AFBR-59R5LZ - Avago Technologies - Datasheet.Directory

Description

Avago Technologies’ AFBR-59R5LZ optical transceiver

supports high-speed serial links over multimode optical

 ber at signaling rates up to 4.25 GBd. Compliant with

the Small Form Factor (SFF) Multi Source Agreement

(MSA) 2x5/2x10 mechanical speci cations for LC Duplex

transceivers, ANSI Fibre Channel FC-PI and IEEE 802.3 for

gigabit applications the part is electrically interoperable

with 2x5 and 2x6 conformant devices. The AFBR-59R5LZ

is dimensionally compliant with the SFF MSA form factor

with the exception of two additional pins for communi-

cating with the diagnostic interface.

As an enhancement to the conventional SFF 2x5 interface

de ned in the SFF MSA (Multi-Source Agreement), the

AFBR-59R5LZ is compliant to SFF-8472 (digital diagnostic

interface for optical transceivers). Using the 2-wire serial

interface de ned in the SFF-8472 MSA, the AFBR-59R5LZ

provides real time temperature, supply voltage, laser bias

current, laser average output power and received average

input power.

This information is in addition to conventional SFP/GBIC

base data. The digital diagnostic interface also adds the

ability to disable the transmitter (TX_DISABLE), moni-

tor for Transmitter Faults (TX_FAULT) and monitor for

Receiver Signal Detect (Sig_Det). This 2x7 package also

includes one dedicated ‘hard’ pin for TX_FAULT.

Application

 Fibre Channel and iSCSI HBA Cards

Related Products

 AFBR-57R5APZ: 850 nm +3.3 V LC SFP for

4.25/2.125/1.0625 GBd Fibre Channel

AFBR-59R5LZ

Digital Diagnostic 2x7 SFF 850 nm 4.25/2.125/1.0625 GBd,

RoHS-Compliant Optical Transceiver

Data Sheet

Features

 Fully RoHS Compliant

 Diagnostic Features Per SFF-8472 “Diagnostic

Monitoring Interface for Optical Transceivers”

 Real time monitoring of:

- Transmitted Optical Power

- Received Optical Power

- Laser Bias Current

- Temperature

- Supply Voltage

 Wide Temp and supply voltage operation

(-10°C to 85°C) (3.3 +/- 10%)

 Transceiver Speci cations per SFF 2x5 Multi-Source

Agreement and SFF-8472 (revision 9.3)

- 4.25 GBd Fibre Channel operation

for FC-PI 400-M5-SN-I and 400-M6-SN-I

- 2.125 GBd Fibre Channel operation

for FC-PI 200-M5-SN-1 and 200-M6-SN-I

- 1.0625 GBd Fibre Channel operation

for FC-PI 100-M5-SN-I and 100-M6-SN-I

 Link Lengths at 4.25 Gbd:

- 150 m with 50 um MMF, 70 m with 62.5 um MMF

 Link Lengths at 2.125 Gbd

- 300m with 50um MMF, 150m with 65.5um MMF

 Link Lengths at 1.0625 GBd:

- 500 m with 50 μm MMF, 300 m with 62.5 μm MMF

 LC Duplex optical connector interface conforming

to ANSI TIA/EIA604-10 (FOCIS 10A)

 850nm Vertical Cavity Surface Emitting Laser

(VCSEL) Source Technology

 IEC 60825-1 Class 1/CDRH Class 1 laser eye safe

 Compatible with Gigabit Ethernet

Figure 1. Transceiver Functional Diagram

Digital Diagnostic Interface and Serial Identi cation

The 2-wire serial interface is based on ATMEL AT24C01A

series EEPROM protocol and signaling detail. Conven-

tional EEPROM memory, bytes 0-255 at memory address

0xA0, is organized in compliance with SFF-8074i. New

digital diagnostic information, bytes 0-255 at memory

address 0xA2, is compliant to SFF-8472. The new diag-

nostic information provides the opportunity for Predic-

tive Failure Identi cation, Compliance Prediction, Fault

Isolation and Component Monitoring.

The I2C accessible memory page address 0xB0 is used

internally by SFP for the test and diagnostic purposes

and it is reserved.

Predictive Failure Identi cation

The predictive failure feature allows a host to identify

potential link problems before system performance is

impacted. Prior identi cation of link problems enables

a host to service an application via “fail over” to a redun-

dant link or replace a suspect device, maintaining system

uptime in the process. For applications where ultra-high

system uptime is required, a digital SFF provides a means

to monitor two real-time laser metrics associated with

observing laser degradation and predicting failure: aver-

age laser bias current (Tx_Bias) and average laser optical

power (Tx_Power).

Compliance Prediction:

Compliance prediction is the ability to determine if an

optical transceiver is operating within its operating and

environmental requirements. AFBR-59R5LZ devices

provide real-time access to transceiver internal supply

voltage and temperature, allowing a host to identify

potential component compliance issues. Received

optical power is also available to assess compliance of

a cable plant and remote transmitter. When operating

out of requirements, the link cannot guarantee error free

transmission.

