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1
clk5600_02.1
February 2005 Data Sheet
© 2004 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
ispClock 5600 Family
In-System Programmable, Zero-Delay Clock Generator
with Universal Fan-Out Buffer
Features
10MHz to 320MHz Input/Output Operation
Low Output to Output Skew (<50ps)
Low Jitter Peak-to-Peak (<60ps)
Up to 20 Programmable Fan-out Buffers
Programmable output standards and individual
enable controls
- LVTTL, LVCMOS, HSTL, SSTL, LVDS,
LVPECL
Programmable output impedance
- 40 to 70
in 5
increments
Programmable slew rate
Up to 10 banks with individual V
CCO
and GND
- 1.5V, 1.8V, 2.5V, 3.3V
Fully Integrated High-Performance PLL
Programmable lock detect
Multiply and divide ratio controlled by
- Input divider (5 bits)
- Feedback divider (5 bits)
- Five output dividers (5 bits)
Programmable On-chip Loop Filter
Precision Programmable Phase Adjustment
(Skew) Per Output
16 settings; minimum step size 195ps
- Locked to VCO frequency
Up to +/- 12ns skew range
Coarse and fine adjustment modes
Up to Five Clock Frequency Domains
Flexible Clock Reference and External
Feedback Inputs
Programmable input standards
- LVTTL, LVCMOS, SSTL, HSTL, LVDS,
LVPECL
Clock A/B selection multiplexer
Feedback A/B selection multiplexer
Programmable termination
Four User-programmable Profiles Stored in
E
2
CMOS
®
Memory
Supports both test and multiple operating
configurations
Full JTAG Boundary Scan Test In-System
Programming Support
Exceptional Power Supply Noise Immunity
Commercial (0 to 70°C) and Industrial
(-40 to 85°C) Temperature Ranges
100-pin and 48-pin TQFP Packages
Applications
Circuit board common clock generation and
distribution
PLL-based frequency generation
High fan-out clock buffer
Zero-delay clock buffer
Product Family Block Diagram
VCO
OUTPUT
DRIVERS
SKEW
CONTROL
CLOCK OUTPUTS
REFERENCE
INPUTS
JTAG
INTERFACE
&
E2CMOS
MEMORY
LOCK DETECT
FILTER
PHASE/
FREQUENCY
DETECTOR
1023
Multiple Profile
Management Logic
INTERNAL FEEDBACK PATH
PLL CORE
OUTPUT
ROUTING
MATRIX
V0
V1
V2
V3
V4
OUTPUT
DIVIDERS
*
*
* Input Available only on ispClock5620
BYPASS
MUX
FEEDBACK
INPUTS
Internal/External
Feedback
Select
M
N
Lattice Semiconductor ispClock5600 Family Data Sheet
2
General Description and Overview
The ispClock5610 and ispClock5620 are in-system-programmable high-fanout PLL-based clock drivers designed
for use in high performance communications and computing applications. The ispClock5610 provides up to 10 sin-
gle-ended or five differential clock outputs, while the ispClock5620 provides up to 20 single-ended or 10 differential
clock outputs. Each pair of outputs may be independently configured to support separate I/O standards (LVDS,
LVPECL, LVTTL, LVCMOS, SSTL, HSTL) and output frequency. In addition, each output provides independent pro-
grammable control of termination, slew-rate, and timing skew. All configuration information is stored on-chip in non-
volatile E
2
CMOS memory.
The ispClock5600’s PLL and divider systems supports the synthesis of clock frequencies differing from that of the
reference input through the provision of programmable input and feedback dividers. A set of five post-PLL V-divid-
ers provides additional flexibility by supporting the generation of five separate output frequencies. Loop feedback
may be taken internally from the output of any of the five V-dividers, or externally through FBKA+/- or FBKB+/- pins.
The core functions of all members of the ispClock5600 family are identical, the differences between devices being
restricted to the number of inputs and outputs, as shown in the following table. Figures 1 and 2 show functional
block diagrams of the ispClock5610 and ispClock5620.
Table 1. ispClock5600 Family Members
Figure 1. ispClock5610 Functional Block Diagram
Device Ref. Input Pairs Feedback Input Pairs Clock Outputs
ispClock5610 1 1 10
ispClock5620 2 2 20
VCO
LOOP
FILTER
PHASE
DETECT
LOCK
DETECT
M
N
INPUT
DIVIDER
FEEDBACK
SKEW ADJUST
1
0
FEEDBACK
DIVIDER
GOE OEXLOCK PLL_BYPASS
JTAG INTERFACE
OEY
TDI TMS TCK TDO
SGATE
SKEW
CONTROL
OUTPUT
DRIVERS
BANK_5A
BANK_5B
BANK_7A
BANK_7B
OUTPUT
DIVIDERS
OUTPUT ROUTING
MATRIX
RESET
V1
V2
V0
V3
V4
BANK_0A
BANK_0B
BANK_2A
BANK_2B
BANK_4A
BANK_4B
PS0 PS1
Profile Select
Control
0123
OUTPUT ENABLE CONTROLS
(1-32)
(1-32)
(2-64)
(2-64)
(2-64)
(2-64)
(2-64)
REFA+
REFA-
REFVTT
FBKA+
FBKA -
FBKVTT
E2 Configuration
Lattice Semiconductor ispClock5600 Family Data Sheet
3
Figure 2. ispClock5620 Functional Block Diagram
0
1
VCO
LOOP
FILTER
PHASE
DETECT
LOCK
DETECT
M
N
INPUT
DIVIDER
REFA+
REFA-
REFB+
REFB-
REFSEL
REFVTT
FEEDBACK
SKEW ADJUST
1
0
FEEDBACK
DIVIDER
GOE OEXLOCK PLL_BYPASS
JTAG INTERFACE
OEY
TDI TMS TCK TDO
SGATE
SKEW
CONTROL
OUTPUT
DRIVERS
SKEW
CONTROL
OUTPUT
DRIVERS
BANK_5A
BANK_5B
BANK_6A
BANK_6B
BANK_7A
BANK_7B
BANK_8A
BANK_8B
BANK_9A
BANK_9B
OUTPUT
DIVIDERS
OUTPUT ROUTING
MATRIX
RESET
V1
V2
V0
V3
V4
BANK_0A
BANK_0B
BANK_1A
BANK_1B
BANK_2A
BANK_2B
BANK_3A
BANK_3B
BANK_4A
BANK_4B
PS0 PS1
Profile Select
Control
0123
OUTPUT ENABLE CONTROLS
(1-32)
(1-32)
(2-64)
(2-64)
(2-64)
(2-64)
(2-64)
0
1
FBKA+
FBKA-
FBKB+
FBKB-
FBKSEL
FBKVTT
E2 Configuration
Lattice Semiconductor ispClock5600 Family Data Sheet
4
Absolute Maximum Ratings
ispClock5600V
Core Supply Voltage V
CCD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 5.5V
PLL Supply Voltage V
CCA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 5.5V
JTAG Supply Voltage V
CCJ
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 5.5V
Output Driver Supply Voltage V
CCO
. . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.5V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.5V
Output Voltage
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.5V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Junction Temperature with power supplied . . . . . . . . . . . . . . . . . . . -40 to 130°C
1. When applied to an output when in high-Z condition
Recommended Operating Conditions
Recommended Operating Conditions – V
CCO
vs. Logic Standard
Symbol Parameter Conditions
ispClock5600V
UnitsMin. Max.
V
CCD
Core Supply Voltage 3.0 3.6 V
V
CCJ
JTAG I/O Supply Voltage 1.62 3.6 V
V
CCA
Analog Supply Voltage 3.0 3.6 V
V
CCXSLEW
V
CC
Turn-on Ramp Rate All supply pins 0.33 V/µs
T
JOP
Operating Junction Temperature Commercial 0 100 °C
Industrial -40 115
T
A
Ambient Operating Temperature Commercial 0 70
1
°C
Industrial -40 85
1
1. Device power dissipation may also limit maximum ambient operating temperature.
V
CCO
(V) V
REF
(V) V
TT
(V)
Logic Standard Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
LVTTL 3.0 3.3 3.6
LVCMOS 1.8V 1.71 1.8 1.89
LVCMOS 2.5V 2.375 2.5 2.625
LVCMOS 3.3V 3.0 3.3 3.6
SSTL2 Class 1 2.375 2.5 2.625 1.15 1.25 1.35 V
REF
- 0.04 V
REF
+ 0.04
SSTL3 Class 1 3.0 3.3 3.6 1.30 1.50 1.70 V
REF
- 0.05 V
REF
V
REF
+ 0.05
HSTL Class 1 1.425 1.5 1.575 0.68 0.75 0.90 0.5 x V
CCO
LVPECL (Differential) 3.0V 3.3V 3.6V
LVDS V
CCO
= 2.5V 2.375 2.5V 2.625
V
CCO
= 3.3V 3.0 3.3 3.6
Note: ‘—’ denotes V
REF
or V
TT
not applicable to this logic standard
Lattice Semiconductor ispClock5600 Family Data Sheet
5
E
2
CMOS Memory Write/Erase Characteristics
Performance Characteristics – Power Supply
DC Electrical Characteristics – Single-ended Logic
DC Electrical Characteristics – LVDS
Parameter Conditions Min. Typ. Max. Units
Erase/Reprogram Cycles 1000
Symbol Parameter Conditions Typ. Max. Units
I
CCD
Core Supply Current ispClock5610 f
VCO
= 640MHz 110 120 mA
ispClock5620 f
VCO
= 640MHz 150 160 mA
I
CCA
Analog Supply Current f
VCO
= 640MHz 5.5 7 mA
I
CCO
Output Driver Supply Current
(per Bank)
V
CCO
= 1.8V
1
, LVCMOS
V
CCO
= 2.5V
1
, LVCMOS
V
CCO
= 3.3V
1
, LVCMOS
V
CCO
= 3.3V
2
, LVDS
13
18
24
7.5
15
24
35
8
mA
I
CCJ
JTAG I/O Supply Current (static)
V
CCJ
= 1.8V
V
CCJ
= 2.5V
V
CCJ
= 3.3V
200
300
300
300
400
400
µA
1. Supply current consumed by each bank, both outputs active, 18pF load, 320MHz output frequency.
2. Supply current consumed by each bank, 100
, 5pf differential load, 320MHz output frequency.
Logic Standard
V
IL
(V) V
IH
(V)
V
OL
Max. (V) V
OH
Min. (V) I
OL
(mA) I
OH
(mA)Min. Max. Min. Max.
LVTTL/LVCMOS 3.3V -0.3 0.8 2 3.6 0.4 V
CCO
- 0.4 4
1
-4
1
LVCMOS 1.8V -0.3 0.68 1.07 3.6 0.4 V
CCO
- 0.4 4
1
-4
1
LVCMOS 2.5V -0.3 0.7 1.7 3.6 0.4 V
CCO
- 0.4 4
1
-4
1
SSTL2 Class 1 -0.3 V
REF
- 0.18 V
REF
+ 0.18 3.6 0.54
2
V
CCO
- 0.81
2
7.6 -7.6
SSTL3 Class 1 -0.3 V
REF
- 0.2 V
REF
+ 0.2 3.6 0.9
2
V
CCO
- 1.3
2
8-8
HSTL Class 1 -0.3 VREF - 0.1 VREF + 0.1 3.6 0.43VCCO - 0.438-8
1. Specified for 50 internal series output termination.
2. Specified for 40 internal series output termination.
3. Specified for 20 internal series output termination.
Symbol Parameter Conditions Min. Typ. Max. Units
VICM Common Mode Input Voltage VTHD 100mV VTHD/2 2.0 V
VTHD 150mV VTHD/2 2.325 V
VTHD Differential Input Threshold ±100 mV
VIN Input Voltage 0 2.4 V
VOH Output High Voltage RT = 100 1.375 1.60 V
VOL Output Low Voltage RT = 1000.9 1.03 V
VOD Output Voltage Differential RT = 100250 400 480 mV
VOD Change in VOD between H and L 50 mV
VOS Output Voltage Offset Common Mode Output Voltage 1.125 1.20 1.375 V
VOS Change in VOS Between H and L 50 mV
ISA Output Short Circuit Current VOD = 0V, Outputs Shorted to GND 24 mA
ISAB Output Short Circuit Current VOD = 0V, Outputs Shorted to Each Other 12 mA
Lattice Semiconductor ispClock5600 Family Data Sheet
6
DC Electrical Characteristics – Differential LVPECL
DC Electrical Characteristics – Input/Output Loading
Symbol Parameter Test Conditions Min. Typ. Max. Units
VIH Input Voltage High VCCD = 3.0 to 3.6V VCCD - 1.17 VCCD - 0.88 V
VCCD = 3.3V 2.14 2.42
VIL Input Voltage Low VCCD = 3.0 to 3.6V VCCD - 1.81 VCCD - 1.48 V
VCCD = 3.3V 1.49 1.83
VOH Output High Voltage1VCCO = 3.0 to 3.6V VCCO - 1.07 VCCO - 0.88 V
VCCO = 3.3V 2.23 2.42
VOL Output Low Voltage1VCCO = 3.0 to 3.6V VCCO - 1.81 VCCO - 1.62 V
VCCO = 3.3V 1.49 1.68
1. 100 differential termination.
