SEMICONDUCTOR TECHNICAL DATA L SUFFIX CERAMIC CASE 620 The MC14094B combines an 8-stage shift register with a data latch for each stage and a three-state output from each latch. Data is shifted on the positive clock transition and is shifted from the seventh stage to two serial outputs. The QS output data is for use in high-speed cascaded systems. The QS output data is shifted on the following negative clock transition for use in low-speed cascaded systems. Data from each stage of the shift register is latched on the negative transition of the strobe input. Data propagates through the latch while strobe is high. Outputs of the eight data latches are controlled by three-state buffers which are placed in the high-impedance state by a logic Low on Output Enable. * Three-State Outputs * Capable of Driving Two Low-Power TTL Loads or One Low-Power Schottky TTL Load Over the Rated Temperature Range * Input Diode Protection * Data Latch * Dual Outputs for Data Out on Both Positive and Negative Clock Transitions * Useful for Serial-to-Parallel Data Conversion * Pin-for-Pin Compatible with CD4094B MC14XXXBCP MC14XXXBCL MC14XXXBD VDD DC Supply Voltage Plastic Ceramic SOIC TA = - 55 to 125C for all packages. MAXIMUM RATINGS* (Voltages Referenced to VSS) Parameter D SUFFIX SOIC CASE 751B ORDERING INFORMATION IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIII IIIIII III IIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIII IIIIII III IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII Symbol P SUFFIX PLASTIC CASE 648 Value Unit - 0.5 to + 18.0 V PIN ASSIGNMENT STROBE 1 16 DATA 2 15 CLOCK 3 14 VDD OUTPUT ENABLE Q5 4 13 Q6 12 Q7 Vin, Vout Input or Output Voltage (DC or Transient) - 0.5 to VDD + 0.5 V Q1 Iin, Iout Input or Output Current (DC or Transient), per Pin 10 mA Q2 5 Q3 6 11 Q8 PD Power Dissipation, per Package 500 mW Q4 7 10 QS Tstg Storage Temperature - 65 to + 150 _C VSS 8 9 QS 260 _C TL Lead Temperature (8-Second Soldering) * Maximum Ratings are those values beyond which damage to the device may occur. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C Ceramic "L" Packages: - 12 mW/_C From 100_C To 125_C Clock Parallel Outputs Serial Outputs Output Enable Strobe Data Q1 QN QS* QS 0 X X Z Z Q7 No Chg. 0 X X Z Z No Chg. Q7 1 0 X No Chg. No Chg. Q7 No Chg. 1 1 0 0 QN-1 Q7 No Chg. 1 1 1 1 QN-1 Q7 No Chg. 1 1 1 No Chg. No Chg. No Chg. Q7 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. v v Z = High Impedance X = Don't Care * At the positive clock edge, information in the 7th shift register stage is transferred to Q8 and QS. REV 3 1/94 MOTOROLA Motorola, Inc. 1995 CMOS LOGIC DATA MC14094B 1 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII IIII III IIIIII IIIIIIII IIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII IIIIIIII IIIIII IIIIIIIIII IIII III III IIII III IIII III IIII III III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII IIIIIIII IIIIII IIIIIIIIIIIIIIIIIIII IIII III IIII III IIII III III IIIIII