Fault Isolation

The fault isolation feature allows a host to quickly pin-

point the location of a link failure, minimizing system

downtime. For optical links, the ability to identify a fault

at a local device, remote device or cable plant is crucial

to speeding service of an installation. AFBR-59R5LZ real-

time monitors of Tx_Bias, Tx_Power, Vcc, Temp and Rx

average power can be used to assess local transceiver

current operating conditions. In addition, status  ags Tx

Disable and Rx Signal Detect are mirrored in memory and

available via the two-wire serial interface.

LIGHT FROM FIBER

LIGHT TO FIBER

PHOTO-DETECTOR

RECEIVER

AMPLIFICATION

& QUANTIZATION

RD+ (RECEIVE DATA)

RD- (RECEIVE DATA)

Rx LOSS OF SIGNAL

VCSEL

TRANSMITTER

LASER

DRIVER &

SAFETY

CIRCUITRY

TX_DISABLE

TD+ (TRANSMIT DATA)

TD- (TRANSMIT DATA)

TX_FAULT

ELECTRICAL INTERFACE

MOD-DEF2 (SDA)

MOD-DEF1 (SCL)

MOD-DEF0

CONTROLLER & MEMORY

OPTICAL INTERFACE

Component Monitoring

The AFBR-59R5LZ real-time monitors of Tx_Bias, Tx_Pow-

er, Vcc, Temp and Rx Average Power may potentially be

used as a debugging aid for system installation and de-

sign, and transceiver parametric evaluation for factory or

 eld quali cation. For example, temperature per module

can be observed in high-density applications to facilitate

thermal evaluation of blades and systems.

Transmitter Section

The transmitter section contains 850nm VCSEL (Vertical

Cavity Surface Emitting Laser) light source, located at the

optical interface which mates with the LC optical con-

nector. The VCSEL is driven by a custom IC which uses

the incoming di erential (PECL compatible) high speed

logic signal to modulate laser diode driver current. This

Tx laser driver circuit regulates optical output power at a

constant level provided the incoming data pattern is dc

balanced (8B/10B code, for example).

Transmit Disable (Tx_Disable)

The AFBR-59R5LZ accepts a TTL transmit disable control

signal input which shuts down the transmitter. A high

signal implements this function while a low signal allows

normal transceiver operation. In the event of a fault (e.g.

eye safety circuit activated), cycling this control signal

resets the module as depicted in Figure 5. An internal

pull down resistor enables the laser if the line is not con-

nected on the host board. Host systems should allow

a 10ms interval between successive assertions of this

control signal. Tx_Disable can be asserted via the two-

wire serial interface (address A2h, byte 110, bit 6) and

monitored (address A2h, byte 110, bit 7).

The contents of A2h, byte 110 bit 6 are logic Or’d with the

TX_DISABLE pin to control the transmit output.

Eye Safety Circuit

The AFBR-59R5LZ provides Class 1 (single fault tolerant)

eye safety by design and has been tested for compliance

with the requirements listed in Table 1. The eye safety

circuit continuously monitors optical output power levels

and will disable the transmitter upon detecting an un-

safe condition beyond the scope of Class 1 certi cation.

Such unsafe conditions can be due to inputs from the

host board (Vcc  uctuation, unbalanced code) or a fault

within the transceiver.

Receiver Section

The receiver section contains a PIN photodiode and cus-

tom transimpedance preampli er, located at the optical

interface which mates with the LC optical connector. The

output is fed to a custom IC that provides post-ampli ca-

tion and quantization.

Signal Detect (Sig_Det)

The post-ampli cation IC also includes the transition

detection circuitry which monitors the ac level of incom-

ing optical signals and provides a TTL status signal to the

host. An adequate optical input results in high signal

detect output while a low signal detect output indicates

an unusable optical input. The signal detect thresholds

are set so that a low output indicates a de nite optical

fault has occurred. Signal Detect can be monitored via

the two-wire serial (address A2h, byte 110, bit 1).

Functional Data I/O

The AFBR-59R5LZ interfaces with the host circuit board

through fourteen I/O pins (2x7) identi ed by function

in Table 2. These pins are sized for the use in boards be-

tween 0.062 in. and 0.100 in. thick. The board layout for

this interface is depicted in Figure 7.

The AFBR-59R5LZ transmit and receive interfaces are

PECL compatible. To simplify board requirements,

transmitter bias resistors and ac coupling capacitors are

incorporated into the transceiver module and so are not

required on the host board. The Tx_Disable and Signal

Detect lines require TTL lines on the host board if they

are to be utilized. The transceiver will operate normally if

these lines are not connected on the host board.

Figure 2 depicts the recommended interface circuit to

link the AFBR-59R5LZ to the supporting physical layer

ICs. Timing for MSA compliant control signals imple-

mented in the transceiver are listed on Page 12 and

diagramed in Figure 5.

PCB Assembly Process Compatibility

The AFBR-59R5LZ is compatible with industry standard

wave solder and aqueous wash processes as detailed on

Page 13. The transceiver is shipped with a process plug

to keep out impinging liquids, but is not intended to be

immersed. After assembly, the process plug should be

kept in place as a dust plug when the transceiver is not

in use.