Symbol Parameter Conditions Min. Typ. Max. Units
ILK Input Leakage Note 1 ±10 µA
IPU Input Pull-up Current Note 2 80 120 µA
IPD Input Pull-down Current Note 3 120 150 µA
IOLK Tristate Leakage Output Note 4 ±10 µA
CIN Input Capacitance Notes 2, 3, 5 8 10 pF
Note 6 13.5 15 pF
1. Applies to clock reference inputs when termination ‘open’.
2. Applies to TDI, TMS inputs.
3. Applies to REFSEL, PS0, PS1, GOE, SGATE and PLL_BYPASS.
4. Applies to all logic types when in tristated mode.
5. Applies to OEX, OEY, TCK, RESET inputs.
6. Applies to REFA+, REFA-, REFB+, REFB-, FBKA+, FBKA-, FBKB+, FBKB-.
Lattice Semiconductor ispClock5600 Family Data Sheet
7
Switching Characteristics – Timing Adders for I/O Modes
Output Rise and Fall Times – Typical Values1, 2
Adder Type Description Min. Typ. Max. Units
tIOI Input Adders2
LVTTL_in Using LVTTL Standard 0 0 0 ns
LVCMOS18_in Using LVCMOS 1.8V Standard 0.20 0.45 0.70 ns
LVCMOS25_in Using LVCMOS 2.5V Standard 0 0 0 ns
LVCMOS33_in Using LVCMOS 3.3V Standard 0 0 0 ns
SSTL2_in Using SSTL2 Standard 1.15 1.35 1.60 ns
SSTL3_in Using SSTL3 Standard 1.15 1.35 1.60 ns
HSTL_in Using HSTL Standard 1.15 1.35 1.60 ns
LVDS_in Using LVDS Standard 1.15 1.35 1.60 ns
LVPECL_in Using LVPECL Standard 1.15 1.35 1.60 ns
tIOO Output Adders1, 3
LVTTL_out Output Configured as LVTTL Buffer -0.10 0.15 0.45 ns
LVCMOS18_out Output Configured as LVCMOS 1.8V Buffer -0.15 0.15 0.55 ns
LVCMOS25_out Output Configured as LVCMOS 2.5V Buffer -0.10 0.15 0.45 ns
LVCMOS33_out Output Configured as LVCMOS 3.3V Buffer -0.10 0.15 0.45 ns
SSTL2_out Output Configured as SSTL2 Buffer -0.10 0.15 0.45 ns
SSTL3_out Output Configured as SSTL3 Buffer -0.10 0.15 0.45 ns
HSTL_out Output Configured as HSTL Buffer 0 0.15 0.45 ns
LVDS_out Output Configured as LVDS Buffer 0 0 0 ns
LVPECL_out Output Configured as LVPECL Buffer 0 0 0 ns
tIOS Output Slew Rate Adders1
Slew_1 Output Slew_1 (Fastest) 0 ps
Slew_2 Output Slew_2 330 ps
Slew_3 Output Slew_3 660 ps
Slew_4 Output Slew_4 (Slowest) 1320 ps
1. Measured under standard output load conditions – see Figures 3-5.
2. All input adders referenced to LVTTL.
3. All output adders referenced to LVPECL.
Output Type
Slew 1 (Fastest) Slew 2 Slew 3 Slew 4 (Slowest)
UnitstRtFtRtFtRtFtRtF
LVTTL 0.65 0.45 0.85 0.60 1.20 0.90 1.75 1.30 ns
LVCMOS 1.8V 0.90 0.40 1.05 0.50 1.40 0.80 2.00 1.20 ns
LVCMOS 2.5V 0.70 0.40 0.90 0.55 1.20 0.85 1.80 1.20 ns
LVCMOS 3.3V 0.65 0.45 0.85 0.60 1.20 0.90 1.75 1.30 ns
SSTL2 0.65 0.40 0.90 0.60 1.35 0.85 2.30 1.40 ns
SSTL3 0.65 0.40 0.90 0.60 1.35 0.85 2.30 1.40 ns
HSTL 0.85 0.30 1.00 0.50 1.50 0.70 2.55 1.10 ns
LVDS30.25 0.20 ——————ns
LVPECL30.20 0.20 ——————ns
1. See Figures 3-5 for test conditions.
2. Measured between 20% and 80% points.
3. Only the ‘fastest’ slew rate is available in LVDS and LVPECL modes.
Lattice Semiconductor ispClock5600 Family Data Sheet
8
Output Test Loads
Figures 3-5 show the equivalent termination loads used to measure rise/fall times, output timing adders and other
selected parameters as noted in the various tables of this data sheet.
Figure 3. CMOS Termination Load
Figure 4. HSTL/SSTL Termination Load
Figure 5. LVDS/LVPECL Termination Load
ispCLOCK
SCOPE
950
50/3" 50/36"
505pF
Zo = 50
ispCLOCK
SCOPE
50/3" 50/36" 950
505pF
Zo = HSTL: ~20
SSTL: 40
VTERM
50
ispCLOCK
50/36"
34
3450/36"
0.1U
0.1U
44.2
3pF
(parasitic)
3pF
(parasitic) SCOPE
50
50
5pF
5pF
ChA
ChB
50/3" 50/1"
50/3" 50/1"
Interface Circuit
33.2
33.2
Lattice Semiconductor ispClock5600 Family Data Sheet
9
Programmable Input and Output Termination Characteristics
Symbol Parameter Conditions VCCO Voltage Min. Typ. Max. Units
RIN Input Resistance
Rin=40 setting 36 44
Rin=45 setting 40.5 49.5
Rin=50 setting 45 55
Rin=55 setting 49.5 60.5
Rin=60 setting 54 66
Rin=65 setting 59 71.5
Rin=70 setting 61 77
ROUT Output Resistance1
Rout20 setting
VCCO=3.3V 14
VCCO=2.5V 14
VCCO=1.8V 14
VCCO=1.5V 14
Rout40 setting
VCCO=3.3V -9% 38 9%
VCCO=2.5V -11% 40 11%
VCCO=1.8V -13% 40 13%
Rout45 setting
VCCO=3.3V -10% 45 10%
VCCO=2.5V -12% 45 12%
VCCO=1.8V -14% 44 14%
Rout50 setting
VCCO=3.3V -8% 50 8%
VCCO=2.5V -9% 49 9%
VCCO=1.8V -13% 49 13%
Rout55 setting
VCCO=3.3V -9% 55 9%
VCCO=2.5V -11% 55 11%
VCCO=1.8V -13% 55 13%
Rout60 setting
VCCO=3.3V -8% 59 8%
VCCO=2.5V -9% 59 9%
VCCO=1.8V -14% 59 14%
Rout65 setting
VCCO=3.3V -8% 65 8%
VCCO=2.5V -9% 64 9%
VCCO=1.8V -13% 64 13%
Rout70 setting
VCCO=3.3V -9% 72 9%
VCCO=2.5V -10% 70 10%
VCCO=1.8V -12% 69 12%
1. Guaranteed by characterization.
Lattice Semiconductor ispClock5600 Family Data Sheet
10
Performance Characteristics – PLL
Symbol Parameter Conditions Min. Typ. Max. Units
fREF, fFBK Reference and feedback input
frequency range 10 320 MHz
tCLOCKHI,
tCLOCKLO
Reference and feedback input
clock HIGH and LOW times 1.25 ns
tRINP,
tFINP
Reference and feedback input
rise and fall times
Measured between 20% and 80%
levels —— 5 ns
MDIV M-divider range 1 32
NDIV N-Divider range 1 32
fPFD Phase detector input frequency
range210 320 MHz
fVCO VCO operating frequency 320 640 MHz
VDIV Output Divider range Even integer values only 2 64
fOUT Output frequency range1
Fine Skew Mode,
fVCO = 640MHz 10 320 MHz
Coarse Skew Mode,
fVCO = 640MHz 5 160 MHz
tJIT (cc) Output adjacent-cycle jitter
(1000 cycle sample)
Loop filter from Table 23 45 60 ps (p-p)
Loop filter from Table 38 45 70 ps (p-p)
tJIT (per) Output period jitter
(10000 cycle sample)
Loop filter from Table 23 8 10 ps (RMS)
Loop filter from Table 38 9 12 ps (RMS)
tJIT(φ)Reference clock to output jitter
(6000 cycle sample)
Loop filter from Table 23 NA NA ps (RMS)
Loop filter from Table 38 38 50 ps (RMS)
tφStatic phase offset PFD input frequency 100MHz7-375 -75 225 ps
PFD input frequency <100MHz7-37.5 22.5 mUI6
tDELAY Reference clock to output delay Internal feedback mode70.3 0.45 0.6 ns
DCERR Output duty cycle error (see
Table 4 for nominal values)4
Output type LVDS, VCCO = 3.3V5 260 ps
Output type LVCMOS 3.3V5
fOUT >100 MHz 300 ps
tPDBYPASS Reference clock to output
propagation delay M=1, V=2 6 ns
tLPLL Lock time From Power-up event 150 500 µs
From Reset event 15 50 µs
PSR Power supply rejection, period
jitter vs. power supply noise
fIN = fOUT = 100MHz
VCCA = VCCD = VCCO modulated
with 100kHz sinusoidal stimulus
0.05
1. In PLL Bypass mode (PLL_BYPASS = HIGH), output will support frequencies down to 0Hz (divider chain is a fully static design).
2. Dividers should be set so that they provide the phase detector with signals of 10MHz or greater for loop stability.
3. fIN = fOUT = 100 MHz, M = N = 1, V = 6, output type LVPECL.
4. Variation in duty cycle expressed in ps. To obtain duty cycle percentage error (%ERR) for a given output frequency (fOUT), %ERR = 100 x
fOUT x DCERR.
5. See Figures 3-5 for output loads.
6. milli-Unit Interval
7. Input and outputs LVPECL mode
8. fIN = 100MHz, M = 1, N = 3, V = 2, output type LVPECL.
ps(RMS)
mV(p-p)
Lattice Semiconductor ispClock5600 Family Data Sheet
11
Timing Specifications
Skew Matching
Programmable Skew Control
Control Functions
Figure 6. RESET and Profile Select Timing
Symbol Parameter Conditions Min. Typ. Max. Units
tSKEW Output-output Skew Between any two identically configured and loaded
outputs regardless of bank. 50 ps
Symbol Parameter Conditions Min. Typ. Max. Units
tSKRANGE Skew Control Range1
Fine Skew Mode, fVCO = 320 MHz 5.86
ns
Fine Skew Mode, fVCO = 640 MHz 2.93
Coarse Skew Mode, fVCO = 320 MHz 11.72
Coarse Skew Mode, fVCO = 640 MHz 5.86
SKSTEPS Skew Steps per range 16
tSKSTEP Skew Step Size2
Fine Skew Mode, fVCO = 320 MHz 390
ps
Fine Skew Mode, fVCO = 640 MHz 195
Coarse Skew Mode, fVCO = 320 MHz 780
Coarse Skew Mode, fVCO = 640 MHz 390
tSKERR Skew Time Error3Fine skew mode 30 ps
Coarse skew mode 50
1. Skew control range is a function of VCO frequency (fVCO). In fine skew mode TSKRANGE = 15/(8 x fVCO).
In coarse skew mode TSKRANGE = 15/(4 x fVCO).
2. Skew step size is a function of VCO frequency (fVCO). In fine skew mode TSKSTEP = 1/(8 x fVCO).
In coarse skew mode TSKSTEP = 1/(4 x fVCO).
3. Only applicable to outputs with non-zero skew settings.
Symbol Parameter Conditions Min. Typ. Max. Units
tDIS/OE Delay Time, OEX or OEY to Output Disabled/
Enabled —1020ns
tDIS/GOE Delay Time, GOE to Output Disabled/Enabled 10 20 ns
tSUSGATE Setup Time, SGATE to Output Clock Start/
Stop 3 cycles1
tPLL_RSTW PLL Reset Pulse Width21—ms
tRSTW Logic Reset Pulse Width320 ns
tHPS_RST Hold time for RESET past change in PS[0..1] 20 ns
1. Output clock cycles for the particular output being controlled.
2. Will completely reset PLL.
3. Will only reset digital logic.
tHPS_RST
tPLL_RSTW
PS[0..1]
RESET
Lattice Semiconductor ispClock5600 Family Data Sheet
12
Timing Specifications (Cont.)
