Data Sheet
Broadcom AV02-3873EN
October 9, 2018
Description
This family of SMT LEDs is packaged in the form of PLCC-6
with a separate heat path for each LED die, enabling it to be
driven at a higher current.
Individually addressable pin-outs give higher flexibility in
circuitry design. With closely matched radiation pattern
along the package’s X-axis, these LEDs are suitable for
indoor full color display applications.
For easy pick-and-place, the LEDs are shipped in tape and
reel. Every reel is shipped from a single intensity and color
bin for better uniformity.
These LEDs are compatible with reflow soldering process.
CAUTION! These LEDs are Class 1C ESD sensitive.
Please observe appropriate precautions during
handling and processing. Refer to Broadcom®
Application Note AN-1142 for additional details.
CAUTION! Customers should keep the LED in the
moisture barrier bag (MBB) when not in use
because prolonged exposure to the
environment might cause the silver-plated
leads to tarnish, which might cause difficulties
in soldering.
Features
Standard PLCC-6 package (Plastic Leaded Chip
Carrier) with individual addressable pin-out for higher
flexibility of driving configuration
LED package with diffused silicone encapsulation
Using AlInGaP and InGaN dice technologies
Typical viewing angle 110°
Compatible with reflow soldering process
JEDEC MSL 3
Water-Resistance (IPX6, see note) per IEC 60529:2001
NOTE: The test is conducted at the component level by
mounting the components on the PCB with proper
porting to protect the leads. Customers should
perform the necessary tests on the components
for their final applications.
Applications
Full color display
ASMT-YTD7-0AA02
Tricolor PLCC6 White Surface LED
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Package Dimensions
Lead Configuration
NOTE:
1. All dimensions are in millimeters (mm).
2. Unless otherwise specified, tolerance is ± 0.20 mm.
3. Encapsulation = silicone.
4. Terminal finish = silver plating.
1 Cathode (Blue)
2 Cathode (Green)
3 Cathode (Red)
4 Anode (Red)
5 Anode (Green)
6 Anode (Blue)
1
6
5
43
2
1
2.3 ± 0.2
3.4 ± 0.2
3.0 ± 0.2
2.30 ± 0.2
2.8 ± 0.2
0.35 ± 0.2
0.2 ± 0.2
0.8 ± 0.2
0.9 ± 0.2
1.8 ± 0.2
0.5 ± 0.2
Blue
Green
Red
6
52
4 3
Package
Marking
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Absolute Maximum Ratings
TJ = 25°C.
Optical Characteristics
TJ = 25°C.
Electrical Characteristics
TJ = 25°C.
Parameter Red Green and Blue Unit
DC forward currenta
a. Derate linearly as shown in Figure 7 to Figure 10.
50 25 mA
Peak forward current b
b. Duty Factor = 10%, frequency = 1 kHz.
100 100 mA
Power dissipation 125 90 mW
Maximum junction temperature Tj max 110 °C
Operating temperature range –40 to + 100 °C
Storage temperature range –40 to +100 °C
Color
Luminous Intensity,
IV (mcd) @ IF=20 mA
a
a. The luminous intensity Iv is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the
spatial radiation pattern may not be aligned with the axis.
Dominant Wavelength,
λd (nm) @IF=20 mA
b
b. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
Peak
Wavelength, λP
(nm)
@IF = 20 mA
Viewing Angle,
2θ½ (°)c
c. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Test Current
(mA)Min. Typ. Max. Min. Typ. Max. Typ. Typ.
Red 560 650 1125 617 623 627 630 120 20
Green 1400 1900 2850 525 529 537 522 120
Blue 285 384 560 465 469 475 465 120
Color
Forward Voltage,
VF (V) @IF = 20 mAa
a. Tolerance = ±0.1V.
Reverse Voltage,
VR (V) @ IR = 100 µAb
b. Indicates product final testing condition. Long-term reverse bias is not recommended.
Reverse Voltage,
VR (V) @ IR = 10 µAb
Thermal Resistance,
RθJ-S (°C/W)
Min. Typ. Max. Min. Min. 1 Chip On 3 Chips On
Red 1.8 2.1 2.5 4.0 — 280 330
Green 2.6 3.1 3.4 — 4.0 240 357
Blue 2.6 3.1 3.4 — 4.0 240 357
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Part Numbering System
ASMT - YTD7 - 0AA02
x1x2x3x4x5
Code Description Option
x1Package type D White surface
x2Minimum intensity bin A Red: bin U2 Red: bin U2, V1, V2
Green: bin W2, X1, X2
Blue: bin T1, T2, U1
Green: bin W2
Blue: bin T1
x3Number of intensity bins A 3 intensity bins from minimum
x4Color bin combination 0 Red: full distribution
Green: bin A, B, C
Blue: bin A, B, C, D
x5Test option 2 Test current = 20 mA
ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Broadcom AV02-3873EN
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Bin Information
Intensity Bins (CAT)
Tolerance: ±12%
Color Bins (BIN) – Green
Tolerance: ±1 nm.