Caution

There are no user serviceable parts nor maintenance

requirements for the AFBR-59R5LZ. All mechanical

adjustments are made at the factory before shipping.

Tampering with, modifying, misusing or improperly han-

dling the AFBR-59R5LZ will void the product warranty.

It may also result in improper operation and possibly

overstress the laser source. Performance degradation

or device failure may result. Connection of the AFBR-

59R5LZ to a light source not compliant to IEEE 802.3 or

ANSI FC-PI speci cations, operating above the maximum

operating conditions or in a manner inconsistent with it’s

design and function may result in exposure to hazardous

light radiation and may constitute an act of modifying or

manufacturing a laser product.

Persons performing such an act are required by law to

re-certify and re-identify the laser product under the

provisions of U.S. 21 CFR (Subchapter J) and the TUV.

Ordering Information

Please contact your local  eld sales engineer or one of

Avago Technologies franchised distributors for ordering

information. For technical information, please visit Ava-

go Technologies’ WEB page at www.avagotech.com or

contact Avago Technologies Customer Response Center

at 1-800-235-0312. For information related to SFF Com-

mittee documentation visit www.s committee.org

Table 1. Regulatory Compliance

Feature Test Method Performance

Electrostatic Discharge (ESD)

to the Electrical Pins

MIL-STD-883C

Method 3015.4

Class 1 (> 2000 Volts)

Electrostatic Discharge (ESD)

to the Duplex LC Receptacle

Variation of IEC 61000-4-2 Typically withstands at least 15 kV without dam-

age when the duplex LC connector receptacle is

contacted by a Human Body Model probe.

Ful lls Live Tra c ESD testing up to 8 kV with

less than 1 errored second.

Electromagnetic Interference

(EMI)

FCC Class B

CENELEC EN55022 Class B

(CISPR 22A)

VCCI Class 1

System margins are dependent on customer

board and chassis design.

Immunity Variation of IEC 61000-4-3 Typically shows no measurable e ect from a 10

V/m  eld swept from 10 MHz to 1 GHz applied

to the transceiver without a chassis enclosure

Laser Eye Safety and

Equipment Type Testing

US FDA CDRH AEL Class 1

US21 CFR, Subchapter J per Paragraphs

1002.10 and 1002.12.

(IEC) EN60825-1: 2007

(IEC) EN60825-2: 2004+A1

(IEC) EN60950-1: 2006+A11

CDRH certi cation #9720151-57

TUV  le #R72102088.01

Component Recognition Underwriters Laboratories and Canadian

Standards Association Joint Component

Recognition for Information Technology

Equipment Including Electrical Business

Equipment

UL File # E173874

Must comply with UL1950 or CUL 1950.

RoHS Compliance Less than 1000ppm of cadmium, lead, mercury,

hexavalent chromium, polybrominated biphe-

nyls, and polybrominated biphenyl ethers

Regulatory Compliance

The AFBR-59R5LZ complies with all applicable laws and

regulations as detailed in Table 1. Certi cation level

is dependent on the overall con guration of the host

equipment. The transceiver performance is o ered as a

 gure of merit to assist the designer.

Electrostatic Discharge (ESD)

The AFBR-59R5LZ is compatible with ESD levels found

in typical manufacturing and operating environments

as described in Table 1. In the normal handling and op-

eration of optical transceivers, ESD is of concern in two

circumstances.

The  rst case is during handling of the transceiver prior

to soldering onto the host board. To protect the device,

it’s important to use normal ESD handling precautions.

These include using grounded wrist straps, workbenches

and  oor mats wherever the transceiver is handled.

The second case to consider is static discharges to the

exterior of the host equipment chassis after assembly.

If the optical interface is exposed to the exterior of host

equipment cabinet, the transceiver may be subject to

system level ESD requirements.

Electromagnetic Interference (EMI)

Equipment incorporating gigabit transceivers is typically

subject to regulation by the FCC in the United States, TUV

and CENELEC EN55022 (CISPR 22) in the European Union

and VCCI in Japan. The AFBR-59R5LZ’s compliance to

these standards is detailed in Table 1. The metal housing

and shielded design of the AFBR-59R5LZ minimize the

EMI challenge facing the equipment designer.

Flammability

The AFBR-59R5LZ optical transceiver is made of metal

and high strength, heat resistant, chemical resistant and

UL 94V-0  ame retardant plastic.

EMI Immunity

Due to its shielded design, the EMI immunity of the

AFBR-59R5LZ exceeds typical industry standards.

BAUART

GEPRUFT

TYPE

APPROVED

TUV

Rheinland

Product Safety

Figure 2. Typical Application Con guration

Figure 3. Recommended Power Supply Filter

LASER DRIVER

RX_SD

SCL

SDA

Tx_FAULT

Tx_DISABLE

TD+

Tx FAULT

Tx DIS

TDÐ

RD+

RX_SD

SDA

SCL

VCC,R

GND

4.7 k to 10 k

PROTOCOL IC

GND

1 H

10 F 0.1 F

0.1 F

10 F 0.1 F

3.3 V

SERDES IC

GND,T

0.01 F

POST AMPLIFIER

100

4.7 k to 10 k

100

6.8 k

0.01 F

4.7 k to 10 k

RD-

GND

1 µH

0.1 µF

VCCR

SFF MODULE

10 µF

VCCT

0.1 µF 10 µF

3.3 V

HOST BOARD

0.1 µF

NOTE: INDUCTORS MUST HAVE LESS THAN 1 W SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFF MODULE.