Boundary Scan Logic
JTAG Interface and Programming Mode
Symbol Parameter Min. Max. Units
tBTCP TCK (BSCAN Test) Clock Cycle 40 ns
tBTCH TCK (BSCAN Test) Pulse Width High 20 ns
tBTCL TCK (BSCAN Test) Pulse Width Low 20 ns
tBTSU TCK (BSCAN Test) Setup Time 8 ns
tBTH TCK (BSCAN Test) Hold Time 10 ns
tBRF TCK (BSCAN Test) Rise and Fall Rate 50 mV/ns
tBTCO TAP Controller Falling Edge of Clock to Valid Output 10 ns
tBTOZ TAP Controller Falling Edge of Clock to Data Output Disable 10 ns
tBTVO TAP Controller Falling Edge of Clock to Data Output Enable 10 ns
tBVTCPSU BSCAN Test Capture Register Setup Time 8 ns
tBTCPH BSCAN Test Capture Register Hold Time 10 ns
tBTUCO BSCAN Test Update Register, Falling Edge of Clock to Valid Output 25 ns
tBTUOZ BSCAN Test Update Register, Falling Edge of Clock to Output Disable 25 ns
tBTUOV BSCAN Test Update Register, Falling Edge of Clock to Output Enable 25 ns
Symbol Parameter Condition Min. Typ. Max. Units
fMAX Maximum TCK Clock Frequency 25 MHz
tCKH TCK Clock Pulse Width, High 20 ns
tCKL TCK Clock Pulse Width, Low 20 ns
tISPEN Program Enable Delay Time 15 µs
tISPDIS Program Disable Delay Time 30 µs
tHVDIS High Voltage Discharge Time, Program 30 µs
tHVDIS High Voltage Discharge Time, Erase 200 µs
tCEN Falling Edge of TCK to TDO Active 15 ns
tCDIS Falling Edge of TCK to TDO Disable 15 ns
tSU1 Setup Time 8 ns
tHHold Time 10 ns
tCO Falling Edge of TCK to Valid Output 15 ns
tPWV Verify Pulse Width 30 µs
tPWP Programming Pulse Width 20 ms
tBEW Bulk Erase Pulse Width 200 ms
Lattice Semiconductor ispClock5600 Family Data Sheet
13
Timing Diagrams
Figure 7. Erase (User Erase or Erase All) Timing Diagram
Figure 8. Programming Timing Diagram
Figure 9. Verify Timing Diagram
Figure 10. Discharge Timing Diagram
VIH
VIL
VIH
VIL
The clock (TCK) must be
able to run free with TMS = VIL
The clock (TCK) must be
able to run free with TMS = VIL
Update-IR Run-Test/Idle (Erase) Select-DR Scan
Clock to Shift-IR state and shift in the Discharge
Instruction, then clock to the Run-Test/Idle state
Run-Test/Idle (Discharge)
Specified by the Data Sheet
TMS
TCK
State
tH
tH
tH
tH
tH
tHtSU1
tSU1
tSU1
tSU1
tSU1
tSU1
tSU2
tCKH
tCKH
tCKH
tCKH
tCKH tGKL tBEW tGKL
TMS
TCK
State
VIH
VIL
VIH
VIL
Update-IR Run-Test/Idle (Program) Select-DR Scan
Clock to Shift-IR state and shift in the next
Instruction, which will stop the discharge process
Update-IR
The clock (TCK) must be
able to run free with TMS = VIL
tSU1 tSU1 tSU1 tSU1
tSU1
tHtHtHtH
tH
tCKL tPWP
tCKH tCKH tCKH tCKH
tCKL
TMS
TCK
State
VIH
VIL
VIH
VIL
Update-IR Run-Test/Idle (Program) Select-DR Scan
Clock to Shift-IR state and shift in the next Instruction
Update-IR
The clock (TCK) must be
able to run free with TMS=VIL
t
H
t
H
t
H
t
H
t
H
t
CKH
t
CKH
t
CKH
t
CKL
t
PWV
t
CKH
t
CKL
t
SU1
t
SU1
t
SU1
t
SU1
t
SU1
TMS
TCK
State
VIH
VIL
VIH
VIL
Update-IR Run-Test/Idle (Erase or Program)
Select-DR Scan
Clock to Shift-IR state and shift in the Verify
Instruction, then clock to the Run-Test/Idle state
Run-Test/Idle (Verify)
Specified by the Data Sheet
Actual
tH
tH
tH
tH
tHtHtSU1
tCKH
tHVDIS (Actual)
tCKH
tCKH
tCKH tCKL tPWP or tBEW tPWV tCKH
tCKL
tPWV
tSU1
tSU1
tSU1
tSU1 tSU1
Lattice Semiconductor ispClock5600 Family Data Sheet
14
Typical Performance Characteristics
0
0.2
0.4
0.6
0.8
1
1.2
300
03
320 370 420 470 520 570 620
6 9 12 15 320 370 420 470 520 570 620
320 370 420 470 520 570 620
400 500 600 700
ICCO vs. Output Frequency
(LVCMOS 3.3V, Normalized to 320MHz)
ICCD vs. fVCO
(Normalized to 640MHz)
Typical Skew Error vs. Setting
(Skew Mode = FINE, fVCO = 600MHz)
Cycle-Cycle Jitter vs. VCO Frequency
V=4
Phase Jitter vs. VCO Frequency
V=4
Period Jitter vs. VCO Frequency
V=4
0
0.2
0.4
0.6
0.8
1
1.2
0 50 100 150 200 250 300 350
Output Frequency (MHz)
Skew Setting # VCO Frequency (MHz)
VCO Frequency (MHz)
VCO Frequency (MHz)
fVCO
(MHz)
Normalized ICCO Current
Normalized ICCD CurrentError vs. Ideal (ps)Cycle-Cycle Jitter (RMS) – ps
Period Jitter (RMS) – ps Phase Jitter (RMS) – ps
-100
25
15
5
0
*PFD = Phase/Frequency Detector
20
10
25
15
5
0
20
10
-75
-50
-25
0
25
50
75
100
30
35
40
45
50
55
60
65
70
PFD* = 20MHz
PFD = 20MHz
PFD = 40MHz
PFD = 40MHz
PFD = 80MHz
PFD = 80MHz
PFD =
80 MHz
40 MHz
20 MHz
Lattice Semiconductor ispClock5600 Family Data Sheet
15
Typical Performance Characteristics (Cont.)
Detailed Description
PLL Subsystem
The ispClock5600 provides an integral phase-locked-loop (PLL) which may be used to generate output clock sig-
nals at lower, higher, or the same frequency as a user-supplied input reference signal. The core functions of the
PLL are an edge-sensitive phase detector, a programmable loop filter, and a high-speed voltage-controlled oscilla-
tor (VCO). Additionally, a set of programmable input, output and feedback dividers (M, N, V[1..5]) is provided to
support the synthesis of different output frequencies.
Phase/Frequency Detector
The ispClock5600 provides an edge-sensitive phase/frequency detector (PFD), which means that the device will
function properly over a wide range of input clock reference duty cycles. It is only necessary that the input refer-
ence clock meet specified minimum HIGH and LOW times (tCLOCKHI, tCLOCKLO) for it to be properly recognized by
the PFD. The PFD’s output is of a classical charge-pump type, outputting charge packets which are then integrated
by the PLL‘s loop filter.
A lock-detection feature is also associated with the PFD. When the ispClock5600 is in a LOCKED state, the LOCK
output pin goes LOW. The lock detector has two operating modes; phase lock mode and frequency lock mode. In
60
55
50
45
35
40
30
0
10
20
30
40
50
60
70
80
320 370 420 470 520 570 620 670
320 370 420 470 520 570 620 670
Typical Phase Jitter vs. VCO Frequency
PFD* = 80 MHz
Typical Period Jitter vs. VCO Frequency
PFD = 80 MHz
Typical Cycle-Cycle Jitter vs. VCO Frequency
PFD = 80 MHz
VCO Frequency
(MHz)
VCO Frequency
(MHz)
320 370 420 470 520 570 620 670
VCO Frequency
(MHz)
Phase Jitter (RMS) – psPeriod Jitter (RMS) – ps
Cycle-Cycle Jitter (RMS) – ps
140
120
100
80
20
40
60
0
V = 4, 8, 16, 32
V = 32
V = 16
V = 8
V = 8
V = 4
V = 16
V = 32
V = 4
*PFD = Phase/Frequency Detector
Lattice Semiconductor ispClock5600 Family Data Sheet
16
phase-lock mode, the LOCK signal is asserted if the phases of the reference and feedback signals match, whereas
in frequency-lock mode the LOCK signal is asserted when the frequencies of the feedback and reference signals
match. The option of which mode to use is programmable and may be set using PAC-Designer software (available
from the Lattice web site at www.latticesemi.com).
In phase-lock mode the lock detector asserts the LOCK signal as soon as a lock condition is determined. In fre-
quency-lock mode, however, the PLL must be in a locked condition for a set number of phase detector cycles
before the LOCK signal will be asserted. The number of cycles required before asserting the LOCK signal in fre-
quency-lock mode can be set from 16 through 256.
When the lock condition is lost the LOCK signal will be de-asserted immediately in both phase-lock and frequency-
lock detection modes. In frequency-lock mode, however, if the input reference signal is stopped, the LOCK output
may continue to be asserted. In phase-lock mode, a loss of the input reference signal will always result in de-asser-
tion of the LOCK output.
Loop Filter
A simplified schematic for the ispClock5600 loop filter is shown in Figure 11. The filter’s capacitors are fixed, and
the response is controlled by setting the value of the phase-detector’s output current source’s and the value of the
variable resistor. The phase detector output current has 14 possible settings, ranging from 3µA to 55µA, while the
resistor may be set to any one of six values ranging from 2.3K to 9.3K. This provides a total of 84 unique I-R com-
binations which may be selected.
Figure 11. ispClock5600 Loop Filter (Simplified)
Because the selection of an optimal PLL loop filter can be a daunting task, PAC-Designer offers a set of default fil-
ter settings which will provide acceptable performance for most applications. The primary criterion for selecting one
of these settings is the total division factor used in the feedback path. This factor is the ratio between the VCO out-
put frequency and the feedback V-divider output frequency which is the product of the N-divider and Vfeedback-
divider (N x Vfeedback). Table 2 and Table 3 list the default loop filter settings that correspond to all possible allow-
able V x Vfeedback values. Table 2 should be used to minimize cycle to cycle and period jitter while Table 3 should be
used to optimize overall jitter performance including phase jitter.
To VCO
R
C2
C1
I
I
Phase Detector
From
M-divider
From
N-divider
Lattice Semiconductor ispClock5600 Family Data Sheet
17
Table 2. Filter Settings for Minimizing Cycle-Cycle and Period Jitter
Table 3. Filter Settings for Optimizing Overall Jitter (Recommended)
Note that the choice of loop filter parameters can have significant effects on settling time, output jitter, and whether
the PLL will be fundamentally stable and be able to lock to an incoming signal. The values recommended in Table 2
and Table 3 were chosen to provide maximum loop stability while still providing exceptional jitter performance.
Please note that when the skew mode is set to ‘coarse’, the effective value of NxV must be considered to have dou-
bled. Refer to the section titled ‘Coarse Skew Mode’ on page 30 for further details.
The PLLs loop bandwidth is a function of both the divider configuration and the loop filter settings. Figure 12 shows
the loop bandwidth as a function of the total feedback division ratio (N x VFBK). For each NxV feedback divider point
in this plot, the PLL loop filter was set to the corresponding value recommended in Table 2. The use of non-recom-
mended loop filter settings may result in significantly different bandwidths for a given NxV divider setting.
N x VFBK I (µA) R (k)
2 to 8 5 2.3
10 7 2.3
12 to 14 9 2.3
16 11 2.3
18 to 20 13 2.3
22 15 2.3
24 to 26 17 2.3
28 19 2.3
30 21 2.3
32 to 64 22 2.3
Note: Do not use this setting if phase jitter performance opti-
mization is required.
N x VFBK I (µA) R (k)
2 17 2.3
4 to 6 33 2.3
8 to 14 55 2.3
16 to 22 55 3.7
24 to 52 55 5.1
54 to 62 55 7.9
Lattice Semiconductor ispClock5600 Family Data Sheet
18
Figure 12. PLL Loop Bandwidth vs. Feedback Divider Setting (nominal)
VCO
The ispClock5600 provides an internal VCO which provides an output frequency ranging from 320MHz to 640MHz.
The VCO is implemented using differential circuit design techniques which minimize the influence of power supply
noise on measured output jitter. The VCO is also used to generate skews as a function of the total VCO period.
Using the VCO as the basis for controlling output skew allows for highly precise and consistent skew generation,
both from device-to-device, as well as channel-to-channel within the same device.
M, N, and V Dividers
The ispClock5600 incorporates a set of programmable dividers which provide the ability to synthesize output fre-
quencies differing from that of the reference clock input.
The input, or M divider prescales the input reference frequency, and can be programmed with integer values over
the range of 1 to 32. To achieve low levels of output jitter, it is best to use the smallest M divider value possible.
The feedback, or N divider prescales the feedback frequency and like the M divider, can also be programmed with
integer values ranging from 1 to 32.
Each one of the five output, or V dividers can be independently programmed to provide even division ratios ranging
from 2 to 64.
When the PLL is selected (PLL_BYPASS=LOW) and locked, the output frequency of each V divider (fk) may be cal-
culated as:
(1)
where
fk is the frequency of V divider k
fref is the input reference frequency
M and N are the input and feedback divider settings
Vfbk is the setting of the V divider used to close the PLL feedback path
Vk is the setting of the V divider used to provide output k
Note that because the feedback may be taken from any V divider, Vk and Vfbk may refer to the same divider.
PLL Loop Bandwidth vs.
