedance

—

62.5

Ω

ΔZOS

ZOS mismatch

—

High Speed (Differential) Output AC Specifications

ΔVCMTX(LF)

Common-Mode Variation, 50 MHz – 450 MHz

—

mVRMS

ΔVCMTX(HF)

Common-Mode Variation, above 450 MHz

—

mVRMS

Output 20% - 80% Rise Time

Output 80% - 20% Fall Time

0.08 Gbps ≤ tR ≤ 1

Gbps

—

0.30

1 Gbps < tR ≤ 1.5

Gbps

—

0.35

tR ≤ 1.5 Gbps

100

—

1.5 Gbps < tR ≤ 2.5

Gbps

—

0.40

tR > 1.5 Gbps

—

Output Data Valid After CLK Output

0.08 Gbps ≤ tF ≤ 1

Gbps

—

0.30

1 Gbps < tF ≤ 1.5

Gbps

—

0.35

tF ≤ 1.5 Gbps

100

—

1.5 Gbps < tF ≤ 2.5

Gbps

—

0.40

tF > 1.5 Gbps

—

Low Power (Single-Ended) Output DC Specifications

VOH

Low Power Mode Output HIGH Voltage

0.08 Gbps ≤ VOH ≤

1.50 Gbps

1.1

1.2

1.3

VOH > 1.50 Gbps

0.95

—

1.3

VOL

Low Power Mode Input LOW Voltage

—

–50

—

ZOLP

Output Impedance in Low Power Mode

—

110

—

Ω

Low Power (Single-Ended) Output AC Specifications

tRLP

15% - 85% Rise Time

—

tFLP

85% - 15% Fise Time

—

tREOT

HS – LP Mode Rise and Fall Time, 30% - 85%

—

TLP-PULSE-TX

Pulse Width of the LP Exclusive-OR Clock

1st LP XOR Clock

Pulse after STOP

State or Last Pulse

before STOP State

—

All Other Pulses

—

TLP-PER-TX

Period of the LP Exclusive-OR Clock

—

δV/δtSR

Slew Rate @ CLOAD = 0 pF

—

500

mV/ns

Slew Rate @ CLOAD = 5 pF

—

300

mV/ns

Slew Rate @ CLOAD = 20 pF

—

250

mV/ns

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FPGA-DS-02049-0.83 85

Symbol

Description

Conditions

Min

Typ

Max

Unit

Slew Rate @ CLOAD = 70 pF

—

150

mV/ns

Slew Rate @ CLOAD = 0 to 70 pF (Falling Edge

Only)

—

mV/ns

—

mV/ns

Slew Rate @ CLOAD = 0 to 70 pF (Rising Edge

Only)

—

mV/ns

—

mV/ns

Slew Rate @ CLOAD = 0 to 70 pF (Rising Edge

Only)

—

30 -

0.075*

(VO,INST -

700)

—

mV/ns

—

25 -

0.0625*

(VO,INST -

550)

—

mV/ns

CLOAD

Load Capacitance

—

Table 3.38. Hardened D-PHY Pin Characteristic Specifications

Symbol

Description

Conditions

Min

Typ

Max

Unit

Pin Characteristic Specifications

VPIN

Pin Signal Voltage Range

—

–50

—

1350

VPIN_LVLP

Pin Signal Voltage Range in LVLP Operation

—

–50

—

1150

ILEAK

Pin Leakage Current

—

–100

—

100

µA

VGNDSH

Ground Shift

—

–50

—

–5

—

VPIN(absmax)

Transient Pin Voltage Level

—

–0.15

—

1.45

TVPIN(absmax)

Maximum Transient Time above VPIN(max) or

below VPIN(min)

—

Table 3.39. Hardened D-PHY Clock Signal Specification

Symbol

Description

Conditions

Min

Typ

Max

Unit

Clock Signal Specification

Instantaneous

UIINST

—

12.5

UI Variation

∆UI

—

–10%

—

10%

—

–5%

—

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86 FPGA-DS-02049-0.83

Table 3.40. Hardened D-PHY Data-Clock Timing Specifications

Symbol

Description

Conditions

Min

Typ

Max

Unit

Data-Clock Timing Specifications

TSKEW[TX]

Data to Clock Skew

0.08 Gbps ≤ TSKEW[TX]

≤ 1.00 Gbps

–0.15

—

0.15

UIINST

1.00 Gbps < TSKEW[TX]

≤ 1.50 Gbps

–0.20

—

0.20

UIINST

TSKEW[TLIS]

Data to Clock Skew

0.08 Gbps ≤ TSKEW[TLIS]

≤ 1.00 Gbps

–0.20

—

0.20

UIINST

1.00 Gbps < TSKEW[TLIS]

≤ 1.50 Gbps

–0.10

—

0.10

UIINST

TSETUP[RX]

Input Data Setup Before CLK

0.08 Gbps ≤ TSETUP[RX]

≤ 1.00 Gbps

0.15

—

1.00 Gbps < TSETUP[RX]

≤ 1.50 Gbps

0.20

—

THOLD[RX]

Input Data Hold After CLK

0.08 Gbps ≤ THOLD[RX]

≤ 1.00 Gbps

0.15

—

1.00 Gbps < THOLD[RX]

≤ 1.50 Gbps

0.20

—

FIN_DPHY

Input frequency to Hardened D-PHY PLL

200

MHz

TSKEW[TX] Static

Static Data to Clock Skew (Tx)

> 1.5 Gbps

–0.20

—

0.20

UIINST

TSKEW[TLIS] Static

Static Data to Clock Skew (Channel)

> 1.5 Gbps

–0.10

—

0.10

UIINST

TSKEW[RX] Static

Static Data to Clock Skew (Rx)

> 1.5 Gbps

–0.20

—

0.20

UIINST

TSKEW[TX]

Dynamic

Dynamic Data to Clock Skew (Tx)

> 1.5 Gbps

–0.15

—

0.15

UIINST

ISI

Channel ISI

> 1.5 Gbps

—

0.20

UIINST

TSETUP[RX] +

THOLD[RX]

Dynamic

Dynamic Data to Clock Skew Window Rx

Tolerance

> 1.5 Gbps

0.50

—

UIINST

3.24. CrossLink-NX Hardened PCIe Characteristics

3.24.1. PCIe (2.5 Gb/s)

Over recommended operating conditions.

