www.ti.com
FEATURES
V+PA3B
DETB
DETN
RFANTB
V+LNABA
RFANTA
GND
GND
BYPOUT
BYPIN
MXB
ABSEL
V+LOB
RSVD1
LOP
LON
IFP
IFN
MXA
V+LOA
TXGADJB
LOADJB
TR
RXDGC
RFB
RSVD2
V+PA1B
PABCB
BCIN
V+PA2B
V+IF
V+IFP
V+IFN
RFA
V+PA1A
V+GEN
V+PA2A
PABCA
V+PA3A
BCOUT
1
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
383940 37 36 35 34 33 32 31
131211 14 15 16 17 18 19 20
TRF2436
SLWS176C APRIL 2005 REVISED MAY 2007
High-Power Dual-Band (2.4-GHz to 2.5-GHz and 4.9-GHz to 5.9-GHz) RF Front-End
Integrated Temperature Compensated TXPower DetectorsHighly Integrated 802.16 d/e Radio FrequencyFront End ASIC PA Bias Control FunctionFully Integrated Up/Down Converters, LNAs, Antenna Port OP
1dB
= +23 dBm TypicalPAs and T/R Switches
Antenna Port OIP3 = +33 dBm, TypicalSuper Heterodyne Architecture for Superior
Frequency Range: 2.4 to 2.5 andAdjacent Channel Rejection Performance
4.9 to 5.9 GHzDifferential LO and IF Interface for Enhanced
Noise Figure: 4 dB ISM Band, 6 dB 5 GHzSpurious/EMI Performance
Bands TypicalCommon Frequency Plan uses a Single LO
Typical Gain: 38 dB TX, 20 dB RXand Common IF for Single IF Filter for Both
IF = 374 MHzBands
TRF2436 PACKAGE
(TOP VIEW)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
DESCRIPTION
BPF
BPF
T/R
T/R
T/R
T/R
A/B
A/B
ABSEL
TR
RXGC
RFANTA
RFANTB
IF
LO
DET
V+
2
PA
PA
T/R
PA
V+
V+
MXA
MXBRFB
RFA
2
2
PABCA
PABCB
DEVICE INFORMATION
TRF2436
SLWS176C APRIL 2005 REVISED MAY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.
The TRF2436 is a fully integrated Dual Band Tri Mode Radio Frequency Front End (RFFE) designed specificallyfor use in 802.16 d/e applications. The TRF2436 is designed to perform RF up and down conversions in theunlicensed ISM and 4.9-5.9 GHz bands. The TRF2436 uses a common IF frequency for both bands, eliminatingthe need for additional IF filtering. Combined with the TI TRF2432 IF/IQ Transceiver/Synthesizer, the TRF2436completes the TI WLAN two-chip radio.
The TRF2436 incorporates all of the RF blocks for both the “b” and “a” bands except for low cost ceramic filters.The ASIC includes LNAs, PAs, mixers, bias circuitry, RX gain control, transmit coupler detectors, and T/Rswitches. High integration and internal RF matching enhances performance and greatly reduce external partcount. The only external components needed (other than simple passives) for operation are RF filters andexternal low power DC switching FETs.
Functional Block Diagram
TERMINAL FUNCTIONS
TERMINAL
I/O TYPE DESCRIPTIONNAME NO.
MXB 1 I/O RF SE B band RF Input/Output to mixer. 50- single ended. Do not apply DC.ABSEL 2 I Digital Band select pin. HIGH = A-band. LOW = B-band.V+LOB 3 I Power B band LO amplifier bias +3.3VRSVD1 4 - - Not connected for normal operation. Leave Open.LOP 5 I RF Dif. LO input (differential) Positive, AC coupled
2
Submit Documentation Feedback
www.ti.com
TRF2436
SLWS176C APRIL 2005 REVISED MAY 2007
DEVICE INFORMATION (continued)TERMINAL FUNCTIONS (continued)
TERMINAL
I/O TYPE DESCRIPTIONNAME NO.