Feedback Divider Setting* (Typical)
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
016324864
N x V Feedback Division Product
*loop filter configured to recommended setting
Loop Bandwidth (MHz)
=
fkfref
N x Vfbk
M x Vk
Lattice Semiconductor ispClock5600 Family Data Sheet
19
Because the VCO has an operating frequency range spanning 320 MHz to 640 MHz, and the V dividers provide
division ratios from 2 to 64, the ispClock5600 can generate output signals ranging from 5MHz to 320 MHz. For per-
formance and stability reasons, however, there are several constraints which should be followed when selecting
divider values:
Use the smallest feasible value for the M divider
The output frequency from the M (and N) divider should be greater or equal to 10 MHz.
The product of the N divider and the V divider used to close the PLLs feedback loop should be less than or
equal to 64 (N x Vfbk 64)
Output Duty Cycle
The ispClock5600’s output duty cycle varies as a function of the V divider used to generate that output. If the V-
divider setting is either 2 or a multiple of 4, the nominal output duty cycle will be exactly 50%. All other V divider set-
tings will result in non-50% output duty cycles. Table 4 summarizes the nominal output duty cycle as a function of
the V divider setting. Note that if the output is inverted, the duty cycle will be equal to 100%-DC%, where DC% is
the duty cycle indicated in the table. For example, with a V divider of 14, the non-inverted duty cycle from Table 4
will be 43%. For an inverted output, the duty cycle will be 100%-43% or 57%.
Table 4. Nominal Output Duty Cycle vs. V-divider Setting
Device Start-up Behavior
The outputs of the ispClock5600 always start up edge aligned. When the V-divider is set to a value of 2 and the out-
put skew is set to a value greater than 8, the first clock cycle immediately following power-up could be incomplete
(runt cycle). For all the remaining conditions, no runt clocks will be generated after power-up.
PLL_BYPASS Mode
The PLL_BYPASS mode is provided so that input reference signals can be coupled through to the outputs without
using the PLL functions. When PLL_BYPASS mode is enabled (PLL_BYPASS=HIGH), the output of the M divider
is routed directly to the inputs of the V dividers. In PLL_BYPASS mode, the nominal values of the V dividers are
Divider Settings
with 50% Output
Duty Cycle
Divider Settings with
Non-50% Output Duty
Cycles
V DC% V DC%
2
50
633
41040
81443
12 18 44
16 22 45
20 26 46
24 30 47
28 34 47
32 38 47
36 42 48
40 46 48
44 50 48
48 54 48
52 58 48
56 62 48
60
64
Lattice Semiconductor ispClock5600 Family Data Sheet
20
halved, so that they provide division ratios ranging from 1 to 32. The output frequency for a given V divider (fk) will
be determined by
(2)
Please note that PLL_BYPASS mode is provided primarily for testing purposes. When PLL_BYPASS mode is
enabled, features such as lock detect and skew generation are unavailable.
Reference and External Feedback Inputs
The ispClock5600 provide sets of configurable, internally-terminated inputs for both clock reference and feedback
signals. In normal operation, the one of the clock reference input pairs (REFA+/- or REFB+/-) is used as a clock
input.
The external feedback inputs make it possible to sample an output signal at the point of delivery. This makes it pos-
sible to provide output clocks which have very low skews in relation to the reference clock regardless of loading
effects.
The ispClock5610 provides one input signal pair for reference input and one input pair for external feedback, while
the ispClock5620 provides two pairs for reference signals and two pairs for feedback. To select between reference
and feedback inputs, the ispClock5620 provides two CMOS-compatible digital inputs called REFSEL and FBKSEL.
Table 5 shows the behavior of these two control inputs.
Table 5. REFSEL and FBKSEL Operation for ispClock5620
LVTTL (3.3V)
LVCMOS (1.8V, 2.5V, 3.3V)
SSTL2
SSTL3
HSTL
Differential SSTL2
Differential SSTL3
Differential HSTL
LVDS
LVPECL (differential, 3.3V)
Each input also features internal programmable termination resistors, as shown in Figure 13. Note that all refer-
ence inputs (REFA+, REFA-, REFB+, REFB-) terminate to the REFVTT pin, while all feedback inputs (FBKA+,
FBKA-, FBKB+, FBKB-) terminate to the FBKVTT pin.
REFSEL
Selected
Input Pair FBKSEL
Selected
Input Pair
0 REFA+/- 0 FBKA+/-
1 REFB+/- 1 FBKB+/-
=
fk
fref x 2
M x Vk
Lattice Semiconductor ispClock5600 Family Data Sheet
21
Figure 13. ispClock5600 Clock Reference and Feedback Input Structure (REFA+/- Pair Shown)
The following usage guidelines are suggested for interfacing to supported logic families.
LVTTL (3.3V), LVCMOS (1.8V, 2.5V, 3.3V)
The receiver should be set to LVCMOS or LVTTL mode, and the input signal should be connected to the ‘+’ termi-
nal of the input pair (e.g. REFA+). The ‘-’ input terminal should be left floating. CMOS transmission lines are gener-
ally source terminated, so all termination resistors should be set to the OPEN state. Figure 14 shows the proper
configuration. Please note that because switching thresholds are different for LVCMOS running at 1.8V, there is a
separate configuration setting for this particular standard.
Figure 14. LVCMOS/LVTTL Input Receiver Configuration
HSTL, SSTL2, SSTL3
The receiver should be set to HSTL/SSTL mode, and the input signal should be fed into the ‘+’ terminal of the input
pair. The ‘-’ input terminal should be tied to the appropriate VREF value, and the associated REFVTT or FBKVTT
terminal should be tied to a VTT termination supply. The positive input’s terminating resistor should be engaged and
set to 50. Figure 15 shows an appropriate configuration. Refer to the “Recommended Operating Conditions -
Supported Logic Standards” table in this data sheet for suitable values of VREF and VTT.
RTRT
REFA-
REFA+
REFVTT
To Internal
Logic
Single-ended
ispClock5600
Receiver
Differential
Receiver
R
T
OPEN
REFA-
REFA+
REFVTT
Single-ended
Receiver
No Connect
No Connect
Signal In
ispClock5600
Lattice Semiconductor ispClock5600 Family Data Sheet
22
One important point to note is that the termination supplies must have low impedance and be able to both source
and sink current without experiencing fluctuations. These requirements generally preclude the use of a resistive
divider network, which has an impedance comparable to the resistors used, or of commodity-type linear voltage
regulators, which can only source current. The best way to develop the necessary termination voltages is with a
regulator specifically designed for this purpose. Because SSTL and HSTL logic is commonly used for high-perfor-
mance memory busses, a suitable termination voltage supply is often already available in the system.
Figure 15. SSTL2, SSTL3, HSTL Receiver Configuration
50
CLOSED
REFA-
REFA+
REFVTT
VTT
Differential
Receiver
VREF IN
Signal In
ispClock5600
OPEN
Lattice Semiconductor ispClock5600 Family Data Sheet
23
Differential HSTL and SSTL
HSTL and SSTL are sometimes used in a differential form, especially for distributing clocks in high-speed memory
systems. Figure 16 shows how ispClock5600 reference input should be configured for accepting these standards.
The major difference between differential and single-ended forms of these logic standards is that in the differential
case, the REFA- input is used as a signal input, not a reference level, and that both terminating resistors are
engaged and set to 50.
Figure 16. Differential HSTL/SSTL Receiver Configuration
LVDS/Differential LVPECL
The receiver should be set to LVDS or LVPECL mode as required and both termination resistors should be
engaged and set to 50. The associated REFVTT or FBKVTT pin, however, should be left unconnected. This cre-
ates a floating 100 differential termination resistance across the input terminals. The LVDS termination configura-
tion is shown in Figure 17.
Figure 17. LVDS Input Receiver Configuration
50
CLOSED
REFA-
REFA+
REFVTT
Differential
Receiver
+Signal In
ispClock5600
CLOSED
-Signal In
50
VTT
50
CLOSED
REFA-
REFA+
REFVTT
Differential
Receiver
+Signal In
CLOSED
-Signal In
50
No Connect
LVDS
Driver
ispClock5600
Lattice Semiconductor ispClock5600 Family Data Sheet
24
Note that while a floating 100 resistor forms a complete termination for an LVDS signal line, additional circuitry
may be required to satisfactorily terminate a differential LVPECL signal. This is because a true bipolar LVPECL out-
put driver typically requires an external DC ‘pull-down’ path to a VTERM termination voltage (typically VCC-2V) to
properly bias its open emitter output stage. When interfacing to an LVPECL input signal, the ispClock5600’s inter-
nal termination resistors should not be used for this pull-down function, as they may be damaged from excessive
current. The pull-down should be implemented with external resistors placed close to the LVPECL driver
(Figure 18)
Figure 18. LVPECL Input Receiver Configuration
Please note that while the above discussions specify using 50 termination impedances, the actual impedance
required to properly terminate the transmission line and maintain good signal integrity may vary from this ideal. The
actual impedance required will be a function of the driver used to generate the signal and the transmission medium
used (PCB traces, connectors and cabling). The ispClock5600’s ability to adjust input impedance over a range of
40 to 70 allows the user to adapt his circuit to non-ideal behaviors from the rest of the system without having to
swap out components.
Output Drivers
The ispClock5600 provide banks of configurable, internally-terminated high-speed dual-output line drivers. The
ispClock5610 provides five driver banks, while the ispClock5620 provides ten. Each of these driver banks may be
configured to provide either a single differential output signal, or a pair of single-ended output signals. Programma-
ble internal source-series termination allows the ispClock5600 to be matched to transmission lines with imped-
ances ranging from 40 to 70 Ohms. The outputs may be independently enabled or disabled, either from E2CMOS
configuration or by external control lines. Additionally, each can be independently programmed to provide a fixed
amount of signal delay or skew, allowing the user to compensate for the effects of unequal PCB trace lengths or
loading effects. Figure 19 shows a block diagram of a typical ispClock5600 output driver bank and associated skew
control.
Because of the high edge rates which can be generated by the ispClock5600’s clock output drivers, the VCCO
power supply pin for each output bank should be individually bypassed. Low ESR capacitors with values ranging
from 0.01 to 0.1 µF may be used for this purpose. Each bypass capacitor should be placed as close to its respec-
tive output bank power pins (VCCO and GNDO) pins as is possible to minimize interconnect length and associated
parasitic inductances.
50
CLOSED
REFA-
REFA+
REFVTT
Differential
Receiver
+Signal In
CLOSED
-Signal In
50
No Connect
LVPECL
Driver
ispClock5600
RPD RPD
VTERM
Lattice Semiconductor ispClock5600 Family Data Sheet
25
In the case where an output bank is unused, the associated VCCO pin may be either left floating or tied to ground
to reduce quiescent power consumption. We recommend, however, that all unused VCCO pins be tied to ground
where possible. All GND0 pins must be tied to ground, regardless of whether or not the associated bank is used.
Figure 19. ispClock5600 Output Driver and Skew Control
Each of the ispClock5600’s output driver banks can be configured to support the following logic outputs:
LVTTL
LVCMOS (1.8V, 2.5V, 3.3V)
SSTL2
SSTL3
HSTL
LVDS
Differential LVPECL (3.3V)
To provide LVTTL, LVCMOS, SSTL2, SSTL3, and HSTL outputs, the CMOS output drivers in each bank are
enabled. These circuits provide logic outputs which swing from ground to the VCCO supply rail. The choice of
VCCO to be supplied to a given bank is determined by the logic standard to which that bank is configured. Because
each pair of outputs has its own VCCO supply pin, each bank can be independently configured to support a differ-
ent logic standard. Note that the two outputs associated with a bank must necessarily be configured to the same
logic standard. The source impedance of each of the two outputs in each bank may be independently set over a
range of 40 to 70 in 5 steps. A low impedance option (20) is also provided for cases where low source ter-
mination is desired on a given output.
Control of output slew rate is also provided in LVTTL, LVCMOS, SSTL2, SSTL3, and HSTL output modes. Four
output slew-rate settings are provided, as specified in the “Output Rise Times” and “Output Fall Times” tables in this
data sheet.
To provide LVDS and differential LVPECL outputs, a separate internal driver is used which provides the correct
LVDS or LVPECL logic levels when operating from a 3.3V VCCO. Because both LVDS and differential LVPECL
transmission lines are normally terminated with a single 100 resistor between the ‘+’ and ‘-’ signal lines at the far
OE
Control
From V-Dividers
Skew
Adjust
Skew
Adjust
BANKxA
BANKxB
Single-ended
‘A’ output Driver
Single-ended
‘B’ output Driver
Differential
(PECL/LVDS)
Driver
OE
Control
OE
Control
Lattice Semiconductor ispClock5600 Family Data Sheet
26
end, the ispClock5600’s internal termination resistors are not available in these modes. Also note that output slew-
rate control is not available in LVDS or LVPECL mode, and that these drivers always operate at a fixed slew-rate.
Polarity control (true/inverted) is available for all output drivers. In the case of single-ended output standards, the
polarity of each of the two output signals from each bank may be controlled independently. In the case of differen-
tial output standards, the polarity of the differential pair may be selected.
Suggested Usage
Figure 20 shows a typical configuration for the ispClock5600’s output driver when configured to drive an LVTTL or
LVCMOS load. The ispClock5600’s output impedance should be set to match the characteristic impedance of the
transmission line being driven. The far end of the transmission line should be left open, with no termination resis-
tors.
