DATA SHEE
T
THIN-FILM CHIP RESISTORS
TF×23 series, 0.1% TC50
10 Ω TO 1 MΩ
sizes 1210, 1206, 0805, 0603 and 0402
Product Specification – Jul 10, 2003 V.2
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 2 www.yageo.com
FEATURES
• High precision
• High long-tem stability
• Low temperature coefficient.
APPLICATIONS
• Converters
• Printer equipment
• Motherboards
• Telecom
• Consumer.
QUICK REFERENCE DATA
VALUE
DESCRIPTION TF523 TF023 TF123 TF223 TF323
Size code 1210 1206 0805 0603 0402
Resistance range 10 Ω to 1 MΩ 10
Ω to 1 MΩ 10
Ω to 1 MΩ 10
Ω to 332 kΩ 10
Ω to 100 kΩ
Resistance tolerance
and series ±0.1%; E24 and E96 series
Temperature coefficient ≤ ±50 × 10−6/K
Maximum dissipation at
Tamb = 70 °C 0.25 W 0.125 W 0.125 W 0.1 W 0.0625 W
Maximum permissible
voltage (DC or RMS) 200 V 200 V 150 V 75 V 50 V
Climatic category
(IEC 60068) 55/125/56
Basic specification IEC 60115-8 and MIL-STD-202F
DESCRIPTION
The re sist ors ar e con str uct ed o n a high grad e ce ram ic b ody (a lum iniu m
oxide). Internal metal elect rodes are added at each end and connected by
a resistive paste which is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance
required and the value is trimmed to within tolerance by laser cutting of
this resistiv e layer.
The res istive layer is cover ed with a pr otect ive co atin g and printed with
the resistance value. Finally, the two external end term inations are added.
To guarantee optimum solderability the outer layer consists of a lead-tin
alloy.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 3 www.yageo.com
ORDERING INFORMATION
Table 1 Ordering code indicating resistor type and packing
TYPE SIZE
CODE RESISTANCE
VALUE TOL.
(%) PAPER TAPE
ON REEL 12NC ORDERI NG CODE
TF523 1210 10
Ω to 1 MΩ ±0.1 5000 2390 412 4xxxx
TF023 1206 10
Ω to 1 MΩ ±0.1 5000 2390 411 4xxxx
TF123 0805 10 Ω to 1 MΩ ±0.1 5000 2390 401 4xxxx
TF223 0603 10
Ω to 332 kΩ ±0.1 5000 2390 404 4xxxx
TF323 0402 10
Ω to 100 kΩ ±0.1 10000 2390 407 4xxxx
Ordering code (12NC)
• The resistors have a 12-digit
ordering code starting with 2390;
see Table 1.
• The subsequent 4 digits indicate
the resistor type and packing.
• The remaining 4 digits indicate
the resistance value:
− The first 3 digits indicate the
resistance valu e.
− The last digit indicates the
resistance decade in
accordance with Table 2.
Table 2 Last digit of 12NC
RESISTANCE
DECADE LAST DIGIT
10 Ω to 97.6 Ω 9
100 Ω to 976 Ω 1
1 kΩ to 9.76 kΩ 2
10 kΩ to 97.6 kΩ 3
100 kΩ to 976 kΩ 4
1 MΩ 5
ORDERING EXAMPLE
The ordering code of a TF023
resistor, value 1000 Ω with
0.1% tolerance, supplied on paper
tape of 5000 units per reel is:
2390 411 41002.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 4 www.yageo.com
FUNCTIONAL DESCRI PTI ON
Product characterization
Standard values of nominal
resistance are taken from the E24
and E96 series for resistors with a
tolerance of ±0.1%.
The values of the E24 and E96
series are in accordance with
“IEC publication 60063”.
Limiting values
TYPE LIMITING
VOLTAGE(1)
(V)
LIMITING
POWER
(W)
TF523 200 0.25
TF023 200 0.125
TF123 150 0.125
TF223 75 0.1
TF323 50 0.0625
Note
1. The maximum voltage that may
be continuously applied to the
resistor element, see
“IEC publication 60115-8”.
DERATING
The rated power that the resistor can dissipate depends on the operating
temperature; see Fig.1.