Table 3.41. PCIe (2.5 Gb/s)

Symbol

Description

Condition

Min.

Typ.

Max.

Unit

Transmitter1

Unit Interval

—

399.88

400

400.12

BWTX

Tx PLL bandwidth

—

1.5

—

MHz

VTX-DIFF-PP

Differential p-p Tx voltage

swing

—

0.8

—

1.2

Vp-p

VTX-DIFF-PP-LOW

Low power differential p-p Tx

voltage swing

—

0.4

—

1.2

Vp-p

VTX-DE-RATIO-3.5dB

Tx de-emphasis level ratio at

3.5dB

—

TTX-RISE-FALL

Transmitter rise and fall time

—

0.125

—

TTX-EYE

Transmitter Eye, including all

jitter sources

—

0.75

—

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FPGA-DS-02049-0.83 87

Symbol

Description

Condition

Min.

Typ.

Max.

Unit

TTX-EYE-MEDIAN-to-MAX-

JITTER

Max. time between jitter

median and max deviation

from the median

—

0.125

RLTX-DIFF

Tx Differential Return Loss,

including pkg and silicon

—

RLTX-CM

Tx Common Mode Return Loss,

including pkg and silicon

50 MHz < freq < 2.5 GHz

—

ZTX-DIFF-DC

DC differential Impedance

—

120

Ω

VTX-CM-AC-P

Tx AC peak common mode

voltage, RMS

—

mV,

RMS

ITX-SHORT

Transmitter short-circuit

current

—

VTX-DC-CM

Transmitter DC common-mode

voltage

—

1.2

VTX-IDLE-DIFF-AC-p

Electrical Idle Output peak

voltage

—

VTX-RCV-DETECT

Voltage change allowed during

Receiver Detect

—

600

TTX-IDLE-MIN

Min. time in Electrical Idle

—

TTX-IDLE-SET-TO-IDLE

Max. time from EI Order Set to

valid Electrical Idle

—

TTX-IDLE-TO-DIFF-DATA

Max. time from Electrical Idle

to valid differential output

—

Receiver2

Unit Interval

—

399.88

400

400.12

VRX-DIFF-PP

Differential Rx peak-peak

voltage

—

0.175

—

1.2

Vp-p

TRX-EYE3

Receiver eye opening time

—

0.4

—

TRX-EYE-MEDIAN-to-MAX-

JITTER3

Max time delta between

median and deviation from

median

—

0.3

RLRX-DIFF

Receiver differential Return

Loss, package plus silicon

—

RLRX-CM

Receiver common mode Return

Loss, package plus silicon

—

ZRX-DC

Receiver DC single ended

impedance

—

Ω

ZRX-DIFF-DC

Receiver DC differential

impedance

—

120

Ω

ZRX-HIGH-IMP-DC

Receiver DC single ended

impedance when powered

down

—

200K

—

Ω

VRX-CM-AC-P3

Rx AC peak common mode

voltage

—

150

mV,

peak

VRX-IDLE-DET-DIFF-PP

Electrical Idle Detect Threshold

—

175

mVp-p

Notes:

1. Refer to PCI Express Base Specification Revision 3.0 Table 4.18 test condition and requirement for respective parameters.

2. Refer to PCI Express Base Specification Revision 3.0 Table 4.24 test condition and requirement for respective parameters.

3. Spec compliant requirement

CrossLink-NX Family

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88 FPGA-DS-02049-0.83

3.24.2. PCIe (5 Gb/s)

Over recommended operating conditions.

Table 3.42. PCIe (5 Gb/s)

Symbol

Description

Test Conditions

Min

Typ

Max

Unit

Transmit1

Unit Interval

—

199.94

200

200.06

BWTX-PKG-PLL1

Tx PLL bandwidth

corresponding to PKGTX-PLL1

—

MHz

BWTX-PKG-PLL2

Tx PLL bandwidth

corresponding to PKGTX-PLL2

—

MHz

PKGTX-PLL1

Tx PLL Peaking

corresponding to PKGTX-PLL1

—

PKGTX-PLL2

Tx PLL Peaking

corresponding to PKGTX-PLL2

—

VTX-DIFF-PP

Differential p-p Tx voltage

swing

—

0.8

—

1.2

V, p-p

VTX-DIFF-PP-LOW

Low power differential p-p Tx

voltage swing

—

0.4

—

1.2

V, p-p

VTX-DE-RATIO-3.5dB

Tx de-emphasis level ratio at

3.5dB

—

VTX-DE-RATIO-6dB

Tx de-emphasis level ratio at

6dB

—

5.5

—

6.5

TMIN-PULSE

Instantaneous lone pulse width

—

0.9

—

TTX-RISE-FALL

Transmitter rise and fall time

—

0.15

—

TTX-EYE

Transmitter Eye, including all

jitter sources

—

0.75

—

TTX-DJ

Tx deterministic jitter > 1.5

MHz

—

0.15

TTX-RJ

Tx RMS jitter < 1.5 MHz

—

ps,

RMS

TRF-MISMATCH

Tx rise/fall time mismatch

—

0.1

RLTX-DIFF

Tx Differential Return Loss,

including package and silicon

50 MHz < freq < 1.25 GHz

—

1.25 GHz < freq < 2.5 GHz

—

RLTX-CM

Tx Common Mode Return Loss,

including package and silicon

50 MHz < freq < 2.5 GHz

—

ZTX-DIFF-DC

DC differential Impedance

—

120

Ω

VTX-CM-AC-PP

Tx AC peak common mode

voltage, peak-peak

—

150

mV,

p-p

ITX-SHORT

Transmitter short-circuit

current

—

VTX-DC-CM

Transmitter DC common-mode

voltage

—

1.2

VTX-IDLE-DIFF-DC

Electrical Idle Output DC

voltage

—

VTX-IDLE-DIFF-AC-p

Electrical Idle Differential

Output peak voltage

—

VTX-RCV-DETECT

Voltage change allowed during

Receiver Detect

—

600

TTX-IDLE-MIN

Min. time in Electrical Idle

—

TTX-IDLE-SET-TO-IDLE

Max. time from EI Order Set to

valid Electrical Idle

—

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FPGA-DS-02049-0.83 89

Symbol

Description

Test Conditions

Min

Typ

Max

Unit

TTX-IDLE-TO-DIFF-DATA

Max. time from Electrical Idle

to valid differential output

—

Receive2

Unit Interval

—

199.94

200

200.06

VRX-DIFF-PP

Differential Rx peak-peak

voltage

—

0.343

—

1.2

V, p-p

TRX-RJ-RMS

Receiver random jitter

tolerance (RMS)