Figure 20. Configuration for LVTTL/LVCMOS Output Modes
Figure 21 shows a typical configuration for the ispClock5600’s output driver when configured to drive SSTL2,
SSTL3, or HSTL loads. The ispClock5600’s output impedance should be set to 40 for driving SSTL2 or SSTL3
loads and to the 20 setting for driving HSTL. The far end of the transmission line must be terminated to an
appropriate VTT voltage through a 50 resistor.
Figure 21. Configuration for SSTL2, SSTL3, and HSTL Output Modes
While supporting single-ended HSTL and SSTL outputs, the ispClock5600 does not support differential HSTL or
SSTL outputs. Although complementary HSTL and SSTL signals may be generated by using both an inverted out-
put and a non-inverted output similarly configured, the resulting signal pair may not meet the JEDEC differential
HSTL specifications for common mode voltage or crossover voltage.
Figure 22 shows a typical configuration for the ispClock5600’s output driver when configured to drive LVDS or dif-
ferential LVPECL loads. The ispClock5600’s output impedance is disengaged when the driver is set to LVDS or
Zo
Ro = Zo
ispClock5600
LVCMOS/LVTTL
Mode
LVCMOS/LVTTL
Receiver
Zo=50
Ro : 40 (SSTL)
20 (HSTL)
ispClock5600
SSTL/HSTL
Mode SSTL/HSTL
Receiver
VTT
VREF
RT=50
Lattice Semiconductor ispClock5600 Family Data Sheet
27
LVPECL mode. The far end of the transmission line must be terminated with a 100 resistor across the two signal
lines.
Figure 22. Configuration for LVDS and LVPECL Output Modes
Note that when in LVPECL output mode, the ispClock5600’s output driver provides an internal pull-down, unlike a
typical bipolar LVPECL driver. For this reason no external pull-down resistors are necessary and the driver may be
terminated with a single 100 resistor across the signal lines. For proper operation, pull-down resistors should
NOT be used with the ispClock5600’s LVPECL output mode.
Thermal Management
In applications where a majority of the ispClock5610 or ispClock5620’s outputs are active and operating at or near
maximum output frequency (320 MHz), package thermal limitations may need to be considered to ensure a suc-
cessful design. Thermal characteristics of the packages employed by Lattice Semiconductor may be found in the
document Thermal Management which may be obtained at www.latticesemi.com.
The maximum current consumption of the digital and analog core circuitry is approximately 167mA worst case
(ICCD + ICCA), and each of the output banks may draw up to 35mA worst case (LVCMOS 3.3V, CL=18pF, fOUT=320
MHz, both outputs in each bank enabled). This results in a total device dissipation:
PDMAX = 3.3V x (10 x 35mA + 167mA) = 1.7W (3)
With a maximum recommended operating junction temperature (TJOP) of 115°C for an industrial grade device, the
maximum allowable ambient temperature (TAMAX) can be estimated as
TAMAX = TJOP - PDMAX x ΘJA = 115°C - 1.7W x 35°C/W = 55°C (4)
where ΘJA = 35 °C/W for the 100 TQFP package and ΘJA = 48 °C/W for the 48 TQFP package in still air.
The above analysis represents the worst-case scenario. Significant improvement in maximum ambient operating
temperature can be realized with additional cooling. Providing a 200 LFM (Linear Feet per Minute) airflow reduces
ΘJA to 29°C/W, which results in a maximum ambient operating temperature of 66°C.
In practice, however, the absolute worst-case situation will be relatively rare, as not all outputs may be running at
maximum output frequency in a given application. Additionally, if the internal VCO is operating at less than its max-
imum frequency (640MHz), it requires less current on the VCCD pin. In these situations, one can estimate the
effective ICCO for each bank and the effective ICCD for the digital core functions based on output frequency and
VCO frequency. Normalized curves relating current to operating frequency for these parameters may be found in
the Typical Performance Characteristics section.
While it is possible to perform detailed calculations to estimate the maximum ambient operating temperature from
operating conditions, some simpler rule-of-thumb guidance can also be obtained through the derating curves
shown in Figure 23. The curves in Figure 23a show the maximum ambient operating temperature permitted when
operating a given number of output banks at the maximum output frequency (320MHz). Note that it is assumed that
both outputs in each bank are active.
Zo=50
ispClock5600
LVDS/LVPECL
mode LVDS/PECL
Receiver
RT=100
Zo=50
Lattice Semiconductor ispClock5600 Family Data Sheet
28
Figure 23. Maximum Ambient Temperature vs. Number of Active Output Banks
Figure 23b shows another derating curve, derived under the assumption that the output frequency is 100MHz. For
many applications, 100MHz outputs will be a more realistic scenario. Comparing the maximum temperature limits
of Figure 23b with Figure 23a, one can see that significantly higher operating temperatures are possible in LVC-
MOS 3.3V output mode with more outputs at 100MHz than at 320MHz.
The examples above used LVCMOS 3.3V logic, which represents the maximum power dissipation case at higher
frequencies. For optimal operation at very high frequencies (> 150 MHz) LVDS will often be the best choice from a
signal integrity standpoint. For LVDS-configured outputs, the maximum ICCO current consumption per bank is low
enough that both the ispClock5610 and ispClock5620 can operate all outputs at maximum frequency over their
complete rated temperature range, as shown in Figure 23c.
Note that because of variations in circuit board mounting, construction, and layout, as well as convective and forced
airflow present in a given design, actual die operating temperature is subject to considerable variation from that
which may be theoretically predicted from package characteristics and device power dissipation.
Output Enable Controls
The ispClock5600 family provides the user with several options for enabling and disabling output pins, as well as
suspending the output clock. In addition to providing the user with the ability to reduce the device’s power con-
Temperature Derating Curves
(Outputs LVCMOS 3.3V, fOUT=320 MHz)
Temperature Derating Curves
(Outputs LVCMOS 3.3V, fOUT=100 MHz)
40
50
60
70
80
90
0246810
# Active Output Banks # Active Output Banks
Maximum Ambient Temp. C
Maximum Ambient Temp. C
5620 Commercial
5620 Industrial
5610 Commericial
5610 Industrial
40
50
60
70
80
90
0246810
(a) (b)
Temperature Derating Curves
(Outputs LVDS, fOUT=320 MHz)
40
50
60
70
80
90
Maximum Ambient Temp. C
0246810
# Active Output Banks
(c)
Lattice Semiconductor ispClock5600 Family Data Sheet
29
sumption by turning off unused drivers, these features can also be used for functional testing purposes. The follow-
ing inputs pins are used for output enable functions:
GOE – global output enable
OEX, OEY – secondary output enable controls
SGATE – synchronous output control
Additionally, internal E2CMOS configuration bits are provided for the purpose of modifying the effects of these
external control pins.
When GOE is HIGH, all output drivers are forced into a high-Z state, regardless of any internal configuration. When
GOE is LOW, the output drivers may also be enabled or disabled on an individual basis, and optionally controlled
by the OEX and OEY pins. Internal E2CMOS configuration is used to establish whether the output driver is always
enabled (when GOE pin is LOW), never enabled (permanently off), or selectively enabled by the state of either
OEX or OEY. Bringing GOE high will also disable the internal feedback driver and will result in a loss of lock.
Synchronous output gating is provided by ispClock5600 devices through the use of the SGATE pin. The SGATE pin
does not disable the output driver, but merely forces the output to either a high or low state, depending on the out-
put driver’s polarity setting. If the output driver polarity is true, the output will be forced LOW when SGATE is
brought LOW, while if it is inverted, the output will be forced HIGH. A primary feature of the SGATE function is that
the clock output is enabled and disabled synchronous to the selected internal clock source. This prevents the gen-
eration of partial, ‘runt’, output clock pulses, which would otherwise occur with simple combinatorial gating
schemes. The SGATE is available to all clock outputs and is selectable on a bank-by-bank basis.
Table 6 shows the behavior of the outputs for various combinations of the output enables, SGATE input, and
E2CMOS configuration.
Table 6. Clock Output Enable Functions
Table 7. SGATE Function
Skew Control Units
Each of the ispClock5600’s clock outputs is supported by a skew control unit which allows the user to insert an indi-
vidually programmable delay into each output signal. This feature is useful when it is necessary to de-skew clock
signals to compensate for physical length variations among different PCB clock paths.
GOE OEX OEY E2 Configuration Output
X X X Always OFF High-Z
0 X X Always ON Clock Out
0 0 X Enable on OEX Clock Out
0 1 X Enable on OEX High-Z
0 X 0 Enable on OEY Clock Out
0 X 1 Enable on OEY High-Z
1 X X n/a High-Z
SGATE Bank Controlled by SGATE? Output Polarity Output
X NO True Clock
X NO Inverted Inverted Clock
0 YES True LOW
0 YES Inverted HIGH
1 YES True Clock
1 YES Inverted Inverted Clock
Lattice Semiconductor ispClock5600 Family Data Sheet
30
Unlike the skew adjustment features provided in many competing products, the ispClock5600’s skew adjustment
feature provides exact and repeatable delays which exhibit extremely low channel-to-channel and device-to-device
variation. This is achieved by deriving all skew timing from the VCO, which results in the skew increment being a lin-
ear function of the VCO period. For this reason, skews are defined in terms of ‘unit delays’, which may be pro-
grammed by the user over a range of 0 to 15. The ispClock5600 family also supports both ‘fine’ and ‘coarse’ skew
modes. In fine skew mode, the unit skew ranges from 195ps to 390 ps, while in the coarse skew mode unit skew
varies from 390ps to 780ps. The exact unit skew (TU) may be calculated from the VCO frequency (fvco) by using
the following expressions:
(5)
When an output driver is programmed to support a differential output mode, a single skew setting is applied to both
the BANKxA+ and BANKxB- signals. When the output driver is configured to support a single-ended output stan-
dard, each of the two single-ended outputs may be assigned independent skews.
By using the internal feedback path, and programming a skew into the feedback skew control, it is possible to
implement negative timing skews, in which the clock edge of interest appears at the ispClock5600’s output before
the corresponding edge is presented at the reference input. When the feedback skew unit is used in this way, the
resulting negative skew is added to whatever skew is specified for each output. For example, if the feedback skew
is set to 6TU, BANK1’s skew is 8TU and BANK2’s skew is 3TU, then BANK1’s effective output skew will be 2TU
(8TU-6TU), while BANK2’s effective skew will be -3TU (3TU-6TU). This negative skew will manifest itself as
BANK2’s outputs appearing to lead the input reference clock, appearing as a negative propagation delay.
When the feedback V-divider is set to 2, the feedback skew should not be greater than 8.
Please note that the skew control units are only usable when the PLL is selected. In PLL bypass mode
(PLL_BYPASS=1), output skew settings will be ineffective and all outputs will exhibit skew consistent with the
device’s propagation delay and the individual delays inherent in the output drivers consistent with the logic stan-
dard selected.
Coarse Skew Mode
The ispClock5600 family provides the user with the option of obtaining longer skew delays at the cost of reduced
time resolution through the use of coarse skew mode. Coarse skew mode provides unit delays ranging from 390ps
(fVCO = 640MHz) to 780ps (fVCO = 320MHz), which is twice as long as those provided in fine skew mode. When
coarse skew mode is selected, an additional divide-by-2 stage is effectively inserted between the VCO and the V-
divider bank, as shown in Figure 24. When assigning divider settings in coarse skew mode, one must account for
this additional divide-by-two so that the VCO still operates within its specified range (320-640MHz).
Figure 24. Additional Factor-of-2 Division in Coarse Mode
When one moves from fine skew mode to coarse skew mode with a given divider configuration, the VCO frequency
will attempt to double to compensate for the additional divide-by-2 stage. Because the fVCO range is not increased,
however, one must modify the feedback path V-divider settings to bring fVCO back into its specified operating range
(320MHz to 640MHz). This can be accomplished by dividing all V-divider settings by two. All output frequencies will
=
TU
For fine skew mode,
1
8fvco
=
TU
For coarse skew mode,
1
4fvco
VCO
÷2
V-dividers
Fine
Mode
Fout
Coarse
Mode
Lattice Semiconductor ispClock5600 Family Data Sheet
31
remain unchanged from what they were in fine mode. One drawback of moving from fine skew mode into coarse
skew mode is that it may not be possible to maintain consistent output frequencies, as only those V-divider settings
which are multiples of four (in fine mode) may be divided by two. For example, a V-divider setting of 24 will divide
down to 12, which is also a legal V-divider setting, whereas an initial setting of 26 would divide down to 13, which is
not a valid setting.
When one moves from coarse skew mode to fine skew mode, the extra divide-by-two factor is removed from
between the VCO and the V-divider bank, halving the VCO’s effective operating frequency. To compensate for this
change, all of the V-dividers must be doubled to move the VCO back into its specified operating range and maintain
consistent output frequencies. The only situation in which this may be a problem is when a V-divider initially in
coarse mode has a value greater than 32, as the corresponding fine skew mode setting would be greater than 64,
which is not supported.
Output Skew Matching and Accuracy
Understanding the various factors which relate to output skew is essential for realizing optimal skew performance in
the ispClock5600 family of devices.
