344
Revised: 09/23/13
©2013 Littelfuse, Inc
Specifications are subject to change without notice.
Teccor® brand Thyristors
Standard Bidirectional SIDACs
Kxxxzy Series
Soldering Parameters
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)oTFDT
Average ramp up rate (Liquidus Temp)
(TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)oTFDPOET
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)oTFDPOET
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 280°C
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
reheat
Ramp-upRamp-up
Ramp-down
am
-
Physical Specifications Reliability/Environmental Tests
Test Specifications and Conditions
High Temperature
Voltage Blocking
MIL-STD-750: Method 1040, Condition
A Rated VDRM (VAC-peak), 125°C, 1008
hours
Temperature Cycling
MIL-STD-750: Method 1051
-40°C to 150°C, 15-minute dwell, 100
cycles
Biased Temperature &
Humidity
EIA/JEDEC: JESD22-A101
80% min VBO (VDC), 85°C, 85%RH, 1008
hours
High Temp Storage MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage -40°C, 1008 hours
Thermal Shock
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
Autoclave
(Pressure Cooker Test)
EIA/JEDEC: JESD22-A102
121°C, 100%RH, 2atm, 168 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability ANSI/J-STD-002: Category 3
Lead Bend MIL-STD-750: Method 2036, Condition E
Terminal Finish 100% Matte Tin Plated / Pb-free Solder
Dipped
Body Material UL recognized epoxy meeting flammability
classification 94V-0
Lead Material Copper Alloy
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long
way toward extending the operating life of the Thyristor.
Overheating and surge currents are the main killers of
SIDACs. Correct mounting, soldering, and forming of the
leads also help protect against component damage.