Microwave Ceramics and Modules Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band B69842N5257B202
Preliminary Data Sheet
ISSUE DATE 18.03.04 ISSUE P2 PUBLISHER SAW MWC PD PAGE 1/4
Features
zSMD filter consisting of coupled resonators with stepped impedances
zMgTiO3 - CaTiO3 (εr = 21 / TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
zExcellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2 zComponent drawing
zRecommended footprint
Page 3 zCharacteristics
zMaximum ratings
zTypical passband characteristic
Page 4 zProcessing information
zSoldering requirements
zDelivery mode
Microwave Ceramics and Modules Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band B69842N5257B202
Preliminary Data Sheet
ISSUE DATE 18.03.04 ISSUE P2 PUBLISHER SAW MWC PD PAGE 2/4
Component drawing
Recommended footprint
View from below onto the solder terminals and view from beside
soldered Pads. I/O
pads must be
soldered to 50 ohms
impedance lines
ground under solder
resist. It must be
connected to ground
plane below by vias.
Max via diameter:0.3 mm
Max via pitch:1 mm
Microwave Ceramics and Modules Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band B69842N5257B202
Preliminary Data Sheet
ISSUE DATE 18.03.04 ISSUE P2 PUBLISHER SAW MWC PD PAGE 3/4
Characteristics
min. typ. max.
Center frequency fc- 5250 - MHz
Insertion loss αIL 0.9 1.0 dB
Passband B200 MHz
Standing wave ratio SWR 1.5 2.0
Impedance
Power
Z
P
50
1.0
Ω
W
A
ttenuation α
at DC to 1990 MHz
at 1990 to 2170 MHz
at 2400 to 2500 MHz
52
50
45
57
55
50
dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1) - 40/+ 90/56
Operating temperature Top -40 / + 85 °C
Typical passband characteristic
-70
-60
-50
-40
-30
-20
-10
0
1,0
1,3
1,5
1,8
2,0
2,3
2,5
2,8
3,0
3,3
3,5
3,8
4,0
4,3
4,5
4,8
5,0
5,3
5,5
5,8
6,0
Frequency [GHz]
Attenuation [dB]
S11 [dB]
S21 [dB]
Microwave Ceramics and Modules Filter
2 Pole Filter for W-LAN 5GHz / [5.15-5.35] Band B69842N5257B202
Preliminary Data Sheet
ISSUE DATE 18.03.04 ISSUE P2 PUBLISHER SAW MWC PD PAGE 4/4
Processing information
zWettability acc. to IEC 68-2-58: ≥ 75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type reflow reflow
Maximum solderin
g
tem
p
erature 235
(
max. 2 sec.
)
260
(
max. 2 sec.
)
°C
(measuring point on top surface of the component) 225 (max. 10 sec.) 250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [°C]
215°C±10°C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [°C]
245°C±5°C
2.5 °C/s > - 5 °C/s
Delivery mode
•Blister tape acc. to IEC 286-3, grey
•Pieces/tape: 4000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
