74ACT11543
OCTAL REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS136 – D3608, JULY 1990 – REVISED APRIL 1993
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1993, Texas Instruments Incorporated
2–1
•Inputs Are TTL-Voltage Compatible
•3-State True Outputs
•Back-to-Back Registers for Storage
•Flow-Through Architecture Optimizes
PCB Layout
•Center-Pin VCC and GND Configurations
Minimize High-Speed Switching Noise
•
EPIC
t
(Enhanced-Performance Implanted
CMOS) 1-
m
m Process
•500-mA T ypical Latch-Up Immunity at 125°C
description
This 8-bit registered transceiver contains two sets
of D-type latches for temporary storage of data
flowing in either direction. Separate latch enable
(LEAB or LEBA) and output enable (GAB or GBA)
inputs are provided for each register to permit
independent control in either direction of data flow.
The A-to-B enable (CEAB) input must be low in order to enter data from A or to output data to B. Having CEAB
low and LEAB low makes the A-to-B latches transparent; a subsequent low-to-high transition of LEAB puts the
A latches in the storage mode. With CEAB and GAB both low, the 3-state B outputs are active and reflect the
data present at the output of the A latches. Data flow from B-to-A is similar, but requires the use of CEBA, LEBA,
and GBA inputs.
The 74ACT11543 is characterized for operation from – 40°C to 85°C.
FUNCTION TABLE
INPUTS LATCH
STATUS
OUTPUT BUFFERS
CEAB LEAB GAB
STATUS
A TO B†B1 THRU B8
H X X Storing Z
X H Storing
X H Z
L L L Transparent Current A Data
L H L Storing Previous
}
A Data
†A-to-B data flow is shown: B-to-A flow control is the same except uses
CEBA, LEBA, and GBA.
‡Data present before low-to-high transition of LEAB.
DW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CEBA
A1
A2
A3
A4
GND
GND
GND
GND
A5
A6
A7
A8
CEAB
GBA
LEBA
B1
B2
B3
B4
VCC
VCC
B5
B6
B7
B8
LEAB
GAB
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
EPIC is a trademark of Texas Instruments Incorporated.
74ACT11543
OCTAL REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS136 – D3608, JULY 1990 – REVISED APRIL 1993
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2–2
logic symbol†logic diagram (positive logic)
A1
LEAB
CEAB
GAB
LEBA
CEBA
GBA
2
16
14
15
27
1
28
B1
26
C1
1D
1D
C1
A8
A7
A6
A5
A4
A3
A2
A1
LEAB
CEAB
GAB
LEAB
CEBA
GBA
13
12
11
10
5
4
3
2
16
14
15
27
1
28
6D
3
2C6
G2
2EN4
1C5
G1
1EN
4
5D
B8
B7
B6
B5
B4
B3
B2
B1
17
18
19
20
23
24
25
26
To Seven Other Transceivers
†This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC)±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC)±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC)±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
recommended operating conditions
MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VIInput voltage 0 VCC V
VOOutput voltage 0 VCC V
IOH High-level output current –24 mA
IOL Low-level output current 24 mA
D
t/
D
vInput transition rise or fall rate 0 10 ns/V
TAOperating free-air temperature –40 85 °C
74ACT11543
OCTAL REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS136 – D3608, JULY 1990 – REVISED APRIL 1993
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–3
electrical characteristics over recommended operating free-air temperature range
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C
MIN
MAX
UNIT
PARAMETER
TEST
CONDITIONS
V
CC MIN TYP MAX
MIN
MAX
UNIT
IOH =50
m
A
4.5 V 4.4 4.4
I
OH = –
50
m
A
5.5 V 5.4 5.4
VOH
IOH =24mA
4.5 V 3.94 3.8 V
I
OH = –
24
mA
5.5 V 4.94 4.8
IOH = – 75 mA†5.5 V 3.85
IOL =50
m
A
4.5 V 0.1 0.1
I
OL =
50
m
A
5.5 V 0.1 0.1
VOL
IOL =24mA
4.5 V 0.36 0.44 V
I
OL =
24
mA
5.5 V 0.36 0.44
IOL = 75 mA†5.5 V 1.65
IIControl inputs VI = VCC or GND 5.5 V ±0.1 ±1
m
A
IOZ A or B ports‡VO = VCC or GND 5.5 V ±0.5 ±5
m
A
ICC VI = VCC or GND, IO = 0 5.5 V 8 80
m
A
D
ICC§One input at 3.4 V, Other inputs at GND or VCC 5.5 V 0.9 1 mA
CiControl inputs VI = VCC or GND 5 V 4.5 pF
Cio A or B ports VO = VCC or GND 5 V 12 pF
†Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡For I/O ports, the parameter IOZ includes the input leakage current.
§This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
UNIT
MIN MAX
MIN
MAX
UNIT
twPulse duration, LEAB or LEBA low 4 4 ns
t
Setu
p
time
Data after LEAB or LEBA↑2.5 2.5
ns
t
su
Set
u
p
time
Data before CEAB or CEBA↑3 3
ns
th
Hold time
Data after LEAB or LEBA↑2 2
ns
t
h
Hold
time
Data after CEAB or CEBA↑1.5 1.5
ns
74ACT11543
OCTAL REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS136 – D3608, JULY 1990 – REVISED APRIL 1993
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2–4
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO TA = 25°C
MIN
MAX
UNIT
PARAMETER
(INPUT) (OUTPUT) MIN TYP MAX
MIN
MAX
UNIT
tPLH
AorB
BorA
3.5 6.2 9.1 3.5 10.2
ns
tPHL
A
or
B
B
or
A
3.2 6.5 10.8 3.2 12.1
ns
tPLH
LEBA or LEAB
AorB
3 6.1 10.1 3 11.2
ns
tPHL
LEBA
or
LEAB
A
or
B
3.7 7.2 11.7 3.7 13.2
ns
tPZH
CEBA or CEAB
AorB
3.5 6.7 11.1 3.5 12.2
ns
tPZL
CEBA
or
CEAB
A
or
B
3.2 8.4 13.4 3.2 16
ns
tPHZ
CEBA or CEAB
AorB
4.8 7.3 10.1 4.8 11
ns
tPLZ
CEBA
or
CEAB
A
or
B
5.1 7.5 10.3 5.1 11.1
ns
tPZH
GBA or GAB
AorB
3.3 6.4 10.5 3.3 11.5
ns
tPZL
GBA
or
GAB
A
or
B
3 8 12.8 3 15.3
ns
tPHZ
GBA or GAB
AorB
4.6 6.9 9.6 4.6 10.4
ns
tPLZ
GBA
or
GAB
A
or
B
5 7.1 9.8 5 10.5
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
CdPower dissi
p
ation ca
p
acitance
p
er transceiver
Outputs enabled
CL=50
p
F f=1MHz
47 p
F
C
pd
Po
w
er
dissipation
capacitance
per
transcei
v
er
Outputs disabled
C
L =
50
pF
,
f
=
1
MH
z13
pF
74ACT11543
OCTAL REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS136 – D3608, JULY 1990 – REVISED APRIL 1993
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–5
PARAMETER MEASUREMENT INFORMATION
50% VCC
1.5 V
1.5 V
1.5 V
3 V
3 V
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V 3 V
0 V
50% VCC
50% VCC
Input
(see Note B)
Out-of-Phase
Output
In-Phase
Output
Timing Input
(see Note B)
50% VCC
VOLTAGE WAVEFORMS
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
2 × VCC
500 Ω
500 Ω
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note C)
Output
W aveform 2
S1 at GND
(see Note C)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V
1.5 V
[
VCC
0 V
50% VCC 20% VCC
50% VCC 80% VCC
[
0 V
3 V
GND
Open
VOLTAGE WAVEFORMS
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
3 V
0 V
1.5 V 1.5 V
tw
VOLTAGE WAVEFORMS
Input
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
74ACT11543
OCTAL REGISTERED TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS136 – D3608, JULY 1990 – REVISED APRIL 1993
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2–6
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74ACT11543DWR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11543DWRE4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11543DWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74ACT11543NT OBSOLETE PDIP NT 28 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
74ACT11543DWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74ACT11543DWR SOIC DW 28 1000 346.0 346.0 49.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 20-Aug-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74ACT11543NT OBSOLETE PDIP NT 28 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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