MLB206
70 10055 50 Tamb( C)
o
(%P )
rated
00
50
100
125
Pmax
Fig.1 Maximum dissipation (Pmax) in percentage of rated power as a
function of the ambient temperature (Tamb).
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 5 www.yageo.com
tb
tt
T
inner electrode
end termination
protective coat
CCB633
1001
marking
W
L
protective coat
resistor layer
ceramic substrate
MECHANICAL DATA
Mass per 100 units
TYPE MASS
(g)
TF523 1.67
TF023 1
TF123 0.55
TF223 0.25
TF323 0.052
Marking
TYPE E24 E96
TF523 4 digits 4 digits
TF023 4 digits 4 digits
TF123 4 digits 4 digits
TF223 3 digits
3 digits
EIA-96
TF323 no marking
4-DIGIT MARKING
For values up to 97.6 Ω the R is
used as a decimal point. For values
of 1 kΩ or greater the first 3 digits
apply to the resistance value and the
fourth indicates the number of zeros
to follow.
Example
MARKING RESISTANCE
10R0 10 Ω
10R2 10.2
Ω
1001 1 kΩ
OUTLINES
Table 3 Chip resistor type and relevant physical dimensions; see Fig.2
TYPE L
(mm) W
(mm) T
(mm) tt
(mm) tb
(mm)
TF523
(1210) 3.1 ±0.1 2.6 ±0.1 0.55 ±0.1 0.50 ±0.2 0.5 ±0.2
TF023
(1206) 3.1 ±0.1 1.6 ±0.1 0.55 ±0.1 0.45 ±0.2 0.4 ±0.2
TF123
(0805) 2.0 ±0.1 1.25 ±0.1 0.50 ±0.1 0.35 ±0.2 0.35 ±0.2
TF223
(0603) 1.6 ±0.1 0.8
±0.1 0.45
±0.1 0.25
±0.15 0.25
±0.15
TF323
(0402) 1.0 ±0.1 0.50
±0.05 0.30
±0.05 0.20
±0.1 0.25
±0.1
Fig.2 Outlines.
For dimensions see Table 3.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 6 www.yageo.com
3-DIGI T MARKING
The first 2 digits apply to the
resistance value and the third
indicates the number of zeros to
follow.
Example
MARKING RESISTANCE
120 12
Ω
123 12 kΩ
124 120 kΩ
3-DIGIT EIA-96 MARKING
The first 2 digits apply to the
resistance value and the third
character indicates the multiplier as
shown in Tables 4 and 5.
Example
MARKING RESISTANCE
10X 12.4
Ω
10C 12.4 kΩ
10D 124 kΩ
MARKING OF PACKING MATERIAL
The packing material is also marked
and includes resistance value,
tolerance, catalogue number,
quantity, production period, batch
number and source code.
Table 4 First two digits of the resistance code
CODE VALUE CODE VALUE CODE VALUE CODE VALUE
01 100 25 178 49 316 73 562
02 102 26 182 50 324 74 576
03 105 27 187 51 332 75 590
04 107 28 191 52 340 76 604
05 110 29 196 53 348 77 619
06 113 30 200 54 357 78 634
07 115 31 205 55 365 79 649
08 118 32 210 56 374 80 665
09 121 33 215 57 383 81 681
10 124 34 221 58 392 82 698
11 127 35 226 59 402 83 715
12 130 36 232 60 412 84 732
13 133 37 237 61 422 85 750
14 137 38 243 62 432 86 768
15 140 39 249 63 442 87 787
16 143 40 255 63 453 88 806
17 147 41 261 65 464 89 825
18 150 42 267 66 475 90 845
19 154 43 274 67 487 91 866
20 158 44 280 68 499 92 887
21 162 45 287 69 511 93 909
22 165 46 294 70 523 94 931
23 169 47 301 71 536 95 953
24 174 48 309 72 549 96 976
Table 5 Multiplier codes
CODE Y X A B C D E F
Multiplier 10−2 10−1 1 10 102 103 104 105
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 7 www.yageo.com
TEST AND REQUIREMENTS
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
55/125/56 (rated temperature range
−55 to +125 °C; damp heat, lon g
term, 56 days). The testing also
covers the requirements specified by
EIA and MIL-STD-202F.