1.5 MHz – 100 MHz

Random noise

—

4.2

ps,

RMS

TRX-DJ

Receiver deterministic jitter

tolerance

—

RLRX-DIFF

Receiver differential Return

Loss, package plus silicon

50 MHz < freq < 1.25 GHz

—

1.25 GHz < freq < 2.5 GHz

—

RLRX-CM

Receiver common mode

Return Loss, package plus

silicon

—

ZRX-DC

Receiver DC single ended

impedance

—

Ω

ZRX-HIGH-IMP-DC

Receiver DC single ended

impedance when powered

down

—

200K

—

Ω

VRX-CM-AC-P3

Rx AC peak common mode

voltage

—

150

mV,

peak

VRX-IDLE-DET-DIFF-PP

Electrical Idle Detect Threshold

—

3403

mv, pp

Notes:

1. Refer to PCI Express Base Specification Revision 3.0 Table 4.18 test condition and requirement for respective parameters.

2. Refer to PCI Express Base Specification Revision 3.0 Table 4.24 test condition and requirement for respective parameters.

3. Spec compliant requirement

3.25. CrossLink-NX Hardened SGMII Receiver Characteristics

3.25.1. SGMII Rx Specifications

Over recommended operating conditions.

Table 3.43. SGMII Rx

Symbol

Description

Test Conditions

Min

Typ

Max

Unit

fDATA

SGMII Data Rate

—

1250

—

MHz

fREFCLK

SGMII Reference Clock Frequency (Data

Rate / 10)

—

125

—

MHz

JTOL_DET

Jitter Tolerance, Deterministic

—

JTOL_TOL

Jitter Tolerance, Total

—

Δf/f

Data Rate and Reference Clock Accuracy

—

–300

—

300

ppm

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90 FPGA-DS-02049-0.83

3.26. CrossLink-NX sysCONFIG Port Timing Specifications

Over recommended operating conditions.

Table 3.44. CrossLink-NX sysCONFIG Port Timing Specifications

Symbol

Parameter

Device

Min

Typ.

Max

Unit

Master SPI POR / REFRESH Timing

tICFG

Time during POR, from VCC, VCCAUX, VCCIO0 or

VCCIO1 (whichever is the last) pass POR trip

voltage, or REFRESH command executed, to

the rising edge of INITN

—

tVMC

Time from rising edge of INITN to the valid

Master MCLK

—

µs

fMCLK_DEF

Default MCLK frequency (Before MCLK

frequency selection in bitstream)

—

fCLKHF/128

—

MHz

Slave SPI/I2C/I3C POR / REFRESH Timing

tMSPI_INH

Time during POR, from VCC, VCCAUX, VCCIO0 or

VCCIO1 (whichever is the last) pass POR trip

voltage, or REFRESH command executed, to

pull PROGRAMN LOW to prevent entering

MSPI mode

—

µs

tACT_CCLK

Minimum time before driving CCLK (SSPI) from

POR or REFRESH

—

µs

tACT_SCL

Minimum time before driving SCL (I2C/I3C)

from POR or REFRESH

—

µs

tACT_PROGRAMN_H

Minimum time driving PROGRAMN HIGH after

last activation clock

—

tCONFIG_CCLK

Minimum time to start driving CCLK (SSPI) after

PROGRAMN HIGH

—

tCONFIG_CCLK

Minimum time to start driving SCL (I2C/I3C)

after PROGRAMN HIGH

—

PROGRAMN Configuration Timing

tPROGRAMN

PROGRAMN LOW pulse accepted

—

tPROGRAMN_RJ

PROGRAMN LOW pulse rejected

—

tINIT_LOW

PROGRAMN LOW to INITN LOW

—

tINIT_HIGH

PROGRAMN LOW to INITN HIGH

LIFCL-40

—

LIFCL-17

—

tDONE_LOW

PROGRAMN LOW to DONE LOW

—

tDONE_HIGH

PROGRAMN HIGH to DONE HIGH

—

tIODISS

PROGRAMN LOW to I/O Disabled

—

Master SPI

fMCLK*

Max selected MCLK output frequency

—

165

MHz

tMCLKH

MCLK output clock pulse width HIGH

—

2.5

—

tCCLKL

MCLK output clock pulse width LOW

—

2.5

—

tSU_MSI

MSI to MCLK setup time

—

tHD_MSI

MSI to MCLK hold time

—

tCO_MSO

MCLK to MSO delay

—

Slave SPI

fCCLK

CCLK input clock frequency

—

135

MHz

tCCLKH

CCLK input clock pulse width HIGH

—

3.5

—

tCCLKL

CCLK input clock pulse width LOW

—

3.5

—

tSU_SSI

SSI to CCLK setup time

—

4.3

—

tHD_SSI

SSI to CCLK hold time

—

0.8

—

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FPGA-DS-02049-0.83 91

Symbol

Parameter

Device

Min

Typ.

Max

Unit

tCO_SSO

CCLK falling edge to valid SSO output

—

tEN_SSO

CCLK falling edge to SSO output enabled

—

tDIS_SSO

CCLK falling edge to SSO output disabled

—

tHIGH_SCSN

SCSN HIGH time

—

tSU_SCSN

SCSN to CCLK setup time

—

3.5

—

tHD_SCSN

SCSN to CCLK hold time

—

1.6

—

I2C/I3C

fSCL_I2C

SCL input clock frequency for I2C

—

MHz

fSCL_I3C

SCL input clock frequency for I3C

—

MHz

tSCLH

SCL input clock pulse width HIGH

—

tSCLL

SCL input clock pulse width LOW

—

tSU_SDA

SDA to SCL setup time

—

tHD_SDA

SDA to SCL hold time

—

tCO_SDA

SCL falling edge to valid SDA output

—

tEN_SDA

SCL falling edge to SDA output enabled

—

tDIS_SDA

SCL falling edge to SDA output disabled

—

Wake-Up Timing

fDONE_HIGH

Last configuration clock cycle to DONE going

HIGH

—

MHz

tFIO_EN

User I/O enabled in Fast I/O Mode

LIFCL-40

—

cycles

LIFCL-17

—

cycles

tIOEN

Config clock to user I/O enabled

—

tMWC

Additional master MCLK after DONE HIGH

—

tMCLKZ

Master MCLK to Hi-Z

—

*Note: fMCLK has a dependency on HFOSC and is 1/3 of fCLKHF.