LON 6 I RF Dif. LO input (differential) Negative, AC coupledIFP 7 I/O RF Dif. IF input/output (differential) Positive, DC coupled, typical DC Voltage is 2.6VIFN 8 I/O RF Dif. IF input/output(differential) Negative, DC coupled, typical DC Voltage is 2.6VMXA 9 I/O RF SE A band RF Input/Output to mixer. 50- single ended. Do not apply DC.V+LOA 10 I Power A band LO amplifier bias +3.3VV+IF 11 I Power IF amplifier bias +3.3V.V+IFP 12 I Power IFP amplifier bias +3.3V.V+IFN 13 I Power IFN amplifier bias +3.3V.RFA 14 I/O RF SE A Band RF Input/Output to PA/LNA. 50- single ended. AC coupled.V+PA1A 15 I Power A band Power amplifier bias +3.3V.V+GEN 16 I Power DC Bias Control Bias +3.3V.V+PA2A 17 I Power A band Power amplifier bias +3.3V.PABCA 18 - - A band PA Bias Control InputV+PA3A 19 - - A band Power amplifier bias +3.3V.BCOUT 20 O Analog Bias Control Output.BYPIN 21 I Analog DC Bias Bypass InputBYPOUT 22 O Analog DC Bias Bypass OutputGND 23, 24 - - Connect to groundRFANTA 25 I/O RF SE A band RF in/out to antennas. AC coupled.V+LNABA 26 I Power A and B Band LNA bias +3.3V.RFANTB 27 I/O RF SE B band RF in/out to antennas. AC coupled.DETN 28 O Analog Negative RF power detector outputDETP 29 O Analog Positive RF power detector output.V+PA3B 30 I Power B band Power amplifier bias +3.3V.V+PA2B 31 I Power B band Power amplifier bias +3.3V.BCIN 32 I Analog Bias control inputPABCB 33 - - B band PA Bias Control InputV+PA1B 34 I Power B band Power amplifier bias +3.3V.RSVD2 35 - - Not Connected for normal operation. Leave Open.RFB 36 I/O RF SE B band RF Input/Output to PA/LNA. 50- single ended. AC coupled.RXDGC 37 I Digital Rx Gain Control. HIGH = minimum gain. LOW = maximum gainTR 38 I Digital Transmit/Receive mode control. HIGH = transmit. LOW = receive.LOADJB 39 - - Not connected for normal operation. Leave Open. B band LO amp bias adjust.TXGADJB 40 - - Not connected for normal operation. Leave open. PAB Amplifier bias adjust.
3Submit Documentation Feedback
www.ti.com
ABSOLUTE MAXIMUM RATINGS
DC CHARACTERISTICS
RECEIVER CHARACTERISTICS
TRF2436
SLWS176C APRIL 2005 REVISED MAY 2007
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
CC
DC supply voltage 0 to 6.9 VI
CC
DC supply current 600 mARF input power Any port and any mode 10 dBmV
ID
Digital input voltage -0.3 to 5 VT
JC
Junction temperature 175 °Cθ
JC
Thermal resistance junction-to-case 35 °C/WT
A
Operating temperature -20 to 85 °CT
stg
Storage temperature -40 to 105 °CLead temperature 40 sec maximum 220 °C
TYP ratings are at 25 °C and V
CC
= 3.3 V, MIN and MAX ratings are over operating free-air temperature and voltage ranges(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
CC
Supply voltage Specification compliant 2.7 3.3 4.2 VB Band, RX Mode 65 105 mAA Band, RX Mode 80 120 mAI
CC
Total supply current
B Band, TX Mode, Max PABC input 410 520 mAA Band, TX Mode, Max PABC input 450 550 mAV
IH
High-level input voltage 1.7 VV
IL
Low-level input voltage 0.5 VI
IH
High-level input current 100 300 µAI
IL
Low-level input current -50 µA
TR = Low, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25 °C and V
CC
= 3.3 V (unless otherwisenoted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
B band 2400 2500f
IRF
RF input frequency MHzA band 4900 5900B band 2774 2874f
LO
LO input frequency MHzA band 2637 3137f
IF
IF input frequency 374 MHzB Band High Gain Mode
17 19RXGC=LOWG Gain dBA Band High Gain Mode
18 23RXGC=LOW
B Band Low Gain Mode
25RXGC=HIGHG Gain step size dBA Band Low Gain Mode
15RXGC=HIGH
B Band. Max Gain 4 5Noise figure dBA Band. Max Gain 6 7.5
4
Submit Documentation Feedback
www.ti.com
TRANSMITTER CHARACTERISTICS
TRF2436
SLWS176C APRIL 2005 REVISED MAY 2007
RECEIVER CHARACTERISTICS (continued)TR = Low, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25 °C and V
CC
= 3.3 V (unless otherwisenoted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
B Band High Gain Mode
-16 -13RXGC=LOW
B Band Low Gain ModeRXGC=HIGHInput P
-1dB
dBmA Band High Gain Mode
-22 -18RXGC=LOW
A Band Low Gain Mode
-16 -13RXGC=HIGH
B Band High Gain Mode
-6 -2RXGC=LOW
B Band Low Gain Mode
4 8RXGC=HIGHInput 3rd order intercept point dBmA Band High Gain Mode