Figure 4. Module pin con guration.

TOP VIEW

Table 2. Pin Description

Pin Name Function/Description Notes

EER Receiver Signal Ground 7

CCR Receiver Power Supply: +3.3V 5

3 SD TTL Signal Detect: Active High 3

4 RD- Received Data Out Bar 4

5 RD+ Received Data Out 4

CCT Transmitter Power Supply: +3.3V 5

EET Transmitter Signal Ground 7

8 TX_DISABLE TTL Transmitter Disable: Active High,

(Open = Enabled)

9 TD+ Transmitter Data In 6

10 TD- Transmitter Data In Bar 6

A SDA Serial Interface Data I/O (Mod-def2) 2

B SCL Serial Interface Clock Input (Mod-def1) 2

CNC

D TX_FAULT Transmitter Fault Indication - High Indicates a

fault condition

Notes:

1. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is pulled down with 6.8 k internal to the transceiver.

Low (0 – 0.8 V) or Open: Transmitter Enabled

Between (0.8 V and 2.0 V): Unde ned

High (2.0 – VCC max): Transmitter Disabled

The TX_DISABLE pin state is logic Or’d with the contents of EEPROM address A2h, byte 110 bit 6 (soft disable control bit) to control the trans-

mit output.

2. The signals SDA and SCL designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 k resistor on the host board.

SCL is the serial clock line of two wire serial interface. SDA is the serial data line of two wire serial interface

3. Signal Detect is a normally high LVTTL output. When high it indicates the received optical power is adequate for normal operation. When

Low, it indicates the received optical power is insu cient to guarantee error free operation. In the low state, the output will be pulled to <

0.8 V.

4. RD-/+ designate the di erential receiver outputs. They are ac coupled 100  di erential lines which should be terminated with 100  di er-

ential at the host SerDes input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these

lines will be between 600 and 1600 mV di erential (300 – 800 mV single ended) when properly terminated.

5. VCCR and VCCT are the receiver and transmitter power supplies. They are de ned at the transceiver pins.

6. TD-/+ designate the di erential transmitter inputs. They are ac coupled di erential lines with 100  di erential termination inside the mod-

ule. The ac coupling is done inside the module and is not required on the host board. The inputs will accept di erential swings of 400 – 2400

mV (200 – 1200 mV single ended), though it is recommended that values between 500 and 1200 mV di erential (250 – 600 mV single ended)

be used for best EMI performance.

7. Transmitter and Receiver Ground are common internally on the transceiver PCB. They are electrically connected to signal ground within the

transceiver.

8. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7k – 10k resistor on the host board. When high, this output

indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.

Table 3. Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit Notes

Storage Temperature TS-40 +100 °C 1, 2

Case Operating Temperature TC-40 +100 °C 1, 2

Aqueous Wash Pressure 110 psi

Maximum Wave or Flow Soldering Temperature TF+260 °C 4

Relative Humidity, non condensing RH 5 95 % 1

Supply Voltage VCCT, R -0.5 3.8 V 1, 2, 3

Voltage to any pin -0.5 3.8 V

Low Speed Input Voltage VIN -0.5 VCC + 0.5 V 1

Table 4. Recommended Operating Conditions

Parameter Symbol Minimum Maximum Unit Notes

Case Operating Temperature TC-10 +85 °C 5, 6

Supply Voltage VCCT, R 2.97 3.63 V 6, 7

Data Rate 1.0625 4.25 Gb/s 6

Table 5. Transceiver Electrical Characteristics

(TC = -10°C to +85C, VCCT, VCCR = 3.3 V ± 10%)

Parameter Symbol Minimum Maximum Unit Notes

AC Electrical Characteristics

Power Supply Noise Rejection (Peak-to-Peak) PSNR 100 mV 6

DC Electrical Characteristics

Module Supply Current ICC 210 mA TX + RX

Power Dissipation PDISS 765 mW

Low Speed Outputs:

Signal Detect [SD], SDA VOH

VOL

2.0 VCCT, R + 0.3

0.8

Low Speed Inputs:

Transmitter Disable [TX_DIS], SCL, SDA VIH

VIL

2.00 VCC

0.8

Notes:

1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a

short period of time. See Reliability Data Sheet for speci c reliability performance.

2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability

is not implied, and damage to the device may occur over an extended period of time.

3. The module supply voltages, VCCT and VCCR must not di er by more than 0.5 V or damage to the device may occur.

4. Maximum wave or  ow soldering temperature should not be applied for more than 10 seconds.

5. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.

6. Filter per SFF speci cation is required on host board to remove 10 Hz to 4 MHz content.

7. SCL and SDA are to be pulled up externally with a 4.7 k – 10 k resistor on the host board to 3.3 V.

Table 6. Transmitter and Receiver Electrical Characteristics

(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)

Parameter Symbol Minimum Maximum Unit Notes

High Speed Data Input:

Transmitter Di erential Input Voltage (TD +/-)

VI400 2400 mV 1

High Speed Data Output:

Receiver Di erential Output Voltage (RD +/-)

VO600 1600 mV 2

Receiver Contributed Total Jitter

(4.25 Gb/s)

TJ 0.26 UI 4

62 ps

Receiver Contributed Total Jitter

(2.125 Gb/s)

TJ 0.262 UI 4

123 ps

Receiver Contributed Total Jitter

(1.0625 Gb/s)

TJ 0.218 UI 4

205 ps

Receiver Electrical Output Rise & Fall Times

(20-80%)

tr, tf 50 150 ps 5

Notes:

1. Internally ac coupled and terminated (100 Ohm di erential).

2. Internally ac coupled but requires an external load termination (100 Ohm di erential).

3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern

4. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter

(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed

RJ is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ

remain within their speci ed FC-PI maximum limits with the worst case speci ed component jitter input.

5. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.

Table 7. Transmitter Optical Characteristics

(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)

Parameter Symbol Minimum Maximum Unit Notes

Modulated Optical Output Power (OMA)

(Peak-to-Peak) 4.25 Gb/s

OMA 247 μW 8

Modulated Optical Output Power (OMA)

(Peak-to-Peak) 2.125 Gb/s

OMA 196 μW 3

Modulated Optical Output Power (OMA)

(Peak-to-Peak) 1.0625 Gb/s

OMA 156 μW 4

Average Optical Output Power Pout -9.0 dBm 1, 2

Center Wavelength C830 860 nm

Spectral Width - rms ,rms 0.85 nm

Optical Rise/Fall Time tr, tf 90 ps 7

RIN 12 (OMA) RIN -118 dB/Hz

Transmitter Contributed Total Jitter (4.25 Gb/s) TJ 0.25 UI 6

60 ps

Transmitter Contributed Total Jitter (2.125 Gb/s) TJ 0.254 UI 6

120 ps

Transmitter Contributed Total Jitter (1.0625 Gb/s) TJ 0.267 UI 6

251 ps

Pout TX_DISABLE Asserted POFF -35 dBm

Notes:

1. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power max.

2. Into 50/125 μm (0.2 NA) and 62.5/125 μm (0.275 NA)multimode optical  ber.

3. An OMA of 196 is approximately equal to an average power of –9 dBm assuming an Extinction Ratio of 9 dB.

4. An OMA of 156 is approximately equal to an average power of –10 dBm assuming an Extinction Ratio of 9 dB.

5. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern.

6. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter

(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ

is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ re-

main within their speci ed FC-PI maximum limits with the worst case speci ed component jitter input.

7. Measured 20-80%.

8. An OMA of 247 W is approximately equal to an average power of –8 dBm,avg assuming an Extinction Ratio of 9 dB.

Table 8. Receiver Optical Characteristics

(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)

Parameter Symbol Minimum Maximum Unit Notes

Input Optical Power [Overdrive] PIN 0 dBm, avg

Input Optical Modulation Amplitude (p-p)

4.25 Gb/s

OMA 61 μW, OMA 6, 7

Input Optical Modulation Amplitude (p-p)

2.125 Gb/s

OMA 49 μW, OMA 1, 6

Input Optical Modulation Amplitude (p-p)

1.0625 Gb/s

OMA 31 μW, OMA 2, 6

Stressed receiver sensitivity (OMA)

4.25 Gb/s

138 μW, OMA 50/125 μm  ber, 8

148 μW, OMA 62.5/125 μm  ber, 8

Stressed receiver sensitivity (OMA)

2.125 Gb/s

96 μW, OMA 50/125 μm  ber, 3

109 μW, OMA 62.5/125 μm  ber, 3

Stressed receiver sensitivity (OMA)

1.0625 Gb/s

55 μW, OMA 50/125 μm  ber, 4

67 μW, OMA 62.5/125 μm  ber, 4

Return Loss 12 dB

Signal Detect - Deassert PD27.5 uW, OMA

-30 -17.5 dBm, avg 5

Signal Detect - Assert PA31 uW, OMA

-17.0 dBm, avg 5

Loss of Signal Hysteresis PA - PD0.5 dB

Notes:

1. 50/125 μm. An OMA of 49 is approximately equal to an average power of –15 dBm with an Extinction Ratio of 9dB.

2. 50/125 μm. An OMA of 31 is approximately equal to an average power of –17 dBm with an Extinction Ratio of 9 dB.

3. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.26 dB for 50 μm  ber and 2.03 dB for 62.5 μm  ber. Stressed receiver

DCD component min (at TX) is 40 ps.

4. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 0.96 dB for 50 μm  ber and 2.18 dB for 62.5 μm  ber. Stressed receiver

DCD component min (at TX) is 80 ps.

5. These average power values are speci ed with an Extinction Ratio of 9 dB. The signal detect circuitry responds to valid 8B/10B encoded peak

to peak input optical power, not average power.

6. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.

