Marconi Caswell Limited, Caswell, Towcester, Northamptonshire, NN12 8EQ
Telephone: + 44 (0) 1327 350581 Fax: + 44 (0) 1327 356775 Website: www.caswelltechnology.com
Caswell Technology is the trading name of Marconi Caswell Limited which is a wholly owned subsidiary of Marconi plc
MCL reserves the right to update or change this specification without notice
462/SM/00027/200 Iss 1/2 A Marconi company
P35-4250-0
GaAs MMIC SP4T REFLECTIVE
SWITCH, DC - 4GHz
Features
• Broadband performance
• Low insertion loss; 0.6dB typ at 2GHz
• Ultra low DC power consumption
• Fast switching speed; 3ns typical
• Small die size; 0.67 mm2
Description
The P35-4250-0 is a high performance Gallium Arsenide single pole four throw RF switch MMIC. It is
suitable for use in broadband communications and instrumentation applications. A short circuit
reflective termination is presented at the isolated outputs of the switch. The switch is controlled by the
application of complimentary 0V/-5V or 0/-8V signals to the control lines in accordance with the truth
table below.
This die is fabricated using MCL's 0.5µm gate length MESFET process (S20) and is fully protected using
Silicon Nitride passivation for excellent performance and reliability. This device is also available
packaged in a low-cost surface-mount plastic package (see P35-4250-3).
Electrical Performance
Ambient temperature = 22±3°C, ZO = 50Ω, Control voltages = 0V/-5V unless otherwise stated
Parameter Conditions Min Typ Max Units
Insertion Loss1DC - 2GHz
2 - 4GHz
-
-
0.6
0.9
0.9
1.2
dB
dB
Isolation1DC - 2GHz
2 - 4GHz
35
25
45
35
-
-
dB
dB
Input Return Loss2DC - 2GHz
2 - 4GHz
26
23
28
25
-
-
dB
dB
Output Return Loss2DC - 2GHz
2 - 4GHz
26
23
28
25
-
-
dB
dB
1dB power compression point30/-5V Control; 50MHz
0/-5V Control; 2GHz
0/-8V Control; 50MHz
0/-8V Control; 2GHz
-
-
-
-
19
22.5
21.5
30
-
-
-
-
dBm
dBm
dBm
dBm
Switching Speed 50% Control to 10%90%RF -3-ns
Notes
1. Insertion Loss and Isolation measured between RF input and any output.
2. Return Loss measured in low loss switch state.
3. Input power at which insertion loss compresses by 1dB.
Marconi Caswell Limited, Caswell, Towcester, Northamptonshire, NN12 8EQ
Telephone: + 44 (0) 1327 350581 Fax: + 44 (0) 1327 356775 Website: www.caswelltechnology.com
Caswell Technology is the trading name of Marconi Caswell Limited which is a wholly owned subsidiary of Marconi plc
MCL reserves the right to update or change this specification without notice
462/SM/00027/200 Iss 1/2 A Marconi company
P35-4250-0
Typical Performance at 22° C
Insertion Loss
0.0
0.5
1.0
1.5
2.0 0 1 2 3 4
Frequency (GHz)
Insertion Loss (dB)
Isolation
0
20
40
60 01234
Frequency (GHz)
Isolation (dB)
Input Return Loss
0
10
20
30
40 01234
Frequency (GHz)
Return Loss (dB)
Output Return Loss
0
10
20
30
40 01234
Frequency (GHz)
Return Loss (dB)
Absolute Maximum Ratings
Max control voltage -8V
Max I/P power +30 dBm
Operating temperature -60°C to +125°C
Storage temperature -65°C to +150°C
Marconi Caswell Limited, Caswell, Towcester, Northamptonshire, NN12 8EQ
Telephone: + 44 (0) 1327 350581 Fax: + 44 (0) 1327 356775 Website: www.caswelltechnology.com
Caswell Technology is the trading name of Marconi Caswell Limited which is a wholly owned subsidiary of Marconi plc
MCL reserves the right to update or change this specification without notice
462/SM/00027/200 Iss 1/2 A Marconi company
P35-4250-0
Chip Outline Electrical Schematic
Die size: 0.91 x 0.74mm
Bond pad size: 90µm x 90µm
Die thickness: 200µm
Switching Truth Table
Control Pad Voltage (V) Path From RF IN to
A1 B1 A2 B2 A3 B3 A4 B4 RF1 RF2 RF3 RF4
-5 0 0 -5 0-5 0-5 Low Loss Isolated Isolated Isolated
0-5 -5 0 0 -5 0-5 Isolated Low Loss Isolated Isolated
0-5 0-5 -5 0 0 -5 Isolated Isolated Low Loss Isolated
0-5 0-5 0-5 -5 0Isolated Isolated Isolated Low Loss
Handling, Mounting and Bonding
The back of the die is gold metallized and can be die-attached manually onto gold, eutectically with Au-
Sn (80:20) or with low temperature conductive epoxy. The maximum allowable die temperature is
310°C for 2 minutes. Bonds should be made onto the exposed gold pads with 17 or 25 microns pure
gold, half-hard gold wire. Bonding should be achieved with the die face at 225°C to 275°C with a heated
thermosonic wedge (approx. 125°C) and a maximum force of 60 grams. Ball bonds may be used but
care must be taken to ensure the ball size is compatible with the bonding pads shown. The length of the
bond wires should be minimised to reduce parasitic inductance, particularly those to the RF and ground
pads.
Ordering Information
P35-4250-0
