TCD1001P TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) TCD1001P The TCD1001P is a high sensitive and low dark current 128-elements linear image sensor which includes CCD drive circuit, clamp circuit and sample & hold circuit. The CCD drive circuit consists of the pulse generator therefore it is possible to easy drive by applying simple pulses. The sensor is designed for scanner. FEATURES Number of Image Sensing Elements : 128 elements Image Sensing Element Size : 32mx32m on 32m centers Weight: 1.0g (typ.) Photo Sensing Region : High sensitive pn photodiode Clock : 3 Input pulses 5V Internal Circuit : Sample & Hold circuit, Clamp circuit Package : 20 pin MAXIMUM RATINGS CHARACTERISTIC PIN CONNECTION SYMBOL Master Clock Voltage VM Clock Pulse Voltage V Shift Pulse Voltage VSH Power Supply Voltage (Analog) VAD Power Supply Voltage (Digital) VDD1 RATING UNIT -0.3~8 V -0.3~15 V -0.3~15 V VDD2 Sample & Hold Switch Voltage VSP Operating Temperature Topr 0~60 C Storage Temperature Tstg -25~85 C Note 1: All voltage are with respect to SS terminals(Ground). (TOP VIEW) 1 2002-03-08 TCD1001P CIRCUIT DIAGRAM PIN NAMES M Master Clock VAD Power (Analog) 1 Clock (Phase 1) VDD1 Power (Digital, 12V) 2 Clock (Phase 2) VDD2 Power (Digital, 12V) SH Shift Gate SS Ground (Analog) OS Signal Output SS1 Ground (Digital, 12V) Compensation Output SS2 Ground (Digital, 12V) Non Connection VSP Sample and Hold Switch DOS NC 2 2002-03-08 TCD1001P OPTICAL / ELECTRICAL CHARACTERISTICS (Ta = 25C, VAD = VDD1 = VDD2 = 12V, VM = V = VSH = 5V (PULSE), f = 1.0MHz, tINT (INTEGRATION TIME) = 10ms, LIGHT SOURCE = DAYLIGHT FLUORESCENT LAMP, LOAD RESISTANCE = 100k) CHARACTERISTICS SYMBOL MIN TYP. MAX UNIT R 63.7 85 106 V / lx*s PRNU (1) 10 % (Note 2) PRNU (3) 3 12 mV (Note 3) Sensitivity Photo Response Non Uniformity Saturation Output Voltage NOTE VSAT 1.2 2.0 V (Note 4) Saturation Exposure SE 0.02 lx*s (Note 5) Dark Signal Voltage VDRK 4 8 mV (Note 6) Dark Signal Non Uniformity DSNU 2 5 mV (Note 6) Analog Current Dissipation IAD 8.0 12 mA IDD1 1 mA IDD2 10.0 15 mA Total Transfer Efficiency TTE 92 % Output Impedance ZO 0.5 1.0 k VOS 3.5 5.0 6.5 V (Note 7) VDOS 3.5 5.0 6.5 V (Note 7) |VOS-VDOS| 400 mV Digital Current Dissipation DC Signal Output Voltage DC Compensation Output Voltage DC Differential Error Voltage Note 2: PRNU (1) is measured at 50% of SE (Typ.) Definition of PRNU : PRNU = x 100(%) Where is average of total signal outputs and is the maximum deviation from under uniform illumination. Note 3: PRNU (3) is defined as maximum voltage with next pixel where measured 5% of SE (Typ.) Note 4: VSAT is defined as minimum Saturation Output Voltage of all effective pixels. Note 5: Definition of SE : SE = VSAT (lx s) R Note 6: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage. 3 2002-03-08 TCD1001P Note 7: DC signal output voltage and DC compensation output voltage are defined as follows: OPERATING CONDITION CHARACTERISTICS Master Clock Pulse Voltage Clock Pulse Voltage SYMBOL "H" Level "L" Level 4.5 5.0 5.5 0 0.5 4.5 5.0 5.5 "L" Level V2 0 0.5 V-0.5 V V 0 0.5 4.5 5.0 13.0 0 0.5 VAD 11.4 12.0 13.0 VDD1 11.4 12.0 13.0 VDD2 11.4 12.0 13.0 "H" Level "L" Level Power Supply Voltage (Analog) Power Supply Voltage (Digital) *: MAX V1 "L" Level Sample and Hold Switch Voltage* TYP. "H" Level "H" Level Shift Pulse Voltage VM MIN VSH VSP UNIT V V V V V V Supply "H" Level to VSP terminal when sample-and-hold circuit is used, when sample-and-hold circuit is not used supply "L" Level to VSP terminal. CLOCK CHARACTERISTICS (Ta = 25C) CHARACTERISTICS Master Clock Pulse Frequency Clock Pulse Frequency Master Clock Pulse Capacitance Clock Capacitance Shift Gate Capacitance 4 SYMBOL MIN TYP. MAX UNIT fM 2.0 6.0 MHz f 1.0 3.0 MHz CM 10 20 pF C 100 200 pF CSH 50 100 pF 2002-03-08 TIMING CHART TCD1001P 5 2002-03-08 TCD1001P TIMING REQUIREMENS 6 2002-03-08 TCD1001P SYMBOL MIN TYP. (Note 2) MAX UNIT t1 60 300 ns t5 0 300 ns t2, t4 0 50 ns SH Pulse Width t3 300 1000 ns Pulse Timing of SH and M t6 20 50 ns CHARACTERISTICS Pulse Timing of SH and 1, 2 SH Pulse Rise Time, Fall Time 1, 2 Pulse Rise Time, Fall Time Pulse Timing of 1, 2 and M M Pulse Rise Time, Fall Time M Pulse Width Video Data Delay Time (Note 3) S / H Video Data Delay Time t9, t10 0 20 ns t11, t13 20 100 ns t8, t12, t14 40 100 ns t7, t15, t16 0 20 ns t17, t18 80 250 ns t19 45 ns t20, t21 70 ns Note 2: TYP. is the case of f = 1MHz. Note 3: Load Resistance is 100k. 7 2002-03-08 TCD1001P TYPICAL DRIVE CIRCUIT 8 2002-03-08 TCD1001P CAUTION 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C. 9 2002-03-08 TCD1001P PACKAGE DIEMENSIONS Unit : mm Note1: Note2: Note3: Note4: Note5: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. TOP OF CHIP TO BOTTOM OF PACKAGE. TOP OF CHIP TO OF PACKAGE. GLASS THICKNESS (n = 1.5) No. 1 SENSOR ELEMENT (S1) TO CENTER OF No. 1 PIN. Weight: 1.0g (typ.) 10 2002-03-08 TCD1001P RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 11 2002-03-08