In the case where two outputs are identically configured, and driving identical loads, the maximum skew is defined
by tSKEW, which is specified as a maximum of 50ps. In Figure 25 the Bank1A and BANK2A outputs show the skew
error between two matched outputs.
Figure 25. Skew Matching Error Sources
One can also program a user-defined skew between two outputs using the skew control units. Because the pro-
grammable skew is derived from the VCO frequency, as described in the previous section, the absolute skew is
very accurate. The typical error for any non-zero skew setting is given by the tSKERR specification. For example, if
one is in fine skew mode with a VCO frequency of 500MHz, and selects a skew of 8TU, the realized skew will be
2ns, which will typically be accurate to within +/-30 ps. An example of error vs. skew setting can be found in the
chart ‘Typical Skew Error vs. Setting’ in the typical performance characteristics section. Note that this parameter
adds to output-to-output skew error only if the two outputs have different skew settings. The Bank1A and Bank3A
outputs in Figure 25 show how the various sources of skew error stack up in this case. Note that if two or more out-
puts are programmed to the same skew setting, then the contribution of the tSKERR skew error term does not apply.
When outputs are configured or loaded differently, this also has an effect on skew matching. If an output is set to
support a different logic type, this can be accounted for by using the tIOO output adders specified in the Table
‘Switching Characteristics’. That table specifies the additional skew added to an output using LVPECL as a base-
line. For instance, if one output is specified as LVTTL (tIOO = 0.15ns), and another output is specified as LVPECL
(tIOO = 0ns), then one could expect 0.1ns of additional skew between the two outputs. This timing relationship is
shown in Figure 26a.
+/- tSKEW
2ns +/- (tSKEW) +/- (tSKERR)
BANK1A
(skew setting = 0)
BANK2A
(skew setting=0)
BANK3A
(skew setting = 2ns)
Lattice Semiconductor ispClock5600 Family Data Sheet
32
Figure 26. Output Timing Adders for Logic Type (a) and Output Slew Rate (b)
Similarly, when one changes the slew rate of an output, the output slew rate adders (tIOS) can be used to predict
the resulting skew. In this case, the fastest slew setting (1) is used as the baseline against which other slews are
measured. For example, in the case of outputs configured to the same logic type (e.g. LVCMOS 1.8V), if one output
is set to the fastest slew rate (1, tIOS = 0ps), and another set to slew rate 3 (tIOS = 660ps), then one could expect
660ps of skew between the two outputs, as shown in Figure 26b.
Static Phase Offset and Input-Output Skew
The ispClock5600’s external feedback inputs can be used to obtain near-zero effective delays from the clock refer-
ence input pins to a designated output pin. In external feedback mode (Figure 27) the PLL will attempt to force the
output phase so that the rising edge phase (t φ) at the feedback input matches the rising edge phase at the refer-
ence input. The residual error between the two is specified as the static phase error. Note that any propagation
delays (tFBK) in the external feedback path drive the phase of the output signal backwards in time as measured at
the output. For this reason, if zero input-to-output delays are required in external feedback mode, the length of the
signal path between the output pin and the feedback pin should be minimized.
Figure 27. External Feedback Mode and Timing Relationships
Other Features
Internal Feedback Mode
In addition to supporting the use of external feedback to close the phase-locked loop, ispClock5620 also provides
the option of using an internal feedback path for this function. This feature is useful for minimizing external connec-
tions and routing in situations where one does not wish to attempt to compensate for external signal path delays.
LVPECL Output
(TIOS
= 0)
LVTTL Output
(TIOS
= 0.1ns)
0.15ns
(a)
LVCMOS Output
(Slew rate=1)
LVCMOS Output
(Slew rate=3)
660ps
(b)
Input Reference Clock REF
FBK
BANK
OUTPUT
ispClock5600
Delay = tFBK
tφ
tFBK
REF
FBK
BANK
OUTPUT
Lattice Semiconductor ispClock5600 Family Data Sheet
33
Profile Select
The ispClock5600 stores all internal configuration data in on-board E2CMOS memory. Up to four independent con-
figuration profiles may be stored in each device. The choice of which configuration profile is to be active is specified
thought the profile select inputs PS0 and PS1, as shown in Table 8.
Table 8. Profile Select Function
Each profile controls the following internal configuration items:
M divider setting
N divider setting
V divider settings
PLL loop filter settings
Output skew settings
Internal feedback skew settings
Internal vs. external feedback selection
The following settings are independent of the selection of active profile and will apply regardless of which profile is
selected:
Input logic configuration
– Logic family
– Input impedance
Output bank logic configuration
– Logic family
V-divider signal source
– Enable/SGATE control options
– Output impedance
– Slew rate
– Signal inversion
V-divider to be used as feedback source
Fine/Coarse skew mode selection
UES string
If any of the above items are modified, the change will apply across all profiles. In some cases this may cause
unanticipated behavior. If multiple profiles are used in a design, the suitability of the profile independent settings
must be considered with respect to each of the individual profiles.
When a profile is changed by modifying the values of the PS0 and PS1 inputs, it may be necessary to assert a
RESET signal to the ispClock5600 to restart the PLL and resynchronize all the internal dividers.
RESET and Power-up Functions
To ensure proper PLL startup and synchronization of outputs, the ispClock5600 provides both internally generated
and user-controllable external reset signals. An internal reset is generated whenever the device is powered up. An
external reset may be applied by asserting a logic HIGH at the RESET pin. Asserting RESET resets all internal
dividers, and will cause the PLL to lose lock. On losing lock, the VCO frequency will begin dropping. The length of
time required to regain lock is related to the length of time for which RESET was asserted.
PS1 PS0 Active Profile
0 0 Profile 0
0 1 Profile 1
1 0 Profile 2
1 1 Profile 3
Lattice Semiconductor ispClock5600 Family Data Sheet
34
When the ispClock5600 begins operating from initial power-on, the VCO starts running at a very low frequency
(<100 MHz) which gradually increases as it approaches a locked condition. To prevent invalid outputs from being
applied to the rest of the system, it is recommended that either the SGATE, OEX, or OEY pins be used to control
the outputs based on the status of the LOCK pin. Holding the SGATE pin LOW during power-up will result in the
BANK outputs being asserted HIGH or LOW (depending on inversion status) until SGATE is brought HIGH. Assert-
ing OEX or OEY high will result in the BANK outputs being held in a high-impedance state until the OEX or OEY
pin is pulled LOW. One should not use the GOE pin to control the outputs in anticipation of LOCK status, as holding
GOE HIGH also disables internal feedback and will prevent the device from ever achieving lock.
Software-Based Design Environment
Designers can configure the ispClock5600 using Lattice’s PAC-Designer software, an easy to use, Microsoft Windows
compatible program. Circuit designs are entered graphically and then verified, all within the PAC-Designer environ-
ment. Full device programming is supported using PC parallel port I/O operations and a download cable connected to
the serial programming interface pins of the ispClock5600. A library of configurations is included with basic solutions
and examples of advanced circuit techniques are available on the Lattice web site at www.latticesemi.com. In addi-
tion, comprehensive on-line and printed documentation is provided that covers all aspects of PAC-Designer operation.
The PAC-Designer schematic window, shown in Figure 28 provides access to all configurable ispClock5600 elements
via its graphical user interface. All analog input and output pins are represented. Static or non-configurable pins such
as power, ground and the serial digital interface are omitted for clarity. Any element in the schematic window can be
accessed via mouse operations as well as menu commands. When completed, configurations can be saved and
downloaded to devices.
Figure 28. PAC-Designer Design Entry Screen
In-System Programming
The ispClock5600 is an In-System Programmable (ISP™) device. This is accomplished by integrating all E2CMOS
configuration control logic on-chip. Programming is performed through a 4-wire, IEEE 1149.1 compliant serial JTAG
interface at normal logic levels. Once a device is programmed, all configuration information is stored on-chip, in
non-volatile E2CMOS memory cells. The specifics of the IEEE 1149.1 serial interface and all ispClock5600 instruc-
tions are described in the JTAG interface section of this data sheet.
Lattice Semiconductor ispClock5600 Family Data Sheet
35
User Electronic Signature
A user electronic signature (UES) feature is included in the E2CMOS memory of the ispClock5600. This consists of
32 bits that can be configured by the user to store unique data such as ID codes, revision numbers or inventory
control data. The specifics this feature are discussed in the IEEE 1149.1 serial interface section of this data sheet.
Electronic Security
An electronic security “fuse” (ESF) bit is provided in every ispClock5600 device to prevent unauthorized readout of
the E2CMOS configuration bit patterns. Once programmed, this cell prevents further access to the functional user
bits in the device. This cell can only be erased by reprogramming the device, so the original configuration can not
be examined once programmed. Usage of this feature is optional. The specifics of this feature are discussed in the
IEEE 1149.1 serial interface section of this data sheet.
Production Programming Support
Once a final configuration is determined, an ASCII format JEDEC file can be created using the PAC-Designer soft-
ware. Devices can then be ordered through the usual supply channels with the user’s specific configuration already
preloaded into the devices. By virtue of its standard interface, compatibility is maintained with existing production
programming equipment, giving customers a wide degree of freedom and flexibility in production planning.
Evaluation Fixture
Included in the basic ispClock5600 Design Kit is an engineering prototype board that can be connected to the par-
allel port of a PC using a Lattice ispDOWNLOAD® cable. It demonstrates proper layout techniques for the
ispClock5600 and can be used in real time to check circuit operation as part of the design process. Input and out-
put connections (SMA connectors for all RF signals) are provided to aid in the evaluation of the ispClock5600 for a
given application. (Figure 29).
Figure 29. Download from a PC
Part Number Description
PAC-SYSTEMCLK5620 Complete system kit, evaluation board, ispDOWNLOAD cable and software.
PACCLK5620-EV Evaluation board only, with components, fully assembled.
ispDownload
Cable (6')
4
Other
System
Circuitry
ispClock5600
Device
PAC-Designer
Software
Lattice Semiconductor ispClock5600 Family Data Sheet
36
IEEE Standard 1149.1 Interface (JTAG)
Serial Port Programming Interface Communication with the ispClock5600 is facilitated via an IEEE 1149.1 test
access port (TAP). It is used by the ispClock5600 both as a serial programming interface, and for boundary scan
test purposes. A brief description of the ispClock5600 JTAG interface follows. For complete details of the reference
specification, refer to the publication, Standard Test Access Port and Boundary-Scan Architecture, IEEE Std.
1149.1-1990 (which now includes IEEE Std. 1149.1a-1993).
Overview
An IEEE 1149.1 test access port (TAP) provides the control interface for serially accessing the digital I/O of the
ispClock5600. The TAP controller is a state machine driven with mode and clock inputs. Given in the correct
sequence, instructions are shifted into an instruction register which then determines subsequent data input, data
output, and related operations. Device programming is performed by addressing the configuration register, shifting
data in, and then executing a program configuration instruction, after which the data is transferred to internal
E2CMOS cells. It is these non-volatile cells that store the configuration or the ispClock5600. A set of instructions
are defined that access all data registers and perform other internal control operations. For compatibility between
compliant devices, two data registers are mandated by the IEEE 1149.1 specification. Others are functionally spec-
ified, but inclusion is strictly optional. Finally, there are provisions for optional data registers defined by the manu-
facturer. The two required registers are the bypass and boundary-scan registers. Figure 30 shows how the
instruction and various data registers are organized in an ispClock5600.
Figure 30. ispClock5600 TAP Registers
TAP Controller Specifics
The TAP is controlled by the Test Clock (TCK) and Test Mode Select (TMS) inputs. These inputs determine whether
an Instruction Register or Data Register operation is performed. Driven by the TCK input, the TAP consists of a
small 16-state controller design. In a given state, the controller responds according to the level on the TMS input as
shown in Figure 31. Test Data In (TDI) and TMS are latched on the rising edge of TCK, with Test Data Out (TDO)
becoming valid on the falling edge of TCK. There are six steady states within the controller: Test-Logic-Reset, Run-
ADDRESS REGISTER (10 BITS)
E2CMOS
NON-VOLATILE
MEMORY
UES REGISTER (32 BITS)
IDCODE REGISTER (32 BITS)
BYPASS REGISTER (1 BIT)
INSTRUCTION REGISTER (8 BITS)
TEST ACCESS PORT (TAP)
LOGIC
OUTPUT
LATCH
TDI TCK TMS TDO
B-SCAN REGISTER (56 BITS)
MULTIPLEXER
DATA REGISTER (90 BITS)
Lattice Semiconductor ispClock5600 Family Data Sheet
37
Test/Idle, Shift-Data-Register, Pause-Data-Register, Shift-Instruction-Register and Pause-Instruction-Register. But
there is only one steady state for the condition when TMS is set high: the Test-Logic-Reset state. This allows a
reset of the test logic within five TCKs or less by keeping the TMS input high. Test-Logic-Reset is the power-on
default state.
