LM88CIMM-A - National Semiconductor

LM88

LM88 Factory Programmable Dual Remote-Diode Thermostat

Literature Number: SNIS116B

LM88

OBSOLETE

October 6, 2011

Factory Programmable Dual Remote-Diode Thermostat

General Description

The LM88 is a dual remote-diode temperature sensor with 3

digital comparators. The LM88 has 3 open-drain outputs

(O_SP0, O_SP1 and O_CRIT) that can be used as interrupts

or to signal system shutdown. The digital comparators can be

factory programmed to make a greater than or less than com-

parison. When programmed for a greater than comparison

outputs:

O_SP0 and O_SP1 activate when the temperatures mea-

sured by D0 or D1 exceed the associated setpoints of T_SP0

or T_SP1.

O_CRIT activates when the temperature measured by ei-

ther D0 or D1 exceeds setpoint T_CRIT.

T_CRIT can be set at 1°C intervals from −40°C to +125°C.

T_SP0 and T_SP1 can be set at 4°C intervals in the range of

T_CRIT +127°C/−128°C. Hysteresis for all comparators is set

to 1°C. O_CRIT, in conjunction with T_CRIT, could be used

to prevent catastrophic damage to key subsystems such as

notebook Card Bus cards while O_SP0 and O_SP1, in con-

junction with T_SP0 and T_SP1, can warn of an impending

failure.

The LM88 is available in an 8-lead mini-small-outline pack-

age.

Applications

■Microprocessor Thermal Management

■Appliances

■Portable Battery Powered Systems

■Fan Control

■Industrial Process Control

■HVAC Systems

■Remote Temperature Sensing

■Electronic System Protection

Features

■2 external remote diode input channels

■3 digital comparator outputs, 1 per remote diode and one

T_CRIT common to both

■Factory programmable greater than or less than

comparisons

■1°C comparator hysteresis

■2 setpoints, T_SP0 and T_SP1, factory programmable in

4°C intervals

■1 setpoint, T_CRIT, factory programmable in 1°C intervals

■Active Low open-drain digital outputs

■8-pin mini-SO plastic package

Key Specifications

■ Power Supply Voltage 2.8V–3.8V

■ Power Supply Current 1.5 mA (max)

■ LM88 Temperature Range −40°C to +85°C

■ Diode Setpoint Temperature

Range 0°C to +125°C

■ Temperature Trip Point Accuracy:

Diode Junction

Temperature

(TDJ)

LM88CIM

Accuracy

LM88CIM

Temperature

Range

+45°C to +85°C ±3°C (max) −40°C to +85°C

+60°C to +100°C ±3°C (max) −40°C to +85°C

Note: These are sample ranges. Contact factory for other

ranges.

Pentium™ is a trademark of Intel Corporation.

101326 Version 3 Revision 2 Print Date/Time: 2011/10/06 11:23:01

LM88 Factory Programmable Dual Remote-Diode Thermostat

Simplified Block Diagram and Connection Diagram

MSOP-8/MUA08A Package

10132601

Top View

10132602

For simplicity, the effects of the hysteresis are not shown in the temperature re-

sponse diagram.

Order Number Device

Marking

NS Package

Number

Transport

Media

T_SP0

(°C)

T_SP1

(°C)

T_CRIT

(°C)

S etpoint

Accuracy

(°C)

LM88CIMM-A

T08A

MUA08A

MSOP-8

Rail

61 49 80 ±3

LM88CIMMX-A Tape and

Real

LM88CIMM-B

T08A

MUA08A

MSOP-8

Rail

41 49 60 ±3

LM88CIMMX-B Tape and

Real

For other setpoints please contact the factory. Performance is dependent on temperature range.

Typical Application

10132613

FIGURE 1. Thermal Protection for Pentium™ Processor and Graphics Chip

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101326 Version 3 Revision 2 Print Date/Time: 2011/10/06 11:23:01

LM88

Absolute Maximum Ratings (Note 1)

Input Voltage 6V

Input Current at any pin (Note 2) 5mA

Package Input Current (Note 2) 20mA

Package Dissipation at TA = 25°C

(Note 4) 900mW

Soldering Information

MSOP Package (Note 6) :

Vapor Phase (60 seconds) 215°C

Infrared (15 seconds) 220°C

Storage Temperature −65°C to + 150°C

ESD Susceptibility (Note 5)

Human Body Model

Machine Model

2500V

250V

Operating Ratings (Note 1)

Operating Temperature Range TMIN ≤ T ≤ TMAX

LM88CIMM −40°C ≤ TA ≤ +85°C

Remote Diode Junction 0°C ≤ TDJ ≤ +125°C

Positive Supply Voltage (V+)+2.8V to +3.8V

Maximum V O_CRIT, V O_SP0

and V O_SP1 +5.5V

LM88 Electrical Characteristics

The following specifications apply for 2.8VDC≤V+ ≤ 3.8VDC unless otherwise specified. Boldface limits apply for TA = TJ = TMIN

to TMAX; all other limits TA = TJ = 25°C unless otherwise specified.

Symbol Parameter Conditions Typical

(Note 7)

LM88CIMM

Limits

(Note 8)

Units

(Limits)

Temperature Sensor

Setpoint Temperature Accuracy (Note 9)+60°C ≤ TDJ ≤ +100°C ±3 °C (max)

+45°C ≤ TDJ ≤ +85°C

+30°C ≤ TDJ ≤ +70°C

Setpoint Hysteresis 1 °C (min)

1 °C (max)

Output Update Rate 920 ms (max)

VD−, VD0 and VD1 Analog Inputs

ID+SOURCE Diode Source Current (D+ − D−)=0.65; high level 120 210 µA (max)

46 µA (min)

(D+ − D−)=0.65; low level 12 21 µA (max)

4.6 µA (min)

VD−Out D− Output Source Voltage 0.7 V

LM88 Electrical Characteristics

The following specifications apply for 2.8VDC≤V+ ≤ 3.8VDC unless otherwise specified. Boldface limits apply for TA = TJ = TMIN

to TMAX; all other limits TA = TJ = 25°C unless otherwise specified.

Symbol Parameter Conditions Typical

(Note 7)

Limits

(Note 8)

Units

(Limits)

V+ Power Supply

ISSupply Current 1.5 mA (max)

Digital Outputs

IOUT(“1”) Logical “1” Output Leakage Current

(Note 10)

VOUT=V+− 0.6V where

V+=3.8V to 2.8V

2µA (max)

VOUT=V+ =3.8V to

2.8V

40 µA (max)

VOUT(“0”) Logical “0” Output Voltage IOUT = +3 mA 0.4 V (max)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2: When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA

maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four.

Note 3: Parasitics or ESD protection circuitry are shown in the diagram found below. The ESD Clamp circtuitry is triggered on when there is an ESD event. The

table maps what devices appear on the different pins.

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LM88

Pin Name D1 D2 D3 D4 D5 D6 R1

D0+ X X X X X 50Ω

D− XXXXXX50Ω

D1+ X X X X X 50Ω

O_CRIT X X X X 0Ω

O_SP1 X X X X 0Ω

O_SP0 X X X X 0Ω

10132604

Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to

ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax–TA)/θJA or the number

given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 125°C. For this device the typical thermal resistance (θJA) of the different

package types when board mounted follow:

Package Type θJA

MUA08A 250°C/W

Note 5: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin.

Note 6: See the URL ”http://www.national.com/packaging/“ for other recomdations and methods of soldering surface mount devices.

Note 7: Typicals are at TJ = TA = 25°C and represent most likely parametric norm.

Note 8: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).

Note 9: These are sample temperature ranges, contact the factory for other temperature ranges. Performance is dependent on temperature range.

Note 10: The two IOH specifications are intended to describe two operating regions of the output voltage. In Region 1, V+− 0.6V and below, there is normal leakage

current, 2µA (max). In Region 2, V+− 0.6V to V+, there is additional current flowing caused by the ESD protection circuitry (see Figure in Note 3). The maximum

current flow is under short circuit conditions as specified at 40µA (max). Under normal operating conditions a pull-resistor (R) will be used. The voltage drop across

this pull-up resistor caused by the 2µA normal leakage current with large values of R (much greater than 100k) will bias diode D1 into the cutoff region causing

the additional current to be negligible in the voltage drop calculation. With low values of R more current will flow as in the case of a 1.1k pull-up, 20µA may flow

causing less than 22mV of voltage drop.

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101326 Version 3 Revision 2 Print Date/Time: 2011/10/06 11:23:01

LM88

1.0 Functional Description

10132611

a) When programmed for a greater than comparison

10132612

b) When programmed for a less than comparison

FIGURE 2. Comparator output temperature response diagrams

1.1 PIN DESCRIPTIONS

V+This is the positive supply voltage pin, which has

a range of 2.8 to 3.8 volts. This pin should be by-

passed with a 0.1µF capacitor to ground.

GND This is the ground pin.

D0+, D1+ These pins connect to the positive terminal of the

diodes (e.g. a 2N3904 collector base shorted or a

Pentium thermal diode anode) and provide the

source current for forward biasing the diodes for

the temperature measurement. During a temper-

ature conversion, the current source switches be-

tween 120µA and 12µA. The diodes are sampled

sequentially.

D− This pin should be connected to the negative pin

of each diode (e.g. a 2N3904 emitter or a Pentium

thermal diode cathode). A star connection is rec-

ommended. Separate traces should be routed

from this pin to each diode cathode. This pin bi-

ases the negative diode terminals to approximate-

ly 0.7V.

O_CRIT This is an active-low open-drain digital output. It

goes LOW when a comparison of either diode

temperature reading to the setpoint T_CRIT is

true. It returns to HIGH when the comparison of

the diode temperature, that caused the true con-

dition, to T_CRIT±1°C is false. The CRIT com-

parator can be factory programmed to make a

greater than or less than comparison. (See Sec-

tion 1.3 LM88 OPTIONS)

O_SP1 This is an active-low open-drain digital output. It

goes LOW when the comparison of the tempera-

ture reading of diode one to the value of T_SP1 is

true. The SP1 comparator has a built in hysteresis

of 1°C. Therefore, O_SP1 returns to HIGH when

diode one's temperature comparison to the value

of T_SP1±1°C is false. The SP1 comparator can

be factory programmed to make a greater than or

less than comparison.(See Section 1.3 LM88 OP-

TIONS)

O_SP0 This is an active-low open-drain digital output. It

goes LOW when the comparison of the tempera-

ture reading of diode one to the value of T_SP0 is

true. The SP0 comparator has a built in hysteresis

of 1°C. Therefore, O_SP0 returns to HIGH when

diode one's temperature comparison to the value

of T_SP0±1°C is false. The SP0 comparator can

be factory programmed to make a greater than or

less than comparison.(See Section 1.3 LM88 OP-

TIONS)

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101326 Version 3 Revision 2 Print Date/Time: 2011/10/06 11:23:01

LM88

1.2 TYPICAL PIN CONNECTION

Pin Label Pin Number Typical Connection

D0+ 1 3904-type transistor shorted-collector base or Pentium thermal diode anode; 2.2nF capacitor connected

to D-

D− 2 3904-type transistor emitter or Pentium thermal diode cathode (individual traces are required to each

diode; do not daisy chain); two 2.2nF capacitors connected to D0+ and D1+

D1+ 3 3904-type transistor shorted collector-base or Pentium thermal diode anode; 2.2nF capacitor connected

to D-

GND 4 a quiet system ground

O_CRIT 5 2k pull-up; system shutdown or the THERM pin of the ICH (I/O Controller Hub found in PCs)

O_SP1 6 2k pull-up; general purpose input (GPI), to determine which diode caused the THERM event

O_SP1 7 2k pull-up; general purpose input (GPI), to determine which diode caused the THERM event

V+8 3.3V; 0.1µF bypass capacitor

1.3 LM88 OPTIONS

1.3.1 Set-Point Values

T_SP0 and T_SP1 are dependent on the value of T_CRIT:

T_SP0 = T_CRIT + 4a + 1

T_SP1 = T_CRIT + 4b + 1

where:

a and b are any integer in the range of −32 to +31.

