Ver. 201306
※Rated Current: DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
21 2.0±0.1 1.25±0.1 0.9±0.1 0.5+0.2
-0.3
DESCRIPTION
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
Max.
CIG21LR47MNE 0805/2012 0.47 ±20 % 0.080 ±20 % 1.30
CIG21L1R0MNE 0805/2012 1.0 ±20 % 0.110 ±20 % 1.15
CIG21L1R2MNE 0805/2012 1.2 ±20 % 0.125 ±20 % 1.10
CIG21L1R5MNE 0805/2012 1.5 ±20 % 0.140 ±20 % 1.05
CIG21L2R2MNE 0805/2012 2.2 ±20 % 0.160 ±20 % 0.95
CIG21L3R3MNE 0805/2012 3.3 ±20 % 0.220 ±20 % 0.80
CIG21L4R7MNE 0805/2012 4.7 ±20 % 0.260 ±20 % 0.75
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG21L Series (2012/ EIA 0805)
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201306
CI G 21 L 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (L:Low RDC Type)
(5) Inductance (R47:0.47uH, 1R0:1.0uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 3,000
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING FLOW SOLDERING
PRODUCT IDENTIFICATION
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question
regarding the data sheets, please contact our sales personnel or application engineers.