7. 50/125um. An OMA of 61 W is approximately equal to an average power of –14 dBm with an Extinction Ratio of 9 dB.

8. 4.25 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.67 dB for 50 μm  ber and 2.14 dB for 62.5 μm  ber. Stressed receiver DCD

component min (at TX) is 20 ps.

Table 9. Transceiver Soft Diagnostic Timing Characteristics

(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)

Parameter Symbol Minimum Typical Maximum Unit Notes

Hardware TX_DISABLE Assert Time t_o 10 μs 1

Hardware TX_DISABLE Negate Time t_on 1 ms 2

Time to initialize, including reset of

TX_FAULT

t_init 300 ms 3

Hardware TX_DISABLE to Reset t_reset 10 μs 4

Hardware Signal_Detect Deassert Time t_loss_on 100 μs 5

Hardware Signal_Detect Assert Time t_loss_o 100 μs 6

Software TX_DISABLE Assert Time t_o _soft 100 ms 7

Software TX_DISABLE Negate Time t_on_soft 100 ms 8

Software Tx_FAULT Assert Time t_fault_soft 100 ms 9

Software Signal_Detect DeAssert Time t_loss_on_soft 100 ms 10

Software Signal_Detect Assert Time t_loss_o _

soft

100 ms 11

Analog parameter data ready t_data 1000 ms 12

Serial bus hardware ready t_serial 300 ms 13

Write Cycle Time t_write 10 ms 14

Serial ID Clock Rate f_serial_clock 400 kHz

Notes:

1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.

2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.

3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.

4. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.

5. Time from loss of optical signal to Signal Detect De-Assertion.

6. Time from valid optical signal to Signal Detect Assertion.

7. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured

from falling clock edge after stop bit of write transaction.

8. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of

nominal.

9. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.

10. Time for two-wire interface de-assertion of Signal Detect (A2h, byte 110, bit 1) from loss of optical signal.

11. Time for two-wire interface assertion of Signal Detect (A2h, byte 110, bit 1) from presence of valid optical signal.

12. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.

13. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).

14. Time from stop bit to completion of a 1-8 byte write command.

Table 10. PCB Assembly Process Compatibility

Parameter Symbol Minimum Typical Maximum Unit Notes

Hand Lead Soldering

Temperature/Time

TSOLD/tSOLD + 260/10 °C/sec

Wave Soldering and

Aqueous Wash

TSOLD/tSOLD + 260/10 °C/sec

Aqueous Wash Pressure 110 psi

Table 11. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics

(TC = -10 °C to +85 °C, VCCT, VCCR = 3.3 V ± 10%)

Parameter Symbol Min Units Notes

Transceiver (Internal)

Temperature Accuracy

TINT ± 3.0 °C Temperature is measured internal to the transceiver and does

not re ect case temperature.

Valid from = -10°C to +70 °C internal transceiver temperature.

Transceiver (Internal)

Supply Voltage Accuracy

VINT ± 0.1 V Supply voltage is measured internal to the transceiver and

can, with less accuracy, be correlated to voltage at the SFF Vcc

pin. Valid over 3.3 V ± 10%.

Transmitter Laser DC

Bias Current Accuracy

IBIAS ± 10 % IBIAS is better than ± 10% of the nominal value.

Transmitted Optical Output Power

Accuracy (AVG - average power)

PT± 3.0 dB Coupled into 50/125 μm multimode  ber.

Valid from 100 μW,avg to 500 μW, avg.

Received Optical Input Power

Accuracy (Average power))

PR± 3.0 dB Coupled from 50/125 μm multimode  ber.

Valid from 31 μW,OMA to 500 μW,OMA.

Figure 5. Transceiver Timing Diagrams (Tx_FAULT as reported by A2h Byte 110 Bit 2)

Tx_FAULT

VCC > 2.97 V

t_init

Tx_DISABLE

TRANSMITTED SIGNAL

t_init

Tx_FAULT

VCC > 2.97 V

Tx_DISABLE

TRANSMITTED SIGNAL

t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED

t_off

Tx_FAULT

Tx_DISABLE

TRANSMITTED SIGNAL

t-off & t-on: TX DISABLE ASSERTED THEN NEGATED

t_on

Tx_FAULT

OCCURANCE OF FAULT

t_fault

Tx_DISABLE

TRANSMITTED SIGNAL

Tx_FAULT

OCCURANCE OF FAULT

Tx_DISABLE

TRANSMITTED SIGNAL

t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED

t_reset t_init*

* CANNOT READ INPUT...