IIIIIIII IIIIII IIIIIIIIIIIIIIIIIIII IIIIIII IIIIIIIIIII IIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII IIII III IIII III IIII III III IIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) Characteristic Output Voltage Vin = VDD or 0 Symbol - 55_C 25_C 125_C VDD Vdc Min Max Min Typ # Max Min Max Unit "0" Level VOL 5.0 10 15 -- -- -- 0.05 0.05 0.05 -- -- -- 0 0 0 0.05 0.05 0.05 -- -- -- 0.05 0.05 0.05 Vdc "1" Level VOH 5.0 10 15 4.95 9.95 14.95 -- -- -- 4.95 9.95 14.95 5.0 10 15 -- -- -- 4.95 9.95 14.95 -- -- -- Vdc 5.0 10 15 -- -- -- 1.5 3.0 4.0 -- -- -- 2.25 4.50 6.75 1.5 3.0 4.0 -- -- -- 1.5 3.0 4.0 5.0 10 15 3.5 7.0 11 -- -- -- 3.5 7.0 11 2.75 5.50 8.25 -- -- -- 3.5 7.0 11 -- -- -- 5.0 5.0 10 15 - 3.0 - 0.64 - 1.6 - 4.2 -- -- -- -- - 2.4 - 0.51 - 1.3 - 3.4 - 4.2 - 0.88 - 2.25 - 8.8 -- -- -- -- - 1.7 - 0.36 - 0.9 - 2.4 -- -- -- -- IOL 5.0 10 15 0.64 1.6 4.2 -- -- -- 0.51 1.3 3.4 0.88 2.25 8.8 -- -- -- 0.36 0.9 2.4 -- -- -- mAdc Input Current Iin 15 -- 0.1 -- 0.00001 0.1 -- 1.0 Adc Input Capacitance (Vin = 0) Cin -- -- -- -- 5.0 7.5 -- -- pF Quiescent Current (Per Package) IDD 5.0 10 15 -- -- -- 5.0 10 20 -- -- -- 0.005 0.010 0.015 5.0 10 20 -- -- -- 150 300 600 Adc Total Supply Current** (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT 5.0 10 15 3-State Output Leakage Current ITL 15 Vin = 0 or VDD Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) VIL "1" Level VIH (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Vdc Vdc IOH Source Sink mAdc IT = (4.1 A/kHz) f + IDD IT = (14 A/kHz) f + IDD IT = (140 A/kHz) f + IDD -- 0.1 -- 0.0001 0.1 Adc -- 3.0 A #Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. ** The formulas given are for the typical characteristics only at 25_C. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk where: IT is in A (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.001. MC14094B 2 MOTOROLA CMOS LOGIC DATA IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII IIII IIIII IIII IIII IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII IIII IIIII IIII IIII IIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C) Characteristic Symbol Output Rise and Fall Time tTLH, tTHL = (1.35 ns/pF) CL + 33 ns tTLH, tTHL = (0.6 ns/pF) CL + 20 ns tTLH, tTHL = (0.4 ns/pF) CL + 20 ns Propagation Delay Time Clock to Serial out QS tPLH, tPHL = (0.90 ns/pF) CL + 305 ns tPLH, tPHL = (0.36 ns/pF) CL + 107 ns tPLH, tPHL = (0.26 ns/pF) C L + 82 ns tTLH, tTHL VDD Vdc Min Typ # Max 5.0 10 15 -- -- -- 100 50 40 200 100 80 Unit ns tPLH, tPHL ns 5.0 10 15 -- -- -- 350 125 95 600 250 190 Clock to Serial out Q'S tPLH, tPHL = (0.90 ns/pF) CL + 350 ns tPLH, tPHL = (0.36 ns/pF) CL + 149 ns tPLH, tPHL = (0.26 ns/pF) CL + 62 ns 5.0 10 15 -- -- -- 230 110 75 460 220 150 Clock to Parallel out tPLH, tPHL = (0.90 ns/pF) CL + 375 ns tPLH, tPHL = (0.35 ns/pF) CL + 177 ns tPLH, tPHL = (0.26 ns/pF) CL + 122 ns 5.0 10 15 -- -- -- 420 195 135 840 390 270 Strobe to Parallel out tPLH, tPHL = (0.90 ns/pF) CL + 245 ns