Figure 31. TAP States
When the correct logic sequence is applied to the TMS and TCK inputs, the TAP will exit the Test-Logic-Reset state
and move to the desired state. The next state after Test-Logic-Reset is Run-Test/Idle. Until a data or instruction shift
is performed, no action will occur in Run-Test/Idle (steady state = idle). After Run-Test/Idle, either a data or instruc-
tion shift is performed. The states of the Data and Instruction Register blocks are identical to each other differing
only in their entry points. When either block is entered, the first action is a capture operation. For the Data Regis-
ters, the Capture-DR state is very simple: it captures (parallel loads) data onto the selected serial data path (previ-
ously chosen with the appropriate instruction). For the Instruction Register, the Capture-IR state will always load
the IDCODE instruction. It will always enable the ID Register for readout if no other instruction is loaded prior to a
Shift-DR operation. This, in conjunction with mandated bit codes, allows a “blind” interrogation of any device in a
compliant IEEE 1149.1 serial chain. From the Capture state, the TAP transitions to either the Shift or Exit1 state.
Normally the Shift state follows the Capture state so that test data or status information can be shifted out or new
data shifted in. Following the Shift state, the TAP either returns to the Run-Test/Idle state via the Exit1 and Update
states or enters the Pause state via Exit1. The Pause state is used to temporarily suspend the shifting of data
through either the Data or Instruction Register while an external operation is performed. From the Pause state,
shifting can resume by reentering the Shift state via the Exit2 state or be terminated by entering the Run-Test/Idle
state via the Exit2 and Update states. If the proper instruction is shifted in during a Shift-IR operation, the next entry
into Run-Test/Idle initiates the test mode (steady state = test). This is when the device is actually programmed,
erased or verified. All other instructions are executed in the Update state.
Test Instructions
Like data registers, the IEEE 1149.1 standard also mandates the inclusion of certain instructions. It outlines the
function of three required and six optional instructions. Any additional instructions are left exclusively for the manu-
Test-Logic-Rst
Run-Test/Idle Select-DR-Scan Select-IR-Scan
Capture-DR Capture-IR
Shift-DR Shift-IR
Exit1-DR Exit1-IR
Pause-DR Pause-IR
Exit2-DR Exit2-IR
Update-DR Update-IR
1
0
00
00
00
11
00
00
11
11
0011
00
11
11
11 1
0
Note: The value shown adjacent to each state transition in this figure
represents the signal present at TMS at the time of a rising edge at TCK.
Lattice Semiconductor ispClock5600 Family Data Sheet
38
facturer to determine. The instruction word length is not mandated other than to be a minimum of two bits, with only
the BYPASS and EXTEST instruction code patterns being specifically called out (all ones and all zeroes respec-
tively). The ispClock5000 contains the required minimum instruction set as well as one from the optional instruction
set. In addition, there are several proprietary instructions that allow the device to be configured and verified. For
ispClock5000, the instruction word length is eight bits. All ispClock5000 instructions available to users are shown in
Table 9.
The following table lists the instructions supported by the ispClock5600 JTAG Test Access Port (TAP) controller:
Table 9. ispClock5600 TAP Instruction Table
BYPASS is one of the three required instructions. It selects the Bypass Register to be connected between TDI and
TDO and allows serial data to be transferred through the device without affecting the operation of the
ispClock5600. The IEEE 1149.1 standard defines the bit code of this instruction to be all ones (111111).
The required SAMPLE/PRELOAD instruction dictates the Boundary-Scan Register be connected between TDI
and TDO. The bit code for this instruction is defined by Lattice as shown in Table 9.
The EXTEST (external test) instruction is required and will place the device into an external boundary test mode
while also enabling the boundary scan register to be connected between TDI and TDO. The bit code of this instruc-
tion is defined by the 1149.1 standard to be all zeros (000000).
The optional IDCODE (identification code) instruction is incorporated in the ispClock5600 and leaves it in its func-
tional mode when executed. It selects the Device Identification Register to be connected between TDI and TDO.
The Identification Register is a 32-bit shift register containing information regarding the IC manufacturer, device
Instruction Code Description
EXTEST 0000 0000 External Test.
ADDRESS_SHIFT 0000 0001 Address register (10 bits)
DATA_SHIFT 0000 0010 Address column data register (89 bits)
BULK_ERASE 0000 0011 Bulk Erase
PROGRAM 0000 0111 Program column data register to E2
PROGRAM_SECURITY 0000 1001 Program Electronic Security Fuse
VERIFY 0000 1010 Verify column
DISCHARGE 0001 0100 Fast VPP Discharge
PROGRAM_ENABLE 0001 0101 Enable Program Mode
IDCODE 0001 0110 Address Manufacturer ID code register (32 bits)
USERCODE 0001 0111 Read UES data from E2 and addresses UES register (32 bits)
PROGRAM_USERCODE 0001 1010 Program UES register into E2
PROGRAM_DISABLE 0001 1110 Disable Program Mode
HIGHZ 0001 1000 Force all outputs to High-Z state
SAMPLE/PRELOAD 0001 1100 Capture current state of pins to boundary scan register
CLAMP 0010 0000 Drive I/Os with boundary scan register
USER_LOGIC_RESET 0010 0010 Resets User Logic
INTEST 0010 1100 Performs in-circuit functional testing of device.
ERASE DONE 0010 0100 Erases the ‘Done’ bit only
PROG_INCR 0010 0111 Program column data register to E2 and auto-increment address register
VERIFY_INCR 0010 1010 Load column data register from E2 and auto-increment address register
PROGRAM_DONE 0010 1111 Programs the ‘Done’ Bit
NOOP 0011 0000 Functions Similarly to CLAMP instruction
BYPASS 1xxx xxxx Bypass - Connect TDO to TDI
Lattice Semiconductor ispClock5600 Family Data Sheet
39
type and version code (Figure 32). Access to the Identification Register is immediately available, via a TAP data
scan operation, after power-up of the device, or by issuing a Test-Logic-Reset instruction. The bit code for this
instruction is defined by Lattice as shown in Table 9.
Figure 32. ispClock5600 Family ID Codes
In addition to the four instructions described above, there are 20 unique instructions specified by Lattice for the
ispClock5620. These instructions are primarily used to interface to the various user registers and the E2CMOS non-
volatile memory. Additional instructions are used to control or monitor other features of the device, including bound-
ary scan operations. A brief description of each unique instruction is provided in detail below, and the bit codes are
found in Table 9.
PROGRAM_ENABLEThis instruction enables the ispClock5600’s programming mode.
PROGRAM_DISABLEThis instruction disables the ispClock5600’s programming mode.
BULK_ERASEThis instruction will erase all E2CMOS bits in the device, including the UES data and electronic
security fuse (ESF). A bulk erase instruction must be issued before reprogramming a device. The device must
already be in programming mode for this instruction to execute.
ADDRESS_SHIFTThis instruction shifts address data into the address register (10 bits) in preparation for either
a PROGRAM or VERIFY instruction.
DATA_SHIFTThis instruction shifts data into or out of the data register (90 bits), and is used with both the PRO-
GRAM and VERIFY instructions.
PROGRAMThis instruction programs the contents of the data register to the E2CMOS memory column pointed
to by the address register. The device must already be in programming mode for this instruction to execute.
PROG_INCRThis instruction first programs the contents of the data register into E2CMOS memory column
pointed to by the address register and then auto-increments the value of the address register. The device must
already be in programming mode for this instruction to execute.
PROGRAM_SECURITYThis instruction programs the electronic security fuse (ESF). This prevents data other
than the ID code and UES strings from being read from the device. The electronic security fuse may only be reset
by issuing a BULK_ERASE command. The device must already be in programming mode for this instruction to exe-
cute.
XXXX / 0000 0001 0110 0001 / 0000 0100 001 / 1
MSB LSB
Part Number
(16 bits)
0161h = ispClock5610
(3.3V version)
Version
(4 bits)
E2 Configured
JEDEC Manufacturer
Identity Code for
Lattice Semiconductor
(11 bits)
Constant ‘1’
(1 bit)
per 1149.1-1990
XXXX / 0000 0001 0110 0000 / 0000 0100 001 / 1
MSB LSB
Part Number
(16 bits)
0160h = ispClock5620
(3.3V version)
Version
(4 bits)
E2 Configured
JEDEC Manufacturer
Identity Code for
Lattice Semiconductor
(11 bits)
Constant ‘1’
(1 bit)
per 1149.1-1990
Lattice Semiconductor ispClock5600 Family Data Sheet
40
VERIFYThis instruction loads data from the E2CMOS array into the column register. The data may then be
shifted out. The device must already be in programming mode for this instruction to execute.
VERIFY_INCRThis instruction copies the E2CMOS column pointed to by the address register into the data col-
umn register and then auto-increments the value of the address register. The device must already be in program-
ming mode for this instruction to execute.
DISCHARGEThis instruction is used to discharge the internal programming supply voltage after an erase or pro-
gramming cycle and prepares ispClock5600 for a read cycle.
PROGRAM_USERCODEThis instruction writes the contents of the UES register (32 bits) into E2CMOS memory.
The device must already be in programming mode for this instruction to execute.
USERCODEThis instruction both reads the UES string (32 bits) from E2CMOS memory into the UES register
and addresses the UES register so that this data may be shifted in and out.
HIGHZThis instruction forces all outputs into a High-Z state.
CLAMPThis instruction drives I/O pins with the contents of the boundary scan register.
USER_LOGIC_RESETThis instruction resets all user-accessible logic, similar to asserting a HIGH on the
RESET pin.
INTESTThis instruction performs in-circuit functional testing of the device.
ERASE_DONEThis instruction erases the ‘DONE’ bit only. This instruction is used to disable normal operation of
the device while in programming mode until a valid configuration pattern has been programmed.
PROGRAM_DONEThis instruction programs the ‘DONE’ bit only. This instruction is used to enable normal
device operation after programming is complete.
NOOPThis instruction behaves similarly to the CLAMP instruction.