Tx_FAULT

OCCURANCE OF FAULT

t_fault

Tx_DISABLE

TRANSMITTED SIGNAL

OPTICAL SIGNAL

LOS

t-fault: TX DISABLE ASSERTED THEN NEGATED,

TX SIGNAL NOT RECOVERED

t-loss-on & t-loss-off

t_loss_on

t_init*

t_reset

* SFP SHALL CLEAR Tx_FAULT IN

t_init IF THE FAILURE IS TRANSIENT

t_loss_off

OCCURANCE

OF LOSS

Table 12. EEPROM Serial ID Memory Contents – Conventional SFF Memory (Address A0h)

Byte #

Decimal

Data

Hex Notes

Byte #

Decimal

Data

Hex Notes

0 02 SFF physical device (soldered device) 37 00 Hex Byte of Vendor OUI 4

1 04 Serial ID function supported 38 17 Hex Byte of Vendor OUI 4

2 07 LC optical connector 39 6A Hex Byte of Vendor OUI 4

3 00 40 41 “A” - Vendor Part Number ASCII character

4 00 41 46 “F” - Vendor Part Number ASCII character

5 00 42 42 “B” - Vendor Part Number ASCII character

6 00 43 52 “R” - Vendor Part Number ASCII character

7 20 Intermediate distance (per FC-PI) 44 2D “-” - Vendor Part Number ASCII character

8 40 Shortwave laser w/o OFC (open  ber control) 45 35 “5” - Vendor Part Number ASCII character

9 0C Multi-mode 50 μm and 62.5 μm optical media 46 39 “9” - Vendor Part Number ASCII character

10 15 100, 200 & 400 MBytes/sec FC-PI speed 147 52 “R” - Vendor Part Number ASCII character

11 01 Compatible with 8B/10B encoded data 48 35 “5” - Vendor Part Number ASCII character

12 2B 4300 MBit/sec nominal bit rate (4.25 Gbit/s) 49 -- “*” - Vendor Part Number ASCII character 9

13 00 50 4C “L” - Vendor Part Number ASCII character

14 00 51 5A “Z” - Vendor Part Number ASCII character

15 00 52 20 “ “ - Vendor Part Number ASCII character

16 0F 150m of 50/125 μm  ber @ 4.25GBit/sec 253 20 “ “ - Vendor Part Number ASCII character

17 07 70m of 62.5/125um  ber @ 4.25GBit/sec 354 20 “ “ - Vendor Part Number ASCII character

18 00 55 20 “ “ - Vendor Part Number ASCII character

19 00 56 20 “ “ - Vendor Part Number ASCII character

20 41 “A” - Vendor Name ASCII character 57 20 “ “ - Vendor Part Number ASCII character

21 56 “V” - Vendor Name ASCII character 58 20 “ “ - Vendor Part Number ASCII character

22 41 “A” - Vendor Name ASCII character 59 20 “ “ - Vendor Part Number ASCII character

23 47 “G” - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength 5

24 4F “O” - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength 5

25 20 “ “ - Vendor Name ASCII character 62 00

26 20 “ “ - Vendor Name ASCII character 63 Checksum for Bytes 0-62 6

27 20 “ “ - Vendor Name ASCII character 64 00

28 20 “ “ - Vendor Name ASCII character 65 1C Hardware SFF TX_DISABLE, TX_FAULT & Sig-

Det

29 20 “ “ - Vendor Name ASCII character 66 00

30 20 “ “ - Vendor Name ASCII character 67 00

31 20 “ “ - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters 7

32 20 “ “ - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters 8

33 20 “ “ - Vendor Name ASCII character 92 68 Digital Diagnostics, Internal Cal, Rx Avg Pwr

34 20 “ “ - Vendor Name ASCII character 93 F0 A/W, Soft TX_DISABLE, TX_FAULT & “RX_LOS”

(signal detect)

35 20 “ “ - Vendor Name ASCII character 94 01 SFF-8472 Compliance to revision 9.3

36 00 95 Checksum for Bytes 64-94 6

96 - 255 00

Notes:

1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec. 400 MBytes/sec is a serial

bit rate of 4.25 GBit/sec.

2. Link distance with 50/125um cable at 1.0625 Gbit/sec is 500m. Link distance at 2.125 Gbit/sec is 300m.

3. Link distance with 62.5/125um cable at 1.0625 Gbit/sec is 300m. Link distance with 62.5/125um cable at 2.125 Gbit/sec is 150m.

4. The IEEE Organizationally Unique Identi er (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).

5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.

6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074i) and stored prior to product shipment.

7. Addresses 68-83 specify the AFBR-59R5LZ ASCII serial number and will vary on a per unit basis.

8. Addresses 84-91 specify the AFBR-59R5LZ ASCII date code and will vary on a per date code basis.

9. For AFBR-59R5LZ, address 49-51 contains “L”, “Z”, “ “ (Hex 4C 5A and 20). For AFBR-59R5ALZ, address 49-51 contains “A”, “L”, “Z” (Hex 41 4C 5A).