tPLH, tPHL = (0.36 ns/pF) C L + 127 ns tPLH, tPHL = (0.26 ns/pF) CL + 87 ns 5.0 10 15 -- -- -- 290 145 100 580 290 200 tPHZ, tPZL 5.0 10 15 -- -- -- 140 75 55 280 150 110 tPLZ, tPZH 5.0 10 15 -- -- -- 225 95 70 450 190 140 Setup Time Data in to Clock tsu 5.0 10 15 125 55 35 60 30 20 -- -- -- ns Hold Time Clock to Data th 5.0 10 15 0 20 20 - 40 - 10 0 -- -- -- ns Clock Pulse Width, High tWH 5.0 10 15 200 100 83 100 50 40 -- -- -- ns Clock Rise and Fall Time tr(cl) tf(cl) 5 10 15 -- -- -- -- -- -- 15 5.0 4.0 s fcl 5.0 10 15 -- -- -- 2.5 5.0 6.0 1.25 2.5 3.0 MHz tWL 5.0 10 15 200 80 70 100 40 35 -- -- -- ns Output Enable to Output tPHZ, tPZL = (0.90 ns/pF) CL + 95 ns tPHZ, tPZL = (0.36 ns/PF) CL + 57 ns tPHZ, tPZL = (0.26 ns/pF) CL + 42 ns tPLZ, tPZH = (0.90 ns/pF) CL + 180 ns tPLZ, tPZH = (0.36 ns/pF) CL + 77 ns tPLZ, tPZH = (0.26 ns/pF) CL + 57 ns Clock Pulse Frequency Strobe Pulse Width * The formulas given are for the typical characteristics only at 25_C. #Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3-STATE TEST CIRCUIT FOR tPHZ AND tPZH VSS O.E. FOR tPLZ AND tPZL VDD 1k DATA ST OUTPUT 50 pF CLOCK MOTOROLA CMOS LOGIC DATA MC14094B 3 BLOCK DIAGRAM REGISTER STAGE 1 CLOCK 2 LATCH 1 CLOCK 3-STATE BUFFER 1 STROBE VDD * SERIAL DATA IN 15 CLOCK CLOCK STROBE STROBE CLOCK CLOCK STROBE 4 Q1 * 2 OUTPUT ENABLE 3 4 5 6 7 8 REGISTER STAGE 2 LATCH 2 3-STATE BUFFER 2 5 Q2 REGISTER STAGE 3 LATCH 3 3-STATE BUFFER 3 6 Q3 REGISTER STAGE 4 LATCH 4 3-STATE BUFFER 4 7 Q4 REGISTER STAGE 5 LATCH 5 3-STATE BUFFER 5 14 Q5 REGISTER STAGE 6 LATCH 6 3-STATE BUFFER 6 13 Q6 REGISTER STAGE 7 LATCH 7 3-STATE BUFFER 7 12 Q7 LATCH 8 3-STATE BUFFER 8 11 Q8 10 QS 9 QS REGISTER STAGE 8 CLOCK 3 STROBE STROBE CLOCK CLOCK * CLOCK CLOCK CLOCK CLOCK CLOCK 1 *Input Protection Diodes STROBE * STROBE CLOCK STROBE DYNAMIC TIMING DIAGRAM tWH 3 tf tr CLOCK 50% 90% 50% 10% th tsu 2 DATA IN tWL 1 STROBE 15 OUTPUT ENABLE 50% tPLH N Q1 Q7 tTLH 9 QS 90% tPHL 90% tPLH tPHZ tTHL MC14094B 4 tPZL 90% 10% 10% tPHL tPLH 50% 50% tPLH 10 QS tPLZ tPZH 90% 10% 10% 50% 50% tPHL 50% MOTOROLA CMOS LOGIC DATA OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V -A- 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. -B- C L DIM A B C D E F G H K L M N -T- K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M S INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A- 16 9 1 8 B F C L S -T- SEATING PLANE K H G D J 16 PL 0.25 (0.010) MOTOROLA CMOS LOGIC DATA M T A M M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC14094B 5 OUTLINE DIMENSIONS D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J -A- 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 -B- 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C -T- SEATING PLANE M D 16 PL 0.25 (0.010) M T B S A S J DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. 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Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 MC14094B 6 *MC14094B/D* MOTOROLA CMOS LOGIC DATA MC14094B/D