PROGRAMN

Figure 3.14. Master SPI POR/REFRESH Timing

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92 FPGA-DS-02049-0.83

PROGRAMN

Figure 3.15. Slave SPI/I2C/I3C POR/REFRESH Timing

Figure 3.16. Master SPI PROGRAMN Timing

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FPGA-DS-02049-0.83 93

Figure 3.17. Slave SPI/I2C/I3C PROGRAMN Timing

Figure 3.18. Master SPI Configuration Timing

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94 FPGA-DS-02049-0.83

Figure 3.19. Slave SPI Configuration Timing

Figure 3.20. I2C /I3C Configuration Timing

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FPGA-DS-02049-0.83 95

Figure 3.21. Master SPI Wake-Up Timing

Figure 3.22. Slave SPI/I2C/I3C Wake-Up Timing

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96 FPGA-DS-02049-0.83

3.27. JTAG Port Timing Specifications

Over recommended operating conditions.

Table 3.45. JTAG Port Timing Specifications

Symbol

Parameter

Min

Typ.

Max

Units

fMAX

TCK clock frequency

—

MHz

tBTCPH

TCK [BSCAN] clock pulse width high

—

tBTCPL

TCK [BSCAN] clock pulse width low

—

tBTS

TCK [BSCAN] setup time

—

tBTH

TCK [BSCAN] hold time

—

tBTRF

TCK [BSCAN] rise/fall time

—

mV/ns

tBTCO

TAP controller falling edge of clock to valid output

—

tBTCODIS

TAP controller falling edge of clock to valid disable

—

tBTCOEN

TAP controller falling edge of clock to valid enable

—

tBTCRS

BSCAN test capture register setup time

—

tBTCRH

BSCAN test capture register hold time

—

tBUTCO

BSCAN test update register, falling edge of clock to valid output

—

tBTUODIS

BSCAN test update register, falling edge of clock to valid disable

—

tBTUPOEN

BSCAN test update register, falling edge of clock to valid enable

—

TMS

TDI

TCK

TDO

Data to be

Captured

from I/O

Data to be

driven out

to I/O

ataD dilaVataD dilaV

Data Captured

tBTCPH tBTCPL

tBTCOEN

tBTCRS

tBTUPOEN tBUTCO tBTUODIS

tBTCRH

tBTCO tBTCODIS

tBTS tBTH

tBTCP

Figure 3.23. JTAG Port Timing Waveforms

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FPGA-DS-02049-0.83 97

3.28. Switching Test Conditions

Figure 3.24 shows the output test load that is used for AC testing. The specific values for resistance, capacitance,

voltage, and other test conditions are listed in Table 3.46.

DUT

CL*

Test Point

*CL Includes Test Fixture and Probe Capacitance

Figure 3.24. Output Test Load, LVTTL and LVCMOS Standards

Table 3.46. Test Fixture Required Components, Non-Terminated Interfaces

Test Condition

Timing Ref.

LVTTL and other LVCMOS settings (L ≥ H, H ≥ L)



0 pF

LVCMOS 3.3 = 1.5 V

—

LVCMOS 2.5 = VCCIO/2

—

LVCMOS 1.8 = VCCIO/2

—

LVCMOS 1.5 = VCCIO/2

—

LVCMOS 1.2 = VCCIO/2

—

LVCMOS 2.5 I/O (Z ≥ H)



1 MΩ

0 pF

VCCIO/2

—

LVCMOS 2.5 I/O (Z ≥ L)

1 MΩ



0 pF

VCCIO/2

VCCIO

LVCMOS 2.5 I/O (H ≥ Z)



100

0 pF

VOH – 0.10

—

LVCMOS 2.5 I/O (L ≥ Z)

100



0 pF

VOL + 0.10

VCCIO

Note: Output test conditions for all other interfaces are determined by the respective standards.

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98 FPGA-DS-02049-0.83

4. Pinout Information

4.1. Signal Descriptions*

Signal Name

Bank

Type

Description

Power and GND

Vss

—

GND

Ground for internal FPGA logic and I/O

VSSA_D-PHY

—

GND

Analog Ground for D-PHY blocks

VSSSD

—

GND

Ground for SERDES blocks

VCC

—

Power

Power supply pins for core logic. VCC is connected to 1.0 V (nom.)

supply voltage. Power On Reset (POR) monitors this supply voltage.

VCCAUXA

—

Power

Auxiliary power supply pin for internal analog circuitry. This supply is

connected to 1.8 V (nom.) supply voltage. POR monitors this supply

voltage.

VCCAUX

—

Power

Auxiliary power supply pin for I/O Bank 0, Bank 1, Bank 2, Bank 6, and

Bank 7. This supply is connected to 1.8 V (nom.) supply voltage, and is

used for generating stable drive current for the I/O.

VCCAUXHx

—

Power

Auxiliary power supply pin for I/O Bank 3, Bank 4, and Bank 5. This

supply is connected to 1.8 V (nom.) supply voltage, and is used for

generating stable current for the differential input comparators.

VCCIOx

0-7

Power

Power supply pins for I/O bank x.

For x = 0, 1, 2, 6, and 7, VCCIO can be connected to (nom.) 1.2 V, 1.5 V,

1.8 V, 2.5 V, or 3.3 V.

For x = 3, 4, and 5, VCCIO can be connected to (nom.) 1.0 V, 1.2 V, 1.35

V, 1.5 V, or 1.8 V.

There are dedicated and shared configuration pins in banks 0 and 1.

POR monitors these banks supply voltages.

