TPD6F002 www.ti.com SLLS876A - AUGUST 2008 - REVISED NOVEMBER 2009 SIX-CHANNEL EMI FILTER FOR LCD DISPLAY/KEYPAD APPLICATION Check for Samples: TPD6F002 FEATURES 1 * * * Six-Channel EMI Filtering for Data Ports Robust ESD Protection Exceeds IEC61000-4-2 (Level 4) - 15-kV Human-Body Model (HBM) - 20-kV IEC 61000-4-2 Contact Discharge - 30-kV IEC 61000-4-2 Air-Gap Discharge Pi-Style (C-R-C) Filter Configuration (R = 100 , CTOTAL = 34 pF) Less than 20-nA Leakage Current Across Temperature and Process Variation - -35 dB Insertion Loss at 800 MHz - -57 dB Crosstalk Attenuation at 100 MHz - -35 dB Insertion Loss at 800 MHz - -3 dB Bandwidth 100 MHz Space-Saving SON Package (3 mm x 1.35 mm) and Flow-Through Pin Mapping Provides Optimum Filter Performance DSV PACKAGE (TOP VIEW) Ch1_In Ch1_Out Ch2_In Ch2_Out Ch3_In Ch3_Out Ch4_In GND * * Ch4_Out Ch5_In Ch5_Out Ch6_In Ch6_Out APPLICATIONS * * * * LCD Display Interface Keypad SVGA Video Connections Memory Interface DESCRIPTION/ORDERING INFORMATION The TPD6F002 is a six-channel EMI filter in a space-saving DSV package. This low-pass filter array reduces EMI emissions and provides system-level ESD protection at the data ports. Because of its small package and easy-to-use pin assignments, this device is suitable for a wide array of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. In particular, the TPD6F002 is ideal for EMI filtering and protecting data lines from ESD at the LCD display, keypad, and memory interfaces. The pi-style (C-R-C) filter provides at least 35 dB attenuation in the carrier frequency range. The TPD6F002 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. This filter includes ESD protection circuitry that prevents damage to the application when subjected to ESD up to IEC 61000-4-2 20 kV Contact ESD and 30 kV Air-Gap ESD. The TPD6F002 is specified for -40C to 85C operation. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2008-2009, Texas Instruments Incorporated TPD6F002 SLLS876A - AUGUST 2008 - REVISED NOVEMBER 2009 www.ti.com ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (1) (2) (2) 0.5-mm pitch SON - DSV PACKAGE DIMENSION Length = 3 mm, Width = 1.35 mm, Pitch = 0.5 mm, Height = 0.75 mm) ORDERABLE PART NUMBER TOP-SIDE MARKING TPD6F002DSVR YM3NS For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. EQUIVALENT SCHEMATIC REPRESENTATION 100 Ch_In C1 =17pF Ch_Out C2=17pF GND ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VIO IO to GND Tstg Storage temperature range TJ Junction temperature Lead temperature (soldering, 10 s) (1) MAX -65 UNIT 6 V 150 C 150 C 300 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = -40C to 85C (Unless otherwise noted) PARAMETER TEST CONDITIONS IIO = 10 A MIN TYP (1) MAX UNIT 100 115 20 nA VBR DC breakdown voltage R Resistance C Capacitance (C1 or C2) VIO = 2.5 V 17 IIO Channel leakage current VIO = 3.3 V 1 fC Cut-off frequency ZSOURCE = 50 , ZLOAD = 50 (1) 6 85 V pF 100 MHz Typical values are at TA = 25C. ESD PROTECTION PARAMETER TYP UNIT HBM 15 kV IEC 61000-4-2 Contact Discharge 20 kV IEC 61000-4-2 Air-Gap Discharge 30 kV 2 Submit Documentation Feedback Copyright (c) 2008-2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 TPD6F002 www.ti.com SLLS876A - AUGUST 2008 - REVISED NOVEMBER 2009 TYPICAL OPERATING CHARACTERISTCS 1.00E-05 8.00E-06 6.00E-06 -40C 25C 85C 4.00E-06 C u r re n t ( A ) 2.00E-06 0.00E+00 -2.00E-06 -4.00E-06 -6.00E-06 -8.00E-06 -1.00E-05 -7 -5 -3 -1 1 3 5 7 Voltage (V) Figure 1. DC Voltage-Current Sweep across Input, Output Pins Submit Documentation Feedback Copyright (c) 2008-2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 3 TPD6F002 SLLS876A - AUGUST 2008 - REVISED NOVEMBER 2009 www.ti.com 150 R e s is t a n c e ( o h m s ) 100 50 0 -40 25 85 Temp (C) Figure 2. Series Resistance vs Temperature 4 Submit Documentation Feedback Copyright (c) 2008-2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 TPD6F002 www.ti.com SLLS876A - AUGUST 2008 - REVISED NOVEMBER 2009 0 -10 -20 -30 S 4 1 (d B ) -40 -50 -60 -70 -80 -90 -100 1.00E+06 1.00E+07 1.00E+08 1.00E+09 frequency (Hz) Figure 3. Channel-to-Channel Crosstalk Submit Documentation Feedback Copyright (c) 2008-2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 5 TPD6F002 SLLS876A - AUGUST 2008 - REVISED NOVEMBER 2009 www.ti.com 0 -5 -10 I n s e rt io n L o s s ( d B ) -15 -20 -25 -30 -35 -40 -45 1.00E+06 1.00E+07 1.00E+08 1.00E+09 Frequency (Hz) Figure 4. TPD6F002 Typical Insertion-loss Characteristics (TA = 25C, DC Bias = 0 V, 50 Environment) 6 Submit Documentation Feedback Copyright (c) 2008-2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 TPD6F002 www.ti.com SLLS876A - AUGUST 2008 - REVISED NOVEMBER 2009 30 C1 C2 25 C a p a c i ta n c e (p F ) 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Voltage Bias (V) Figure 5. Capacitance (C1 or C2) vs. Bias Voltage Submit Documentation Feedback Copyright (c) 2008-2009, Texas Instruments Incorporated Product Folder Link(s): TPD6F002 7 PACKAGE OPTION ADDENDUM www.ti.com 12-Mar-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TPD6F002DSVR ACTIVE SON DSV Pins Package Eco Plan (2) Qty 12 3000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-May-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPD6F002DSVR Package Package Pins Type Drawing SON DSV 12 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 1.74 B0 (mm) K0 (mm) P1 (mm) 3.33 1.05 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-May-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD6F002DSVR SON DSV 12 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated