AT27C010-45TC - Atmel Corporation

Features

•Fast Read Access Time - 45 ns

•Low-Power CMOS Operation

– 100 µA max. Standby

– 25 mA max. Active at 5 MHz (AT27C010L)

– 35 mA max. Active at 5 MHz (AT27C010)

•JEDEC Sta ndard Packages

– 32-Lead 600-mil PDIP

– 32-Lead PLCC

– 32-Lead TSOP

•5V ± 10% Supply

•High Reliability CMOS Technology

– 2000V ESD Protection

– 200 mA Latchup Immunity

•Rapid™ Pr o gramm ing Algorith m - 100 µs/b y te (typic al)

•CMOS and TTL Compatible Inputs and Outputs

•Integrated Product Identification Code

•Commercial, Industrial and Automotive Temperature Ranges

Description

The AT27C01 0( L) is a l ow- pow er, high-per forma nc e 1,04 8,5 76- bi t o ne-ti me pr og ram-

mable read onl y memory (OTP EPRO M) organized as 128K by 8 bits. They require

only one 5V power su pply in normal re ad mode ope ratio n. Any by te can be ac cesse d

in less than 45 ns, eliminating the need for speed reducing WAIT states on high-per-

form ance microprocessor systems.

Two power v ersio ns are o ffered . In read mode, the AT27 C010 typica lly c onsumes 25

mA while the AT27C010L requires only 8 mA. Standby mode supply current for both

parts is typically less than 10 µA.

1-Megabit

(128K x 8)

OTP EPROM

AT27C010(L)

Rev. 0321J–07/98

1M bit EPROM

Pin Configurations

Pin Name Function

A0 - A16 Addresses

O0 - O7 Outputs

CE Chip Enable

OE Out put Enable

PGM Program Strobe

NC No Connect TSOP Top View

Type 1

A11

A13

A14

PGM

VCC

VPP

A16

A15

A12

A10

GND

PLCC Top View

A14

A13

A11

A10

GND

A12

A15

A16

VPP

VCC

PGM

(continued)

PDIP Top View

VPP

A16

A15

A12

GND

VCC

PGM

A14

A13

A11

A10

AT27C010(L)

The AT27C010(L) in available in a choice of industry stan-

dard JEDEC-approved one-time programmable (OTP)

plast ic PDIP, PL CC, and TSOP pack ages. All devic es fea-

ture two line control (CE, OE) to give de signe rs the fle xibil-

ity to prevent bus contention.

With 128K byte storage capability, the AT27C010(L) allows

firmware to be stored reliably and to be accessed by the

system without the delays of mass storage media.

Atmel ’s 27C0 10(L) ha ve additi onal fe atures to ensure hi gh

quality and efficient pr oducti on use. The Rapid™ Pr ogram-

ming A lgorith m reduces the time require d to progr am the

part and guarantees reliable programming. Programming

time is typically on ly 100 µs/by te. The Inte grated Pro duct

Identification Code electron ically id entifies the devic e and

manufacturer. This feature is used by industry standard

progra mmin g equipm ent to sele ct t he p rop er pr ogr ammin g

algorithms and voltages.

System Considerations

Switching between active and standby conditions via the

Chip Enabl e pi n may pr odu ce tra ns ien t vo ltag e ex cu rs ions .

Unless accommodated by the system design, these tran-

sients may exceed data sheet limits, resulting in device

non-c onforman ce. At a mi nimum, a 0. 1 µF high frequency,

low inherent inductance, ceramic capacitor should be uti-

lized for each device. T his capacitor should be connected

between the VCC and Ground terminals of the device, as

close to the device as possible. Additionally, to stabilize the

supply voltage level on printed circuit boards with large

EPROM arrays, a 4.7 µF bulk electrolytic capacitor should

be utilized, again connected between the VCC and Ground

terminals. This capacitor should be positioned as close as

possible to the point where the power supply is connected

to the array.

Bloc k Diagram

AT27C010(L)

Note: 1. Minimum voltage is -0.6V dc which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is

VCC + 0.75V dc which may overshoot to +7.0 volts for pulses of less than 20 ns.

Notes: 1. X can be VIL or VIH.

2. Refer to Programming Characteristics.

3. VH = 12.0 ± 0.5V.

4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled l ow

(VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.

Absolute Maximum Ratings*

Temperature Under Bias................................ -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute Maxi-

mum Ratings” may cause permanent damage to

the device. This is a stress rating only and func-

tional operation of the device at these or any other

conditions beyond those indicated in the opera-

tional sections of this specification is not implied.

Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

Storage Temperature..................................... -65°C to +150°C

Voltage on Any Pin with

Respect to Ground .........................................-2.0V to +7.0V(1)

Voltage on A9 with

Respect to Ground ......................................-2.0V to +14.0V(1)

VPP Supply Voltage with

Respect to Ground .......................................-2.0V to +14.0V(1)

Operating Modes

Mode\Pin CE OE PGM Ai VPP Outputs

Read VIL VIL X(1) Ai X DOUT

Output Disable X VIH XXXHigh Z

Standby VIH XXXXHigh Z

Rapid Program(2) VIL VIH VIL Ai VPP DIN

PGM Verify VIL VIL VIH Ai VPP DOUT

PGM Inhibit VIH XX X V

PP High Z

Product Identification(4) VIL VIL XA9 = VH(3)

A0 = VIH or VIL

A1 - A16 = VIL

X Identification Co de

AT27C010(L)

Notes: 1. VCC must be applied simultaneously or before VPP

, and removed simultaneously or after VPP

2. VPP may be connect ed dire ctl y to VCC, ex cep t d urin g p rog ramming. The sup pl y c urre nt w o ul d then be the su m of ICC and I PP

Notes: 2,3,4,5. - see AC Waveforms for Read Operation.

DC and AC Operating Conditions for Read Operation

AT27C010/AT27C010L

-45 -55 -70 -90 -12 -15

Operating

Temp. (Case)

Com. 0°C - 70°C0

C - 70°C0

C - 70°C

Ind. -40°C - 85°C-40

C - 85°C-40

C - 85°C

Auto. -40°C - 125°C-40

C - 125°C-40

C - 125°C

VCC Pow er Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%

DC and Operating Characteristics for Read Operation

Symbol Parameter Condition Min Max Units

ILI Input Load Current VIN = 0V to VCC Com., Ind. ± 1µA

Auto. ± 5µA

LO Output Leakage Current VOUT = 0V to VCC Com., Ind. ± 5µA

Auto. ±10 µA

IPP1(2) VPP(1)) Read/Standby Current VPP = VCC 10 µA

ISB VCC(1) Standby Current ISB1 (CMOS), CE = VCC ± 0.3V 100 µA

ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1 mA

ICC VCC Active Current f = 5 MHz, IOUT = 0 mA,

CE = VIL

AT27C010(L) 25 mA

AT27C010 35 mA

VIL Input Lo w Voltage -0.6 0.8 V

VIH Input High Voltage 2.0 VCC + 0.5 V

VOL Output Low Voltage IOL = 2.1 mA 0.4 V

VOH Output High Voltage IOH = -400 µA2.4V

AC Characteristics for Read Operation

Symbol Parameter Condition

AT27C010/AT27C010L

Units

-45 -55 -70 -90 -12 -15

Min Max Min Max Min Max Min Max Min Max Min Max

tACC(3) Address to Output Delay CE =OE=V

IL 45 55 70 90 120 150 ns

tCE(2) CE to Output Delay OE = VIL 45 55 70 90 120 150 ns

tOE(2)(3) OE to Output Delay CE = VIL 20 25 30 35 35 40 ns

tDF(4)(5) OE or CE High to Output Float , whichever occurred

first 20 20 25 25 30 35 ns

tOH Output Hold from Address, CE or OE, whichever

occurred first 777000ns

AT27C010(L)

AC Waveforms for Read Operation(1)

Notes: 1. Timing measurement reference level is 1.5V for -45 and -55 devices. Input AC drive levels are VIL = 0.0V and VIH = 3.0V.

Timing measurement reference levels for all other speed grades are VOL = 0.8V and VOH = 2.0V. Input AC drive levels are

VIL = 0.45V and VIH = 2.4V.

2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.

3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC.

4. This parameter is only sampled and is not 100% tested.

5. Output float is defined as the point when data is no longer driven.

Input Test Waveforms and

Measurement Levels Output Test Load

Note: 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.

tR, tF < 5 ns (10% to 90%)

For -45 and -55 devices only:

tR, tF < 20 ns (10% to 90%)

For -70, -90, -12, -15, and -20 devices: Note: CL = 100 pF in cludi ng jig

capacitance, except for

the -45 and -55 devices,

where CL=30pF.

Pin Capacitance

f = 1 MHz, T = 2 5°C(1)

Symbol Typ Max Units Conditions

CIN 48pFV

IN = 0V

COUT 812pFV

OUT = 0V

AT27C010(L)

Programming Waveforms(1)

Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.

2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer.

3. When programming the AT27C010(L) at 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage

transients.

DC Pr ogramming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions

Limits

UnitsMin Max

ILI Input Load Current VIN = VIL, VIH ±10 µA

VIL Input Low Level -0.6 0.8 V

VIH Input High Level 2.0 VCC + 1 V

VOL Output Lo w Voltage IOL = 2.1 mA 0.4 V

VOH Output High Voltage IOH = -400 µA2.4 V

CC2 VCC Supply Current (Program and Verify) 40 mA

IPP2 VPP Supply Current CE = PGM = VIL 20 mA

VID A9 Product Identification Voltage 11.5 12.5 V

AT27C010(L)

Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP

2. This para meter i s only sample d and i s not 1 00% te sted. O utput Flo at is defi ned as the po int wh ere dat a is no longe r driv en—

see timing diagram.

3. Program Pulse width tolerance is 100 µsec ± 5%.

AC Pr ogramming Characteristics

TA = 25 ± 5°C, VCC = 6.5 ± 0.25 V, VPP = 13.0 ± 0.25V

Symbol Parameter Test Conditions(1)

Limits

UnitsMin Max

tAS Address Setup Time

Input Rise and Fall Times

(10% to 90%) 20ns

Input Pulse Levels 0.45V to 2.4V

Input Timing Reference Level

0.8V to 2.0V

Output Timing Reference Level

0.8V to 2.0V

2µs

tCES CE Setup Time 2 µs

tOES OE Setup Time 2 µs

tDS Data Setup Time 2 µs

tAH Address Hold Time 0 µs

tDH Data Hold Time 2 µs

tDFP OE High to Output Float Delay(2) 0 130 ns

tVPS VPP Setup Time 2 µs

tVCS VCC Setup Time 2 µs

tPW PGM Program Pulse Widt h(3) 95 105 µs

tOE Data Valid from OE 150 ns

tPRT VPP Pulse Rise TIme

During Programming 50 ns

Atmel’s 27C010(L) Integrat ed Product Identification Code

Codes

Pins Hex

DataA0 O7 O6 O5 O4 O3 O2 O1 O0

Manufacturer 000011110 1E

Device Type 100000101 05

AT27C010(L)

Rapid Programming Algorithm

A 100 µs PGM pulse width is used to program. The

address is set to the first location. VCC is raised to 6.5V and

VPP is raised to 13 .0V. Each addr ess is firs t programme d

with one 100 µs PGM pulse wit hout verification. Then a

verification / reprogramming loop is executed for each

addres s. In the event a byte fails to pa ss verif ication, up to

10 successive 100 µs pulses are appli ed with a ver ifica tion

after each pulse. If the byte fails to verify after 10 pulses

have been appl ied, the part is c onsidered failed. A fter the

byte verifies properly, the next address is selected until all

have been checked. VPP is then lowered to 5.0V and VCC to

5.0V. All bytes ar e rea d ag ain and compared wi th th e or ig i-

nal data to determine if the device passes or fails.

AT27C010(L)

AT27C010 Ordering Information

tACC

(ns)

ICC (mA)

Ordering Code Package Operation RangeActive Standby

45 35 0.1 AT27C010-45JC

AT27C010-45PC

AT27C010-45TC

32J

32P6

32T

Commercial

(0°C to 70°C)

35 0.1 AT27C010-45JI

AT27C010-45PI

AT27C010-45TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

55 35 0.1 AT27C010-55JC

AT27C010-55PC

AT27C010-55TC

32J

32P6

32T

Commercial

(0°C to 70°C)

35 0.1 AT27C010-55JI

AT27C010-55PI

AT27C010-55TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

70 35 0.1 AT27C010-70JC

AT27C010-70PC

AT27C010-70TC

32J

32P6

32T

Commercial

(0°C to 70°C)

35 0.1 AT27C010-70JI

AT27C010-70PI

AT27C010-70TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

Package Type

32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)

32P6 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

32T 32-Lead, Plastic Thin Small Outline Package (TSOP)

(continued)

AT27C010(L)

90 35 0.1 AT27C010-90JC

AT27C010-90PC

AT27C010-90TC

32J

32P6

32T

Commercial

(0°C to 70°C)

35 0.1 AT27C010-90JI

AT27C010-90PI

AT27C010-90TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

35 0.1 AT27C010-90JA

AT27C010-90PA 32J

32P6 Automotive

(-40°C to 125°C)

120 35 0.1 AT27C010-12JC

AT27C010-12PC

AT27C010-12TC

32J

32P6

32T

Commercial

(0°C to 70°C)

35 0.1 AT27C010-12JI

AT27C010-12PI

AT27C010-12TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

35 0.1 AT27C010-12JA

AT27C010-12PA 32J

32P6 Automotive

(-40°C to 125°C)

150 35 0.1 AT27C010-15JC

AT27C010-15PC

AT27C010-15TC

32J

32P6

32T

Commercial

(0°C to 70°C)

35 0.1 AT27C010-15JI

AT27C010-15PI

AT27C010-15TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

35 0.1 AT27C010-15JA

AT27C010-15PA 32J

32P6 Automotive

(-40°C to 125°C)

AT27C 010 Ordering Information (Continued)

tACC

(ns)

ICC (mA)

Ordering Code Package Operation RangeActive Standby

Package Type

32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)

32P6 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

32T 32-Lead, Plastic Thin Small Outline Package (TSOP)

AT27C010(L)

AT27C010L Ordering Information

tACC

(ns)

ICC (mA)

Ordering Code Package Operation RangeActive Standby

45 25 0.1 AT27C010L-45JC

AT27C010L-45PC

AT27C010L-45TC

32J

32P6

32T

Commercial

(0°C to 70°C)

25 0.1 AT27C010L-45JI

AT27C010L-45PI

AT27C010L-45TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

55 25 0.1 AT27C010L-55JC

AT27C010L-55PC

AT27C010L-55TC

32J

32P6

32T

Commercial

(0°C to 70°C)

25 0.1 AT27C010L-55JI

AT27C010L-55PI

AT27C010L-55TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

70 25 0.1 AT27C010L-70JC

AT27C010L-70PC

AT27C010L-70TC

32J

32P6

32T

Commercial

(0°C to 70°C)

25 0.1 AT27C010L-70JI

AT27C010L-70PI

AT27C010L-70TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

90 25 0.1 AT27C010L-90JC

AT27C010L-90PC

AT27C010L-90TC

32J

32P6

32T

Commercial

(0°C to 70°C)

25 0.1 AT27C010L-90JI

AT27C010L-90PI

AT27C010L-90TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

120 25 0.1 AT27C010L-12JC

AT27C010L-12PC

AT27C010L-12TC

32J

32P6

32T

Commercial

(0°C to 70°C)

25 0.1 AT27C010L-12JI

AT27C010L-12PI

AT27C010L-12TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

150 25 0.1 AT27C010L-15JC

AT27C010L-15PC

AT27C010L-15TC

32J

32P6

32T

Commercial

(0°C to 70°C)

25 0.1 AT27C010L-15JI

AT27C010L-15PI

AT27C010L-15TI

32J

32P6

32T

Industrial

(-40°C to 85°C)

Package Type

32J 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)

32P6 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)

32T 32-Lead, Plastic Thin Small Outline Package (TSOP)

AT27C010(L)

Packaging Information

.045(1.14) X 45˚ PIN NO.1

IDENTIFY .025(.635) X 30˚ - 45˚

.012(.305)

.008(.203)

.021(.533)

.013(.330)

.530(13.5)

.490(12.4)

.030(.762)

.015(.381)

.095(2.41)

.060(1.52)

.140(3.56)

.120(3.05)

.032(.813)

.026(.660)

.050(1.27) TYP

.553(14.0)

.547(13.9)

.595(15.1)

.585(14.9)

.300(7.62) REF

.430(10.9)

.390(9.90)

AT CONTACT

POINTS

.022(.559) X 45˚ MAX (3X)

.453(11.5)

.447(11.4)

.495(12.6)

.485(12.3)

1.67(42.4)

1.64(41.7) PIN

.566(14.4)

.530(13.5)

.090(2.29)

MAX

.005(.127)

MIN

.065(1.65)

.015(.381)

.022(.559)

.014(.356)

.065(1.65)

.041(1.04)

.630(16.0)

.590(15.0) 0

15 REF

.690(17.5)

.610(15.5)

.012(.305)

.008(.203)

.110(2.79)

.090(2.29)

.161(4.09)

.125(3.18)

SEATING

PLANE

.220(5.59)

MAX

1.500(38.10) REF

*Controlling dimension: millimeters

INDEX

MARK

18.5(.728)

18.3(.720) 20.2(.795)

19.8(.780)

0.25(.010)

0.15(.006)

0.50(.020)

BSC 7.50(.295)

REF

8.20(.323)

7.80(.307) 1.20(.047) MAX

0.15(.006)

0.05(.002)

5REF

0.70(.028)

0.50(.020)

0.20(.008)

0.10(.004)

32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)

Dimensions in Inches and (Millimeters)

JEDEC STANDARD MS-016 AE

32P6, 32-Lead, 0.600" Wide, Plastic Dual Inline

Package (PDIP)

Dimensions in Inches and (Millimeters)

32T, 32-Lead, Plastic Thin Small Outline Package

(TSOP)

Dimensions in Millimeters and (Inches)*

JEDEC OUTLINE MO-142 BD

AT27C010(L)

Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war-

ranty which is detailed in Atmel’s Ter ms and Conditions located on the Company’s website. The Company assumes no responsibility for

any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without

notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual prop-

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not authorized for use as critical components in life suppor t devices or systems.

Marks bearing ® and/or ™ are registered trademarks and trademarks of Atmel Cor poration.

Ter ms and product names in this document may be trademarks of others.

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0321J–07/98/xM