Color Bins (BIN) – Red
Tolerance: ±1 nm.
Color Bins (BIN) – Blue
Tolerance: ±1 nm.
Bin ID
Luminous Intensity (mcd)
Min. Max.
T1 285 355
T2 355 450
U1 450 560
U2 560 715
V1 715 900
V2 900 1125
W1 1125 1400
W2 1400 1800
X1 1800 2240
X2 2240 2850
Bin ID
Dominant Wavelength
(nm)
Chromaticity
Coordinate (for
Reference)
Min. Max. Cx Cy
A 525.0 531.0 0.1142 0.8262
0.1624 0.7178
0.2001 0.6983
0.1625 0.8012
B 528.0 534.0 0.1387 0.8148
0.1815 0.7089
0.2179 0.6870
0.1854 0.7867
C 531.0 537.0 0.1625 0.8012
0.2001 0.6983
0.2353 0.6747
0.2077 0.7711
Bin ID
Dominant Wavelength
(nm)
Chromaticity
Coordinate (for
Reference)
Min. Max. Cx Cy
— 617.0 627.0 0.6850 0.3149
0.6815 0.3150
0.7000 0.2966
0.7037 0.2962
Bin ID
Dominant Wavelength
(nm)
Chromaticity coordinate
(for Reference)
Min. Max. Cx Cy
A 465.0 469.0 0.1355 0.0399
0.1751 0.0986
0.1680 0.1094
0.1267 0.0534
B 467.0 471.0 0.1314 0.0459
0.1718 0.1034
0.1638 0.1167
0.1215 0.0626
C 469.0 473.0 0.1267 0.0534
0.1680 0.1094
0.1593 0.1255
0.1158 0.0736
D 471.0 475.0 0.1215 0.0626
0.1638 0.1167
0.1543 0.1361
0.1096 0.0868
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Figure 1: Relative Intensity vs. Wavelength Figure 2: Forward Current vs. Forward Voltage
0.0
0.2
0.4
0.6
0.8
1.0
WAVELENGTH - nm
RELATIVE INTENSITY
380 480 580 680
Red
Green
Blue
Red Green/Blue
0
20
40
60
80
100
012345
FORWARD CURRENT - mA
FORWARD VOLTAGE - V
Figure 3: Relative Intensity vs. Forward Current Figure 4: Dominant Wavelength Shift vs. Forward Current
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 1020304050
RELATIVE INTENSITY
FORWARD CURRENT - mA
Green
Blue
Red
-4.0
-2.0
0.0
2.0
4.0
6.0
8.0
0 102030405060
DOMINANT WAVELENGTH SHIFT - nm
(NORMALIZED AT 20mA)
MONO PULSE CURRENT - mA
Red
Green
Blue
Figure 5: Relative Intensity vs. Junction Temperature Figure 6: Forward Voltage vs. Junction Temperature
0.1
1
10
RELATIVE INTENSITY
Blue
Green
Red
-40 -20 0 20 40 60 80 100 120
TJ - JUNCTION TEMPERATURE - °C
-0.30
-0.20
-0.10
0.00
0.10
0.20
0.30
0.40
0.50
-40-20 0 20406080100120
FORWARD VOLTAGE SHIFT - V
JUNCTION TEMPERATURE, TJ-°C
Red
Green
Blue
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Figure 7: Maximum Forward Current vs. Temperature for Red
(1 Chip On)
Figure 8: Maximum Forward Current vs. Temperature for Red
(3 Chips On)
0
10
20
30
40
50
0 20 40 60 80 100 120
MAXIMUM FORWARD CURRENT - mA
TEMPERATURE (°C)
Ts
TA
0
10
20
30
40
50
60
0 20 40 60 80 100 120
TA
Ts
MAXIMUM FORWARD CURRENT - mA
TEMPERATURE (°C)
Figure 9: Maximum Forward Current vs. Temperature for
Green and Blue (1 Chip On)
Figure 10: Maximum Forward Current vs. Temperature for
Green and Blue (3 Chips On)
0
5
10
15
20
25
30
0 20 40 60 80 100 120
Ts
TA
MAXIMUM FORWARD CURRENT - mA
TEMPERATURE (°C)
0
5
10
15
20
25
30
0 20 40 60 80 100 120
TA
MAXIMUM FORWARD CURRENT - mA
TEMPERATURE (°C)
Ts
NOTE: Maximum forward current graphs based on
ambient temperature, TA are with reference to
thermal resistance RθJ-A as follows. For more
details, see Thermal Management.
Condition
Thermal Resistance from LED Junction to
Ambient, RθJ-A (°C/W)
Red Green and Blue
1 chip on 450 410
3 chips on 630 690
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Figure 11: Radiation Pattern Along X-Axis of the Package Figure 12: Radiation Pattern Along Y-Axis of the Package
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
0.0
0.2
0.4
0.6
0.8
1.0
NORMALI ZED I NTENSITY
Red
Green
Bl u e
0.0
0.2
0.4
0.6
0.8
1.0
NORMALIZED INTENSITY
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
Red
Green
Bl ue
Figure 13: Illustration of Package Axis for Radiation Pattern
XX
Y
Y
Figure 14: Recommended Soldering Land Pattern
Maximize the size of copper pad of PIN 1, PIN 4, PIN5
for better heat dissipation.
Copper pad Solder mask
0.40
0.50
2.30
1.35
1.60
4.55
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Figure 15: Carrier Tape Dimensions
Figure 16: Reeling Orientation
Package Marking
8.00 +0.30
-0.10
O
1.00 +0.10
0
O
1.50 +0.10
0
2.00 ±0.05
4.00 ±0.10
4.00 ±0.10
3.05 ±0.10
1.75 ±0.10
2.29 ±0.10
0.229 ±0.01
3.81 ±0.10
3.50 ±0.05
PACKAGE MARKING
USER FEED DIRECTION
PRINTED LABEL
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Figure 17: Reel Dimensions
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
20.20 MIN.
(0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
13.1 ± 0.5
(0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
Ø
Ø
Broadcom AV02-3873EN
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ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Packing Label
(i) Standard label (attached on moisture barrier bag)
(ii) Baby label (attached on plastic reel)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant Halogen Free
e4 Max Temp 260C MSL3
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
(1T) TAPE DATE:
QUANTITY: Packing Quantity
D/C: Date Code VF:
CAT: INTENSITY BIN
BIN: COLOR BIN
BABY LABEL COSB001B V0.0
(9D): DATE CODE:
Example of luminous intensity (lv) bin information on
label:
Example of color bin information on label:
NOTE: No color bin ID exists for the Red color because
there is only one range (see Bin Information).
CAT: U2 T1
Intensity bin for Blue: T1
Intensity bin for Green: W2
Intensity bin for Red: U2
W2
BIN: A B
Color bin for Blue: B
Color bin for Green: A
ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Broadcom AV02-3873EN
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Soldering
Recommended reflow soldering condition.
(i) Leaded Reflow Soldering
Do not perform reflow soldering more than twice.
Observe the necessary precautions for handling
moisture-sensitive devices as stated in the following
section.
Recommended board reflow direction is as follows.
(ii) Lead-Free Reflow Soldering
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering for rework only if this is unavoidable, and it
must be strictly controlled to the following conditions:
– Soldering iron tip temperature = 320°C maximum
– Soldering duration = 3 seconds maximum
– Number of cycles = 1 only
– Power of soldering iron = 50W maximum
Do not touch the LED body with a hot soldering iron
except the soldering terminals because it might
damage the LED.
For de-soldering, use a double flat tip.
Confirm beforehand whether hand soldering will affect
the functionality and performance of the LED.
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX.
REFLOW DIRECTION
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Broadcom AV02-3873EN
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Precautionary Notes
Handling Precautions
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant that is hard and brittle, silicone is softer and
flexible. Observe special handling precautions during
assembly of silicone encapsulated LED products. Failure to
comply might lead to damage and premature failure of the
LED. Refer to Application Note AN5288, Silicone
Encapsulation for LED: Advantages and Handling
Precautions for more information.
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might
apply excessive force or even pierce through the
silicone and cause failures to the LED die or wire bond.
