74ACT11543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCAS136 - D3608, JULY 1990 - REVISED APRIL 1993 * * * * * * * Inputs Are TTL-Voltage Compatible 3-State True Outputs Back-to-Back Registers for Storage Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125C DW PACKAGE (TOP VIEW) CEBA A1 A2 A3 A4 GND GND GND GND A5 A6 A7 A8 CEAB t description This 8-bit registered transceiver contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch enable (LEAB or LEBA) and output enable (GAB or GBA) inputs are provided for each register to permit independent control in either direction of data flow. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 GBA LEBA B1 B2 B3 B4 VCC VCC B5 B6 B7 B8 LEAB GAB The A-to-B enable (CEAB) input must be low in order to enter data from A or to output data to B. Having CEAB low and LEAB low makes the A-to-B latches transparent; a subsequent low-to-high transition of LEAB puts the A latches in the storage mode. With CEAB and GAB both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B-to-A is similar, but requires the use of CEBA, LEBA, and GBA inputs. The 74ACT11543 is characterized for operation from - 40C to 85C. FUNCTION TABLE INPUTS CEAB LEAB GAB H X X X H LATCH STATUS A TO B OUTPUT BUFFERS B1 THRU B8 Storing Z Storing X H Z L L L Transparent Current A Data L H L Storing Previous A Data } A-to-B data flow is shown: B-to-A flow control is the same except uses CEBA, LEBA, and GBA. Data present before low-to-high transition of LEAB. EPIC is a trademark of Texas Instruments Incorporated. Copyright 1993, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 2-1 74ACT11543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCAS136 - D3608, JULY 1990 - REVISED APRIL 1993 logic symbol GBA CEBA LEAB GAB CEAB LEAB A1 A2 A3 A4 A5 A6 A7 A8 28 1 27 15 14 16 2 3 logic diagram (positive logic) 1EN GBA G1 CEBA 1C5 2EN4 LEBA G2 GAB 2C6 3 6D 5D 4 26 25 4 24 5 23 10 20 11 19 12 18 13 17 B1 CEAB LEAB B2 B3 A1 28 1 27 15 14 16 2 C1 1D 26 B1 B4 C1 1D B5 B6 B7 B8 To Seven Other Transceivers This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed. recommended operating conditions MIN NOM MAX 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 IOL Dt /Dv Low-level output current TA Operating free-air temperature 2-2 High-level input voltage 2 High-level output current Input transition rise or fall rate POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 UNIT V V 0.8 V VCC VCC V - 24 mA V 24 mA 0 10 ns/ V - 40 85 C 74ACT11543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCAS136 - D3608, JULY 1990 - REVISED APRIL 1993 electrical characteristics over recommended operating free-air temperature range PARAMETER TEST CONDITIONS VCC IOH = - 50 mA VOH IOH = - 24 mA IOH = - 75 mA II IOZ IOL = 24 mA Control inputs A or B ports ICC DICC Ci Control inputs TA = 25C TYP MAX MIN 4.5 V 4.4 4.4 5.5 V 5.4 5.4 4.5 V 3.94 3.8 5.5 V 4.94 MAX UNIT V 4.8 5.5 V IOL = 50 mA VOL MIN 3.85 4.5 V 0.1 5.5 V 0.1 0.1 0.1 4.5 V 0.36 0.44 5.5 V 0.36 0.44 V IOL = 75 mA VI = VCC or GND 5.5 V 5.5 V 0.1 1 mA VO = VCC or GND VI = VCC or GND, IO = 0 5.5 V 0.5 5 mA 5.5 V 8 80 mA One input at 3.4 V, Other inputs at GND or VCC 5.5 V 0.9 1 mA VI = VCC or GND VO = VCC or GND 5V 1.65 4.5 pF Cio A or B ports 5V 12 Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC. pF timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) TA = 25C MIN MAX tw Pulse duration, LEAB or LEBA low tsu Setup time th Hold time MIN 4 4 2.5 2.5 Data before CEAB or CEBA 3 3 Data after LEAB or LEBA 2 2 1.5 1.5 Data after LEAB or LEBA Data after CEAB or CEBA POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MAX UNIT ns ns ns 2-3 74ACT11543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCAS136 - D3608, JULY 1990 - REVISED APRIL 1993 switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPLH tPHL LEBA or LEAB A or B tPZH tPZL CEBA or CEAB A or B tPHZ tPLZ CEBA or CEAB A or B tPZH tPZL GBA or GAB A or B tPHZ tPLZ GBA or GAB A or B MIN TA = 25C TYP MAX MIN MAX 3.5 6.2 9.1 3.5 10.2 3.2 6.5 10.8 3.2 12.1 3 6.1 10.1 3 11.2 3.7 7.2 11.7 3.7 13.2 3.5 6.7 11.1 3.5 12.2 3.2 8.4 13.4 3.2 16 4.8 7.3 10.1 4.8 11 5.1 7.5 10.3 5.1 11.1 3.3 6.4 10.5 3.3 11.5 3 8 12.8 3 15.3 4.6 6.9 9.6 4.6 10.4 5 7.1 9.8 5 10.5 UNIT ns ns ns ns ns ns operating characteristics, VCC = 5 V, TA = 25C PARAMETER Cpd d 2-4 TEST CONDITIONS Power dissipation capacitance per transceiver Outputs enabled Outputs disabled POST OFFICE BOX 655303 pF CL = 50 pF, * DALLAS, TEXAS 75265 f = 1 MHz TYP 47 13 UNIT pF 74ACT11543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCAS136 - D3608, JULY 1990 - REVISED APRIL 1993 PARAMETER MEASUREMENT INFORMATION 2 x VCC S1 500 From Output Under Test Open GND 500 CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 x VCC GND LOAD CIRCUIT 3V Timing Input (see Note B) 1.5 V 0V tw tsu 3V Input 1.5 V th 1.5 V 3V 1.5 V 1.5 V Data Input 0V 0V VOLTAGE WAVEFORMS Output Control (low-level enabling) 3V Input (see Note B) 1.5 V 1.5 V 0V tPHL tPLH In-Phase Output 50% VCC VOH 50% VCC VOL 50% VCC 3V VOH 50% VCC VOL Output Waveform 2 S1 at GND (see Note C) 1.5 V 1.5 V 0V tPZL [ VCC tPLZ Output Waveform 1 S1 at 2 x VCC (see Note C) tPLH tPHL Out-of-Phase Output VOLTAGE WAVEFORMS 50% VCC VOL tPHZ tPZH VOLTAGE WAVEFORMS 20% VCC 50% VCC 80% VCC VOH [0V VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr = 3 ns, tf = 3 ns. C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 2-5 74ACT11543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SCAS136 - D3608, JULY 1990 - REVISED APRIL 1993 2-6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ACT11543DWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11543DWRE4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11543DWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11543NT OBSOLETE PDIP NT 28 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74ACT11543DWR Package Package Pins Type Drawing SOIC DW 28 SPQ Reel Reel Diameter Width (mm) W1 (mm) 1000 330.0 32.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 11.35 18.67 3.1 16.0 32.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74ACT11543DWR SOIC DW 28 1000 346.0 346.0 49.0 Pack Materials-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2011 PACKAGING INFORMATION Orderable Device 74ACT11543NT Status (1) OBSOLETE Package Type Package Drawing PDIP NT Pins Package Qty Eco Plan 28 TBD (2) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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