LM136-5.0, LM236-5.0, LM336-5.0 www.ti.com SNVS750D - JUNE 1999 - REVISED MARCH 2013 LM136-5.0, LM236-5.0, LM336-5.0 5.0V Reference Diode Check for Samples: LM136-5.0, LM236-5.0, LM336-5.0 FEATURES DESCRIPTION * * * * * * * * * The LM136-5.0/LM236-5.0/LM336-5.0 integrated circuits are precision 5.0V shunt regulator diodes. These monolithic IC voltage references operate as a low temperature coefficient 5.0V zener with 0.6 dynamic impedance. A third terminal on the LM1365.0 allows the reference voltage and temperature coefficient to be trimmed easily. 1 2 Adjustable 4V to 6V Low Temperature Coefficient Wide Operating Current of 600 A to 10 mA 0.6 Dynamic Impedance 1% Initial Tolerance Available Specified Temperature Stability Easily Trimmed for Minimum Temperature Drift Fast Turn-on Three Lead Transistor Package The LM136-5.0 series is useful as a precision 5.0V low voltage reference for digital voltmeters, power supplies or op amp circuitry. The 5.0V makes it convenient to obtain a stable reference from low voltage supplies. Further, since the LM136-5.0 operates as a shunt regulator, it can be used as either a positive or negative voltage reference. The LM136-5.0 is rated for operation over -55C to +125C while the LM236-5.0 is rated over a -25C to +85C temperature range. The LM336-5.0 is rated for operation over a 0C to +70C temperature range. See the Connection Diagrams for available packages. For applications requiring 2.5V see LM136-2.5. Connection Diagrams Figure 1. TO-92 Plastic Package (Bottom View) Figure 2. TO Metal Can Package (Bottom View) Figure 3. SOIC Package 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2013, Texas Instruments Incorporated LM136-5.0, LM236-5.0, LM336-5.0 SNVS750D - JUNE 1999 - REVISED MARCH 2013 www.ti.com Typical Applications Figure 4. 5.0V Reference Adjust to 5.00V * Any silicon signal diode Figure 5. 5.0V Reference with Minimum Temperature Coefficient * Does not affect temperature coefficient Figure 6. Trimmed 4V to 6V Reference with Temperature Coefficient Independent of Breakdown Voltage 2 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 LM136-5.0, LM236-5.0, LM336-5.0 www.ti.com SNVS750D - JUNE 1999 - REVISED MARCH 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) Reverse Current 15 mA Forward Current 10 mA -60 to +150 C LM136-5.0 -55 to +150 C LM236-5.0 -25 to +85 C LM336-5.0 0 to +70 C TO-92 Package (10 sec.) 260 C TO Package (10 sec.) 300 C Vapor Phase (60 sec.) 215 C Infrared (15 sec.) 220 C Storage Temperature Operating Temperature Range (2) Soldering Information SOIC Package (1) (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its specified operating conditions. For elevated temperature operation, Tj max see THERMAL CHARACTERISTICS THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) LM136 150C LM236 125C LM336 100C Thermal Resistance ja (Junction to Ambient) TO-92 180C/W (0.4 Leads) TO SOIC-8 440C/W 165C/W 80C/W N/A 170C/W (0.125 Leads) ja (Junction to Case) N/A ELECTRICAL CHARACTERISTICS Parameter Reverse Breakdown Voltage Conditions LM136A-5.0/LM236A-5.0 LM336B-5.0 LM136-5.0/LM236-5.0 LM336-5.0 Min Typ LM136-5.0/LM236-5.0/LM336-5.0 4.9 5.00 LM136A-5.0/LM236A-5.0, LM336B-5.0 4.95 5.00 6 0.6 Max Units Min Typ Max 5.1 4.8 5.00 5.2 5.05 4.90 5.00 5.1 V 12 6 20 mV 1.2 0.6 2 4 12 mV TA=25C, IR=1 mA Reverse Breakdown Change TA=25C, With Current 600 AIR10 mA Reverse Dynamic Impedance TA=25C, IR=1 mA, f = 100 Hz V Temperature Stability VR Adjusted 5.00V (2) IR=1 mA, (Figure 15) 0CTA70C (LM336-5.0) (1) (2) Unless otherwise specified, the LM136-5.0 is specified from -55CTA+125C, the LM236-5.0 from -25CTA+85C and the LM3365.0 from 0CTA+70C. Temperature stability for the LM336 and LM236 family is specified by design. Design limits are specified (but not 100% percent production tested) over the indicated temperature and supply voltage ranges. These limits are not used to calculate outgoing quality levels. Stability is defined as the maximum charge in VREF from 25C to TA(min) or TA(max). Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 Submit Documentation Feedback 3 LM136-5.0, LM236-5.0, LM336-5.0 SNVS750D - JUNE 1999 - REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) (1) LM136A-5.0/LM236A-5.0 Parameter Conditions LM136-5.0/LM236-5.0 Min Reverse Breakdown Change LM336B-5.0 LM336-5.0 Min Typ Units Typ Max Max -25CTA+85C (LM236-5.0) 7 18 mV -55CTA+125C (LM136-5.0) 20 36 mV 600 AIR10 mA 6 17 6 1.6 0.8 24 mV 2.5 With Current Adjustment Range Circuit of Figure 14 1 Reverse Dynamic Impedance IR = 1 mA 0.8 Long Term Stability TA=25C0.1C, IR=1 mA, t = 1000 hrs 20 4 Submit Documentation Feedback 1 20 V ppm Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 LM136-5.0, LM236-5.0, LM336-5.0 www.ti.com SNVS750D - JUNE 1999 - REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Reverse Voltage Change Zener Noise Voltage Figure 7. Figure 8. Dynamic Impedance Response Time Figure 9. Figure 10. Reverse Characteristics Temperature Drift Figure 11. Figure 12. Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 Submit Documentation Feedback 5 LM136-5.0, LM236-5.0, LM336-5.0 SNVS750D - JUNE 1999 - REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Forward Characteristics Figure 13. 6 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 LM136-5.0, LM236-5.0, LM336-5.0 www.ti.com SNVS750D - JUNE 1999 - REVISED MARCH 2013 APPLICATION HINTS The LM136-5.0 series voltage references are much easier to use than ordinary zener diodes. Their low impedance and wide operating current range simplify biasing in almost any circuit. Further, either the breakdown voltage or the temperature coefficient can be adjusted to optimize circuit performance. Figure 14 shows an LM136-5.0 with a 10k potentiometer for adjusting the reverse breakdown voltage. With the addition of R1 the breakdown voltage can be adjusted without affecting the temperature coefficient of the device. The adjustment range is usually sufficient to adjust for both the initial device tolerance and inaccuracies in buffer circuitry. If minimum temperature coefficient is desired, four diodes can be added in series with the adjustment potentiometer as shown in Figure 15. When the device is adjusted to 5.00V the temperature coefficient is minimized. Almost any silicon signal diode can be used for this purpose such as a 1N914, 1N4148 or a 1N457. For proper temperature compensation the diodes should be in the same thermal environment as the LM136-5.0. It is usually sufficient to mount the diodes near the LM136-5.0 on the printed circuit board. The absolute resistance of the network is not critical and any value from 2k to 20k will work. Because of the wide adjustment range, fixed resistors should be connected in series with the pot to make pot setting less critical. Figure 14. LM136-5.0 with Pot for Adjustment of Breakdown Voltage (Trim Range = 1.0V Typical) Figure 15. Temperature Coefficient Adjustment (Trim Range = 0.5V Typical) Typical Applications * Adjust for 6.25V across R1 Figure 16. Precision Power Regulator with Low Temperature Coefficient Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 Submit Documentation Feedback 7 LM136-5.0, LM236-5.0, LM336-5.0 SNVS750D - JUNE 1999 - REVISED MARCH 2013 8 www.ti.com Figure 17. 5V Crowbar Figure 18. Adjustable Shunt Regulator Figure 19. Linear Ohmmeter Figure 20. Op Amp with Output Clamped Figure 21. Bipolar Output Reference Figure 22. 5.0V Square Wave Calibrator Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 LM136-5.0, LM236-5.0, LM336-5.0 www.ti.com SNVS750D - JUNE 1999 - REVISED MARCH 2013 Figure 23. 10V Buffered Reference Figure 24. Low Noise Buffered Reference Figure 25. Wide Input Range Reference Schematic Diagram Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 Submit Documentation Feedback 9 LM136-5.0, LM236-5.0, LM336-5.0 SNVS750D - JUNE 1999 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D * 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM136-5.0 LM236-5.0 LM336-5.0 PACKAGE OPTION ADDENDUM www.ti.com 11-Sep-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM136AH-5.0 ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 125 ( LM136AH5.0 ~ LM136AH5.0) LM136AH-5.0/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM136AH5.0 ~ LM136AH5.0) LM136H-5.0 ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 125 ( LM136H5.0 ~ LM136H5.0) LM136H-5.0/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM136H5.0 ~ LM136H5.0) LM236AH-5.0/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 ( LM236AH5.0 ~ LM236AH5.0) LM236H-5.0 ACTIVE TO NDV 3 1000 TBD Call TI Call TI -25 to 85 ( LM236H5.0 ~ LM236H5.0) LM236H-5.0/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -25 to 85 ( LM236H5.0 ~ LM236H5.0) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Sep-2016 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OUTLINE NDV0003H TO-CAN - 2.67 mm max height SCALE 1.250 TO-46 4.95 4.55 0.76 MAX 2.67 MAX 0.64 MAX UNCONTROLLED LEAD DIA 3X 12.7 MIN 3X 0.483 0.407 5.32-5.56 2 1 3 45 ( 2.54) 1.16 0.92 1.22 0.72 4219876/A 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-46. www.ti.com EXAMPLE BOARD LAYOUT NDV0003H TO-CAN - 2.67 mm max height TO-46 (2.54) 0.07 MAX ALL AROUND ( 1.2) METAL 3 3X ( 0.7) VIA SOLDER MASK OPENING (1.27) 1 (R0.05) TYP 2X ( 1.2) METAL 2 0.07 MAX TYP 2X SOLDER MASK OPENING LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE:12X 4219876/A 01/2017 www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2017, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM136AH-5.0 LM136AH-5.0/NOPB LM136H-5.0 LM136H-5.0/NOPB LM236AH-5.0 LM236AH-5.0/NOPB LM236H5.0 LM236H-5.0/NOPB