SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
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Specifications
Insulation Resistance: 500MΩ at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30mΩ max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
Extra Feature: Clipped Cover
IC149 - 064 - *01 - B5
Part Number (for IC-use)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
30.15
23.70 x 17.00
23.65
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
8.60
IC149 Series (SMT) QFP/TQFP - 64 Pins (13x19) 1.0mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N2:N2:
N2:N2:
N2:These holes are only necessary when fixing the Socket with screws.
N3: These holes are only necessary for use with positioning pins.
N4: The Socket may be glued to the PC Board within this area.
not available
Compatible Emulation-Adapter
14mm x 20mm
22.9 • 17.0
0.15
3.05
max.
17.6 ~ 20.1
14.0
1.0
20.0
0.35
Detail E
N1 Detail E
N3
N4
N2
23.6 ~ 26.1