T_CRIT can be any value in the range of 0°C to +125°C with

a resolution of 1°C.

1.3.2 Functionality

The LM88's comparators can be factory programmed to do a

greater than or less than comparison. When programmed for

a greater than comparison, the comparison result is true when

the temperature measured is above the preprogrammed set-

point temperature. The comparison returns to false when the

temperature measured is below or equal to the setpoint tem-

perature minus one degree. For a less than comparison the

comparison result is true when the temperature measured is

below the preprogrammed limit. The result turns to false when

the temperature measured is above or equal to the setpoint

limit plus one degree. SP0, SP1 and CRIT comparisons can

all be independently programmed to be greater than or less

than. All CRIT comparisons are required to be the same, ei-

ther greater than or less than. The comparator hysteresis can

also be factory set to one, two or three degrees. The hystere-

sis for all comparisons is required to be the same.

2.0 Application Hints

2.1 OPEN-DRAIN OUTPUTS

The O_SP0, O_SP1 and 0_CRIT outputs are open-drain out-

puts and do not have internal pull-ups. A “high” level will not

be observed on these pins until pull-up current is provided

from some external source, typically a pull-up resistor. Choice

of resistor value depends on many system factors but, in gen-

eral, the pull-up resistor should be as large as possible. This

will minimize any internal temperature reading errors due to

internal heating of the LM88. The maximum resistance of the

pull-up needed to provide a 2.1V high level, based on LM88

specification for High Level Output Current with the supply

voltage at 3.0V, is 430kΩ.

2.2 THERMAL DIODE MOUNTING CONSIDERATIONS

To measure temperature the LM88 uses two remote diodes.

These diodes can be located on the die of a target IC, allowing

measurement of the IC's temperature, independent of the

LM88's temperature. The LM88 has been optimized to mea-

sure the remote diode of a Pentium type processor as shown

in Figure 3. A discrete diode can also be used to sense the

temperature of external objects or ambient air. Remember

that a discrete diode's temperature will be affected, and often

dominated, by the temperature of its leads.

As with any IC, the LM88 and accompanying wiring and cir-

cuits must be kept insulated and dry, to avoid leakage and

corrosion. This is especially true if the circuit may operate at

cold temperatures where condensation can occur. Printed-

circuit coatings and varnishes such as Humiseal and epoxy

paints or dips are often used to ensure that moisture cannot

corrode the LM88 or its connections. Moisture may also cause

leakage on the diode wiring and therefore affect the accuracy

of the temperature set-points.

10132615

FIGURE 3. Pentium or 3904 Temperature vs LM88

Temperature Set-point

Most silicon diodes do not lend themselves well to this appli-

cation. It is recommended that a 2N3904 transistor base

emitter junction be used with the collector tied to the base.

A diode connected 2N3904 approximates the junction avail-

able on a Pentium III microprocessor for temperature mea-

surement. Therefore, the LM88 can sense the temperature of

this diode effectively.

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LM88

2.3 EFFECTS OF THE DIODE NON-IDEALITY FACTOR ON

ACCURACY

The technique used in today's remote temperature sensors is

to measure the change in VBE at two different operating points

of a diode. For a bias current ratio of N:1, this difference is

given as:

where:

•η is the non-ideality factor of the process the diode is

manufactured on,

•q is the electron charge,

•k is the Boltzmann's constant,

•N is the current ratio,

•T is the absolute temperature in °K.