The tests are carried out in
accordance with IEC publication
60068, “Recommended basic
climatic and mechanical robustness
testing procedure for electronic
components” and under standard
atmospheric conditions in
accordance with “IEC 60068-1”,
subclause 5.3.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
Table 6 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
MIL-STD TEST PROCEDURE REQUIREMENTS
4.4.1 visual
examination no holes; clean surface;
no damage
4.4.2 dimensions
(outline) gauge see Table 3
applied voltage (+0/−10%):
10 Ω ≤ R < 100 Ω: 0.3 V
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
10 kΩ ≤ R < 100 kΩ: 10 V
100 kΩ ≤ R < 1 MΩ: 25 V
4.5 resistance
1 MΩ: 50 V
R − Rnom: max. ±0.1%
4.18 20 (Tb) 202F
method
210C
resistance to
soldering heat unmounted chips;
10 ±1 s; 260 ±5 °C no visible damage
∆R/R max.: ±(0.5% + 0.05 Ω)
4.17 20 (Ta) 202F
method
208G
solderability unmounted chips completely
immersed for 5 ±0.5 s in a
solder bath at 230 ±5 °C
good tinning (≥95% covered);
no damage
4.7 202F
method
301
voltage proof on
insulation maximum voltage (RMS)
during 1 minute,
metal block method
no breakdown or flashover
4.13 MIL-R
55342D
para.
4.7.5
short time
overload room temperature;
V = 2.5 × Vrated;
5 s (voltage not more
than 2 × Vmax);
specimen stabilized at room
temperature for 30 minutes
∆R/R max.: ±(0.5% + 0.05 Ω)
In Table 6 the tests and
requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8, 60068
and MIL-STD”; a short description of
the test procedure is also given. In
some instances deviations from the
IEC recommendations were
necessary for our method of
specifying.
All soldering tests are performed
with mildly activat ed flux.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 8 www.yageo.com
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
MIL-STD TEST PROCEDURE REQUIREMENTS
4.33 bending resistors mounted on a
90 mm glass epoxy resin PCB
(FR4); bending:
2 mm for 1210
2 mm for 1206
3 mm for 0805
3 mm for 0603
2 mm for 0402
no visible damage
∆R/R max.: ±(0.25% + 0.05 Ω)
MIL-R
55342D
para.
4.7.4
low temperature
operation −65 +0/−5 °C for 1 hour;
loaded with Vrated for
45 +5/−0 minutes ON, and
15 +5/−0 minutes OFF;
specimen stabilized at room
temperature for 24 hours after
test
no visible damage
∆R/R max.: ±(0.5% + 0.05 Ω)
4.19 14 (Na) 202F
method
107
thermal shock 2 minutes at LCT and
2 minutes at UCT; 5 cycles no visible damage
∆R/R max.: ±(0.5% + 0.05 Ω)
4.25.1 202F
method
108A
endurance 1000 +48/−0 hours; 70 ±2 °C;
loaded with Pn or Vmax;
1.5 hours on, 0.5 hours off;
specimen stabilized at room
temperature for 1 hour min.
after test
∆R/R max.: ±(0.5% + 0.05 Ω)
4.8.4.2 202F
method
304
temperature
coefficient at 25/LCT/25 °C and
25/UCT/25 °C ≤ ±50 × 10−6/K
4.6.1.1 202F
method
302
insulation
resistance after 1 minute,
metal block method
1210: 400 V (DC)
1206: 400 V (DC)
0805: 300 V (DC)
0603: 150 V (DC)
0402: 100 V (DC)
Rins min.: 104 MΩ
EIA 575
3.13 leaching unmounted chips; 60 ±1 s;
260 ±5 °C good tinning; no leaching
EIA/IS
703 4.6 202F
method
106
moisture
resistance 65 ±2 °C; 95 +3/−5% RH;
loaded with 0.01 Pn or Vmax
for 42 damp heat cycles.