Lattice Semiconductor ispClock5600 Family Data Sheet
41
Pin Descriptions
Pin Name Description Pin Type
Pin Number
ispClock5610
48 TQFP
ispClock5620
100 TQFP
VCCO_0 Output Driver ‘0’ VCC Power 1 3
VCCO_1 Output Driver ‘1’ VCC Power 5 7
VCCO_2 Output Driver ‘2’ VCC Power 9 11
VCCO_3 Output Driver ‘3’ VCC Power 25 15
VCCO_4 Output Driver ‘4’ VCC Power 29 19
VCCO_5 Output Driver ‘5’ VCC Power 51
VCCO_6 Output Driver ‘6’ VCC Power 55
VCCO_7 Output Driver ‘7’ VCC Power 59
VCCO_8 Output Driver ‘8’ VCC Power 63
VCCO_9 Output Driver ‘9’ VCC Power 67
GNDO_0 Output Driver ‘0’ Ground GND 4 6
GNDO_1 Output Driver ‘1’ Ground GND 8 10
GNDO_2 Output Driver ‘2’ Ground GND 12 14
GNDO_3 Output Driver ‘3’ Ground GND 28 18
GNDO_4 Output Driver ‘4’ Ground GND 32 22
GNDO_5 Output Driver ‘5’ Ground GND 54
GNDO_6 Output Driver ‘6’ Ground GND 58
GNDO_7 Output Driver ‘7’ Ground GND 62
GNDO_8 Output Driver ‘8’ Ground GND 66
GNDO_9 Output Driver ‘9’ Ground GND 70
BANK_0A Clock Output driver 0, ‘A’ output Output 3 5
BANK_0B Clock Output driver 0, ‘B’ output Output 2 4
BANK_1A Clock Output driver 1, ‘A’ output Output 7 9
BANK_1B Clock Output driver 1, ‘B’ output Output 6 8
BANK_2A Clock Output driver 2, ‘A’ output Output 11 13
BANK_2B Clock Output driver 2, ‘B’ output Output 10 12
BANK_3A Clock Output driver 3, ‘A’ output Output 27 17
BANK_3B Clock Output driver 3, ‘B’ output Output 26 16
BANK_4A Clock Output driver 4, ‘A’ output Output 31 21
BANK_4B Clock Output driver 4, ‘B’ output Output 30 20
BANK_5A Clock Output driver 5, ‘A’ output Output 53
BANK_5B Clock Output driver 5, ‘B’ output Output 52
BANK_6A Clock Output driver 6, ‘A’ output Output 57
BANK_6B Clock Output driver 6, ‘B’ output Output 56
BANK_7A Clock Output driver 7, ‘A’ output Output 61
BANK_7B Clock Output driver 7, ‘B’ output Output 60
BANK_8A Clock Output driver 8, ‘A’ output Output 65
BANK_8B Clock Output driver 8, ‘B’ output Output 64
BANK_9A Clock Output driver 9, ‘A’ output Output 69
BANK_9B Clock Output driver 9, ‘B’ output Output 68
VCCA Analog VCC for PLL circuitry Power 13 30
GNDA Analog Ground for PLL circuitry GND 14 31
Lattice Semiconductor ispClock5600 Family Data Sheet
42
VCCD Digital Core VCC Power 24, 33 47, 71
GNDD Digital GND GND 23, 48 46, 93
VCCJ JTAG interface VCC Power 36 74
REFA+ Clock Reference A positive input Input 18 38
REFA- Clock Reference A negative input Input 19 39
REFB+ Clock Reference B positive input Input 42
REFB- Clock Reference B negative input Input 41
REFSEL Clock Reference Select input (LVCMOS) Input
1
—43
REFVTT Termination voltage for reference inputs Power 20 40
FBKA+ Clock feedback A positive input Input 15 32
FBKA- Clock feedback A negative input Input 16 33
FBKB+ Clock feedback B positive input Input 36
FBKB- Clock feedback B negative input Input 35
FBKSEL Clock feedback select input (LVCMOS) Input
1
—37
FBKVTT Termination voltage for feedback inputs Power 17 34
TDO JTAG TDO Output line Output 35 73
TDI JTAG TDI Input line Input
2
39 84
TCK JTAG Clock Input Input 38 83
TMS JTAG Mode Select Input
2
37 82
LOCK PLL Lock indicator, LOW indicates PLL lock Output 34 72
SGATE Synchronous output gate Input
1
40 85
GOE Global Output Enable Input
1
42 87
OEX Output Enable 1 Input 21 44
OEY Output Enable 2 Input 22 45
PS0 Profile Select 0 Input
1
44 89
PS1 Profile Select 1 Input
1
43 88
PLL_BYPASS PLL Bypass Input
1
47 92
RESET Reset PLL Input
1
41 86
TEST1 Test Input 1 - connect to GNDD Input 46 91
TEST2 Test Input 2 - connect to GNDD Input 45 90
n/c No internal connection n/a
1, 2, 23, 24, 25, 26, 27,
28, 29, 48, 49, 50, 75,
76, 77, 78, 79, 94, 97,
98, 99, 100
Reserved Factory use only - Do not connect n/a 80, 81, 95, 96
1. Internal pull-down resistor.
2. Internal pull-up resistor.
Pin Descriptions (Continued)
Pin Name Description Pin Type
Pin Number
ispClock5610
48 TQFP
ispClock5620
100 TQFP
Lattice Semiconductor ispClock5600 Family Data Sheet
43
Detailed Pin Descriptions
VCCO_[0..9], GNDO_[0..9]
These pins provide power and ground for each of the output banks. In the case when
an output bank is unused, its corresponding VCCO pin may be left unconnected or preferably should be tied to
ground. ALL GNDO pins should be tied to ground regardless of whether the associated bank is used or not. When
a bank is used, it should be individually bypassed with a capacitor in the range of 0.01 to 0.1uF as close to its
VCCO and GNDO pins as is practical.
BANK_[0..9]A, BANK_[0..9]B
These pins provide clock output signals. The choice of output divider (V0-V4) and
output driver type (CMOS, LVDS, SSTL, etc.) may be selected on a bank-by-bank basis. When the outputs are con-
figured as pairs of single-ended outputs, output impedance and slew rate may be selected on an output-by-output
basis.
VCCA, GNDA
These pins provide analog supply and ground for the ispClock5600 family’s internal analog cir-
cuitry, and should be bypassed with a 0.1uF capacitor as close to the pins as is practical. To improve noise immu-
nity, it is suggested that the supply to the VCCA pin be isolated from other circuitry with a ferrite bead.
VCCD, GNDD
These pins provide digital supply and ground for the ispClock5600 family’s internal digital circuitry,
and should be bypassed with a 0.1uF capacitor as close to the pins as is practical. to improve noise immunity it is
suggested that the supply to the VCCD pins be isolated with ferrite beads.
VCCJ
This pin provides power and a reference voltage for use by the JTAG interface circuitry. It may be set to
allow the ispClock5600 family devices to function in JTAG chains operating at voltages differing from VCCD.
REFA+, REFA-, REFB+, REFB-
These input pins provide the inputs for clock signals, and can accommodate
either single ended or differential signal protocols by using either just the ‘+’ pins, or both the ‘+’ and ‘-’ pins. Two
sets of inputs are provided to accommodate the use of different signal sources and redundant clock sources.
REFSEL
This input pin is used to select which clock input pair (REFA+/- or REB+/-) is selected for use as the ref-
erence input. When REFSEL=0, REFA+/- is used, and when REFSEL=1, REFB+/- is used.
REFVTT
This pin is used to provide a termination voltage for the reference inputs when they are configured for
SSTL or HSTL logic, and should be connected to a suitable voltage supply in those cases.
FBKA+, FBKA-, FBKB+, FBKB-
These input pins provide the inputs for feedback sense of output clock signals,
and can accommodate either single ended or differential signal protocols by using either just the ‘+’ pins, or both
the ‘+’ and ‘-’ pins. Two sets of inputs are provided to accommodate the use of alternate feedback signal sources.
FBKSEL
This input pin is used to select which clock input pair (FBKA+/- or FBK+/-) is selected for use as the
feedback input. When FBKSEL=0, FBKA+/- is used, and when FBKSEL=1, FBKB+/- is used.
FBKVTT
This pin is used to provide a termination voltage for the feedback inputs when they are configured for
SSTL or HSTL logic, and should be connected to a suitable voltage supply in those cases.
TDO, TDI, TCK, TMS
These pins comprise the ispClock5600 device’s JTAG interface. The signal levels for these
pins are determined by the selection of the VCCJ voltage.
LOCK
This output pin indicates that the device’s PLL is in a locked condition when it goes low.
SGATE
This input pin provides a synchronous gating function for the outputs, which may be enabled on a bank-
by-bank basis. When the synchronous gating function is enabled for a given bank, that bank’s outputs will output a
clock signal when the SGATE pin is HIGH, and will drive a constant HIGH or LOW when the SGATE pin is LOW.
Synchronous gating ensures that when the state of SGATE is changed, no partial clock pulses will appear at the
outputs.
OEX, OEY
These pins are used to enable the outputs or put them into a high-impedance condition. Each output
may be set so that it is always on, always off, enabled by OEX or enabled by OEY.
Lattice Semiconductor ispClock5600 Family Data Sheet
44
GOE – Global output enable. This pin drives all outputs to a high-impedance state when it is pulled HIGH. GOE
also controls the internal feedback buffer, so that bringing GOE high will cause the PLL to lose lock.
PS0, PS1These input pins are used to select one of four user-defined configuration profiles for the device.
PLL_BYPASSWhen this pin is pulled LOW, the V-dividers are driven from the output of the device’s VCO, and
the device behaves as a phase-locked loop. When this pin is pulled HIGH, the V-dividers are driven directly from
the output of the M-divider, and the PLL functions are effectively bypassed.
RESETWhen this pin is pulled HIGH, all on-board counters are reset, and lock is lost.
TEST1,TEST2These pins are used for factory test functions, and should always be tied to ground.
n/cThese pins have no internal connection. We recommend that they be left unconnected.
RESERVEDThese pins are reserved for factory use and should be left unconnected.
Lattice Semiconductor ispClock5600 Family Data Sheet
45
Package Diagrams
48-Pin TQFP (Dimensions in Millimeters)
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
TO THE LOWEST POINT ON THE PACKAGE BODY.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
BASE METAL
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
8.
OF THE PACKAGE BY 0.15 MM.
DIMENSIONS.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
6. SECTION B-B:
3.
1
b
0.220.17b 0.27
0.16
0.23
0.200.09c
c1 0.09
b1 0.17
0.15
0.13
0.20
MAX.
1.60
0.15
0.75
1.45
e
N
L0.45
0.50 BSC
0.60
48
E1
E
D1
D
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
A2
A1
1.35
0.05
SYMBOL
A-
MIN.
1.40
-
NOM.
-
C A-B D
SEE DETAIL "A"
LEAD FINISH
C SEATING PLANE
A
3.
0.08
c
b
1
c
MC
b
A-B D
3.
D
4X
8.
e
B3.
E
D
0.20
GAUGE PLANE
A1
0.08 C
AA2
1.00 REF.
L
0.20 MIN.
B
0-7
B
H
E1
0.25
0.20 DA-BHD1
SECTION B - B
DETAIL "A"
NOTES:
PIN 1 INDICATOR
1
N
Lattice Semiconductor ispClock5600 Family Data Sheet
46
100-Pin TQFP (Dimensions in Millimeters)
B
LEAD FINISH
BASE METAL
5. THE TOP OF PACKAGE MAY BE SMALLER THAN THE BOTTOM
4. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
DATUMS A, B AND D TO BE DETERMINED AT DATUM PLANE H.
ALLOWABLE MOLD PROTRUSION IS 0.254 MM ON D1 AND E1
2. ALL DIMENSIONS ARE IN MILLIMETERS.
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5 - 1982.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
7. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT ON THE PACKAGE BODY.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8.
DIMENSIONS.
OF THE PACKAGE BY 0.15 MM.
6. SECTION B-B:
3.
SECTION B-B
b1
c
b
c
1
0.160.130.09c1
0.50 BSC
0.17
0.09c
b1
0.17b
e
0.15
0.20
0.20
0.23
0.22 0.27
14.00 BSC
16.00 BSC
0.45
N
L
E1
E
100
0.60 0.75
14.00 BSC
16.00 BSC
D1
D
0.05
1.35A2
A1
1.40
-
1.45
0.15
SYMBOL
DETAIL 'A'
A1
0.10 C
MIN.
A--
NOM.
1.60
MAX.
0.20 MIN.
1.00 REF.
0-7
L
B
SIDE VIEW
SEATING PLANE
0.20 C
MDA-B
b
TOP VIEW
8
e
D
A
3
D
GAUGE PLANE
SEE DETAIL 'A'
C
A A2
0.204X A-BH D
H
0.25
BOTTOM VIEW
3
3
B
E1
E
D1
0.20 A-BCD 100X
NOTES:
PIN 1 INDICATOR
Lattice Semiconductor ispClock5600 Family Data Sheet
47
Part Number Description
Ordering Information
Conventional Packaging
Commercial
Industrial
Lead-Free Packaging
Commercial
Industrial
Part Number Clock Outputs Supply Voltage Package Pins
ispPAC-CLK5610V-01T48C 10 3.3V TQFP 48
ispPAC-CLK5620V-01T100C 20 3.3V TQFP 100
Part Number Clock Outputs Supply Voltage Package Pins
ispPAC-CLK5610V-01T48I 10 3.3V TQFP 48
ispPAC-CLK5620V-01T100I 20 3.3V TQFP 100
Part Number Clock Outputs Supply Voltage Package Pins
ispPAC-CLK5610V-01TN48C 10 3.3V Lead-Free TQFP 48
ispPAC-CLK5620V-01TN100C 20 3.3V Lead-Free TQFP 100
Part Number Clock Outputs Supply Voltage Package Pins
ispPAC-CLK5610V-01TN48I 10 3.3V Lead-Free TQFP 48
ispPAC-CLK5620V-01TN100I 20 3.3V Lead-Free TQFP 100
ispPAC-CLK56XX X - 01 XXXX X
Grade
I = Industrial Temp. Range
C = Commercial Temp. Range
Package
T48 = 48-pin TQFP
T100 = 100-pin TQFP
TN48 = Lead-Free 48-pin TQFP
TN100 = Lead-Free100-pin TQFP
Device Number
CLK5610
CLK5620
Operating Voltage
V = 3.3V
Performance Grade
01 = Standard
Device Family
Lattice Semiconductor ispClock5600 Family Data Sheet
48
Package Options
ispClock5610: 48-pin TQFP
ispPAC-
CLK5610V-01T48C
VCCO_0
BANK_0A
BANK_0B
GNDO_0
VCCO_1
BANK_1A
BANK_1B
GNDO_1
VCCO_2
BANK_2A
BANK_2B
GNDO_2
VCCA
GNDA
FBKA+
FBKA-
FBKVTT
REFA+
REFA-
REFVTT
OEX
OEY
GNDD
VCCD
VCCO_3
BANK_3A
BANK_3B
GNDO_3
VCCO_4
BANK_4A
BANK_4B
GNDO_4
VCCD
LOCK
TDO
VCCJ
TMS
PS0
TCK
TDI
SGATE
RESET
GOE
PS1
TEST2
TEST1
PLL_BYPASS
GNDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
Lattice Semiconductor ispClock5600 Family Data Sheet
49
ispClock5620: 100-pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
ispPAC-CLK5620V-01T100C
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
n/c
Reserved
Reserved
n/c
n/c
n/c
n/c
n/c
Reserved
Reserved
VCCO_0
BANK_0A
BANK_0B
GNDO_0
VCCO_1
BANK_1A
BANK_1B
GNDO_1
VCCO_2
BANK_2A
BANK_2B
GNDO_2
VCCO_3
BANK_3A
BANK_3B
GNDO_3
VCCO_4
BANK_4A
BANK_4B
GNDO_4
VCCA
GNDA
FBKA+
FBKA-
FBKVTT
FBKB-
FBKB+
REF A+
REFA-
REF VTT
REFB-
REF B+
RFSEL
OEX
OEY
GNDD
VCCD
FBSEL
VCCO_5
BANK_5A
BANK_5B
GNDO_5
VCCO_6
BANK_6A
BANK_6B
GNDO_6
VCCO_7
BANK_7A
BANK_7B
GNDO_7
VCCO_8
BANK_8A
BANK_8B
GNDO_8
VCCO_9
BANK_9A
BANK_9B
GNDO_9
VCCD
LOCK
TDO
VCCJ
TMS
PS0
TCK
TDI
SGATE
RESET
GOE
PS1
TEST2
TEST1
PLL_BYPASS
GNDD