The temperature sensor then measures ΔVBE and converts

to IT digital data. In this equation, k and q are well defined

universal constants, and N is a parameter controlled by the

temperature sensor. The only other parameter is η, which de-

pends on the diode that is used for measurement. Since

ΔVBE is proportional to both η and T, the variations in η cannot

be distinguished from variations in temperature. Since the

non-ideality factor is not controlled by the temperature sensor,

it will directly add to the inaccuracy of the sensor. For the

Pentium II, Intel specifies a ±1% variation in η from part to

part. As an example, assume a temperature sensor has an

accuracy specification of ±3 °C at room temperature of 25 °C

and the process used to manufacture the diode has a non-

ideality variation of ±1%. The resulting accuracy of the tem-

perature sensor at room temperature will be:

TACC = ± 3°C + (±1% of 298 °K) = ±6°C

The additional inaccuracy in the temperature measurement

caused by η can be eliminated if each temperature sensor is

calibrated with the remote diode that it will be paired with.

2.4 PCB LAYOUT to MINIMIZE NOISE

In a noisy environment, such as a processor motherboard,

layout considerations are very critical. Noise induced on

traces running between the remote temperature diode sensor

and the LM88 can cause temperature conversion errors. The

following guidelines should be followed:

1. Place a 0.1 μF power supply bypass capacitor as close

as possible to the VDD pin and the recommended 2.2 nF

capacitor as close as possible to the D+ and D− pins.

Make sure the traces to the two 2.2nF capacitor are

matched.

2. The recommended 2.2nF diode bypass capacitor

actually has a range of 200pF to 3.3nF. The average

temperature accuracy will not change over that

capacitance range. Increasing the capacitance will lower

the corner frequency where differential noise error will

start to affect the temperature reading thus producing a

reading that is more stable. Conversely, lowering the

capacitance will increase the corner frequency where

differential noise error starts to affect the temperature

reading thus producing a reading that is less stable.

3. Ideally, the LM88 should be placed within 10cm of the

remote diode pins with the traces being as straight, short

and identical as possible. Trace resistance of 1Ω can

cause as much as 1°C of error. This error can be

compensated by using the Remote Temperature Offset

Registers, since the value placed in these registers will

automatically be subtracted or added to the remote

temperature reading.

4. Diode traces should be surrounded by a GND guard ring

to either side, above and below if possible. This GND

guard should not go between the D+ and D− lines so that

in the event that noise does couple to the diode lines, it

would be coupled common mode and rejected.(See

Figure 4)

5. Avoid routing diode traces in close proximity to power

supply switching or filtering inductors.

6. Avoid running diode traces close to or parallel to high

speed digital and bus lines. Diode traces should be kept

at least 2cm apart from the high speed digital traces.

7. If it is necessary to cross high speed digital traces, the

diode traces and the high speed digital traces should

cross at a 90 degree angle.

8. The ideal place to connect the LM88's GND pin is as

close as possible to the processor GND associated with

the sense diode.

9. Leakage current between D+ and GND should be kept

to a minimum. One nano-ampere of leakage can cause

as much as 1°C of error in the diode temperature reading.

Keeping the printed circuit board as clean as possible will

minimize leakage current.

10132633

FIGURE 4. Ideal Diode Trace Layout

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101326 Version 3 Revision 2 Print Date/Time: 2011/10/06 11:23:01

LM88

3.0 Applications Circuits

10132614

FIGURE 5. Pentium processor Thermal Management with Fan Control

10132603

FIGURE 6. Card Bus Thermal Management

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101326 Version 3 Revision 2 Print Date/Time: 2011/10/06 11:23:01

LM88

Physical Dimensions inches (millimeters) unless otherwise noted

8-Lead Molded Mini Small Outline Package (MSOP)

(JEDEC REGISTRATION NUMBER M0-187)

Order Number LM88CIMM, or LM88CIMMX

NS Package Number MUA08A

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101326 Version 3 Revision 2 Print Date/Time: 2011/10/06 11:23:01

LM88

Notes

LM88 Factory Programmable Dual Remote-Diode Thermostat

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specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265