PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering ------------------- Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP (dual in-line package) DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 PMFP8 (plastic micro flat package) PMFP8 plastic micro flat package; 8 leads (straight) SOT144-1 SO (small outline) SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 SO8 plastic small outline package; 8 leads (straight); body width 3.9 mm SOT96-2 SO8 plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 VSO (very small outline) VSO40 1998 Mar 17 plastic very small outline package; 40 leads; face down 2 SOT158-2 PAGE Philips Semiconductors Package information Package outlines DIP DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1998 Mar 17 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 3 Philips Semiconductors Package information Package outlines DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE 1998 Mar 17 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 4 Philips Semiconductors Package information Package outlines PMFP PMFP8: plastic micro flat package; 8 leads (straight) SOT144-1 E D X c m t n HE 8 5 Q2 A2 Q1 pin 1 index L detail X 1 4 e w M b 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 b c D (1) E (1) e HE L m max. n max. Q1 Q2 t w mm 0.90 0.70 0.40 0.25 0.19 0.12 3.1 2.9 3.1 2.9 0.80 4.6 4.4 0.75 0.26 0.3 0.40 0.30 0.40 0.30 0.95 0.1 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 94-01-25 95-01-24 SOT144-1 1998 Mar 17 EUROPEAN PROJECTION 5 Philips Semiconductors Package information Package outlines SO SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1998 Mar 17 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 6 o 8 0o Philips Semiconductors Package information Package outlines SO8: plastic small outline package; 8 leads (straight); body width 3.9 mm D SOT96-2 E A X c HE v M A Z 8 5 Q A2 pin 1 index L 1 4 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A2 bp c D (1) E (2) e HE L Q v w Z (1) mm 1.45 1.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.4 6.2 1.2 0.7 0.6 0.25 0.25 0.7 0.3 inches 0.057 0.049 0.019 0.0100 0.20 0.014 0.0075 0.19 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.028 0.012 0.252 0.047 0.244 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-05-22 SOT96-2 1998 Mar 17 EUROPEAN PROJECTION 7 Philips Semiconductors Package information Package outlines SO8: plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 D E A X c y HE v M A Z 8 5 Q A2 A (A 3) A1 pin 1 index Lp L 1 4 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 7.65 7.45 7.6 7.4 1.27 10.65 10.00 1.45 1.1 0.45 1.1 1.0 0.25 0.25 0.1 2.0 1.8 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.30 0.29 0.30 0.29 0.050 0.419 0.057 0.394 0.043 0.018 0.043 0.039 0.01 0.01 0.004 0.079 0.071 inches 0.10 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-25 97-05-22 SOT176-1 1998 Mar 17 EUROPEAN PROJECTION 8 o 8 0o Philips Semiconductors Package information Package outlines SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013AA 1998 Mar 17 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 9 Philips Semiconductors Package information Package outlines SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1998 Mar 17 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 10 Philips Semiconductors Package information Package outlines VSO VSO40: plastic very small outline package; 40 leads; face down SOT158-2 D E A y X c HE v M A Z 40 21 L Lp A1 Q (A 3) A2 A pin 1 index detail X 1 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 7o 0o Note 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-2 1998 Mar 17 EUROPEAN PROJECTION 11