GND
Ch1_In
Ch2_In
Ch3_In
Ch4_In
Ch5_In
Ch6_In
Ch1_Out
Ch2_Out
Ch3_Out
Ch4_Out
Ch5_Out
Ch6_Out
TPD6F002
www.ti.com
SLLS876A –AUGUST 2008–REVISED NOVEMBER 2009
SIX-CHANNEL EMI FILTER FOR LCD DISPLAY/KEYPAD APPLICATION
Check for Samples: TPD6F002
1FEATURES DSV PACKAGE
• Six-Channel EMI Filtering for Data Ports (TOP VIEW)
• Robust ESD Protection Exceeds IEC61000-4-2
(Level 4)
– ±15-kV Human-Body Model (HBM)
– ±20-kV IEC 61000-4-2 Contact Discharge
– ±30-kV IEC 61000-4-2 Air-Gap Discharge
• Pi-Style (C-R-C) Filter Configuration
(R = 100 Ω, CTOTAL = 34 pF)
• Less than 20-nA Leakage Current Across
Temperature and Process Variation
– -35 dB Insertion Loss at 800 MHz
– -57 dB Crosstalk Attenuation at 100 MHz
– -35 dB Insertion Loss at 800 MHz
– -3 dB Bandwidth 100 MHz
• Space-Saving SON Package (3 mm × 1.35 mm)
and Flow-Through Pin Mapping Provides
Optimum Filter Performance
APPLICATIONS
• LCD Display Interface
• Keypad
• SVGA Video Connections
• Memory Interface
DESCRIPTION/ORDERING INFORMATION
The TPD6F002 is a six-channel EMI filter in a space-saving DSV package. This low-pass filter array reduces EMI
emissions and provides system-level ESD protection at the data ports. Because of its small package and
easy-to-use pin assignments, this device is suitable for a wide array of applications such as mobile handsets,
PDAs, video consoles, notebook computers, etc. In particular, the TPD6F002 is ideal for EMI filtering and
protecting data lines from ESD at the LCD display, keypad, and memory interfaces. The pi-style (C-R-C) filter
provides at least 35 dB attenuation in the carrier frequency range.
The TPD6F002 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to
electromagnetic interferences. This filter includes ESD protection circuitry that prevents damage to the
application when subjected to ESD up to IEC 61000-4-2 ±20 kV Contact ESD and ±30 kV Air-Gap ESD.
The TPD6F002 is specified for –40°C to 85°C operation.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
100Ω
C2=17pF
C1 =17pF
Ch_In Ch_Out
GND
TPD6F002
SLLS876A –AUGUST 2008–REVISED NOVEMBER 2009
www.ti.com
ORDERING INFORMATION ORDERABLE
TAPACKAGE(1) (2) PACKAGE DIMENSION TOP-SIDE MARKING
PART NUMBER
Length = 3 mm, Width = 1.35 mm,
–40°C to 85°C 0.5-mm pitch SON – DSV TPD6F002DSVR YM3NS
Pitch = 0.5 mm, Height = 0.75 mm)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
EQUIVALENT SCHEMATIC REPRESENTATION
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VIO IO to GND 6 V
Tstg Storage temperature range –65 150 °C
TJJunction temperature 150 °C
Lead temperature (soldering, 10 s) 300 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
TA= –40°C to 85°C (Unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VBR DC breakdown voltage IIO = 10 μA 6 V
R Resistance 85 100 115 Ω
C Capacitance (C1 or C2) VIO = 2.5 V 17 pF
IIO Channel leakage current VIO = 3.3 V 1 20 nA
fCCut-off frequency ZSOURCE = 50 Ω, ZLOAD = 50 Ω100 MHz
(1) Typical values are at TA= 25°C.
ESD PROTECTION PARAMETER TYP UNIT
HBM ±15 kV
IEC 61000-4-2 Contact Discharge ±20 kV
IEC 61000-4-2 Air-Gap Discharge ±30 kV
2Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPD6F002
-1.0 0E-05
-8.0 0E-06
-6.0 0E-06
-4.0 0E-06
-2.0 0E-06
0.00E+00
2.00E-06
4.00E-06
6.00E-06
8.00E-06
1.00E-05
-7 -5 -3 -1 1 3 5 7
Voltage (V)
C u r re n t ( µ A )
-40C 25C 85C
TPD6F002
www.ti.com
SLLS876A –AUGUST 2008–REVISED NOVEMBER 2009
TYPICAL OPERATING CHARACTERISTCS
Figure 1. DC Voltage-Current Sweep across Input, Output Pins
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPD6F002
0
50
100
150
-40 25 85
Temp (C)
R e s is ta n c e ( o h m s )
TPD6F002
SLLS876A –AUGUST 2008–REVISED NOVEMBER 2009
www.ti.com
Figure 2. Series Resistance vs Temperature
4Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPD6F002
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
1.00E+06 1.00E+07 1.00E+08 1.00E+09
frequency (Hz)
S 4 1 (d B )
TPD6F002
www.ti.com
SLLS876A –AUGUST 2008–REVISED NOVEMBER 2009
Figure 3. Channel-to-Channel Crosstalk
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPD6F002
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
1.00E+06 1.00E+07 1.00E+08 1.00E+09
Frequency (Hz)
I n s e rt io n L o s s ( d B )
TPD6F002
SLLS876A –AUGUST 2008–REVISED NOVEMBER 2009
www.ti.com
Figure 4. TPD6F002 Typical Insertion-loss Characteristics
(TA= 25°C, DC Bias = 0 V, 50 ΩEnvironment)
6Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPD6F002
0
5
10
15
20
25
30
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Voltage Bias (V)
C a p a c i ta n c e (p F )
C1 C2
TPD6F002
www.ti.com
SLLS876A –AUGUST 2008–REVISED NOVEMBER 2009
Figure 5. Capacitance (C1 or C2) vs. Bias Voltage
Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TPD6F002
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPD6F002DSVR ACTIVE SON DSV 12 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Mar-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPD6F002DSVR SON DSV 12 3000 180.0 8.4 1.74 3.33 1.05 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 26-May-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPD6F002DSVR SON DSV 12 3000 202.0 201.0 28.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-May-2012
Pack Materials-Page 2
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