VCC_D-PHYx

—

Power

1.0 V (nom.) digital power supply for the hardened D-PHY blocks.

X = 0, 1

VCCA_D-PHYx

—

Power

1.8 V (nom.) analog power supply for the hardened D-PHY blocks.

X = 0, 1

VCCPLL_D-PHYx

—

Power

1.0 V (nom.) power supply for the hardened D-PHY blocks.

X = 0, 1

VCCADC18

—

Power

1.8 V (nom.) power supply for the ADC block.

VCCSD0

—

Power

1.0 V (nom.) power supply for the SERDES block.

VCCPLLSD0

—

Power

1.8 V (nom.) power supply for the PLL in the SERDES block.

VCCAUXSD

—

Power

1.8 V (nom.) auxiliary power supply for the SERDES block.

Dedicated Pins

Dedicated Configuration I/O Pin

JTAG_EN

Input

LVCMOS input pin. This input selects the JTAG shared GPIO to be used

for JTAG

0 = GPIO

1 = JTAG

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FPGA-DS-02049-0.83 99

Dedicated ADC I/O Pins

ADC_REF[0, 1]

—

Input

ADC reference voltage, for each of the 2 ADC converters

ADC_DP/N[0, 1]

—

Input

Dedicated ADC input pairs, for each of the 2 ADC converters

Dedicated High Speed I/O Pins

SD0_RXDP/N

—

Input

High Speed Data Differential Input Pairs

SD0_TXDP/N

—

Output

High Speed Data Differential Output Pairs

SD0_REFCLKP/N

—

Input

High Speed Reference Clock Differential Input Pairs

SD0_REXT

—

Input

High Speed External Reference Resistor Input. Resistor connects

between to this pin and SD0_REFRET pin. This is used to adjust the on-

chip differential termination impedance, based on the external

resistance value:

REXT = 909 Ω, RDIFF = 80 Ω

REXT = 976 Ω, RDIFF = 85 Ω

REXT = 1.02 kΩ, RDIFF = 90 Ω

REXT = 1.15 kΩ, RDIFF = 100 Ω

SD0_REFRET

—

Input

High Speed Reference Return Input. These pins should be AC coupled

to the VCCPLLSD0 supply

Dedicated D-PHY I/O Pins

D-PHY[0-1]_DP/N[0-3]

—

Input,

Output

Hardened D-PHY Data Input/Output Pairs, for each of the 4 High Speed

lanes in the 2 Hardened D-PHY Blocks

D-PHY[0-1]_CKP/N

—

Input

Hardened D-PHY Clock Input Pairs, for each of the 2 Hardened D-PHY

Blocks

Misc Pins

—

No connect.

RESERVED

—

This pin is reserved and should not be connected to anything on the

board.

General Purpose I/O Pins

P[T/B/L/R] [Number]_[A/B]

T = 0

R = 1, 2

B = 3, 4, 5

L = 6. 7

Input,

Output,

Bi-Dir

Programmable User I/O:

[T/B/L/R] indicates the package pin/ball is in T (Top), B (Bottom), L

(Left), or R (Right) edge of the device.

[Number] identifies the PIO [A/B] pair.

[A/B] shows the package pin/ball is A or B signal in the pair. PIO A and

PIO B are grouped as a pair.

Each A/B pair in the bottom banks supports true differential input and

output buffers. When configured as differential input, differential

termination of 100 Ω can be selected.

Each A/B pair in the top, left and right banks does not support true

differential input or output buffer. It supports all single-ended inputs

and outputs, and can be used for emulated differential output buffer.

Some of these user-programmable I/O are used during configuration,

depending on the configuration mode. You need to make appropriate

connection on the board to isolate the 2 different functions

before/after configuration.

Some of these user-programmable I/O are shared with special function

pins. These pins, when not used as special purpose pins, can be

programmed as I/O for user logic.

During configuration the user-programmable I/O are tristated with an

internal weak pull-down resistor enabled. If any pin is not used (or not

bonded to a package pin), it is tristated and default to have weak pull-

down enabled after configuration.

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100 FPGA-DS-02049-0.83

Shared Configuration Pins1, 2

1. These pins can be used for configuration during configuration mode. When configuration is completed, these pins can be

used as GPIO, or shared function in GPIO. When these pins are used in dual function, you need to isolate the signal paths for

the dual functions on the board.

2. The pins used are defined by the configuration modes detected. Slave SPI or I2C/I3C modes are detected during slave

activation. Pins that are not used in the configuration mode selected are tristated during configuration, and can connect

directly as GPIO in user’s function.

PRxxx /SDA/USER_SDA

Input,

Output,

Bi-Dir

Configuration:

I2C/I3C Mode: SDA signal

User Mode:

PRxxx: GPIO

User_SDA: SDA signal for I2C/I3C interface

PRxxx /SCL/USER_SCL

Input,

Output,

Bi-Dir

Configuration:

I2C/I3C Mode: SCL signal

User Mode:

PRxxx: GPIO

User_SDA: SCL signal for I2C/I3C interface

PRxxx/TDO/SSO

Input,

Output,

Bi-Dir

Configuration:

Slave SPI Mode: Slave Serial Output

User Mode:

PRxxx: GPIO

TDO: When JTAG_EN = 1, used as TDO signal for JTAG

PRxxx/TDI/SSI

Input,

Output,

Bi-Dir

Configuration:

Slave SPI Mode: Slave Serial Input

User Mode:

PRxxx: GPIO

TDI: When JTAG_EN = 1, used as TDI signal for JTAG

PRxxx/TMS/SCSN

Input,

Output,

Bi-Dir

Configuration:

Slave SPI Mode: Slave Chip Select

User Mode:

PRxxx: GPIO

TMS: When JTAG_EN = 1, used as TMS signal for JTAG

PRxxx/TCK/SCLK

Input,

Output,

Bi-Dir

Configuration:

Slave SPI Mode: Slave Clock Input

User Mode:

PRxxx: GPIO

TCK: When JTAG_EN = 1, used as TCK signal for JTAG

PTxxx/MCSNO

Input,

Output,

Bi-Dir

Configuration:

Master SPI Mode: Chip Select Output

User Mode:

PTxxx: GPIO

PTxxx/MD3

Input,

Output,

Bi-Dir

Configuration:

Master Quad SPI Mode: I/O3

User Mode:

PTxxx: GPIO

PTxxx/MD2

Input,

Output,

Bi-Dir

Configuration:

Master Quad SPI Mode: I/O2

User Mode:

PTxxx: GPIO

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 101

PTxxx/MSI/MD1

Input,

Output,

Bi-Dir

Configuration:

Master SPI Mode: Master Serial Input

Master Quad SPI Mode: I/O1

User Mode:

PTxxx: GPIO

PTxxx/MSO/MD0

Input,

Output,

Bi-Dir

Configuration:

Master SPI Mode: Master Serial Output

Master Quad SPI Mode: I/O0

User Mode:

PTxxx: GPIO

PTxxx/MCSN/PCLKT0_1

Input,

Output,

Bi-Dir

Configuration:

Master SPI Mode: Master Chip Select Output

User Mode:

PTxxx: GPIO

PCLKT0_0: Top PCLK Input

PTxxx/MCLK/PCLKT0_0

Input,

Output,

Bi-Dir

Configuration:

Master SPI Mode: Master Clock Output

User Mode:

PTxxx: GPIO

PCLKT0_1: Top PCLK Input

PTxxx/PROGRAMN

Input,

Output,

Bi-Dir

Configuration:

PROGRAMN: Initiate configuration sequence when asserted LOW.

User Mode:

PTxxx: GPIO

PTxxx/INITN

Input,

Output,

Bi-Dir

Configuration:

INITN: Open Drain I/O pin. This signal is driven to LOW when

configuration sequence is started, to indicate the device is in

initialization state. This signal is released after initialization is

completed, and the configuration download can start. You can keep

drive this signal LOW to delay configuration download to start.

User Mode:

PTxxx: GPIO

PTxxx/DONE

Input,

Output,

Bi-Dir

Configuration:

DONE: Open Drain I/O pin. This signal is driven to LOW during

configuration time. It is released to indicate the device has completed

configuration. You can keep drive this signal LOW to delay the device to

wake up from configuration.

User Mode:

PTxxx: GPIO

Shared User GPIO Pins1, 2, 3, 4

1. Shared User GPIO pins are pins that can be used as GPIO, or functional pins that connect directly to specific functional

blocks, when device enters into User Mode.

2. Declaring on assigning the pin as GPIO or specific functional pin is done by configuration bitstream, except JTAG pins.

3. JTAG pins are controlled by JTAG_EN signal. When JTAG_EN = 1, the pins are used for JTAG interface. When JTAG = 0, the

pins are used as GPIO or specific functional pin defined by configuration bitstream.

4. Refer to package pin file.

Shared JTAG Pins

PRxxx/TDO/ yyyy

Input,

Output,

Bi-Dir

User Mode:

PRxxx: GPIO

TDO: When JTAG_EN = 1, used as TDO signal for JTAG

yyyy: Other possible selectable specific functional

CrossLink-NX Family

Preliminary Data Sheet

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102 FPGA-DS-02049-0.83

PRxxx/TDI/yyyy

Input,

Output,

Bi-Dir

User Mode:

PRxxx: GPIO

TDI: When JTAG_EN = 1, used as TDI signal for JTAG

yyyy: Other possible selectable specific functional

PRxxx/TMS/ yyyy

Input,

Output,

Bi-Dir

User Mode:

PRxxx: GPIO

TMS: When JTAG_EN = 1, used as TMS signal for JTAG

yyyy: Other possible selectable specific functional

PRxxx/TCK/ yyyy

Input,

Output,

Bi-Dir

User Mode:

PRxxx: GPIO

TCK: When JTAG_EN = 1, used as TCK signal for JTAG

Yyyy: Other possible selectable specific functional

Shared CLOCK Pins 1

1. Some PCLK pins can also be used as GPLL reference clock input pin. Refer to CrossLink-NX sysCLOCK PLL/DLL Design and

Usage Guide (FPGA-TN-02095).

PBxxx/PCLK[T,C][3,4,5]_[0-

3]/yyyy

3, 4, 5

Input,

Output,

Bi-Dir

User Mode:

PBxxx: GPIO

PCLK: Primary Clock or GPLL Refclk signal

[T,C] = True/Complement when using differential signaling

[3,4,5] = Bank

[0-3] Up to 4 signals in the bank

yyyy: Other possible selectable specific functional

PTxxx/PCLKT0_[0-1]/yyyy

Input,

Output,

Bi-Dir

User Mode:

PTxxx: GPIO

PCLKT: Primary Clock or GPLL Refclk signal (Only Single Ended)

[0-1] Up to 2 signals in the bank

yyyy: Other possible selectable specific functional

PRxxx/PCLKT[1,2]_[0-2]/yyyy

1, 2

Input,

Output,

Bi-Dir

User Mode:

PRxxx: GPIO

PCLKT: Primary Clock or GPLL Refclk signal (Only Single Ended)

[0-2] Up to 3 signals in the bank

yyyy: Other possible selectable specific functional

PLxxx/PCLKT[6,7]_[0-2]/yyyy

6, 7

Input,

Output,

Bi-Dir

User Mode:

PLxxx: GPIO

PCLKT: Primary Clock or GPLL Refclk signal (Only Single Ended)

[0-2] Up to 3 signals in the bank

yyyy: Other possible selectable specific functional

PBxxx/LRC_GPLL[T,C]_IN/yyyy

Input,

Output,

Bi-Dir

User Mode:

PBxxx: GPIO

LRC_GPLL: Lower Right GPLL Refclk signal

[T,C] = True/Complement when using differential signaling

yyyy: Other possible selectable specific functional

PBxxx/LLC_GPLL[T,C]_IN/yyyy

Input,

Output,

Bi-Dir

User Mode:

PBxxx: GPIO

LLC_GPLL: Lower Left GPLL Refclk signal

[T,C] = True/Complement when using differential signaling

yyyy: Other possible selectable specific functional

PLxxx/ULC_GPLLT_IN/yyyy

Input,

Output,

Bi-Dir

User Mode:

PLxxx: GPIO

ULC_GPLL: Upper Left GPLL Refclk signal (Only Single Ended)

yyyy: Other possible selectable specific functional

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 103

PRxxx/URC_GPLLT_IN/yyyy

Input,

Output,

Bi-Dir

User Mode:

PRxxx: GPIO

URC_GPLL: Upper Right GPLL Refclk signal (Only Single Ended)

yyyy: Other possible selectable specific functional

Shared VREF Pins

PBxxx/VREF[3,4,5]_[1-2]/yyyy

3, 4, 5

Input,

Output,

Bi-Dir

User Mode:

PBxxx: GPIO

VREF: Reference Voltage for DDR memory function

[3,4,5] = Bank

[1-2] Up to VREFs for each bank

yyyy: Other possible selectable specific functional

Shared ADC Pins

PBxxx/ADC_C[P,N]nn/yyyy

3, 4, 5

Input,

Output,

Bi-Dir

User Mode:

PBxxx: GPIO

ADC_C: ADC Channel Inputs

[P,N] = Positive or Negative Input

nn = ADC Channel number (0 – 15)

yyyy: Other possible selectable specific functional

Shared Comparator Pins

PBxxx/COMP[1-3][P,N]/yyyy

3, 5

Input,

Output,

Bi-Dir

User Mode:

PBxxx: GPIO

COMP: Differential Comparator Input

[P,N] = Positive or Negative Input

[1-3] = Input to Comparators 1-3

yyyy: Other possible selectable specific functional

Shared SGMII Pins

PBxxx/SGMII_RX[P,N][0-

1]/yyyy

3, 5

Input,

Output,

Bi-Dir

User Mode:

PBxxx: GPIO

SGMII_RX: Differential SGMII RX Inputs

[P,N] = Positive or Negative Input

[0-1] = Input to SGMII RX0 or RX1

yyyy: Other possible selectable specific functional

*Note: Not all signals are available as external pins in all packages. Refer to the Pinout List file for various package details.

CrossLink-NX Family

Preliminary Data Sheet

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104 FPGA-DS-02049-0.83

4.2. Pin Information Summary

4.2.1. CrossLink-NX Family

Pin Information

Summary

LIFCL-17

LIFCL-40

72wlcsp

72 QFN

121csfBGA

256caBGA

121csfBGA

72 QFN

289csBGA

256caBGA

400caBGA

User I/O Pins

General

Purpose

Inputs/Outputs

per Bank

Bank 0

—

Bank 1

—

Bank 2

—

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

—

Bank 7

—

Total Single-Ended User

I/O

—

185

Differential

Input / Output

Pairs

Bank 0

Bank 1

Bank 2

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

Bank 7

Total Differential I/O

—

Power Pins

VCC, VCCECLK

—

VCCAUXA

—

VCCAUX

—

VCCAUXHx

—

VCCAUXSD

—

VCCIO

Bank 0

—

Bank 1

—

Bank 2

—

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

—

Bank 7

—

VCC_D-PHYx

—

VCCA_D-PHYx

—

VCCPLL_D-PHYx

—

VCCSD0

—

VCCPLLSD0

—

VCCADC18

—

Total Power Pins

—

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 105

Pin Information

Summary

LIFCL-17

LIFCL-40

72wlcsp

72 QFN

121csfBGA

256caBGA

121csfBGA

72 QFN

289csBGA

256caBGA

400caBGA

GND Pins

Vss

—

VSSADC

—

VSSSD

—

VSSA_D-PHY

—

Total GND Pins

—

Dedicated Pins

Dedicated ADC Channels

(pairs)

—

Dedicated ADC Reference

Voltage Pins

—

Dedicated D-PHY Data

Channels (pairs)

—

Dedicated D-PHY Clock

(pairs)

—

Dedicated Misc Pins

JTAGEN

—

RESERVED

—

Total Dedicated Pins

—

Shared Pins

Shared

Configuration

Pins

Bank 0

—

Bank 1

—

Bank 2

Bank 3

Bank 4

Bank 5

Bank 6

Bank 7

Shared JTAG

Pins

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Bank 6

Bank 7

Shared PCLK

Pins

Bank 0

—

Bank 1

—

Bank 2

—

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

—

Bank 7

—

CrossLink-NX Family

Preliminary Data Sheet

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106 FPGA-DS-02049-0.83

Pin Information

Summary

LIFCL-17

LIFCL-40

72wlcsp

72 QFN

121csfBGA

256caBGA

121csfBGA

72 QFN

289csBGA

256caBGA

400caBGA

Shared GPLL

Pins

Bank 0

Bank 1

—

Bank 2

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

Bank 7

—

Shared VREF

Pins

Bank 0

Bank 1

Bank 2

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

Bank 7

Shared ADC

Channels (pairs)

Bank 0

Bank 1

Bank 2

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

Bank 7

Shared

Comparator

Channels (pairs)

Bank 0

Bank 1

Bank 2

Bank 3

—

Bank 4

—

Bank 5

—

Bank 6

Bank 7

Shared SGMII

Channels (pairs)

Bank 0

Bank 1

Bank 2

Bank 3

—

Bank 4

Bank 5

—

Bank 6

Bank 7

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 107

5. Ordering Information

5.1. CrossLink-NX Part Number Description

Logic Capacity

40 = 39K Logic Cells Package

SG72 = 72-pin QFN

MG121 = 121-ball csfBGA

BG256 = 256-ball caBGA

MG289 = 289-ball csBGA

BG400 = 400-ball caBGA

LIFCL

Grade

C = Commercial

I = Industrial

- 40 - X XXXX X

Speed (same number for HP and LP)

7 = Slowest

9 = Fastest

Device Family

CrossLink-NX FPGA

Logic Capacity

17 = 17K Logic Cells

Package

UWG72 = 72-ball WLCSP

SG72 = 72-pin QFN

MG121 = 121-ball csfBGA

BG256 = 256-ball caBGA

Device Family

CrossLink-NX FPGA

LIFCL

Grade

C = Commercial

I = Industrial

- 17 - X XXXX X

Speed (same number for HP and LP)

7 = Slowest

9 = Fastest

CrossLink-NX Family

Preliminary Data Sheet

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108 FPGA-DS-02049-0.83

5.2. Ordering Part Numbers

5.2.1. Commercial

Part Number

Speed

Package

Pins

Temp.

Logic Cells (K)

LIFCL-17-7UWG72C

–7

Lead free WLCSP

Commercial

LIFCL-17-8UWG72C

–8

Lead free WLCSP

Commercial

LIFCL-17-9UWG72C

–9

Lead free WLCSP

Commercial

LIFCL-17-7SG72C

–7

Lead free QFN

Commercial

LIFCL-17-8SG72C

–8

Lead free QFN

Commercial

LIFCL-17-9SG72C

–9

Lead free QFN

Commercial

LIFCL-17-7MG121C

–7

Lead free csfBGA

121

Commercial

LIFCL-17-8MG121C

–8

Lead free csfBGA

121

Commercial

LIFCL-17-9MG121C

–9

Lead free csfBGA

121

Commercial

LIFCL-17-7BG256C

–7

Lead free caBGA

256

Commercial

LIFCL-17-8BG256C

–8

Lead free caBGA

256

Commercial

LIFCL-17-9BG256C

–9

Lead free caBGA

256

Commercial

LIFCL-40-7SG72C

–7

Lead free QFN

Commercial

LIFCL-40-8SG72C

–8

Lead free QFN

Commercial

LIFCL-40-9SG72C

–9

Lead free QFN

Commercial

LIFCL-40-7MG121C

–7

Lead free csfBGA

121

Commercial

LIFCL-40-8MG121C

–8

Lead free csfBGA

121

Commercial

LIFCL-40-9MG121C

–9

Lead free csfBGA

121

Commercial

LIFCL-40-7MG289C

–7

Lead free csBGA

289

Commercial

LIFCL-40-8MG289C

–8

Lead free csBGA

289

Commercial

LIFCL-40-9MG289C

–9

Lead free csBGA

289

Commercial

LIFCL-40-7BG256C

–7

Lead free caBGA

256

Commercial

LIFCL-40-8BG256C

–8

Lead free caBGA

256

Commercial

LIFCL-40-9BG256C

–9

Lead free caBGA

256

Commercial

LIFCL-40-7BG400C

–7

Lead free caBGA

400

Commercial

LIFCL-40-8BG400C

–8

Lead free caBGA

400

Commercial

LIFCL-40-9BG400C

–9

Lead free caBGA

400

Commercial

5.2.2. Industrial

Part Number

Speed

Package

Pins

Temp.

Logic Cells (K)

LIFCL-17-7UWG72I

–7

Lead free WLCSP

Industrial

LIFCL-17-8UWG72I

–8

Lead free WLCSP

Industrial

LIFCL-17-9UWG72I

–9

Lead free WLCSP

Industrial

LIFCL-17-7SG72I

–7

Lead free QFN

Industrial

LIFCL-17-8SG72I

–8

Lead free QFN

Industrial

LIFCL-17-9SG72I

–9

Lead free QFN

Industrial

LIFCL-17-7MG121I

–7

Lead free csfBGA

121

Industrial

LIFCL-17-8MG121I

–8

Lead free csfBGA

121

Industrial

LIFCL-17-9MG121I

–9

Lead free csfBGA

121

Industrial

LIFCL-17-7BG256I

–7

Lead free caBGA

256

Industrial

LIFCL-17-8BG256I

–8

Lead free caBGA

256

Industrial

LIFCL-17-9BG256I

–9

Lead free caBGA

256

Industrial

LIFCL-40-7SG72I

–7

Lead free QFN

Industrial

LIFCL-40-8SG72I

–8

Lead free QFN

Industrial

CrossLink-NX Family

Preliminary Data Sheet

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FPGA-DS-02049-0.83 109

Part Number

Speed

Package

Pins

Temp.

Logic Cells (K)

LIFCL-40-9SG72I

–9

Lead free QFN

Industrial

LIFCL-40-7MG121I

–7

Lead free csfBGA

121

Industrial

LIFCL-40-8MG121I

–8

Lead free csfBGA

121

Industrial

LIFCL-40-9MG121I

–9

Lead free csfBGA

121

Industrial

LIFCL-40-7MG289I

–7

Lead free csBGA

289

Industrial

LIFCL-40-8MG289I

–8

Lead free csBGA

289

Industrial

LIFCL-40-9MG289I

–9

Lead free csBGA

289

Industrial

LIFCL-40-7BG256I

–7

Lead free caBGA

256

Industrial

LIFCL-40-8BG256I

–8

Lead free caBGA

256

Industrial

LIFCL-40-9BG256I

–9

Lead free caBGA

256

Industrial

LIFCL-40-7BG400I

–7

Lead free caBGA

400

Industrial

LIFCL-40-8BG400I

–8

Lead free caBGA

400

Industrial

LIFCL-40-9BG400I

–9

Lead free caBGA

400

Industrial

CrossLink-NX Family

Preliminary Data Sheet

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110 FPGA-DS-02049-0.83

Supplemental Information

For Further Information

A variety of technical notes for the CrossLink-NX family are available.

For further information on interface standards refer to the following websites:

 JEDEC Standards (LVTTL, LVCMOS, SSTL) – www.jedec.org

 PCI – www.pcisig.com

CrossLink-NX Family

Preliminary Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02049-0.83 111

Revision History

Revision 0.83, November 2020

Section

Change Summary

All

Removed ALUREG/ALU and TransFR references across the document.

General Description

Updated Table 1.1.

Architecture

 Updated Figure 2.1 and Figure 2.2.

 Update sysI/O Banking Scheme section content to correct the bank information for 40K

and 17K device.

 Removed VCCIO supplies should be powered-up before or together with the VCC and

VCCAUX supplies information in Typical sysI/O I/O Behavior During Power-up section.

DC and Switching Characteristics

 Updated symbol and condition values in Table 3.1 and Table 3.9.

 Updated notes in Table 3.2. Removed note 2: All VCCIO supplies with same voltage

should be connected together.

 Updated Table 3.26 to correct the package values for LVDS and subLVDS.

Pinout Information

Updated table in Signal Descriptions* and Pin Information Summary.

Revision 0.82, August 2020

Section

Change Summary

Introduction

Added Cryptographic Engine information in Features section.

Cryptographic Engine

Added this section.

Revision 0.81.01, May 2020

Section

Change Summary

Architecture

 Updated Table 3.2 and added footnote 5.

 Updated content of Large RAM section.

 Updated Primary Clocks and Dynamic Clock Control to add domain.

 Updated Device Configuration section to add the following statements:

 The test access port is supported for VCCIO1 = 1.8 V - 3.3 V.

 JTAG, SSPI, MSPI, I2C and I3C are supported for VCCIO = 1.8 V - 3.3 V.

 Updated MIPI D-PHY Blocks section.

 Updated content and figures of Peripheral Component Interconnect Express (PCIe)

section.

DC and Switching Characteristics

Updated the following tables:

 Table 3.10

 Table 3.11

 Table 3.26

 Table 3.44.