Table 13. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)

Byte #

Decimal Notes

Byte #

Decimal Notes

Byte #

Decimal Notes

0 Temp H Alarm MSB126 Tx Pwr L Alarm MSB4104 Real Time Rx Pwr, MSB5

1 Temp H Alarm LSB127 Tx Pwr L Alarm LSB4105 Real Time Rx Pwr, LSB5

2 Temp L Alarm MSB128 Tx Pwr H Warning MSB4106 Reserved

3 Temp L Alarm LSB129 Tx Pwr H Warning LSB4107 Reserved

4 Temp H Warning MSB130 Tx Pwr L Warning MSB4108 Reserved

5 Temp H Warning LSB131 Tx Pwr L Warning LSB4109 Reserved

6 Temp L Warning MSB132 Rx Pwr H Alarm MSB5110 Status/Control - See Table 14

7 Temp L Warning LSB133 Rx Pwr H Alarm LSB5111 Reserved

CC H Alarm MSB234 Rx Pwr L Alarm MSB5112 Flag Bits - See Table 15

CC H Alarm LSB235 Rx Pwr L Alarm LSB5113 Flag Bits - See Table 15

10 VCC L Alarm MSB236 Rx Pwr H Warning MSB5114 Reserved

11 VCC L Alarm LSB237 Rx Pwr H Warning LSB5115 Reserved

12 VCC H Warning MSB238 Rx Pwr L Warning MSB5116 Flag Bits - See Table 15

13 VCC H Warning LSB239 Rx Pwr L Warning LSB5117 Flag Bits - See Table 15

14 VCC L Warning MSB240-55 Reserved 118 Reserved

15 VCC L Warning LSB256-94 External Calibration Constants6119 Reserved

16 Tx Bias H Alarm MSB395 Checksum for Bytes 0-947120-127 Reserved

17 Tx Bias H Alarm LSB396 Real Time Temperature MSB1128-247 Customer Writeable8

18 Tx Bias L Alarm MSB397 Real Time Temperature LSB1248-254 Vendor Speci c

19 Tx Bias L Alarm LSB398 Real Time VCC MSB2

20 Tx Bias H Warning MSB399 Real Time VCC LSB2

21 Tx Bias H Warning LSB3100 Real Time Tx Bias MSB3

22 Tx Bias L Warning MSB3101 Real Time Tx Bias LSB3

23 Tx Bias L Warning LSB3102 Real Time Tx Power MSB4

24 Tx Pwr H Alarm MSB4103 Real Time Tx Power LSB4

25 Tx Pwr H Alarm LSB4

Notes:

1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256 degrees C.

2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 uV.

3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 uA.

4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.

5. Received average power (RX Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.

6. Bytes 56-94 are not intended for use with AFBR-59R5LZ, but have been set to default values per SFF-8472.

7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.

8. Bytes 128-247 are write enabled (customer writeable) .

Table 14. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)

Bit # Status/Control Name Description Notes

7 TX_ DISABLE State Digital state of SFF TX_ DISABLE Input Pin (1 = TX_DISABLE asserted) 1

6 Soft TX_ DISABLE Read/write bit for changing digital state of SFF TX_DISABLE function11, 2

5 reserved

4 reserved

3 reserved

2 TX_FAULT State Digital state of the laser fault function (1 = Laser Fault Detected) 1

1 Signal Detect State Digital state of the SFF Sig_Det Output Pin (1 = Signal Detect asserted) 1

0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready) 1

Notes:

1. The response time for soft commands of the AFBR-59R5LZ is 100msec as speci ed by the MSA SFF-8472

2. Bit 6 is logic OR’d with the SFF TX_DISABLE input pin 8 either asserted will disable the SFF transmitter.

3. AFBR-59R5LZ meets the MSA SFF-8472 data ready timing of 1000 msec.

Table 15. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)

Byte Bit Flag Bit Name Description

112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold.

6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold.

CC High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold.

CC Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold.

3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold.

2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold.

1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold.

0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold.

113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold.

6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold.

0-5 reserved

116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold.

6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold.

CC High Warning Set when transceiver internal supply voltage exceeds high warning threshold.

CC Low Warning Set when transceiver internal supply voltage exceeds low warning threshold.

3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold.

2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold.

1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold.

0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold.

117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold.

6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold.

0-5 reserved

Figure 6. Mechanical Drawing - AFBR-59R5LZ

14.20

±0.10

0.559

±0.004

13 ±0.10

0.512 ±0.004

14.23

0.56

10.16

0.40

678

PLUG

CA1234

AREA FOR

PROCESS

0.40

±0.002

0.040

1.02

±0.05

(X2)

10.16

0.46

±0.05

(X14)

0.018

±0.002

0.115

2.92 MIN

0.38

9.65

0.37

9.35

1.78

(12X)

0.07

13.59

48.8

1.92

0.54

MAX

13.35

0.53

TX fault

RD+

RD-

VccR

VeeR

SDA

Rate select

VccT

VeeT

Tx-Disable

TD+

TD-

SCL

TC position

6.25

±0.05

0.246

±0.002

Figure 8. Assembly Drawing

Figure 7. Mechanical Drawing - AFBR-59R5ALZ

14.23

0.56

10.16

0.400

2.15 MIN

0.37

9.35

0.38

9.65

0.085

1.78

(12X)

0.07

0.53

13.35

1.92

48.8

13.59 MAX

0.54

6.25

±0.05

0.246

±0.002

12.00

REF MAX

0.47

15.75

0.75

0.00

0.62

0.03

0.00

SECTION A-A

Top of PCB

10.16 ±0.10

0.400 ±0.004

1.00 0.00

0.15

0.039 0.000

0.006

±0.10

0.560

±0.004

14.22

15.24

MIN PITCH

0.600

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-0109EN - September 12, 2012

Figure 9. Board Layout