CREAT BY ART
- Ideal for automated placement
- Reliable low cost construction utilizing molded plastic technique
- High surge current capability
- UL Recognized File # E-326854
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
V
RRM
50 100 200 400 600 800 1000 1200 1400 V
V
RMS
35 70 140 280 420 560 700 840 980 V
V
DC
50 100 200 400 600 800 1000 1200 1400 V
I
F(AV)
A
I
2
t A
2
s
T
JO
C
T
STG O
C
Document Number: DS_D1310039 Version: H13
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: Molded plastic body
DBLS
DBLS201G thru DBLS209G
Taiwan Semiconductor
Glass Passivated Brid
g
e Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
Polarity: Polarity as marked on the body
Weight: 0.36 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL DBLS
201G
DBLS
202G
DBLS
203G
DBLS
204G
DBLS
205G
DBLS
208G
DBLS
209G UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
DBLS
206G
DBLS
207G
μA
50
Rating for fusing (t<8.3ms)
Maximum average forward rectified current 2
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
Note 1: Pulse Test with PW=300μs,1% Duty Cycle
Typical thermal resistance R
θjL
R
θjA
15
40
O
C/W
A
Maximum instantaneous forward voltage (Note 1)
I
F
= 2 A V
F
V
Maximum DC reverse current T
J
=25 ℃
at rated DC blocking voltage T
J
=125℃
10.3
1.15 1.30
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
I
R
2
500
PART NO.
Note 1: "x" defines voltage from 50V (DBLS201G) to 1400V (DBLS209G)
PART NO.
DBLS207G
DBLS207G
(TA=25℃ unless otherwise noted)
Document Number: DS_D1310039 Version: H13
DBLS201G thru DBLS209G
Taiwan Semiconductor
PACKING COD E GREEN COMPOUND
CODE
PACKAGE
50 / TUBE
PACKING
ORDERING INFORMATION
DBLS20xG
(Note 1)
C1 Suffix "G" DBLS
RD
DBLS207G RDG RD G
EXAMPLE
1,500 / 13" Paper reel
RATINGS AND CHARACTERISTICS CURVES
Green compound
PREFERRED P/N PACKING CODE GREEN COMPOUND
CODE
DBLS207G RD RD
DESCRIPTION
0
0.5
1
1.5
2
2.5
0 20 40 60 80 100 120 140 160
AVERAGE FORWARD CURRENT (A)
AMBIENT TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVELOAD
WITH HEATSINK
0
10
20
30
40
50
1 10 100
PEAK FORWARD SURGE CURRENT
(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
(JEDEC Method)
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
0.1
1
10
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
DBLS201G - DBLS207G
DBLS208G - DBLS209G
Min Max Min Max
A 5.00 5.20 0.197 0.205
B 1.02 1.20 0.040 0.047
C 8.13 8.51 0.320 0.335
D 2.40 2.60 0.094 0.102
E 9.80 10.30 0.386 0.406
F 6.20 6.50 0.244 0.256
G 0.22 0.33 0.009 0.013
H 1.02 1.53 0.040 0.060
I 0.076 0.33 0.003 0.013
J 3.90 4.10 0.154 0.161
Symbol
A
B
C
D
E
F
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1310039 Version: H13
DBLS201G thru DBLS209G
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
2.6
9.2
MARKING DIAGRAM
SUGG ESTED PAD LAYOUT
Unit (mm)
2.3
1.3
6.9
11.5
Unit (inch)
0.091
0.051
0.272
0.453
0.102
0.362
1
10
100
1 10 100
CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1310039 Version: H13
DBLS201G thru DBLS209G
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
