EMVA13AB1-51.840M TR RoHS Pb EMVA13 A B 1 -51.840M TR Series RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD 3.3Vdc LVCMOS Voltage Controlled MEMS Oscillator Frequency Tolerance/Stability 50ppm Maximum Operating Temperature Range -40C to +85C Packaging Options Tape & Reel Nominal Frequency 51.840MHz Absolute Pull Range 30ppm Minimum ELECTRICAL SPECIFICATIONS Nominal Frequency 51.840MHz Frequency Tolerance/Stability 50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, 260C Reflow, Shock, and Vibration) Aging at 25C 1ppm Maximum First Year Operating Temperature Range -40C to +85C Supply Voltage 3.3Vdc 10% Input Current 15mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH = -4mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL = +4mA) Rise/Fall Time 2nSec Maximum (Measured from 20% to 80% of waveform) Duty Cycle 50 5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Absolute Pull Range 30ppm Minimum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, Vibration, and First Year Aging at 25C over the Control Voltage (Vc).) Control Voltage 0.05Vdc to 1.7Vdc (Test Condition for APR) Control Voltage Range 0.0Vdc to 1.8Vdc Linearity 1% Maximum Transfer Function Positive Transfer Characteristic Modulation Bandwidth 8kHz Typical, 5kHz Minimum (Measured at -3dB, Vc = 0.875Vdc) Input Impedance 250kOhms Minimum Input Leakage Current 10A Maximum Typical Phase Noise at Offsets -100dBc/Hz at offset of 10kHz, -115dBc/Hz at offset of 100kHz, -145dBc/Hz at offset of 1MHz, and 154dBc/Hz at offset of 10MHz Period Jitter (RMS) 3pSec Typical, 6pSec Maximum Period Jitter (pk-pk) 20pSec Typical, 40pSec Maximum RMS Phase Jitter (Fj = 1.875MHz to 20MHz; Random) 0.8pSec Typical RMS Phase Jitter (Fj = 900kHz to 7.5MHz; Random) 0.6pSec Typical Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity Level J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only) www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6 EMVA13AB1-51.840M TR ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G MECHANICAL DIMENSIONS (all dimensions in millimeters) 0.85 0.15 5.00 0.15 1.20 0.10 (x4) 2.1 0.08 MAX 2 3 R0.70 0.10 PIN CONNECTION 1 Control Voltage 2 Case Ground 3 Output 4 Supply Voltage LINE MARKING 7.00 0.15 5.08 0.10 A 1 C0.25 0.10 2.60 0.15 1.70 1 XXXX or XXXXX XXXX or XXXXX=Ecliptek Manufacturing Lot Code 4 1.40 0.10 (x4) Note A: Center paddle is connected internally to oscillator ground (Pad 2). Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6 EMVA13AB1-51.840M TR CLOCK OUTPUT OUTPUT WAVEFORM VOH 80% of Waveform 50% of Waveform 20% of Waveform VOL Fall Time Rise Time TW T Duty Cycle (%) = TW/T x 100 Test Circuit for CMOS Output Oscilloscope Supply Voltage (VDD) Current Meter Power Supply 0.01F (Note 1) Voltage Meter 0.1F (Note 1) Frequency Counter Probe (Note 2) Output Ground CL (Note 3) Voltage Control Power Supply Voltage Meter Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6 EMVA13AB1-51.840M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.2 2.0 0.2 DIA 1.5 0.1 0.30 0.05 7.5 0.2 16.0 0.3 A0* 6.75 0.20 8.0 0.2 B0* K0* *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 180 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6 EMVA13AB1-51.840M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6 EMVA13AB1-51.840M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 6 of 6