-12 -8RXGC=LOW
A Band Low Gain Mode
-6 -3RXGC=HIGH
Z = 50 Both Bands, Both GainRF input return loss 8 dBmodes
Z = 50 Both Bands, Both GainLNA out return loss RF 9 dBmodesMixer input MX return loss Z = 50 Both Bands 10 dBOutput return loss Measured into 200 differential 10 dBB band -30LO at MX leakage dBmA Band (5274-6274 MHz) -30LO at IF leakage Both bands -40 dBmB band 1Gain flatness full band dBA band 2Gain flatness / 22 MHz Both bands dBFull range to within 0.5 dB final. AllGain settling time 0.3 µsbands
In Band: B Band High Gain Mode
30RXGC=LOW
In Band: B Band Low Gain Mode
5RXGC=HIGHRF to RFANT isolation dBIn Band: A Band High Gain Mode
25RXGC=LOW
In Band: A Band Low Gain Mode
35RXGC=HIGH
TR = High, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25 °C and V
CC
= 3.3 V (unless otherwisenoted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f
IF
IF input frequency 374 MHzB band 2400 2500 MHzf
ORF
RF output frequency
A band 4900 5900 MHzB band 2774 2874 MHzf
LO
LO input frequency
A band 2637 3137 MHzB Band 37 40 dBG Gain
A Band 40 43 dB
5Submit Documentation Feedback
www.ti.com
COMMON ELECTRICAL CHARACTERISTICS
TRF2436
SLWS176C APRIL 2005 REVISED MAY 2007
TRANSMITTER CHARACTERISTICS (continued)TR = High, 2 dB base band filter loss in RX band, MIN, TYP, and MAX rating are at 25 °C and V
CC
= 3.3 V (unless otherwisenoted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
B band. max PABC input 22 23.5 dBmA band. max PABC input 20.5 22.5 dBmOutput 1 dB gain compression
5150 5350 MHz Max PABC input,V+PA = 2.9 V min, 20.5 22.5 dBmOther V
CC
= 2.7 V minB band 32 35 dBmOutput 3rd order intercept
A band 30 32.5 dBmNoise figure Both bands 8 dBIF input return loss Measured into 200 differential 8 dBMixer output return loss MX Z = 50 both bands 10 dBRF input return loss RF Z = 50 both bands 8 dBRFANT return loss Z = 50 both bands 6 dBB band -35 dBml
lkg
LO leakage at MX
A band (5274-6274 MHz) -35 dBmB band 1 dBGain flatness full band
A band 2 dBGain flatness / 22 MHz Both bands dBPA harmonics Both bands CW at P1 dB -20 dBcB band 50 dBRFANT to RF isolation
A band 50 dBPA Off Isolation RF to RFANT In band: both bands 50 dBPA Turn On Time To within 0.5 dB max power 0.2 µsPA Turn Off Time To within -20 dB max power 0.2 µsFrom max power after turn-on time,PA droop 0.5 dBMaximum on duration is 200 msPA Bias Control Input Range Max Current corresponds to max PA
mA(PABC) bias state
MIN, TYP, and MAX ratings are at 25 °C and V
CC
= 3.3 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Gain within 0.5dB. Not Including PATR_SEL switch time 0.3 1 µsramp timeAB_SEL switch time 1 µsLO input power Reference to 100 differential -1 5 dBmMeasured to 100 differential atLO input return loss 625 °CIF port impedance Differential 200 LO port impedance 100
6
Submit Documentation Feedback
www.ti.com
TYPICAL CHARACTERISTICS
A Band Detector Output
0.1
1
10
100
1000
0 5 10 15 20 25
Pout(dBm)
VDETP−VDETN (mV)
25C
−25C
85C
B Band Detector Output
0.1
1
10
100
1000
−10−5 0 5 10152025
Pout(dBm)
VDETP−VDETN (mV)
25C
−25C
85C
TRF2436
SLWS176C APRIL 2005 REVISED MAY 2007
Figure 1. A Band Detector Output
Figure 2. B Band Detector Output
7Submit Documentation Feedback
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TRF2436IRTBR ACTIVE VQFN RTB 40 2500 Green (RoHS &
no Sb/Br) CU SN Level-3-260C-168 HR
TRF2436IRTBRG4 ACTIVE VQFN RTB 40 2500 Green (RoHS &
no Sb/Br) CU SN Level-3-260C-168 HR
TRF2436IRTBT ACTIVE VQFN RTB 40 250 Green (RoHS &
no Sb/Br) CU SN Level-3-260C-168 HR
TRF2436IRTBTG4 ACTIVE VQFN RTB 40 250 Green (RoHS &
no Sb/Br) CU SN Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TRF2436IRTBR VQFN RTB 40 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
TRF2436IRTBT VQFN RTB 40 250 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Feb-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TRF2436IRTBR VQFN RTB 40 2500 336.6 336.6 28.6
TRF2436IRTBT VQFN RTB 40 250 336.6 336.6 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Feb-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP®Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2012, Texas Instruments Incorporated