(1 cycle consists of 7 steps;
see Fig.3)
∆R/R max.: ±(0.5% + 0.05 Ω)
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 9 www.yageo.com
75
initial drying
24 hours
90 − 98% RH 80 − 98%
RH
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
initial measurements
as specified in 2.2
0
STEP1 STEP3STEP2
prior to first
cycle only
STEP4
one cycle 24 hours; repeat as specified in 2.5
voltage applied as specified in 2.4
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP6 STEP7
HBK073
STEP5
51015
end of final cycle;
measurements
as specified in 2.7
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
20 time [h]
temperature
[°C]
25
50
25
0
90 − 98% RH 90 − 98% RH
+10 °C (+18 °F)
−2 °C (−3.6 °F)
80 − 98%
RH
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
Fig.3 Moisture resistance test requirements.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 10 www.yageo.com
MOUNTING
Due to their rectangular shape and small dimensional
tolerances, surface-mounted resistors are suitable for
handling by automatic placement systems.
Footprint dimensions
MBG628
E
B
A
F
C
DG
preferred direction during wave soldering
solder land /
solder paste
pattern
solder resist
pattern
occupied area
tracks
E AVAILABLE AREA FOR TRACKS
underneath the CHIP
Fig.4 Recommended footprint dimensions.
For dimensions see Table 7.
Table 7 Reflow soldering; for dimensions see also Fig.4
FOOTPRINT DIMENSIONS (mm)
TYPE SIZE
CODE A B C D E F G PROCESSING
REMARKS
PLACEMENT
ACCURACY
(mm)
TFx323 0402 1.5 0.5 0.5 0.6 0.1 1.9 1.0 ±0.15
TFx223 0603 2.1 0.5 0.8 0.9 0.0 2.5 1.7 ±0.25
TFx123 0805 2.6 0.9 0.85 1.4 0.5 3.0 2.1 ±0.25
TFx023 1206 3.8 2.0 0.9 1.8 1.4 4.2 2.5 ±0.25
TFx523 1210 3.8 2.0 0.9 2.7 1.4 4.2 3.4
IR soldering
±0.25
Table 8 Wave soldering; for dimensions see also Fig.4
FOOTPRINT DIMENSIONS (mm)
TYPE SIZE
CODE A B C D E F G
PROPOSED NUMBER
AND DIMENSIONS OF
DUMMY TRACKS (mm)
PLACEMENT
ACCURACY
(mm)
TFx223 0603 2.7 0.9 0.9 0.8 0.15 3.2 1.9 1 × (0.15 × 0.8) ±0.25
TFx123 0805 3.3 1.3 1.0 1.3 0.34 3.9 2.4 1
× (0.3 × 1.3) ±0.25
TFx023 1206 4.5 2.5 1.0 1.7 1.25 3.9 2.4 3
× (0.25 × 1.7) ±0.25
TFx523 1210 5.3 2.3 1.5 2.6 1.25 6.3 4.2 3
× (0.25 × 2.6) ±0.25
Chip placement can be on ceramic substrates and
printed-circuit boards (PCBs). Electrical connection to the
circuit is by soldering. The finishing of the end
terminations guarantees a reliable contact.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 11 www.yageo.com
SOLDERING CONDITIONS
The robust construction of chip resistors allows them to
be completely immersed in a solder bath of 260 °C for
one minute. Therefore, it is possible to mount surface-
mount resistors on one side of a PCB and other
components on the reverse side (mixed PCBs).
Surface-mount resistors are tested for solderability at
235 °C during 2 seconds. The test condition for no
leaching is 260 °C for 60 seconds. Typical examples of
soldering processes that provide reliable joints without
any damage, are given in Figs 5 and 6.
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
260 °C
130 °C
(°C)
t (s)
MLA859
245 °C
215 °C
180 °C
10 s
40 s
2 K/s
T
Fig.5 Infrared soldering.
Typical values (solid line).
Process limits (dotted lines).
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 12 www.yageo.com
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
235 °C to 260 °Csecond wave
5 K/s
2 K/s
first wave
200 K/s
100 °C to 130 °Cforced
cooling
2 K/s
(°C)
t (s)
T
MLA861
Fig.6 Double wave soldering.
Typical values (solid line).
Process limits (dotted lines).