Do not touch the silicone encapsulant. Uncontrolled
forces acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
The surface of the silicone material attracts dust and
dirt easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone, use
a cotton bud with isopropyl alcohol (IPA). During
cleaning, rub the surface gently without putting
pressure on the silicone. Ultrasonic cleaning is not
recommended.
For automated pick-and-place, Broadcom has tested
the following nozzle size to work with this LED.
However, due to the possibility of variations in other
parameters, such as pick and place machine maker/
model and other settings of the machine, verify that the
selected nozzle will not cause damage to the LED.
Handling of Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
Before use:
– An unopened moisture barrier bag (MBB) can be
stored at < 40°C / 90% RH for 12 months. If the
actual shelf life has exceeded 12 months and the
humidity indicator card (HIC) indicates that baking is
not required, it is safe to reflow the LEDs per the
original MSL rating.
– Do not open the MBB prior to assembly (for
example, for IQC).
Control after opening the MBB:
– Read the HIC immediately upon opening the MBB.
– Keep the LEDs at < 30°C / 60% RH at all times, and
all high temperature-related processes, including
soldering, curing or rework, must be completed
within 168 hours.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or
desiccator at < 5% RH.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to
other high-temperature processes, store the PCB in a
sealed MBB with desiccant or desiccator at < 5% RH to
ensure that all LEDs have not exceeded their floor life of
168 hours.
Baking is required if:
– The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
– The LEDs are exposed to condition of > 30°C / 60%
RH at any time.
– The LED floor life exceeded 168 hours.
The recommended baking condition is: 60°C ± 5°C for
20 hours.
Baking should only be done once.
ID
OD
ID = 1.7mm
OD = 3.5mm
ASMT-YTD7-0AA02 Data Sheet Tricolor PLCC6 White Surface LED
Broadcom AV02-3873EN
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Storage
The soldering terminals of these Broadcom LEDs are
silver plated. If the LEDs are exposed too long in the
ambient environment, the silver plating might become
oxidized and, thus, affect its solderability performance.
As such, keep unused LEDs in a sealed MBB with
desiccant or in desiccator at <5 % RH.
Application Precautions
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
recommended to ensure consistent performance.
LEDs exhibit slightly different characteristics at different
drive currents, which might result in larger variations in
their performance (that is, intensity, wavelength, and
forward voltage). Set the application current as close as
possible to the test current to minimize these variations.
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, make sure that the
reverse bias voltage does not exceed the allowable limit
of the LED.
Do not use the LED in the vicinity of material with sulfur
content or in an environment of high gaseous sulfur
compound and corrosive elements. Examples of
material that might contain sulfur are rubber gaskets,
RTV (room temperature vulcanizing) silicone rubber,
rubber gloves, and so on. Prolonged exposure to such
an environment might affect the optical characteristics
and product life.
Avoid a rapid change in ambient temperature,
especially in high humidity environments, because this
will cause condensation on the LED.
Although the LED is rated as IPx6 according to
IEC60529, the degree of protection provided by
enclosure, the test condition might not represent actual
exposure during application. If the LED is intended to
be used in an outdoor or a harsh environment, protect
the LED against damage caused by rain water, dust, oil,
corrosive gases, external mechanical stress, and so on.
Thermal Management
Optical, electrical, and reliability characteristics of the LED
are affected by temperature. Keep the junction temperature
(TJ) of the LED below allowable limits at all times. TJ can be
calculated as follows:
TJ = TA + RθJ-A x IF × VFmax
where:
TA = Ambient temperature (°C)
RθJ-A = Thermal resistance from LED junction to
ambient (°C/W)
IF = Forward current (A)
VFmax = Maximum forward voltage (V)
The complication of using this formula lies in TA and RθJ-A.
Actual TA is sometimes subjective and hard to determine.
RθJ-A varies from system to system depending on design
and is usually not known.
Another way of calculating TJ is by using the solder point
temperature TS as follows:
TJ = TS + RθJ-S × IF × VFmax
where:
TS = LED solder point temperature as shown in the
following illustration (°C)
RθJ-S = Thermal resistance from junction to solder point
(°C/W)
TS can be measured easily by mounting a thermocouple on
the soldering joint as shown in preceding illustration, while
RθJ-S is provided in the data sheet. Verify the TS of the LED
in the final product to ensure that the LEDs are operated
within all maximum ratings stated in the data sheet.
Eye Safety Precautions
LEDs may pose optical hazards when in operation. Do not
look directly at operating LEDs because it might be harmful
to the eyes. For safety reasons, use appropriate shielding or
personal protective equipment.
Ts point - pin 5
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