_KEC SEMICONDUCTOR] ~~ KIA431/F/A/AF KOREA ELECTRONICS CO.,LTD. TECHNICAL DATA BIPOLAR LINEAR INTEGRATED CIRCUIT PROGRAMMABLE PRECISION REFERENCES The KIA431/F/A/AF integrated circuits are three- terminal programmable shunt regulator diodes. These a monolithic IC voltage reference operate as a low temperature coefficient zener which is programmable fh from Vier to 36 volts with two external resistors. These devices exhibit a wide operating current range of 1.0 to 100mA with a typical dynamic impedance of 0.2262, The characteristics of these references make well them excellent replacements for zener diodes in many applications such as digital voltmeters, power leas supplies, and op amp circuitry. = The 2.5 volt reference makes it convenient to obtain |. REFERENCE a stable reference from 5.0 volt logic supplies, and 2 ANODE since the KLA431/F/A/AF operates as a shunt regulator, om it can be used as either a positive or negative TQ-92 voltage reference. HL b m z MILLIMETERS 4.70 MAX 4.89 WAX 8.70 MAX 0.45, 1.00 1.27 0.88 0.46 14,.00+ 0,50 0.56 MAK 2.90 O45 Mar 1.00 ul ee ta ame re fe fae fa feat fet ft | en fit FEATURES - Programmable Output Voltage to 36 Volts. - Voltage Reference Tolerance : 1.0% (SIA431 4/AF) : - Low Dynamic Output Impedance : 0.22 (Typ.). [_] a + Sink Current Capability of 1.0 to 100mA. vole + Equivalent Full-Range Temperature Coefficient 7 of 50ppm/C (Typ.). pel; + Temperature Compensated for Operation Over Full Rated | Operating Temperature Range. leFeLe? | MILLIMETERS 4.70 MAX 2.604 0.20 LO MAX DAB+O.LE = ot z + Low Output Noise Voltage. x Jejefals|e] & Jolel> g g 5 O.5+0.46 ft al = MARKING 4. REFERENCE Type No. Marking 2, ANODE KIA43LF 3A KIA43 LAF 3B SOoT89 MAXIMUM RATINGS (Full operating ambient temperature range applies unless otherwise noted.) CHARACTERISTIC SYMBOL RATING UNIT Cathode To Anode Voltage VA 37 Vv Cathode Current Range, Continuous Ik 100~ 150 mA Reference Input Current Range, Continuos Tree -0,05~ 10 mA Operating Junction Temperature Ty 150 Cc Operating Temperature Tor 40~ 85 c Storage Temperature Taig 65~ 150 C ee KIA431/A 700 Total Power Dissipation Pp mw KIA431 F/AF 800 1997. 12. 11 Revision No : 4 KEC V6KIA431/F/A/AF BLOCK DIAGRAM Cathode | (R) | | (K) Cathode | | (K) | | Reference | | (R) Le | d anode(A) Anode{A) ELECTRICAL CHARACTERISTICS (Ta=25') CHARACTERISTICS SYMBCL cincorr TEST CONDITION MIN. | TYP. | MAX. | UNIT KIA431L/F 2,440 2.495 | 2.550 V I Seton mput Viet Figure 1 | Vra=Vrer , Ik=lOmA olage KIA431A/AF 2470 | 2495 | 2520 | V Reference Input Voltage Fi 1 Deviation Over Temperature AViet igure Va=Vier , In=lOmA - 7.0 30 mV (Note 1) Range Ratio of Change in AVEa= _ 1A 97 Reference Input. Voltage to AVret! : _ 10V ~Vree Change in Cathode to AVA igure 2) Tk-1OmA AVrs= - 10 949 mv/V Anode Voltage IV ~LOV , , Reference Input Ta=25C Ix-l0mA, R1=10k2, 7 LS 4.0 Tree Figure 2 nA Current Ta=Too R2=co - - 65 Reference Input Current _ _ Deviation Over Temperature Ayer Figure 2 Teoma, RINK, - 0.8 25 BA R R2=ca ange Minimum Cathode . _ _ Current For Regulation Fon Figure 1) Vea" Viet 05 Lo mA Off-State Cathode Current Tote Figure 3 | Vra=36V, Vier=0V - 2,5 1000 nA . Figure 1 | Vea=Vrer, Ix=L.0~100mA,| _ _ Dynamic Impedance Lk (Note 2) | Veer Input O".\__ Vica | | lk Res Note 1: - The deviation parameter AVrer is defined as the differences between the maximum and minimum values obtained over the full operating ambient temperature range that ref ter R1 Via= Vret(l+is) +! ret xR1 Vref applies. Veet Max. __ AVret = Yer (Max.) Vref (Min.) ATa = To-Ty Veet Min. TL AMBIENT TEMPERATURE The average temperature coefficient of the Reference input voltage, aVrer is defined as AVret (> x 10 pom Vie at 25 OV ret ( ) = Cc ATa AVret X 10 ATaVre at 257T) @ Vie can be positive or negative depending on whether Vie Min. or Vier Max. occurs at the lower ambient temperature. FIGURE 3-TEST CIRCUIT FOR [yee Input @-\A._*_2) V KA | lott Example : AVrr = &0mV and slope is positive, Vier at 25C=2.495V, ATa=70T 0.008x10 @ Viee= = = 458 pom 70x(2.495) Note 2: The dynamic impedance 7x, is defined as: AVEA | Zia) = Alk When the device is programmed with two external resistors, Rl and R2, (refer to Figure 2) the total dynamic impedance of the circuit is defined as: Rl. fxa'| = |Zeal (+ [Zul = |Zaal Ro 1997, 12. 11 Revision No : 4 KEC 36KTA431/F/A/AF Ik Vea 150 100 on oO | on o CATHODE CURRENT Ix (mA) 100 -3.0 -1.0 0 1.0 2.0 3.0 CATHODE VOLTAGE Vxa () AVeet Ta Tg-10mA Ta=25 C VOLTAGE 4Vrep (mV) CHANGE IN REFERENCE INPUT a 10 20 30 40 AMBIENT TEMPERATURE Ta ("C) Gyo f Tk=10mA Ta=25 C OPEN LOOP VOLTAGE GAIN Gyo (dB) 1.0k 10k 100k 1.0M 10M FREQUENCY f (Hz) = 800 OUTPUT o 4 = od Y Oo = ES J o a INPUT 0 4.0 8.0 12 16 20 TIME t (us) 1997, 12. 11 Revision No : 4 KEC 4/8KTA431/F/A/AF 900 800 700 600 500 400 300 200 100 0 KIA431F /AF KIA431/4 0 25 350 735 100 125 150 175 ALLOWABLE POWER DISSIPATION Py (mW) AMBIENT TEMPERATURE Ta (C) 1997. 12. 11 Revision No : 4 KEC 5/6KTA431/F/A/AF PRECAUTION FOR USE SOLDERING Flat Package (SOT-89 Package) Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. a nm a a o a oa Qo Atomospheric temperature('C) resin suface temperature | | | | | | | | | on | Time (sec.) Within 30 sec. (a) When employing solder reflow method @ Atmospheric temperature around resin surfaces must be less than 240, not exceeding the time length of 10 sec. @ Recommend temperature profile @ Precautions on heating method When resin in kept exposed to high ternperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) When employing halogen lamps or infrared-ray heaters When halogen larnps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. * Please keep a reflow solder operating when SOT-89 package's soldering. 1997, 12. 1 Revision No : 4 KEC 6/6