The resistors may be soldered twice in accordance with this method if desired.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 13 www.yageo.com
PACKING
Tape and reel specifications
All tape and reel specifications are in accordance with
“IEC 60286-3”. Basic dimensions are given in Figs 7, 8
and 9 and Tables 9, and 10.
Peel-off force
Peel-off forces of both paper and blister tapes are in
accordance with “IEC 60286-3” that is, at a peel-off
speed of 300 ±10 mm/minute, 0.1 N to 1.0 N for 8 mm
tape. The peel-off angle should be between 165° and
180°.
Paper tape specification
MBG251
E
FW
P2
P0
P1
D0
B0
A0
T
cover tape
Fig.7 Paper tape.
Cumulative tolerance over 10 holes: ±0.2 mm.
Bottom fixing tape thickness: 50 ±10 µm.
Top fixing tape thickness : 50 ±10 µm.
For dimensions see Table 9.
Table 9 Dimensions of paper tape for relevant chip size; see Fig.7
TYPE AND SIZE CODE
TF323 (0402) TF223 (0603) TF123 (0805) TF023 (1206) TF523 (1210) UNIT
SYMBOL
SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL.
A0 0.65 ±0.1 1.10 ±0.1 1.65 ±0.1 1.90
±0.1 2.80 ±0.1 mm
B0 1.15 ±0.1 1.90 ±0.1 2.40 ±0.1 3.50 ±0.1 3.50 ±0.1 mm
W 8.0 ±0.2 8.0 ±0.2 8.0 ±0.2 8.0 ±0.2 8.0 ±0.2 mm
E 1.75 ±0.1 1.75 ±0.1 1.75 ±0.1 1.75 ±0.1 1.75 ±0.1 mm
F 3.50
±0.05 3.50 ±0.05 3.50 ±0.05 3.50
±0.05 3.50 ±0.05 mm
D0 1.5 +0.1/−0 1.5 +0.1/−0 1.50 +0.1/−0 1.5
+0.1/−0 1.5 +0.1/−0 mm
P0 4.0 ±0.1 4.0 ±0.1 4.0 ±0.1 4.0
±0.1 4.0 ±0.1 mm
P1 2.0 ±0.05 4.0 ±0.05 4.0 ±0.05 4.0 ±0.05 4.0 ±0.05 mm
P2 2.0 ±0.05 2.0 ±0.05 2.0 ±0.05 2.0 ±0.05 2.0 ±0.05 mm
T 0.53
±0.1 0.7 ±0.1 0.85 ±0.1 0.85
±0.1 0.85 ±0.1 mm
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 14 www.yageo.com
Tape leader/trailer specification
CCB325
empty compartments
with cover tape
(min. 240 mm) cover tape only
leader ≥400 mm
trailer (max. 260 mm)
trailer end
leader end
Fig.8 Leader/trailer tape.
Taping requirements
Resistance side facing up.
Component is free and not sticking to top and/or bottom
tape.
Component should be easy to remove from the carrier
tape and the chip cavity should have no mechanical
damage.
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 15 www.yageo.com
Reel specification
NCA
W1
W2
HBK039
Fig.9 Reel.
Dimensions in mm.
For reel dimensions see Table 10.
Table 10 Reel dimensions; see Fig.9
TYPE SIZE
CODE
UNITS
PER
REEL
TAPE
WIDTH
(mm)
A
(mm) N
(mm) C
(mm) W1
(mm)
W2
MAX.
(mm)
TF323 0402 10000
TF223 0603 5000
TF123 0508 5000
TF023 1206 5000
TF523 1210 5000
8 180
+0/−3 60
+1/−0 13.0
±0.2 9.0
±0.3 11.4
±1
Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx23 series, 0.1% TC50
10 Ω to 1 MΩ
2003 Jul 10 Rev.2 16 www.yageo.com
REVISION HISTORY
Revision Date Change
Notification Description
Rev.0 2001 Jul 30 - - First issue of this specification
Rev.1 2001 Sep 10 EBR-3240-
01177 - Range expanded with 0.25 W size 1210 resistors
- MIL-STD test procedures added
Rev.2 2003 Jul 10 - - Updated company logo
- Marking code revised
